JP6836648B2 - Inspection equipment, on-board equipment, inspection method - Google Patents

Description

The techniques disclosed herein relate to techniques for inspecting the condition of columnar electrodes.

Conventionally, there are those using columnar electrodes for the electrical connection between the substrate and the electronic component and the electrical connection between the electronic component and the electronic component. Since the columnar electrode occupies a smaller area than the connection using solder balls, the terminals can be arranged at a high density, which is suitable for high integration of electronic components such as LSI.

The following Patent Document 1 includes a semiconductor substrate, an electrode pad formed on the main surface of the semiconductor substrate, and a protruding electrode electrically connected to the electrode pad, and the protruding electrode is provided on the electrode pad. A semiconductor device including a pedestal portion and a protrusion provided on the pedestal portion is described. In the same document, a protruding electrode is formed on a semiconductor substrate by using a lamination technique.

Japanese Unexamined Patent Publication No. 2014-3201

As a method of providing columnar electrodes (protruding electrodes) on a substrate or a component, the following methods can be considered in addition to the lamination technique. As shown in FIG. 5, the columnar electrodes are held in a predetermined arrangement on the lower surface of the holding body (holding plate) by using, for example, an adhesive layer. Then, while the columnar electrode is held by the holding body, it is transferred and mounted at a mounting position on a substrate or a component. After that, the columnar electrode can be attached to the substrate or component by fixing the columnar electrode to the substrate or component and then pulling the holding body apart.

The construction method using a retainer has an advantage that it is relatively easy to change the arrangement of the columnar electrodes. However, if an extra columnar electrode is held by the holding body or if there is a shortage, the columnar electrodes mounted on the substrate or the component will be excessive or deficient, resulting in a manufacturing defect.
The technique disclosed in the present specification suppresses the production of a defective substrate by inspecting the quality of the holding state of the columnar electrode by the holding body when the columnar electrode is mounted on the substrate or the component by using the holding body. The purpose is.

The inspection device disclosed in the present specification is provided on a mounting device in which a plurality of columnar electrodes are collectively mounted on a substrate or a component by using a holding body, and a first camera for photographing the holding body and the first camera. A determination unit for determining whether or not the holding state of the columnar electrode by the holding body is good or bad is provided based on the first image of the holding body taken by the camera before being collectively mounted. In this configuration, the quality of the holding state of the columnar electrode by the holding body can be inspected.

As one embodiment of the inspection apparatus disclosed in the present specification, when there is an abnormality in the holding state of the columnar electrode by the holding body, the determination unit responds to the type of abnormality in the holding body to be inspected. It is advisable to display a display that teaches the repair method. With this configuration, the operator can easily perform the repair work of the columnar electrode.

As one embodiment of the inspection apparatus disclosed in the present specification, when the holding state of the columnar electrode by the holding body is normal, a plurality of the columnar electrodes are placed on the substrate or the component by using the holding body. After being collectively mounted and fixed, the holding body may be separated from the columnar electrode by a pulling device. In this configuration, when the holding state of the columnar electrodes by the holding body is normal, a step of collectively mounting the columnar electrodes on the substrate or a component and a step of pulling the holding body away from the collectively mounted columnar electrodes are performed, so that the defective substrate is used. Can be suppressed.

As one embodiment of the inspection apparatus disclosed in the present specification, the determination unit does not mount the holding body separated from the columnar electrode based on the second image taken by the first camera. It is advisable to determine the presence or absence of the columnar electrode left in the holder. With this configuration, it is possible to detect improper fixing of the columnar electrode to the substrate or component. Therefore, the outflow of defective substrates and defective parts can be suppressed.

As one embodiment of the inspection apparatus disclosed in the present specification, the substrate is provided with a second camera for photographing the substrate or the component, and the determination unit is the substrate to which the columnar electrodes are fixed after the holding body is separated. Alternatively, it is preferable to determine whether or not the columnar electrode is mounted on the substrate or the component based on the third image of the component taken by the second camera. With this configuration, it is possible to detect a mounting defect of the columnar electrode on the substrate or component. Therefore, the outflow of defective substrates and defective parts can be suppressed.

As one embodiment of the inspection apparatus disclosed in the present specification, the determination unit captures the third image and the substrate or the component by the second camera before collectively mounting the columnar electrodes. It is advisable to judge whether or not the columnar electrode is mounted on the substrate or the component by comparing with the above. In this configuration, since the images before and after mounting are compared, it is possible to accurately detect mounting defects of the columnar electrodes on the substrate or component without being affected by the wiring pattern or the like.

As one embodiment of the inspection device disclosed in the present specification, a first detection unit for detecting the height of the lower surface of the columnar electrode held by the holding body is provided, and the determination unit is the first detection unit. It is advisable to judge the quality of the height of the lower surface of the plurality of columnar electrodes held by the holding body based on the detected value of. In this configuration, it is possible to suppress the mounting defect of the columnar electrode due to the height defect of the lower surface of the columnar electrode.

As one embodiment of the inspection apparatus disclosed in the present specification, a second detection unit for detecting the height of the upper surface of the columnar electrode mounted on the substrate or the component is provided, and the determination unit is the determination unit. Based on the detection value of the second detection unit, it is preferable to determine whether the height of the upper surface of the plurality of columnar electrodes mounted on the substrate or the component is good or bad. With this configuration, it is possible to suppress mounting defects of the mating component due to the height defect of the upper surface of the columnar electrode.

The mounting device disclosed in the present specification is a mounting device for mounting columnar electrodes on a substrate or a component, and a plurality of the columnar electrodes are mounted on the substrate or the component by using a base and a holding body. It is equipped with a head unit that is collectively mounted on the above and the above-mentioned inspection device. In this configuration, since the mounting device includes an inspection device for inspecting the quality of the holding state of the columnar electrodes by the holding body, it is possible to suppress the occurrence of defective substrates.

