CN109494173B - Chip mounting apparatus and method for manufacturing semiconductor device - Google Patents

Chip mounting apparatus and method for manufacturing semiconductor device Download PDF

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Publication number
CN109494173B
CN109494173B CN201811051542.6A CN201811051542A CN109494173B CN 109494173 B CN109494173 B CN 109494173B CN 201811051542 A CN201811051542 A CN 201811051542A CN 109494173 B CN109494173 B CN 109494173B
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vibration
vibration displacement
displacement
waveform
mounting head
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CN109494173A (en
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楯充明
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Abstract

The invention provides a chip mounting device having a mechanism for detecting abnormality of a mounting head. The chip mounting device is provided with: a bare chip supply section; a substrate supply unit; a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and a control unit for controlling the bare chip supply unit, the substrate supply unit, and the mounting unit. The mounting portion includes: a mounting head having a collet for sucking the bare chip; a drive unit including a drive shaft for moving the mounting head; and a sensor capable of detecting an angular velocity and an acceleration of the mounting head. The control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor, and determines an abnormality.

Description

Chip mounting apparatus and method for manufacturing semiconductor device
Technical Field
The present invention relates to a die bonding apparatus, and is applicable to a die bonding apparatus including, for example, a gyro sensor.
Background
Some of the manufacturing processes of semiconductor devices include a process of mounting a semiconductor chip (hereinafter, simply referred to as a bare chip (die)) on a wiring board, a lead frame, or the like (hereinafter, simply referred to as a board) and assembling a package, and the process of assembling a package includes the following processes: a step of dividing bare chips from a semiconductor wafer (hereinafter, simply referred to as a wafer); and a mounting step of mounting the divided bare chip on a substrate. The manufacturing apparatus used in the mounting process is a die mounter such as a die bonder.
The die mounter is a device that mounts (mounts and bonds) a bare chip onto a substrate or a mounted bare chip using solder, a plating material, or a resin as a bonding material. In a die mounter which mounts a bare chip on a surface of a substrate, for example, the following operations (operations) are repeated: the bare chips are sucked and picked up from the wafer using a suction nozzle called a collet (collet), transported onto the substrate, applied with a pressing force, and heated to bond the materials, thereby performing mounting. The collet is arranged at the top end of the mounting head. The mounting head is driven by a driving unit (servo motor) such as a ZY drive shaft, and the servo motor is controlled by a motor control device.
In the servo motor control, in order to avoid mechanical impact on the workpiece and a unit supporting the workpiece, the workpiece needs to be moved by smoothly accelerating and decelerating the workpiece.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2012-175768
In a chip mounter such as a chip mounter, mounting accuracy and the like are improved, and stability in quality of a product produced by the device is required. On the other hand, in order to improve productivity, the chip mounter operates the pickup head and the mounting head at a high speed, and thus, the risk of device failure, defective products, and the like due to an increase in mechanical load and vibration is increased.
However, the following problems currently exist: there is no mechanism for accurately grasping the movement locus and vibration of the mounting head and the like during the operation of the apparatus and detecting an abnormality in advance.
Disclosure of Invention
The invention provides a chip mounting device with a mechanism for detecting abnormity of a mounting head and the like.
Other objects and novel features will become apparent from the description and drawings of the specification.
A brief description of a typical configuration of the present invention will be given below.
That is, the die bonding apparatus includes: a bare chip supply section; a substrate supply unit; a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and a control unit for controlling the bare chip supply unit, the substrate supply unit, and the mounting unit. The mounting portion includes: a mounting head having a collet for sucking the bare chip; a drive unit including a drive shaft for moving the mounting head; and a sensor capable of detecting an angular velocity and an acceleration of the mounting head. The control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor, and determines an abnormality.
Effects of the invention
According to the above chip mounter, abnormality based on vibration can be detected.
Drawings
Fig. 1 is a schematic plan view showing a structure of a chip mounter according to an embodiment.
Fig. 2 is a diagram illustrating a schematic configuration and operation of the chip mounter of fig. 1.
Fig. 3 is a block diagram showing a schematic configuration of a control system of the chip mounter of fig. 1.
Fig. 4 is a block diagram illustrating a basic principle of the motor control device of fig. 3.
Fig. 5 is a diagram illustrating the detection directions of the angular velocity and the acceleration of the gyro sensor.
Fig. 6 is a diagram illustrating the mounting position of the gyro sensor.
Fig. 7 is a diagram illustrating the vibration of the mounting head in the X-axis rotation direction.
Fig. 8 is a diagram illustrating a driving direction and a Z-axis angular velocity of the mounting head.
Fig. 9 is a diagram illustrating an angular velocity waveform and a rotation angle in the state of fig. 8.
Fig. 10 is a diagram illustrating the driving direction and the Y-direction acceleration of the mounting head.
Fig. 11 is a diagram illustrating an acceleration waveform, an acceleration command waveform, and a differential acceleration in the state of fig. 10.
Fig. 12 is a graph illustrating differential velocity and displacement.
Fig. 13 is a diagram illustrating a synthesized waveform of the vibration displacement in the X direction and the vibration displacement in the Y direction when the mounting head is driven in the Y direction.
Fig. 14 is a diagram illustrating an example of the maximum displacement in the 3-axis direction and the maximum displacement in the 3-axis rotation direction.
Fig. 15 is a diagram illustrating fluctuations in vibration displacement and a threshold value.
Fig. 16 is a flowchart illustrating a method of manufacturing a semiconductor device.
Fig. 17 is a diagram illustrating an acceleration waveform, a velocity, and a position in the state of fig. 10.
Fig. 18 is a diagram illustrating a mounting position of a gyro sensor in modification 2.
Fig. 19 is a diagram for explaining the abnormality determination method of modification 3.
