WO2020227987A1

WO2020227987A1 - High-speed surface mounting and transferring method and related product

Info

Publication number: WO2020227987A1
Application number: PCT/CN2019/087097
Authority: WO
Inventors: 张卫华
Original assignee: 深圳市兴华炜科技有限公司
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2020-11-19

Abstract

A high-speed surface mounting and transferring method and device. Said method comprises the following steps: acquiring a linear velocity v of a material platform, a surface mounting speed v, the coordinates of a material, and surface mounting coordinates (S201); determining a rotational angular velocity ω of a central rotating mechanism according to the linear velocity v (S202), ω = v/r, r being the radius of the central rotating mechanism; and attaching the material at the constant rotational angular velocity ω on the coordinates of the material, and completing surface mounting after arriving at the surface mounting coordinates (S203). Said method and device have the advantage of high efficiency.

Description

High-speed patch transfer method and related products

Technical field

The invention relates to the field of electronic technology, in particular to a high-speed patch transfer method and related products.

Background technique

In the mounting process of LED backlight or bare chip, it is often necessary to transfer materials from one location to another location with high speed and high precision; for example: MiniLED production, MicroLED production.

Existing placement uses a stop-and-go method for placement, and its efficiency is too poor to meet the productivity requirement of more than 100,000 points per hour.

technical problem

The embodiment of the present invention provides a high-speed patch transfer method and related products, which can complete the placement with high-speed movement, and improve the efficiency of placement.

Technical solutions

In the first aspect, an embodiment of the present invention provides a high-speed patch transfer method,

Obtain the linear velocity v of the material platform, the placement speed v, the coordinates of the material, and the placement coordinates;

Determine the rotational angular velocity ω of the central rotating mechanism according to the linear velocity v; ω=v/r; where r is the radius of the central rotating mechanism;

The coordinate of the material is sucked at a constant rotational angular velocity ω, and the placement is completed when the placement coordinate is reached.

Optionally, before the method reaches the placement coordinates and completes placement, the method further includes:

Obtain the image information of the material, and adjust the position of the material according to the image information.

Optionally, the adjusting the position of the material according to the image information specifically includes:

Obtain the position image information of the corresponding material, quickly analyze the image information, and provide position offset adjustment parameters for the target position.

Optionally, the method further includes:

After the placement is complete, the nozzle angle returns to zero.

Optionally, the method further includes:

Obtain the photographed picture at the second camera position, and determine whether there is a foreign body on the nozzle. If there is a foreign body on the nozzle, perform a throwing action at the throwing position.

In a second aspect, a high-speed patch transfer device is provided, and the device includes:

The acquisition unit is used to acquire the linear velocity v of the material platform, the placement speed v, the coordinates of the material, and the placement coordinates;

The control unit is used to determine the rotational angular velocity ω of the central rotating mechanism according to the linear velocity v; ω=v/r; where r is the radius of the central rotating mechanism;

The placement unit is used for sucking the material at a constant rotational angular velocity ω to the coordinate of the material, and the placement is completed by reaching the placement coordinate.

Optionally, the device further includes:

The adjustment unit is used to adjust the position of the material according to the image information of the material.

Optionally, the adjustment unit is specifically configured to obtain position image information of the corresponding material, quickly analyze the image information, and provide position offset adjustment parameters for the target position.

Optionally, the control unit is also used to reset the angle of the suction nozzle to zero after the component placement is completed.

In a third aspect, a computer-readable storage medium is provided, which stores a program for electronic data exchange, wherein the program causes a terminal to execute the method provided in the first aspect.

Beneficial effect

Implementing the embodiments of the present invention has the following beneficial effects:

It can be seen that the technical solution provided by the present application completes the placement of materials in a mobile manner, thereby realizing high-speed placement of materials and improving production efficiency.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.

Figure 1 is a schematic diagram of a placement.

Figure 2 is a schematic flow diagram of a high-speed patch transfer method.

Fig. 3 is a schematic diagram of a placement position provided by an embodiment of the present invention.

