JP2020047841A - Mounting device and manufacturing method for semiconductor device - Google Patents

Abstract

To provide a mounting device in which vibration of a mounting head is reduced.SOLUTION: A mounting device includes a first mounting head for transporting a die, a second mounting head for transporting the die having operation timing different from that of the first mounting head, a first drive part for moving the first mounting head freely in a first direction, a second drive part for moving the second mounting head freely in the first direction, a control section for controlling the first and second drive parts. The control section is configured to calculate exciting force, generated when moving the first mounting head, from a command value, or to add a thrust equivalent cancelling the exciting force in the inverse direction as a feedforward component, as a vibration waveform previously measured and registered, to a control amount of the second mounting head.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a mounting device, and is applicable, for example, to a mounting device in which two mounting heads perform operations different from each other.

  As a conventional component mounting apparatus, a mounting head equipped with a plurality of suction nozzles for holding components, an X beam that supports the mounting head movably along an X direction that is a direction along the surface of the substrate, and an X direction And two Y beams that support both ends of the X beam so as to be movable in the Y direction orthogonal to the X axis. In the component mounting apparatus having such a configuration, the X beam having both ends supported by the respective Y beams is moved in the Y direction, and the mounting head supported by the X beam is moved in the X direction. Thus, the mounting head is aligned with the mounting position of the substrate, and the components are mounted on the substrate.

  Further, in such a component mounting apparatus, two X beams are supported between two Y beams, and two mounting heads movably supported by the respective X beams are used. An apparatus configuration that implements efficient component mounting is employed. In recent years, there has been a strong demand for improving component mounting accuracy in addition to improving productivity in component mounting.

  In such a component mounting apparatus, two mounting heads often perform different operations in parallel in order to improve productivity in component mounting. For example, there is a case where one mounting head is performing a component mounting operation on a substrate while the other mounting head is performing a component removing operation at a component supply unit.

JP 2011-187468 A

In the case where the two mounting heads perform mutually different operations in parallel in this manner, in the component mounting apparatus, the vibration generated by the operation of one of the mounting head and the X beam is transmitted to the Y beam, and this vibration is Further, it is transmitted to the other X beam and the mounting head. Such transmission of vibration may adversely affect the accuracy of component position recognition and mounting operation. In order to avoid the influence of such vibration transmission, it is necessary to restrict the operation between the two mounting heads, which hinders an improvement in productivity in component mounting.
An object of the present disclosure is to provide a mounting device that reduces vibration of a mounting head.
Other problems and novel features will be apparent from the description of this specification and the accompanying drawings.

The outline of a typical one of the present disclosure will be briefly described as follows.
That is, the mounting apparatus has a first mounting head that transports the die, and an operation timing different from that of the first mounting head, and the second mounting head that transports the die, and the first mounting head can freely move in the first direction. A first drive unit for moving the second mounting head; a second drive unit for freely moving the second mounting head in the first direction; and a control unit for controlling the first drive unit and the second drive unit. The control unit calculates a vibration force generated when the first mounting head is moved from a command value, or as a vibration waveform measured and registered in advance, the thrust equivalent to canceling the vibration force in the opposite direction. A feedforward component to the control amount of the second mounting head.

  According to the mounting device, the vibration of the mounting head can be reduced.

FIG. 1 is a top view schematically showing the mounting device of the embodiment. FIG. 2 is a side view schematically showing the mounting device of FIG. FIG. 3 is a schematic front view for explaining the problem of the mounting apparatus of FIG. FIG. 4 is a schematic front view illustrating the mounting device of the embodiment. FIG. 5A is a diagram for explaining the inertia force applied to the mating shaft and the deviation generated by the operation of the moving shaft of the mounting apparatus of FIG. 4A. FIG. 5B is a diagram illustrating the inertia force applied to the mating shaft and the deviation generated due to the operation of the moving shaft of the mounting device of FIG. 4B. FIG. 6A is a diagram illustrating calculation of the thrust of the partner shaft in the case of long-distance operation. FIG. 6B is a diagram illustrating calculation of the thrust of the partner shaft in the case of short-distance operation. FIG. 7A is a block diagram of a control system of the mounting device of the comparative example. FIG. 7B is a block diagram of a control system of the mounting apparatus. FIG. 8A is a vibration model diagram of the device when the device is installed on a strong floor. FIG. 8B is a vibration model diagram of the device when the device is installed on a floor that is not strong. FIG. 9 is a diagram illustrating a vibration waveform and a canceling waveform due to jerk of the operation axis. FIG. 10 is a diagram illustrating a vibration waveform and a canceling waveform due to the jerk of the operation axis. FIG. 11 is a top view schematically showing the flip chip bonder of the first embodiment. FIG. 12 is a diagram for explaining the operations of the pickup flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. FIG. 13 is a schematic sectional view showing a main part of the die supply unit of FIG. FIG. 14 is a schematic side view showing a main part of the bonding section of FIG. FIG. 15 is a flowchart showing a bonding method performed by the flip chip bonder of FIG. FIG. 16 is a top view schematically showing the die bonder of the second embodiment.

