JP2015173551A - Semiconductor manufacturing method and die bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die bonder and a semiconductor manufacturing method, which can reduce a control time even when a sufficient jerk command cannot be issued in order to inhibit oscillation in a travelling direction during operation.SOLUTION: A semiconductor manufacturing method comprises the steps of: generating each command waveform of an acceleration speed, a speed and a location from jerk data which has a huge effect on oscillation in a row direction; regenerating each next command waveform depending on a location deviation amount while limiting jerk constantly; correcting a control command value in a manner such that each command wavelength indicates a target value of a control command waveform to control a real location in real time. By doing this, oscillation and deviation with respect to a travelling direction when a motor is driven at high speed are minimized to achieve reduction in a control time.

Description

  The present invention relates to a control device and a motor control method for driving a servo motor used for moving a driven body in a machine tool or an industrial machine, and more particularly to a semiconductor manufacturing method and a die bonder using the same.

For example, as shown in FIG. 10, the conventional servo motor control device 100 is open-loop control when viewed from the motion controller, and uses the current command position, the actual position and the actual speed obtained from the motor 130. Thus, only the servo amplifier 120 (speed loop control unit 121 and position loop control unit 122) performs position and speed compensation. That is, when the target position speed is given to the control device 100, the command pulse train generation unit 112 sequentially outputs the position command value as a command pulse train to the servo amplifier 120 according to the output waveform 111 of the command speed waveform unit 110. In the servo amplifier 120, the position loop control unit 121 and the speed loop control unit 122 output a control signal to the motor 130 in response to the input position command value. That is, the motor 130 rotates according to the control signal, and the actual position and the actual speed are fed back to the position loop control unit 121 and the speed loop control unit 122 according to the rotation, and feedback control is performed.
In the above-described conventional technology, when the motor is operated at a high speed, the future command waveform cannot be grasped in the servo amplifier 120. For this reason, it is difficult to easily suppress vibration and settling time in the traveling direction. In addition, since the motor control is based on the accumulation pulse (or position deviation pulse or error pulse) method, it is difficult to operate with an ideal locus when performing synchronous control or the like.

  However, conventionally, in servo motor control, it is necessary to move the driven body by smoothly accelerating / decelerating it so as not to give mechanical shock to the driven body and the unit that supports the driven body.

  Therefore, in Patent Document 1, a command waveform is generated from jerk data that greatly influences vibration in the traveling direction, and a future command speed waveform is regenerated in real time by always limiting jerk according to the deviation amount. In this way, the actual position control is performed, thereby suppressing vibrations and deviations in the traveling direction when the motor operates at high speed, thereby reducing the control time.

JP 2012-175768 A

  However, in the control method of Patent Document 1, the control that increases the jerk that greatly affects the vibration in the traveling direction becomes unstable. Therefore, it has been found that the jerk cannot be set to a sufficient value, and as a result, a sufficient actual speed may not be obtained with respect to the target speed, and the control time becomes longer.

  In view of the above problems, an object of the present invention is to provide a motor capable of shortening the control time even if a sufficient jerk cannot be issued to suppress vibration in the traveling direction during operation. A semiconductor manufacturing method and a die bonder using a control device and a motor control method are provided.

  In order to achieve the above-described object, the die bonder and the semiconductor manufacturing method of the present invention generate acceleration, velocity, and position command waveforms from jerk data that greatly affect the vibration in the traveling direction, and according to the position deviation amount. , Regenerates each future command waveform while always limiting jerk, corrects the control command value so that it becomes the target value of the control command waveform of each command waveform, and controls the actual position in real time. This suppresses vibrations and deviations in the direction of travel when the motor operates at high speed, thereby realizing a reduction in control time.

  That is, the die bonder of the present invention inputs a target value that is an amplitude value of jerk, acceleration, speed, and position, and each of the ideal jerk command waveform, acceleration command waveform, speed from the start position to the target position. Position deviation for detecting a position deviation between the actual waveform position of the driven body obtained based on the rotation of the servo motor and the position command value of the ideal position command waveform. Based on the position deviation at each sampling interval, the control unit regenerates a control command value that forms a control command waveform out of the acceleration, velocity, and position command waveforms to obtain a control command regeneration value. A command waveform regenerator, and a die bonder that inputs the regenerated control command value to a servo amplifier, controls the driven body to the target position, and mounts the die on the workpiece; The control command value is corrected with a control correction command value that causes the amplitude value of the actual speed of the driven body obtained by inputting the control command value to the servo amplifier to approach the target value of the control command waveform. And a control command correcting unit that controls the driven body with the corrected control command value.

  Further, the semiconductor manufacturing method of the present invention inputs jerk, acceleration, velocity, and a target value that is a position amplitude value, and each of the ideal jerk command waveform and acceleration command waveform from the start position to the target position. Generating a speed command waveform and a position command waveform, detecting a position deviation between the actual position of the driven body obtained based on the rotation of the servo motor and the position command value of the ideal position command waveform, and at every sampling interval Based on the position deviation, a control command value that forms a control command waveform is regenerated from the acceleration, velocity, and position command waveforms to obtain a control command regenerated value, and the regenerated control command A semiconductor manufacturing method in which a value is input to a servo amplifier, the driven body is controlled to the target position, and a die is mounted on a work, and the control command value is input to the servo amplifier. The control command value is corrected with a control correction command value that causes the amplitude value of the actual speed of the driven body to approach the target value of the control command waveform, and the driven command is corrected with the corrected control command value. It is characterized by controlling the body.

  According to the present invention, a motor control device and a motor control method capable of shortening the control time even if a sufficient jerk cannot be issued to suppress vibration in the traveling direction during operation can be used. A semiconductor manufacturing method and a die bonder can be provided.

It is a figure explaining the subject of this invention and the basic principle of a motor control method using 1st Example 200 of the motor control apparatus and motor control method of this invention shown in FIG. FIG. 2A (a) shows the target speed and the actual speed when the speed command value is sequentially input to the servo amplifier based on the speed command value waveform generated by the ideal waveform generator based on the target speed and the like, and feedforward control is performed. FIG. FIG. 2A (b) is a diagram showing an ideal speed command waveform when the target speed in FIG. 2A (a) is V1 +. FIG. 2A (c) is a diagram showing an actual speed waveform obtained from the ideal speed command waveform shown in FIG. 2B. It is a figure which shows the processing flow for obtaining the data of FIG. 2A (a). FIG. 2A (a) when the speed command value is corrected based on the FF value obtained by the linear approximation of FIG. 2A (a), and sequentially input to the servo amplifier in the same manner as FIG. 2A (a), and feedforward control is performed. It is the figure which showed the relationship between the same target speed and real speed. It is a figure for demonstrating one Example of the ideal command waveform produced | generated by the ideal waveform production | generation part in the motion controller of the motor control apparatus of this invention. It is a figure for demonstrating the jerk addition waveform of one Example of the motor control apparatus of this invention. It is a block diagram which shows the structure of the 1st Example of the motor control apparatus of this invention. It is a block diagram which shows the structure of the 2nd Example of the motor control apparatus of this invention. It is a block diagram which shows the structure of the 3rd Example of the motor control apparatus of this invention. FIG. 6 is a diagram showing jerk waveforms, acceleration waveforms, and velocity waveforms added for compensation when the deviation amount is 1 pulse, 2 pulses, 4 pulses, 8 pulses, and 16 pulses when the present invention is implemented. is there. It is a flowchart for demonstrating the procedure of one Example of operation | movement of the motor control method of this invention. It is a figure for demonstrating the jerk upper / lower limit confirmation process operation | movement in one Example of the motor control apparatus and motor control method of this invention. It is a figure which shows one Example of the command waveform reproduced | regenerated after calculation of the jerk waveform for compensation in the motor control apparatus and motor control method of this invention. It is a figure which shows the die bonder which has a motor control apparatus of this invention. It is a block diagram which shows the structure of the conventional control apparatus.