Embodiments of the invention

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

The terms "first", "second", "third" and "fourth" in the description and claims of the present invention and the drawings are used to distinguish different objects, rather than describing a specific order . In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes unlisted steps or units, or optionally also includes Other steps or units inherent to these processes, methods, products or equipment.

Reference to "embodiments" herein means that specific features, results, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art clearly and implicitly understand that the embodiments described herein can be combined with other embodiments.

The technical solution provided by this application is implemented in the following scenarios. The method structure is divided into three parts, namely:

The feeding part, this part has a special XY high-precision linear drive mechanism, equipped with an independent optical positioning system. The materials are neatly placed in the yellow supply tray shown in the figure. The coordinates of the material position and the identification of good and bad points are completed in the previous process. It can be 8-inch or 6-inch semiconductor cutting body.

Rotation transfer part, multiple nozzles are distributed around the circle (for example, >60), which are responsible for sucking, rotating, photographing, fine-tuning the angle, putting down, returning to position and other actions at different positions; in this mechanism, there are two positions arranged High-speed camera provides high-speed image recognition and positioning for materials.

The target position part and the material supply part will be mounted to the corresponding position according to the designed coordinate point. The bottom plate can be FPC, glass and other materials. The parts of the feeding part are mounted to the corresponding coordinates at high speed and high precision.

For placement, stop-and-go placement is to make the material static, and the placement part is also static, and then the suction nozzle rotates the placement to complete the placement of the material. However, with the improvement of integration and technical standards, the requirements for the number of placements are getting higher and higher. In order to improve efficiency, mobile placement must be used. However, for mobile placement, how to ensure the accuracy of materials is a problem, especially For electronic devices, the accuracy is often required to reach 20 um or less, which makes mobile placement a difficult problem to solve. In order to solve this problem, the scheme of this application is:

Flying reclaiming: The central rotating mechanism operates at a constant angular velocity, and the tangential direction of the suction position (the linear velocity in the X direction is basically unchanged in a very short time). The feeding mechanism operates at the same linear velocity, and the material is placed in the suction Below the mouth, at this time, the suction nozzle is stationary with respect to the material. This relative static time is extremely short. The suction nozzle goes down to suck the material and rises quickly to complete the suction action. Even if the suction position has a slight deviation, it can be corrected in the subsequent image processing.

Flying placement: the central rotating mechanism runs at a constant angular velocity, and the tangential direction of the placement position (the linear velocity in the X direction is basically unchanged in a very short time) is operated at the same linear velocity by the placement mechanism. The coordinate position material is placed below the material. At this time, the suction nozzle is stationary relative to the material. This relative static time is extremely short. The suction nozzle goes down to place the material and rises quickly to complete the placement action. (See below for the accuracy calculation and error analysis of placement coordinates).

Refer to Figure 1. Figure 1 is a schematic diagram of placement. As shown in Figure 1, it includes: the material platform 10, the suction nozzle 11 on the central rotating mechanism, and the placement position 12, although the material platform 10 and the placement position 12 are both Moving state, but because the suction nozzle 11 on the central rotating mechanism is also in a rotating state, so at one point, for example, when sucking materials, as long as the relative speed of the suction nozzle and the material platform 10 is 0, then this is a very short time Inside, you can complete the suction of the material, and the same is true for the corresponding discharge, that is, the material can be attached, so that the central rotating mechanism does not need to stop the action, and the LED can be quickly attached at a faster speed. Installed to meet the requirement of 100,000 points/h.

Refer to Figure 2. Figure 2 provides a high-speed patch transfer method. The method is shown in Figure 2. The method can be completed by a central rotating mechanism. The method includes the following steps:

Step S201: Obtain the linear velocity v, the placement speed v, the coordinates of the material, and the placement coordinates of the material platform;

Step S202: Determine the rotational angular velocity ω of the central rotating mechanism according to the linear velocity v; ω=v/r; where r is the radius of the central rotating mechanism;

In step S203, the coordinate of the material is sucked at a constant rotational angular velocity ω, and the placement is completed by reaching the placement coordinate.