  Hereinafter, embodiments and examples will be described with reference to the drawings. However, in the following description, the same components will be denoted by the same reference symbols, and repeated description may be omitted. In addition, in order to make the description clearer, the width, thickness, shape, and the like of each part may be schematically illustrated in comparison with an actual embodiment, but this is merely an example, and the interpretation of the present invention is not described. It is not limited.

  First, the configuration of the mounting apparatus according to the embodiment will be described with reference to FIGS. FIG. 1 is a top view schematically showing the mounting device of the embodiment. FIG. 2 is a side view schematically showing the mounting device of FIG.

  The mounting apparatus 100 according to the embodiment is an apparatus that transports a component 300 from a component supply unit (not shown) to above the work 200 and attaches (mounts) the transported component 300 to the work 200. The mounting apparatus 100 includes a gantry 110, a mounting stage 120 supported on the gantry 110, X support stands 131a and 131b provided on the gantry 110, and Y supported on the X support stands 131a and 131b. Beams 140a and 140b, mounting heads 150a and 150b supported by Y beams 140a and 140b, and drive units 160a and 160b for driving mounting heads 150a and 150b in the Y-axis direction and the Z-axis direction are provided. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a horizontal plane. In the present embodiment, the direction in which the Y beams 140a and 140b extend is the Y-axis direction (second direction) as shown in FIG. The direction orthogonal to the X-axis will be described as the X-axis direction (first direction). The Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane. Note that the X direction and the Y direction described in the section of the background art are different.

  The mounting heads 150a and 150b are devices having holding means for holding the component 300 detachably, and are attached to the Y beams 140a and 140b so as to be reciprocally movable in the Y-axis direction.

  In the case of the present embodiment, three mounting heads 150a and 150b are provided, and each of the mounting heads 150a and 150b includes a holding unit 151a having a nozzle for holding the component 300 by vacuum suction. The holding means of the mounting head 150b is not shown. In addition, the driving units 160a and 160b can vertically move the three mounting heads 150a and 150b independently in the Z-axis direction. The mounting heads 150a and 150b have a function of holding and transporting the component 300, and mounting the component 300 on the work 200 that is suction-fixed to the mounting stage 120.

  Guides 132a and 132b provided on the X support bases 131a and 131b are members that guide the Y beams 140a and 140b so as to be slidable in the X-axis direction. In the case of the present embodiment, two X support bases 131a and 131b are arranged in parallel, and each X support base 131a and 131b is fixed to the gantry 110 in a state of extending in the X-axis direction. The X support tables 131a and 131b may be formed integrally with the gantry 110. The X supports 131a and 131b and the guides 132a and 132b are called X beams 130a and 130b. The X beams 130a and 130b are also referred to as X1 axis and X2 axis. The Y beams 140a and 140b are also called Y1 axis and Y2 axis.

  As shown in FIG. 2, sliders 143a and 143b are mounted on the guides 132a and 132b so as to be movable in the X-axis direction. The legs 142aa, 142ba, 142ab, 142bb of the Y beams 140a, 140b are mounted on the sliders 143a, 143b of the two guides 132a, 132b, respectively. That is, the main beams 141a, 141b of the Y beams 140a, 140b extend in the Y-axis direction so as to straddle the mounting stage 120, and the legs 142aa, 142ba, 142ab, 142bb at both ends are attached to the sliders 143a, 143b. The guides 132a and 132b attached to the X support tables 131a and 131b are movably supported in the X-axis direction. The legs 142aa, 142ba, 142ab, 142bb include driving units 144aa, 144ba, 144ab, 144bb such as motors for driving the Y beams 140a, 140b in the X-axis direction. Since the bottom surfaces of the main beams 141a and 141b and the bottom surfaces of the legs 142aa, 142ba, 142ab and 142bb (the upper surfaces of the sliders 143a and 143b) are located on the same plane, the main beams 141a and 141b are connected to the X support 131a. , 131b are not so high.

  As shown in FIG. 1, the Y beams 140a and 140b are members that extend in the Y-axis direction, guide the reciprocating movement of the mounting heads 150a and 150b in the Y-axis direction, and are also driving units.

  Next, vibration of the Y beam and the mounting head will be described with reference to FIG. FIG. 3 is a schematic front view for explaining the problem of the mounting device of FIG. 1, FIG. 3A is a diagram for explaining that the opposed two axes operate independently, and FIG. FIG. 3C is a diagram illustrating a case where one axis is operating and the other axis is stopped, FIG. 3C is a diagram illustrating the vibration deformation of the frame, and FIG. 3D is a diagram illustrating the vibration of the other axis. FIG.

  In the mounting apparatus 100, two mounting heads 150a and 150b often perform different operations in parallel, as shown in FIG. 3A, in order to improve productivity in component mounting. For example, while one mounting head 150b is performing a component mounting operation on a substrate, the other mounting head 150a may perform an operation of moving in the X direction.