As one embodiment of the mounting device disclosed herein, the inspection device is based on a first image of the holding body taken before batch mounting by a first camera provided in the mounting device. When the holding state of the columnar electrode by the body is judged to be good or bad, the head portion is mounted on the substrate or the columnar electrode collectively on the component when the holding state of the columnar electrode by the holding body is normal. The retainer may be pulled apart. In this configuration, the mounting device can perform a step of collectively mounting the columnar electrodes and a step of pulling the holding body apart. Further, when the holding state of the columnar electrodes by the holding body is normal, the step of collectively mounting the columnar electrodes and the step of pulling the holding body apart are performed, so that the occurrence of defective substrates can be suppressed.

The inspection method disclosed in the present specification is a first camera provided in a mounting device for collectively mounting a plurality of columnar electrodes on a substrate or a component using a holding body, and the holding body is mounted before being collectively mounted. Based on the first image of the holding body taken by the first camera, the quality of the holding state of the columnar electrode by the holding body is determined. In this method, the quality of the holding state of the columnar electrode by the holding body can be inspected.

According to the technique disclosed herein, the state of the columnar electrodes held by the retainer can be inspected. Then, by using the holding body determined to be normal by the inspection for production, it is possible to suppress the production of defective substrates.

Top view of the on-board device according to the first embodiment Front view of the head unit Block diagram showing the electrical configuration of the on-board device Side view of the substrate on which the columnar electrodes are mounted Side view of holding plate Bottom view of the holding plate The figure which shows the mounting process of a columnar electrode and an IC component on a substrate The figure which shows the mounting process of a columnar electrode and an IC component on a substrate The figure which shows the image of the holding plate before mounting a columnar electrode. The figure explaining the deviation of the suction position and the angle of the holding plate by the suction nozzle. Flow chart showing the flow of the inspection process Explanatory drawing of definition data of columnar electrode The figure which shows the image of the holding plate before mounting a columnar electrode. The figure which shows the display example at the time of an error The figure which shows the image of the holding plate after mounting a columnar electrode. The figure which shows the image of the substrate before and after mounting a columnar electrode and the difference image between them. The figure which shows the image of the substrate before and after mounting a columnar electrode and the difference image between them. Top view of the on-board device according to the third embodiment The figure which shows the detection operation of the bottom surface height of a columnar electrode by a laser displacement meter. Top view of the assembly board Floor plan of holding plate Front view of the head unit equipped with a laser displacement meter

<Embodiment 1>
1. 1. Overall configuration of the mounting device 1 As shown in FIG. 1, the mounting device 1 includes a base 11, a conveyor 20 for transporting the substrate P, a backup device 25, a head unit 60, and a head unit 60 as a base 11. It includes a drive device 30 that moves in the plane direction (XY direction) above, a first camera 81, and a second camera 85. In the following description, the longitudinal direction of the base 11 (horizontal direction in FIG. 1) is referred to as the X direction, the depth direction of the base 11 (vertical direction in FIG. 1) is the Y direction, and the vertical direction in FIG. Is the Z direction. Further, the head unit 60 is an example of the "head portion" and the "pulling device" of the present invention.

The conveyor 20 is arranged in the center of the base 11. The conveyor 20 includes a pair of conveyor belts 21 that circulate and drive in the X direction, and conveys the substrate P indicated by the alternate long and short dash line on the conveyor belt 21 in the X direction by friction with the belts.

In the present embodiment, the left side shown in FIG. 1 is the entrance, and the substrate P is carried from the left side shown in FIG. 1 from the upstream machine onto the base 11 through the conveyor 20. The carried-in substrate P is carried by the conveyor 20 to the working position G at the center of the base, and is stopped there.

A backup device 25 is provided at the working position G. As shown in FIG. 2, the backup device 25 has a backup plate 26 that supports the lower surface of the substrate P and an elevating device 28. The backup plate 26 can be moved in the Z direction by the elevating device 28. By supporting the lower surface of the substrate P at the working position G, the backup device 25 suppresses the substrate P from being deformed so as to bend during mounting.

Further, the backup plate 26 may have a built-in heater 27 for heating. The heater 27 is provided for heat-bonding (reflowing) the columnar electrode 170 to the land 100 of the substrate P. In FIG. 2, the backup device 25, the substrate P, and the conveyor 20 are viewed from the X direction.

Supply units 13A to 13C are provided on the base 11 so as to surround the work position G. A holding plate 150 holding a columnar electrode 170, which will be described later, is arranged in the supply unit 13A. An IC component 180 such as an LSI chip is arranged in the supply unit 13B. Further, in the supply unit 13C, a large number of feeders for supplying small electronic components such as chip resistors are installed side by side.

Then, at the working position G, the head unit 60 is mounted with a mounting process for mounting the parts arranged in the supply units 13A to 13C, that is, the columnar electrodes 170, the IC parts 180, and the small electronic parts on the substrate P. This is done by the mounting head 63. The mounting board Ps that has completed all the steps in the mounting device 1 is carried to the right in FIG. 1 through the conveyor 20 and is carried out to the downstream machine. The mounting board Ps means a board on which necessary parts such as columnar electrodes 170, IC parts 180, and small parts are mounted on the board P carried in from the upstream machine.

The drive device 30 is roughly composed of a pair of support legs 41, a head support 51, a Y-axis ball screw 45, a Y-axis motor 47, an X-axis ball screw 55, and an X-axis motor 57. More specifically, as shown in FIG. 1, a pair of support legs 41 are installed on the base 11. Both support legs 41 are located on both sides of the working position, and both extend straight in the Y direction.

Guide rails 42 extending in the Y direction are installed on both support legs 41, and head supports 51 are attached to the left and right guide rails 42 while fitting both ends in the longitudinal direction.

A Y-axis ball screw 45 extending in the Y direction is attached to the right support leg 41, and a ball nut (not shown) is screwed into the Y-axis ball screw 45. A Y-axis motor 47 is attached to the Y-axis ball screw 45.

