JPH10261735A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mount type area array package having narrow pitch. SOLUTION: A μPGA.IC has a wiring board 10 wherein inner terminals 12 and external terminals 13 which are connected by an electric wiring 14 are formed on both of the surfaces. Wires 23 bridge an electrode pad of a pellet 22 which is fixed on the wiring board 10 by a bonding layer 21 and the inner terminals 12. The pellet 22, the inner terminals 12 and the wires 23 are plastic-molded by a resin sealing member 25. Micropins 27 whose outer diameters are set to be 30-100 μm and whose length are set to be 0.5-1.2 mm are soldered on the respective external terminals 13. Thereby, since the outer diameter of the micropin 27 is thin, the pitch between pins can be narrowed, and the mounting density can be increased in the area arrangement of the micropins 27. Surface-mount is possible by abutting the micropins 27 against the land of a mounting board. Imperfection such as short-circuiting between pins which is to be caused by collapse of solder bumps of a BGA can be prevented by maintaining a gap between the μPGA.IC and the mounting board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for manufacturing a semiconductor device, and more particularly to a technology for manufacturing a semiconductor device having a surface mount type package in which external terminals are arranged in an area. The present invention also relates to a device which is effective when used for a low-cost semiconductor integrated circuit device (hereinafter, referred to as an IC).

[0002]

2. Description of the Related Art Today, as the number of pins increases, packages having pins (external terminals) from peripheral portions, such as quad flat package (QFP) ICs and tape carrier package (TCP) ICs, have a narrow pitch. As a result, it is approaching the limits of package manufacturing and board assembly. Therefore, a ball grid array package (hereinafter, referred to as BGA) is provided as a surface mount IC that realizes a large number of pins without increasing the size of the package by arranging external terminals on the entire main surface of the package. Some ICs have been proposed.

That is, an IC provided with this BGA
(Hereinafter referred to as BGA-IC), an internal terminal group and an external terminal group are formed on a front main surface and a rear main surface, respectively, and each internal terminal and each external terminal are electrically connected to each other. A semiconductor pellet is bonded to the main surface of the wiring substrate on the side on which the internal terminals are formed, and is electrically connected to the internal terminal group by bonding wires. The semiconductor pellet-side main surface of the board is resin-sealed with a resin sealing body including the semiconductor pellet, and solder bumps are projected from each external terminal exposed on the opposite main surface of the wiring board. Have been.

Incidentally, as an area array package in which external terminals are arranged in areas, a pin grid package is used.
An array package (hereinafter, referred to as PGA) has been conventionally known. However, since PGA is an insertion type package, pins having an outer diameter of 2 mm or more and a length of 3 mm or more are fixed to each external terminal of the wiring board by a silver brazing method or a driving method.

[0005] As an example describing BGA and PGA, see "VLSI Packaging Technology (Lower)" published by Nikkei BP Co., Ltd., published on May 31, 1993, p.
3 to P178.

[0006]

However, in the above-mentioned BGA, since the outer diameter of the solder bump is large,
In addition, during reflow soldering to a mounting board, the solder bumps are crushed and short-circuits between pins are caused, so that there is a limit to narrowing the pitch between pins.

Further, since the above-mentioned PGA is an insertion type package, its outer diameter is 2 mm or more and its length is 3 m.
m or more pins are required, and there is a limit to narrowing the pitch between pins and improving electrical characteristics.

An object of the present invention is to provide a semiconductor device having a novel surface-mount area array package capable of reducing the pitch between pins.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a plurality of internal terminals and a plurality of external terminals are respectively formed on the wiring board, and each of the internal terminals and each of the external terminals are electrically connected to each other. Is a semiconductor device in which a semiconductor pellet fixed to a wiring board is electrically connected, and each pin is mechanically and electrically connected to each of the external terminals, wherein the pin has an outer diameter of 30 μm to 1 μm.
It is characterized by being formed with a length of 0.5 mm to 1.2 mm with a thickness of 00 μm.

The above-mentioned pins (hereinafter referred to as micro pins).
Can be connected to the external terminals by soldering. Further, the micro pins can be connected to the external terminals by wire bonding.