Description of the reference numerals
10: chip mounter
1: bare chip supply unit
11: wafer with a plurality of chips
13: jacking unit
2: pickup part
21: pick-up head
3: intermediate stage part
31: intermediate carrying platform
4: mounting part
41: mounting head
8: control unit
83 e: motor control device
210: motion controller
211: ideal waveform generating part
212: instruction waveform generating unit
213：DAC
214: abnormal operation diagnosis unit
220: servo amplifier
221: speed loop control part
230: servo motor
D: bare chip
S: substrate
Detailed Description
In the embodiment, the angular velocity and acceleration of the mounting head during operation are detected by the sensor, the current operation trajectory is grasped, and the waveform is compared with the motor command acceleration waveform and the vibration waveform accumulated in the past operation, whereby the abnormality diagnosis of the operation of the mounting head can be performed.
Hereinafter, embodiments and modifications will be described with reference to the drawings. In the following description, the same components are denoted by the same reference numerals, and redundant description thereof may be omitted.
[ examples ] A method for producing a compound
Fig. 1 is a schematic plan view showing a chip mounter according to an embodiment. Fig. 2 is a view for explaining the operation of the pick-up head and the mounting head when viewed from the direction of arrow a in fig. 1.
The chip mounter 10 is roughly classified into: a bare chip supply unit 1 that supplies a bare chip D to be mounted on a substrate S on which one or more product regions (hereinafter, referred to as package regions P) that will eventually become one package are printed; a pickup section 2; an intermediate stage section 3; a mounting portion 4; a conveying section 5; a substrate supply unit 6; a substrate output unit 7; and a control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the chip mounter 10, and the X-axis direction is the left-right direction. The bare chip supply unit 1 is disposed on the front side of the chip mounter 10, and the mounting unit 4 is disposed on the back side.
First, the bare chip supply section 1 supplies the bare chip D to be mounted on the package region P of the substrate S. The bare chip supply unit 1 includes: a wafer holding stage 12 that holds the wafer 11; and a lift-up unit 13 indicated by a dotted line, which lifts up the bare chip D from the wafer 11. The die supplying unit 1 moves in the XY direction by a driving mechanism not shown, and moves the die D to be picked up to the position of the lift unit 13.
The pickup section 2 includes: a pickup head 21 that picks up the bare chip D; a Y drive section 23 of the pickup head which moves the pickup head 21 in the Y direction; and driving units, not shown, for moving the collet 22 up and down, rotating, and moving in the X direction. The pickup head 21 has a collet 22 (see also fig. 2) that sucks and holds the lifted bare chip D to the tip, picks up the bare chip D from the bare chip supply unit 1, and mounts the bare chip D on the intermediate stage 31. The pickup head 21 includes driving units, not shown, for moving the collet 22 up and down, rotating, and moving in the X direction.
The intermediate stage portion 3 includes: an intermediate stage 31 on which a bare chip D is temporarily placed; and a stage recognition camera 32 for recognizing the bare chip D on the intermediate stage 31.
The mounting section 4 picks up the bare chip D from the intermediate stage 31, and mounts the bare chip D on the package region P of the substrate S that has been transported, or on the bare chip that has already been mounted on the package region P of the substrate S. The mounting portion 4 has: a mounting head 41 including a collet 42 (see also fig. 2) for sucking and holding the bare chip D at the tip end, similarly to the pickup head 21; a Y drive unit 43 that moves the mounting head 41 in the Y direction; and a substrate recognition camera 44 that takes an image of a position recognition mark (not shown) of the package region P of the substrate S to recognize the mounting position.
With this configuration, the mounting head 41 corrects the pickup position and the attitude based on the imaging data of the stage recognition camera 32, picks up the bare chip D from the intermediate stage 31, and mounts the bare chip D on the substrate based on the imaging data of the substrate recognition camera 44.
The conveying unit 5 includes a substrate conveying claw 51 for gripping and conveying the substrate S and a conveying path 52 for moving the substrate S. The substrate S is moved by driving a nut, not shown, of the substrate transport claw 51 provided on the transport path 52 by a ball screw, not shown, provided along the transport path 52.
With such a configuration, the substrate S is moved from the substrate supply unit 6 to the mounting position along the conveyance path 52, and after mounting, the substrate S is moved to the substrate discharge unit 7, and the substrate S is delivered to the substrate discharge unit 7.
The control unit 8 includes: a memory for storing a program (software) for monitoring and controlling the operation of each part of the chip mounter 10; and a Central Processing Unit (CPU) that executes the program stored in the memory.
The chip mounter 10 has: a wafer recognition camera 24 that recognizes a posture of the bare chip D on the wafer 11; a stage recognition camera 32 that recognizes the posture of the bare chip D placed on the intermediate stage 31; and a substrate recognition camera 44 that recognizes a mounting position on the mounting table BS. What is necessary to perform the correction of the attitude deviation between the recognition cameras is the stage recognition camera 32 involved in the pickup by the mounting head 41 and the substrate recognition camera 44 involved in the mounting to the mounting position by the mounting head 41.
The control unit 8 will be described with reference to fig. 3. Fig. 3 is a block diagram showing a schematic configuration of the control system. The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control Unit 8 is roughly divided and mainly includes a control arithmetic device 81 composed of a CPU (Central processing Unit), a storage device 82, an input/output device 83, a bus 84, and a power supply Unit 85. The storage device 82 includes: a main storage 82a configured by a RAM in which a processing program and the like are stored; and an auxiliary storage device 82b configured by an HDD in which control data, image data, and the like necessary for control are stored. The input/output device 83 includes: a monitor 83a that displays device status, information, and the like; a touch panel 83b for inputting an instruction from an operator; a mouse 83c that operates the monitor; and an image acquisition device 83d that acquires image data from the optical system 88. The input/output device 83 further includes: a motor control device 83e for controlling a driving unit 86 such as an XY stage (not shown) of the bare chip supply unit 1 and a ZY driving axis of the head stage; and an I/O signal control device 83f that acquires or controls signals from a signal unit 87 such as a switch of various sensors, lighting devices, and the like. The optical system 88 includes the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44. The control arithmetic device 81 acquires necessary data via the bus 84, performs arithmetic operations, controls the pickup head 21 and the like, and transmits information to the monitor 83a and the like.
