CN220006302U

CN220006302U - Lamp bead removing assembly and lamp panel repairing equipment

Info

Publication number: CN220006302U
Application number: CN202321024431.2U
Authority: CN
Inventors: 李长浩; 白绳武; 李阳; 欧文涛
Original assignee: Xian Novastar Electronic Technology Co Ltd
Current assignee: Xian Novastar Electronic Technology Co Ltd
Priority date: 2023-04-28
Filing date: 2023-04-28
Publication date: 2023-11-14
Anticipated expiration: 2033-04-28

Abstract

The utility model provides a lamp bead removing assembly and lamp panel repairing equipment, wherein the lamp bead removing assembly comprises: the laser (101) is used for heating and thermally welding the bad lamp beads on the circuit board; and the suction nozzle (102) is used for sucking away the defective lamp beads and melted solder so as to expose the bonding pads corresponding to the defective lamp beads. The utility model can improve the eliminating effect of the lamp beads and lay a good foundation for the subsequent steps of tin spot, surface mount, die bonding and the like.

Description

Lamp bead removing assembly and lamp panel repairing equipment

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a lamp bead removing assembly and lamp panel repairing equipment.

Background

Due to the multiple factors of poor packaging technology, defects of raw materials of the lamp beads, abnormal integrated circuits (integrated circuit, ICs) on the circuit board and the like, the lamp panel is electrified and lightened to cause abnormal lamp bead display problems such as dead lamp, dark lamp, bright lamp, string bright, color cast and the like, and therefore, the lamp panel with the poor lamp beads needs to be repaired. The repair of the lamp panel generally comprises a plurality of steps of removing, tin plating, pasting, die bonding and the like, and each step can be completed by different components of the lamp panel repair equipment. The defective lamp beads can be removed from the circuit board through the lamp bead removing assembly, so that new lamp beads can be conveniently and subsequently installed.

The lamp bead removing assembly mainly removes bad lamp beads from a circuit board in a manner of violent excavation of a physical razor, violent trituration of a conical part and the like, is easy to damage the circuit board, can leave solder or lamp bead fragments on the circuit board, has poor removing effect, can cause bad influence on subsequent steps of welding, pasting, die bonding and the like, and finally causes non-ideal mounting effect of newly-supplemented good lamp beads.

Disclosure of Invention

The embodiment of the utility model provides a lamp bead removing assembly and lamp panel repairing equipment, which can improve the removing effect of lamp beads and lay a good foundation for the subsequent steps of tin spot, surface mount, die bonding and the like.

In a first aspect, there is provided a lamp bead reject assembly comprising: the laser is used for heating and thermally welding the bad lamp beads on the circuit board; and the suction nozzle is used for sucking away the defective lamp beads and melted solder so that the bonding pads corresponding to the defective lamp beads are exposed.

The lamp bead removing assembly provided by the embodiment of the utility model comprises the laser and the suction nozzle, wherein the laser can emit laser to heat and thermally weld the bad lamp beads on the circuit board, the suction nozzle can suck the unwelded bad lamp beads and melted solder, and the lamp bead removing purpose is realized through the mutual matching of the laser and the suction nozzle. Compared with the traditional physical violent means, the lamp bead removing assembly provided by the embodiment of the utility model can not contact the circuit board and the bonding pad in the whole removing process, can not damage the circuit board and the bonding pad, can not leave lamp bead fragments or solder on the circuit board, has good lamp bead removing effect, and can lay a good foundation for the subsequent steps of tin plating, surface mounting, die bonding and the like.

In one possible design, the bead reject assembly further comprises: and the air blowing nozzle is used for blowing air to the bad lamp beads so as to accelerate the speed of the bad lamp beads to be separated from the bonding pads.

The blowing nozzle is connected with positive pressure pneumatic devices such as an air pump or a fan, and can blow air to the bad lamp beads, so that the bad lamp beads and melted solder can be quickly separated from the circuit board, and the sucking nozzle can conveniently suck the solder. Poor lamp beads and the separation speed of solder from the circuit board can be accelerated through setting up the air blowing mouth, can improve the efficiency that the lamp beads were rejected.

In one possible design, the suction nozzle and the blowing nozzle are configured to: when the poor lamp beads are heated and thermally welded, the openings of the air suction nozzle and the air blowing nozzle face to the focal position of the laser.