When the Y-axis motor 47 is energized, the ball nut moves back and forth along the Y-axis ball screw 45, and as a result, the head support 51 fixed to the ball nut and the head unit 60 described below move Y along the guide rail 42. Move in the direction (Y-axis servo mechanism).

The head support 51 has a shape long in the X direction. As shown in FIG. 2, the head support 51 is provided with a guide member 53 extending in the X direction, and the head unit 60 is movably attached to the guide member 53 along the axis of the guide member 53. Has been done. An X-axis ball screw 55 extending in the X direction is mounted on the head support 51, and a ball nut is screwed onto the X-axis ball screw 55.

An X-axis motor 57 is attached to the X-axis ball screw 55, and when the motor 57 is energized, the ball nut moves back and forth along the X-axis ball screw 55, and as a result, a head unit fixed to the ball nut. 60 moves in the X direction along the guide member 53 (X-axis servo mechanism).

Therefore, by controlling the X-axis motor 57 and the Y-axis motor 47 in a complex manner, the head unit 60 can be moved and operated in the plane direction (XY direction) on the base 11.

A plurality of mounting heads 63 for mounting each part are mounted in a row on the head unit 60. Each mounted head 63 is configured to be able to move up and down with respect to the head unit 60 by rotating around the axis by the R-axis motor and driving the Z-axis motor. Further, each mounting head 63 is configured so that a negative pressure is supplied from a negative pressure means (not shown) to generate a suction force at the tip of the head.

By operating the X-axis motor 57, the Y-axis motor 47, and the Z-axis motor at predetermined timings, the mounting device 1 connects each part, that is, a columnar electrode 170, an IC part 180, and a small electronic part, from the supply units 13A to 13C. , It can be taken out by the mounting head 63 and mounted on the substrate P.

A first camera 81 is installed on the base 11. The first camera 81 is fixed on the base 11 with the imaging surface facing upward. The first camera 81 is provided for image recognition of the holding plate 150, the IC component 180, and the like taken out from the supply units 13A to 13C.

Further, the second camera 85 is fixed to the head unit 60 with the imaging surface facing downward. Since the second camera 85 moves integrally with the head unit 60 on the base 11 by driving the above-mentioned X-axis servo mechanism and Y-axis servo mechanism, an image at an arbitrary position on the substrate P can be captured. It can be imaged. The mounting device 1 recognizes the position of the substrate P stopped at the working position G and the position of each land 100 formed on the substrate P based on the image of the substrate P taken by the second camera 85.

2. 2. Electrical configuration of the mounting device 1 Next, the electrical configuration of the mounting device 1 will be described with reference to FIG. The entire device 1 of the mounted device 1 is controlled and controlled by the controller 210. The controller 210 is an example of the "determination unit" of the present invention. Further, the controller 210, the first camera 81, and the second camera 85 are "inspection devices 5".

The controller 210 includes an arithmetic processing unit 211 composed of a CPU and the like, and also includes an on-board program storage means 213, a motor control unit 215, an image processing unit 216, a storage unit 217, and an input / output unit 219. An operation panel 220 is connected to the arithmetic processing unit 211, and various input operations can be performed via the operation panel 220.

The on-board program storage means 213 stores an on-board program for controlling a servo mechanism including an X-axis motor 57, a Y-axis motor 47, a Z-axis motor, an R-axis motor, and the like.

The motor control unit 215, together with the arithmetic processing unit 211, drives various motors according to an on-board program, and various motors are electrically connected to the motor control unit 215.

Further, the first camera 81 and the second camera 85 are electrically connected to the image processing unit 216, and the image data output from each of the cameras 81 and 85 is taken in, respectively. Then, the image processing unit 216 analyzes the captured image.

3. 3. Mounting and Inspection Process of Columnar Electrode 170 on Substrate P The columnar electrode 170 is mounted on the land 100 of the substrate P as shown in FIG. 4 and functions as a terminal for connection with the IC component 180.

The mounting device 1 uses the holding plates 150 shown in FIGS. 5 and 6 to collectively mount a plurality of columnar electrodes 170 on the substrate P. The holding plate 150 is an example of the "holding body" of the present invention.

As shown in FIG. 5, the holding plate 150 is composed of a plate-shaped resin plate main body 151 and an adhesive layer 155 provided on the lower surface of the plate main body 151.

The columnar electrode 170 is made of copper and has a cylindrical shape. The columnar electrode 170 is held by the adhesive layer 155 of the holding plate 150. Specifically, the columnar electrode 170 has its upper surface abutted against the adhesive layer 155 of the holding plate, and is held in an upright state (a state in which the axes are orthogonal to each other) with respect to the holding plate 150. The lower surface 171 of the columnar electrode 170 is a bonding surface to the substrate P.

As shown in FIG. 6, a plurality of columnar electrodes 170 are adhesively held on the holding plate 150 in a predetermined arrangement. In the example of FIG. 6, 12 columnar electrodes 170 are arranged in a quadrangular shape along the outer edge of the plate with respect to the holding plate 150. The number and position of the columnar electrodes 170 correspond to the number and position of the lands 100 of the substrate P to be mounted.

7 and 8 are diagrams showing a manufacturing process of mounting substrates Ps. The mounting substrate Ps is a substrate on which a columnar electrode 170 and an IC component are mounted on the substrate P.

The manufacturing process of the mounting substrate Ps is composed of eight steps (A) to (H), all of which are executed by the mounting device 1.

In the step (A), the substrate P is carried in and photographed. Specifically, the substrate P to be worked is subjected to a printing process (a process of printing the solda paste on the land on the surface of the substrate) by the upstream machine, and then moved to the work position G on the base 11 by the conveyor. Sent.

After that, the backup plate 26 of the backup device 25 rises to support the lower surface of the substrate P stopped at the working position G. After the substrate P is carried in, the controller 210 moves the head unit 60 above the substrate P stopped at the working position G, and photographs the substrate P with the second camera 85.

