CN220140070U - Patch assembly and patch equipment - Google Patents

Abstract

The utility model provides a patch assembly and patch equipment, wherein the patch assembly comprises: a patch suction nozzle (101) for performing bead patch on a bonding pad on a circuit board; the detector comprises a pressure sensor and/or a flowmeter, wherein the pressure sensor is used for acquiring patch pressure information born by the bonding pad, and the flowmeter is used for acquiring air flow information in the patch suction nozzle (101); and the controller is electrically connected with the detector and is used for determining whether the patch quality of the bonding pad is qualified or not according to detection information from the detector. According to the patch assembly provided by the utility model, when the quality of a patch of a certain bonding pad is unqualified, the patch assembly can be timely detected, so that the patch operation can be timely interfered or adjusted, and the efficiency of the bead patch can be improved.

Description

Patch assembly and patch equipment

Technical Field

The utility model relates to the technical field of semiconductor equipment, in particular to a patch assembly and patch equipment.

Background

Due to the multiple factors of poor packaging technology, defects of raw materials of the lamp beads, abnormal integrated circuits (integrated circuit, ICs) on the circuit board and the like, the lamp panel is electrified and lightened to cause abnormal lamp bead display problems such as dead lamp, dark lamp, bright lamp, string bright, color cast and the like, and therefore, the lamp panel with the poor lamp beads needs to be repaired. The repair of the lamp panel generally comprises a plurality of steps of removing, tin plating, pasting, die bonding and the like, and each step can be completed by different components of the lamp panel repair equipment.

The lamp bead patch is a difficulty existing at present, in the process of the lamp bead patch, good lamp beads need to be transplanted onto a bonding pad of a circuit board from a wafer by a patch assembly, the process needs to be subjected to the processes of lamp bead suction, circuit board positioning, lamp bead patch and the like, and how to enable the lamp beads to be attached to the bonding pad smoothly and accurately to become an industry pain point. In the prior art, since the lamp beads are automatically attached to the bonding pads by the bonding pad assembly according to a preset automatic program, when the bonding pads undergoing bonding operation are unqualified in bonding quality (for example, the lamp beads are not tightly contacted with solder paste or are adhered to the suction nozzle but not attached to the bonding pads), the lamp beads cannot be found in time, so that the bonding operation on other bonding pads at the back can be affected, reworking and repairing or re-bonding can be needed to be carried out on the bonding pads at the back, and the bonding efficiency of the lamp bead bonding is reduced.

Disclosure of Invention

The embodiment of the utility model provides a patch assembly and patch equipment, which can be timely detected when the quality of a patch of a certain bonding pad is unqualified, so that the patch work can be timely interfered or adjusted, and the efficiency of bead patch is improved.

In a first aspect, a patch assembly is provided, wherein a patch suction nozzle is configured to perform bead patch on a bonding pad on a circuit board; the detector comprises a pressure sensor and/or a flowmeter, wherein the pressure sensor is used for acquiring patch pressure information born by the bonding pad, and the flowmeter is used for acquiring air flow information in the patch suction nozzle; and the controller is electrically connected with the detector and is used for determining whether the patch quality of the bonding pad is qualified or not according to detection information from the detector.

In one possible implementation, the detection information includes the patch pressure information, and the controller determines that the patch quality of the pad is acceptable when the patch stroke of the patch nozzle reaches and the patch pressure borne by the pad is greater than or equal to a preset pressure threshold.

In one possible implementation, the detection information includes the air flow information, and the controller determines that the patch quality of the pad is acceptable if the air flow in the patch nozzle increases significantly after the patch nozzle leaves the pad.

In one possible implementation, the detection information includes the patch pressure information and the air flow information, the patch pressure borne by the pad is greater than or equal to a preset pressure threshold when the patch stroke of the patch nozzle is reached, and the air flow in the patch nozzle increases significantly after the patch nozzle leaves the pad, and the controller determines that the patch quality of the pad is acceptable.

In one possible implementation, the patch assembly further includes: and the laser range finder is used for measuring the height information of the bonding pad.

In one possible implementation, the patch assembly further includes: and the suction nozzle rotating motor is used for rotating the patch suction nozzle so that the lamp beads on the patch suction nozzle can be mutually aligned with the bonding pads.

In one possible implementation, the patch assembly further includes: and the Y-axis movement module is used for driving the patch suction nozzle to the upper part of the bonding pad after the patch suction nozzle sucks the lamp beads.