The above-described semiconductor device is surface-mounted on a mounting board by reflow soldering each micro pin against each land of the mounting board.

According to the above-mentioned means, since the outer diameter of the micropin is extremely small, the pitch between the pins can be sufficiently narrowed, and since the pin arrangement is in the form of an area, the mounting density can be set high. . Further, since the length is extremely short, it is possible to mount the micro pins on the lands of the mounting board by surface mounting. Moreover, since the micro pins are in contact with the lands of the mounting board, the distance between the semiconductor device and the mounting board can be maintained, and
It is possible to prevent short-circuit between pins due to the collapse of the solder bumps in A.

[0015]

1A and 1B show a semiconductor device according to an embodiment of the present invention. FIG. 1A is a plan sectional view of an upper half, a bottom view is a lower half, and FIG. It is. FIG. 2 is an explanatory view showing a method for manufacturing the semiconductor device according to an embodiment of the present invention.

In the present embodiment, the semiconductor device according to the present invention has a surface-mounted PGA (hereinafter referred to as μPGA) in which a micro pin and a micro pin are fixed to external terminals arranged in an area shape.
That. ). An IC (hereinafter, referred to as μPGA · IC) 32 including the μPGA is configured as shown in FIG.

That is, the μPGA IC 32 has a wiring board 10 in which a group of internal terminals 12 and a group of external terminals 13 are formed on a front main surface and a rear main surface, respectively. 13 are electrically connected to each other by an electric wiring 14 penetrating the base 11 of the wiring board 10. A semiconductor pellet in which a semiconductor integrated circuit including a semiconductor element group is built (hereinafter, referred to as a pellet).
Reference numeral 22 denotes a face-up arrangement on the main surface of the wiring board 10 on the side of the internal terminals 12, and is fixed (bonded) to the center of the upper surface of the base 11 of the wiring board 10 by a bonding layer 21. A plurality of electrode pads are formed on the main surface opposite to the bonding surface of the pellet 22 and are arranged in a ring around the outer periphery. Each electrode pad is formed between each of the internal terminals 12 of the wiring board 10. The wires 23 are respectively bridged. A resin sealing body 25 is formed on the pellet-side main surface and the side surface of the wiring substrate 10 by the pellet 2.
2. Molded so as to seal the internal terminals 12 and the wires 23 with resin. Each external terminal 13 exposed on the opposite main surface of the wiring board 10 has a micro pin 2
7 are fixed by soldering. And
This μPGA · IC 32 is manufactured by a manufacturing method described below.

Hereinafter, μPGA according to an embodiment of the present invention will be described.
-A method for manufacturing an IC will be described. According to this description, μPG
The details of the configuration of the A-IC 32 will be clarified together.

In this embodiment, the wiring board 10 shown in FIG. 2 is used in the method of manufacturing the μPGA IC. The wiring substrate 10 includes a base 11 formed of a square plate using an insulating substrate. The outer diameter of the base 11 is set larger than the outer diameter of the pellet. In the present embodiment, the base 11 is formed in a multilayer structure (not shown) using glass epoxy resin in which glass fiber is impregnated with epoxy resin. However, the base 11 can be formed using another insulating substrate such as a ceramic.

On one principal surface (hereinafter, referred to as an upper surface) of the base 11, a plurality of (scored to the number corresponding to the electrode pads of the pellets) a plurality of internal terminals 12 formed in a small-diameter rectangular thin plate shape are square. It is aligned and fixed on the outline. On the lower surface of the base 11, the number of external terminals 13 formed in the shape of a small-diameter circular thin plate are dispersed and arranged in a number corresponding to the number of the internal terminals 12 so as to be substantially uniform over the entire surface of the square. I have. In the present embodiment, the internal terminal 1
The second group and the external terminal 13 group are formed by patterning a copper foil adhered to the surface of the base 11 by lithography and etching. However, the internal terminals 12 and the external terminals 13 may be formed by a screen printing method, a plating method, an evaporation method using a metal mask, or the like.

