TWI712100B - Electronic parts packaging device - Google Patents

Abstract

The invention realizes the reduction of the installation space and the improvement of the packaging accuracy in an electronic part packaging device including a plurality of packaging heads. The bonding device 100 for packaging the semiconductor chip 16 on the substrate 15 includes a common linear guide 20 extending in the Y direction; a plurality of packaging heads 21a and 21b are arranged in the Y direction and are guided by the linear guide 20 Move in the Y direction; and the control unit 50 adjusts the positions of the packaging head 21a and the packaging head 21b in the Y direction; and the control unit 50 causes the packaging head 21a and the packaging head 21b to face in the same direction while starting, and causes the packaging head 21a and the packaging The head 21b stops at the same time.

Description

Electronic parts packaging device

The invention relates to a structure of an electronic component packaging device.

As a packaging device for packaging electronic parts on a substrate, the following packaging device is used, which includes: a pick-up part, which picks up a semiconductor die from a wafer and places it on an intermediate platform; and a bonding part, The semiconductor wafer is picked up from the intermediate platform, transferred to the substrate, and bonded to the substrate.

In addition, in the packaging device, there has also been proposed a device that includes two pick-up parts and a bonding part, and alternately performs pick-up and bonding to shorten bonding time (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-130583

[The problem to be solved by the invention]

However, in the packaging device described in Patent Document 1, since the two packaging heads are arranged in a direction orthogonal to the support arm, a large installation space is required. In addition, since picking and bonding are performed alternately, there is a situation in which, during bonding of one of the packaging heads, vibration caused by the actions of the other packaging heads interferes and affects the packaging accuracy. This effect becomes more pronounced when the packaging head is moved at a high speed in order to shorten the packaging time.

Therefore, the object of the present invention is to reduce the installation space and improve the packaging accuracy in an electronic component packaging device including a plurality of packaging heads. [Means to solve the problem]

The electronic component packaging device of the present invention is an electronic component packaging device that encapsulates electronic components on a substrate or other electronic components, and includes: a linear guide extending in a predetermined direction; a plurality of packaging heads arranged in a predetermined direction, It is guided by the linear guide to move in a predetermined direction; and the control unit adjusts the position of the packaging head in the predetermined direction; and the control unit makes the packaging heads start in the same direction and simultaneously starts, and stops the packaging heads at the same time.

As described above, by arranging the packaging heads in a predetermined direction, the installation space can be reduced. In addition, by starting and stopping a plurality of packaging heads at the same time, the interference of vibration caused by the operation of each packaging head can be suppressed, and the packaging quality can be improved.

The electronic component packaging device of the present invention can also be configured as: each packaging head is equipped with a packaging nozzle for picking up and packaging electronic parts, and the picking position of the packaging nozzle picks up the electronic parts, and the packaging nozzle of the packaging head encapsulates the electronic parts Between the packaging positions, move in a predetermined direction, and the control unit makes each packaging head from each pickup position or each packaging position, facing the same direction and start at the same time, and makes each packaging head reach each packaging position or each pickup position at the same time stop.

Since the control unit causes the packaging heads to start in the same direction from the pickup position or the packaging position at the same time, reach the packaging position or the pickup position at the same time and stop at the same time, it is possible to suppress the pick-up or packaging operation of one of the packaging heads. The vibration caused by the movement of the packaging head interferes and affects the packaging accuracy.

The electronic component packaging device of the present invention can also be configured to include a plurality of packaging platforms, holding a substrate for packaging electronic parts or a substrate for packaging other electronic parts on the upper surface, and a predetermined direction between each pickup position and each packaging platform The distances are equal.

With this configuration, the distance between the pick-up position and the packaging position can be made the same, and multiple packaging heads can be started and stopped at the same time to improve packaging quality.

The electronic component packaging device of the present invention may also be configured such that the substrate is packaged with a plurality of electronic components in a predetermined direction, and the control unit makes each packaging head equal to each distance between each pickup position and each packaging position. Move and encapsulate multiple electronic parts.

