TW201917818A - Die bonding apparatus and manufacturing method of semiconductor device capable of detecting an abnormality of a bonding head - Google Patents

Abstract

The subject of the present invention is to provide a die bonding apparatus having a means for detecting an abnormality of a bonding head and the like. To solve the problem, the die bonding apparatus includes a die supply part, a substrate supply part, a bonding part for bonding a die supplied from the die supply part onto a substrate supplied from the substrate supply part or onto a die already bonded to the substrate, and a control unit for controlling the die supply part, the substrate supply part and the bonding part. The bonding part includes a bonding head having a chuck for attracting the die, a driving unit having a driving shaft for moving the bonding head, and a sensor capable of detecting an angular velocity and an acceleration of the bonding head. Based on the result obtained by the sensor, the control unit compares a vibration displacement with a predetermined threshold value of vibration displacement to determine an abnormality.

Description

Die bonding device and method for manufacturing semiconductor device

The present disclosure relates to a die bonding device, and can be applied to, for example, a die bonding device including, for example, a gyro sensor.

A part of the manufacturing process of a semiconductor device includes a process of assembling a package by mounting a semiconductor wafer (hereinafter, simply referred to as a die) on a wiring board or a lead frame (hereinafter, simply referred to as a substrate), and a part of the process of assembling the package. A process of dividing a die from a semiconductor wafer (hereinafter, simply referred to as a wafer), and a joining process of mounting the divided die on a substrate. The manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

The die bonder is a device that uses solder, gold plating, and resin as bonding materials to bond (attach and mount) the die to the substrate or the bonded die. The die is repeatedly picked up in a die bonder bonded to the surface of a substrate, for example, by using a suction nozzle called a chuck to pick up the die from the wafer, and to transfer the die to the substrate to apply a pressing force. The joining operation (operation) is performed by heating the joining material. The chuck is mounted at the front end of the joint head. The joint head is driven by a drive unit (servo motor) such as a ZY drive shaft, and the servo motor is controlled by a motor control device.

In servo motor control, it is necessary to smoothly perform acceleration / deceleration and move the workpiece in a manner that does not cause mechanical impact on the workpiece or a unit supporting the workpiece.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-175768

[Problems to be Solved by the Invention]

In a die bonding device such as a die bonder, it is required to improve the bonding accuracy and the like, and the quality of products produced in the device is stable. In addition, since the die bonding device moves the pick-up head or the bonding head at high speed in order to improve productivity, the risk of device failure or defective production due to increased mechanical load or vibration increases.

However, in the current situation, is there any problem of a means for accurately grasping the motion trajectory or vibration of the joint head or the like during the operation of the device and detecting an abnormality in advance.

An object of the present disclosure is to provide a die bonding apparatus including a means for detecting an abnormality in a bonding head or the like.
Other problems and novel features are apparent from the description of this specification and the drawings of the attachments.

[Means to solve the problem]

A brief description of the representative contents of this disclosure is as follows.
That is, the die bonding apparatus includes a die supply section; a substrate supply section; and a bonding section, which is used to bond the die supplied from the die supply section to the substrate supplied from the board supply section or is bonded to the substrate. On the die of the substrate; and the control part, which controls the die supply part, the substrate supply part and the bonding part. The joint portion includes a joint head including a chuck for adsorbing the crystal grains, a drive unit including a drive shaft for moving the joint head, and a sensor capable of detecting an angular velocity and an acceleration of the joint head. The control unit uses the result obtained by the sensor to compare the vibration displacement with a threshold value of a predetermined vibration displacement to determine an abnormality.

[Inventive effect]

When the above-mentioned die bonding device is used, abnormality due to vibration can be detected.

In the implementation mode, the detector detects the angular velocity and acceleration of the joint head in motion, grasps the current motion trajectory, and compares the motor command acceleration waveform or the vibration waveform stored by the past motion to enable the joint head to move. Abnormal diagnosis.

Hereinafter, examples and modifications will be described using drawings. However, in the following description, the same reference numerals are given to the same constituent elements, and repeated explanations are omitted.

[Example]

FIG. 1 is a schematic top view of a die bonder related to the embodiment. FIG. 2 is a diagram illustrating the actions of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 1.

The die bonder 10 generally includes a supply unit 1, a pick-up unit 2, and a supply unit 2 for supplying a die D mounted on a printed board region (hereinafter, referred to as a package region P) mounted in one or a plurality of final packages. The intermediate stage part 3, the joint part 4, the conveyance part 5, the substrate supply part 6, the substrate carry-out part 7, and the control part 8 which monitors and controls the operation of each part. The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply section 1 is arranged on the front side of the die bonder 10, and the joint section 4 is arranged on the deep side.

First, the die supply unit 1 supplies the die D mounted on the package region P of the substrate S. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a broken line that pushes the die D from the wafer 11. The die supply unit 1 moves in the XY direction by a driving means (not shown) to move the picked-up die D to the position of the push-up unit 13.

The picking section 2 includes a picking head 21 for picking up the die D, a Y driving section 23 for moving the picking head 21 to the Y direction, and various driving sections (not shown) for lifting, rotating, and moving the chuck 22 in the X direction. . The pick-up head 21 includes a chuck 22 (see also FIG. 2) that sucks and holds the pushed-up crystal grains D at the front end, picks up the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate stage 31. The pick-up head 21 includes drive units (not shown) that raise, lower, rotate, and move the chuck 22 in the X direction.

The intermediate platform section 3 includes an intermediate platform 31 on which the die D is temporarily placed, and a platform identification camera 32 for identifying the die D on the intermediate platform 31.