Internal terminal 1 arranged on the upper surface of base 11
The internal terminals 12 and the external terminals 13 are electrically independent from each other and electrically connected to the external terminals 13 disposed on the lower surface of the base 11 by an electric wiring 14 disposed inside the base 11. It is connected to the. A large number of electrical wirings 14, which are wired in a state of being electrically insulated from each other, are so-called multi-layered by connecting the upper and lower layers to each other by through holes after being patterned on each layer of the base 11 formed in a multilayer structure. It is formed in a wiring structure.

In this embodiment, a protective film 15 called a solder resist is applied to the upper and lower surfaces of the base 11, respectively, and the internal terminals 12 on the upper surface and the external terminals 13 on the lower surface are separated from the protective film 15 by the protective film 15. The main surfaces are each exposed.

In the pellet bonding step and the wire bonding step, the pellet 22 is bonded by the bonding layer 21 to the wiring board 10 having the above-described structure, as shown in FIG.
Wires 23 are bonded at both ends and bridged between each electrode pad formed on the outer peripheral portion of the upper surface of the pellet 22 and each internal terminal 12 of the wiring board 10.

Although detailed description is omitted, the μPGA
In the pellet 22 used for the IC, an integrated circuit including a desired semiconductor element group is appropriately formed in a wafer state in a so-called pre-process in a semiconductor device manufacturing process. Then, a pellet 22 in which an integrated circuit (not shown) is formed
Is diced into small pieces of a substantially square shape that can be placed at the center of the wiring board 10, and a plurality of electrode pads formed using a conductive metal are One end of the wire 23 is provided so as to be bondable.

When the pellet 22 is mechanically and electrically connected to the wiring board 10 by the pellet and wire bonding operation, an assembly of the wiring board and the pellet shown in FIG. 3 (hereinafter, referred to as an assembly). 24 are manufactured.

Next, this assembly 24 includes a resin sealing body 25.
Are molded as shown in FIG. Resin sealing body 2
The pellet 22, the internal terminals 12 group, the wires 23 group, and a part of the wiring board 10 are resin-sealed inside the resin sealing body 25 in the assembly (hereinafter, referred to as a molded body) 26 in which the mold 5 is formed. ing. An end surface of the molded body 26 opposite to the pellet mounting surface of the base 11 of the wiring board 10 is exposed from the surface on the lower surface of the resin sealing body 25, and the external terminals 13 are exposed.

Thereafter, as shown in FIG. 5, each of the external terminals 13 exposed on the lower surface of the base 11 of the wiring board 10 in the molded body 26 is mechanically and micro-pinned by a reflow soldering method. Electrically connected.

As shown in FIG. 5A, the micro pins 27 are formed in a substantially thumbtack shape using Kovar (Fe-Ni-Co alloy). Micro pin 2
7 has a needle part 28 having an outer diameter of 30 μm to 100 μm and a total length of 0.5 mm when soldered to the external terminal 13.
It is set to be 2 mm.
The outer diameter of the flange 29 is set substantially equal to the outer diameter of the external terminal 13. Although not shown, the micro pins 27 are coated with a nickel (Ni) plating film and a gold (Au) plating film.

The micro pins 27 according to the above configuration are mounted on a jig 40. The jig 40 includes a main body 41 made of a heat-resistant material such as quartz glass and formed in a rectangular flat plate shape larger than the wiring board 10. The thickness of the main body 41 is the needle portion 28 of the micro pin 27. Is set longer than the length. The body 41 has the same number of pin holding holes 42 as the external terminals 13 of the wiring board 10, arranged so as to face each external terminal 13, and is opened so as to penetrate in the thickness direction. The inner diameter of the pin holding hole 42 is set to be larger than the outer diameter of the needle 28 of the micropin 27 and smaller than the flange 29 of the micropin 27. The micro pin 27 is attached to the jig 40 with the needle portion 28 inserted into the pin holding hole 42 from above and the flange portion 29 engaged with the opening edge of the pin holding hole 42 on the upper surface of the main body 41.

