CN109494173A - The manufacturing method of chip attachment device and semiconductor devices - Google Patents
The manufacturing method of chip attachment device and semiconductor devices Download PDFInfo
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- CN109494173A CN109494173A CN201811051542.6A CN201811051542A CN109494173A CN 109494173 A CN109494173 A CN 109494173A CN 201811051542 A CN201811051542 A CN 201811051542A CN 109494173 A CN109494173 A CN 109494173A
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- 239000004065 semiconductor Substances 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 11
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- 238000000034 method Methods 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 31
- 238000003745 diagnosis Methods 0.000 claims description 11
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- 239000004615 ingredient Substances 0.000 claims 2
- 230000007246 mechanism Effects 0.000 abstract description 4
- 230000009471 action Effects 0.000 description 31
- 238000001514 detection method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
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- 238000009434 installation Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
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- 238000003860 storage Methods 0.000 description 4
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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Abstract
The present invention provides the chip attachment device for having the mechanism detected to the exception of mounting head etc..Chip attachment device has: bare chip supply unit；Substrate supply unit；The bare chip supplied from the bare chip supply unit is mounted on the substrate supplied from the substrate supply unit or mounted onto the bare chip of the substrate by attachment portion；And control unit, control bare chip supply unit, substrate supply unit and attachment portion.The attachment portion has: mounting head has the collet chuck for adsorbing the bare chip；Driving portion has the drive shaft for keeping the mounting head mobile；And sensor, it is able to detect the angular speed and acceleration of the mounting head.The control unit uses the result obtained by the sensor to be compared vibration displacement with the threshold value of preset vibration displacement, to judge abnormal.
Description
Technical field
The present invention relates to chip attachment device, the chip attachment device that can be suitable for having such as gyro sensor.
Background technique
In a part of the manufacturing process of semiconductor devices, exist semiconductor chip (hreinafter referred to as bare chip
(die).) it is equipped on (the hreinafter referred to as substrates such as circuit board, nead frame.) and to the process that encapsulation is assembled, right
There are following process in the process that encapsulation is assembled: from semiconductor wafer (hreinafter referred to as chip.) segmentation bare chip work
Sequence；The attachment process bare chip being partitioned into being equipped on substrate.Manufacturing device used in attachment process is chip patch
The chip attachment devices such as installation (die bonder).
Chip attachment machine is that bare chip attachment (is carried and glued using scolding tin, plating material, resin as grafting material
Connect) in substrate or by the device on mounted bare chip.In the chip patch that bare chip is mounted on to the surface of such as substrate
In installation, repeat to act (operation) as follows: being inhaled bare chip from chip using the adsorption mouth for being referred to as collet chuck (collet)
It is attached and pick up, it is conveyed on substrate, applies pressing force, and heat to grafting material, to be mounted.Collet chuck installation
In the top of mounting head.Mounting head is driven by the driving portion (servo motor) of ZY drive shaft etc., and servo motor is filled by motor control
Set control.
In servo motor control, in order to avoid the unit to workpiece, bearing workpiece brings mechanical shock, need smoothly
Acceleration and deceleration and keep workpiece mobile.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2012-175768 bulletin
In the chip attachment device such as chip attachment machine, placement accuracy etc. is made to improve and require the product product produced by device
The stabilization of matter.On the other hand, chip attachment device in order to improve productivity ratio, makes pick-up head, mounting head high speed motion, therefore, by
Increase in mechanical load, vibration and lead to plant failure, the risk that generates substandard products etc. improves.
But, there is currently following problems: not grasping the movement locus, vibration of mounting head etc. accurately in device operating
It moves and detects abnormal mechanism in advance.
Summary of the invention
The issue of the present invention is to provide a kind of chip attachment devices of abnormal mechanism for having detection mounting head etc..
Other projects and new feature become apparent according to the narration content and attached drawing of this specification.
If simpling illustrate the summary of the representative structure in the present invention, as described below.
That is, chip attachment device has: bare chip supply unit；Substrate supply unit；Attachment portion will be supplied from the bare chip
The substrate supplied from the substrate supply unit is mounted on to the bare chip that portion supplies or has mounted the bare chip to the substrate
On；And control unit, control bare chip supply unit, substrate supply unit and attachment portion.The attachment portion has: mounting head,
It has the collet chuck for adsorbing the bare chip；Driving portion has the drive shaft for keeping the mounting head mobile；And sensor,
Its angular speed for being able to detect the mounting head and acceleration.The control unit uses the result obtained by the sensor to vibration
Dynamic displacement is compared with the threshold value of preset vibration displacement, to judge abnormal.
Invention effect
According to said chip mounting device, it is able to detect the exception based on vibration.
Detailed description of the invention
Fig. 1 is the approximate vertical view for indicating the structure of chip attachment machine of embodiment.
Fig. 2 is the outline structure of the chip attachment machine of explanatory diagram 1 and its figure of movement.
Fig. 3 is the block diagram for indicating the schematic configuration of the control system of chip attachment machine of Fig. 1.
Fig. 4 is the composition block diagram of the basic principle of the controller for motor for explanatory diagram 3.
Fig. 5 is the figure for illustrating the detection direction of angular speed and acceleration of gyro sensor.
Fig. 6 is the figure for illustrating the installation site of gyro sensor.
Fig. 7 is the figure for illustrating the vibration of X-axis direction of rotation of mounting head.
Fig. 8 is the figure for illustrating the driving direction and Z axis angular speed of mounting head.
Fig. 9 is the angular speed waveform and the figure of rotation angle in the state of explanatory diagram 8.
Figure 10 is the figure for illustrating the driving direction and Y-direction acceleration of mounting head.
Figure 11 is the figure of Acceleration pulse in the state of explanatory diagram 10, acceleration instructional waveform and difference acceleration.
Figure 12 is the figure for illustrating difference speed and displacement.
The synthesis of the vibration displacement of the vibration displacement and Y-direction of X-direction when Figure 13 is the Y-direction driving for illustrating mounting head
The figure of waveform.
Figure 14 is the figure of the example of the maximum displacement for illustrating 3 axis directions and the maximum displacement of 3 axis direction of rotation.
Figure 15 is the fluctuation for illustrating vibration displacement and the figure of threshold value.
Figure 16 is the flow chart for illustrating the manufacturing method of semiconductor devices.
Figure 17 is Acceleration pulse, speed and the figure of position in the state of explanatory diagram 10.
Figure 18 is the figure for illustrating the installation site of gyro sensor of variation 2.
Figure 19 is the figure for illustrating the abnormality judgment method of variation 3.