  As shown in FIG. 3B, when the Y beam 140a, which is the Y1 axis, moves in the X axis direction, as shown in FIG. 3C, the mass (Ma) of the mounting head 150a and the Y beam 140a during acceleration / deceleration. The reaction force (Fr = Ma · A) multiplied by the acceleration (A) is transmitted to the gantry (frame) 110, and the gantry 110 is vibrated, and vibrates and deforms as indicated by a two-dot broken line. Here, the vibration acceleration of the gantry 110 is A '. When the gantry 110 vibrates, as shown in FIG. 3D, the inertia force (Mb) of the other mounting head 150b multiplied by the mass (Mb) of the mounting head 150b and the Y beam 140b and the vibration acceleration (A ′) is applied. Fi = Mb · A ′) is applied in the opposite direction of the vibration of the gantry 110. This inertial force is applied as an external force to the motors of the drive units 144ab and 144bb that hold the other mounting head 150b and the Y beam 140b, and cause a reduction in positioning accuracy.

  In the case of a configuration such as opposed two axes, when the Y beam 140a, which is the Y1 axis, is operating, even if the Y beam 140b, which is the Y2 axis, is stopped, the acceleration / deceleration vibration of the Y1 axis is transmitted through the frame, and the Y2 axis is moved. This causes vibration and causes a displacement of about several μm to several tens of μm. This problem occurs not only in the gantry structure as in the present embodiment, but also in the case of a mechanism configuration in which separate drive systems having axes that drive in the same direction are used, and one of the drive systems is affected by the operation vibration of the other. .

  Next, an embodiment for solving the above-described problem will be described with reference to FIGS. FIG. 4 is a front view schematically showing the mounting device of the embodiment, FIG. 4A is a diagram without a vibration measuring device, and FIG. 4B is a diagram with a vibration measuring device. FIG. FIG. 5A is a diagram for explaining the inertia force applied to the mating shaft and the deviation generated by the operation of the moving shaft of the mounting apparatus of FIG. 4A. FIG. 5B is a diagram illustrating the inertia force applied to the mating shaft and the deviation generated due to the operation of the moving shaft of the mounting device of FIG. 4B. FIG. 6A is a diagram illustrating calculation of the thrust of the partner shaft in the case of long-distance operation. FIG. 6B is a diagram illustrating calculation of the thrust of the partner shaft in the case of short-distance operation. FIG. 7A is a block diagram of a control system of the mounting device of the comparative example. FIG. 7B is a block diagram of a control system of the mounting apparatus. FIG. 8A is a vibration model diagram of the device when the device is installed on a strong floor. FIG. 8B is a vibration model diagram of the device when the device is installed on a floor that is not strong. FIG. 9 is a diagram for explaining the thrust calculated from the jerk of the operation axis and the thrust calculated from the vibration waveform in the case of long-distance operation. FIG. 10 is a diagram for explaining the thrust calculated from the jerk of the motion axis and the thrust calculated from the vibration waveform in the case of the short distance operation.

  As shown in FIG. 4A, by applying a thrust (Fp) to the Y2 axis to cancel the inertial force (Fi) generated in the Y beam 140b as the Y2 axis when the Y beam 140a as the Y1 axis operates. The vibration of the Y2 axis is reduced. Specifically, as shown in FIG. 5A, the gantry vibrates with a vibrating force (acceleration (J)) generated by operating the Y1 axis, and an inertial force is applied to the partner shaft by the vibration of the gantry 110. The vibration originating from the inertial force is generated on the partner shaft and appears as a deviation. This vibration is determined by the rigidity and frequency characteristics of the vibration system formed by the gantry 110 and the Y-axis drive shaft, and the vibration amplitude, frequency, damping characteristics, and the like differ depending on each device configuration. Since the starting point of vibration is the starting point of acceleration and deceleration of the operating axis, a thrust compensation waveform that matches the vibration characteristics of the shaft and drive unit shaft configuration is obtained from that point, and vibration is suppressed by adding it to the thrust of the partner axis. I do. For example, as shown in FIGS. 6A and 6B, the exciting force generated by the operating axis is the jerk (J) calculated by differentiating the acceleration (A) obtained by differentiating the command operation speed (V), and the opposite direction. The excitation force is canceled by simultaneously adding the thrust equivalent to the above (solid line of thrust compensation in the figure) to the Y2-axis control value as a feedforward component, thereby suppressing vibration.

  Further, as shown in FIG. 4B, the vibration of the gantry vibrated by being vibrated on the operation axis has a vibration waveform starting from the jerk (J) of the operation axis as shown in FIG. 5B. When it is applied to the shaft, it appears as an extra deviation in the partner shaft, and the motor control unit of the partner shaft detects this deviation, gives feedback to cancel the deviation, issues a thrust command, and tries to return to the target position. Therefore, the vibration of the gantry is measured by a vibration measuring device 170 installed on the gantry, and as shown in FIG. 5B, the excitation force applied to the mating shaft is calculated from the vibration of the gantry 110, and the thrust equivalent to canceling the vibration applied to the mating shaft is calculated. Is added to the control value of the Y2 axis as a feedforward component simultaneously with the operation of the operation axis, thereby canceling the exciting force and suppressing the vibration. The vibration measuring device 170 may be any device that can measure displacement, speed, acceleration, etc., such as an acceleration pickup or a gyro sensor.