On the other hand, as shown in FIG.
On the exposed surface of each external terminal 13, a preliminary soldering portion 30 for forming a soldering portion is formed in advance by a screen printing method, an immersion soldering method (solder dipping method), or the like. In the present embodiment, the preliminary soldering part 30 has a melting point of 320 ° C.
Is formed by using a high melting point solder material of Pb-5 wt% Sn.

The molded body 26 having the external terminal 13 and the preliminary solder portion 30 formed thereon is connected to the jig 4 on which the micro pins 27 are mounted.
Set to 0. At this time, the flange 2 of each micro pin 27
9 and the external terminals 13 are positioned so as to abut each other.

Subsequently, by the reflow soldering process (not shown), the spare solder portions 30 of the external terminals 13 are each heated and melted, and then cooled and solidified, as shown in FIG. 5B. Each soldered portion (hereinafter, referred to as a pin connection portion) 31 is formed between each external terminal 13 of the molded body 26 and the flange portion 29 of each micro pin 27. At this time, since the preliminary solder portion 30 is formed of a high melting point solder material, a relatively high temperature heat treatment is performed.

As described above, the micro pins 27 are mechanically connected to the external terminals 13 of the molded body 26 by the respective pin connecting portions 31.
Of each micro pin 2 via the pin connection 31
7 are electrically connected to each other.
The μPGA IC 32 shown in FIG.

ΜPGA manufactured and configured as described above
The IC 32 is surface-mounted on the mounting board 33 as shown in FIG. That is, as shown in FIG. 6A, each land 34 on which the preliminary solder portion 35 is formed is formed.
The μPGA IC 32 is mounted on the mounting board 33 so that the lower ends of the micro pins 27 abut against each other. In this embodiment, the mounting board 3
The pre-soldering portion 35 for the third land 34 is formed using a normal solder material of Pb-62 wt% Sn having a melting point of 183 degrees Celsius.

Subsequently, when each spare solder portion 35 is heated and melted and cooled and solidified by a reflow soldering process (not shown), each solder portion (hereinafter, referred to as a mounting solder portion) 36 is formed. As shown in FIG. 6B, they are formed simultaneously. At this time, since the preliminary solder portion 35 for the land 34 of the mounting board 33 is formed of low melting point solder, a relatively low temperature heat treatment is performed. Therefore, the respective pin connection portions 31 of the μPGA · IC 32 soldered with the high melting point solder are not melted by the soldering process of the mounting soldering portion 36.

Each micro pin 27 and each land 34
Even if there is a slight displacement between the micro-pins 27 and the lands 34, the mounting soldering portion 36 exhibits a self-alignment function. The pins 27 are securely and mechanically and electrically connected to the lands 34 by the respective soldering portions 36.

Further, each micro pin 27 is connected to each land 3
4, the μPG
Since the group of micro pins 27 supports the load of the A · IC 32, the distance between the μPGA · IC 32 and the mounting board 33 is maintained as designed and uniform. Therefore, the occurrence of a short circuit between pins due to the crushing of the solder bumps in the BGA IC is prevented beforehand.
As a result, it is possible to widen a margin in temperature control of the reflow soldering process at the time of surface mounting.

Next, the operation will be described. Due to the difference in the thermal expansion coefficient between the wiring board 10 and the mounting board 33, the heat resistance during the heat cycle test in the screening test and the μPGA · IC32
When a large thermal fluctuation acts on the μPGA IC 32 and the mounting board 33 during the actual operation of the
When a large difference occurs between the amount of expansion deformation and the amount of contraction deformation between the C32 and the mounting board 33, stress is applied to the mounting soldering portion 36, and peeling or cracking occurs in the mounting soldering portion 36. There is.

However, in this embodiment, FIG.
As shown in (b), since the micro pins 27 having a very small length are interposed between the μPGA IC 32 and the mounting board 33, the micro pins 27 due to the difference in thermal expansion coefficient at the time of thermal fluctuation. The difference in the amount of deformation between the μPGA · IC 32 and the mounting board 33 is absorbed by the elastic deformation of the micropin 27. As a result, peeling and cracking of the mounting soldered portion 36 are prevented.