Description of symbols
10: chip attachment machine
1: bare chip supply unit
11: chip
13: jacking up unit
2: pickup section
21: pick-up head
3: intermediate microscope carrier portion
31: intermediate microscope carrier
4: attachment portion
41: mounting head
8: control unit
83e: controller for motor
210: motion controller
211: ideal waveform generating unit
212: instructional waveform generating unit
213:DAC
214: remarkable action diagnostics division
220: servo amplifier
221: speed ring control unit
230: servo motor
D: bare chip
S: substrate
Specific embodiment
In embodiments, it using the angular speed and acceleration of the mounting head in sensor detection operation, grasps current
Movement locus, also, be compared with motor command acceleration waveform, the vibrational waveform accumulated in past movement, thus
It is able to carry out the abnormity diagnosis of mounting head movement.
Hereinafter, being illustrated using attached drawing to embodiment and variation.Wherein, in the following description, sometimes to phase
Same reference numerals are marked with constituent element, and the repetitive description thereof will be omitted.
[embodiment]
Fig. 1 is the top view for indicating the outline of chip attachment machine of embodiment.Fig. 2 is seen from the direction arrow A in Fig. 1
Illustrate the figure of the movement of pick-up head and mounting head when examining.
Chip attachment machine 10 is substantially distinguished and includes bare chip supply unit 1, and supply, which will be installed on, is printed with one or more
A product area (hereinafter referred to as packaging area P for eventually becoming an encapsulation.) substrate S on bare chip D；Pickup section 2；
Intermediate microscope carrier portion 3；Attachment portion 4；Delivery section 5；Substrate supply unit 6；Substrate output section 7；And control unit 8, to each section
Movement is monitored and is controlled.Y direction is the front-rear direction of chip attachment machine 10, and X-direction is left and right directions.Naked core
Piece supply unit 1 is configured at the nearby side of chip attachment machine 10, and attachment portion 4 is configured at inboard.
Firstly, bare chip supply unit 1 supplies the bare chip D that be installed on the packaging area P of substrate S.Bare chip supply unit 1
Chip holding station 12 is included, chip 11 is kept；The jack-up unit 13 being represented by dotted lines jacks up bare chip D from chip 11.
Bare chip supply unit 1 is moved using driving mechanism (not shown) along the direction XY, makes the bare chip D to be picked up to jack-up unit 13
Position is mobile.
Pickup section 2 includes pick-up head 21, picks up bare chip D；The Y driving portion 23 of pick-up head, makes pick-up head 21 along Y
Direction is mobile；Each driving portion (not shown) makes the lifting of collet chuck 22, rotation and moves in X direction.Pick-up head 21 has will be by
The bare chip D absorption of jack-up is held in the collet chuck 22 (also referring to Fig. 2) on top, picks up bare chip D from bare chip supply unit 1, and
It is placed in intermediate microscope carrier 31.Pick-up head 21 has and makes the lifting of collet chuck 22, rotation and move in X direction (not shown) each
Driving portion.
Intermediate microscope carrier portion 3 includes intermediate microscope carrier 31, temporarily loads bare chip D；Microscope carrier identifies camera 32, is used for
Identify the bare chip D on intermediate microscope carrier 31.
Bare chip D picks up from intermediate microscope carrier 31 in attachment portion 4, and bare chip D is mounted on to the encapsulation for the substrate S that conveying comes
On the P of region, or mounted in the mode on the bare chip that is laminated on the packaging area P for having mounted substrate S.Attachment portion
4 include mounting head 41, have in the same manner as pick-up head 21 bare chip D absorption being held in the collet chuck 42 on top (also referring to figure
2)；Y driving portion 43 moves mounting head 41 along Y-direction；Camera 44 is identified with substrate, to the packaging area P of substrate S
Position recognition mark (not shown) shot, identify mounting position.
It utilizes such structure, photographed data of the mounting head 41 based on microscope carrier identification camera 32 is to take-off location, posture
It is corrected, picks up bare chip D from intermediate microscope carrier 31, the photographed data based on substrate identification camera 44 mounts bare chip D
In substrate.
Delivery section 5 has the transport path 52 of the substrate conveying claw 51 for holding conveying substrate S and substrate S movement.Substrate S
By using the ball-screw (not shown) being arranged along transport path 52 to the substrate conveying claw 51 for being set to transport path 52
Nut (not shown) is driven and is moved.
It utilizing such structure, substrate S is moved to mounting position along transport path 52 from substrate supply unit 6, after attachment,
It is moved to substrate output section 7, substrate S is consigned into substrate output section 7.
Control unit 8 has: memory, and preservation is monitored and controlled to the movement of each section of chip attachment machine 10
The program (software) of system；With central processing unit (CPU), the program for being stored in memory is executed.
Chip attachment machine 10 includes wafer identification camera 24, identifies the posture of the bare chip D on chip 11；Microscope carrier
Identify camera 32, identification is placed into the posture of the bare chip D of intermediate microscope carrier 31；And substrate identifies camera 44,
Identify the installation site on mounting stage BS.Must carry out the posture deviation correction between identification camera is participated in by mounting head 41
The mounted substrate identification to installation site that the microscope carrier identification camera 32 of the pickup of progress and participation are carried out from mounting head 41
Camera 44.
Control unit 8 is illustrated using Fig. 3.Fig. 3 is the block diagram for indicating the schematic configuration of control system.Control system
80 have control unit 8, driving portion 86, signal section 87 and optical system 88.Control unit 8 is substantially distinguished and is mainly had by CPU
Control arithmetic unit 81, the storage device 82, input and output of (central processing unit, Central Processor Unit) composition
Device 83, bus 84 and power supply unit 85.Storage device 82 includes main storage means 82a, by being stored with processing routine etc.
RAM constitute；It is constituted with the HDD of auxilary unit 82b, control data, image data needed for being stored with control etc..
Input/output unit 83 includes monitor 83a, display device state, information etc.；Touch panel 83b, input operator's
Instruction；Mouse 83c, operation monitor；And image acquiring device 83d, obtain the image data from optical system 88.
In addition, input/output unit 83 includes controller for motor 83e, control bare chip supply unit 1 XY microscope carrier (not shown),
The driving portion 86 of the ZY drive shaft of mounting head microscope carrier etc.；With I/O signal control device 83f, from various sensors, lighting device
Deng the signal sections 87 such as switch obtain or control signal.It include wafer identification camera 24, microscope carrier identification in optical system 88
Camera 32, substrate identify camera 44.It controls arithmetic unit 81 and obtains the data needed via bus 84, carry out operation, into
The control of row pick-up head 21 etc. sends information to monitor 83a etc..