The control unit 8 stores the image data captured by the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44 in the storage device 82 via the image acquisition device 83 d. The control arithmetic device 81 is used to position the package regions P of the bare chip D and the substrate S and to inspect the surfaces of the bare chip D and the substrate S by using programmed software based on the stored image data. The driving unit 86 is moved by software via the motor control unit 83e based on the positions of the bare chip D and the package region P of the substrate S calculated by the control arithmetic unit 81. The bare chip D is mounted on the package region P of the substrate S by positioning the bare chip on the wafer by this process and operating the pickup unit 2 and the driver of the mounting unit 4. The wafer recognition camera 24, stage recognition camera 32, and substrate recognition camera 44 used are a grayscale camera, a color camera, or the like, and the light intensity is digitized.
Fig. 4 is a block diagram illustrating a basic principle of the motor control device of fig. 3. The motor control device 83e includes a motion controller 210 and a servo amplifier 220, and controls a servo motor 230. The motion controller 210 includes an ideal waveform generating unit 211 that performs a process of generating an ideal command waveform, a command waveform generating unit 212, a DAC (Digital to Analog Converter)213, and an operation abnormality diagnosing unit 214. The servo amplifier 220 includes a velocity loop control unit 221.
As shown in fig. 4, the motion controller 210 and the servo amplifier 220 of the motor control device 83e are closed-loop controlled. Therefore, the speed loop control unit 221 of the servo amplifier 220 performs speed control using the current commanded position and the actual position and actual speed obtained from the servo motor 230. The velocity loop control unit 221 controls the velocity by generating a command waveform by the motion controller 210 while limiting the jerk by obtaining the actual velocity and the actual position from the servo motor 230. The ideal waveform generating Unit 211 and the command waveform generating Unit 212 are constituted by, for example, a CPU (Central Processing Unit) and a memory that holds a program executed by the CPU.
For example, in fig. 4, a target position, a target velocity, a target acceleration, and a target jerk are provided to the motion controller 210. The actual position and the actual speed are sequentially input as encoder signals to the command waveform generating unit 212 via the servo amplifier 220 or directly from the servo motor 230.
The ideal waveform generation unit 211 of the motion controller 210 generates (a) a command jerk waveform (JD), (b) a command acceleration waveform (AD), (c) a command velocity waveform (VD), and (d) a command position waveform (PD), respectively, based on target values of jerk, acceleration, velocity, and position input from the control arithmetic device 81. The ideal waveform generator 211 outputs the command jerk waveform (JD), the command acceleration waveform (AD), the command velocity waveform (VD), and the command position waveform (PD) to the command waveform generator 212, and outputs the command acceleration waveform (AD) to the abnormal operation diagnosis unit 214.
The command waveform generating unit 212 sequentially regenerates a future command velocity waveform while limiting the jerk based on the output signal waveform (the current command position obtained from the command waveform at the ideal position) output from the ideal waveform generating unit 211 and the encoder signal (actual position) input from the servo motor 230, and sequentially outputs the waveform to the DAC 213. For example, the command waveform generating unit 212 performs (1) command waveform input/output processing, (2) encoder signal counting processing, and (3) command waveform reproduction processing.
The DAC 213 converts the input digital command value into an analog speed command value, and outputs the converted value to the speed loop control unit 221 of the servo amplifier 220. The encoder signal is stored as a pulse by an encoder signal counter (not shown).
The speed loop control unit 221 of the servo amplifier 220 controls the rotational speed of the servo motor 230 based on the speed command value input from the motion controller 210 and the encoder signal input from the servo motor 230.
The servo motor 230 rotates at a rotation speed according to the control of the rotation speed input from the speed loop control unit 221 of the servo amplifier 220, and outputs the actual position and the actual speed as encoder signals to the speed loop control unit 221 of the servo amplifier 220 and the command waveform generation unit 212 of the motion controller 210.
In the embodiment of fig. 4, the actual position of the driven body such as the mounting head is calculated from the count value (the number of rotations and the rotation angle) of the servo motor 230, and the actual velocity is calculated based on the calculated actual position. However, a position detection device that directly detects the position of the driven body may be provided, and the position detected by the position detection device may be an actual position.
The abnormal operation diagnosis unit 214 acquires the angular velocity and XYZ-direction acceleration signals from the gyro sensor 45, compares the angular velocity and XYZ-direction acceleration signals with the command waveform, and extracts the vibration displacement. When an abnormality is detected, the operation abnormality diagnosis unit 214 outputs an abnormality detection signal to the command waveform generation unit 212 to stop the servo motor.
The mounting position, angular velocity, and acceleration detection method of the gyro sensor will be described with reference to fig. 5 to 7. Fig. 5 is a diagram showing the detection directions of the angular velocity and the acceleration of the gyro sensor. Fig. 6 is a diagram showing the mounting position of the gyro sensor. Fig. 7 is a diagram showing the vibration of the mounting head in the X-axis rotation direction.
The gyro sensor 45 uses a 6-axis gyro sensor capable of detecting 3-axis angular velocity and 3-axis acceleration. As shown in fig. 5, the detection (vibration detection) direction of the angular velocity and acceleration of the gyro sensor 45 is Ax: x-direction acceleration (G), Ay: acceleration in Y direction (G), Az: z-direction acceleration (G), Gx: x-axis angular velocity (deg/s), Gy: y-axis angular velocity (deg/s), Gz: z-axis angular velocity (deg/s).
As shown in fig. 6, the gyro sensor 45 is provided in the vicinity of the center O of the mounting head 41 (hereinafter, simply referred to as the mounting head center) near the intersection of the drive axes in the X, Y, and Z directions that drive the mounting head 41. For example, the intersection of the drive axes in the X, Y, and Z directions is located on the back side (back side in the drawing) of the mounting head 41, and the center O is the center of gravity of the mounting head 41. The gyro sensor 45 is provided on the front side (near side in the drawing) of the mounting head 41. Therefore, the gyro sensor 45 is located before the intersection of the drive axes in the X, Y, and Z directions and the center O of the mounting head 41, but is referred to as being located at the center of the mounting head. The vibration waveform of the mounting head can be extracted from the difference between the acceleration waveform obtained from the gyro sensor 45 and the motor command acceleration waveform.
As shown in fig. 7, the vibration (Gx) in the rotational direction of the mounting head 41 can be accurately detected by the gyro sensor 45.