In one possible implementation, the patch assembly further includes: and the Z-axis lifting module is used for driving the patch suction nozzle to lift.

In one possible implementation, the patch assembly further includes: a triaxial manual micro-motion platform; and the CCD camera is fixedly arranged on the triaxial manual micro-motion platform and is used for photographing a wafer containing the lamp beads to be absorbed.

In a second aspect, a patch device is provided, comprising a patch assembly provided by any one of the possible implementations of the first aspect.

Optionally, the surface mounting device may be a lamp panel repair device or a lamp panel production and processing device.

According to the patch assembly provided by the embodiment of the utility model, the lamp patch assembly comprises the detector and the controller, the detector can acquire detection information in the process that the patch suction nozzle performs lamp bead patch operation on the welding disc, and the controller can determine whether the patch quality of the welding disc is qualified or not according to the detection information. The detector may include a pressure sensor for acquiring patch pressure information carried by the pad and/or a flow meter for acquiring air flow information within the patch nozzle. The sensed information may accordingly include the patch pressure information and/or the air flow information from which the controller may determine whether the patch mass is acceptable. For example, the controller can determine whether the lamp beads are tightly attached to the bonding pads (solder paste) according to the patch pressure information, so that whether the patch quality is qualified can be determined. The controller can also determine whether the lamp beads are accurately sucked, whether the lamp beads fall off midway or not and whether the lamp beads are adhered to the suction nozzle but not adhered to the bonding pad according to the air flow information, so that whether the quality of the patch is qualified or not can be determined.

The patch assembly provided by the embodiment of the utility model can monitor the patch process, can be timely detected when the patch quality of a certain bonding pad is unqualified, and can timely output reminding information to an operator at the moment, so that manual intervention or adjustment can be timely performed on the patch work, and the efficiency of bead patch is improved.

Drawings

Fig. 1 is a schematic structural diagram of a patch assembly according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of a mounting structure of the patch nozzle.

Fig. 3 is a schematic diagram of the control principle of the patch assembly.

Fig. 4 is a schematic structural diagram of a patch device according to an embodiment of the present utility model.

Reference numerals:

100. a patch assembly; 101. a patch suction nozzle; 102. a laser range finder; 103. a suction nozzle rotating motor; 104. a Y-axis movement module; 105. a Z-axis lifting module; 106. a CCD camera; 107. a triaxial manual micro-motion platform; 109. a mounting base; 110. a connecting arm;

200. a portal frame;

300. a feeding assembly;

400. and (5) installing a platform.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present utility model and are not to be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, it should be understood that the terms "upper," "lower," "side," "front," "rear," and the like indicate an orientation or a positional relationship based on installation, and are merely for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

It should be further noted that, in the embodiments of the present utility model, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present utility model, reference numerals may be given to only one of the parts or the parts in the drawings, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.

In the prior art, due to lack of monitoring in the process of attaching the lamp beads to the bonding pads of the circuit board, even if the condition that the quality of the bonding pad is unqualified (for example, the lamp beads are not tightly attached or are not attached to the bonding pads because of being attached to the suction nozzle) occurs to a certain bonding pad, the bonding pad cannot be found in time, so that the bonding pad operation of other bonding pads at the back can be affected, reworking and pasting or re-pasting can be needed to be carried out on the bonding pad at the back, and the efficiency of the lamp bead bonding pad is reduced.

In view of the above problems, an embodiment of the present utility model provides a patch assembly, where the bead patch assembly includes a detector and a controller, the detector can obtain detection information during a bead patch operation of a solder pad by the patch assembly, and the controller can determine whether the quality of the solder pad patch is qualified according to the detection information. The patch assembly provided by the embodiment of the utility model can monitor the patch process, and can be timely detected when the patch quality of a certain bonding pad is unqualified, so that the patch operation can be timely interfered or adjusted, and the efficiency of the lamp bead patch is improved.

The embodiment of the present utility model firstly provides a patch assembly 100, and fig. 1 is a schematic structural diagram of the patch assembly 100 provided in the embodiment of the present utility model.