Control unit 8 will be by wafer identification camera 24, microscope carrier identification camera 32 and base via image acquiring device 83d
Plate identification camera 44 shoots obtained image data and is stored in storage device 82.Based on the image data saved and utilize volume
The software of journey, and positioning and the bare chip of the packaging area P of bare chip D and substrate S are carried out using arithmetic unit 81 is controlled
The surface inspection of D and substrate S.Position based on the packaging area P for controlling bare chip D and substrate S that arithmetic unit 81 is calculated
Driving portion 86 is moved via controller for motor 83e using software.The positioning of the bare chip on chip is carried out using the technique,
Make its movement using the driving portion of pickup section 2 and attachment portion 4, bare chip D is mounted on the packaging area P of substrate S.It is used
Wafer identification camera 24, microscope carrier identification camera 32 and substrate identification camera 44 be tonal gradation camera, colour
Camera etc., by Optical power values.
Fig. 4 is the composition block diagram for the basic principle of the controller for motor of explanatory diagram 3.Controller for motor 83e tool
Received shipment movement controller 210 and servo amplifier 220 control servo motor 230.Motion controller 210, which has, preferably to be referred to
Enable ideal waveform generating unit 211, the instructional waveform generating unit 212, DAC (digital analog converter, Digital of the generation processing of waveform
To Analog Converter) 213 and remarkable action diagnostics division 214.Servo amplifier 220 has speed ring control unit
221。
As shown in figure 4, the motion controller 210 and servo amplifier 220 of controller for motor 83e become closed-loop control.
Thus, using the current location of instruction and the physical location and actual speed that are obtained from servo motor 230, by servo amplifier
220 speed ring control unit 221 carries out speed control.Wherein, speed ring control unit 221 passes through by 210 one side of motion controller
It obtains actual speed and physical location from servo motor 230 and limits acceleration, regenerate instructional waveform on one side, thus
Carry out its speed control.In addition, ideal waveform generating unit 211 and instructional waveform generating unit 212 are by such as CPU (central processing list
Member, Central Processing Unit) and the memory of program performed by CPU is kept to constitute.
For example, in Fig. 4, target position, target velocity, aimed acceleration and target acceleration are to motion controller
210 provide.Moreover, physical location and actual speed are as code device signal via servo amplifier 220 or from servo motor
230 directly sequentially input to instructional waveform generating unit 212.
The ideal waveform generating unit 211 of motion controller 210 according to from control arithmetic unit 81 input acceleration, plus
Speed, speed and the target value of position generate (a) respectively and instruct acceleration waveform (JD), (b) command acceleration waveform
(AD), (c) command speed waveform (VD), (d) location of instruction waveform (PD).Ideal waveform generating unit 211 will instruct acceleration
Waveform (JD), command acceleration waveform (AD), command speed waveform (VD), location of instruction waveform (PD) are to instructional waveform generating unit
212 outputs, and command acceleration waveform (AD) is exported to remarkable action diagnostics division 214.
Instructional waveform generating unit 212 is based on the signal output waveform exported from ideal waveform generating unit 211 (from ideal position
The current location of instruction that the instructional waveform set obtains) and from the code device signal (physical location) that servo motor 230 inputs,
Acceleration is limited on one side, is successively regenerated command speed waveform from now on one side and is sequentially output to DAC 213.For example, referring to
Waveform generating unit 212 is enabled to carry out (1) instructional waveform input and output processing, (2) code device signal counting processing and (3) instruction
Waveform regeneration processing.
The instruction value of the number inputted is converted into the speed value of analog signal by DAC 213, to servo amplifier
220 speed ring control unit 221 exports.In addition, code device signal is inclined by position using code device signal counter (not shown)
Residual quantity is accumulated as pulse.
The speed ring control unit 221 of servo amplifier 220 according to the speed value inputted from motion controller 210 and from
The code device signal that servo motor 230 inputs controls the rotation speed of servo motor 230.
Servo motor 230 is with the control phase with the rotation speed inputted from the speed ring control unit 221 of servo amplifier 220
The rotation speed rotation answered, the speed ring control using physical location and actual speed as code device signal to servo amplifier 220
The output of the instructional waveform generating unit 212 of portion 221 processed and motion controller 210.
In addition, in the fig. 4 embodiment, calculating patch from the count value (number of revolutions and rotation angle) of servo motor 230
The physical location for filling first-class driven member calculates actual speed based on the physical location calculated.It is however also possible to be, have
The position detecting device for directly detecting the position of driven member, is set as actual bit for position detected by the position detecting device
It sets.
Remarkable action diagnostics division 214 obtains angular speed and XYZ directional acceleration signal from gyro sensor 45, with instruction
Waveform is compared, and extracts vibration displacement.Remarkable action diagnostics division 214 believes abnormality detection in the case where detecting exception
Number to instructional waveform generating unit 212 export, stop servo motor.
Using Fig. 5~7 come to gyro sensor installation site and angular speed, acceleration detection method be illustrated.
Fig. 5 is the figure for indicating the detection direction of angular speed and acceleration of gyro sensor.Fig. 6 is the peace for indicating gyro sensor
The figure of holding position.Fig. 7 is the figure for indicating the vibration of X-axis direction of rotation of mounting head.
Gyro sensor 45 is passed using the 6 axis gyroscopes for being able to carry out the detection of 3 axis angular rates and the detection of 3 axle accelerations
Sensor.As shown in figure 5, the angular speed of gyro sensor 45 and detection (vibration detection) direction of acceleration are that the direction Ax:X adds
Speed (G), Ay:Y directional acceleration (G), Az:Z directional acceleration (G), Gx:X axis angular rate (deg/s), Gy:Y axis angular rate
(deg/s), Gz:Z axis angular rate (deg/s).
As shown in fig. 6, the drive with the X-direction, Y-direction, Z-direction of driving mounting head 41 is arranged in gyro sensor 45
(hreinafter referred to as mounting head center near the center O of the close mounting head 41 of the intersection point of moving axis.).For example, X-direction, the side Y
It is located at the back side (back side of attached drawing) of mounting head 41 to the intersection point of the drive shaft of, Z-direction, center O is the center of gravity of mounting head 41.Top
Spiral shell instrument sensor 45 is set to the table side (the nearby side of attached drawing) of mounting head 41.Thus, gyro sensor 45 is located at than the side X
It is known as being located in mounting head by position nearby to, the center O of Y-direction, the intersection point of the drive shaft of Z-direction and mounting head 41
The heart.It can be extracted according to the difference between the Acceleration pulse that gyro sensor 45 obtains and motor command acceleration waveform
The vibrational waveform of mounting head.