In the step (B), the columnar electrode 170 is taken out and inspected. Specifically, the controller 210 moves the head unit 60 above the supply unit 13A. Then, the center of the upper surface of the holding plate 150 is sucked and held by the mounting head 63, and the holding plate 150 holding the columnar electrode 170 is taken out from the supply unit 13A.

After that, the controller 210 moves the head unit 60 above the first camera 81. Then, the holding plate 150 held by the mounting head 63 is photographed by the first camera 81.

FIG. 9 is an image (corresponding to the first image of the present invention) 300 of the holding plate 150 taken by the first camera 81. In the image 300, 12 white parts are high-luminance parts (parts with strong light reflection) and show columnar electrodes.

From the image 300 of the holding plate 150, the controller 210 confirms the suction state of the holding plate 150 by the mounting head 63, that is, the deviation of the suction position and the suction angle.

Specifically, as shown in FIG. 10, the deviation amounts dx and dy of the center O1 of the holding plate 150 with respect to the center O2 of the mounting head 63 and the inclination θ of the holding plate 150 are detected. The deviation amounts dx, dy and the inclination θ are calculated in order to correct the deviation of the position and the angle when the holding plate 150 is mounted on the substrate P.

As shown in FIG. 10, the center O1 of the holding plate 150 can be obtained from the intersection of straight lines Lx and Ly connecting the centers of the outer lines by recognizing the outer shape of the holding plate 150, for example. Further, the slope θ can be obtained from the slope of the straight line Lx.

Further, the controller 210 recognizes the columnar electrode 170 from the image 300 of the holding plate 150, and inspects the quality of the holding state of the columnar electrode 170 by the holding plate 150.

Specifically, as shown in FIG. 11, the inspection flow is composed of S10 to S120, and the controller 210 first starts with the columnar electrode 170 from the image 300 of the holding plate 150 taken by the first camera 81. Is performed (S10).

As shown in FIG. 9, in the image 300 of the holding plate 150, only the portion of the columnar electrode 170 glows white (high brightness), and the surroundings are generally dark. Therefore, the controller 210 can recognize the columnar electrode 170 by analyzing the image of the holding plate 150 and recognizing it with high brightness.

Next, the controller 210 performs a process of confirming whether or not all the columnar electrodes 170 are present at the electrode center positions C1 to C12 on the holding plate 150 (S20).

Specifically, as shown in FIG. 12, the mounting device 1 includes data on the coordinates of the electrode center positions C1 to C12 with reference to the center O1 of the holding plate 150 as inspection data for each columnar electrode 170. Data having a circular shape (for example, radius R) is stored in the storage unit 217.

Then, the controller 210 determines from the image 300 of the holding plate 150 taken by the first camera 81 whether or not the columnar electrodes 170 overlapping the positions C1 to C12 of the electrodes can be recognized.

When the columnar electrodes 170 overlapping the electrode center positions C1 to C12 can be recognized (S20: YES), the controller 210 has the columnar electrodes 170 overlapping the electrode center positions C1 to C12 in addition to the columnar electrodes 170. A process for confirming whether or not the extra columnar electrode 170 is recognized is performed (S30).

When the extra columnar electrodes 170 are not recognized (S30: YES), the controller 210 performs a process of confirming whether or not there is an abnormality in the shape of each columnar electrode 170 overlapping the electrode center positions C1 to C12. (S40). Specifically, the outer shape of each columnar electrode 170 is recognized from the image 300 of the holding plate 150 taken by the first camera 81, and the roundness and the circular dimension are checked. Then, if the roundness and the circular dimension are within the normal range, it is determined that there is no abnormality. The roundness can be calculated from the circumference and the area. The circular dimension is the radius R.

When there is no abnormality in the shape of all the columnar electrodes 170 (S40: YES), the controller 210 performs a process of confirming whether or not there is an abnormality in the position of each columnar electrode 170 overlapping the electrode center positions C1 to C12. (S50). Specifically, from the image 300 of the holding plate 150 taken by the first camera 81, the center position of each columnar electrode 170 is recognized with reference to the center O1 of the holding plate 150. Then, the recognized center position is compared with the electrode center positions C1 to C12 stored as inspection data, and if the position deviation is within a predetermined value, it is determined that there is no abnormality.

When there is no abnormality in the positions of all the columnar electrodes 170 (S50: YES), the controller 210 determines that the holding state of the columnar electrodes 170 by the holding plate 150 is “normal” (S70). That is, it is determined that a normal number of columnar electrodes 170 are correctly arranged for each of the electrode center positions C1 to C12 stored as inspection data.

Then, when it is determined that the holding state of the columnar electrode 170 by the holding plate 150 is normal, the step (C) shown in FIG. 7 is performed.

On the other hand, when NO is determined in S20 to S50 in the inspection flow, the controller 210 displays an error on the operation panel 220 according to the type of error (details of the error display will be described later), and the holding plate. The 150 is not used for production and is treated as a repair product (reused product after repair).

In the step (C) shown in FIG. 7, a plurality of columnar electrodes 170 held on the holding plate 150 are collectively mounted on the upper surface of the substrate P. Specifically, the controller 210 moves the head unit 60 above the substrate P. Then, when the holding plate 150 moves to directly above the substrate P, the mounting head 63 is lowered, and the plurality of columnar electrodes 170 held on the holding plate 150 are collectively mounted on each land 100 of the substrate P.

If there is a deviation in the suction position or suction angle of the holding plate 150 with respect to the mounting head 63, the controller 210 performs a correction process for correcting the deviation in the position or angle. Specifically, the mounting position is corrected by anticipating the deviation amounts dx and dy of the center O1. Further, the mounting head 63 is rotated in the R-axis direction to perform a process of correcting the inclination θ.

In the step (D) shown in FIG. 7, the mounted columnar electrode 170 and the land 100 of the substrate P are heat-bonded (reflowed). Specifically, the controller 210 energizes the heater 27 built in the backup plate 26 to heat the substrate P. As a result, the solda paste printed on the lands 100 is dissolved, and the columnar electrodes 170 are collectively bonded to the lands 100 of the substrate P.