As shown in fig. 1, the patch assembly 100 provided in the embodiment of the present utility model may be applied to a lamp panel processing (production) device or a lamp panel repairing device. For example, the chip assembly 100 may be mounted on a mounting platform of a lamp panel processing apparatus or a lamp panel repair apparatus by the portal frame 200. The lamp panel mainly includes a circuit board and a lamp bead fixedly connected to the circuit board, and the patch assembly 100 is used for attaching the lamp bead to a bonding pad of the circuit board in the process of machining or repairing the lamp panel, more specifically, attaching the lamp bead to solder paste on the bonding pad, and then fixing the lamp bead on the circuit board by heating the solder paste (i.e. performing die bonding operation). The circuit board may be, for example, a printed circuit board (printed circuit board, PCB), but is not limited thereto; the light beads may be, for example, any type of LED light beads such as a sub-millimeter light-emitting diode (MiniLED), but are not limited thereto.

As shown in fig. 1, a patch assembly 100 according to an embodiment of the present utility model includes a patch nozzle 101 and a driving mechanism. The driving mechanism is in transmission connection with the patch suction nozzle 101 and is used for driving the patch suction nozzle 101 to move between the lamp bead suction position and the patch position so as to complete the whole patch process of the lamp beads.

Specifically, the patch nozzle 101 has an opening and can generate negative pressure inside, for example, the patch nozzle 101 may be connected to a vacuum generator. When the chip suction nozzle 101 is moved to or near the bead suction position, the vacuum generator starts to operate, and the inside of the chip suction nozzle 101 can generate negative pressure, so that the bead can be sucked through the opening. In this case, the opening may not be completely closed by the bead, and a gap may exist between the edge of the opening and the bead, that is, external air may flow through the gap and after the patch nozzle 101 to the vacuum generator, so that the inside of the patch nozzle 101 may keep a small weak air flow. Alternatively, the bead may completely close the opening of the patch nozzle 101, and the interior of the patch nozzle 101 is maintained in a negative pressure state without flowing air current.

Under the action of the driving mechanism, the chip suction nozzle 101 which sucks the lamp beads is moved from the lamp bead sucking position to the chip position, and the chip position is the position where the bonding pad which needs to be subjected to chip mounting operation is located, and at the moment, the vacuum generator is controlled to enable negative pressure in the chip suction nozzle 101 to disappear or reduce, so that the lamp beads can be separated from the chip suction nozzle 101, the lamp beads are attached to solder paste of the bonding pad, and the whole chip mounting process of the bonding pad is completed.

Alternatively, in other cases, the negative pressure inside the suction nozzle 101 may be kept constant during the process of pasting, and the negative pressure may be kept at a small value all the time, so that the lamp beads can be sucked and kept above the nozzle openings when the lamp beads are not contacted with the solder paste, and after the lamp beads are attached to the solder paste, and during the process of moving up the suction nozzle 101, the lamp beads can be detached from the suction nozzle 101 to be attached to the bonding pads under the adhesion effect of the solder paste due to a certain viscosity of the solder paste.

Alternatively, the driving mechanism is in driving connection with the patch nozzle 101, where the driving mechanism may include any power source such as a motor, a cylinder, and any driving mechanism such as a rail, a chute, a gear, a cam, a belt, or a mechanical arm, which is not limited in the present utility model. For example, the drive mechanism may comprise a high precision KK module.

Alternatively, the patch suction nozzle 101 may include a plurality of patch suction nozzles arranged in parallel, and at this time, the driving mechanism drives the plurality of patch suction nozzles 101 to move simultaneously, and the plurality of patch suction nozzles 101 can absorb a plurality of lamp beads simultaneously at a time, so as to implement a patch operation on a plurality of pads simultaneously.

As shown in fig. 1, the driving mechanism may include a Y-axis moving module 104, the Y-axis moving module 104 is mounted on the gantry 200, the chip suction nozzle 101 is connected to the Y-axis moving module 104, and the Y-axis moving module 104 is used for driving the chip suction nozzle 101 to above the bonding pad along the Y-direction in fig. 4 after the chip suction nozzle 101 sucks the lamp beads.

For example, the Y-axis motion module 104 may be, for example, a high-precision KK module, where the repeated positioning precision of the KK module is ±2 μm, and the encoder precision reaches 0.00274 ° in cooperation with a 17-bit absolute servo motor, so that the higher patch precision requirement may be achieved. The repeated positioning precision of the linear motor of the module is +/-2 mu m, and the high patch precision requirement can be achieved by matching with a +/-1 mu m grating ruler.