In addition, as shown in fig. 7, also can accurately grasp the direction of rotation of mounting head 41 using gyro sensor 45
It vibrates (Gx).
The abnormality diagnostic sequence of mounting head is illustrated using Fig. 8~15.Fig. 8 is the driving side for indicating mounting head
To the figure with Z axis angular speed.Fig. 9 is the figure of the angular speed waveform and rotation angle in the state of indicating Fig. 8, and (A) of Fig. 9 is table
Show that the figure of the angular speed waveform of Z axis direction of rotation, (B) of Fig. 9 are obtained from indicating that the waveform to Fig. 9 (A) integrates
Rotate the figure of angle waveform.Figure 10 is the figure for indicating the driving direction and Y-direction acceleration of mounting head.Figure 11 indicates Figure 10
The figure of Acceleration pulse, acceleration instructional waveform and difference acceleration under state, (A) of Figure 11 are to indicate that Y-direction adds
The figure of velocity wave form, (B) of Figure 11 are the figures for indicating the acceleration instructional waveform of Y-direction, and (C) of Figure 11 indicates Figure 11
(A) with the figure of the difference waveform of the waveform of (B) of Figure 11.Figure 12 is the figure for indicating difference speed and displacement, and (A) of Figure 12 is table
Show the figure of the difference velocity wave form of Y-direction obtained from the waveform to (C) of Figure 11 integrates, (B) of Figure 12 is to indicate pair
The figure of the displacement waveform of Y-direction obtained from the waveform of (A) of Figure 12 is integrated.Figure 13 is to indicate that the Y-direction of mounting head is driven
The figure of the synthetic waveform of the vibration displacement of the vibration displacement and Y-direction of X-direction when dynamic.Figure 14 is the maximum for indicating 3 axis directions
The figure of the example of displacement and the maximum displacement of 3 axis direction of rotation.Figure 15 is the fluctuation for indicating vibration displacement and the figure of threshold value.
(a1) remarkable action diagnostics division 214 the angular velocity signal waveform obtained from gyro sensor 45 is integrated and
Find out the vibration displacement of direction of rotation.As shown in figure 8, measuring the angle of Z axis direction of rotation in the Y-direction driving of mounting head 41
Speed signal obtains the angular velocity signal waveform (Gz (deg/s)) of such Z axis direction of rotation shown in (A) of Fig. 9.To the Z axis
The angular velocity signal of direction of rotation is integrated, and calculates such Z axis rotation angle (deg) shown in (B) of Fig. 9, and find out Z axis
The vibration displacement of direction of rotation.Similarly, the vibration displacement and Y of the X-axis direction of rotation when Y-direction driving of mounting head 41 are found out
The vibration displacement of axis direction of rotation.
(a2) remarkable action diagnostics division 214 adds according to the acceleration signal waveform and instruction that are obtained by gyro sensor 45
The difference of velocity wave form extracts the waveform of the vibration component of mounting head 41, finds out vibration displacement.As shown in Figure 10, in mounting head
The acceleration signal that Y-direction is measured when 41 Y-direction driving, obtains the acceleration signal of such Y-direction shown in (A) of Figure 11
Waveform (Ay).Calculate the difference of such command acceleration waveform (AD) shown in (B) of the acceleration signal waveform (Ay) and Figure 11
Value calculates such difference shown in (C) of Figure 11 and accelerates waveform (Δ Ay).To the difference accelerate waveform (Δ Ay) integrated and
Calculate such difference speed (Δ Vy) shown in (A) of Figure 12.Moreover, being integrated to the difference speed (Δ Vy) and finding out figure
The vibration displacement (Dy) of such Y-direction shown in 12 (B).Similarly find out the X-direction when Y-direction driving of mounting head 41
The vibration displacement of vibration displacement and Z-direction.
(a3) vibration displacement of the remarkable action diagnostics division 214 according to the X-axis direction of rotation found out in above-mentioned (a1), Y-axis
The vibration displacement of direction of rotation and the vibration displacement of Z axis direction of rotation (3 axis direction of rotation) calculate the vibration of 3 axis direction of rotation
The synthetic waveform of displacement, according to the vibration displacement of the X-direction found out in (a2), the vibration displacement of Y-direction and Z-direction (3 axis
Direction) vibration displacement calculate 3 axis directions vibration displacement synthetic waveform.In order to be easy diagram in Figure 13, show
The synthetic waveform of X-direction vibration displacement and Y-direction vibration displacement when the Y-direction driving of mounting head 41.
(a4) synthetic waveform and 3 axis rotation sides of the remarkable action diagnostics division 214 from the vibration displacements of 3 axis directions of mounting head
To vibration displacement synthetic waveform, find out maximum displacement (MD) and 3 axis of the vibration displacement of 3 axis directions as shown in Figure 14
The maximum displacement (RMD) of the vibration displacement of direction of rotation.
(a5) remarkable action diagnostics division 214 repeatedly measures in (calculating) and the attachment found out in above-mentioned (a2) movement in advance
Vibration displacement the same waveform of synthetic waveform and find out and accumulate with (a4) same maximum displacement, and with common attachment
The vibration displacement that (calculating) is measured in above-mentioned (a2) in process is compared.
(a6) conjunction that in above-mentioned (a4) measures (calculating) of the remarkable action diagnostics division 214 in common attachment process
At the maximum displacement (MD) of 3 axis directions of waveform and at least one of the maximum displacement (RMD) of 3 axis direction of rotation more than Figure 15
In the case where shown such threshold value being previously set, signal is detected to 212 output abnormality of instructional waveform generating unit and makes servo
Motor 230 stops, and the case where remarkable action of mounting head 41 is shown in monitor 83a.
(a7) in abnormality detection, remarkable action diagnostics division 214 to be divided into X-direction, Y-direction, Z-direction and X-axis respectively
The determination of the action waveforms progress abnormal cause of direction of rotation, Y-axis direction of rotation, Z axis direction of rotation.
Then, it is said using manufacturing method of the Figure 16 to the semiconductor devices for the chip attachment machine for having used embodiment
It is bright.Figure 16 is the flow chart for indicating the manufacturing method of semiconductor devices.
Step S11: the wafer ring 14 that remain cutting belt 16 is accommodated in wafer case (not shown), to chip attachment machine 10
Input, the cutting belt 16 are pasted with the bare chip D being partitioned into from chip 11.Control unit 8 makes wafer ring 14 from filled with wafer ring
14 wafer case is supplied to bare chip supply unit 1.In addition, prepared substrate S, and inputted to chip attachment machine 10.Control unit 8 utilizes
Substrate S is installed on substrate conveying claw 51 by substrate supply unit 6.