In the step (E) shown in FIG. 8, the holding plate 100 is separated from the joined columnar electrode 170. Specifically, the controller 210 raises the mounting head 63 from the height shown in FIG. 7D while maintaining the state in which the holding plate 150 is attracted. As a result, the holding plate 150 can be separated from the joined columnar electrode 170. That is, the holding plate 150 can be peeled off against the adhesive force of the adhesive layer 155.

In the step (F) shown in FIG. 8, the holding plate 100 is recognized and inspected. Specifically, the controller 210 moves the separated holding plate 150 above the first camera 81 to take a picture.

Then, the controller 210 inspects the presence or absence of the columnar electrodes 170 left on the holding plate 150 from the image 400 of the holding plate 150 taken by the first camera 81.

FIG. 15 is an image of the holding plate 150 after being separated by the first camera 81, where 400A shows an image in a normal state and 400B shows an image in an abnormal state. The images 400A and 400B correspond to the second image of the present invention.

When the columnar electrodes 170 are not recognized from the image of the holding plate 150 after being separated (in the case of the image 400A), the controller 210 determines that all the columnar electrodes 170 held by the holding plate 150 are correctly mounted on the substrate P (in the case of the image 400A). normal). On the other hand, when the columnar electrode 170 is recognized from the image of the holding plate 150 after being separated (in the case of the image 400B), it is determined that some of the columnar electrodes 170 held by the holding plate 150 are not mounted on the substrate P (in the case of the image 400B). Abnormal).

Then, when it is determined to be "normal", the holding plate 150 is disposed of at a disposal site (not shown), and then the step (G) shown in FIG. 8 is performed. If it is determined to be "abnormal", the steps (G) and (H) shown in FIG. 8 are not executed, and the substrate P is treated as a defective product.

In the step (G) shown in FIG. 8, a process of recognizing the position of the columnar electrode 170 mounted on the substrate P is performed. Specifically, the controller 210 moves the head unit 60 above the substrate P and photographs the substrate P on which the columnar electrodes 170 are mounted by the second camera 85. Then, the controller 210 recognizes the position of each columnar electrode 170 mounted on the substrate P from the image taken by the second camera 85.

In the step (H) shown in FIG. 8, a process of mounting the IC component 180 is performed. Specifically, the controller 210 moves the head unit 60 above the supply unit 13B. Then, the IC component 180 is taken out from the supply unit 13B by the mounting head 63.

Then, the controller 210 takes a picture of the IC component 180 held by the mounting head 63 by the first camera 81, and then controls the head unit 60 to mount the IC component 180 on the substrate P. That is, as shown in FIG. 8H, the IC component 180 is mounted so that the terminals 190 overlap each of the columnar electrodes 170 bonded to the substrate P.

If there is a deviation in the suction position or suction angle of the IC component 180 by the mounting head 63, it is advisable to perform a correction process for correcting the deviation in the position or angle when mounting on the substrate P.

After mounting the IC component 180, the controller 210 executes a process of mounting an electronic component other than the IC component on the substrate P. Then, when all the components are mounted on the board P, all the steps performed by the mounting device 1 are completed, and the mounted board Ps after manufacturing is carried out to the downstream machine.

Next, in the inspection flow shown in FIG. 11 described above, when NO is determined in S20 to S50, the controller 210 displays the display unit (not shown) of the operation panel 220 according to the type of error. ..

FIG. 13 shows the images 310A to 310E of the holding plate 150 taken by the first camera 81 when an error occurs. For example, as in the image 310A shown in FIG. 13A, when there is no columnar electrode 170 overlapping the electrode center position C2 at that position (S20: NO), it is shown in FIG. 14A. In this way, the image 330A with a cross mark added to the electrode center position C2 is displayed on the operation panel 220, and at the same time, "There is a shortage of columnar electrodes at the electrode center position C2. Display a message such as "Please go". The display is "an example of a display that teaches a repair method".

As shown in the image 310B shown in FIG. 13 (B), when the shape of the columnar electrode 170 overlapping the electrode center position C9 is abnormal (S40: NO), it is shown in FIG. 14 (B). In this way, the image 330B with a cross mark added to the electrode center position C9 is displayed on the operation panel 220, and at the same time, "The columnar electrode at the electrode center position C9 is collapsed. Repair work is performed to repair the collapse. A message such as "Please" is displayed. The display is "an example of a display that teaches a repair method".

When there is an abnormality in the position of the columnar electrode 170 overlapping the center position C2 of some electrodes as shown in the image 310C shown in FIG. 13 (C) (S50: NO), it is shown in FIG. 14 (C). In this way, the image 330C with a cross mark added to the electrode center position C2 is displayed on the operation panel 220, and at the same time, "The position of the columnar electrode at the electrode center position C2 is misaligned. Repair to correct the misalignment. Display a message such as "Please do the work". The display is "an example of a display that teaches a repair method".

When an extra columnar electrode 170 is recognized in addition to the columnar electrode 170 overlapping the electrode center positions C1 to C12 as in the image 310D shown in FIG. 13 (D) (S30: NO), FIG. 14 shows. As shown in (D), the image 330D in which the extra columnar electrode 170 is marked with a cross is displayed on the operation panel 220, and at the same time, "there is an extra columnar electrode. Repair work to remove the excess. Please do. ”Is displayed. The display is "an example of a display that teaches a repair method".

The image 310E shown in FIG. 13 (E) shows a case where the holding plate 150 is taken out from the supply unit 13A in a state where two sheets are overlapped. In such a case, a NO determination is made in S60 of the inspection flow, and then, as shown in FIG. 14 (E), an image 330E in which a cross is added to one of the holding plates 150 is displayed on the operation panel 220, and together with this. Then, a message such as "Simultaneously adsorbing the holding plate. Please perform repair work to remove the simultaneously adsorbed holding plate" is displayed. The display is "an example of a display that teaches a repair method".