  Hereinafter, embodiments of a die bonder using the motor control device and the motor control method of the present invention will be described. FIG. 9 is a conceptual view of the die bonder according to the tenth embodiment as viewed from above. The die bonder is roughly divided into a wafer supply unit 1, a work supply / conveyance unit 2, a die bonding unit 3, and a system control unit 7.

  The wafer supply unit 1 includes a wafer cassette lifter 11 and a pickup device 12. The wafer cassette lifter 11 has a wafer cassette (not shown) filled with wafer rings, and sequentially supplies the wafer rings to the pickup device 12. The pick-up device 12 moves the wafer ring so that the desired die can be picked up from the wafer ring.

The workpiece supply / conveyance unit 2 includes a stack loader 21, a frame feeder 22, and an unloader 23, and conveys a workpiece (a substrate such as a lead frame) in the direction of the arrow. The stack loader 21 supplies the workpiece to which the die is bonded to the frame feeder 22. The frame feeder 22 conveys the work to the unloader 23 through two processing positions on the frame feeder 22. The unloader 23 stores the conveyed work.
The die bonding unit 3 includes a preform unit (paste application unit) 31 and a bonding head unit 32. The preform portion 31 applies a die adhesive to the workpiece, for example, a lead frame, conveyed by the frame feeder 22 with a needle. The bonding head unit 32 picks up the die from the pickup device 12 and moves up to move the die to the bonding point on the frame feeder 22. Then, the bonding head unit 32 lowers the die at the bonding point, and bonds the die onto the workpiece coated with the die adhesive.

  The bonding head unit 32 includes a bonding head 35 and drive shafts 70, 40, and 50 that move the bonding head 35 in the X, Y, and Z directions.

The system control unit 7 is a host system control device that controls the entire movement of the die bonder and has a motor control device 200 therein.
The motor control device 200 controls the X, Y, and Z directions of the bonding head 35 as described above, controls the X, Y, and Z directions of the needle, controls the workpiece conveyance by the workpiece supply / conveyance unit 2, The present invention can also be applied to control in each of the X and Y directions of a work position recognition camera that recognizes the position of a work such as a substrate that has been transported, and set control of a wafer ring pickup device 12. The bonding head 35, the needle, the workpiece supply / conveyance unit 2, the workpiece position recognition camera, and the pickup device 12 are driven bodies.

  Next, the problem of the present invention and the basic principle of the motor control method will be described using the first embodiment 200 of the motor control apparatus and motor control method of the present invention shown in FIG. In the motor control device 200, the motion controller 210 and the servo amplifier 220 are closed loop control. The motion controller 210 includes an ideal waveform generation unit 211, a command waveform generation unit 212, an FF (feed forward) value correction unit 214 that is an example of a control command correction unit, and a DAC (Digital to Analog Converter) 213 that converts the analog signal. Have The servo amplifier 220 includes a speed loop control unit 221 that performs speed control based on a speed command value that is a control command value. Reference numeral 130 denotes a servo motor. The command waveform generation unit 212 is, for example, a CPU (Central Processing Unit). In FIG. 1, the same devices as those in FIG. 9 are denoted by the same reference numerals, and the description thereof is omitted.

  The ideal waveform generation unit 211 obtains ideal command waveforms as shown in FIG. 1 from the target values of jerk, acceleration, speed, and position input from the system control unit 7. (a) is an ideal jerk command waveform, (b) is an ideal acceleration command waveform, (c) is an ideal speed command waveform, and (d) is an ideal position command waveform. The term “ideal” is used to mean that the controlled object is controlled smoothly with a predetermined processing time by suppressing the vibration of the controlled object while limiting the jerk.

  As shown in FIG. 1, the command waveform generation unit 212 is based on the current command position obtained from the ideal position waveform generated in the motion controller 210 and the actual position obtained from the motor 130. The speed command waveform formed in 211 is sequentially regenerated while limiting jerk, and the regenerated speed command waveform is sequentially output to the FF value correction unit 214 as a speed command value.

The FF value correction unit 214 corrects the speed command value and inputs it to the servo amplifier 220.
The servo amplifier 220 performs feedback control based on the corrected speed command value to obtain the actual position and actual speed of the driven body.

  In the present embodiment shown in FIG. 1, the speed command waveform and the speed command value are the control command waveform and the control command value, respectively.

  The FF value correction unit 214, which is an example of the control command correction unit that is a feature of this embodiment, approaches the target speed input from the system control unit 7 shown in FIG. 9 among the speed waveforms obtained from the servo amplifier. Correct the speed command value.

  Hereinafter, the embodiment 200 of the motor control device of this embodiment will be described in detail based on an example applied to the die bonder 10 described in FIG. The die bonder 10 controls the bonding head 35 to pick up and raise a semiconductor chip (die) from the wafer, linearly moves in the Y direction to the top of the work to be mounted, and descends and mounts it on the substrate. After the mounting, the bonding head 35 is reversely operated to return to the pickup position. Then, implementation and return are repeated.

  In addition to FIG. 9, the die bonder includes an intermediate stage, in which a pickup head picks up a die from a wafer and places it on the intermediate stage, and a bonding head picks up the die from the intermediate stage and mounts it on a work.

In the following description, the linear movement control of the bonding head 35 in the Y direction will be described as an example.
The feature of the present embodiment with respect to the cited document 1 is that it includes an FF value correction unit 214 that corrects the speed command value formed by the command waveform generation unit 212.

First, in order to accurately understand the significance of the FF value correction unit 214, a method for controlling the motor while limiting the jerk of the bonding head 35 in FIG. 1 will be described.
For example, in FIG. 1, target values Job, Aobj, Vobj, and Pojj that are amplitude values of jerk, acceleration, speed, and position shown in FIG. 3 from the system control unit 7 shown in FIG. Are input to the ideal waveform generator 211. The target value Job of jerk is input when the controlled object does not vibrate (oscillate). The non-vibrating condition of jerk can be set if the driving system viewed from the motor is determined.