The bonding portion 4 is used to pick up the die D from the intermediate platform 31, and to bond the die D to the package area P of the substrate S that has been transported, or to laminate the die D that has been bonded to the package area P of the substrate S Form for joining. The bonding portion 4 includes a bonding head 41 (see FIG. 2) of the chuck 42 (see also FIG. 2) for holding and holding the crystal grain D on the front end, a Y driving portion 43 that moves the bonding head 41 to the Y direction, and a photographing substrate S, as in the pickup head 21. A position identification mark (not shown) in the package area P, and a substrate identification camera 44 for identifying a bonding position.
With this configuration, the bonding head 41 corrects the pickup position and posture based on the photographic data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate based on the photographic data of the substrate recognition camera 44.

The conveyance unit 5 includes a substrate conveyance claw 51 that grasps and conveys the substrate S, and a conveyance path 52 that moves the substrate S. The substrate S is moved by driving a non-illustrated nut of the substrate conveying claw 51 provided on the conveying path 52 with a ball wheel lever (not shown) provided along the conveying path 52.
With this configuration, the substrate S is moved from the substrate supply section 6 to the bonding position along the conveyance path 52, and after the bonding, the substrate S is moved to the substrate carrying-out section 7 and the substrate S is handed over to the substrate carrying-out section 7.

The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

The die bonder 10 includes a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a platform recognition camera 32 that recognizes the attitude of the die D placed on the intermediate platform 31, and a bonding platform BS. The camera 44 at the mounting position. It is necessary to correct the posture shift between the recognition cameras, which are the platform recognition camera 32 related to the picking up by the bonding head 41 and the substrate recognition camera 44 related to the bonding to the mounting position by the bonding head 41.

The control unit 8 will be described using FIG. 3. Fig. 3 is a block diagram showing a schematic configuration of a control system. The control system 80 includes a control unit 8, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 8 generally includes a control mainly composed of a CPU (Central Processor Unit), a computing device 81, a memory device 82, an input / output device 83, a bus bar 84, and a power supply unit 85. The memory device 82 includes a main memory device 82a constituted by a RAM storing a processing program and the like, and an auxiliary memory device 82b constituted by an HDD which stores control data or image data required for control. The input / output device 83 includes a screen 83a for displaying device status or information, a touch panel 83b for inputting instructions from an operator, a mouse 83c for operating the screen, and an image capturing device for capturing image data from the optical system 88 83d. Furthermore, the input / output device 83 includes a motor control device 83e that controls the XY stage (not shown) of the die supply unit 1 or a drive unit 86 that is connected to a ZY drive shaft of the headstock, and signals or illumination from various sensors. The signal unit 87 such as a switch of a device or the like is an I / O signal control device 83f that captures or controls a signal. The optical system 88 includes a wafer identification camera 24, a platform identification camera 32, and a substrate identification camera 44. The control and computing device 81 retrieves required data via the bus line 84, performs calculations, and controls the pickup head 21 and the like, or sends information to the screen 83a and the like.

The control unit 8 stores the image data captured by the wafer identification camera 24, the platform identification camera 32, and the substrate identification camera 44 in the memory device 82 via the image acquisition device 83d. According to the software programmed based on the saved image data, the control and computing device 81 is used to perform positioning of the package area P of the die D and the substrate S, and surface inspection of the die D and the substrate S. Based on the positions of the die D and the package area P of the substrate S calculated by the control and computing device 81, the drive unit 86 is moved by the software via the motor control device 83e. With this process, the die on the wafer is positioned, and the die D that operates as the driving part of the pick-up part 2 and the bonding part 4 is bonded to the package area P of the substrate S. The wafer identification camera 24, the platform identification camera 32, and the substrate identification camera 44 used are gray scale, color, etc., and the light intensity is quantified.

FIG. 4 is a block diagram illustrating the basic principle of the motor control device of FIG. 3. FIG. The motor control device 83 e includes an operation controller 210 and a servo 220, and controls the servo motor 230. The motion controller 210 includes an ideal waveform generation unit 211 that performs ideal command waveform generation processing, an instruction waveform generation unit 212, a DAC (Digital to Analog Converter) 213, and an operation abnormality diagnosis unit 214. The servo amplifier 220 includes a speed loop control unit 221.

As shown in FIG. 4, the motor control device 83 e is a closed-loop control of the motion controller 210 and the servo amplifier 220. Therefore, the current command position and the actual position and actual speed obtained from the servo motor 230 are used to perform speed control by the speed loop control section 221 of the servo amplifier 220. However, the speed loop control section 221 is controlled by the motion controller 210. While acquiring the actual speed from the servo motor 230 and acquiring the actual position to limit the jerk, the command waveform is generated again to perform the speed control. The ideal waveform generation unit 211 and the instruction waveform generation unit 212 are configured by, for example, a CPU (Central Processing Unit) and a memory storing a program executed by the CPU.

For example, in FIG. 4, a target position, a target speed, a target acceleration, and a target jerk are applied to the motion controller 210. Then, the command waveform generation unit 212 directly inputs the actual position and the actual speed through the servo amplifier 220 or the servo motor 230 as encoder signals.

The ideal waveform generation unit 211 of the motion controller 210 generates (a) a commanded acceleration waveform (JD), and (b) a commanded acceleration from target values of jerk, acceleration, speed, and position input from the control and computing device 81. Waveform (AD), (c) command speed waveform (VD), (d) command position waveform (PD). The ideal waveform generation unit 211 outputs the commanded acceleration waveform (JD), the commanded acceleration waveform (AD), the commanded speed waveform (VD), and the commanded position waveform (PD) to the commanded waveform generation unit 212 and outputs the commanded acceleration waveform (AD). Output to the operation abnormality diagnosis unit 214.

The command waveform generation unit 212 is based on the output signal waveform output from the ideal waveform generation unit 211 (the current command position obtained from the command waveform at the ideal position) and the encoder signal (actually input from the servo motor 230). Position), while limiting the jerk, it sequentially outputs the command speed waveform after it is regenerated to the DAC213. For example, the instruction waveform generation unit 212 performs (1) instruction waveform input / output processing, (2) encoder signal counting processing, and (3) instruction waveform reproduction processing.