Further, in this embodiment, since the pin connection portion 31 is formed on the flange portion 28 of the micro pin 27, the soldering area is increased, so that the soldering strength is increased, and Thermal stress can be widely dispersed. Therefore, it is possible to prevent fatigue destruction of the pin connection portion 31 due to thermal stress.

By the way, when a defect is detected by an electrical characteristic test or the like in a mounting structure in which the μPGA IC 32 is mechanically and electrically connected to the mounting board 33 by a group of micro pins 27, it is reused by repair. It is desirable from the viewpoint of improving the production yield of the μPGA · IC 32. In such a case, in the present embodiment, the μPGA · IC 32 and the mounting board 33 can be separated from each other, so that repair can be performed.
The production yield of C32 can be improved.

When it is desired to separate the μPGA IC 32 from the mounting board 33, it is heated to a working temperature slightly higher than the melting point of the low melting point solder forming the mounting soldering portion 36. Since the soldering portion 36 is melted by this heating, the μPGA IC 32 is separated from the mounting board 33 so that the μPGA IC 32
3 at the lower end of the micropin 27.

According to the above embodiment, the following effects can be obtained. (1) Each micropin is mounted by setting the outer diameter of the micropin, which is mechanically and electrically connected to the external terminal, to 30 μm to 100 μm and the length of the micropin to 0.5 mm to 1.2 mm. Since the lands can be mechanically and electrically connected to the lands of the board, the μPGA IC can be surface-mounted on the mounting board.

(2) By setting the outer diameter of the micro pins to be extremely small, the pitch between the pins can be sufficiently narrowed, and since the arrangement of the micro pins is in the form of an area, the mounting density is set high. be able to.

(3) By setting the length to be extremely short, it is possible to mount the micropins on the lands of the mounting board to enable surface mounting, and to set the micropins in contact with the lands of the mounting board. Becoming μP
Since the gap between the GA / IC and the mounting board can be maintained, it is possible to prevent short-circuit between pins due to crushing of solder bumps in the BGA.

(4) By soldering the micro pins to the lands of the mounting board, the μPG at the time of thermal fluctuation based on the thermal expansion coefficient difference between the μPGA · IC and the mounting board.
Since the difference in the amount of deformation between the AIC and the mounting board can be absorbed by the elastic deformation of the pins, it is possible to prevent peeling and cracking from occurring at the mounting soldering portion.

(5) The durability of the mounted body in which the μPGA IC is mounted on the mounting board by soldering is prevented by preventing the occurrence of peeling or cracking at the soldered portion due to stress due to thermal fluctuation. And the quality and reliability of the package can be improved.

(6) The mounting soldering part is made of μPGA.IC
By using a solder material having a lower melting point than the solder material of the pin connection part, the μPGA · IC can be easily separated from the mounting board, so that repair becomes possible. The manufacturing yield of IC can be improved.

(7) By forming the pin connection by soldering the flange formed at one end of the micro pin to the external terminal, the soldering area of the pin connection can be increased, so that the soldering strength is increased. And stress can be widely dispersed. As a result, it is possible to prevent fatigue destruction due to stress of the pin connection portion 31 of the μPGA · IC.

FIG. 7 shows μPGA according to the second embodiment of the present invention.
-It shows the pin connection process in the IC manufacturing method,
(A) is a front sectional view showing a wire bonding step,
(B) is a partially cut front view showing a cutting step.

The second embodiment differs from the first embodiment in that micropins are mechanically and electrically connected to external terminals by wire bonding. That is, as shown in FIG. 7A, the wire 43 is inserted into the capillary 44 of the nail head bonding apparatus, and the tip is nail-head bonded to the external terminal 13. Subsequently, as shown in FIG. 7B, the wire 4 having one end bonded to the external terminal 13 is formed.
3 is fed out to an appropriate length, and a cutter 4 is fixed at a predetermined position.
5 cut. By this action, the external terminal 13
Are micro pins formed by wire bonding (hereinafter referred to as wire bonding micro pins).
27A is mechanically and electrically connected. Although not shown, then, a ball is formed by a discharge torch at the tip of the wire 43 tailed from the capillary 44. Thereafter, by repeating the above operation, the wire bonding micro pins 27A are mechanically and electrically connected to all the external terminals 13.