In the process of removing the lamp beads, the focal position of the laser can act on the bonding pad of the bad lamp beads, so that the heating effect can be ensured, the opening of the air suction nozzle and the opening of the air blowing nozzle face the focal position of the laser, positive-pressure blowing negative-pressure sucking operation can be timely performed on the bad lamp beads after the disassembly and melted solder, and the lamp bead removing efficiency is improved.

In one possible design, the bead reject assembly further comprises: and the temperature measuring sensor is used for measuring the temperature at the focal position of the laser when the poor lamp beads are heated and thermally welded.

When the poor lamp beads are heated and thermally welded, the temperature measuring sensor is used for measuring the temperature at the focal position of the laser. The temperature sensor is arranged to monitor the heating temperature in real time, the heating temperature is reliably controlled within a reasonable temperature range, and adverse effects on rejection effect (desoldering) caused by too low temperature or too high temperature are effectively avoided.

In one possible design, the bead reject assembly further comprises: the laser and the temperature measuring sensor are fixedly arranged on the triaxial manual micro-motion platform.

Through setting up manual fine motion platform of triaxial, can finely tune the position of laser instrument and temperature sensor for the focus of laser instrument sent can be accurate to act on the pad of bad lamp pearl, and temperature sensor can be accurate gather the temperature of laser focus position (i.e. pad) position department.

In one possible design, the bead reject assembly further comprises: the Z-axis lifting module is characterized in that the air suction nozzle and the air blowing nozzle are fixedly arranged on the Z-axis lifting module, and openings of the air suction nozzle and the air blowing nozzle are inclined downwards and are opposite to each other.

Through the setting, the Z-axis lifting module can drive the suction nozzle to lift with the blowing nozzle, and in the process of removing the lamp beads, the Z-axis lifting module drives the two gas nozzles to be close to the circuit board at the same time, so that the blowing and sucking operation is conveniently performed on the bad lamp beads on the circuit board at the same time. Because the openings of the air suction nozzle and the air blowing nozzle are inclined downwards and are arranged in opposite directions, the air flow blown out by the air blowing nozzle can be accurately captured by the air suction nozzle after being reflected by the circuit board, namely, bad lamp beads blown out by the air blowing nozzle can be quickly, conveniently and accurately sucked away by the air suction nozzle, and the efficiency of lamp bead rejection is improved.

In one possible design, the laser is used to emit a flat-top waveform laser to heat and thermally weld the defective lamp beads.

The laser adopts a flat-top waveform, the waveform has higher homogenization degree, for example, the flat-top area 365x115um, the homogenization degree can reach more than 90 percent, and the heated soaking of the bonding pad and the lamp beads can be ensured in the light spot range of the laser, so that good conditions are provided for the desoldering, and the lamp bead removing effect is improved.

In one possible design, the laser is further configured to: and the solder paste is used for heating and crystallizing the good lamp beads adhered to the bonding pads through the solder paste so as to mount the good lamp beads on the circuit board.

That is, the laser can also be multiplexed to heat the crystal to the good lamp pearl, thereby be favorable to reducing the implementation cost of lamp plate repair equipment. The lamp bead removing assembly is substantially equivalent to a 'removing die bonding assembly' of lamp panel repairing equipment.

In one possible design, the bead reject assembly further comprises: and the CCD camera is fixedly arranged on the triaxial manual micro-motion platform and is used for photographing the circuit board.

In a second aspect, a lamp panel repair apparatus is provided, including a lamp bead removal assembly provided by any one of the foregoing first aspects.

Because the lamp panel repair equipment adopts the lamp bead removing assembly provided by the embodiment, the lamp panel repair equipment also has the technical effect corresponding to the lamp bead removing assembly, and the description is omitted here.

Drawings

Fig. 1 is a schematic diagram of a working process of a lamp bead removing assembly according to an embodiment of the present utility model.

Fig. 2 is a schematic structural diagram of a lamp bead removing assembly according to an embodiment of the present utility model.

FIG. 3 is a schematic view of the mounting structure of the suction nozzle and the blowing nozzle.

FIG. 4 is a schematic illustration of the relative positioning of a suction nozzle and a blowing nozzle.

Fig. 5 is a schematic view of a mounting structure of the laser.

Fig. 6 is a schematic structural diagram of a lamp panel repairing apparatus according to an embodiment of the present utility model.