The DAC213 converts the input digital command value into a speed command value of an analog signal and outputs it to the speed loop control section 221 of the servo amplifier 220. In addition, the encoder signal uses an encoder signal counter (not shown) to store the position deviation amount as a pulse.

The speed loop control unit 221 of the servo amplifier 220 controls the rotation speed of the servo motor 230 in accordance with the speed command value input from the motion controller 210 and the encoder signal input from the servo motor 230.

The servo motor 230 rotates at a rotational speed controlled by the rotational speed input from the speed loop control unit 221 of the servo amplifier 220, and outputs the actual position and actual speed as encoder signals to the speed loop control of the servo amplifier 220. The unit 221 and the command waveform generation unit 212 of the motion controller 210.

In the embodiment of FIG. 4, the actual position of the driven body such as the joint head is calculated from the count value (the number of rotations and the rotation angle) of the servo motor 230, and the actual speed is calculated based on the calculated actual position. However, even if a position detection device that directly detects the position of the driven body is provided, the position detected by the position detection device may be the actual position.

The abnormal motion diagnosis unit 214 extracts the angular velocity and acceleration signals in the XYZ direction from the gyro sensor 45, compares the command waveforms, and extracts the vibration displacement. The abnormal operation diagnosis unit 214 detects an abnormal situation, outputs an abnormality detection signal to the command waveform generation unit 212, and stops the servo motor.

The installation position, angular velocity, and acceleration detection method of the gyro sensor will be described using FIGS. 5 to 7. FIG. 5 is a diagram showing a method of detecting the angular velocity and acceleration of the gyro sensor. FIG. 6 is a diagram showing a mounting position of the gyro sensor. FIG. 7 is a diagram showing vibration in the X-axis rotation direction of the joint head.

As the gyro sensor 45, a 6-axis gyro sensor capable of detecting 3-axis angular velocity and detecting 3-axis acceleration is used. As shown in FIG. 5, the angular velocity and acceleration detection (vibration detection) directions of the gyro sensor 45 are Ax: X-direction acceleration (G), Ay: Y-direction acceleration (G), and Az: Z-direction acceleration ( G), Gx: X-axis angular velocity (deg / s), Gy: Y-axis angular velocity (deg / s), Gz: Z-axis angular velocity (deg / s).

As shown in FIG. 6, the gyro sensor 45 is disposed near the center O of the joint head 41 (hereinafter, simply referred to as simply referred to as “here”) near the intersection of the X-, Y-, and Z-direction drive axes. Splice head center). For example, the intersections of the drive axes in the X, Y, and Z directions are located on the back side (back side in the drawing) of the joint head 41, and the center O is the center of gravity of the joint head 41. The gyro sensor 45 is provided on the front side (the front side in the drawing) of the joint head 41. According to this, although the gyro sensor 45 is located further forward than the intersection of the drive axes in the X, Y, and Z directions and the center O of the joint head 41, it is said to be located at the center of the joint head. The vibration waveform of the joint head can be extracted from the difference between the acceleration waveform obtained by the gyro sensor 45 and the motor command acceleration waveform.

Furthermore, as shown in FIG. 7, even the vibration (Gx) of the gyro sensor 45 with respect to the rotation direction of the joint head 41 can be accurately grasped.

The procedure of the abnormality diagnosis of the joint head will be described with reference to FIGS. 8 to 15. FIG. 8 is a diagram showing the driving direction and the Z-axis angular velocity of the joint head. FIG. 9 is a diagram showing an angular velocity waveform and a rotation angle in a state of FIG. 8, FIG. 9 (A) is a diagram showing an angular velocity waveform in a Z-axis rotation direction, and FIG. 9 (B) is a diagram showing a comparison with FIG. 9 (A) Graphic of the rotation angle waveform after the waveform is integrated. FIG. 10 is a diagram showing the driving direction and the Y-direction acceleration of the joint head. FIG. 11 is a diagram showing an acceleration waveform, an acceleration command waveform, and a differential acceleration in the state shown in FIG. 10. FIG. 11 (A) is a diagram showing an acceleration waveform in the Y direction, and FIG. 11 (B) is a diagram showing the acceleration in the Y direction. FIG. 11 (C) is a diagram showing a difference waveform of the waveforms of FIGS. 11 (A) and 11 (B). FIG. 12 is a diagram showing a differential velocity and a displacement, FIG. 12 (A) is a diagram showing a differential velocity waveform in a Y direction after integrating the waveform in FIG. 11 (C), and FIG. 12 (B) is a diagram illustrating A diagram showing the displacement waveform in the Y direction after integrating the waveform in FIG. 12 (A). FIG. 13 is a diagram illustrating a composite waveform of the vibration displacement in the X direction and the vibration displacement in the Y direction when the joint head is driven in the Y direction. FIG. 14 is a diagram illustrating an example of the maximum displacement in the three-axis direction and the maximum displacement in the three-axis rotation direction. FIG. 15 is a graph showing deviations and critical values of vibration displacement.

(a1) The abnormal operation diagnosis unit 214 integrates the angular velocity signal waveform obtained from the gyro sensor 45 to obtain the vibration displacement in the rotation direction. As shown in FIG. 8, when the joint head 41 is driven in the Y direction, the angular velocity signal in the Z-axis rotation direction is measured to obtain the angular velocity signal waveform (Gz (deg / s) in the Z-axis rotation direction as shown in FIG. 9 (A). ). Integrate the angular velocity signal in the Z-axis rotation direction, calculate the Z-axis rotation angle (deg) shown in FIG. 9 (B), and obtain the vibration displacement in the Z-axis rotation direction. Similarly, determine the Y of the joint head 41 The vibration displacement in the X-axis rotation direction and the vibration displacement in the Y-axis rotation direction during directional driving.