  As shown in FIG. 7A, in the control of the motor (M) of the drive unit of the comparative example, for the Y1 axis, the position control unit 71a outputs a speed command to the speed control unit 72a based on the operation command and the position information of the motor 75a. I do. The speed control unit 72a outputs current control information based on the speed command and the speed information of the motor 75a. The current control unit 73a controls the amplifier 74a based on the information of the amplifier (AMP) 74a and the current control information. The Y2 axis is controlled similarly to the Y1 axis. As described above, in the control method of the comparative example, the operating axis and the partner axis are controlled independently of each other, and the partner axis receives the influence of the vibration generated by the operation of the operating axis as a disturbance (external force vibration). Become.

  Therefore, as shown in FIG. 7B, in the embodiment, the thrust compensating units 76a and 76b estimate the exciting force applied to the partner axis (for example, the Y2 axis) from the operation command of the operating axis (for example, the Y1 axis), and The thrust feedforward component of the shaft is added to or subtracted from the current controllers 73a and 73b. Accordingly, at the same time as the operation axis operates, a force is generated in the direction in which the opposing axis is depressed before the vibration is generated, and the relative displacement (deviation) between the gantry 110 and the other axis affected by the vibration is suppressed. The effect of vibration can be reduced and the accuracy can be improved.

  When a device installed on a strong floor is assumed, a three-degree-of-freedom vibration system (Xa, Xb, Xframe) as shown in FIG. 8A may be assumed. Here, Ma is the mass of the entire Y1 axis, Xa is the position in the X direction of the Y1 axis, Xam is the positioning position of a drive unit such as a motor that moves the Y1 axis in the X direction, Vxam is an operation command applied to the Y1 axis, and Mb is the Y2 axis. The total mass, Xb is the position of the Y2 axis in the X direction, Xbm is the positioning position of a drive unit such as a motor that moves the Y2 axis in the X direction, Mframe is the total mass of the gantry, and Xframe is the displacement of the gantry. In this case, the inertial force and vibration of the Y2 axis having a mass of Mb may be calculated from the behavior of the Xframe (vibration acceleration (A ') of the gantry) caused by the fluctuation of the Y1 axis. In this case, it is easy to calculate and set the compensation thrust applied in the assembly adjustment stage of the device maker. However, when there is a problem with the floor rigidity that causes floor vibration due to the operation of the device, it is represented by a model (four-degree-of-freedom vibration system (Xa, Xb, Xframe, Xfloor)) as shown in FIG. Vibration having a waveform different from that in the case of three degrees of freedom is applied to the partner shaft. Where Xfloor is the floor displacement. The displacement and characteristics of the floor differ depending on the installation environment. This makes it difficult to anticipate the vibration of the gantry due to the Y1-axis operation in advance, and requires adjustment at the installation location of the apparatus. In this case, the operating shaft is operated at the installation location, and the vibration waveform obtained from the static torque and the deviation waveform of the mating shaft is measured by a vibration measuring device similar to the vibration measuring device 170 installed on the gantry 110 or the mounting heads 150a and 150b. This can be dealt with by measuring and extracting, calculating a thrust compensation waveform from the waveform, and storing it in a storage device of a control device described later.

  Further, the operation axis is periodically moved, and the vibration waveform of the mating axis is measured by a vibration measuring instrument similar to the vibration measuring instrument 170 installed on the gantry 110 or the mounting heads 150a, 150b, etc., and stored in a storage device of a control device described later. By registering and correcting, it becomes possible to correct even the aging of the apparatus. This makes it possible to automatically measure and register by utilizing the waiting time such as waiting for substrate loading and unloading occurring during the production of the apparatus.

  In the above-described embodiment, the thrust of the partner axis (for example, the Y2 axis) is calculated from the jerk calculated from the command speed of the operation axis (for example, the Y1 axis). However, as shown in FIG. The jerk acceleration may be calculated from the jerk ((a) Y1-axis jerk) calculated by differentiating the jerk calculated from the command speed of (i), and used as the thrust of the partner axis (for example, the Y2-axis). Further, as shown in FIG. 9, the characteristics (vibration waveform) of the device are measured in advance by a vibration measuring device similar to the vibration measuring device 170 installed on the gantry 110 or the mounting heads 150a and 150b, and the deviation and thrust of the partner shaft are measured. From the vibration waveform ((b) Y2-axis thrust), a canceling waveform shape for canceling the vibration may be registered in a storage device of a control device described later, and this may be used as the thrust of the partner shaft. In this case, the Y1 axis is operated, and an optimal offset waveform is generated and registered while observing the deviation and the thrust of the Y2 axis.

  As shown in FIG. 10, even when the moving distance is short, the jerk ((a) the Y1-axis jerk) calculated by differentiating the jerk calculated from the command speed of the operation axis (for example, the Y1-axis) is obtained. The rise of the jerk may be calculated and used as the thrust of the partner axis (for example, the Y2 axis). Further, as shown in FIG. 10, the characteristics (vibration waveform) of the device are measured in advance by a vibration measuring device similar to the vibration measuring device 170 installed on the gantry 110 or the mounting heads 150a and 150b, and the deviation and thrust of the partner shaft are measured. From the vibration waveform ((b) Y2-axis thrust), a canceling waveform shape for canceling the vibration may be registered in a storage device of a control device described later, and this may be used as the thrust of the partner shaft.

  Hereinafter, an example in which the present invention is applied to a flip chip bonder which is an example of the mounting apparatus of the above-described embodiment will be described. The flip chip bonder is used, for example, for manufacturing a fan-out type wafer level package (FOWLP), which is a package for forming a rewiring layer in a wide area exceeding the chip area.