The technical solution provided in this application completes the placement of materials in a mobile manner, thereby realizing high-speed placement of materials and improving production efficiency.

Optionally, the foregoing method may further include:

When passing the bottom light camera (ie, the first camera position), the position triggers the camera to take a high-speed photo. Obtain the location image information of the corresponding material. Quick analysis and provide position offset adjustment parameters for the target position. Including X deviation (dx), Y deviation (dy), angle deviation (da).

The above-mentioned positioning analysis method can be realized by using an existing placement machine.

Optionally, the above method may also include:

After the placement is completed, the nozzle angle is reset to zero to prepare for the subsequent suction of materials.

Optionally, the above method may also include:

At the second camera position, take a picture to determine whether there are foreign objects on the nozzle, such as unreleased materials, other dirt in the air, etc. If there are foreign objects in the nozzle, you need to perform a throwing action at the throwing position to ensure that it is The suction nozzle is clean at the suction position.

The entire mechanism needs to cooperate closely in speed, position and time to complete high-speed and high-precision coordinated actions;

2.1 Material supply preparation: The material is placed in the material supply system, the coordinate position is confirmed optically, (or the coordinate file of the previous process is read) to obtain the overall material coordinate information. If there are dead pixels or materials that need to be skipped, mark them at this time. Do not draw in subsequent draw steps

2.2 Preparation of the placed part: The placed part adopts optical MARK alignment to obtain accurate coordinate information.

2.3 Feeding take-off and stop: Because the friction between the feeding material and the tray is limited, in order to prevent the material position from changing, the feeding system needs a relatively long distance to take off and stop before starting and stopping to ensure the feeding position Does not tip over.

2.4 Take-off and stop of the placed materials: There is a sticky substance between the bottom of the placed materials, so the take-off and stop distances are relatively easy to control.

2.5 Production process: Ensure that the linear velocity of the rotation point (1) as shown in Figure 3 is equal to the linear velocity of the material supply platform in the X direction. Within a limited time range, the suction nozzle can quickly absorb the material, and then follow the rotating head Arrive at the angle setting position (2), rotate at the position (3) to take pictures, rotate at the position (4) to adjust the angle, when the rotate reaches the position (5), because the placement position is equal to the linear velocity of the rotating head in the X direction, The patching action is completed in a short time. Rotate to reach position (6) to do the angle zeroing action, rotate to reach position (7) to confirm that there is no debris in the nozzle or the material is not placed, and rotate to reach position (8) to do a throwing action. The entire production is completed.

2.6 Reversing process: Because the X direction needs to move in the reverse direction during the reversing process, the entire rotating axis also needs to move in reverse. Therefore, after the last suction position is accurately calculated, the placement platform decelerates and then moves in the reverse direction. The rotation axis also runs in the reverse direction, and positions 1 to 8 are adjusted accordingly.

3 Theoretical calculation of movements

3.1 Speed control: Angular velocity ω, rotating table radius R, circumferential linear velocity Vr= ω*R, as long as ω is constant, the circumferential linear velocity can be kept constant.

3.2 Mounting accuracy range control. In motion angle 2*d

Within the range, the accuracy can be guaranteed dx=±R*sin(d

). For example, if the control accuracy is in the range of 20um and the radius R=25mm, then d

<0.05゜ can guarantee accuracy. The smaller the radius, the higher the accuracy and the smaller the required linear velocity.

Similarly, in order to ensure the mounting speed, a very fast linear speed is required. For example, 20 parts need to be mounted per second, and the distance between each part is 0.25mm, and the moving distance is 5.0mm per second. For a circle with a radius of 25mm,

… ω=60* d/(2*R*π)=5/(2*25*3.14)=2rpm, linear speed 5.0mm/s In other words, the angular speed is 2 rpm, which is 2 revolutions per minute.

However, there are more than 60 nozzle positions on the turret, 20 points need to be mounted per second, and need to rotate 60*20/60=20rpm. The linear velocity of a circle with a radius of 25mm is (2*25*π*20/60 ) = 52.333mm/s, so in fact, in order to meet the requirements of linear speed, it needs to be pasted at 10 points between the placement positions, and then pasted repeatedly.