(a2) The abnormal operation diagnosis unit 214 is based on the difference between the acceleration signal waveform and the command acceleration waveform obtained by the gyro sensor 45, and extracts the waveform of the vibration component of the joint head 41 to obtain the vibration displacement. As shown in FIG. 10, when the joint head 41 is driven in the Y direction, the acceleration signal in the Y direction is measured to obtain the acceleration signal waveform (Ay) in the Y direction as shown in FIG. 11 (A). The difference between the acceleration signal waveform (Ay) and the command acceleration waveform (AD) as shown in FIG. 11 (B) is calculated, and the difference acceleration waveform (ΔAy) as shown in FIG. 11 (C) is calculated. This differential acceleration waveform (ΔAy) is integrated. The differential velocity (ΔVy) is calculated as shown in FIG. 12 (A). Then, the differential velocity (ΔVy) is integrated to obtain the vibration displacement (Dy) in the Y direction as shown in FIG. 12 (B). Similarly, the vibration displacement in the X direction and the vibration displacement in the Z direction when the Y head is driven in the Y direction are obtained.

(a3) The abnormal operation diagnosis unit 214 is calculated from the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction (three-axis rotation direction) obtained in the above (a1). The composite waveform of the vibration displacement in the 3 axis rotation direction is calculated from the vibration displacement in the X direction, the vibration displacement in the Y direction, and the vibration displacement in the Z direction (3 axis direction) obtained in (a2). The synthetic waveform. For ease of illustration in FIG. 13, a composite waveform of the X-direction vibration displacement and the Y-direction vibration displacement when the Y head is driven in the Y direction is shown.

(a4) The abnormal operation diagnosis unit 214 calculates the vibration displacement in the three-axis direction from the composite waveform of the vibration displacement in the three-axis direction of the joint head and the composite waveform of the vibration displacement in the three-axis rotation direction as shown in FIG. 14. Maximum displacement (MD), and the maximum displacement (RMD) of the vibration displacement in the 3-axis rotation direction.

(a5) The abnormal operation diagnosis unit 214 measures (calculates) the same waveform of the combined waveform of the vibration displacement in the joining operation obtained in the above (a2) several times in advance, and obtains the same maximum displacement as (a4) and gives It is stored and compared with the vibration displacement measured (calculated) in the above-mentioned (a2) in a normal joining process.

(a6) The abnormal operation diagnosis unit 214 is at least at least the maximum displacement (MD) in the 3 axis direction and the maximum displacement (RMD) in the 3 axis rotation direction of the composite waveform measured (calculated) in the above (a4) during normal joining process. One, if the threshold value is set in advance as shown in FIG. 15, an abnormality detection signal is output to the command waveform generation unit 212 to stop the servo motor 230, and the abnormality of the operation of the joint head 41 is displayed on the screen 83a.

(a7) At the time of abnormality detection, the abnormality diagnosis unit 214 specifies the cause of the abnormality by using the operation waveforms divided into the X, Y, Z, and X-axis rotation directions, the Y-axis rotation direction, and the Z-axis rotation direction.

Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. 16. FIG. 16 is a flowchart showing a method of manufacturing a semiconductor device.
Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is stored is stored in a wafer cassette (not shown), and is transferred to the die bonder 10. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. The substrate S is prepared and carried into the die bonder 10. The control unit 8 mounts the substrate S on the substrate transfer claw 51 with the substrate supply unit 6.

Step S12: The control unit 8 picks up the divided dies from the wafer.
Step S13: The control unit 8 mounts the picked-up crystal grains on the substrate S or laminates the bonded crystal grains. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, and the bonding head 41 picks up the die D again from the intermediate stage 31 and joins the transferred substrate S. In parallel with step S13, the abnormality diagnosis of the joint head is performed.

Step S14: The control part 8 takes out the board | substrate S to which the die D was joined from the board | substrate conveying claw 51 by the board | substrate carrying-out part 7. The substrate S is carried out from the die bonder 10.

In an embodiment, a 6-axis gyroscope sensor is placed in the center of the joint head. During the operation of the joint head, the vibration waveform of the joint head rotation direction is extracted from the angular velocity obtained by the 6-axis gyro sensor, and the difference between the acceleration waveform obtained from the gyro sensor and the motor command acceleration waveform is used to extract the joint. Head vibration waveform. By comparing the displacement of the vibration calculated from the extracted vibration waveform and the displacement of the vibration measured and stored several times in advance, it is confirmed whether there is a change in the vibration of the current bonding head operation, and an abnormality of the device is detected. When the vibration displacement measured this time exceeds the critical value given in advance, the device reports an abnormality after stopping the motor. By using the above-mentioned function to move the joint head, it is possible to diagnose the abnormality of the joint head.

According to the embodiment, the vibration of the bonding head can be grasped. Furthermore, by providing a gyro sensor near the center of the joint head, it is possible to accurately grasp vibrations in the direction of rotation of the joint head.

Furthermore, by comparing the acceleration waveform of the motor command of the joint head or the vibration waveform stored in the past operation, it is judged whether the movement of the current vibration exceeds the threshold value given in advance, and the abnormality diagnosis of the joint head is performed. With this, it is possible to prevent malfunction of the device, production of defective products, and the like in advance.

In addition, the vibration displacement including the rotation direction can be calculated with one sensor. Furthermore, in the abnormality detection, the cause of the abnormality can also be specified by dividing the vibration displacement into the X, Y direction, and the X-axis, Y-axis, and Z-axis rotation directions.

(Modification)
In the following, a few typical modifications are exemplified. In the following description of the modified example, it is assumed that parts having the same configuration and functions as those described in the above-mentioned embodiment can use the same symbols as those in the above-mentioned embodiment. It should be noted that the description of such a part can be appropriately applied to those described in the above-mentioned embodiment within a range that is not technically contradictory. In addition, all or a part of the above-mentioned embodiments and a plurality of modified examples can be appropriately and compositely applied within a technically non-contradictory range.