FIG. 11 is a top view schematically showing the flip chip bonder of the first embodiment. FIG. 12 is a schematic sectional view showing a main part of the die supply unit of FIG.
The flip chip bonder 10 is roughly divided into a die supply unit 1, a pickup unit 2, transfer units 8a and 8b, intermediate stage units 3a and 3b, bonding units 4a and 4b, a transport unit 5, and a substrate supply unit 6K. And a control unit 7 for monitoring and controlling the operation of each unit.

  First, the die supply unit 1 supplies a die D to be mounted on a substrate P such as a substrate. The die supply unit 1 includes a wafer holding table 12 that holds the divided wafers 11 and a push-up unit 13 that pushes up a die D from the wafer 11 by a dotted line. The die supply unit 1 is moved in the X and Y directions by driving means (not shown) to move the die D to be picked up to the position of the push-up unit 13. The die supply unit 1 moves the wafer ring 14 to a pickup point so that a desired die D can be picked up from the wafer ring 14. The wafer ring 14 is a jig to which the wafer 11 is fixed and which can be attached to the die supply unit 1.

  The pickup unit 2 has a pickup flip head 21 that picks up and reverses the die D, and each driving unit (not shown) that moves the collet 22 up and down, rotates, reverses, and moves in the X-axis direction. With such a configuration, the pickup flip head 21 picks up the die D, rotates the pickup flip head 21 by 180 degrees, inverts the bumps of the die D, faces the lower surface, and transfers the die D to the transfer heads 81a and 81b. Posture.

  The transfer units 8a and 8b receive the inverted die D from the pickup flip head 21 and place the die D on the intermediate stages 31a and 31b. The transfer units 8a and 8b are provided with transfer heads 81a and 81b having collets 82a and 82b for holding the die D at the tip similarly to the pickup flip head 21, and an X drive unit for moving the transfer heads 81a and 81b in the X-axis direction. 83a and 83b.

  The intermediate stage units 3a and 3b include intermediate stages 31a and 31b on which the die D is temporarily placed, and stage recognition cameras 34a and 34b. The intermediate stages 31a and 31b are movable in the Y-axis direction by a driving unit (not shown).

The bonding units 4a and 4b pick up the dies D from the intermediate stages 31a and 31b and bond the dies D onto the substrate P being transported. Bonding sections 4a and 4b are provided with bonding heads 41a and 41b provided with collets 42a and 42b for attracting and holding a die D at the tip similarly to pickup flip head 21, and a Y beam 43a for moving bonding heads 41a and 41b in the Y-axis direction. , 43b, board recognition cameras 44a, 44b for capturing position recognition marks (not shown) on the board P and recognizing the bonding positions, and X support bases 451a, 451b.
With such a configuration, the bonding heads 41a and 41b pick up the die D from the intermediate stages 31a and 31b and bond the die D to the substrate P based on the image data of the substrate recognition cameras 44a and 44b.

  The transport unit 5 includes transport rails 51 and 52 on which the substrate P moves in the X direction. The transport rails 51 and 52 are provided in parallel. With such a configuration, the substrate P is unloaded from the substrate supply unit 6K, moved to the bonding position along the transfer rails 51 and 52, moved to the substrate unloading unit 6H after bonding, and transferred to the substrate unloading unit 6H. hand over. While bonding the die D to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the transport rails 51 and 52.

  The control device 7 includes a storage device (memory) for storing a program (software) and data for monitoring and controlling the operation of each part of the flip chip bonder 10, a central processing unit (CPU) for executing the program stored in the memory. , Is provided.

  As shown in FIG. 12, a die supply unit 1 includes an expand ring 15 for holding a wafer ring 14, a support ring 17 for horizontally positioning a dicing tape 16 held on the wafer ring 14 and having a plurality of dies D adhered thereto. And a push-up unit 13 for pushing up the die D upward. In order to pick up a predetermined die D, the push-up unit 13 is vertically moved by a drive mechanism (not shown), and the die supply unit 1 is horizontally moved.

  The bonding portion will be described with reference to FIGS. FIG. 14 is a schematic side view showing a main part of the bonding section 4. Some components are shown in perspective. The side view of FIG. 14 corresponds to the side view of FIG. Hereinafter, the description will be made focusing on the Y beam 43a side of the bonding portion 4, but the Y beam 43b has a configuration symmetrical to the Y beam 43a.

  The bonding section 4 includes a bonding stage BS (mounting stage 120) supported on the gantry 53 (gantry 110), an X support 451a (X support 131a) provided near the transport rails 51 and 52, The Y beam 43a (Y beam 140a) supported on the support base 451a, the bonding head 41a (mounting head 150a) supported by the Y beam 43a, and the bonding head 41a are driven in the Y axis direction and the Z axis direction. A driving unit 46a (a driving unit 160a).

  The bonding head 41a is a device having a collet 42a (holding means 151a) for detachably holding the die D (component 300), and is attached to the Y beam 43a so as to be able to reciprocate in the Y-axis direction.