3. 3. Explanation of Effect The mounting device 1 recognizes the holding plate 150 as an image after taking it out from the supply unit 13A, and inspects whether the holding state of the columnar electrode 170 by the holding plate 150 is good or bad (step (B) in FIG. 8). Then, the columnar electrodes 170 held on the holding plate 150 are collectively mounted on the substrate P only when there is no abnormality as a result of the inspection. Therefore, it is possible to avoid using the holding plate 150 having an abnormality in holding the columnar electrode 170 for production, so that the production of a defective substrate can be suppressed.

Moreover, the holding state of the columnar electrode 170 is inspected by using the image 300 acquired to confirm the suction state of the holding plate 150 with respect to the mounting head 63 (presence or absence of deviation or inclination of the center position). Therefore, it is not necessary to photograph the holding plate 150 for inspecting the holding state of the columnar electrode 170.

Further, after mounting the columnar electrode 170 on the substrate P, the mounting device 1 recognizes the image of the holding plate 150 and inspects the presence or absence of the columnar electrode 170 remaining on the holding plate 150. Then, when the columnar electrode 170 is not left, the IC component 180 is mounted on the substrate P. On the other hand, when the columnar electrode 170 is left, the substrate P is treated as a defective product. By doing so, it is possible to suppress the outflow of defective substrates.

Further, when there is an abnormality in the holding state of the columnar electrode 170 by the holding plate 150, the mounting device 1 displays a display that teaches a repair method according to the type of abnormality. By doing so, the operator can easily perform the repair work of the columnar electrode 170.

<Embodiment 2>
In the second embodiment, the controller 210 performs a process of inspecting whether or not the columnar electrode 170 is mounted on the substrate P. Specifically, in the step (A) shown in FIG. 7, an image of the substrate P taken by the second camera 85 before the columnar electrodes 170 are collectively mounted, and in the step (G) shown in FIG. 8, the columnar electrodes As an example of a method of comparing two images from an image of the substrate P taken by the second camera 85 after mounting the 170, a difference image of the two images is created.

The image 510 shown in FIG. 16A is an image (corresponding to the fourth image of the present invention) in which the substrate P is photographed by the second camera 85 before the columnar electrodes 170 are collectively mounted. The image 520 shown in FIG. 16B is an image (corresponding to the third image of the present invention) taken by the second camera 85 after mounting the columnar electrode 170. Further, the image 530 shown in FIG. 16 (C) is a difference image between the two images 510 and 520.

Since the difference image 530 is an image in which the parts that do not change before and after mounting, such as the wiring pattern, disappear and only the parts that have changed remain, the columnar electrode 170 is easy to recognize, and the mounting state of the columnar electrode 170 with respect to the substrate P is good or bad. Can be judged accurately.

FIG. 16 is an image in a normal state, and 12 columnar electrodes 170 are mounted on the substrate P without any mistake. FIG. 17 shows each image 510 to 520 at the time of improper mounting, and as is clear from the difference image 530, only 11 columnar electrodes 170 are mounted on the substrate P, and the columnar electrodes 170 not mounted are mounted. Existing.

The controller 210 recognizes the columnar electrode 170 from the difference image 530 and determines whether or not the mounting is defective. Then, in the normal state, the process proceeds to the step (H) shown in FIG. 8, and the work of mounting the IC component 180 on the substrate P on which the columnar electrode 170 is mounted is performed. On the other hand, if the columnar electrode 170 is defectively mounted, the substrate P is treated as a defective product.

By doing so, it is possible to prevent the defective substrate from flowing out to the downstream machine. The method of inspecting the quality of the mounted state of the columnar electrode 170 with respect to the substrate P can be performed by the same method as the method of inspecting the quality of the holding state of the columnar electrode 170 by the holding plate 150.

<Embodiment 3>
FIG. 18 is a plan view of the mounting device 1 according to the third embodiment. The third embodiment is different from the first embodiment in that the laser displacement meter 600 is added. The laser displacement meter 600 is an example of the "first detection unit" of the present invention.

The laser displacement meter 600 is a device that measures the height of the lower surface 171 of the columnar electrode 170 held by the holding plate 150. The lower surface 171 is a joint surface with respect to the substrate P. As shown in FIG. 18, the laser displacement meter 600 is arranged on the base 11 with the detection surface facing upward.

In the third embodiment, the controller 210 takes an image of the holding plate 150 by the first camera 81 in the step (B) of FIG. 7, and then moves the holding plate 150 above the laser displacement meter 600 to move the holding plate 150. The height H of the lower surface 171 of each columnar electrode 170 held by the 150 is measured by the laser displacement meter 600.

The laser displacement meter 600 utilizes so-called triangulation, and has a light projecting unit that emits a laser and a light receiving unit that receives a laser reflected by an object. In this example, as shown in FIG. 19, the height H of the lower surface 171 of each columnar electrode 170 is measured by the laser displacement meter 600 with reference to the lower surface of the holding plate 150.

After that, the controller 210 determines, for each columnar electrode 170, whether the height H of the lower surface 171 is good or bad, that is, whether the height H varies or not, based on the measurement result. Specifically, the average height H of all columnar electrodes 170 is calculated. Then, for each columnar electrode 170, the difference in height H with respect to the average is obtained, and if the obtained difference is smaller than the threshold value, the height H is determined to be "normal", and if the difference from the average is larger than the threshold value, " Judge as "abnormal".

When all the columnar electrodes 170 are "normal", the controller 210 collectively mounts the columnar electrodes 170 on the substrate P as shown in FIG. 7 (C).

On the other hand, if any one of them has an "abnormality" in height H, the holding plate 150 is treated as a repair product and is not used for production. By doing so, it is possible to suppress mounting defects of the columnar electrode 170 due to variations in height H when mounting on the substrate P. Therefore, it is possible to suppress the production of defective substrates.