(Modification 1)
FIG. 17 is a diagram showing acceleration waveforms, speeds, and positions in the state of FIG. 10, FIG. 17 (A) is a diagram showing acceleration waveforms in the Y direction, and FIG. 17 (B) is a diagram showing the acceleration waveforms in FIG. 17 (A). FIG. 17 (C) is a diagram showing a position waveform in the Y direction after integrating the waveform in FIG. 17 (B).

In the embodiment, the vibration displacement in the Y direction is obtained by the difference between the acceleration signal waveform obtained from the gyro sensor 45 and the command acceleration waveform when the (a2) is driven in the Y direction of the joint head 41, but in the modification In 1, the difference is obtained from the difference between the movement trajectory of the joint head 41 and the command position waveform.

(b1) The operation abnormality diagnosis unit 214 obtains the vibration displacement in the X-axis rotation direction and the vibration displacement in the Y-axis rotation direction and the Z-axis rotation direction when the joint head 41 is driven in the Y direction in the same manner as in the embodiment (a1).

(b2) The abnormal movement diagnosis unit 214 calculates the movement trajectory of the joint head 41 based on the acceleration signal waveform obtained from the gyro sensor 45. As shown in FIG. 10, when the joint head 41 is driven in the Y direction, the acceleration signal in the Y direction is measured to obtain the acceleration signal waveform (Ay) in the Y direction as shown in FIG. 17 (A). The acceleration signal (Ay) in the Y direction is integrated to calculate the velocity (Vy) in the Y direction as shown in FIG. 17 (B). Then, the velocity (Vy) in the Y direction is integrated to calculate the position (Py) in the Y direction as shown in FIG. 17 (C), and the trajectory in the Y direction is obtained. Similarly, the movement trajectory in the X direction and the movement trajectory in the Z direction when the Y head is driven in the Y direction are obtained.

(b3) The operation abnormality diagnosis unit 214 extracts the waveform of the vibration component of the joint head 41 from the difference between the obtained operation trajectory and the command position waveform (PD), and determines the Y-direction direction when the joint head 41 is driven in the Y direction. Vibration displacement. Similarly, the vibration displacement in the X direction and the vibration displacement in the Z direction when the Y head is driven in the Y direction are obtained.

The processing after (b4) is the same as the processing after (a3) of the embodiment.

In Modification 1, a 6-axis gyro sensor is provided near the center of the joint head near the intersection of the drive axes of the X, Y, and Z directions of the drive joint. During the operation of the joint head, the vibration waveform of the joint head rotation direction is extracted from the angular velocity obtained by the 6-axis gyro sensor, and the trajectory of the joint head is calculated based on the acceleration waveform obtained from the gyro sensor. The difference from the motor command position waveform is used to extract the vibration waveform of the joint head. By comparing the displacement of the vibration calculated from the extracted vibration waveform and the displacement of the vibration measured and stored several times in advance, it is confirmed whether there is a change in the vibration of the current bonding head operation, and an abnormality of the device is detected. When the vibration displacement measured this time exceeds the critical value given in advance, the device reports an abnormality after stopping the motor. By using the above-mentioned function to move the joint head, it is possible to diagnose the abnormality of the joint head.

(Modification 2)
FIG. 18 is a diagram showing a mounting position of a gyro sensor according to Modification 2. FIG.

In the embodiment, the case where the gyro sensor 45 is set near the center O of the joint head 41 near the intersection of the drive axes of the X, Y, and Z directions of the joint head 41 will be described, but It is not limited to this, and may be provided at a place where a sensor can be installed from the front end of the chuck 42 of the joint head 41 to the upper end of the joint head 41.

As shown in FIG. 18, when the gyro sensor 45 is installed near the front end of the chuck 42 of the joint head 41 or near the front end of the chuck 42, it is possible to directly grasp the vibration that affects the joint accuracy.

In the second modification, a 6-axis gyro sensor is provided near the chuck front end of the joint head or near the chuck front end. Based on this, the vibration (acceleration signal in the X direction (Ax) and the acceleration signal in the Y direction) that affects the joint accuracy is directly grasped, and the displacement is performed with the vibration measured and stored multiple times in advance. By comparison, an abnormality of the device is detected.

(c1) As shown in FIG. 18, when the joint head 41 is driven in the Y direction, the acceleration signal (Ax) in the X direction and the acceleration signal (Ay) in the Y direction are measured.

(c2) The abnormal operation diagnosis unit 214 extracts the waveform of the vibration component of the joint head 41 from the difference between the measured acceleration signal (Ay) and the commanded acceleration waveform, and obtains the vibration displacement in the Y direction. Similarly, the vibration displacement in the X direction when the Y head is driven in the Y direction is obtained.

(c3) The abnormal operation diagnosis unit 214 calculates a composite waveform of the vibration displacement shown in FIG. 13 based on the vibration displacement in the X direction and the vibration displacement in the Y direction obtained in (c2).

(c4) The abnormal operation diagnosis unit 214 obtains the maximum displacement (MD) of the vibration displacement in the two-axis direction from the combined waveform of the vibration displacement in the two-axis direction of the joint head.

(c5) The operation abnormality diagnosis unit 214 measures (calculates) the waveforms of the combined waveforms of the vibration displacements in the joint operation obtained in (c4) above in multiple times in advance and stores the same waveforms as in the above-mentioned ( c3) The vibration displacement measured (calculated) is compared.

(c6) The abnormal movement diagnosis unit 214 is the maximum displacement (MD) in the two-axis direction of the composite waveform measured (calculated) in (c4) above during normal joining process, and exceeds the threshold set in advance as shown in FIG. 15 In this case, an abnormality detection signal is output to the command waveform generation unit 212 to stop the servo motor 230, and the abnormality of the operation of the joint head 41 is displayed on the screen 83a.