Reference numerals:

100. the lamp bead removing assembly; 101. a laser; 102. an air suction nozzle; 103. an air blowing nozzle; 104. a temperature sensor; 105. a CCD camera; 106. a light source; 107. an X-axis translation module; 108. a Z-axis lifting module; 109. a triaxial manual micro-motion platform; 110. an air tap connecting arm; 111. a mounting base;

200. a lamp panel;

300. repairing the platform assembly;

400. a portal frame;

500. and (5) installing a platform.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present utility model and are not to be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "side," "front," "rear," and the like indicate an orientation or a positional relationship based on installation, and are merely for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

It should be further noted that, in the embodiments of the present utility model, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present utility model, reference numerals may be given to only one of the parts or the parts in the drawings, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.

The current lamp pearl rejection subassembly mainly makes bad lamp pearl break away from the pad of circuit board through means such as physical razor violent rejection, toper piece violent trituration, not only easily damages the pad, still leaves solder or lamp pearl fragment easily on the circuit board, leads to the lamp pearl to reject the effect relatively poor, can lead to the fact harmful effects to follow-up steps such as tin, paster and die bonding from this, leads to final lamp plate repair effect to be difficult to satisfy.

Aiming at the problems, the embodiment of the utility model provides a lamp bead removing assembly, which comprises a laser and a suction nozzle, and achieves the aim of removing the lamp beads through the mutual matching of the laser and the suction nozzle.

The embodiment of the utility model firstly provides a lamp bead removing assembly 100, and fig. 1 is a schematic diagram of a working process of the lamp bead removing assembly 100 provided by the embodiment of the utility model. Fig. 2 is a schematic structural diagram of a lamp bead removing assembly 100 according to an embodiment of the present utility model.

As shown in fig. 1, the bead removal assembly 100 provided in the embodiment of the present utility model can remove defective beads on a lamp panel 200. The lamp panel 200 includes a circuit board, such as a printed circuit board (printed circuit board, PCB), but is not limited thereto, and lamp beads disposed on the circuit board; the light beads may be, for example, any type of LED light beads such as a sub-millimeter light-emitting diode (MiniLED), but are not limited thereto. The lamp panel 200 has at least one defective lamp bead, which needs to be removed from the circuit board, so as to facilitate the subsequent replenishment of new good lamp beads at corresponding positions.

As shown in fig. 2, the bead-reject assembly 100 includes a laser 101 and a suction nozzle 102. The laser 101 is used for heating and thermally welding bad lamp beads on the circuit board of the lamp panel 200, and the suction nozzle 102 is used for sucking away the bad lamp beads and melted solder so that bonding pads corresponding to the bad lamp beads are exposed, thereby facilitating subsequent lamp bead replacement steps such as tin spot, patch, die bonding and the like.

The laser 101 can generate laser light and emit the generated laser light to the circuit board so as to heat and thermally weld the bad lamp beads on the circuit board. The spot size of the laser can be set through the early simulation result, so that good lamp beads at the side positions are prevented from being accidentally injured in the heating process. In the process of eliminating the lamp beads, the distance between the laser 101 and the lamp panel 200 can be controlled, so that the focal position of the laser emitted by the laser 101 is located on the bonding pad corresponding to the poor lamp bead, and a good heating effect can be achieved. The solder on the bonding pad is heated to melt, so that the bad lamp beads can be unwelded with the bonding pad.

The suction nozzle 102 is connected with a negative pressure device such as a vacuum generator, and in the process of removing the lamp beads, the suction port of the suction nozzle 102 is close to and faces towards the bad lamp beads, and the bad lamp beads which are subjected to desoldering and melted solder can be sucked away, so that bonding pads corresponding to the bad lamp beads are exposed, and the purpose of removing the lamp beads is achieved.

The lamp bead removing assembly 100 provided by the embodiment of the utility model comprises a laser 101 and an air suction nozzle 102, wherein the laser 101 can emit laser to heat and thermally weld bad lamp beads on a circuit board, the air suction nozzle 102 can suck the unwelded bad lamp beads and melted solder, and the lamp bead removing purpose is realized through the mutual matching of the laser 101 and the air suction nozzle 102. Compared with the traditional physical violent means, the lamp bead removing assembly 100 provided by the embodiment of the utility model can not contact the circuit board and the bonding pad in the whole removing process, can not damage the circuit board and the bonding pad, can not leave lamp bead fragments or solder on the circuit board, has good lamp bead removing effect, and can lay a good foundation for the subsequent steps of tin plating, surface mounting, die bonding and the like.

Alternatively, the waveform of the laser light emitted by the laser 101 may be a flat-top waveform, i.e., the laser 101 is configured to emit laser light of a flat-top waveform to heat and thermally weld the defective lamp beads.