Fig. 2 is a schematic diagram of the mounting structure of the patch nozzle 101. As shown in fig. 1 and 2, the driving mechanism further includes a Z-axis lifting module 105, the patch nozzle 101 is connected to the Z-axis lifting module 105 through an L-shaped connecting arm 110, and the Z-axis lifting module 105 is connected to the Y-axis moving module 104. The Z-axis lifting module 105 is used for driving the patch suction nozzle 101 to lift along the Z-direction in fig. 4 so as to approach the bonding pad and attach the lamp bead to the bonding pad, and after the lamp bead is attached to the bonding pad, the patch suction nozzle 101 is driven to be away from the bonding pad, and in the process, the negative pressure in the patch suction nozzle 101 is reduced or eliminated so as to facilitate the separation of the lamp bead from the patch suction nozzle 101.

As shown in fig. 1 and 2, the patch assembly 100 further includes a laser rangefinder 102, and the laser rangefinder 102 is used to measure height information of the bonding pads. In some cases, the height may be characterized by the distance between the laser rangefinder 102 and the pad, the shorter the distance between the two, the higher the pad. The height information can be used to determine the travel of the Z-axis lift module 105, i.e., determine how far the Z-axis lift module 105 needs to descend to accurately attach the lamp beads to the bonding pads according to the height information.

For example, the height value can be detected by the laser range finder 102 before the patch, the height deviation value is calculated by the operation control algorithm, and is compensated to the Z-axis lifting module 105 by the operation control algorithm, so that the up-and-down stroke of the patch can be more stable and reliable. For example, the Z-axis lift module 105 may be a Z-axis robot or a high precision KK module.

As shown in fig. 1 and 2, the patch assembly 100 further includes a nozzle rotation motor 103, and the nozzle rotation motor 103 may be disposed on the connection arm 110 and drivingly connected to the patch nozzle 101, and the nozzle rotation motor 103 is configured to rotate the patch nozzle 101 so that the beads on the patch nozzle 101 can be aligned with the pads. After the lamp pearl is absorbed by paster suction nozzle 101, the laminating face of lamp pearl is on a parallel with the XOY plane in FIG. 4, considers that the lamp pearl can take place to rotate so that the lamp pearl can't align each other with the pad at the XOY plane, consequently can set up suction nozzle rotating electrical machines 103 and rotate the lamp pearl, guarantees that the lamp pearl can align each other with the pad.

As shown in fig. 1, the chip assembly 100 further includes a Charge-coupled Device (CCD) camera 106, and by setting the CCD camera 106, a wafer (wafer) containing the lamp beads to be sucked can be photographed and positioned, for example, on the feeding assembly 300 in fig. 4, so that the chip suction nozzle 101 can accurately suck the lamp beads to be sucked. The CCD camera 106 is fixedly arranged on a three-axis (namely XYZ-axis) manual micro-motion platform 107, and the position of the CCD camera 106 can be adjusted by the three-axis manual micro-motion platform 107.

Fig. 3 is a schematic diagram of the control principle of the patch assembly 100. As shown in fig. 3, the patch assembly 100 further includes a controller, and the aforementioned vacuum generator, laser range finder 102, suction nozzle rotating motor 103, Y-axis moving module 104, Z-axis lifting module 105, CCD camera 106, and the like are all connected to the controller.

The CCD camera 106 photographs a wafer with the lamp beads to be sucked on the feeding assembly 300, and sends the acquired image information to the controller, the controller controls the Y-axis moving module 104 and the Z-axis lifting module 105 to drive the patch suction nozzle 101 to move according to the image information so as to suck the lamp beads (during which the vacuum generator is controlled to work so as to generate negative pressure in the patch suction nozzle 101), and the patch suction nozzle 101 sucking the lamp beads is moved to the upper part of the bonding pad through the Y-axis moving module 104. The laser rangefinder 102 measures the height of the bonding pad to obtain height information, and the controller controls the Z-axis lifting module 105 to descend according to the height information so that the lamp beads on the chip suction nozzle 101 can be attached to the bonding pad. After the chip is mounted, the controller controls the Z-axis lifting module 105 to drive the chip suction nozzle 101 to lift (during which the vacuum generator is controlled to reduce or cancel negative pressure generated in the chip suction nozzle 101), and controls the Y-axis moving module 104 to drive the chip suction nozzle 101 to move towards the feeding component 300 so as to start the next chip mounting process.