  In the case of this embodiment, one bonding head 41a is provided, and the bonding head 41a is provided with a collet 42a that holds the die D by vacuum suction. Further, the driving section 46a can move the bonding head 41a up and down in the Z-axis direction. The bonding head 41a has a function of holding and transporting the die D picked up from the intermediate stage 31a, and mounting the die D on the substrate P (work 200) fixed by suction to the bonding stage BS.

  Guides 452a and 452b provided on the X support bases 451a and 451b are members that guide the Y beam 43a slidably in the X-axis direction. In the case of the present embodiment, two X support bases 451a and 451b are arranged in parallel, and the X support bases 451a and 451b are fixed on the transport rails 51 and 52 so as to extend in the X-axis direction. I have. The X support bases 451a and 451b may be formed integrally with the transport rails 51 and 52.

  As shown in FIGS. 11 and 14, sliders 433a and 433b are mounted on guides 452a and 452b so as to be movable in the X-axis direction. Both ends of the Y beam 43a are mounted on the sliders 433a and 433b of the two guides 452, respectively. That is, the Y beam 43a extends in the Y-axis direction so as to straddle over the bonding stage BS, and both ends are attached to the sliders 433a and 433b, and are guided by the guides 452a and 452b attached to the X support bases 451a and 451b. It is movably supported in the direction. Since the bottom surface of the Y beam 43a and the top surfaces of the sliders 433a and 433b are located on the same plane, the Y beam 43a is provided at a position that is not so high from the X support bases 451a and 451b.

  The Y beam 43a of the first embodiment has basically the same configuration as the Y beam 140a of the embodiment. However, the Y beam 43a extends to the right more than the support 451a on the right side in the drawing. This is to enable the bonding head 41a to pick up the die D from the intermediate stage 31a. When the bonding head 41a moves to the right side of the support 451a, the bonding head 41a is raised so that the collet 42a is higher than the guide 452a.

  Next, a bonding method (a method of manufacturing a semiconductor device) performed in the flip chip bonder of the first embodiment will be described with reference to FIG. FIG. 15 is a flowchart showing a bonding method performed by the flip chip bonder of the first embodiment. The following description will focus on the Y beam 43a side, but the same applies to the Y beam 43b side. However, although the Y beam 43b operates at a different timing from the Y beam 43a, the same operation may be performed at the same time.

  Step S <b> 1: The controller 7 moves the wafer holder 12 so that the die D to be picked up is located directly above the push-up unit 13, and positions the die to be peeled in the push-up unit 13 and the collet 22. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. At this time, the control device 7 sucks the dicing tape 16 on the upper surface of the push-up unit 13. The control device 7 lowers the collet 22 while evacuating it, lands on the die D to be separated, and sucks the die D. The controller 7 raises the collet 22 and peels the die D from the dicing tape 16. As a result, the die D is picked up by the pickup flip head 21.

  Step S2: The control device 7 moves the pickup flip head 21.

  Step S3: The control device 7 rotates the pickup flip head 21 by 180 degrees, inverts the bump surface (surface) of the die D toward the lower surface, and inverts the bump (surface) of the die D toward the lower surface. To the transfer head 81a.

  Step S4: The control device 7 picks up the die D from the collet 22 of the pickup flip head 21 by the collet 82a of the transfer head 81a, and transfers the die D.

  Step S5: The control device 7 reverses the pickup flip head 21 and turns the suction surface of the collet 22 downward.

  Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81a to the intermediate stage 31a.

  Step S7: The control device 7 places the die D held on the transfer head 81a on the intermediate stage 31a.

  Step S8: The control device 7 moves the transfer head 81a to the transfer position of the die D.

  Step S9: After or concurrently with step S8, the control device 7 moves the intermediate stage 31a to a transfer position with the bonding head 41a.

  Step SA: The control device 7 picks up the die D from the intermediate stage 31a by the collet 42a of the bonding head 41a, and transfers the die D.

  Step SB: The control device 7 moves the intermediate stage 31a to a transfer position with the transfer head 81a.

  Step SC: The control device 7 moves the die D held by the collet 42a of the bonding head 41a onto the substrate P. At this time, the Y beam 43a moves in the X-axis direction and the bonding head 41a moves in the Y-axis direction.

  Step SD: The control device 7 places the die D picked up from the intermediate stage 31a by the collet 42a of the bonding head 41a on the substrate P.

  Since the Y beams 43a and 43b move at mutually different timings, the bonding head 41b moves at the timing when the bonding head 41a places the die D on the substrate P. Therefore, as shown in FIG. 7B, in the positioning control of the motor (M) of the drive unit, the control device 7 generates the excitation force applied to the Y beam 43a (the partner axis) from the operation command of the Y beam 43b (the operation axis). Estimate and add or subtract to the thrust feedforward of the partner shaft as thrust compensation.

  Step SE: The controller 7 moves the bonding head 41a to a transfer position with the intermediate stage 31a.

  Hereinafter, an example in which the present invention is applied to a die bonder that bonds a semiconductor chip (die) to a substrate or the like, which is an example of the mounting apparatus of the above-described embodiment, will be described.

  FIG. 16 is a schematic top view of the die bonder of the second embodiment.