  For example, the command waveform generation unit 212 can smoothly move the bonding head 35 from the upper part of the pickup position as the starting position to the upper part of the mounting position as the target position within the predetermined processing time in the linear movement described above. 3, T1, T2, and T3 shown in FIG. 3 are determined, and a jerk waveform in one cycle is formed. Similarly, when moving from the upper part of the mounting position to the upper part of the pickup position, T1, T2, and T3 shown in FIG. 3 are determined, and a jerk waveform in one cycle is formed.

  If the jerk waveform is formed, the acceleration waveform, the velocity waveform, and the position waveform are formed by integrating at each stage as shown in FIG.

  After each waveform is formed, the mounting process is started. The bonding head 35 picks up the die and starts moving from the upper part of the pickup to the upper part of the mounting position. After the start of movement, a correction value for jerk up to the next sampling time is formed at every sampling time Ts based on a position encoder indicating position feedback from the servo amplifier 220. A series of speed command values are output to the servo amplifier 220 until the sampling time of the time. This is repeated up to the top of the mounting position. Detailed control operations will be described later.

First, the problem of the present invention and the solution in the first embodiment will be described.
As described in the section of the problem, it has been found that in the control method of Patent Document 1, the actual speed Vr corresponding to the target speed Vobj may not reach the target speed Vobj.

FIG. 2A (a) shows that the speed command value is sequentially input to the servo amplifier 220 based on the speed command value waveform generated by the ideal waveform generator 211 based on the target speed Vobj and the like, and open (feed forward: FF) control is performed. It is the figure which showed the relationship between the target speed and actual speed when doing. The reason for performing the FF control is that in the feedback (FB) control, the acceleration command value is locally corrected, and as a result, the speed command value that is the control command value is corrected to avoid the influence of fluctuation. . Of course, the control correction value of the speed command value may be obtained, for example, as the FB value by the FB control .

If the difference between the actual speed Vr and the target speed Vobj is large, the position deviation also increases, the amount of feedback (correction) to jerk increases, and the possibility that the motor transmits is increased. Therefore, during actual control operation, the jerk condition is not changed, and the FF value (control correction command value) that is the ratio between the two obtained by the equation (1) is added to the speed command value obtained from the command waveform generation unit 212. To get closer to the target speed command.
FF value = Vobj / Vr (1)
As a result, a desired speed can be ensured while suppressing vibration of the controlled object, processing can be performed within a predetermined time, and processing time by the bonding head can be shortened.

  FIG. 2B is a diagram showing a processing flow for obtaining the data of FIG. 2A (a). The data of FIG. 2A (a) is performed, for example, at a predetermined origin position of the bonding head 35 before starting the mounting process. Each value when moving away from the origin position is indicated by +, and each value when returning to the origin position is indicated by-.

  First, in step 201, a fixed distance Lg is determined from the origin position. In step 202, ideal command waveforms based on target values Job, Aobj, Vobj, and Pobj, which are amplitude values of jerk, acceleration, velocity, and position shown in FIG. 3, are generated from Lg and Vobj = V1 +.

In step 203, based on the ideal speed command waveform when Vobj = V1 +, the speed command value is sequentially input to the servo amplifier 220 at each sampling time, and open (FF) control is performed, and the actual position is determined from the encoder signal at that time. Is stored in a memory inside the command waveform generation unit 212. FIG. 2A (b) shows an ideal speed command waveform when the target speed of FIG. 2A (a) is V1 +.

  In step 204, the velocity is obtained from the position difference between sampling k-1 and k (k = 1... M) obtained in step 203. FIG. 2A (c) shows an actual speed waveform obtained from the ideal speed command waveform shown in FIG. 2B. The maximum value r1max + of the actual speed waveform indicated by the broken-line circle is the actual speed Vr1 + when the ideal speed command waveform is the target speed V1. In step 205, the FFV1 + value when moving from the origin direction is obtained from equation (1).

  In step 206, it is determined whether to perform the process in the reverse direction, that is, in the direction toward the origin. If so, the process from step 203 to step 205 is performed under the same conditions, and FFV1- is obtained in the same manner. If it has already been performed, in step 207, the average value in both directions (FFV1 +, FFV1-) is set as the FFV1 value at the target speed Vobj = V1.

  In Step 208, it is determined whether the target speed Vobj needs to be changed. If necessary, V2, V3,... Are changed in Step 209, and Steps 202 to 7 are changed to the FFV2 value, FFV3 at each target speed. Get the value ... In step 210, the average value of the FF values obtained at each target speed is set as the FF value for all speed command values.

  In the actual processing by the bonding head, the speed command value obtained by the command waveform generation unit 212 is corrected by the FF value correction unit 214 using the FF value obtained in step 210, and is input to the motor control device 200 to be speed feedback control. Is done.

In FIG. 2A (a), the FF value is obtained as a ratio to each of the four target speeds Vobj, that is, as a linear approximation. However, the number of measurement points may be one, two, three, or five or more. But you can. In the case of a plurality of locations, a curve approximation function may be used. Furthermore, the inclination angle θ of the actual speed in FIG. 2A (a) may be obtained, and the FF value may be obtained as a linear approximation according to equation (2).
FF value = 1 / tan θ (2)
FIG. 2C shows a case where the speed command value is corrected based on the FF value obtained by the linear approximation of FIG. 2A (a), and is sequentially input to the servo amplifier 220 as in FIG. 2A (a), and feedforward control is performed. It is the figure which showed the relationship between target speed Vobj and actual speed Vr. In FIG. 2C, there is still a deviation between the target speed Vobj and the actual speed Vr, so the FF value may be further corrected from the result of this figure.

  2A (a) and FIG. 2A (b) are the results for the same target speed Vobj, the cause of the difference between the target speed Vobj and the actual speed Vr is that the ideal waveform generator 211 and the command waveform generator 212 A mismatch between the control capabilities of the servo amplifier 220 and the driven body can be considered.

  In any case, as can be seen from FIG. 2C, the jerk Job can be maintained and the difference between the target speed V and the actual speed can be suppressed. As a result, the possibility that the bonding head to be controlled vibrates can be suppressed as much as possible, and the bonding processing time can be shortened.

Note that the control that is linearly moved in the Y direction as described above may be applied to the raising / lowering control of the bonding head 35 at the time of die pick-up and mounting.

  Next, the control method by the motor control device of the first embodiment shown in FIG. 1 will be described in more detail.

FIG. 4B is a diagram illustrating Example 1 of the motor control device of the present invention.
The target values JD (Job), AD (Aobj), VD (Vobj), PD (Pobj) which are amplitude values of jerk, acceleration, speed and position shown in FIG. ) Are respectively input to the motion controller 210. As the jerk target value Job, a value at which the controlled object does not vibrate (oscillate) is input. The non-vibrating condition of jerk can be set if the driving system viewed from the motor is determined.