With this, when multiple electronic components are packaged in a predetermined direction of the substrate, the distance between the pick-up position and the packaging position can be made the same. Therefore, multiple packaging heads can be started and stopped at the same time to improve the packaging quality.

In the electronic component packaging device of the present invention, when the respective distances between the pick-up positions and the respective packaging positions are different, the movement speed of the packaging head of the shorter distance may be made to move the packaging head of the longer distance The speed is slower.

Thereby, even when the respective distances between the pickup position and the packaging position are different, multiple packaging heads can be started and stopped at the same time, which can improve packaging quality. [Effects of the invention]

In an electronic component packaging device including a plurality of packaging heads, the present invention can reduce the installation space and improve the packaging accuracy.

Hereinafter, while referring to the drawings, the bonding device 100 which is the electronic component packaging device of the embodiment will be described. The bonding apparatus 100 encapsulates a semiconductor wafer 16 as an electronic component on a substrate 15 or another semiconductor wafer 16.

As shown in FIG. 1, the bonding device 100 includes: a base 10; a common linear guide 20 installed on the base 10 and extending in the Y direction as a predetermined direction; a plurality of package heads 21a and 21b are linearly The guide 20 is guided to move in the Y direction; and the control unit 50 adjusts the positions of the two packaging heads 21a and 21b in the Y direction.

In addition, as shown in FIG. 1, on the base 10 of the bonding device 100, two sets of transfer rails 11 a and 11 b for transferring the substrate 15 in the X direction, and two packaging platforms 12 a and 12 b are mounted. Furthermore, the joining device 100 includes: a guide frame 32 installed on the base 10 and extending in the X direction; a pickup head 33 guided by the guide frame 32 to move in the X direction; and a guide rail 30 installed It extends in the Y direction on the base 10; the intermediate platform 31 is guided by the guide rail 30 to move in the Y direction; and a wafer holder (not shown) holds the wafer 35.

The Y-direction positions of the centers of the two packaging platforms 12a and 12b are respectively 12c and 12d, and the Y-direction distance between the centers of the packaging platforms 12a and 12b is W1. In addition, two mounting tables 17 for placing and picking up semiconductor wafers 16 are provided on the upper surface of the intermediate stage 31. The Y-direction interval between the two mounting tables 17 is the same as the Y-direction interval between the packaging platform 12a and the packaging platform 12b, and is W1.

The intermediate platform 31 moves in the Y direction between the first position indicated by the solid line in FIG. 1 and the second position indicated by the dotted line. When the intermediate stage 31 reaches the second position indicated by the dotted line, the Y-direction positions of the two mounting tables 17 become the pickup position 13a and the pickup position 13b. As explained above, the Y-direction interval of the two mounting tables 17 is the same as the Y-direction interval of the packaging platform 12a and the packaging platform 12b, which is W1. Therefore, each pickup position 13a, pickup position 13b and each packaging platform 12a, packaging platform The Y-direction distances ΔYc and ΔYd between the Y-direction position 12c and the Y-direction position 12d of each center of 12b are equal.

As shown in FIG. 1, when the semiconductor wafer 16 is packaged at the negative end of the Y-direction of each substrate 15, the Y-direction position where the semiconductor wafer 16 is packaged is a package position 14a and a package position 14b. In this case, the distance in the Y direction between the packaging position 14a and the packaging position 14b is the same as the distance in the Y direction between the two mounting tables 17 and becomes W1. In this case, the distances ΔYa and ΔYb in the Y direction between each pickup position 13a, pickup position 13b, and each packaging position 14a, and packaging position 14b are equal.

The packaging heads 21a and 21b are arranged on one side of the linear guide 20 and installed in the Y direction, and are guided by the linear guide 20 to move in the Y direction. Each of the packaging heads 21a and 21b is mounted with a packaging nozzle 22a and a packaging nozzle 22b for picking up and packaging the semiconductor chip 16. Each of the packaging heads 21a, 21b, and the packaging nozzle 22a and the packaging nozzle 22b come to the mounting table 17 directly above the pickup position 13a, the pickup position 13b, the packaging nozzle 22a, and the packaging nozzle 22b to pick up the semiconductor wafer 16 to package the semiconductor wafer 16 Between the packaging position 14a and the packaging position 14b, it moves in the Y direction.