When connecting the wire bonding micro pins 27A to the external terminals 13 described above, the wire 43 is a conductive wire such as a gold wire or a copper wire and has an outer diameter of 30 mm.
A wire of μm to 100 μm is used. The cut length of the wire 43 having one end bonded to the external terminal 13 is
It is set to 0.5 mm to 1.2 mm.

According to the second embodiment, since the wire bonding micro pins 27A connected to the external terminals 13 by wire bonding are set to be extremely fine and extremely short, the same functions and effects as those of the first embodiment are exerted. Is done.

In FIG. 7, the work 26A to which the wire bonding micro-pins 27A are connected to the external terminals 13 by wire bonding includes a connection terminal 23A in which the pellet 22 is formed on the wiring board 10 by bumps (not shown). Are mechanically and electrically connected to each other, and the resin sealing body 25A is molded by a potting method so as to resin seal the connection terminal portion 23A group.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say.

For example, the combination of solder materials having different melting points is not limited to the use of 320 ° C. solder and 183 ° C. solder, but may be any combination of solder materials having different melting point temperature differences. Can be used.

The micro pins are not limited to being mechanically and electrically connected to the external terminals by soldering, but may be connected by a conductive adhesive. The wire bonding pins are not limited to be connected by the nail head bonding method, but may be connected by the wedge bonding method.

The method is not limited to connecting the micro pins mechanically and electrically to the external terminals after mechanically and electrically connecting the pellets to the wiring board, but also to connecting the micro pins to the wiring board mechanically and electrically. The micro pins may be mechanically and electrically connected to the external terminals.

The mechanical and electrical connection between the wiring substrate and the pellet is not limited to the wire bonding method and the flip chip method, but may be a tape automated bonding (TAB) method.

The micro pins are not limited to being arranged on the end face of the wiring substrate opposite to the pellet (so-called cavity up), but may be arranged on the pellet-side end face of the wiring board (so-called cavity down). Good.

In the above description, the case where the invention made by the inventor is mainly applied to the resin-sealed μPGA · IC which is the field of application as the background has been described, but the invention is not limited to this. Airtight sealed μP
It can be applied to GA / IC. In particular, the present invention
An excellent effect can be obtained when used in a semiconductor device that is small and lightweight, has many pins, and requires low cost.

[0062]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The external terminals arranged in the area form have an outer diameter of 3
By mechanically and electrically connecting micro pins having a length of 0 μm to 100 μm and a length of 0.5 mm to 1.2 mm, the micro pins are respectively mechanically and electrically connected to the lands of the mounting board. Can be
The semiconductor device can be surface-mounted on a mounting board.

By setting the outer diameter to be extremely small, the pitch between pins can be sufficiently reduced, and the mounting density can be set to be large because the micropins are area-shaped.

By setting the length to be extremely short, it is possible to mount the micropins on the lands of the mounting board to enable surface mounting, and to set the micropins in contact with the lands of the mounting board. Since the distance between the semiconductor device and the mounting board can be maintained, the BGA
In this case, it is possible to prevent the occurrence of a short-circuit between pins due to the collapse of the solder bumps.

The micropin has an outer diameter of 30 μm to 100 μm and a length of 0.5 mm according to the size and the number of pins of the semiconductor device, required electric characteristics and required specifications.
It is desirable to set an appropriate value of ~ 1.2 mm. When the outer diameter is smaller than 30 μm, the mechanical strength of mancropine is insufficient. Conversely, if the outer diameter exceeds 100 μm,
The mounting density of the micro pins is rapidly reduced. When the length is shorter than 0.5 mm, the above-described stress relaxation effect and connection reliability are reduced. Conversely, if the length exceeds 1.2 mm, the micropins are bent in the surface mounting state, so that surface mounting becomes impossible.