  As described above, the ideal waveform generation unit 211 determines T1, T2, and T3 shown in FIG. 3 from each target value, and, for example, an ideal waveform for one cycle with respect to the movement distance from the upper position of the pickup to the upper position of the mounting position. (A) A jerk waveform is formed. The jerk waveform is gradually accelerated in the first period T1 from the start of movement of the motor driving the bonding head, is decelerated at a constant speed (period T2) in the central period T2, and is gradually decelerated in the period T3 approaching the final movement position. And is formed to stop. Then, the ideal waveform generator 211 sequentially integrates to generate ideal (b) acceleration waveform, (c) velocity waveform, and (d) position waveform, and output them to the command waveform generator 212.

  The command waveform generation unit 212 regenerates a future speed command waveform while limiting jerk according to the position signal output from the ideal waveform generation unit 211 and the encoder signal input from the motor 130, and the FF Sequentially output to the value correction unit 214. The command waveform generation unit 212 of the embodiment includes a command waveform input / output processing unit 410, a command waveform regeneration processing unit 420, and an encoder signal count processing unit 430 that is a position detection unit.

  The encoder signal count processing unit 430 receives an encoder signal from the motor 130 or via the servo amplifier 220 and always accumulates it as a pulse indicating the actual position.

  The command waveform input / output processing unit 410 inputs each waveform from the ideal waveform generation unit 211 before the start of processing, and the position PD′0 where the bonding head 35 should be in the Y direction at the time of sampling every sampling time Ts after the start of processing. Is obtained from the target position waveform. The position PD′0 is output to the command waveform regeneration processing unit 420 as the number of pulses having the position resolution of the encoder signal. Thereafter, the command waveform input / output processing unit 410 inputs and stores each command waveform up to the next sampling time Ts processed by the command waveform regeneration processing unit 420, and sequentially outputs the speed command waveform to the FF value correction unit. .

  The command waveform regeneration processing unit 420 receives the target command position PD′0 from the command waveform input / output processing unit 410, compares it with the actual position PA0 obtained from the encoder signal count processing unit 430, and uses the subtractor 421 for deviation. The quantity Perr is detected as the difference in the number of pulses.

  The jerk addition waveform generation unit 422 of the command waveform regeneration processing unit 420 generates the addition jerk waveforms C1 to Cn at the sampling interval Ts shown in FIG. 4A based on the position deviation amount Perr. In FIG. 4A, the added jerk waveform is formed in the same pattern as the jerk waveform shown in FIG. However, the width of each positive value and negative value and the interval between them are set to the same k. JC is an addition value, n (natural number) is the number of commands in the sampling interval Ts, and x (natural number) is the command position (1 ≦ x ≦ n) of n command times. Since the additive jerk waveform shown in FIG. 4A has eight portions, n is preferably a multiple of eight. However, n may be a multiple of 4 if the additional jerk waveform is not provided with a portion where the jerk becomes zero.

  The jerk addition waveform generation unit 422 generates jerk waveforms C1 to Cn such that the deviation amount Perr becomes “0” in the future in the sampling interval Ts, that is, n times with the command output cycle TC.

  For example, the jerk waveforms C1 to Cn are generated by the following procedures (1) to (3). In the following, the position deviation target compensation amount is P (Perr is used as it is as P), the command output cycle is TC, the deviation amount compensation target time is TN, the deviation amount compensation target command output cycle is n times, and the jerk waveform , And the magnitude of the jerk addition waveform is JC.

{Procedure (1)}
First, the width K of the jerk waveform is calculated as follows.
From TN> (TC × n), n is a multiple of 8 in order to fix the shape of the jerk addition waveform.
That is, TN> (TC × 8 × K), and the width K of the jerk waveform is as follows.
K <(TN / (TC × 8))
{Procedure (2)}
Next, the magnitude JC of the jerk addition waveform is calculated from the following equation.
JC = (1/8) × (P / K ³ × TC ³ )
{Procedure (3)}
Next, jerk addition waveforms C1 to Cn are generated.
The jerk addition waveforms C1 to Cn for compensating for the deviation amount are as follows. Here, x means the x-th waveform of 1 to n.
When x / K ≦ 1, Cx = JC
When x / K ≦ 2, Cx = 0
When x / K ≦ 3, Cx = −JC
When x / K ≦ 4, Cx = 0
When x / K ≦ 5, Cx = −JC
When x / K ≦ 6, Cx = 0
When x / K ≦ 7, Cx = JC
When x / K ≦ 8, Cx = 0
For example, when K = 1, the jerk addition waveforms C1 to Cn are as follows.
C1 to Cn = {JC, 0, -JC, 0, -JC, 0, JC, 0}
That is, C1 = JC, C2 = 0, C3 = −JC, C4 = 0, C5 = −JC, C6 = 0. C7 = JC and C8 = 0.

  FIG. 5 shows an example of a jerk addition waveform for compensating the deviation amount P. The added value JC is determined by the pulse difference obtained by the subtractor 421. FIG. 5 shows an acceleration addition waveform obtained from the jerk addition waveform added for each compensation when the deviation amount is converted into the number of pulses and is 1 pulse, 2 pulses, 4 pulses, 8 pulses, and 16 pulses. It is a figure which shows a speed addition waveform. As shown in FIG. 5, the greater the deviation amount, the greater the added jerk waveform height JC. In this embodiment, the speed addition waveform is the control command addition waveform.

  In addition, the command waveform regeneration processing unit 420 includes a command waveform regeneration unit 431 that obtains each command waveform output at eight command output cycles TC (= Ts / 8) timing of the current sampling interval Ts. The command waveform regeneration unit 431 according to the present embodiment includes adders 423, 424, 425, and 426.

  In the adders 423, 424, 425, and 426, each command waveform of the current sampling interval Ts requires a command waveform regenerated at the previous sampling. For this purpose, the command waveform input / output unit 410 includes the command jerk waveforms JD′1 to JD′n regenerated at the previous sampling and the command output cycle TC1 among the command waveforms regenerated at the previous sampling. Command acceleration waveforms AD'0 to AD'n, command velocity waveforms VD'0 to VD'n, and command position waveforms PD'0 to PD'n from the previous batch are saved, and necessary waveform values are regenerated. The data is output to the processing unit 420.

First, the adder 423 for obtaining the command jerk waveform will be described. In FIG. 4B, the jerk addition waveform generation unit 422 outputs jerk addition waveforms C1 to Cn to the adder 423. The adder 423 adds the jerk addition waveforms C1 to Cn and the command jerk waveforms JD′1 to JD′n generated at the previous timing, and all the command jerk waveforms JD ′ for the command output period n times. '1 to JD ″ n are regenerated and output to the jerk limiting unit 427 and the adder 424.
For example, the outputs of the adder 423 are JD ″ 1 = JD′1 + C1, JD ″ 2 = JD′2 + C2, JD ″ 3 = JD′3 + C3, to JD ″ n = JD′n + Cn.