The procedure of the abnormality diagnosis of the mounting head will be described with reference to fig. 8 to 15. Fig. 8 is a view showing a driving direction and a Z-axis angular velocity of the mounting head. Fig. 9 is a diagram showing an angular velocity waveform and a rotation angle in the state of fig. 8, fig. 9 (a) is a diagram showing an angular velocity waveform in the Z-axis rotation direction, and fig. 9 (B) is a diagram showing a rotation angle waveform obtained by integrating the waveform of fig. 9 (a). Fig. 10 is a diagram showing the driving direction and the Y-direction acceleration of the mounting head. Fig. 11 is a diagram showing an acceleration waveform, an acceleration command waveform, and a differential acceleration in the state of fig. 10, fig. 11 (a) is a diagram showing an acceleration waveform in the Y direction, fig. 11 (B) is a diagram showing an acceleration command waveform in the Y direction, and fig. 11 (C) is a diagram showing a differential waveform of the waveforms of fig. 11 (a) and 11 (B). Fig. 12 is a diagram showing the differential velocity and the displacement, fig. 12 (a) is a diagram showing a differential velocity waveform in the Y direction obtained by integrating the waveform in fig. 11 (C), and fig. 12 (B) is a diagram showing a displacement waveform in the Y direction obtained by integrating the waveform in fig. 12 (a). Fig. 13 is a diagram showing a waveform obtained by combining the vibration displacement in the X direction and the vibration displacement in the Y direction when the mounting head is driven in the Y direction. Fig. 14 is a diagram showing an example of the maximum displacement in the 3-axis direction and the maximum displacement in the 3-axis rotation direction. Fig. 15 is a diagram showing the fluctuation of the vibration displacement and the threshold value.
(a1) The operation abnormality diagnosis unit 214 integrates the angular velocity signal waveform obtained from the gyro sensor 45 to obtain the vibration displacement in the rotational direction. As shown in fig. 8, when the mounting head 41 is driven in the Y direction, the angular velocity signal in the Z-axis rotation direction is measured, and the angular velocity signal waveform (Gz (deg/s)) in the Z-axis rotation direction as shown in fig. 9 a is obtained. The angular velocity signal in the Z-axis rotation direction is integrated to calculate a Z-axis rotation angle (deg) as shown in fig. 9 (B), and the vibration displacement in the Z-axis rotation direction is obtained. Similarly, the vibrational displacement in the X-axis rotational direction and the vibrational displacement in the Y-axis rotational direction when the mounting head 41 is driven in the Y direction are obtained.
(a2) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the mounting head 41 from the difference between the acceleration signal waveform obtained by the gyro sensor 45 and the command acceleration waveform, and obtains the vibration displacement. As shown in fig. 10, the acceleration signal in the Y direction is measured when the mounting head 41 is driven in the Y direction, and the acceleration signal waveform (Ay) in the Y direction as shown in fig. 11 (a) is obtained. The difference between the acceleration signal waveform (Ay) and the command acceleration waveform (AD) shown in fig. 11 (B) is calculated, and the differential acceleration waveform (Δ Ay) shown in fig. 11 (C) is calculated. The differential acceleration waveform (Δ Ay) is integrated to calculate a differential velocity (Δ Vy) as shown in fig. 12 (a). Then, the differential velocity (Δ Vy) is integrated to obtain the vibration displacement (Dy) in the Y direction as shown in fig. 12 (B). Similarly, the vibration displacement in the X direction and the vibration displacement in the Z direction when the mounting head 41 is driven in the Y direction are obtained.
(a3) The operation abnormality diagnosis unit 214 calculates a composite waveform of the vibration displacement in the 3-axis rotation direction from the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction (3-axis rotation direction) obtained in (a1), and calculates a composite waveform of the vibration displacement in the 3-axis direction from the vibration displacement in the X-axis direction, the vibration displacement in the Y-axis direction, and the vibration displacement in the Z-axis direction (3-axis direction) obtained in (a 2). Fig. 13 shows a waveform obtained by combining the X-direction vibration displacement and the Y-direction vibration displacement during the Y-direction driving of the mounting head 41, for the sake of easy illustration.
(a4) The operation abnormality diagnosis unit 214 obtains the Maximum Displacement (MD) of the 3-axis direction vibration displacement and the maximum displacement (RMD) of the 3-axis rotation direction vibration displacement as shown in fig. 14 from the composite waveform of the 3-axis direction vibration displacement and the composite waveform of the 3-axis rotation direction vibration displacement of the mounting head.
(a5) The operation abnormality diagnosis unit 214 measures (calculates) a waveform similar to the synthesized waveform of the vibration displacement during the mounting operation obtained in the above (a2) a plurality of times in advance, obtains and accumulates the maximum displacement similar to (a4), and compares the maximum displacement with the vibration displacement measured (calculated) in the above (a2) in the normal mounting process.
(a6) When at least one of the Maximum Displacement (MD) in the 3-axis direction and the maximum displacement (RMD) in the 3-axis rotation direction of the composite waveform measured (calculated) in (a4) exceeds a preset threshold value as shown in fig. 15 in the normal mounting process, the operation abnormality diagnosis unit 214 outputs an abnormality detection signal to the command waveform generation unit 212 to stop the servo motor 230, and displays the operation abnormality of the mounting head 41 on the monitor 83 a.
(a7) At the time of abnormality detection, the operation abnormality diagnosis unit 214 specifies the cause of the abnormality with operation waveforms divided into the X-direction, the Y-direction, the Z-direction, the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction.
Next, a method for manufacturing a semiconductor device using the chip mounter of the embodiment will be described with reference to fig. 16. Fig. 16 is a flowchart showing a method of manufacturing a semiconductor device.
Step S11: the wafer ring 14 holding the dicing tape 16 is stored in a wafer cassette (not shown) and is input to the die bonder 10, and the bare chips D cut from the wafer 11 are bonded to the dicing tape 16. The control section 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply section 1. Further, the substrate S is prepared and input to the chip mounter 10. The controller 8 mounts the substrate S on the substrate transfer claw 51 by the substrate supply unit 6.
Step S12: the control section 8 picks up the divided bare chips from the wafer.