On the pickup head 33, a pickup nozzle 34 is installed. The pickup nozzle 34 picks up the semiconductor wafer 16 from the wafer 35 and places it on the mounting table 17 of the intermediate platform 31.

Drive units such as linear motors are mounted on each of the packaging head 21a, the packaging head 21b, the pickup head 33, and the intermediate platform 31, and each drive unit operates according to instructions from the control unit 50. The control unit 50 includes a computer including a central processing unit (CPU) and a memory unit inside.

Next, referring to FIGS. 2 to 8, the operation of the bonding device 100 will be described. In the following description, as shown in FIG. 1, a case where the semiconductor wafer 16 is packaged on the negative side end portion of each substrate 15 in the Y direction will be described.

As shown in FIG. 2, the control unit 50 moves each of the packaging heads 21 a and 21 b to the initial position, and moves the intermediate stage 31 to the first position on the negative side in the Y direction. In addition, the control unit 50 moves the pickup head 33 in the X direction, and uses the pickup nozzle 34 to pick up the semiconductor wafer 16 from the wafer 35 and place them on the two mounting tables 17 of the intermediate stage 31. The semiconductor wafer 16 is placed on the two mounting tables 17 of the intermediate stage 31 at intervals of a distance W1 in the Y direction.

After the placement of the semiconductor wafer 16 is completed, the control unit 50 moves the intermediate stage 31 to the second position on the positive side in the Y direction as shown in FIG. 3. When the intermediate stage 31 moves to the second position, the Y-direction position of each semiconductor wafer 16 placed on each mounting table 17 becomes a pickup position 13a and a pickup position 13b, respectively.

As shown in FIG. 4, the control unit 50 controls the packaging heads 21a and 21b so that the centers of the packaging nozzles 22a and 22b of the packaging heads 21a and 21b are the pickup positions 13a and 13b. Move to the negative side in the Y direction. At this time, the control unit 50 starts each of the packaging heads 21a and 21b from the initial position toward the negative side of the Y direction at the same time, so that the centers of the packaging nozzles 22a and 22b reach the pickup position 13a and the pickup position 13b at the same time. The movement of the packaging head 21a and the packaging head 21b to the negative side in the Y direction is stopped at the same time.

As shown in FIG. 5, the control unit 50 sucks the semiconductor wafer 16 on the tip of each packaging head 21a, each packaging nozzle 22a of the packaging head 21b, and packaging nozzle 22b, respectively, and picks up the semiconductor wafer 16 from the intermediate stage 31. After the pickup is completed, as shown in FIG. 5, the respective packaging heads 21a and 21b are moved from the pickup position 13a and the pickup position 13b to the packaging position 14a and the packaging position 14b. At this time, the control unit 50 activates the packaging heads 21a and 21b simultaneously toward the positive side in the Y direction, and causes the centers of the packaging nozzles 22a and 22b to reach the packaging position 14a and the packaging position 14b at the same time, so that the packaging heads 21a , The movement of the packaging head 21b to the positive side in the Y direction is stopped at the same time.

As described above, since the Y-direction distances ΔYa and ΔYb between each pickup position 13a, pickup position 13b, and each packaging position 14a, and packaging position 14b are equal, the control unit 50 is shown by the dotted line a and solid line a in FIG. Like the line b, at time t0, the packaging heads 21a and 21b are started at the same time, accelerated to the same speed at the same acceleration until time t1, moved at the same speed in the Y direction to time t2, and decelerated to The speed is zero until time t3, and stops at the same time at time t3. At this time, as shown by the broken line c and the solid line d in FIG. 8, the packaging heads 21 a and 21 b reach the packaging position 14 a and the packaging position 14 b at the same time. In FIG. 7, the dashed line a and the solid line b indicate the time change of the speed of each package head 21a and the package head 21b. In FIG. 8, the dashed line c and the solid line d indicate the time in the Y direction position of each package head 21a and the package head 21b. Variety.