Next, the adder 424 generates a command acceleration waveform at the current sampling and a command output period 1 generated at the previous sampling in the sampling interval obtained from the regenerated command jerk waveforms JD ″ 1 to JD ″ n. The command acceleration waveforms AD′0 to AD′n−1 from before the batch are added to regenerate all command acceleration waveforms AD ″ 1 to AD ″ n for the n command output cycles TC and add To the device 425 and the jerk limiting unit 427. In this embodiment, the added acceleration waveform is obtained by integrating the command jerk waveforms JD ″ 1 to JD ″ n with the command output period TC, and values JD ″ 1 × TC to JD ″ n × Tc. The average value in the output cycle TC, that is, each value of the regenerated command jerk waveforms JD ″ 1 to JD ″ n. Of course, a value obtained from the acceleration waveform shown in FIG. 5 may be added to the added acceleration waveform. The same concept applies to the command speed waveform and the command position waveform.
Therefore, the output of the adder 424 is AD ″ 1 = AD′0 + JD ″ 1, AD ″ 2 = AD′1 + JD ″ 2, AD ″ 3 = AD′2 + JD ″ 3,. n = AD′n−1 + JD ″ n.

The adder 425 also generates the regenerated command acceleration waveforms AD ″ 1 to AD ″ n and the command speed waveform VD′0 to VD′n−1 from the previous command output cycle generated at the previous timing. And the command velocity waveforms VD ″ 1 to VD ″ n for the command output cycle n times are regenerated and output to the adder 426 and the jerk limiting unit 427. In this embodiment, the command speed waveform is a control command waveform, and n times VD ″ 1 to VD ″ n are regenerated control command values.
For example, the output of the adder 425 is VD ″ 1 = VD′0 + AD ″ 1, VD ″ 2 = VD′1 + AD ″ 2, VD ″ 3 = VD′2 + AD ″ 3,. n = VD′n−1 + AD ″ n.

Finally, the adder 426 generates the command position waveforms PD′0 to PD′n− from the regenerated command speed waveforms VD ″ 1 to VD ″ n and the previous command output cycle generated at the previous timing. 1 is added to regenerate all command position waveforms PD ″ 1 to PD ″ n for n command output cycles and output to the jerk limiting unit 427.
For example, the output of the adder 426 is PD ″ 1 = PD′0 + VD ″ 1, PD ″ 2 = PD′1 + VD ″ 2, PD ″ 3 = PD′2 + VD ″ 3,. n = PD′n−1 + VD ″ n.

Further, the command waveform regeneration processing unit 420 confirms whether each command waveform obtained by the adders 423 to 426 is within the range.
The jerk limiting unit 427 checks whether or not the regenerated command jerk waveforms JD ″ 1 to JD ″ n exceed the upper limit (or lower limit) with reference to FIG.

  FIG. 7 is a diagram for explaining the jerk upper / lower limit confirmation processing operation in the embodiment of the motor control device and the motor control method of the present invention. In FIG. 7, the jerk upper limit Jmax and the jerk lower limit −Jmax are determined in advance. In FIG. 7, the adder 423 adds the uncorrected command jerk waveforms JD′1 to JD′n (no correction) generated at the previous timing and the jerk addition waveform in the broken-line circle 701. That is, the addition waveform pulses C1, C2, C3, and C4 are added to the jerk waveform indicated by the bold line (command jerk waveforms JD "1 to JD" n). There is a correction at the timing of the previous correction, and if further correction is applied, the pulse waveform may fall below the jerk lower limit value −Jmax.

  In this case, the jerk limiting unit 427 detects whether the pulse waveforms C1, C2, C3, and C4 at the current time are between the upper limit Jmax and the lower limit −Jmax, determines OK or NG, and outputs Is branching. For example, it is detected whether the waveform C2 is less than the upper limit Jmax at the current time (JD ″ 1 to JD ″ n <Jmax). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, it is detected whether or not the waveform C2 at the current time exceeds the lower limit Jmax (−Jmax <JD ″ 1 to JD ″ n). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, the command jerk waveform JD ″ 1 to JD ″ n, command acceleration waveform AD ″ 1 to AD ″ n, command speed waveform VD ″ 1 to VD ″ n are sent to the acceleration limiting unit 428. , And command position waveforms PD ″ 1 to PD ″ n.

  Next, in FIG. 4B, similarly to the jerk limiting unit 427, the acceleration limiting unit 428 detects whether the acceleration waveform at the current time is less than the upper limit Amax (AD ″ 1 to AD ″). n <Amax). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, it is detected whether or not the waveform at the current time exceeds the lower limit Amax (−Amax <AD ″ 1 to AD ″ n). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, the command jerk waveform JD ″ 1 to JD ″ n, command acceleration waveform AD ″ 1 to AD ″ n, command speed waveform VD ″ 1 to VD ″ n are sent to the speed limiter 429. , And command position waveforms PD ″ 1 to PD ″ n.

  Further, in FIG. 4B, the speed limiter 429 detects whether the speed waveform at the current time is less than the upper limit Vmax, similarly to the jerk limiter 427 (VD ″ 1 to VD ″ n < Vmax). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, it is detected whether or not the waveform at the current time exceeds the lower limit Vmax (−Vmax <VD ″ 1 to VD ″ n). If NO (NG), NG information is output to the command waveform restoration unit 4210. If OK, the command jerk waveform JD ″ 1 to JD ″ n, command acceleration waveform AD ″ 1 to AD ″ n, command speed waveform VD ″ 1 to VD ′ are input to the command waveform input / output unit 410. 'n and command position waveforms PD ″ 1 to PD ″ n are output.

  When the NG information is input from any of the jerk limiting unit 427, the acceleration limiting unit 428, or the speed limiting unit 429, the command waveform restoring unit 4210 restores the previous command waveform and calculates the total deviation amount. The correction is carried forward until the next command output (upper and lower limit confirmation processing). That is, the restored previous command waveform is output to the command waveform input / output unit 410.

  Thereafter, in FIGS. 4B and 4C, the regenerated command waveforms JD ″ 1 to JD ″ n, AD ″ 1 to AD ″ n, VD ″ 1 to VD ″ n, and PD ″ 1 ~ PD ″ n is saved as a new command waveform.

  The command waveform speed command values VD ″ 1 to VD ″ n are sequentially input from the command waveform input / output unit 410 to the FF value correction unit 214, corrected by the FF value, and further sequentially output to the DAC 213. The DAC 213 outputs to the servo amplifier 220 the speed command value that is sequentially converted from analog to analog.

4B, the DAC 213 converts the input speed command value VD ″ 1 into an analog value and outputs the analog value to the servo amplifier 220. The servo amplifier 220 rotationally drives the motor 130 according to the input analog data, and outputs the rotational position (and rotational speed) of the motor 130 to the command waveform generation unit 212 as an encoder signal.
The encoder signal output from the motor 130 is input to the encoder signal counter 430 of the command waveform generation unit 212.

  The encoder signal counter 430 outputs the count value PA0 counted at every sampling interval Ts that is a predetermined cycle to the command waveform regeneration processing unit 420.

  In the command waveform regeneration processing unit 420, the adder 421, which is a position deviation detection unit, inputs the count value PA0 output from the encoder signal counter 430 to its subtraction input terminal. Next, a command waveform reproduction process in the cycle is performed.