Step S13: the control unit 8 mounts the picked-up bare chip on the substrate S or laminates the picked-up bare chip on an already mounted bare chip. The control unit 8 causes the bare chip D picked up from the wafer 11 to be placed on the intermediate stage 31, picks up the bare chip D again from the intermediate stage 31 by the mounting head 41, and mounts the bare chip D on the substrate S that has been transported. The abnormality diagnosis of the mounting head is performed in parallel with step S13.
Step S14: the control section 8 takes out the substrate S with the bare chip D mounted thereon from the substrate transfer claw 51 by the substrate output section 7. The substrate S is output from the chip mounter 10.
In an embodiment, a 6-axis gyro sensor is disposed at the center of the mounting head. In the mounting head operation, a vibration waveform in the mounting head rotation direction is extracted from the angular velocity obtained from the 6-axis gyro sensor, and a vibration waveform of the mounting head is extracted from the difference between the acceleration waveform obtained from the gyro sensor and the motor command acceleration waveform. The displacement of the vibration calculated from the extracted vibration waveform is compared with the displacement of the vibration measured and accumulated a plurality of times in advance, and thereby whether or not there is a change in the vibration of the current mounting head operation is checked, and an abnormality of the apparatus is detected. When the displacement of the vibration measured this time exceeds a previously given threshold value, the device reports an abnormality after stopping the motor. By operating the mounting head using the above-described function, it is possible to diagnose an abnormality of the mounting head.
According to the embodiment, the vibration of the mounting head can be grasped. Further, by providing the gyro sensor near the center of the mounting head, the vibration in the rotational direction of the mounting head can be accurately grasped.
Further, the abnormality diagnosis of the mounting head is performed by comparing the current displacement of the vibration with a motor command acceleration waveform of the mounting head and a vibration waveform accumulated in the past operation, and determining whether or not the current displacement of the vibration exceeds a threshold value given in advance. This can prevent a failure of the apparatus, a defective product, and the like.
Further, the vibration displacement including the rotation direction can be calculated by 1 sensor. In addition, the cause of the abnormality can be identified by dividing the vibration displacement in the X, Y, Z direction and the X-axis, Y-axis, and Z-axis rotation directions at the time of abnormality detection.
< modification example >
Hereinafter, some representative modifications will be described. In the following description of the modified examples, the same reference numerals as those of the above-described embodiments can be used for portions having the same structures and functions as those of the above-described embodiments. Further, to the description of this portion, the description of the above embodiments can be appropriately referred to within a range not technically contradictory. In addition, all or a part of the embodiments and the modifications can be appropriately combined and applied within a range not technically contradictory.
(modification 1)
Fig. 17 is a diagram showing an acceleration waveform, a velocity, and a position in the state of fig. 10, fig. 17 (a) is a diagram showing an acceleration waveform in the Y direction, fig. 17 (B) is a diagram showing a velocity waveform in the Y direction obtained by integrating the waveform of fig. 17 (a), and fig. 17 (C) is a diagram showing a position waveform in the Y direction obtained by integrating the waveform of fig. 17 (B).
In the embodiment, in the above (a2), the vibration displacement in the Y direction is obtained from the difference between the acceleration signal waveform obtained from the gyro sensor 45 and the command acceleration waveform when the mounting head 41 is driven in the Y direction, but in the modification 1, the vibration displacement is obtained from the difference between the movement trajectory of the mounting head 41 and the command position waveform.
(b1) The operation abnormality diagnosis unit 214 obtains the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction when the mounting head 41 is driven in the Y direction, in the same manner as in (a1) of the embodiment.
(b2) The operation abnormality diagnosis unit 214 calculates the operation locus of the mounting head 41 based on the acceleration signal waveform obtained from the gyro sensor 45. As shown in fig. 10, the acceleration signal in the Y direction is measured when the mounting head 41 is driven in the Y direction, and the acceleration signal waveform (Ay) in the Y direction as shown in fig. 17 (a) is obtained. The acceleration signal (Ay) in the Y direction is integrated to calculate a velocity (Vy) in the Y direction as shown in fig. 17 (B). Then, the velocity (Vy) in the Y direction is integrated to calculate a position (Py) in the Y direction as shown in fig. 17 (C), and the motion trajectory in the Y direction is obtained. Similarly, the movement locus in the X direction and the movement locus in the Z direction when the mounting head 41 is driven in the Y direction are obtained.
(b3) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the mounting head 41 from the difference between the obtained operation trajectory and the commanded position waveform (PD), and obtains the vibration displacement in the Y direction when the mounting head 41 is driven in the Y direction. Similarly, the vibration displacement in the X direction and the vibration displacement in the Z direction when the mounting head 41 is driven in the Y direction are obtained.
(b4) The subsequent processing is the same as the processing of (a3) and subsequent processing in the embodiment.
In modification 1, a 6-axis gyro sensor is provided near the center of the mounting head near the intersection of the drive axes in the X, Y, and Z directions that drive the mounting head. In the mounting head operation, a vibration waveform in the mounting head rotation direction is extracted from the angular velocity obtained from the 6-axis gyro sensor, the operation locus of the mounting head is calculated based on the acceleration waveform obtained from the gyro sensor, and the vibration waveform of the mounting head is extracted from the difference between the operation locus and the motor command position waveform. The displacement of the vibration calculated from the extracted vibration waveform is compared with the displacement of the vibration measured and accumulated a plurality of times in advance, and the presence or absence of a change in the vibration of the current operation of the mounting head is checked to detect an abnormality in the apparatus. When the displacement of the vibration measured this time exceeds a previously given threshold value, the device reports an abnormality after stopping the motor. By operating the mounting head using the above-described function, it is possible to diagnose an abnormality of the mounting head.
(modification 2)
Fig. 18 is a diagram showing a mounting position of a gyro sensor in modification 2.
In the embodiment, the case where the gyro sensor 45 is provided near the center O of the mounting head 41 near the intersection of the driving shafts in the X direction, the Y direction, and the Z direction that drive the mounting head 41 has been described, but the gyro sensor is not limited to this, and may be provided at a place where the sensor can be attached from the tip of the collet 42 of the mounting head 41 to the upper end of the mounting head 41.