  The die bonder 10A of the second embodiment is roughly divided into a die supply unit 1 for supplying a die D mounted on a substrate P, pickup units 2A and 2B for picking up dies from the die supply unit 1, and a die D picked up. Intermediate stage portions 3A and 3B which are placed once in the middle, bonding portions 4A and 4B for picking up dies D of the intermediate stage portions 3A and 3B and bonding them onto substrate P or already bonded dies D, and substrate P Transport unit 5 for transporting the substrate to the mounting position, a substrate supply unit 6K for supplying the substrate to the transport unit 5, a substrate unloading unit 6H for receiving the mounted substrate P, a control device 7 for monitoring and controlling the operation of each unit, Having.

  First, the die supply unit 1 has a wafer holding table 12 that holds a wafer 11 having a plurality of dies D, and a push-up unit 13 indicated by a dotted line that pushes up the dies D from the wafer 11. The die supply unit 1 is moved in the XY axis directions by driving means (not shown), and moves the die D to be picked up to the position of the push-up unit 13.

  The pickup units 2A and 2B have collets 22A and 22B for sucking and holding the die D pushed up by the push-up unit 13 at the tip, and pick-up the die D and placing the pickup D on the intermediate stage units 3A and 3B. , 21B, and X drive units 23A, 23B of the pickup head for moving the pickup heads 21A, 21B in the X-axis direction. Note that the pickup heads 21A and 21B have respective drive units (not shown) that move the collets 22A and 22B up and down, rotate, and move in the X direction. The pickup head 21A picks up the die D from the wafer 11, moves to the left in the X-axis direction, and places the die D on the intermediate stage 31A provided at the intersection of the trajectory with the bonding head 41A. The pickup head 21B picks up the die D from the wafer 11, moves to the right in the X-axis direction, and places the die D on the intermediate stage 31B provided at the intersection of the trajectory with the bonding head 41B. The pickup heads 21A and 21B move at different timings in directions opposite to each other.

  The intermediate stage units 3A and 3B include intermediate stages 31A and 31B on which the die D is temporarily placed, and stage recognition cameras 34A and 34B for recognizing the die D on the intermediate stages 31A and 31B.

  The bonding parts 4A and 4B have the same structure as the pickup head, and pick up the die D from the intermediate stages 31A and 31B and bond them to the transported substrate P, and the bonding heads 41A and 41B. Collets 42A and 42B attached to the leading end for sucking and holding the die D, Y driving units 43A and 43B for moving the bonding heads 41A and 41B in the Y-axis direction, and a position recognition mark (not shown) of the transferred substrate P ), And board recognition cameras 44A and 44B for recognizing the bonding position of the die D to be bonded. The bonding stages BS1 and BS3 are located on the transport rail 51 side, and the bonding stage BS2 is located on the transport rail 52 side.

  With such a configuration, the bonding heads 41A and 41B correct the pickup position and attitude based on the image data of the stage recognition cameras 34A and 34B, pick up the die D from the intermediate stages 31A and 31B, and perform the board recognition cameras 44A and 44B. The die D is bonded to the substrate P based on the image data of 44B.

  The transport unit 5 is configured to convert the substrate transport pallets 91 and 93 on which one or a plurality of substrates P (fifteen in FIG. 1) are placed into two transport rails 51 provided with two transport chutes and two substrate transport pallets 92. Transport chute 52 having the transport chute. For example, the substrate transport pallets 91, 92, and 93 are moved by a transport belt (not shown) provided on a two-transport chute.

  With such a configuration, the substrate transport pallets 91, 92, and 93 have the substrate P placed on the substrate supply unit 6K, move to the bonding position along the transport chute, move to the substrate unloading unit 6H after bonding, and move to the substrate unloading unit 6H. give.

  The control device 7 includes a storage device (memory) that stores a program (software) and data for monitoring and controlling the operation of each unit of the die bonder 10A, and a central processing unit (CPU) that executes the program stored in the memory. Prepare.

  Since the bonding heads 41A and 41B move at different timings from each other, the bonding head 41A moves at the timing when the bonding head 41B places the die D on the substrate P. Therefore, as shown in FIG. 7B, in the positioning control of the motor (M) of the drive unit, the control device 7 applies the vibration applied to the Y drive unit 43B (the partner axis) from the operation command of the Y drive unit 43A (the operation axis). The force is estimated and added to or subtracted from the thrust feedforward of the partner shaft as thrust compensation.

  As described above, the invention made by the inventor has been specifically described based on the embodiment and the example. However, the present invention is not limited to the above embodiment and the example, and it can be variously modified. Not even.

  In the embodiment, one example of the bonding head (mounting head) has been described. However, the present invention is not limited to this, and a plurality of bonding heads may be used as in the embodiment.

  Further, in the embodiment, the example in which the reversing mechanism is provided in the pickup flip head, the transfer head receives the die from the pickup flip head, mounts the die on the intermediate stage, and moves the intermediate stage, but is not limited thereto. Instead, the die may be picked up and the inverted flip-flop head may be moved, or the picked-up die D may be placed on a stage unit that can rotate the front and back of the die, and the stage unit may be moved. .

  Further, in the embodiment, an example in which a flip chip bonder and a die bonder for bonding a semiconductor chip (die) to a substrate or the like will be described. However, the present invention is not limited to this, and a packaged semiconductor device or the like is mounted on the substrate. The present invention can also be applied to a chip mounter (surface mounter) or the like that performs the above.