When the movement of the packaging heads 21a and 21b to the packaging positions 14a and 14b is completed, and the packaging heads 21a and 21b are stopped, the control unit 50 lowers the packaging nozzles 22a and 22b to attract The semiconductor wafer 16 at the tip of the packaging nozzle 22 a and the packaging nozzle 22 b is packaged on each substrate 15.

After the packaging of each semiconductor chip 16 on each substrate 15 is completed, as shown in FIG. 6, the control unit 50 moves each packaging head 21a and packaging head 21b to the initial position, moves the intermediate platform to the first position, and continues to the next The semiconductor wafer 16 is picked up and packaged.

In the case where a plurality of semiconductor wafers 16 are arranged and packaged in the Y direction on the substrate 15, the control unit 50 makes the distances between the respective pickup positions 13a, 13b, and the respective packaging positions 14a and 14b equal In this way, each of the packaging heads 21a and 21b is moved to package a plurality of semiconductor wafers 16. For example, as shown in FIG. 1, if the semiconductor chip 16 is packaged on the negative side end of each substrate 15 in the Y direction, next, the semiconductor chip 16 is packaged at positions shifted by ΔY1 from the initial package position to the positive side in the Y direction. . In this case, the Y-direction distance between the packaging positions 14a and 14b is W1. Therefore, the distances between the pickup position 13a and the pickup position 13b and the respective packaging positions 14a and 14b are equal, which is the same as the above In the same way, by moving the packaging heads 21a and 21b in the Y direction at the same acceleration and speed, they can be started at the same time and reach the packaging position 14a and 14b at the same time, so that the packaging heads 21a and 21b are stopped at the same time. .

As described above, in the bonding device 100 of the present embodiment, since the packaging head 21a and the packaging head 21b are arranged on one side of the linear guide 20 and arranged in the Y direction, the undisposed linear guide 20 can be packaged The space on one side of the head 21a and the packaging head 21b is used as an arrangement space for other devices. Therefore, the installation space can be reduced. In addition, since the control unit 50 causes each of the packaging heads 21a and 21b to start in the same direction from the pick-up position 13a and the pick-up position 13b, and simultaneously reach the packaging position 14a and the packaging position 14b and stop at the same time, it can be packaged in one of them. During the pick-up operation or the packaging operation of the head 21a, vibration caused by the movement of other packaging heads 21b is suppressed to interfere with the packaging accuracy, thereby improving the packaging accuracy.

Next, the case where each distance between each pick-up position 13a, the pick-up position 13b, and each packaging position 14a1, and the packaging position 14b is different is demonstrated.

As shown in FIG. 9, the semiconductor chip 16 is packaged at the Y-direction negative end of the substrate 15 on the negative side (near side) in the Y direction and the Y-direction positive end of the substrate 15 on the positive side (rear side) in the Y direction. In this case, the distance W2 between the packaging position 14b on the near side and the packaging position 14a1 on the back side is greater than the distance W1 between the pickup position 13b on the near side and the pickup position 13a on the back side. In this case, the distance ΔYa1 between the pickup position 13a on the back side and the packaging position 14a1 on the back side is greater than the distance ΔYb between the pickup position 13b on the near side and the packaging position 14b on the near side. In this case, the control unit 50 makes the moving speed of the packaging head 21b of the shorter moving distance slower than the moving speed of the packaging head 21a of the longer moving distance, so that each of the packaging heads 21a and 21b is At the same time, the packaging head 21a, the packaging nozzle 22a, and the packaging nozzle 22b of the packaging head 21b reach the packaging positions 14a1 and 14b at the same time, and the Y-direction movement of the packaging heads 21a and 21b is stopped at the same time.