Further, the lamp bead removing assembly 100 provided by the embodiment of the utility model further includes a temperature sensor 104, where the temperature sensor 104 is used to measure the temperature at the focal position of the laser 101 when the poor lamp beads are heated and thermally welded. The temperature sensor 104 is arranged to monitor the heating temperature in real time, so that the heating temperature is reliably controlled within a reasonable temperature range, and adverse effects on rejection effects (desoldering) caused by too low temperature or too high temperature are effectively avoided.

Optionally, the temperature sensor 104 may be a coaxial temperature sensing probe, and coaxial temperature measurement can monitor whether the welding-off temperature is kept within a required temperature range in real time, and has a temperature measurement reaction time as high as 200us, so that abnormal influence of too low temperature or too high temperature on the welding-off effect can be effectively avoided.

As shown in fig. 2, the bead-removing assembly 100 according to the embodiment of the present utility model further includes a blowing nozzle 103, where the blowing nozzle 103 is used to blow air to the defective beads, so as to increase the speed of separating the defective beads from the bonding pads. The air blowing nozzle 103 is connected with positive pressure pneumatic devices such as an air pump or a fan, and can blow air to the bad lamp beads, so that the bad lamp beads and melted solder can be quickly separated from the circuit board, and the air blowing nozzle 102 can conveniently suck the solder. Poor lamp beads and the separation speed of solder from the circuit board can be accelerated through setting up the air blowing mouth 103, can improve the efficiency that the lamp beads were rejected.

Fig. 3 is a schematic view of the mounting structure of the suction nozzle 102 and the blowing nozzle 103. As shown in fig. 3, the lamp bead removing assembly 100 further includes a Z-axis lifting module 108, and the air suction nozzle 102 and the air blowing nozzle 103 are fixedly disposed on the Z-axis lifting module 108 through an air nozzle connecting arm 110, and openings of the air suction nozzle 102 and the air blowing nozzle 103 are inclined downward and are disposed opposite to each other.

Through the arrangement, the Z-axis lifting module 108 can drive the suction nozzle 102 and the blowing nozzle 103 to lift, and in the process of removing the lamp beads, the Z-axis lifting module 108 drives the two gas nozzles to be close to the circuit board at the same time, so that the blowing and sucking operation can be conveniently performed on the bad lamp beads on the circuit board at the same time. Because the openings of the air suction nozzle 102 and the air blowing nozzle 103 are inclined downwards and are arranged in opposite directions, the air flow blown out by the air blowing nozzle 103 can be accurately captured by the air suction nozzle 102 after being reflected by the circuit board, namely, bad lamp beads blown out by the air blowing nozzle 103 can be quickly, conveniently and accurately sucked away by the air suction nozzle 102, and the lamp bead removing efficiency is improved.

Fig. 4 is a schematic diagram showing the relative positional relationship between the mouthpiece 102 and the mouthpiece 103. As shown in fig. 4, in the embodiment of the present utility model, the suction nozzle 102 and the blowing nozzle 103 are configured to: when the defective lamp beads are thermally welded, the opening of the air suction nozzle 102 and the opening of the air blowing nozzle 103 face to the focal position F of the laser 101.

In the process of removing the lamp beads, the focal point position F of the laser 101 can act on the bonding pad of the defective lamp beads, so that the heating effect can be ensured, and the opening of the air suction nozzle 102 and the opening of the air blowing nozzle 103 face the focal point position of the laser 101, so that positive-pressure air blowing and negative-pressure sucking operation can be timely performed on the defective lamp beads after the disassembly and melted solder, and the lamp bead removing efficiency can be improved.

Alternatively, as shown in fig. 4, the suction nozzle 102 and the blowing nozzle 103 are configured to: when the defective beads are thermally welded, the center line of the suction nozzle 102 (broken line in the figure) and the center line of the blowing nozzle 103 intersect at the focal position F of the laser 101. Therefore, the blowing and sucking effect of the suction nozzle 102 and the blowing nozzle 103 on bad lamp beads is ensured, and the efficiency of eliminating the lamp beads is improved.

Alternatively, the structures of the air suction nozzle 102 and the air blowing nozzle 103 may be the same, and the two are axisymmetrically arranged with the laser light emitted by the laser 101 as an axis.