As shown in fig. 3, the patch assembly 100 provided in the embodiment of the present utility model further includes a detector for acquiring detection information, where the detector is connected to the controller, and the controller determines whether the patch quality of the pad is acceptable according to the detection information. The detector comprises a pressure sensor for acquiring the pressure information of the patch borne by the pad and/or a flow meter for acquiring the air flow information in the patch nozzle 101. The sensed information may include patch pressure information and/or air flow information from which the controller may determine whether the patch mass of the pad is acceptable.

Specifically, the pressure sensor is used for acquiring the pressure information of the bonding pad in the bonding process, wherein the bonding pad pressure is the pressure of the lamp bead acting on the bonding pad during bonding, and is also the pressure from the bonding pad born by the lamp bead. Whether the lamp beads are tightly attached to the bonding pads (solder paste) can be determined according to the pressure of the patch, and whether the quality of the patch is qualified is further determined. For example, when the patch pressure is too low or the patch pressure is not detected (i.e., the pressure is 0), it is indicated that the lamp beads are not tightly attached to the bonding pads, and at this time, the depth of embedding the lamp beads into the solder paste may be insufficient, the lamp beads may float on the solder paste, or even the lamp beads are not attached to the bonding pads (e.g., the lamp beads fall off in the moving graph), so the controller may determine that the patch quality is not acceptable.

Alternatively, for ease of detection, a pressure sensor may be used to detect the pressure from the bonding pad that the lamp bead is subjected to, i.e. the bonding pressure that the bonding pad is subjected to during the bonding process, based on the principle of force and reaction force. At this time, the pressure sensor may be disposed between the connection arm 110 and the patch nozzle 101, and after the patch nozzle 101 receives the extrusion force of the bonding pad, the patch nozzle 101 continues to extrude the pressure sensor, that is, the pressure sensor indirectly detects the bonding pad pressure information received by the bonding pad in the bonding process through the patch nozzle 101. The pressure sensor may be, for example, a strain type pressure sensor, a piezoresistive type pressure sensor, a capacitive type pressure sensor, a piezoelectric type pressure sensor, or the like.

The flow meter is used for acquiring the air flow information in the patch suction nozzle 101, and it can be known from the foregoing that, after the patch suction nozzle 101 sucks the lamp bead, the lamp bead has a blocking effect on the opening of the patch suction nozzle 101, so that in order to maintain the negative pressure state in the suction nozzle, the patch suction nozzle 101 may have a relatively small air flow, or the opening may be completely blocked so that the air flow in the suction nozzle is 0. When the lamp beads are separated from the patch suction nozzle 101, the air flow in the patch suction nozzle 101 suddenly increases, namely, the air flow is obviously increased. Therefore, whether the lamp bead is separated from the suction nozzle can be determined by judging whether the air flow in the suction nozzle is suddenly increased, so that whether the lamp bead is adhered to the bonding pad or not in the process of moving up the patch suction nozzle 101 can be judged.

Specifically, during the process of moving up the patch suction nozzle 101, the lamp beads should be separated from the patch suction nozzle 101, at this time, the flow rate in the patch suction nozzle 101 may be significantly increased (suddenly increased), if the air flow rate in the patch suction nozzle 101 is not significantly increased, that is, it is determined that the lamp beads are adhered to the suction nozzle and not adhered to the bonding pads, and the controller may determine that the patch quality is unqualified.

Based on a similar principle, in the process of pasting, whether the pasting nozzle 101 absorbs the lamp beads or not and whether the lamp beads are abnormally separated from the pasting nozzle 101 or not in the process of moving the lamp beads or not can be determined by detecting whether the flow in the pasting nozzle 101 is obviously increased or obviously reduced or the like. Accordingly, the air flow information in the patch nozzle 101 may be acquired by the flow meter, and the controller may determine whether the patch mass is acceptable based on the air flow information. As a special case, the situation that the lamp beads fall off and are not attached to the bonding pads is also one of the situations that the quality of the patch is not qualified.

Alternatively, the flow meter herein may be any type of differential pressure flow meter, volumetric flow meter, turbine flow meter, electromagnetic flow meter, ultrasonic flow meter, vortex shedding flow meter, thermal mass flow meter, or coriolis flow meter.