[Brief description of the drawings]

1A and 1B show a μPGA IC according to an embodiment of the present invention, in which FIG. 1A is a plan sectional view of an upper half, a bottom view is a lower half, and FIG.

FIGS. 2A and 2B show a wiring board used in a method of manufacturing a μPGA IC according to an embodiment of the present invention, wherein FIG. 2A is a plan view of an upper half, a bottom view of a lower half, and FIG. () Is a partially cut front view.

3A and 3B show a pellet and after wire bonding. FIG. 3A is a plan view of an upper half, a bottom view of a lower half, and FIG. 3B is a partially cut front view.

4A and 4B show a state after molding of a resin sealing body, wherein FIG. 4A is a plan sectional view of an upper half, a bottom view is a lower half, and FIG. 4B is a partially cut front view.

FIG. 5 shows a micropin soldering process;
(A) is a partially cut front view before soldering, (b) is a front view after soldering.

FIG. 6 shows a mounting process of μPGA · IC,
(A) is a front view before mounting, and (b) is a front view after mounting.

FIG. 7 shows a micro-pin connection step in a method of manufacturing a μPGA-IC according to a second embodiment of the present invention;
(A) is a front sectional view showing a wire bonding step,
(B) is a partially cut front view showing a cutting step.

[Description of sign]

10: wiring board, 11: base, 12: internal terminal, 13
... external terminals, 14 ... electric wiring, 15 ... protective film, 21 ... bonding layer, 22 ... pellets, 23 ... wires, 24 ...
Assembly: 25: Resin sealed body, 26: Molded body, 27: Micro pin, 28: Needle part, 29: Flange part, 30: Spare solder part, 31: Soldering part (pin connection part), 32: μPGA
· IC (semiconductor device), 33: mounting board, 34: land, 35: spare soldering part, 36: mounting soldering part, 40 ...
Jig, 41 ... body, 42 ... pin holding hole, 23A ... connection terminal, 25A ... resin sealing body, 26A ... work, 27A ...
Wire bonding micro pins, 43 ... wires, 44
... capillary, 45 ... cutter.

Claims (10)

[Claims] A plurality of internal terminals and a plurality of external terminals are respectively formed on a wiring board, and each of the internal terminals and each of the external terminals are electrically connected to each other. Is a semiconductor device in which a semiconductor pellet fixed to a wiring board is electrically connected, and each pin is mechanically and electrically connected to each of the external terminals, wherein the pin has an outer diameter of 30 μm to 100 μm. 0.5 length
A semiconductor device characterized in that the distance is set to be in the range of mm to 1.2 mm. 2. The semiconductor device according to claim 1, wherein said pins are soldered to said external terminals. 3. The semiconductor device according to claim 2, wherein the pin has a flange at one end and is soldered to the external terminal at one end of the flange. 4. The pin is soldered to the external terminal with a solder material having a melting point higher than a melting point of a solder material used for mounting.
3. The semiconductor device according to claim 1. 5. The semiconductor device according to claim 1, wherein the pins are formed on the external terminals by wire bonding. 6. The method of manufacturing a semiconductor device according to claim 1, wherein the outer diameter is 30 μm to 100 μm and the length is 0.5 mm to 1 μm.
A method of manufacturing a semiconductor device, wherein a 2 mm pin is prepared in advance, and the pin is mechanically and electrically connected to the external terminal. 7. The method according to claim 6, wherein a flange is formed at one end of the pin in advance, and one end of the flange is soldered to the external terminal. 8. The semiconductor device according to claim 6, wherein the pins are soldered to the external terminals with a solder material having a melting point higher than a melting point of a solder material used for mounting. Method. 9. The method of manufacturing a semiconductor device according to claim 1, wherein the wire having an outer diameter of 30 μm to 100 μm is bonded to one end of the external terminal, and then the length of the wire is increased. 0.
A method of manufacturing a semiconductor device, wherein the pin is formed by cutting the pin to 5 mm to 1.2 mm. 10. The method according to claim 9, wherein the wire is bonded to the external terminal by a nail head wire bonding method.