Although the embodiments have been described in detail above, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples illustrated above.

(1) In the first embodiment, an example in which the columnar electrode 170 is mounted on the substrate P is shown, but the mounting target of the columnar electrode 170 is not limited to the substrate P, and may be a component such as an IC. That is, the columnar electrode 170 may be mounted on a component such as an IC.

(2) Further, as shown in FIG. 20, the substrate P may be an aggregate substrate Pr composed of a plurality of small substrates P1 to P4. In the case of the collective substrate Pr, as shown in FIG. 21, the columnar electrode groups G1 to G4 corresponding to the small substrates P1 to P4 are collectively held with respect to the holding plate 150 by the number of the small substrates. Then, a plurality of columnar electrode groups G1 to G4 may be collectively mounted on the small substrates P1 to P4 of the collective substrate Pr by using the holding plate 150.

(3) In the first embodiment, after mounting the columnar electrode 170, the land 100 of the substrate P and the columnar electrode 170 are joined by heating the substrate P from below with the heater 27 built in the backup plate 26 (hereinafter, reflow step). )did. Then, after joining, a step of pulling the holding plate 150 away from the columnar electrode 170 joined to the substrate P was performed.

The holding plate 150 can be separated as long as the mounted columnar electrode 170 is fixed to the substrate P by some means. Therefore, the reflow step may be performed after the holding plate 150 is separated from the columnar electrode 170. Furthermore, the reflow process and the mounting process of the IC component 180 may be performed by another device arranged on the downstream side of the mounting device 1. That is, the mounting device 1 may be a device that performs a step of mounting the columnar electrode 170 on the substrate P by using at least the holding plate 150.

As an example of the method of fixing the columnar electrode 170 and the land 100, there is a method of using an ultraviolet curable resin agent. That is, a curable resin agent is applied to the land 100 of the substrate P in advance. Then, after mounting the columnar electrode 170 on the substrate P, for example, the adhesive is cured by irradiating ultraviolet rays from an ultraviolet irradiation device provided in the head unit 60. As a result, the columnar electrode 170 can be fixed to the land 100 of the substrate P. The resin agent can be applied, for example, by an upstream machine before the substrate P is carried into the mounting device 1.

(4) In the first embodiment, an example is shown in which the holding plate 150 is separated from the columnar electrode 170 mounted on the substrate P by using the mounting head 63 of the head unit 60. The holding plate 150 does not necessarily have to be separated by using the mounting head 63, and a dedicated pulling device may be provided. The pulling device may have a structure that allows the holding plate 150 to be pulled upward in a fixed state, and the installation location is not limited to the mounting device 1. That is, it may be installed in the mounting device 1 or may be installed separately from the mounting device 1.

(5) In the first embodiment, after mounting the columnar electrode 170 on the substrate P, the holding plate 150 is photographed by the first camera 81, and the columns left on the holding plate 150 from the obtained images 400A and 400B. The presence or absence of the electrode 170 was inspected, but this inspection is optional.

(6) In the first embodiment, the shape of the columnar electrode 170 is cylindrical, but it may be prismatic.

(7) In the second embodiment, the quality of the mounted state of the columnar electrode 170 with respect to the substrate P was inspected based on the difference image 530 of the substrate P before and after mounting the columnar electrode 170. In addition to using the difference image, after mounting the columnar electrode 170, the quality of the mounted state of the columnar electrode 170 on the substrate P may be inspected based only on the image 520 of the substrate P taken by the second camera 85. ..

(8) In the third embodiment, a laser displacement meter 600 is provided on the base 11, and the height of the lower surface 171 of the columnar electrode 170 held by the holding plate 150 is measured. In addition to this, a laser displacement meter may be separately provided to measure the height of the upper surface 172 of the columnar electrode 170 mounted on the substrate P. The upper surface 172 is a mounting surface for the IC component 180, which is a mating component. In the example of FIG. 22, the laser displacement meter 700 is provided with respect to the head unit 60 with the detection surface facing downward. The laser displacement meter 700 is an example of the "second detection unit" of the present invention.

The controller 210 pulls the holding plate 150 away from the columnar electrode in the step (E) of FIG. 8, and then inspects the presence or absence of the columnar electrode 170 remaining in the holding plate 150 in the step (F) of FIG. To do. Then, when the remaining columnar electrodes 170 do not exist, the controller 210 moves the head unit 60 above the substrate P and lasers the height of the upper surface 171 of each columnar electrode 170 mounted on the substrate P. Measure with a displacement meter 700. The height of the upper surface 171 may be measured with reference to, for example, the upper surface of the substrate P.

After that, the controller 210 determines whether or not the height of the upper surface 172 is good or bad, that is, whether or not the height varies, for each columnar electrode 170 based on the measurement result. The method for determining the height variation is the same as that in the third embodiment.

When the heights of all the columnar electrodes 170 are "normal", the controller 210 is an IC that is a mating component on the substrate P on which the columnar electrodes 170 are mounted, as shown in FIG. 8 (H). The component 180 is mounted. On the other hand, if any one of them has an "abnormality" in height, the substrate P is treated as a defective substrate and is not used for subsequent production. By doing so, it is possible to suppress mounting defects of the IC component 180 due to variations in the height of the upper surface 171 and at the same time, it is possible to suppress the outflow of defective substrates.

In addition to the inspection of the height of the upper surface 172 of the columnar electrode 170 by the laser displacement meter 700, the mounting state of the columnar electrode 170 based on the difference image 530 described in the second embodiment is inspected, and both inspections are normal. In this case, the step (H) of FIG. 8 may be performed to mount the IC component 180 on the substrate P on which the columnar electrode 170 is mounted. Further, the laser displacement meters 600 and 700 can be substituted by a stereo camera or the like that simultaneously captures an object from a plurality of different directions.

In the first embodiment, an example in which the columnar electrode 170 is held on the holding plate 150 by using the adhesive layer 155 is shown. The holding method may be a mechanical holding such as a hook or a claw, in addition to the adhesive.