  FIG. 8 schematically shows how all command waveforms are regenerated. FIG. 8 is a diagram illustrating an example of a regenerated command waveform after calculation of a compensation jerk waveform in the motor control device and motor control method of the present invention. The horizontal axis represents time, and the vertical axis represents the amplitude value. Each one-dot chain line is a waveform before compensation, and the motor 130 is controlled with a waveform indicated by a solid line during a sampling interval in which a compensation jerk waveform is added to the command jerk from the current time. In FIG. 8, for the sake of easy understanding, the time axis and the amplitude value of the corrected part are enlarged and displayed, and the actual correction is frequently made.

As a result, the motor 130 rotates, and when the motor rotates at a high speed, vibration and deviation with respect to the traveling direction of the driven body can be suppressed and the settling time can be shortened. In addition, since the motor can be operated with an ideal trajectory and the current position can be constantly monitored, it is easy to operate a plurality of axes in synchronization.
In FIG. 8, the actual position waveform appears to be shifted from before the current time. This indicates a deviation (positional deviation) up to the current time with respect to the command waveform. Actually, since the correction is continued at a very short cycle interval, the shift is not as remarkable as in FIG. In FIG. 8, in order to emphasize and express how the position is corrected, the actual position at the current time is shifted slightly from the command waveform.

FIG. 6 is a flowchart for explaining the procedure of an embodiment of the operation of the motor control method of the present invention. The procedure for creating the command jerk waveform JD ″, command acceleration waveform AD ″, command speed waveform VD ″, and command position waveform PD ″ at the sampling timing will be described with reference to FIG.
In step 601, the current actual position PA0 is obtained from the encoder count value.
In step 602, the deviation amount Perr is calculated from the actual position PA0 and the current command position PD′0.
In step 603, jerk addition waveforms C1 to Cn are generated such that the deviation amount Perr becomes “0” in the future at the command output cycle n times.

In step 604, the jerk addition waveforms C1 to Cn are added to the command jerk waveforms JD′1 to JD′n, and all command jerk waveforms JD ″ 1 to JD ″ n for n command output cycles are obtained. Regenerate.
In step 605, all command output cycles n times from the command acceleration waveforms AD'0 to AD'n-1 from the previous command output cycle and the regenerated command jerk waveforms JD''1 to JD''n. The command acceleration waveforms AD ″ 1 to AD ″ n are regenerated.
In step 606, the command velocity waveforms VD ″ 1 to VD ″ n are regenerated by the same method as the regeneration of the command acceleration waveforms AD ″ 1 to AD ″ n (step 605).
In step 607, the command acceleration command AD ″ 1 to AD ″ n is regenerated (step 605) or the command velocity waveform VD ″ 1 to VD ″ n is regenerated (step 606). The position waveforms PD ″ 1 to PD ″ n are regenerated.

In step 608, it is confirmed whether or not the regenerated jerk waveforms JD ″ 1 to JD ″ n are less than the upper limit Jmax. If it exceeds the upper limit Jmax, the process proceeds to step 612, and if it is less than the upper limit, the process proceeds to step 609.
In step 609, it is confirmed whether or not the regenerated acceleration waveforms AD ″ 1 to AD ″ n are less than the upper limit Amax. If it exceeds the upper limit Amax, the process proceeds to step 612. If it is less than the upper limit, the process proceeds to step 610.
In step 610, it is confirmed whether or not the regenerated velocity waveforms VD ″ 1 to VD ″ n are less than the upper limit Vmax. If it exceeds the upper limit Vmax, the process proceeds to step 612, and if it is less than the upper limit, the process proceeds to step 611.

In step 611, the regenerated command jerk waveforms JD ″ 1 to JD ″ n, command acceleration waveforms AD ″ 1 to AD ″ n, command velocity waveforms VD ″ 1 to VD ″ n, and command position The waveforms PD ″ 1 to PD ″ n are stored as new command waveforms.
In step 613, the next speed command values VD ″ 1 to VD ″ n are output from the DAC 312, the processing in FIG. 6 is terminated, and the operation proceeds to the next command output cycle timing.

  In step 612, the regeneration command waveform is restored with the previous command waveform, and the process proceeds to step 613. That is, the previous command jerk waveforms JD'1 to JD'n are used as the command jerk waveforms JD "1 to JD" n. Further, the previous command acceleration waveforms AD'1 to AD'n are used as the command acceleration waveforms AD "1 to AD" n. Further, the previous command speed waveforms VD'1 to VD'n are also used as the command speed waveforms VD "1 to VD" n. Furthermore, the previous command position waveforms PD′1 to PD′n are used as the command position waveforms PD ″ 1 to PD ″ n.

  In the first embodiment described above, the FF value correction unit (control command correction unit) is provided in the previous stage of the DAC 213, but may be provided in the subsequent stage as an analog amplifier.

  As described above, according to the first embodiment, even if the actual speed does not reach the target speed, the target speed is corrected without correcting the jerk, so that the driven object is operating. It is possible to provide a motor control device and a semiconductor manufacturing method and a die bonder using the motor control method capable of suppressing vibration in the traveling direction and shortening the control time.

(Example 2)
FIG. 4C is a diagram showing a second embodiment of the motor control device and the motor control method of the invention.

The differences between the second embodiment and the first embodiment are the following two points.
The first point relates to the characteristics of the present invention. In the first embodiment, the FF value correction unit 214 is provided between the command waveform input / output unit 410 and the DAC 213, but in the second embodiment, it is provided between the adder 424 and the adder 425. That is, the command speed addition waveform which is all the command acceleration waveforms AD ″ 1 to AD ″ n for n times of the regenerated command output cycle TC obtained by the adder 424 is corrected by applying the FF value. The command speed addition waveform for n times is input to the adder 425. Since the other addition values VD′0 to VD′n−1 obtained 425 times before and last time are also corrected with the FF value at the previous time sampling, the regenerated n times as the output of the adder 425. The command speed addition waveforms VD ″ 1 to VD ″ n are also waveforms corrected with the FF value as a whole.
Other processes are the same except for the second point described below.

  The second point is that in Example 1, the command waveform restoration unit 4210 restored the previous command waveform, but in Example 2, the NG information is simply output, and the command waveform input / output unit 410 responds to the NG information. The previous command waveform that was saved is made the current command waveform.

  Also in the second embodiment described above, even if the actual speed does not reach the target speed, the vibration in the traveling direction during the operation of the driven body can be achieved by correcting the target speed without correcting the jerk. It is possible to provide a motor manufacturing apparatus and a die bonder using the motor control device and the motor control method that can suppress the control time and shorten the control time.

(Example 3)
FIG. 4D is a diagram showing a third embodiment of the motor control device and the motor control method of the invention.