(c7) At the time of abnormality detection, the abnormality diagnosis unit 214 specifies the cause of the abnormality by using the operation waveforms divided into the X direction and the Y direction.

(Modification 3)
FIG. 19 is a diagram showing an abnormality determination method related to Modification 3. FIG. For ease of illustration in FIG. 19, a composite waveform of the X-direction vibration displacement and the Y-direction vibration displacement when the Y head is driven in the Y direction is shown.

In Examples and Modifications 1 and 2, although a single critical value is used to diagnose the abnormality with respect to the maximum displacement of the synthesized waveform, the trajectory of the standard XYZ-direction vibration displacement measured from multiple times and The trajectory of the vibration displacement of the X-axis, Y-axis, and Z-axis rotation directions can be separated by a certain distance, and a method of judging an abnormality is also possible. In this method, it is not necessary to find the maximum displacement from the synthesized waveform. When this is applied to the examples, it is as follows. In addition, the modification 3 can also be applied to the modifications 1 and 2.

(d1) The operation abnormality diagnosing unit 214 performs the same processing as that of (a1) of the embodiment.

(d2) The abnormal operation diagnosis unit 214 performs the same processing as that of the embodiment (a2).

(d3) The operation abnormality diagnosis unit 214 performs the same processing as that of (a3) in the embodiment.

(d4) The operation abnormality diagnosis unit 214 measures (calculates) the waveforms of the combined waveforms of the vibration displacements in the joining operation obtained in (d2) above in advance (several times) and stores the same waveforms as in the above-mentioned ( d2) The vibration displacement measured (calculated) is compared.

(d5) Operation abnormality diagnosis unit 214 is a composite waveform that is measured (calculated) in (d4) above during a normal joining process and exceeds a threshold value set in advance as shown in FIG. 19, and is output to the command waveform generation unit 212. The abnormality detection signal stops the servo motor 230, and displays the abnormality of the operation of the joint head 41 on the screen 83a.

As mentioned above, although the invention created by the present inventors has been specifically described based on the implementation modes, examples, and modification examples, the present invention is not limited to the above implementation modes, examples, and modification examples, and various changes can be made.
For example, in the embodiment, the case where the joint head is applied to the Y-axis drive has been described, but the case where the joint head is applied to the Z-axis drive is also applicable.
In the embodiment, an example in which a gyro sensor is provided in the bonding head is described, but the invention is not limited to this, and a gyro may be provided in the pickup head.
Furthermore, in the embodiment, although the displacement of the vibration is obtained for abnormality diagnosis, not only the displacement of the vibration, but also specific frequency components such as Fourier transform, the past operation is compared with the vibration level of each frequency to perform abnormality diagnosis. Yes.
Furthermore, even if a gyro sensor is installed in the mounting device mounting portion of the bonding head stage and the picking head stage (X, Y, Z driving unit), vibration data other than the vibration data caused by the movement of each head is obtained. An abnormality diagnosis may be performed using the difference between the data of each head.
Furthermore, the vibration data in the stationary state of each head may be used as the reference data. In this way, analysis can be performed using only data based on the movements of the heads, and a more accurate abnormality diagnosis can be performed.
Furthermore, even if a gyro sensor is installed in the substrate recognition camera, the platform recognition camera, and the wafer recognition camera, the abnormality that causes the abnormality of the joint accuracy is diagnosed as the movement of the head or the abnormality of the camera.
In addition, in the embodiment, each of the pickup head and the bonding head is provided, but two or more of them may be used. Furthermore, in the embodiment, although an intermediate platform is provided, it may be used even if there is no intermediate platform. In this case, a pickup head and a bonding head may be used in combination.
Furthermore, in the embodiment, although the surfaces of the crystal grains are bonded to face up, even if the surface of the crystal grains is reversed after picking up the crystal grains, the back surface of the crystal grains may be oriented to be bonded. In this case, it is not necessary to provide an intermediate platform. This device is called a flip chip bonder.

10‧‧‧ Die Bonder

1‧‧‧Crystal Supply Department

11‧‧‧ wafer

13‧‧‧ Push-up unit

2‧‧‧Pick up department

21‧‧‧Pickup head

3‧‧‧Middle Platform Department

31‧‧‧ intermediate platform

4‧‧‧ Junction

41‧‧‧Joint head

8‧‧‧Control Department

83e‧‧‧Motor control device

210‧‧‧ Motion Controller

211‧‧‧ideal waveform generator

212‧‧‧Command waveform generation unit

213‧‧‧DAC

214‧‧‧Operation abnormality diagnosis department

220‧‧‧Servo amplifier

221‧‧‧Speed loop control section

230‧‧‧Servo motor

D‧‧‧ Grain

S‧‧‧ substrate

FIG. 1 is a schematic top view showing the configuration of a die bonder according to the embodiment.

FIG. 2 is a diagram illustrating a schematic configuration and operation of the die bonder of FIG. 1. FIG.

FIG. 3 is a block diagram illustrating a schematic configuration of a control system of the die bonder of FIG. 1. FIG.

FIG. 4 is a block diagram illustrating the basic principle of the motor control device of FIG. 3. FIG.

FIG. 5 is a diagram illustrating the detection directions of the angular velocity and acceleration of the gyro sensor.

FIG. 6 is a diagram illustrating a mounting position of the gyro sensor.

FIG. 7 is a diagram illustrating vibration in the X-axis rotation direction of the joint head.

FIG. 8 is a diagram illustrating the driving direction and the Z-axis angular velocity of the joint head.

FIG. 9 is an illustration of an angular velocity waveform and a rotation angle in the state of FIG. 8.

FIG. 10 is a diagram illustrating the driving direction and the Y-direction acceleration of the joint head.

FIG. 11 is a diagram showing acceleration waveforms, acceleration command waveforms, and differential accelerations in the state of FIG. 10.

