TW202008495A - Electronic component mounting device - Google Patents

Abstract

A bonding device (100) for mounting a semiconductor die (16) onto a substrate (15) is provided with: a common linear guide (20) extending in the Y-direction; a plurality of mounting heads (21a, 21b) which are arranged in the Y-direction and are moved in the Y-direction while being guided by the linear guide (20); and a control unit (50) which adjusts the position of the mounting heads (21a, 21b) in the Y-direction. The control unit (50) causes the mounting heads (21a, 21b) to be moved in the same direction simultaneously, and causes the mounting heads (21a, 21b) to be stopped simultaneously.

Description

Electronic parts packaging device

The invention relates to a structure of an electronic parts packaging device.

As a packaging device for packaging electronic parts on a substrate, the following packaging device is used, which includes: a pick-up section that picks up a semiconductor die (semiconductor die) from a wafer and mounts it on an intermediate platform; and a bonding section, The semiconductor wafer is picked up from the intermediate platform, transferred to the substrate, and bonded to the substrate.

In addition, in the packaging device, there is also proposed a device that includes two pickup parts and a bonding part and alternately picks up and bonds to shorten the bonding time (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-130583

[Problems to be solved by the invention]

However, in the packaging device described in Patent Document 1, since the two packaging heads are arranged in a direction orthogonal to the support arm, a large installation space is required. In addition, since picking and bonding are alternately performed, there is a case where, in the bonding of one of the packaging heads, the vibration caused by the operation of the other packaging head interferes and affects the packaging accuracy. This effect becomes more pronounced when the packaging head is moved at high speed in order to shorten the packaging time.

Therefore, the object of the present invention is to reduce the installation space and improve the packaging accuracy in an electronic component packaging device including a plurality of packaging heads. [Means to solve the problem]

The electronic component packaging device of the present invention is an electronic component packaging device for packaging electronic components on a substrate or other electronic components, including: a linear guide (linear guide) extending in a predetermined direction; a plurality of packaging heads arranged in a predetermined direction, It is guided by the linear guide to move in a predetermined direction; and the control unit adjusts the position of the packaging head in the predetermined direction; and the control unit causes each packaging head to start simultaneously in the same direction and stops each packaging head at the same time.

As described above, by arranging the packaging heads in a predetermined direction, the installation space can be reduced. In addition, by starting and stopping a plurality of package heads at the same time, it is possible to suppress the interference of vibration caused by the operation of each package head, and it is possible to improve the package quality.

In the electronic component packaging device of the present invention, each packaging head may be provided with a packaging nozzle for picking up and packaging electronic components, and a pick-up position for picking up electronic components at the packaging nozzle and a packaging nozzle for the packaging head for packaging electronic components Between the packaging positions, the control unit moves each packaging head from each pickup position or each packaging position in the same direction and starts simultaneously, and causes each packaging head to reach each packaging position or each pickup position at the same time. stop.

Since the control unit causes each packaging head to start from the pickup position or the packaging position in the same direction at the same time, it reaches the packaging position or the pickup position at the same time and stops at the same time, so it is possible to suppress the other The vibration caused by the movement of the packaging head interferes and affects the packaging accuracy.

The electronic component packaging device of the present invention may also include: a plurality of packaging platforms, holding a substrate for packaging electronic components or a substrate for packaging other electronic components on the upper surface, and a predetermined direction between each pickup position and each packaging platform The distance is equal.

With this configuration, the distance between the pickup position and the packaging position can be the same, and multiple packaging heads can be started and stopped at the same time to improve the packaging quality.

In the electronic component packaging device of the present invention, the substrate may be packaged with a plurality of electronic components in a predetermined direction, and the control unit may make each packaging head such that each distance between each pickup position and each packaging position becomes equal Move and package multiple electronic parts.

In this way, when a plurality of electronic components are packaged in a predetermined direction of the substrate, the distance between the pickup position and the package position can also be made the same, so that a plurality of package heads can be simultaneously started and stopped to improve the package quality.