The differences between the third embodiment and the second embodiment are the following three points.
The first and second points relate to the characteristics of the present invention. The first point is that the FF value correction unit 214 is provided between the calculator 424 and the adder 425 in the second embodiment, but in the third embodiment, the corrected speed command waveform unit (correction) of the command waveform input / output unit 410 is corrected. (Command waveform part) obtains a corrected speed command waveform indicated by a broken line obtained by multiplying the speed command waveform obtained by the ideal waveform generation part 211 by the FF value. The second point is a correction speed addition waveform section (correction control addition waveform generation section) (not shown) in the addition waveform generation section 432, and correction speed addition indicated by a broken line obtained by multiplying the speed addition waveform shown in FIG. Get the waveform.

  The third point relates to a method for regenerating a waveform. In the corrected speed command waveform embodiment 2, in the adders 423 to 425, the data obtained this time is added to the data obtained at the previous sampling time, and a new waveform is regenerated. In the third embodiment, the ideal jerk command waveforms JD1 to JD1, the acceleration command waveforms AD1 to AD1, and the corrected speed command waveforms VD1 to VD1 included in the command waveform input / output unit 410 are formed from the current sampling time to the next sampling time. The n pieces of addition data of the acceleration / acceleration addition waveforms JC1 to JC1, the acceleration addition waveforms AC1 to AC1 and the corrected velocity addition waveforms VCS1 to VCSn obtained by the addition waveform generation unit 432 based on the deviation amount Perr are respectively added to the batch data. Addition is performed to regenerate acceleration / acceleration addition waveforms JD ″ 1 to JD ″ n, acceleration addition waveforms AD ″ 1 to AD ″ n, and correction speed addition VD ″ 1 to VD ″ n waveforms. If the speed command waveform is a control command waveform, the regenerated corrected speed waveforms AD ″ 1 to AD ″ n are sequentially output to the DAC 213.

  In the third embodiment, it is not necessary to store the regenerated corrected velocity waveforms VD ″ 1 to VD ″ n and the like. In addition, if the position waveform is not a control command waveform, it is not always necessary to regenerate the position waveform because there is no use for it. In the first and second embodiments, it is not always necessary to regenerate the position waveform in the same manner.

  In the third embodiment described above, the control command waveform is formed by the process indicated by the third point using the corrected speed command waveform and the corrected speed command addition waveform, and is input to the DAC 213. The control command waveform may be formed by the processing indicated by the third point using the added waveform, and may be corrected by the FF value correction unit 214 and input to the DAC 213 as in the first embodiment.

  Even in the third embodiment described above, even if the actual speed does not reach the target speed, the vibration in the traveling direction during the operation of the driven body can be achieved by correcting the target speed without correcting the jerk. It is possible to provide a motor manufacturing apparatus and a die bonder using the motor control device and the motor control method that can suppress the control time and shorten the control time.

Example 4
In Examples 1 to 3, examples in which the present invention is applied to a rotating motor are shown. Example 4 is an example applied to a linear motor other than a rotary motor. Specifically, in FIG. 2, the motor 130 is replaced with a linear motor. The speed loop control unit 221 of the servo amplifier 220 controls the moving speed of the linear motor according to the speed command value input from the motion controller 210 and the encoder signal output from the linear motor.

The linear motor moves at a movement speed according to the movement speed control input from the speed loop control unit 221 of the servo amplifier 220, and the actual position and the actual speed are used as encoder signals as the speed loop control unit 221 of the servo amplifier 220 and the motion. This is output to the command waveform generator 212 of the controller 210.
In the embodiment of FIG. 1 replaced with a linear motor, the actual position of the driven body is calculated from the count value of the linear motor, and the actual speed is calculated based on the calculated actual position. However, a position detection device that directly detects the position of the driven body may be provided, and the position detected by the position detection device may be the actual position.

For example, in FIG. 4B, the DAC 213 sequentially converts the input speed command values VD ″ 1 to VD ″ n into analog values and outputs the analog values to the servo amplifier 220. The servo amplifier 220 drives the pulse motor 140 according to the input analog data, and outputs the movement position (and movement speed) of the pulse motor 140 to the command waveform generation unit 212 as an encoder signal.
The encoder signal output from the pulse motor 140 is input to the encoder signal counter 430 of the command waveform generation unit 212.
The encoder signal counter 430 outputs the count value PA0 counted in a predetermined cycle to the command waveform regeneration processing unit 420.
In the command waveform regeneration processing unit 420, the adder 421 inputs the count value PA0 output from the encoder signal counter 430 to the subtraction input terminal.

  FIG. 8 shows how all command waveforms are regenerated. FIG. 8 is a diagram illustrating an example of a regenerated command waveform after calculation of a compensation jerk waveform in the linear motor control device and the linear motor control method of the present invention. The horizontal axis represents time, and the vertical axis represents the pulse height. Each one-dot chain line is a waveform before compensation, and the linear motor is controlled with a waveform indicated by a solid line during a sampling interval in which a compensation jerk waveform is added to the command jerk from the current time.

  As a result, when the linear motor moves and the linear motor moves at a high speed, the vibration and deviation with respect to the traveling direction of the driven body can be suppressed and the settling time can be shortened. In addition, the linear motor can be operated with an ideal trajectory, and the current position can be constantly monitored. Therefore, it is easy to operate a plurality of axes in synchronization.

  Furthermore, the present invention can be applied to all motors such as a motor having an encoder counter function.

Furthermore, the present invention is not limited to the above-described embodiments, and the present invention can be modified based on the spirit and spirit of the present invention as long as the person has ordinary knowledge in the technical field to which the present invention belongs. Of course, the invention which can be changed is included.
For example, in the above embodiment, the command waveform input / output unit outputs a speed command value to control the motor. However, even if the motor command is controlled by outputting an acceleration command value (acceleration command waveform) or a position command value (position command waveform) instead of a speed command value (speed command waveform) as a control command value (control command waveform) good. Therefore, if a deviation occurs between the acceleration command value or the position command value and the actual acceleration value or the position command value in the same manner as the speed command value, the control command as well as the FF value of the speed command value. A correction value is obtained and the acceleration command value or the position command value is corrected.
As a result, in the case of an acceleration command value, not only position control but also load control is possible.

  The servo control apparatus and servo control method of the present invention can be applied to other semiconductor manufacturing apparatuses and apparatuses using motors in addition to die bonders.