FIG. 12 is a diagram illustrating differential velocity and displacement.

FIG. 13 is a diagram illustrating a composite waveform of the vibration displacement in the X direction and the vibration displacement in the Y direction when the joint head is driven in the Y direction.

FIG. 14 is a diagram illustrating an example of the maximum displacement in the three-axis direction and the maximum displacement in the three-axis rotation direction.

FIG. 15 is a diagram illustrating deviations and critical values of the vibration level meter.

FIG. 16 is a flowchart illustrating a method of manufacturing a semiconductor device.

FIG. 17 is a diagram showing acceleration waveforms, speeds, and positions in the state of FIG. 10.

FIG. 18 is a diagram illustrating a mounting position of a gyro sensor according to Modification 2. FIG.

FIG. 19 is a diagram illustrating an abnormality determination method related to Modification 3. FIG.

Claims (14)

A die bonding device having: Die supply department Substrate supply unit A bonding portion that bonds the crystals supplied from the crystal supply portion to a substrate that is supplied from the substrate supply portion or a crystal that has been bonded to the substrate; and The control part controls the die supply part, the substrate supply part, and the bonding part. The joint portion includes: A bonding head including a chuck for adsorbing the crystal grains; a driving section including a driving shaft for moving the bonding head; and a sensor capable of detecting the angular velocity and acceleration of the bonding head, The control unit uses the result obtained by the sensor to compare the vibration displacement with a threshold value of a predetermined vibration displacement to determine an abnormality. The die bonding device according to claim 1, wherein The sensor is disposed near the center of the bonding head close to the intersection of the driving axes of the X, Y, and Z directions of the bonding head driving. The above control department (a) During the operation of the joint head, the vibration waveform in the rotation direction of the joint head is extracted from the angular velocity obtained from the sensor, and (b) extracting the vibration waveform of the joint head from the difference between the acceleration waveform obtained from the sensor and the motor command acceleration waveform, (c) By comparing the displacement of the vibration calculated from the vibration waveform extracted above and the threshold value set based on the displacement of the vibration measured and stored in advance several times in advance, it is confirmed whether there is a change in the vibration of the current joint head operation. And judge the abnormality of the device. The die bonding device according to claim 1, wherein The sensor is disposed near the center of the bonding head close to the intersection of the driving axes of the X, Y, and Z directions of the bonding head driving, The above control department (a) During the operation of the joint head, the vibration waveform of the rotation direction of the joint head is extracted from the angular velocity obtained from the sensor, and the trajectory of the joint head is calculated based on the acceleration waveform obtained from the sensor. , (b) extracting the vibration waveform of the joint head from the difference between the movement track of the joint head and the waveform of the motor command position, (c) By comparing the displacement of the vibration calculated from the vibration waveform extracted above and the threshold value set based on the displacement of the vibration measured and stored in advance several times in advance, it is confirmed whether there is a change in the vibration of the current joint head operation And judge the abnormality of the device. The die bonding device according to claim 1, wherein The sensor is disposed below a joint head to which the chuck is mounted, The above control department (a) During the joint head operation, the vibration waveform of the joint head is extracted from the difference between the acceleration waveform obtained from the sensor and the motor command acceleration waveform. (b) By comparing the displacement of the vibration calculated from the vibration waveform extracted above and the threshold value set based on the displacement of the vibration measured and stored in advance several times in advance, it is confirmed whether there is a change in the vibration of the present joint head operation And judge the abnormality of the device. The die bonding device according to claim 1, wherein Further equipped with a pickup section, The picking unit includes: A pick-up head having a chuck for adsorbing the crystal grains; A drive unit including a drive shaft that moves the pickup head; and A second sensor capable of detecting the angular velocity and acceleration of the pickup head, The control unit uses the result obtained by the second sensor to compare the vibration displacement with a threshold value of a predetermined vibration displacement to determine an abnormality. The die bonding device according to claim 2, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (a1) Integrate the measured angular velocity signals in the X-axis rotation direction, the angular velocity signals in the Y-axis rotation direction, and the angular velocity signals in the Z-axis rotation direction, respectively, to calculate the vibration displacement in the X-axis rotation direction and the vibration in the Y-axis rotation direction. Displacement and vibration displacement in the Z-axis rotation direction, (b1) Calculate the vibration displacement in the X direction, the vibration displacement in the Y direction, and the vibration in the Z direction from the difference between the acceleration waveforms in the X, Y, and Z directions and the command acceleration waveform measured above. Displacement, (c1) Calculate and synthesize the first synthetic waveform of the X-axis rotation displacement, the Y-axis rotation displacement, and the Z-axis rotation displacement in the X-axis rotation direction and the Y-direction vibration displacement and Y direction. The second composite waveform of vibration displacement and vibration displacement in the Z direction, (c2) The first maximum displacement of the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction is calculated from the first synthesized waveform, and the X direction is calculated from the second synthesized waveform. The second largest displacement of the vibration displacement of the vibration displacement in the Y direction and the vibration displacement in the Z direction, (c3) Comparing the first maximum displacement and the threshold set based on the maximum displacement measured and stored in advance, and comparing the second maximum displacement and the threshold set based on the maximum displacement measured and stored in advance value. A die bonding device as described in claim 3, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (a1) Integrate the measured angular velocity signals in the X-axis rotation direction, the angular velocity signals in the Y-axis rotation direction, and the angular velocity signals in the Z-axis rotation direction, respectively, to calculate the vibration displacement in the X-axis rotation direction and the vibration in the Y-axis rotation direction. Displacement and vibration displacement in the Z-axis rotation direction, (b1) Integrate the acceleration waveforms measured in the X, Y, and Z directions, and calculate the movement trajectories in the X, Y, and Z directions. (b2) From the calculated differences between the X, Y, and Z movement trajectories