Step S12: the bare chip that control unit 8 is partitioned into from die pick.
Step S13: control unit 8 makes picked up bare chip be equipped on substrate S or be laminated in the bare chip mounted
On.Control unit 8 makes the bare chip D picked up from chip 11 be placed in intermediate microscope carrier 31, using mounting head 41 from intermediate microscope carrier 31
Bare chip D is picked up again, is mounted on the substrate S that conveying comes.The abnormity diagnosis of above-mentioned mounting head is concurrently carried out with step S13.
Step S14: control unit 8 takes out the substrate S for being pasted with bare chip D using substrate output section 7 from substrate conveying claw 51.
From 10 output substrate S of chip attachment machine.
In embodiment, 6 axis gyro sensors are set to mounting head center.In mounting head movement, according to from 6 axis
The angular speed that gyro sensor obtains extracts the vibrational waveform of mounting head direction of rotation, also, according to from gyro sensor
The Acceleration pulse of acquirement and the difference of motor command acceleration waveform extract the vibrational waveform of mounting head.Basis is extracted
The displacement for the vibration that above-mentioned vibrational waveform calculates is compared with the displacement of the prior vibration for repeatedly measuring and accumulating, thus to working as
The vibration of preceding mounting head movement whether there is variation and be confirmed, the exception of detection device.In the vibration that this is measured
In the case that displacement has been more than the threshold value of prior imparting, device report is abnormal after stopping motor.By using above-mentioned function
Mounting head is acted, can be realized the abnormity diagnosis of mounting head.
According to embodiment, the vibration of mounting head will appreciate that.In addition, being passed by the way that gyroscope is arranged in mounting head immediate vicinity
Sensor also can accurately grasp the vibration of mounting head direction of rotation.
In addition, by motor command acceleration waveform with mounting head, the vibrational waveform accumulated in past movement into
Row compares, and whether the displacement to current vibration is that movement more than the threshold value of prior imparting judges, to be pasted
Fill the abnormity diagnosis of head.Thereby, it is possible to prevent plant failure, generation substandard products etc. in advance.
Direction of rotation is also included within to interior vibration displacement moreover, can calculate using 1 sensor.In addition, by
The vibration displacement of X, Y, Z-direction and X-axis, Y-axis, all directions of Z axis direction of rotation is divided into when abnormality detection, additionally it is possible to determine different
Normal reason.
< variation >
Hereinafter, illustrating several representative variations.In the explanation of variation below, for have with above-mentioned
The part of the same structure and function of the structure and function illustrated in embodiment can use the appended drawing reference with the above embodiments
Same appended drawing reference.Also, for the explanation of the part, above-mentioned reality technically can be suitably quoted in reconcilable range
Apply the explanation in example.In addition, all or part of of a part of the above embodiments and multiple variations technically not lance
It can be applicable in appropriately combinedly in the range of shield.
(variation 1)
Figure 17 is Acceleration pulse, speed and the figure of position in the state of indicating Figure 10, and (A) of Figure 17 is to indicate Y
The figure of the Acceleration pulse in direction, (B) of Figure 17 are to indicate Y-direction obtained from the waveform to Figure 17 (A) integrates
The figure of velocity wave form, (C) of Figure 17 are the position waveforms for indicating Y-direction obtained from the waveform to Figure 17 (B) integrates
Figure.
In embodiment, it is taken in the Y-direction driving of mounting head 41 according to from gyro sensor 45 in above-mentioned (a2)
The difference of the acceleration signal waveform and command acceleration waveform that obtain finds out the vibration displacement of Y-direction, but in variation 1, root
It is found out according to the difference of the movement locus and location of instruction waveform of mounting head 41.
(b1) remarkable action diagnostics division 214 is in the same manner as (a1) of embodiment, when finding out the Y-direction driving of mounting head 41
The vibration displacement of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation vibration displacement.
(b2) remarkable action diagnostics division 214 calculates attachment based on the acceleration signal waveform obtained from gyro sensor 45
First 41 movement locus.As shown in Figure 10, the acceleration signal that Y-direction is measured in the Y-direction driving of mounting head 41, is schemed
The acceleration signal waveform (Ay) of such Y-direction shown in 17 (A).The acceleration signal (Ay) of the Y-direction is integrated
And calculate the speed (Vy) of such Y-direction shown in (B) of Figure 17.Moreover, being integrated and being calculated to the speed (Vy) of the Y-direction
The position (Py) of such Y-direction shown in (C) of Figure 17 out, finds out the movement locus of Y-direction.Similarly, mounting head 41 is found out
Y-direction driving when X-direction movement locus and Z-direction movement locus.
(b3) remarkable action diagnostics division 214 is extracted according to the difference of calculated movement locus and location of instruction waveform (PD)
The waveform of the vibration component of mounting head 41 finds out the vibration displacement of the Y-direction when Y-direction driving of mounting head 41.Similarly, it asks
The vibration displacement of the vibration displacement of X-direction when the Y-direction driving of mounting head 41 and Z-direction out.
(b4) later processing is same as (a3) of embodiment later processing.
In variation 1, in the attachment close with the intersection point of the X-direction of driving mounting head, Y-direction, the drive shaft of Z-direction
6 axis gyro sensors are arranged in head immediate vicinity.In mounting head movement, according to fast from the angle that 6 axis gyro sensors obtain
Degree extracts the vibrational waveform of mounting head direction of rotation, also, calculates patch based on the Acceleration pulse obtained from gyro sensor
The movement locus for filling head extracts the vibrational waveform of mounting head according to the difference of movement locus and motor location of instruction waveform.To root
The displacement of the vibration calculated according to extracted above-mentioned vibrational waveform and the displacement for the vibration for repeatedly measuring and accumulating in advance are compared
Compared with being detected to the exception of device to confirm to the vibration of current mounting head movement with the presence or absence of variation.Herein
In the case that the displacement of secondary measured vibration has been more than the threshold value of prior imparting, device report is abnormal after stopping motor.
Mounting head is acted by using above-mentioned function, can be realized the abnormity diagnosis of mounting head.
(variation 2)
Figure 18 is the figure for indicating the installation site of gyro sensor of variation 2.
In embodiment, to X-direction, Y-direction, the Z-direction being set to gyro sensor 45 with driving mounting head 41
Drive shaft the close mounting head 41 of intersection point center O near situation be illustrated, but not limited to this, Neng Goushe
It is placed in the place that can be installed from the top of the collet chuck 42 of mounting head 41 to the sensor the upper end of mounting head 41.