As shown in FIG. 11, the control part 50 controls the speed of each packaging head 21a and the packaging head 21b. In FIG. 11, the dotted line e and the solid line b indicate the time change of the speed of each packaging head 21a and the packaging head 21b. In FIG. 12, the dotted line f and the solid line d are at the Y-direction positions of the packaging heads 21a and 21b. Indicates a change in time.

The control unit 50, like the dotted dotted line e and the solid line b shown in FIG. 11, simultaneously activates the respective packaging heads 21a and 21b at time t0. The packaging head 21b on the near side stops accelerating at time t11 due to the short moving distance, and moves at a constant speed in the Y direction at a slower speed than the packaging head 21a on the back side. On the other hand, the packaging head 21a on the back side continues to accelerate to time t1, and moves at a constant speed from time t1, as described above. Then, the packaging head 21a on the back side starts to decelerate from time t2, reaches the packaging position 14a1 at time t3, and becomes zero speed at time t3. The packaging head 21b on the near side continues to move at a constant speed to time t12, starts to decelerate from time t12, reaches the packaging position 14b at time t3, and becomes zero speed at time t3.

At time t3, after the Y-direction movement of the packaging heads 21a and 21b is stopped, the control unit 50 encapsulates the semiconductor wafers 16 sucked by the packaging heads 21a, 21b, and packaging nozzles 22a and 22b in each On the substrate 15. After the packaging of each semiconductor wafer 16 on each substrate 15 is completed, as shown in FIG. 10, the control unit 50 moves each of the packaging heads 21a and 21b to the initial position, moves the intermediate stage 31 to the first position, and continues The pickup and packaging operation of the next semiconductor wafer 16 is performed.

As described above, in the bonding device 100 of the embodiment, when the distances ΔYa1 and ΔYb between the pick-up position 13a, the pick-up position 13b, and the packaging position 14a1, and the packaging position 14b are different, the one with the shorter moving distance The moving speed of the packaging head 21b is slower than the moving speed of the packaging head 21a of the longer distance. Thereby, even when the distances ΔYa1 and ΔYb between the pickup position 13a, the pickup position 13b, the packaging position 14a1, and the packaging position 14b are different, the two packaging heads 21a and 21b can be started and stopped at the same time . During the pick-up or packaging action of one of the packaging heads 21a, the vibration caused by the movement of the other packaging heads 21b can be suppressed to interfere with the packaging accuracy, thereby improving the packaging accuracy.

Next, referring to FIGS. 13 to 15, a bonding device 200 according to another embodiment will be described. The same parts as those of the joining device 100 previously described with reference to FIGS. 1 to 12 are given the same reference numerals, and the description is omitted.

As shown in FIG. 13, the bonding device 200 arranges two linear guides 20 in parallel in the Y direction, and respectively mounts two packaging heads 21a, 21b, and 21c to each linear guide 20. Encapsulation head 21d. Each packaging head 21a, packaging head 21b, packaging head 21c, and packaging head 21d are arranged so as to face each other between the two linear guides 20. Therefore, the space on the side of the linear guide 20 where the packaging head 21a and 21b are not provided, and the side where the packaging head 21c and the packaging head 21d are not provided can be set as a space for other machines, which is better than arranging two for bonding For the device 100, the installation space can be further reduced.

In addition, the joining device 200 is provided with two guide rails 30 and two intermediate platforms 31 guided by the guide rails 30. Furthermore, two pick-up heads 33 are attached to the guide frame 32 extending in the X direction.

The operation of the bonding device 200 configured as described above will be described.

The control unit 50 moves the two pick-up heads 33 in the X direction, and places four semiconductor wafers 16 in total on each mounting table 17 of the intermediate stage 31 from the two wafers 35.