As shown in fig. 2 and 3, the suction nozzle 102 and the blowing nozzle 103 are both fixedly disposed on the Z-axis lifting module 108 through the nozzle connecting arm 110, the Z-axis lifting module 108 is connected to the mounting base 111 through the X-axis translation module 107, and the mounting base 111 is fixedly disposed on the gantry 400. Through the mutual coordination of X-axis translation module 107 and Z-axis lifting module 108 for suction nozzle 102 and blowing nozzle 103 can carry out the operation of blowing to the bad lamp pearl of different positions department on the circuit board, can reduce the removal number of times of circuit board, and X-axis translation module 107 and Z-axis lifting module 108 can all be high accuracy KK module, in order to improve the moving accuracy.

Fig. 5 is a schematic diagram of the mounting structure of the laser 101. As shown in fig. 2 and 5, the lamp bead removing assembly 100 further includes a three-axis (i.e., XYZ axis) manual micro-motion platform 109, the laser 101 and the temperature sensor 104 are both fixedly disposed on the three-axis manual micro-motion platform 109, and the three-axis manual micro-motion platform 109 is fixedly connected to the gantry 400. By arranging the triaxial manual micro-motion platform 109, the positions of the laser 101 and the temperature measuring sensor 104 can be finely adjusted, so that the focus of laser emitted by the laser 101 can accurately act on a bonding pad of a poor lamp bead, and the temperature measuring sensor 104 can accurately collect the temperature of the position of the focus (namely the bonding pad) of the laser.

As shown in fig. 2 and 5, the light bulb removing assembly 100 further includes a Charge-coupled Device (CCD) camera 105, and the CCD camera 105 is fixedly disposed on the three-axis manual micro-stage 109 for photographing the circuit board. By providing the CCD camera 105, a circuit board (e.g., the light panel 200 in fig. 1) can be photographed and positioned, and the position of the CCD camera 105 can be adjusted by the triaxial manual micro-motion stage 109 connected thereto.

Optionally, a light source 106 is further fixedly disposed on the triaxial manual micro-motion platform 109, the light source 106 is disposed corresponding to the CCD camera 105, and the light source 106 is configured to provide a light source for a photographing area of the CCD camera 105, so as to ensure that the CCD camera 105 can obtain a clear image. The light source 106 may have a circular ring structure, and the CCD camera 105 is disposed in the circular ring structure.

Further, the laser 101 provided by the embodiment of the present utility model is further configured to: and the circuit board is used for heating and crystallizing the good lamp beads adhered to the bonding pads through the solder paste so as to install the good lamp beads on the circuit board. That is, the laser 101 can be reused for heating and crystallizing the good lamp beads without providing an additional heating device, thereby being beneficial to reducing the implementation cost of the lamp panel repair device. The lamp bead removing assembly 100 is substantially the "die bonding assembly" of the lamp panel repair apparatus.

It should be noted that, at this time, for convenience in heating the crystal, the two air nozzles can be moved away from the circuit board by the driving mechanism such as the Z-axis lifting module 108.

Referring to fig. 1, a lamp bead removing assembly 100 according to an embodiment of the present utility model may perform removing and die bonding operations according to the following steps:

the lamp panel 200 to be repaired can be clamped through the repairing platform assembly 300, the lamp panel 200 is moved to a designated position, the CCD camera 105 performs Mark point positioning, the position to be repaired is accurately identified and fed back to the transportation controller, and the lamp panel 200 is accurately moved to a suction nozzle preset position (namely a reject position) through driving the repairing platform assembly 300, namely the coordinate position with the bad lamp beads.

It should be noted that, in the early stage of the process, the openings of the suction nozzle 102 and the opening of the blowing nozzle 103 are required to be adjusted to face the focal position of the laser 101, because the blowing and sucking of the air nozzles at two sides in the laser heating process are performed synchronously, so that the bad lamp beads after the heating and the welding can be removed better. The adjustment of the position of the laser 101 may be adjusted by a three-axis manual jog stage 109 connected thereto. After the lamp panel 200 is moved to a predetermined position by driving the rework platform assembly 300, the laser 101 starts heating the defective lamp beads.

In the process of heating and thermal welding of the bad lamp beads, the temperature measuring sensor 104 measures the temperature of the focal position of the laser 101, and the heating temperature can be reliably controlled within a reasonable temperature range through real-time monitoring of the heating temperature, so that adverse effects caused by too low temperature or too high temperature on the rejection effect (the thermal welding) are effectively avoided.

When the bead is unwelded to a certain temperature, the operation of the suction nozzle 102 and the blowing nozzle 103 is started. The positive-pressure blowing negative-pressure sucking mode is adopted, the whole process is not in direct contact with the circuit board and the bonding pad, and the circuit board or the bonding pad is not damaged in the removing stage. After the defective lamp beads and the residual soldering tin are sucked away, the lamp panel 200 is moved to a photographing position by driving the repairing platform assembly 300, photographing is carried out by the CCD camera 105 to confirm the removing effect, the removing of the position is completed, and the above process is repeated until all the defective lamp beads on the lamp panel 200 are removed. The rejection operation is completed up to this point.