As shown in fig. 18, when the gyro sensor 45 is provided at the tip of the collet 42 of the mounting head 41 or in the vicinity of the tip of the collet 42, it is possible to directly grasp vibrations that affect mounting accuracy.
In modification 2, a 6-axis gyro sensor is provided at or near the collet tip of the mounting head. Thus, the vibration (the acceleration signal (Ax) in the X direction and the acceleration signal in the Y direction during the driving in the Y direction) which affects the mounting accuracy is directly grasped, and the displacement of the vibration measured and accumulated a plurality of times in advance is compared with the vibration, thereby detecting the abnormality of the device.
(c1) As shown in fig. 18, the acceleration signal (Ax) in the X direction and the acceleration signal (Ay) in the Y direction are measured when the mounting head 41 is driven in the Y direction.
(c2) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the mounting head 41 from the difference between the measured acceleration signal (Ay) and the command acceleration waveform, and obtains the vibration displacement in the Y direction. Similarly, the vibration displacement in the X direction when the mounting head 41 is driven in the Y direction is obtained.
(c3) The operation abnormality diagnosis unit 214 calculates a synthesized waveform of the vibration displacement as shown in fig. 13 from the vibration displacement in the X direction and the vibration displacement in the Y direction obtained in (c2) above.
(c4) The operation abnormality diagnosis unit 214 obtains the Maximum Displacement (MD) of the 2-axis direction vibration displacement from the synthesized waveform of the 2-axis direction vibration displacement of the mounting head.
(c5) The operation abnormality diagnosis unit 214 measures (calculates) and accumulates a waveform similar to the synthesized waveform of the vibration displacement in the mounting operation obtained in the above (c4) a plurality of times in advance, and compares the waveform with the vibration displacement measured (calculated) in the above (c3) in the normal mounting process.
(c6) When the Maximum Displacement (MD) in the 2-axis direction of the composite waveform measured (calculated) in (c4) above in the normal mounting process exceeds a preset threshold value as shown in fig. 15, the operation abnormality diagnosis unit 214 outputs an abnormality detection signal to the command waveform generation unit 212 to stop the servo motor 230, and displays the operation abnormality of the mounting head 41 on the monitor 83 a.
(c7) At the time of abnormality detection, the operation abnormality diagnosis unit 214 specifies the cause of the abnormality by using operation waveforms divided into the X direction and the Y direction, respectively.
(modification 3)
Fig. 19 is a diagram showing an abnormality determination method according to modification 3. Fig. 19 shows a waveform obtained by combining the X-direction vibration displacement and the Y-direction vibration displacement during the Y-direction driving of the mounting head 41, for the sake of easy illustration.
In the embodiment and the modifications 1 and 2, the abnormality diagnosis is performed with respect to the maximum displacement of the synthesized waveform having a single threshold value, but the following method may be used: when the trajectory of the vibration displacement in the XYZ-direction and the trajectory of the vibration displacement in the Z-axis rotation direction of the X-axis Y-axis are separated from each other by a predetermined distance, it is determined that the abnormality is present. In this method, it is not necessary to find the maximum displacement from the synthesized waveform. This is applied to the embodiment as follows. Modification 3 can be applied to modifications 1 and 2.
(d1) The operation abnormality diagnosis unit 214 performs the same processing as in (a1) of the embodiment.
(d2) The operation abnormality diagnosis unit 214 performs the same processing as in (a2) of the embodiment.
(d3) The operation abnormality diagnosis unit 214 performs the same processing as in (a3) of the embodiment.
(d4) The operation abnormality diagnosis unit 214 measures (calculates) and accumulates a waveform similar to the synthesized waveform of the vibration displacement in the mounting operation obtained in the above (d2) a plurality of times in advance, and compares the waveform with the vibration displacement measured (calculated) in the above (d2) in the normal mounting process.
(d5) When the composite waveform measured (calculated) in (d4) above in a normal mounting process exceeds a preset threshold value as shown in fig. 19, the operation abnormality diagnosis unit 214 outputs an abnormality detection signal to the command waveform generation unit 212 to stop the servo motor 230, and displays on the monitor 83a the case where the operation of the mounting head 41 is abnormal.
The invention made by the present inventors has been specifically described above based on the embodiments, examples, and modifications, but the present invention is not limited to the embodiments, examples, and modifications described above, and various modifications can be made.
For example, in the embodiment, the case where the mounting head is driven in the Y axis is described, but the present invention can be applied to the case where the mounting head is driven in the Z axis.
In the embodiment, the example in which the gyro sensor is provided in the mounting head is described, but the present invention is not limited to this, and the gyro sensor may be provided in the pickup head.
In the embodiment, the abnormality diagnosis is performed by obtaining the displacement of the vibration, but it is also possible to obtain not only the displacement of the vibration but also the frequency component by fourier transform or the like, and compare the vibration level of each frequency with the vibration level of the past operation.
Further, a gyro sensor may be provided in a mounting device holder mounting portion of the mounting head stage and the pickup head stage (X, Y, Z driving unit), vibration data other than vibration data based on the operation of each head may be acquired, and abnormality diagnosis may be performed using a difference from the data of each head.
Further, the vibration data of each head at rest may be used as the reference data. This makes it possible to realize analysis using only data based on the operation of each head, and to perform more accurate abnormality diagnosis.
Further, a gyro sensor may be provided in the substrate recognition camera, the stage recognition camera, and the wafer recognition camera, and the diagnosis may be made as to whether the cause of the abnormality is an operation of the head or an abnormality on the camera side when the mounting accuracy abnormality occurs.
In the embodiment, one pickup head and one mounting head are provided, respectively, but two or more pickup heads may be provided. In the embodiment, the intermediate stage is provided, but the intermediate stage may not be provided. In this case, the pick-up head and the mounting head can be used in combination.
In the embodiment, the die is mounted with the front surface facing upward, but the die may be mounted with the back surface facing upward by turning the front and back surfaces of the die after the die is picked up. In this case, the intermediate stage may not be provided. The device is called a flip chip mounter.