The control unit 50 is the same as the description with reference to FIG. 4, and as shown in FIG. 14, each package nozzle 22a, package nozzle 22b, package nozzle 22c, package head 21a, package head 21b, package head 21c, and package head 21d The center of the nozzle 22d becomes the pickup position 13a and the pickup position 13b, and each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d is moved toward the negative side in the Y direction. At this time, the control unit 50 activates each of the packaging heads 21a, 21b, 21c, and 21d from the initial position toward the negative side of the Y direction at the same time, and causes each of the packaging nozzles 22a, 22b, 22c, and The center of the nozzle 22d reaches the pickup position 13a and the pickup position 13b at the same time, and the movement of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d to the negative side in the Y direction is simultaneously stopped. Then, the semiconductor wafer 16 is sucked at the tip of each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging nozzle 22a, the packaging nozzle 22b, the packaging nozzle 22c, and the packaging nozzle 22d of the packaging head 21d.

The control unit 50 moves the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d from the pickup position 13a and the pickup position 13b to the packaging position 14a and the packaging position 14b in the same manner as described above with reference to FIG. At this time, the control unit 50 activates each of the packaging heads 21a, 21b, 21c, and 21d at the same time toward the positive side in the Y direction, so that the packaging nozzles 22a, 22b, 22c, and 22d are The center reaches the packaging position 14a and the packaging position 14b at the same time, and the movement of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d to the positive side in the Y direction is simultaneously stopped.

When the movement of the packaging heads 21a and 21b to the packaging positions 14a and 14b is completed, and the packaging heads 21a and 21b are stopped, the control unit 50 lowers the packaging nozzles 22a and 22b to attract The semiconductor wafer 16 at the tip of the packaging nozzle 22 a and the packaging nozzle 22 b is packaged on each substrate 15.

In addition to the functions and effects of the bonding device 100, the bonding device 200 of this embodiment can further reduce the installation space compared to the bonding device 100. Four package heads 21a, 21b, 21c, and 21d can be used. The four semiconductor chips 16 are packaged at the same time, so the packaging speed can be further increased.

In addition, in the above description, the case where the two pick-up heads 33 pick up the semiconductor wafers 16 from the two wafers 35 and place them on each mounting table 17 of the intermediate stage 31 has been described, but it is not limited to this, for example, It may be configured that each pickup head 33 picks up the semiconductor wafer 16 from one wafer 35 and places it on each mounting table 17 of each intermediate stage 31.

10‧‧‧Base 11a, 11b‧‧‧Conveying track 12a, 12b‧‧‧Packaging platform 12c, 12d‧‧‧Y direction position 13a, 13b‧‧‧Pickup position 14a, 14a1, 14b‧‧‧Packaging position 15‧‧‧Substrate 16‧‧‧Semiconductor chip 17‧‧‧Mounting table 20‧‧‧Linear guide 21a, 21b, 21c, 21d‧‧‧Packing head 22a, 22b, 22c, 22d‧‧‧Packing nozzle 30‧‧‧Guide 31‧‧‧Intermediate platform 32‧‧‧Guide frame 33‧‧‧Pickup head 34‧‧‧Pick up nozzle 35‧‧‧wafer 50‧‧‧Control Department 100、200‧‧‧Joint device a, c‧‧‧dotted line b, d‧‧‧Solid line e、f‧‧‧dotted dotted line t0, t1, t2, t3, t11, t12; ‧‧‧ time X, Y, Z‧‧‧direction ΔYa, ΔYa1, ΔYb, ΔYc, ΔYd, W1, W2‧‧‧Distance