As shown in figure 18, on the top on the top or collet chuck 42 that gyro sensor 45 is set to the collet chuck 42 of mounting head 41
In the case where near end, the vibration for influencing placement accuracy can be directly grasped.
In variation 2,6 axis gyro sensors are set near the collet chuck top or collet chuck top of mounting head.By
This, directly grasps the vibration (acceleration of acceleration signal (Ax) and Y-direction of X-direction when Y-direction drives for influencing placement accuracy
Spend signal), by being compared with the displacement for the vibration for repeatedly measuring and accumulating in advance, carry out the exception of detection device.
(c1) as shown in figure 18, the acceleration signal (Ax) of measurement X-direction and the side Y in the Y-direction driving of mounting head 41
To acceleration signal (Ay).
(c2) remarkable action diagnostics division 214 is according to the difference of the acceleration signal (Ay) and command acceleration waveform that are measured
The waveform for extracting the vibration component of mounting head 41, finds out the vibration displacement of Y-direction.Similarly, the Y-direction for finding out mounting head 41 is driven
The vibration displacement of X-direction when dynamic.
(c3) remarkable action diagnostics division 214 is according to the vibration displacement of the X-direction found out in above-mentioned (c2) and the vibration of Y-direction
Dynamic displacement, calculates the synthetic waveform of vibration displacement as shown in Figure 13.
(c4) remarkable action diagnostics division 214 finds out 2 axis sides according to the synthetic waveform of the vibration displacement of 2 axis directions of mounting head
To vibration displacement maximum displacement (MD).
(c5) repeatedly measurement (calculating) and the attachment accumulated and found out in above-mentioned (c4) in advance of remarkable action diagnostics division 214
The same waveform of the synthetic waveform of vibration displacement in movement, and being measured in process in above-mentioned (c3) is mounted with common
The vibration displacement of (calculating) is compared.
(c6) conjunction that in above-mentioned (c4) measures (calculating) of the remarkable action diagnostics division 214 in common attachment process
In the case that maximum displacement (MD) at 2 axis directions of waveform has been more than the threshold value being previously set as shown in Figure 15, to finger
It enables 212 output abnormality of waveform generating unit detection signal and stops servo motor 230, the case where by the remarkable action of mounting head 41
It is shown in monitor 83a.
(c7) in abnormality detection, remarkable action diagnostics division 214 be divided into respectively the action waveforms of X-direction, Y-direction into
The determination of row abnormal cause.
(variation 3)
Figure 19 is the figure for indicating the abnormality judgment method of variation 3.In order to be easy diagram in Figure 19, attachment is shown
The synthetic waveform of X-direction vibration displacement and Y-direction vibration displacement when first 41 Y-direction driving.
In embodiment and variation 1,2, there is the maximum displacement for synthetic waveform single threshold value to examine to carry out exception
Break but it is also possible to be following method: track and X-axis Y-axis Z in the direction the XYZ vibration displacement relative to the standard repeatedly measured
The track of axis direction of rotation vibration displacement at a distance in the case where, be judged as abnormal.In the method, without according to conjunction
Maximum displacement is found out at waveform.If will it is suitable for embodiments, as so following.In addition, variation 3 can also be suitable for becoming
Shape example 1,2.
(d1) remarkable action diagnostics division 214 similarly handle with (a1) of embodiment.
(d2) remarkable action diagnostics division 214 similarly handle with (a2) of embodiment.
(d3) remarkable action diagnostics division 214 similarly handle with (a3) of embodiment.
(d4) repeatedly measurement (calculating) and the attachment accumulated and found out in above-mentioned (d2) in advance of remarkable action diagnostics division 214
The same waveform of the synthetic waveform of vibration displacement in movement, and being measured in process in above-mentioned (d2) is mounted with common
The vibration displacement of (calculating) is compared.
(d5) in above-mentioned (d4) the synthesis of measurement (calculating) of the remarkable action diagnostics division 214 in common attachment process
In the case that waveform has been more than the threshold value being previously set as shown in Figure 19, examined to 212 output abnormality of instructional waveform generating unit
It surveys signal and stops servo motor 230, the case where remarkable action of mounting head 41 is shown in monitor 83a.
More than, the invention made by the present inventor is specifically illustrated based on embodiment, embodiment and variation, but
It is self-evident to be able to carry out various changes the present invention is not limited to above embodiment, embodiment and variation.
For example, in embodiment, illustrating the case where carrying out Y-axis driving to mounting head, but it can also be suitable for Z axis and drive
The case where.
In addition, in embodiment, the example that mounting head is provided with gyro sensor is illustrated, but and unlimited
Due to this, gyro sensor can also be set in pick-up head.
In addition, in embodiment, the displacement of vibration is found out to carry out abnormity diagnosis but it is also possible to be not only finding out vibration
Displacement and also frequency content etc. is determined with Fourier transformation etc., relative to past movement to the level of vibration of each frequency into
Row relatively carries out abnormity diagnosis.
Alternatively, it is also possible to be, installed in the mounting device bracket of mounting head microscope carrier, pick-up head microscope carrier (X, Y, Z driving portion)
Gyro sensor is arranged in portion, obtains the vibration data other than the vibration data of the movement based on each head, uses the number with each head
Difference between carries out abnormity diagnosis.
Alternatively, it is also possible to by each head it is static in vibration data be set as reference data.Thereby, it is possible to realize merely with base
In the analysis that the data of the movement of each head carry out, it is able to carry out the abnormity diagnosis of higher precision.
Alternatively, it is also possible to be, identify that gyro is arranged in camera, microscope carrier identification camera, wafer identification camera in substrate
Instrument sensor, the abnormal cause for produce in the case where placement accuracy exception is the movement of head or the exception of camera side
Diagnosis.
It in addition, having a pick-up head and a mounting head respectively in embodiment, but can also be more than two respectively.
In addition, having intermediate microscope carrier in embodiment, but can also be without intermediate microscope carrier.In this case, pick-up head and mounting head can
With dual-purpose.
In addition, being mounted in a manner of upward by the surface of bare chip in embodiment, but bare chip can also be picked up
Make afterwards bare chip table carry on the back overturning and mount the back side of bare chip in a manner of upward.In this case, may be used not
Intermediate microscope carrier is set.The device is known as flip-chip placement equipment.
Claims (14)
1. a kind of chip attachment device comprising:
Bare chip supply unit；
Substrate supply unit；
The bare chip supplied from the bare chip supply unit is mounted on the substrate supplied from the substrate supply unit by attachment portion
Or it mounts on the bare chip of the substrate；And
Control unit, control bare chip supply unit, substrate supply unit and attachment portion,
The attachment portion has:
Mounting head has the collet chuck for adsorbing the bare chip；
Driving portion has the drive shaft for keeping the mounting head mobile；And
Sensor is able to detect the angular speed and acceleration of the mounting head,
The control unit is using the result obtained by the sensor to the threshold value of vibration displacement and preset vibration displacement
It is compared, to judge abnormal.