According to the chip assembly 100 provided by the embodiment of the utility model, the chip assembly 100 includes a detector and a controller, the detector can obtain detection information in the process that the chip suction nozzle 101 performs the bead chip mounting operation on the bonding pad, and the controller can determine whether the bonding pad quality is qualified or not according to the detection information. The detector may include a pressure sensor for acquiring patch pressure information carried by the pad and/or a flow meter for acquiring air flow information within the patch nozzle 101. The sensed information may accordingly include the patch pressure information and/or the air flow information from which the controller may determine whether the patch mass is acceptable. For example, the controller can determine whether the lamp beads are tightly attached to the bonding pads (solder paste) according to the patch pressure information, so that whether the patch quality is qualified can be determined. The controller can also determine whether the lamp beads are accurately sucked, whether the lamp beads fall off midway or not and whether the lamp beads are adhered to the suction nozzle but not adhered to the bonding pad according to the air flow information, so that whether the quality of the patch is qualified or not can be determined.

The patch assembly 100 provided by the embodiment of the utility model can monitor the patch process, can be timely detected when the patch quality of a certain bonding pad is unqualified, and can timely output reminding information to an operator at the moment, so that manual intervention or adjustment can be timely performed on the patch work, and the efficiency of bead patch is improved.

In one possible implementation, the detection information includes patch pressure information, and when the patch stroke of the patch suction nozzle 101 reaches and the patch pressure borne by the pad is greater than or equal to a preset pressure threshold, it indicates that the lamp bead is tightly and reliably attached to the pad, and at this time, the controller determines that the patch quality of the pad is acceptable.

Alternatively, the preset threshold may be determined in advance according to an empirical value in the past normal patch process, and input into the controller.

Optionally, when the patch stroke of the patch suction nozzle 101 is reached and the patch pressure borne by the pad is smaller than the preset pressure threshold, it indicates that the lamp bead is not tightly attached to the pad, and at this time, the depth of embedding the lamp bead into the solder paste may be insufficient, the lamp bead may float on the solder paste, or even the lamp bead is not attached to the pad (for example, the lamp bead falls off in the moving chart), so that the controller may determine that the patch quality is not acceptable.

Alternatively, when the patch stroke of the patch suction nozzle 101 reaches and the patch pressure borne by the pad is smaller than the preset pressure threshold, the Z-axis lift module 105 is controlled to drive the patch suction nozzle 101 to continue to travel downward (i.e., to continue toward the pad) by a preset stroke, which may be, for example, 0.05 millimeters (mm), 0.1mm, 0.12mm, 0.15mm, or 0.2 mm. After the movement is completed, the patch pressure information is acquired again, and if the patch pressure is greater than or equal to (reaches) the preset pressure threshold value at this time, the controller can determine that the patch quality is qualified. Otherwise, the controller determines that the quality of the patch is unqualified, and the operation control program alarms at the moment, and the manual intervention judges whether the patch is abnormal or not.

Through the arrangement, the automation degree of the patch can be improved to a certain extent, the labor is saved, the number of times of manual intervention judgment is reduced, and the efficiency of the patch is improved.

In another possible implementation, the detection information includes air flow information, and when the air flow in the suction nozzle 101 increases significantly after the suction nozzle 101 leaves the bonding pad, it indicates that the lamp beads are attached to the bonding pad (solder paste) smoothly without adhesion, so that the controller determines that the quality of the bonding pad is qualified.

Optionally, the detection information includes air flow information, and when the air flow in the suction nozzle 101 is not increased significantly after the suction nozzle 101 leaves the bonding pad, it is indicated that the lamp beads are adhered to the suction nozzle and not adhered to the bonding pad (solder paste) smoothly, so that the controller determines that the quality of the bonding pad is not qualified.

Here, the person skilled in the art knows the specific meaning of a significant increase in air flow, which is a situation in which the air flow suddenly increases due to the bead being detached from the opening of the patch nozzle 101, which opening is fully opened (suddenly opened), for example, it may be the case that the air flow suddenly becomes 1.5 times, 2 times, 3 times, 4 times, 5 times or even more times the original air flow. The situation that the flow is slightly changed (for example, the flow is slightly changed between 10% and smaller) in the normal and stable operation process of the equipment due to control precision, operation error and the like is eliminated.

In yet another possible implementation, the detection information includes patch pressure information and air flow information, the patch pressure experienced by the pad when the patch stroke of the patch nozzle 101 is reached is greater than or equal to a preset pressure threshold, and the air flow within the patch nozzle 101 increases substantially after the patch nozzle 101 leaves the pad, at which point the controller determines that the patch quality of the pad is acceptable.

At this time, whether the patch quality is qualified or not is determined through the patch pressure information and the air flow information together, and the result is more accurate. When at least one of the patch pressure being less than the preset pressure threshold and the air flow in the patch nozzle 101 not being significantly increased after the patch nozzle 101 leaves the pad, the controller determines that the patch quality of the pad is not acceptable.