The present application also provides a high-speed patch transfer device, which includes:

An embodiment of the present invention also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program makes the computer execute any of the high-speed patch transfers described in the above method embodiments Part or all of the steps of the method.

The embodiment of the present invention also provides a computer program product, the computer program product includes a non-transitory computer-readable storage medium storing a computer program, the computer program is operable to cause a computer to execute the method described in the above method embodiment Part or all of the steps of any high-speed patch transfer method.

It should be noted that for the foregoing method embodiments, for the sake of simple description, they are all expressed as a series of action combinations, but those skilled in the art should know that the present invention is not limited by the described sequence of actions. Because according to the present invention, certain steps can be performed in other order or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily required by the present invention.

In the above-mentioned embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in an embodiment, reference may be made to related descriptions of other embodiments.

In the several embodiments provided in this application, it should be understood that the disclosed device may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in the various embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The above-mentioned integrated unit can be realized in the form of hardware or software program module.

If the integrated unit is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer readable memory. Based on this understanding, the technical solution of the present invention essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, It includes several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disks, magnetic disks or optical disks and other media that can store program codes.

Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above-mentioned embodiments can be completed by instructing relevant hardware through a program. The program can be stored in a computer-readable memory, and the memory can include: flash disk , Read-only memory (English: Read-Only Memory, abbreviation: ROM), random access device (English: Random Access Memory, referred to as: RAM), magnetic disk or CD-ROM, etc.

The embodiments of the present invention are described in detail above, and specific examples are used in this article to illustrate the principles and implementation of the present invention. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; Persons of ordinary skill in the art, based on the idea of the present invention, will have changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as limiting the present invention.

Claims

A high-speed patch transfer method, characterized in that the method includes the following steps:

Obtain the linear velocity v of the material platform, the placement speed v, the coordinates of the material, and the placement coordinates;

Determine the rotational angular velocity ω of the central rotating mechanism according to the linear velocity v; ω=v/r; where r is the radius of the central rotating mechanism;

The coordinate of the material is sucked at a constant rotational angular velocity ω, and the placement is completed when the placement coordinate is reached.
The method according to claim 1, characterized in that, before the method reaches the placement coordinates and completes the placement, the method further comprises:

Obtain the image information of the material, and adjust the position of the material according to the image information.
The method according to claim 2, wherein the adjusting the position of the material according to the image information specifically comprises:

Obtain the position image information of the corresponding material, quickly analyze the image information, and provide position offset adjustment parameters for the target position.
The method of claim 1, wherein the method further comprises:

After the placement is complete, the nozzle angle returns to zero.
The method of claim 1, wherein the method further comprises:

Obtain the taken picture of the second camera position, and determine whether there is a foreign body on the nozzle. If there is a foreign body on the nozzle, perform a throwing action at the throwing position.
A high-speed patch transfer device, characterized in that the device includes:

The acquisition unit is used to acquire the linear velocity v of the material platform, the placement speed v, the coordinates of the material, and the placement coordinates;

The control unit is used to determine the rotational angular velocity ω of the central rotating mechanism according to the linear velocity v; ω=v/r; where r is the radius of the central rotating mechanism;

The placement unit is used to suck the material at the coordinate of the material at a constant rotational angular velocity ω, and then the placement is completed when it reaches the placement coordinate.
The device according to claim 6, wherein the device further comprises:

The adjustment unit is used to adjust the position of the material according to the image information of the material.
The method according to claim 7, wherein:

The adjustment unit is specifically used to obtain position image information of the corresponding material, quickly analyze the image information, and provide position offset adjustment parameters for the target position.
The device according to claim 6, wherein:

The control unit is also used to, after the placement is completed, The nozzle angle returns to zero.
A computer-readable storage medium storing a program for electronic data exchange, wherein the program causes a terminal to execute the method provided in any one of claims 1-5.