100: mounting apparatus 110: mount 120: mounting stage 130a, 130b: X beam 131a, 131b: X support 132a, 132b: guide 140a, 140b: Y beam 150a, 150b: mounting head 160a, 160b: drive unit 170: vibration Measuring instrument 200: Work 300: Parts

Claims (14)

A first mounting head that transports the die,
The operation timing is different from the first mounting head, and a second mounting head for transporting a die,
A first drive unit that freely moves the first mounting head in a first direction,
A second drive unit that freely moves the second mounting head in the first direction,
A control unit that controls the first drive unit and the second drive unit,
With
The control unit calculates a vibration force generated when the first mounting head is moved from a command value, or as a vibration waveform measured and registered in advance, the thrust corresponding to canceling the vibration force in a direction opposite to the vibration force. A mounting device configured to add a component as a feedforward component to a control amount of the second mounting head. The mounting device according to claim 1,
The mounting apparatus, wherein the exciting force is an jerk calculated by differentiating the command operation speed to the first mounting head. The mounting device according to claim 1,
The mounting apparatus, wherein the exciting force is an applied acceleration calculated by differentiating from a command operation speed to the first mounting head. The mounting device according to claim 1,
The mounting apparatus, wherein the exciting force is a vibration waveform corresponding to a previously measured jerk of the first mounting head. The mounting device according to claim 1, further comprising:
A base on which the mounting stage is mounted,
A vibration measuring instrument installed on the gantry,
With
The control unit measures a vibration waveform by the vibration measuring device, calculates a vibration component applied to the second mounting head based on the vibration waveform, stores and stores the vibration component, and the second mounting head based on the vibration component. Mounting device that corrects the control amount of The mounting device according to claim 1,
Further, a vibration measuring device mounted on the second mounting head,
The control unit measures a vibration waveform by the vibration measuring device, calculates a vibration component applied to the second mounting head based on the vibration waveform, stores and stores the vibration component, and the second mounting head based on the vibration component. Mounting device that corrects the control amount of The mounting device according to claim 1,
In addition, equipped with a vibration measuring device,
The control unit moves the first mounting head in a state where the mounting apparatus is installed on the floor of a production place, measures the vibration waveform of the second mounting head by vibrating the vibration measuring device, A mounting device for adjusting a thrust correction waveform of the second mounting head based on a vibration waveform. The mounting device according to claim 1,
In addition, equipped with a vibration measuring device,
The control unit moves the first mounting head during a standby time or a standby time during the operation of the mounting apparatus, measures the vibration waveform of the second mounting head by vibrating the vibration measuring device, A mounting device that stores and corrects a vibration compensation waveform of the second mounting head based on the vibration waveform. The mounting apparatus according to claim 8,
The control unit obtains a thrust or a deviation waveform of the motor driver of the second driving unit by the vibration measuring device, calculates a thrust correction waveform of the second mounting head based on the thrust or the deviation waveform, and stores the waveform. Mounting equipment. The mounting device according to claim 1, further comprising:
A base on which the mounting stage is mounted,
A first beam extending in the first direction so as to cross over the gantry and both ends thereof are supported on the gantry so as to be movable in the second direction, respectively;
A second beam extending in the first direction so as to cross over the gantry, and both ends of which are supported on the gantry movably in the second direction,
With
The first mounting head is supported by the first beam movably in the second direction,
The second mounting head is supported by the second beam movably in the second direction,
The mounting device, wherein the control unit is configured to move the first beam in the first direction by the first drive unit and move the second beam in the first direction by the second drive unit. The mounting device according to claim 10, further comprising:
A flip pickup head that picks up a die from a die supply unit and inverts the die,
A first transfer head that is freely movable in the first direction and picks up the die picked up by the flip pickup head,
A second transfer head that is freely movable in the first direction and picks up the die picked up by the flip pickup head,
A first intermediate stage on which the die that can be freely moved in the second direction and is picked up by the first transfer head is placed;
A second intermediate stage that can be freely moved in the second direction and on which the die picked up by the first transfer head is mounted,
With
The first mounting head picks up the die mounted on the first intermediate stage,
The mounting device for picking up the die mounted on the second intermediate stage, wherein the second mounting head is used. The mounting device according to claim 1, further comprising:
A first pickup head that is freely movable in a second direction and picks up a die from a die supply;
A second pickup head that is freely movable in the second direction and picks up a die from the die supply;
A first intermediate stage on which the die picked up by the first pickup head is mounted,
A second intermediate stage on which the die picked up by the second pickup head is mounted,
With
The first mounting head picks up the die mounted on the first intermediate stage,
The mounting device for picking up the die mounted on the second intermediate stage, wherein the second mounting head is used. Preparing a mounting device according to any one of claims 1 to 11,
Preparing a substrate;
Picking up the die from a die supply unit;
Inverting the die that has been picked up;
Picking up the inverted die and placing it on the substrate;
A method for manufacturing a semiconductor device comprising: Preparing a mounting device according to any one of claims 1 to 9 and 12,
Preparing a substrate;
Picking up the die from a die supply unit;
Picking up the die and mounting it on the substrate;
A method for manufacturing a semiconductor device comprising:

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