In yet another possible implementation, the detection information further includes vacuum information inside the vacuum generator, where the vacuum information may be combined with the foregoing patch pressure information and/or air flow information to determine whether the patch quality of the pad is acceptable. At this time, whether the patch quality is qualified or not is determined through more information, and the result is more accurate.

Here, since the vacuum generator is connected to the suction nozzle 101, the vacuum degree information is similar to the aforementioned air flow information, whether the lamp beads are accurately sucked, dropped halfway, and adhered to the suction nozzle without being adhered to the bonding pad can be determined according to whether the vacuum degree in the vacuum generator is significantly changed (e.g., suddenly increased or decreased) during the bonding process, and whether the quality of the bonding pad is acceptable can be determined.

For example, when the flowmeter readings (i.e., air flow information), the pressure sensor readings (i.e., patch pressure information), and the vacuum readings (i.e., vacuum information) all meet the preset conditions or preset values, the patch quality of the bonding pad is determined to be acceptable.

On the other hand, the embodiment of the utility model also provides a patch device, which can be, for example, a lamp panel repair device or a lamp panel production and processing device.

Fig. 4 is a schematic structural diagram of a patch device according to an embodiment of the present utility model. As shown in fig. 4, the patch device provided in the embodiment of the present utility model includes the patch assembly 100 provided in the foregoing embodiment.

As shown in fig. 4, the chip mounter includes a mounting platform 400, and the chip mounter 100 is mounted on the mounting platform 400 through the gantry 200. In addition, the chip mounter further includes the foregoing feeding assembly 300, the rejecting assembly, the solder dispensing assembly, the die bonding assembly, and the like.

Because the patch device adopts the patch assembly 100 provided in the foregoing embodiment, the patch device also has the technical effects corresponding to the patch assembly 100, which will not be described herein.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. A patch assembly, comprising:

a patch suction nozzle (101) for performing bead patch on a bonding pad on a circuit board;

the detector comprises a pressure sensor and/or a flowmeter, wherein the pressure sensor is used for acquiring patch pressure information born by the bonding pad, and the flowmeter is used for acquiring air flow information in the patch suction nozzle (101);

and the controller is electrically connected with the detector and is used for determining whether the patch quality of the bonding pad is qualified or not according to detection information from the detector.

2. The patch assembly of claim 1, wherein the detection information includes the patch pressure information, and the controller determines that the patch quality of the pad is acceptable when a patch stroke of the patch suction nozzle (101) is reached and a patch pressure experienced by the pad is greater than or equal to a preset pressure threshold.

3. The patch assembly of claim 1, wherein the detection information includes the air flow information, and the controller determines that the patch quality of the pad is acceptable if the air flow in the patch nozzle (101) increases significantly after the patch nozzle (101) is moved away from the pad.

4. The patch assembly according to claim 1, wherein the detection information includes the patch pressure information and the air flow information, the patch pressure experienced by the pad is greater than or equal to a preset pressure threshold when a patch stroke of the patch suction nozzle (101) is reached, and the air flow in the patch suction nozzle (101) increases significantly after the patch suction nozzle (101) leaves the pad, the controller determines that the patch quality of the pad is acceptable.

5. The patch assembly of any one of claims 1-4, further comprising:

and the laser range finder (102) is used for measuring the height information of the bonding pad.

6. The patch assembly of any one of claims 1-4, further comprising:

and a suction nozzle rotating motor (103) for rotating the patch suction nozzle (101) so that the lamp beads on the patch suction nozzle (101) can be aligned with the bonding pads.

7. The patch assembly of any one of claims 1-4, further comprising:

and the Y-axis movement module (104) is used for driving the patch suction nozzle (101) to the upper part of the bonding pad after the patch suction nozzle (101) sucks the lamp beads.

8. The patch assembly of any one of claims 1-4, further comprising:

and the Z-axis lifting module (105) is used for driving the patch suction nozzle (101) to lift.

9. The patch assembly of any one of claims 1-4, further comprising:

a triaxial manual jog platform (107);

and the CCD camera (106) is fixedly arranged on the triaxial manual micro-motion platform (107) and is used for photographing a wafer containing the lamp beads to be absorbed.

10. A patch device comprising a patch assembly as claimed in any one of claims 1 to 9.