1: Wafer supply unit 2: Workpiece supply / conveyance unit 3: Die bonding unit 7: System control unit 35: Bonding head 100: Conventional motor control device 110: Motion controller 111: Command speed waveform generation unit 112: Command pulse train generation Unit 120: Servo amplifier 121: Position loop control unit 122: Speed loop control unit 130: Servo motor 200: Motor controller of the embodiment 210: Motion controller 211: Ideal waveform generation unit 212: Command waveform generation unit 213: DAC
214: FF value correction unit (control command correction unit) 220: Servo amplifier 221: Speed loop control unit 410: Command waveform input / output unit 420: Command waveform regeneration processing unit 421: Subtractor 422: jerk addition waveform generation unit 423 426: adder 427: jerk limiting unit 428: acceleration limiting unit 429: speed limiting unit 430: encoder signal counter 431: command waveform regenerating unit 4210: command waveform restoring unit TC: command output period Ts: sampling interval Vobj: Target speed Vr: Actual speed

Claims (16)

Inputs target values, which are amplitude values of jerk, acceleration, speed, and position, and generates ideal jerk command waveforms, acceleration command waveforms, speed command waveforms, and position command waveforms from the start position to the target position. An ideal waveform generator,
A position deviation detector for detecting a position deviation between the actual position of the driven body obtained based on the rotation of the servo motor and the position command value of the ideal position command waveform;
Command waveform regeneration that regenerates a control command value that forms a control command waveform out of the acceleration, velocity, and position command waveforms and obtains a control command regeneration value based on the position deviation at each sampling interval And
A die bonder that inputs the regenerated control command value to a servo amplifier, controls the driven body to the target position, and mounts a die on a workpiece,
The control command value is corrected with a control correction command value that causes the amplitude value of the actual speed of the driven body obtained by inputting the control command value to the servo amplifier to approach the target value of the control command waveform. A control command correction unit for
Controlling the driven body with the corrected control command value;
A die bonder characterized by that. The die bonder according to claim 1,
The control command correction value is provided between the command waveform generation unit and the servo amplifier.
A die bonder characterized by that. The die bonder according to claim 1,
The same jerk command waveform as the ideal jerk command waveform, the jerk addition waveform obtained based on the position deviation, the control command sum waveform of the control command waveform obtained based on the jerk addition waveform, An addition waveform generation unit for determining
The command waveform regeneration unit adds a plurality of addition data of the control command addition waveform and the same number of the control command values obtained at the time of the previous sampling and the previous sampling, and the control command value is obtained. A regenerator and
The control command correction unit is provided in a preceding stage of the adder to correct the addition data.
A die bonder characterized by that. The die bonder according to claim 1,
The ideal jerk command waveform, the acceleration command waveform, the speed command waveform, and the position command waveform are captured from the ideal waveform generation unit, and the control command regeneration value obtained by the command waveform generation unit is captured. Command waveform input / output section to output to servo amplifier,
The same jerk command waveform as the ideal jerk command waveform, the jerk addition waveform obtained based on the position deviation, the control command sum waveform of the control command waveform obtained based on the jerk addition waveform, An addition waveform generation unit for determining
The control command correction unit is provided in the command waveform input / output unit to correct the control command waveform to obtain a correction control command value, and is provided in the addition waveform generation unit to correct the control command addition waveform. A correction control addition waveform generation unit for obtaining a correction control addition waveform,
The command waveform regeneration unit adds a plurality of addition data forming the correction control addition waveform and the control command value which is the same number of the correction control command values as the plurality, and the regenerated control command Obtaining the control command regeneration value which is a value;
A die bonder characterized by that. The die bonder according to any one of claims 1 to 4,
The control command correction value is obtained by sequentially inputting the control command waveform obtained from the starting position or another starting position to the target position or a fixed distance based on each target value to the servo amplifier. The servo motor is controlled to obtain a first actual speed for the target value of the control command waveform from a series of speeds of the servo motor, and a first target value of the control command waveform for the actual speed is obtained. A first control command correction value obtained as a ratio,
A die bonder characterized by that. The die bonder according to claim 5, wherein
The control command correction value can be processed in the same manner as the processing for obtaining the first actual speed from the target position or the position of the fixed distance to the starting position or the other starting position. A second control command correction value obtained as an average value of the first ratio and the second ratio by obtaining a second ratio of the obtained second actual speed;
A die bonder characterized by that. The die bonder according to claim 6, wherein
The control command correction value is obtained as a linear approximation or a curve approximation function of the first control command correction value or the second control command correction value obtained by changing a plurality of the target values of the control command waveform.
A die bonder characterized by that. The motor control device according to claim 1 or 2,
The control command correction unit is provided via a DAC that converts the command correction value to analog, or is provided at a subsequent stage of the DAC that converts the control command waveform to analog, and outputs the resultant to the servo motor.
A die bonder characterized by that. The die bonder according to any one of claims 1 to 4,
The driven body is at least one of a bonding head, a pickup head, a needle, a workpiece to be conveyed, a workpiece position recognition camera, and a pickup device.
A die bonder characterized by that. Enter target values that are amplitude values of jerk, acceleration, speed, and position, and input the ideal jerk command waveform, acceleration command waveform, speed command waveform, and position command waveform from the start position to the target position. A position deviation between the actual position of the driven body obtained based on the rotation of the servo motor and the position command value of the ideal position command waveform is detected, and the acceleration is detected based on the position deviation at every sampling interval. The control command value forming the control command waveform is regenerated among the command waveforms of the speed and the position to obtain the control command regenerated value, and the regenerated control command value is input to the servo amplifier, A semiconductor manufacturing method for controlling a driving body to the target position and mounting a die on a workpiece,
The control command value is corrected with a control correction command value that causes the amplitude value of the actual speed of the driven body obtained by inputting the control command value to the servo amplifier to approach the target value of the control command waveform. And controlling the driven body with the corrected control command value,
A method of manufacturing a semiconductor. A semiconductor manufacturing method according to claim 10, comprising:
Correction by the control command correction value is performed on the control command regeneration value.
A method of manufacturing a semiconductor. A semiconductor manufacturing method according to claim 10, comprising:
A jerk addition waveform having the same pattern as the ideal jerk command waveform, obtained based on the position deviation, and a control command add waveform of the control command waveform obtained based on the jerk addition waveform. Set
The command waveform regeneration is performed by adding a plurality of addition data of the control command addition waveform and the same number of the control command values obtained at the time of the previous and previous samplings,
Correction by the control command correction value is performed on the addition data.
A method of manufacturing a semiconductor. The semiconductor manufacturing method according to any one of claims 10 to 12,
The control command correction value is obtained by sequentially inputting the control command waveform obtained from the starting position or another starting position to the target position or a fixed distance based on each target value to the servo amplifier. The servo motor is controlled to obtain a first actual speed for the target value of the control command waveform from a series of speeds of the servo motor, and a first target value of the control command waveform for the actual speed is obtained. A first control command correction value obtained as a ratio,
A method of manufacturing a semiconductor. The semiconductor manufacturing method according to claim 13.
The control command correction value can be processed in the same manner as the processing for obtaining the first actual speed from the target position or the position of the fixed distance to the starting position or the other starting position. A second control command correction value obtained as an average value of the first ratio and the second ratio by obtaining a second ratio of the obtained second actual speed;
A method of manufacturing a semiconductor. 15. The semiconductor manufacturing method according to claim 14, wherein
The control command correction value is obtained as a linear approximation or a curve approximation function of the first control command correction value or the second control command correction value obtained by changing a plurality of the target values of the control command waveform.
A method of manufacturing a semiconductor. The semiconductor manufacturing method according to any one of claims 10 to 12,
The driven body is at least one of a bonding head, a pickup head, a needle, a workpiece to be conveyed, a workpiece position recognition camera, and a pickup device.
A method of manufacturing a semiconductor.

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