Claims (21)

1. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform in a rotation direction of the mounting head based on an angular velocity obtained from the sensor during a mounting head operation; and the number of the first and second electrodes,
(b) extracting a vibration waveform of the mounting head from a difference between an acceleration waveform obtained from the sensor and a motor command acceleration waveform;
(c) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(a1) Integrating the measured angular velocity signal in the X-axis rotation direction, the measured angular velocity signal in the Y-axis rotation direction, and the measured angular velocity signal in the Z-axis rotation direction, respectively, to calculate a vibration displacement in the X-axis rotation direction, a vibration displacement in the Y-axis rotation direction, and a vibration displacement in the Z-axis rotation direction;
(b1) extracting a waveform of a vibration component from the difference between the measured acceleration waveforms in the X direction, the Y direction, and the Z direction and the command acceleration waveform, and calculating a vibration displacement in the X direction, a vibration displacement in the Y direction, and a vibration displacement in the Z direction;
(c1) calculating a first synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis rotation direction, the calculated vibration displacement in the Y-axis rotation direction, and the calculated vibration displacement in the Z-axis rotation direction, and a second synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis direction, the calculated vibration displacement in the Y-axis direction, and the calculated vibration displacement in the Z-axis direction;
(c2) calculating a first maximum displacement of the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction from the first synthesized waveform, and calculating a second maximum displacement of the vibration displacement in the X-axis direction, the vibration displacement in the Y-axis direction, and the vibration displacement in the Z-axis direction from the second synthesized waveform;
(c3) the first maximum displacement is compared with a threshold value set based on the maximum displacement measured and accumulated a plurality of times in advance, and the second maximum displacement is compared with a threshold value set based on the maximum displacement measured and accumulated a plurality of times in advance.
2. The chip mounting apparatus according to claim 1,
the sensor is provided near the center of the mounting head near the intersection of the drive shafts in the X, Y, and Z directions that drive the mounting head.
3. The chip mounting apparatus according to claim 1,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
4. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform in a rotation direction of the mounting head from an angular velocity obtained from the sensor during a mounting head operation, and calculating an operation trajectory of the mounting head based on an acceleration waveform obtained from the sensor;
(b) extracting a vibration waveform of the mounting head according to a difference value between the action track of the mounting head and a waveform of a motor command position;
(c) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(a1) Integrating the measured angular velocity signal in the X-axis rotation direction, the measured angular velocity signal in the Y-axis rotation direction, and the measured angular velocity signal in the Z-axis rotation direction, respectively, to calculate a vibration displacement in the X-axis rotation direction, a vibration displacement in the Y-axis rotation direction, and a vibration displacement in the Z-axis rotation direction;
(b1) integrating the measured acceleration waveforms in the X direction, the Y direction and the Z direction to calculate motion tracks in the X direction, the Y direction and the Z direction;
(b2) extracting the waveform of the vibration component according to the calculated difference between the X-direction, Y-direction and Z-direction motion tracks and the waveform of the command position, and calculating the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction;
(c1) calculating a first synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis rotation direction, the calculated vibration displacement in the Y-axis rotation direction, and the calculated vibration displacement in the Z-axis rotation direction, and a second synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis direction, the calculated vibration displacement in the Y-axis direction, and the calculated vibration displacement in the Z-axis direction;
(c2) calculating a first maximum displacement of the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction from the first synthesized waveform, and calculating a second maximum displacement of the vibration displacement in the X-axis direction, the vibration displacement in the Y-axis direction, and the vibration displacement in the Z-axis direction from the second synthesized waveform;
(c3) the first maximum displacement is compared with a threshold value set based on the maximum displacement measured and accumulated a plurality of times in advance, and the second maximum displacement is compared with a threshold value set based on the maximum displacement measured and accumulated a plurality of times in advance.
5. The chip mounting apparatus according to claim 4,
the sensor is provided near the center of the mounting head near the intersection of the drive shafts in the X, Y, and Z directions that drive the mounting head.
6. The chip mounting apparatus according to claim 4,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
7. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform of the mounting head based on a difference between an acceleration waveform obtained from the sensor and a motor command acceleration waveform during a mounting head operation;
(b) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(b1) Extracting the waveform of a vibration component according to the difference between the measured acceleration waveform in the X direction and the measured acceleration waveform in the Y direction and the command acceleration waveform, and calculating the vibration displacement in the X direction and the vibration displacement in the Y direction;
(c1) calculating a synthesized waveform obtained by synthesizing the calculated vibration displacement in the X direction and the vibration displacement in the Y direction;
(c2) calculating the maximum displacement of the vibration displacement in the X direction and the vibration displacement in the Y direction according to the synthesized waveform;
(c3) the maximum displacement is compared with a threshold value set based on the maximum displacement measured and accumulated a plurality of times in advance.
8. The chip mounting apparatus according to claim 7,
the sensor is arranged at the lower part of the mounting head mounted on the collet.
9. The chip mounting apparatus according to claim 7,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
10. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform in a rotation direction of the mounting head based on an angular velocity obtained from the sensor during a mounting head operation; and the number of the first and second electrodes,
(b) extracting a vibration waveform of the mounting head from a difference between an acceleration waveform obtained from the sensor and a motor command acceleration waveform;
(c) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(a1) Integrating the measured angular velocity signal in the X-axis rotation direction, the measured angular velocity signal in the Y-axis rotation direction, and the measured angular velocity signal in the Z-axis rotation direction, respectively, to calculate a vibration displacement in the X-axis rotation direction, a vibration displacement in the Y-axis rotation direction, and a vibration displacement in the Z-axis rotation direction;
(b1) extracting a waveform of a vibration component from the difference between the measured acceleration waveforms in the X direction, the Y direction, and the Z direction and the command acceleration waveform, and calculating a vibration displacement in the X direction, a vibration displacement in the Y direction, and a vibration displacement in the Z direction;
(c1) calculating a first synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis rotation direction, the calculated vibration displacement in the Y-axis rotation direction, and the calculated vibration displacement in the Z-axis rotation direction, and a second synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis direction, the calculated vibration displacement in the Y-axis direction, and the calculated vibration displacement in the Z-axis direction;
(c2) the first synthesized waveform is compared with a threshold value set based on synthesized waveforms measured and stored a plurality of times in advance, and the second synthesized waveform is compared with a threshold value set based on synthesized waveforms measured and stored a plurality of times in advance.