2. chip attachment device according to claim 1, which is characterized in that
The sensor is set to the mounting head close with the intersection point of the X-direction of driving mounting head, Y-direction, the drive shaft of Z-direction
Immediate vicinity,
The control unit
(a) in mounting head movement, the direction of rotation of the mounting head is extracted according to the angular speed obtained from the sensor
Vibrational waveform；Also,
(b) attachment is extracted according to the difference of the Acceleration pulse and motor command acceleration waveform that obtain from the sensor
The vibrational waveform of head；
(c) by displacement to the vibration calculated according to the extracted vibrational waveform be based on repeatedly measuring and accumulating in advance
Vibration displacement and the threshold value that sets is compared, to be carried out to the vibration of current mounting head movement with the presence or absence of variation
Confirm and the exception of device is judged.
3. chip attachment device according to claim 1, which is characterized in that
The sensor is set to the patch close with the intersection point of the X-direction of the driving mounting head, Y-direction, the drive shaft of Z-direction
Head immediate vicinity is filled,
The control unit
(a) in mounting head movement, the direction of rotation of the mounting head is extracted according to the angular speed obtained from the sensor
Vibrational waveform, and calculate based on the Acceleration pulse obtained from the sensor the movement locus of the mounting head；
(b) vibration wave of the mounting head is extracted according to the difference of the movement locus of the mounting head and motor location of instruction waveform
Shape；
(c) by displacement to the vibration calculated according to the extracted vibrational waveform be based on repeatedly measuring and accumulating in advance
Vibration displacement and the threshold value that sets is compared, to be carried out to the vibration of current mounting head movement with the presence or absence of variation
Confirm and the exception of device is judged.
4. chip attachment device according to claim 1, which is characterized in that
The sensor is set to the lower part for the mounting head that the collet chuck is installed,
The control unit
(a) in mounting head movement, according to the Acceleration pulse and motor command acceleration waveform obtained from the sensor
Difference extracts the vibrational waveform of the mounting head；
(b) by displacement to the vibration calculated according to the extracted vibrational waveform be based on repeatedly measuring and accumulating in advance
Vibration displacement and the threshold value that sets is compared, to be carried out to the vibration of current mounting head movement with the presence or absence of variation
Confirm and the exception of device is judged.
5. chip attachment device according to claim 1, which is characterized in that
The chip attachment device is also equipped with pickup section,
The pickup section has:
Pick-up head has the collet chuck for adsorbing the bare chip；
Driving portion has the drive shaft for keeping the pick-up head mobile；And
Second sensor is able to detect the angular speed and acceleration of the pick-up head,
The control unit uses the result obtained by the second sensor to vibration displacement and preset vibration displacement
Threshold value is compared, to judge abnormal.
6. chip attachment device according to claim 2, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(a1) to the angular velocity signal and Z axis of the angular velocity signal of the X-axis direction of rotation measured, Y-axis direction of rotation
The angular velocity signal of direction of rotation is integrated respectively, calculates the vibration of the vibration displacement, Y-axis direction of rotation of X-axis direction of rotation
The vibration displacement of displacement and Z axis direction of rotation；
(b1) according to the difference of the Acceleration pulse of the X-direction, Y-direction and the Z-direction measured and command acceleration waveform
Value extracts the waveform of vibration component, calculates the vibration displacement of the vibration displacement of X-direction, the vibration displacement of Y-direction and Z-direction；
(c1) vibration displacement for the X-axis direction of rotation that will be calculated, the vibration displacement and Z axis of Y-axis direction of rotation are calculated
The first synthetic waveform that the vibration displacement of direction of rotation is synthesized into and by the vibration of the X-direction calculated
The second synthetic waveform that the vibration displacement of displacement, the vibration displacement of Y-direction and Z-direction is synthesized into；
(c2) vibration displacement of the X-axis direction of rotation, the vibration position of Y-axis direction of rotation are calculated according to first synthetic waveform
First maximum displacement of the vibration displacement of shifting and Z axis direction of rotation, calculates the X-direction according to second synthetic waveform
Second maximum displacement of the vibration displacement of vibration displacement, the vibration displacement of Y-direction and Z-direction；
(c3) first maximum displacement is carried out with the threshold value set based on the maximum displacement for repeatedly measuring and accumulating in advance
Compare, second maximum displacement is compared with the threshold value set based on the maximum displacement for repeatedly measuring and accumulating in advance
Compared with.
7. chip attachment device according to claim 3, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(a1) to the angular velocity signal and Z axis of the angular velocity signal of the X-axis direction of rotation measured, Y-axis direction of rotation
The angular velocity signal of direction of rotation is integrated respectively, calculates the vibration of the vibration displacement, Y-axis direction of rotation of X-axis direction of rotation
The vibration displacement of displacement and Z axis direction of rotation；
(b1) Acceleration pulse of the X-direction, Y-direction and the Z-direction that are measured is integrated, calculates X-direction, the side Y
To and Z-direction movement locus；
(b2) it is mentioned according to the difference of the movement locus and location of instruction waveform of the X-direction, Y-direction and the Z-direction that are calculated
The waveform for taking vibration component calculates the vibration displacement of the vibration displacement of X-direction, the vibration displacement of Y-direction and Z-direction；
(c1) vibration displacement for the X-axis direction of rotation that will be calculated, the vibration displacement and Z axis of Y-axis direction of rotation are calculated
The first synthetic waveform that the vibration displacement of direction of rotation is synthesized into and by the vibration of the X-direction calculated
The second synthetic waveform that the vibration displacement of displacement, the vibration displacement of Y-direction and Z-direction is synthesized into；
(c2) vibration displacement of the X-axis direction of rotation, the vibration position of Y-axis direction of rotation are calculated according to first synthetic waveform
First maximum displacement of the vibration displacement of shifting and Z axis direction of rotation, calculates the X-direction according to second synthetic waveform
Second maximum displacement of the vibration displacement of vibration displacement, the vibration displacement of Y-direction and Z-direction；
(c3) first maximum displacement is carried out with the threshold value set based on the maximum displacement for repeatedly measuring and accumulating in advance
Compare, second maximum displacement is compared with the threshold value set based on the maximum displacement for repeatedly measuring and accumulating in advance
Compared with.