and the command position waveforms, extract the waveform of the vibration component to calculate the X displacement, Y displacement, and Z displacement. Displacement, (c1) Calculate and synthesize the first synthetic waveform of the X-axis rotation displacement, the Y-axis rotation displacement, and the Z-axis rotation displacement in the X-axis rotation direction and the Y-direction vibration displacement and Y direction. The second composite waveform of vibration displacement and vibration displacement in the Z direction, (c2) The first maximum displacement of the vibration displacement in the X-axis rotation direction, the vibration displacement in the Y-axis rotation direction, and the vibration displacement in the Z-axis rotation direction is calculated from the first synthesized waveform, and the X direction is calculated from the second synthesized waveform. The second largest displacement of the vibration displacement of the vibration displacement in the Y direction and the vibration displacement in the Z direction, (c3) Comparing the first maximum displacement and the threshold set based on the maximum displacement measured and stored in advance, and comparing the second maximum displacement and the threshold set based on the maximum displacement measured and stored in advance value. The die-bonding device according to claim 4, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (b1) Calculate the vibration displacement in the X direction and the vibration displacement in the Y direction from the difference between the acceleration waveforms in the X and Y directions and the command acceleration waveform measured above. (c1) Calculate the combined waveform of the X-direction vibration displacement and the Y-direction vibration displacement. (c2) Calculate the maximum displacement of the vibration displacement in the X direction and the vibration displacement in the Y direction from the synthesized waveform, (c3) The above-mentioned maximum displacement is compared with a threshold value set based on the maximum displacement measured and stored in advance several times in advance. The die bonding device according to claim 2, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (a1) Integrate the measured angular velocity signals in the X-axis rotation direction, the angular velocity signals in the Y-axis rotation direction, and the angular velocity signals in the Z-axis rotation direction, respectively, to calculate the vibration displacement in the X-axis rotation direction and the vibration in the Y-axis rotation direction. Displacement and vibration displacement in the Z-axis rotation direction, (b1) Calculate the vibration displacement in the X direction, the vibration displacement in the Y direction, and the vibration in the Z direction from the difference between the acceleration waveforms in the X, Y, and Z directions and the command acceleration waveform measured above. Displacement, (c1) Calculate and synthesize the first synthetic waveform of the X-axis rotation displacement, the Y-axis rotation displacement, and the Z-axis rotation displacement in the X-axis rotation direction and the Y-direction vibration displacement and Y direction. The second composite waveform of vibration displacement and vibration displacement in the Z direction, (c2) Comparing the first synthetic waveform with a threshold set based on a composite waveform measured and stored in advance, and comparing the second synthetic waveform with a threshold set based on a composite waveform measured and stored in advance. value. A die bonding device as described in claim 3, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (a1) Integrate the measured angular velocity signals in the X-axis rotation direction, the angular velocity signals in the Y-axis rotation direction, and the angular velocity signals in the Z-axis rotation direction, respectively, to calculate the vibration displacement in the X-axis rotation direction and the vibration in the Y-axis rotation direction. Displacement and vibration displacement in the Z-axis rotation direction, (b1) Integrate the acceleration waveforms measured in the X, Y, and Z directions, and calculate the movement trajectories in the X, Y, and Z directions. (b2) Extract the waveform of the vibration component from the difference between the X, Y, and Z movement trajectories and the command position waveforms calculated above, and calculate the X displacement, Y displacement, and Z displacement. , (c1) Calculate and synthesize the first synthetic waveform of the X-axis rotation displacement, the Y-axis rotation displacement, and the Z-axis rotation displacement in the X-axis rotation direction and the Y-direction vibration displacement and Y direction. The second composite waveform of vibration displacement and vibration displacement in the Z direction, (c2) Comparing the first synthetic waveform with a threshold set based on a composite waveform measured and stored in advance, and comparing the second synthetic waveform with a threshold set based on a composite waveform measured and stored in advance. value. The die-bonding device according to claim 4, wherein The above sensor measurement Angular velocity in the X-axis rotation direction, the Y-axis rotation direction, and the Z-axis rotation direction; and Acceleration in X, Y and Z directions, The above control department (b1) Calculate the vibration displacement in the X direction and the vibration displacement in the Y direction from the difference between the acceleration waveforms in the X and Y directions and the command acceleration waveform measured above. (c1) Calculate the combined waveform of the X-direction vibration displacement and the Y-direction vibration displacement. (c2) The above-mentioned synthesized waveform is compared with a threshold value set based on the synthesized waveform measured and stored in advance plural times in advance. A method for manufacturing a semiconductor device includes: (a) the preparation of the die bonding device of any one of claims 1 to 11; (b) the process of moving into a wafer ring holder that holds dicing tape with die attached; (d) engineering to move into the substrate; (d) the process of picking up grains; (e) the process of bonding the picked-up grains to the above-mentioned substrate or the bonded grains; and (f) a process for performing a quasi-diagnosis of an abnormality based on a measurement result of the sensor, The (f) process is performed in parallel with the (e) process, and the presence or absence of abnormal vibrations in the operation of the joint head is detected based on the measurement results of the sensor. The method for manufacturing a semiconductor device according to claim 12, wherein The above (d) process is to pick up the crystal grains on the dicing tape with the bonding head, The (e) process is to use the bonding head to bond the picked-up crystal grains to the substrate or the crystal grains that have been bonded. The method for manufacturing a semiconductor device according to claim 12, wherein The above (d) project has: (d1) the process of picking up the crystal grains on the cutting tape with a pick-up head; (d2) the process of placing the grains picked up by the picking head on the intermediate platform, The above (e) project has: (e1) a process of picking up a die loaded on the intermediate platform with a bonding head; and (e2) a process of placing the crystal grain picked up by the bonding head on the substrate, The (f) engineering is parallel to the (d2) engineering, and the presence or absence of abnormal vibrations in the operation of the pickup head is detected based on the measurement result of the second sensor.