The die bonding operation also needs to be performed with high precision positioning and then laser heating and die bonding. The specific operation flow is as follows:

the repairing position X axis and the repairing position Y axis of the repairing platform assembly 300 are driven to move to convey the pasted lamp panel 200 to the appointed approximate position, the CCD camera 105 is used for positioning Mark points, the position needing repairing is accurately identified and fed back to the operation control, the position needing crystal fixing on the lamp panel 200 is accurately moved to the position under the laser by driving the repairing position XY axis to move, and the laser 101 starts to heat. The laser 101 is equipped with a temperature sensor 104 for coaxially measuring the temperature, and when the laser heating temperature exceeds a preset range, the laser 101 should stop working immediately, so as to prevent the circuit board from being burnt due to the too high laser temperature. And (5) completing laser heating and completing die bonding. According to the preset coordinates, the repair position XY axis moves in a coordinated manner to reach the next position where die bonding is needed, laser starts to work and heat, the process is repeated until die bonding of all the lamp beads of the patches is completed, and the CCD camera 105 photographs to confirm the die bonding effect and complete die bonding operation.

On the other hand, the embodiment of the utility model also provides a lamp panel repairing device, and fig. 6 is a schematic structural diagram of the lamp panel repairing device provided by the embodiment of the utility model. As shown in fig. 6, the lamp panel repair apparatus provided in the embodiment of the present utility model includes the lamp bead removing assembly 100 provided in the foregoing embodiment.

The lamp panel repairing device provided by the embodiment of the utility model comprises a mounting platform 500 and a portal frame 400, wherein the lamp bead removing assembly 100 is mounted on the mounting platform 500 through the portal frame 400. In addition, the lamp panel repairing apparatus further includes the foregoing repairing platform assembly 300, and the structures such as the tin-plating assembly and the patch assembly, which are not limited in the present utility model.

Because the lamp panel repairing device adopts the lamp bead removing assembly 100 provided in the above embodiment, the lamp panel repairing device also has the technical effects corresponding to the lamp bead removing assembly 100, and will not be described herein.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A light bead reject assembly, comprising:

the laser (101) is used for heating and thermally welding the bad lamp beads on the circuit board;

and the suction nozzle (102) is used for sucking away the defective lamp beads and melted solder so as to expose the bonding pads corresponding to the defective lamp beads.

2. The bead reject assembly of claim 1, further comprising:

and the air blowing nozzle (103) is used for blowing air to the bad lamp beads so as to accelerate the speed of the bad lamp beads to be separated from the bonding pads.

3. The bead-elimination assembly according to claim 2, wherein the suction nozzle (102) and the blowing nozzle (103) are configured to: when the poor lamp beads are heated and thermally welded, the opening of the air suction nozzle (102) and the opening of the air blowing nozzle (103) face to the focus position of the laser (101).

4. The bead reject assembly of claim 2, further comprising:

and a temperature measurement sensor (104) for measuring the temperature at the focal position of the laser (101) when the defective lamp beads are thermally welded.

5. The bead reject assembly of claim 4, further comprising:

the three-axis manual micro-motion platform (109), and the laser (101) and the temperature measuring sensor (104) are fixedly arranged on the three-axis manual micro-motion platform (109).

6. The bead reject assembly of any one of claims 2-5, further comprising:

the air suction nozzle (102) and the air blowing nozzle (103) are fixedly arranged on the Z-axis lifting module (108), and openings of the air suction nozzle and the air blowing nozzle are obliquely downward and oppositely arranged.

7. The bead elimination assembly of any of claims 1-5, wherein the laser (101) is configured to emit a flat-top waveform laser to heat-thermally weld the defective beads.

8. The bead culling assembly of any one of claims 1-5, wherein the laser (101) is further configured to:

and the solder paste is used for heating and crystallizing the good lamp beads adhered to the bonding pads through the solder paste so as to mount the good lamp beads on the circuit board.

9. The bead reject assembly of claim 5, further comprising:

and the CCD camera (105) is fixedly arranged on the triaxial manual micro-motion platform (109) and is used for photographing the circuit board.

10. A lamp panel repair apparatus comprising the lamp bead removal assembly of any one of claims 1-9.