8. chip attachment device according to claim 4, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(b1) it is extracted and is vibrated according to the difference of the Acceleration pulse of the X-direction, Y-direction measured and command acceleration waveform
The waveform of ingredient calculates the vibration displacement of X-direction and the vibration displacement of Y-direction；
(c1) conjunction for being synthesized into the vibration displacement of the X-direction calculated and the vibration displacement of Y-direction is calculated
At waveform；
(c2) maximum displacement of the vibration displacement of the X-direction and the vibration displacement of Y-direction is calculated according to the synthetic waveform；
(c3) maximum displacement is compared with the threshold value set based on the maximum displacement for repeatedly measuring and accumulating in advance.
9. chip attachment device according to claim 2, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(a1) to the angular velocity signal and Z axis of the angular velocity signal of the X-axis direction of rotation measured, Y-axis direction of rotation
The angular velocity signal of direction of rotation is integrated respectively, calculates the vibration of the vibration displacement, Y-axis direction of rotation of X-axis direction of rotation
The vibration displacement of displacement and Z axis direction of rotation；
(b1) according to the difference of the Acceleration pulse of the X-direction, Y-direction and the Z-direction measured and command acceleration waveform
Value extracts the waveform of vibration component, calculates the vibration displacement of the vibration displacement of X-direction, the vibration displacement of Y-direction and Z-direction；
(c1) vibration displacement for the X-axis direction of rotation that will be calculated, the vibration displacement and Z axis of Y-axis direction of rotation are calculated
The first synthetic waveform that the vibration displacement of direction of rotation is synthesized into and by the vibration of the X-direction calculated
The second synthetic waveform that the vibration displacement of displacement, the vibration displacement of Y-direction and Z-direction is synthesized into；
(c2) first synthetic waveform is carried out with the threshold value set based on the synthetic waveform for repeatedly measuring and accumulating in advance
Compare, second synthetic waveform is compared with the threshold value set based on the synthetic waveform for repeatedly measuring and accumulating in advance
Compared with.
10. chip attachment device according to claim 3, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(a1) to the angular velocity signal and Z axis of the angular velocity signal of the X-axis direction of rotation measured, Y-axis direction of rotation
The angular velocity signal of direction of rotation is integrated respectively, calculates the vibration of the vibration displacement, Y-axis direction of rotation of X-axis direction of rotation
The vibration displacement of displacement and Z axis direction of rotation；
(b1) Acceleration pulse of the X-direction, Y-direction and the Z-direction that are measured is integrated, calculates X-direction, the side Y
To the movement locus with Z-direction；
(b2) it is mentioned according to the difference of the movement locus and location of instruction waveform of the X-direction, Y-direction and the Z-direction that are calculated
The waveform for taking vibration component calculates the vibration displacement of the vibration displacement of X-direction, the vibration displacement of Y-direction and Z-direction；
(c1) vibration displacement for the X-axis direction of rotation that will be calculated, the vibration displacement and Z axis of Y-axis direction of rotation are calculated
The first synthetic waveform that the vibration displacement of direction of rotation is synthesized into and by the vibration of the X-direction calculated
The second synthetic waveform that the vibration displacement of displacement, the vibration displacement of Y-direction and Z-direction is synthesized into；
(c2) first synthetic waveform is carried out with the threshold value set based on the synthetic waveform for repeatedly measuring and accumulating in advance
Compare, second synthetic waveform is compared with the threshold value set based on the synthetic waveform for repeatedly measuring and accumulating in advance
Compared with.
11. chip attachment device according to claim 4, which is characterized in that
The sensor is to the angular speed and X-direction of X-axis direction of rotation, Y-axis direction of rotation and Z axis direction of rotation, Y-direction
And the acceleration of Z-direction is measured,
The control unit
(b1) it is extracted and is vibrated according to the difference of the Acceleration pulse of the X-direction, Y-direction measured and command acceleration waveform
The waveform of ingredient calculates the vibration displacement of X-direction and the vibration displacement of Y-direction；
(c1) conjunction for being synthesized into the vibration displacement of the X-direction calculated and the vibration displacement of Y-direction is calculated
At waveform；
(c2) synthetic waveform is compared with the threshold value set based on the synthetic waveform for repeatedly measuring and accumulating in advance.
12. a kind of manufacturing method of semiconductor devices, which is characterized in that the manufacturing method of the semiconductor devices has following work
Sequence:
(a) process prepares chip attachment device described in any one of claims 1 to 11；
(b) process, inputs chip annular keeper, which keeps the cutting belt for being pasted with bare chip；
(c) process prepares simultaneously input substrate；
(d) process picks up bare chip；
(e) bare chip picked up is mounted on the substrate or by mounted bare chip by process；With
(f) process carries out abnormity diagnosis using the measurement result of the sensor,
(f) process is parallel with (e) process and the measurement result based on the sensor detects the dynamic of the mounting head
The presence or absence of exception of the vibration of work.
13. the manufacturing method of semiconductor devices according to claim 12, which is characterized in that
In (d) process, the bare chip in the cutting belt is picked up using the mounting head,
In (e) process, the bare chip picked up using the mounting head is mounted on the substrate or is mounted
Bare chip on.
14. the manufacturing method of semiconductor devices according to claim 12, which is characterized in that
(d) process has following process:
(d1) process picks up the bare chip in the cutting belt using pick-up head；With
(d2) bare chip picked up using the pick-up head is placed in intermediate microscope carrier by process,
(e) process has following process:
(e1) process picks up the bare chip for being placed in the intermediate microscope carrier using mounting head；With
(e2) bare chip picked up using the mounting head is placed in the substrate by process,
(f) process and (d2) process be parallel and the measurement result based on second sensor detects the movement of the pick-up head
The presence or absence of exception of vibration.
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| JP2017173907A JP7102113B2 (en) | 2017-09-11 | 2017-09-11 | Manufacturing method of die bonding equipment and semiconductor equipment |
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| JP (1) | JP7102113B2 (en) |
| KR (1) | KR102100278B1 (en) |
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| WO2020227987A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市兴华炜科技有限公司 | High-speed surface mounting and transferring method and related product |
| CN116033675A (en) * | 2023-02-16 | 2023-04-28 | 深圳市乐祺微电子科技有限公司 | SMT material error correction system |
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Also Published As
| Publication number | Publication date |
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| TW201917818A (en) | 2019-05-01 |
| TWI697981B (en) | 2020-07-01 |
| JP2019050295A (en) | 2019-03-28 |
| KR20190029434A (en) | 2019-03-20 |
| KR102100278B1 (en) | 2020-04-13 |
| CN109494173B (en) | 2022-03-29 |
| JP7102113B2 (en) | 2022-07-19 |
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