1 ... On-board device 5 ... Inspection device 11 ... Base 60 ... Head unit (an example of the "head portion" and "pulling device" of the present invention)
63 ... Mounted head 81 ... First camera 85 ... Second camera 150 ... Holding plate (an example of the "holding body" of the present invention)
151 ... Plate body 155 ... Adhesive layer 170 ... Columnar electrode 210 ... Controller (corresponding to the "judgment unit" of the present invention)
300 ... image (corresponding to the "first image" of the present invention)
400 ... image (corresponding to the "second image" of the present invention)
510 ... image (corresponding to the "fourth image" of the present invention)
520 ... image (corresponding to the "third image" of the present invention)
530 ... difference image

Claims (18)

It ’s an inspection device,
Using a plate-shaped holding member having an adhesive layer for holding the columnar electrodes on the lower surface is provided on the mounting device for collectively mounting a plurality of the columnar electrode on a substrate or on parts, first to shoot the holder 1 With the camera
An inspection device including a determination unit for determining whether or not the holding state of the columnar electrodes is good or bad by the holding body based on a first image of the holding body taken by the first camera before being collectively mounted. The inspection device according to claim 1.
When the determination unit has an abnormality in the holding state of the columnar electrode by the holding body,
An inspection device that displays a display that teaches a repair method according to the type of abnormality of the holding body to be inspected. The inspection device according to claim 1 or 2.
When the holding state of the columnar electrode by the holding body is normal,
An inspection device that collectively mounts and fixes a plurality of the columnar electrodes on the substrate or the component using the holding body, and then separates the holding body from the columnar electrodes by a pulling device. The inspection device according to claim 1 to 3.
The determination unit determines the presence or absence of the columnar electrode left on the holding body without mounting the holding body separated from the columnar electrode based on the second image taken by the first camera. , Inspection equipment. The inspection device according to any one of claims 1 to 4.
A second camera for photographing the substrate or the component is provided.
After the holding body is separated, the determination unit mounts the columnar electrode on the substrate or the component based on a third image of the substrate or the component to which the columnar electrode is fixed taken by the second camera. An inspection device that judges the quality of the condition. The inspection device according to claim 5.
The determination unit compares the third image with the fourth image of the substrate or the component taken by the second camera before the columnar electrodes are collectively mounted, whereby the columnar electrode or the component is mounted on the substrate or the component. An inspection device that determines the quality of the electrode mounting condition. The inspection device according to any one of claims 1 to 6.
A first detection unit for detecting the height of the lower surface of the columnar electrode held by the holder is provided.
The determination unit is an inspection device that determines whether or not the height of the lower surface of the plurality of columnar electrodes held by the holding body is good or bad based on the detection value of the first detection unit. The inspection device according to any one of claims 1 to 7.
A second detection unit for detecting the height of the upper surface of the columnar electrode mounted on the substrate or the component is provided.
The determination unit is an inspection device that determines the quality of the height of the upper surface of a plurality of the columnar electrodes mounted on the substrate or the component based on the detection value of the second detection unit. A mounting device that mounts columnar electrodes on a substrate or component.
Base and
A head portion for collectively mounting a plurality of the columnar electrodes on the substrate or the components by using a plate-shaped holding body having an adhesive layer for holding the columnar electrodes on the lower surface.
An on-board device comprising the inspection device according to any one of claims 1 to 8. The on-board device according to claim 9.
The inspection device determines whether or not the holding state of the columnar electrode by the holding body is good or bad based on the first image of the holding body taken by the first camera provided in the mounting device before the batch mounting.
The head portion is a mounting device that separates the holding body from the columnar electrodes collectively mounted on the substrate or the component when the holding state of the columnar electrode by the holding body is normal. It ’s an inspection method,
In a first camera provided a plurality of the columnar electrode by using a plate-shaped holding member having an adhesive layer for holding the columnar electrodes on the lower surface to the mounting apparatus for collectively mounted on a substrate or on parts, said holding body , Before loading all at once
An inspection method for determining whether or not the holding state of the columnar electrode by the holding body is good or bad based on the first image of the holding body taken by the first camera. The inspection method according to claim 11.
An inspection method in which, when there is an abnormality in the holding state of the columnar electrode by the holding body, the holding body to be inspected is displayed to teach a repair method according to the type of abnormality. The inspection method according to claim 11 or 12.
When the holding state of the columnar electrode by the holding body is normal,
An inspection method in which a plurality of the columnar electrodes are collectively mounted and fixed on the substrate or the component by using the holding body, and then the holding body is separated from the columnar electrodes by a pulling device. The inspection method according to any one of claims 11 to 13.
An inspection method for determining the presence or absence of the columnar electrode left in the holding body without mounting the holding body separated from the columnar electrode based on a second image taken by the first camera. The inspection method according to any one of claims 11 to 14.
After the holding body is separated, the substrate or the component to which the columnar electrode is fixed is photographed by a second camera.
An inspection method for determining whether or not the columnar electrode is mounted on the substrate or the component based on a third image of the substrate or the component taken by the second camera. The inspection method according to claim 15.
By comparing the third image with the fourth image of the substrate or the component taken by the second camera before the columnar electrodes are collectively mounted, the mounting state of the columnar electrode on the substrate or the component is obtained. An inspection method to judge the quality. The inspection method according to any one of claims 11 to 16.
The height of the lower surface of the columnar electrode held by the holding body is detected by the first detection unit.
An inspection method for determining whether or not the height of the lower surface of a plurality of columnar electrodes held in the holding body is good or bad based on the detection value of the first detection unit. The inspection method according to any one of claims 11 to 17.
The height of the upper surface of the columnar electrode mounted on the substrate or the component is detected by the second detection unit.
An inspection method for determining whether or not the height of the upper surface of a plurality of the columnar electrodes mounted on the substrate or the component is good or bad based on the detection value of the second detection unit.

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