Fig. 1 is a plan view showing the configuration of a bonding device according to an embodiment. Fig. 2 is a plan view showing a pickup operation of a semiconductor wafer by a pickup head of the bonding apparatus shown in Fig. 1. Fig. 3 is a plan view showing a movement operation of an intermediate platform of the joining device shown in Fig. 1. Fig. 4 is a plan view showing movement of the packaging head of the bonding device shown in Fig. 1 to a pick-up position. 5 is a plan view showing the movement of the packaging head of the bonding device shown in FIG. 1 to the packaging position. 6 is a plan view showing the movement of the packaging head to the initial position and the movement of the intermediate stage to the first position after the semiconductor chip is packaged on the substrate using the bonding apparatus shown in FIG. 1. FIG. 7 is a graph showing the time change of the speed of each packaging head when each distance between each pickup position and each packaging position is equal in the bonding apparatus shown in FIG. 1. FIG. 8 is a graph showing the time change of the position of each packaging head in the Y direction when the respective distances between each pickup position and each packaging position are the same in the bonding apparatus shown in FIG. 1. 9 is a plan view showing the movement of the packaging head to the packaging position in the case where the respective distances between the pick-up positions and the packaging positions are different in the bonding device shown in FIG. 1. 10 is a plan view showing the movement of the packaging head to the initial position after the semiconductor chip is packaged on the substrate after the movement of the packaging head shown in FIG. 9 and the movement of the intermediate stage to the first position. FIG. 11 is a graph showing the time change of the speed of each packaging head during the movement of the packaging head shown in FIG. 9. FIG. 12 is a graph showing the time change of the position of each packaging head in the Y direction when the packaging head shown in FIG. 9 is moved. Fig. 13 is a plan view showing the configuration of a bonding device according to another embodiment. Fig. 14 is a plan view showing the movement of the packaging head of the bonding device shown in Fig. 13 to a pickup position. 15 is a plan view showing the movement of the packaging head of the bonding device shown in FIG. 13 to the packaging position.

10‧‧‧Base

11a, 11b‧‧‧Conveying track

12a, 12b‧‧‧Packaging platform

12c, 12d‧‧‧Y direction position

13a, 13b‧‧‧Pickup position

14a, 14b‧‧‧Packaging position

15‧‧‧Substrate

16‧‧‧Semiconductor chip

17‧‧‧Mounting table

20‧‧‧Linear guide

21a, 21b‧‧‧Packing head

22a、22b‧‧‧Packing nozzle

30‧‧‧Guide

31‧‧‧Intermediate platform

32‧‧‧Guide frame

33‧‧‧Pickup head

34‧‧‧Pick up nozzle

35‧‧‧wafer

50‧‧‧Control Department

100‧‧‧Joint device

X, Y, Z‧‧‧direction

ΔYa, ΔYb, ΔYc, ΔYd, W1‧‧‧Distance

Claims (5)

An electronic component packaging device is an electronic component packaging device that encapsulates electronic components on a substrate or other electronic components, and includes: Linear guide, extending in the specified direction; A plurality of packaging heads are arranged in a predetermined direction and are guided by the linear guide to move in a predetermined direction; and The control part adjusts the position of the packaging head in the specified direction; and The control unit causes each of the packaging heads to face the same direction and simultaneously starts, and causes each of the packaging heads to stop simultaneously. The electronic component packaging device as described in item 1 of the scope of patent application, wherein Each of the packaging heads is equipped with a packaging nozzle for picking up and packaging the electronic parts, and the picking position of the electronic parts is picked up at the packaging nozzles, and the packaging nozzles of the packaging heads Between the package positions of the package, move in the specified direction, and The control unit causes each of the packaging heads to start at the same direction from each of the pickup positions or each of the packaging positions at the same time, and causes each of the packaging heads to reach each of the packaging positions or each of the pickup positions at the same time And stop at the same time. The electronic component packaging device as described in item 2 of the scope of patent application, wherein Comprising a plurality of packaging platforms, holding the substrate encapsulating the electronic components or the substrate encapsulating the other electronic components on the upper surface; and The distance between each of the pickup positions and each of the packaging platforms is equal in a predetermined direction. The electronic component packaging device as described in item 3 of the scope of patent application, wherein The substrate is packaged with a plurality of the electronic components in a predetermined direction, and The control unit moves each of the packaging heads to package a plurality of the electronic components so that each distance between each of the pickup positions and each of the packaging positions becomes equal. Such as the electronic component packaging device described in item 2 or item 3 of the scope of patent application, wherein In the case where each distance between each of the pickup positions and each of the packaging positions is different, the control unit The moving speed of the packaging head on the shorter distance is slower than the moving speed of the packaging head on the longer distance.

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