11. The chip mounting apparatus according to claim 10,
the sensor is provided near the center of the mounting head near the intersection of the drive shafts in the X, Y, and Z directions that drive the mounting head.
12. The chip mounting apparatus according to claim 10,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
13. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform in a rotation direction of the mounting head from an angular velocity obtained from the sensor during a mounting head operation, and calculating an operation trajectory of the mounting head based on an acceleration waveform obtained from the sensor;
(b) extracting a vibration waveform of the mounting head according to a difference value between the action track of the mounting head and a waveform of a motor command position;
(c) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(a1) Integrating the measured angular velocity signal in the X-axis rotation direction, the measured angular velocity signal in the Y-axis rotation direction, and the measured angular velocity signal in the Z-axis rotation direction, respectively, to calculate a vibration displacement in the X-axis rotation direction, a vibration displacement in the Y-axis rotation direction, and a vibration displacement in the Z-axis rotation direction;
(b1) integrating the measured acceleration waveforms in the X direction, the Y direction and the Z direction to calculate motion tracks in the X direction, the Y direction and the Z direction;
(b2) extracting the waveform of the vibration component according to the calculated difference between the X-direction, Y-direction and Z-direction motion tracks and the waveform of the command position, and calculating the vibration displacement in the X direction, the vibration displacement in the Y direction and the vibration displacement in the Z direction;
(c1) calculating a first synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis rotation direction, the calculated vibration displacement in the Y-axis rotation direction, and the calculated vibration displacement in the Z-axis rotation direction, and a second synthesized waveform obtained by synthesizing the calculated vibration displacement in the X-axis direction, the calculated vibration displacement in the Y-axis direction, and the calculated vibration displacement in the Z-axis direction;
(c2) the first synthesized waveform is compared with a threshold value set based on synthesized waveforms measured and stored a plurality of times in advance, and the second synthesized waveform is compared with a threshold value set based on synthesized waveforms measured and stored a plurality of times in advance.
14. The chip mounting apparatus according to claim 13,
the sensor is provided near the center of the mounting head near the intersection of the drive shafts in the X, Y, and Z directions that drive the mounting head.
15. The chip mounting apparatus according to claim 13,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
16. A chip mounting apparatus, comprising:
a bare chip supply section;
a substrate supply unit;
a mounting section that mounts the bare chip supplied from the bare chip supply section on the substrate supplied from the substrate supply section or the bare chip already mounted on the substrate; and
a control part for controlling the bare chip supply part, the substrate supply part and the mounting part,
the mounting portion includes:
a mounting head having a collet for sucking the bare chip;
a drive unit including a drive shaft for moving the mounting head; and
a sensor capable of detecting an angular velocity and an acceleration of the mounting head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the sensor to determine an abnormality,
the control part
(a) Extracting a vibration waveform of the mounting head based on a difference between an acceleration waveform obtained from the sensor and a motor command acceleration waveform during a mounting head operation;
(b) comparing the displacement of the vibration calculated from the extracted vibration waveform with a threshold value set based on the displacement of the vibration measured and accumulated a plurality of times in advance, thereby confirming whether there is a change in the vibration of the current mounting head operation and determining an abnormality of the apparatus,
the sensor measures angular velocities in an X-axis rotation direction, a Y-axis rotation direction, and a Z-axis rotation direction, and accelerations in the X-direction, the Y-direction, and the Z-direction,
the control part
(b1) Extracting the waveform of a vibration component according to the difference between the measured acceleration waveform in the X direction and the measured acceleration waveform in the Y direction and the command acceleration waveform, and calculating the vibration displacement in the X direction and the vibration displacement in the Y direction;
(c1) calculating a synthesized waveform obtained by synthesizing the calculated vibration displacement in the X direction and the vibration displacement in the Y direction;
(c2) the synthesized waveform is compared with a threshold value set based on synthesized waveforms measured and accumulated a plurality of times in advance.
17. The chip mounting apparatus according to claim 16,
the sensor is arranged at the lower part of the mounting head mounted on the collet.
18. The chip mounting apparatus according to claim 16,
the chip mounting device is also provided with a pick-up part,
the pickup unit includes:
a pickup head having a collet for sucking the bare chip;
a drive unit having a drive shaft for moving the pickup head; and
a second sensor capable of detecting an angular velocity and an acceleration of the pickup head,
the control unit compares the vibration displacement with a preset threshold value of vibration displacement using the result obtained by the second sensor, and determines an abnormality.
19. A method for manufacturing a semiconductor device, comprising:
(a) a process of preparing the chip mounter according to any one of claims 1 to 18;
(b) a step of inputting a wafer ring-shaped holder holding a dicing tape to which bare chips are bonded;
(c) a step of preparing and inputting a substrate;
(d) picking up a bare chip;
(e) a step of attaching the picked bare chip to the substrate or the attached bare chip; and
(f) a step of performing an abnormality diagnosis using the measurement result of the sensor,
the step (f) is performed in parallel with the step (e) and detects the presence or absence of an abnormality in the vibration of the operation of the mounting head based on the measurement result of the sensor.
20. The method for manufacturing a semiconductor device according to claim 19,
in the step (d), the bare chips on the dicing tape are picked up by the mounting head,
in the step (e), the bare chip picked up by the mounting head is mounted on the substrate or the mounted bare chip.
21. The method for manufacturing a semiconductor device according to claim 19,
the step (d) includes the steps of:
(d1) picking up the bare chip on the dicing tape by using a pick-up head; and
(d2) a step of placing the bare chip picked up by the pickup head on an intermediate stage,
the step (e) includes the steps of:
(e1) picking up a bare chip mounted on the intermediate stage by a mounting head; and
(e2) a step of placing the bare chip picked up by the mounting head on the substrate,
the step (f) is performed in parallel with the step (d2), and detects the presence or absence of an abnormality in the vibration of the operation of the pickup head based on the measurement result of the second sensor.
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