In the electronic component packaging device of the present invention, when the respective distances between the pickup positions and the packaging positions are different, the movement speed of the shorter packaging head can be made higher than that of the longer packaging head The speed is slower.

In this way, even when the distance between the pickup position and the packaging position is different, multiple packaging heads can be started and stopped at the same time, and the packaging quality can be improved. [Effect of invention]

The invention can reduce the installation space and improve the packaging accuracy in the electronic component packaging device including a plurality of packaging heads.

Hereinafter, the bonding apparatus 100 which is the electronic component packaging device of the embodiment will be described with reference to the drawings. The bonding apparatus 100 packages the semiconductor wafer 16 as an electronic component on the substrate 15 or other semiconductor wafer 16.

As shown in FIG. 1, the bonding apparatus 100 includes: a base 10; a common linear guide 20 mounted on the base 10 and extending in a Y direction as a predetermined direction; a plurality of package heads 21a and 21b, which are linear The guide 20 guides and moves in the Y direction; and the control unit 50 adjusts the positions of the two packaging heads 21a and 21b in the Y direction.

In addition, as shown in FIG. 1, on the base 10 of the bonding apparatus 100, two sets of transport rails 11 a and transport rails 11 b for transporting the substrate 15 in the X direction and two packaging platforms 12 a and 12 b are mounted. Furthermore, the joining device 100 includes a guide frame 32 mounted on the base 10 and extending in the X direction; a pickup head 33 guided by the guide frame 32 and moving in the X direction; a guide rail 30 installed The base 10 extends in the Y direction; the intermediate platform 31 is guided by the guide rail 30 to move in the Y direction; and the wafer holder (not shown) holds the wafer 35.

The Y-direction positions of the centers of the two packaging platforms 12a and 12b are respectively 12c and 12d, and the Y-direction distance of the centers of the respective packaging platforms 12a and 12b is W1. In addition, on the upper surface of the intermediate stage 31, two mounting tables 17 for placing and picking up the semiconductor wafer 16 are provided. The interval between the two mounting tables 17 in the Y direction is the same as the interval between the packaging platform 12a and the packaging platform 12b in the Y direction, which is W1.

The intermediate platform 31 moves in the Y direction between the first position indicated by the solid line in FIG. 1 and the second position indicated by the dotted line. When the intermediate stage 31 comes to the second position indicated by the dotted line, the Y-direction positions of the two mounting tables 17 become the pickup position 13a and the pickup position 13b. As described above, the interval between the two mounting tables 17 in the Y direction is the same as the interval between the packaging platform 12a and the packaging platform 12b in the Y direction, which is W1. Therefore, each pickup position 13a, 13b and each packaging platform 12a, packaging platform The Y-direction distances ΔYc and ΔYd between the Y-direction position 12c and the Y-direction position 12d of each center of 12b become equal.

As shown in FIG. 1, when the semiconductor wafer 16 is packaged at the negative end of the Y-direction of each substrate 15, the position in the Y direction where the semiconductor wafer 16 is packaged becomes the package position 14 a and the package position 14 b. In this case, the distance between the packaging position 14a and the packaging position 14b in the Y direction is the same as the distance between the two mounting tables 17 in the Y direction, which is W1. In this case, the distances ΔYa and ΔYb in the Y direction between the pickup positions 13a and 13b and the packaging positions 14a and 14b become equal.

Each of the packaging heads 21a and 21b is arranged on one side of the linear guide 20, mounted in the Y direction, and guided by the linear guide 20 to move in the Y direction. To each of the packaging heads 21a and 21b, a packaging nozzle 22a and a packaging nozzle 22b for picking up and packaging the semiconductor wafer 16 are mounted. The packaging head 21a and the packaging head 21b come to the pickup position 13a, the pickup position 13b, and the packaging nozzle 22a and the packaging nozzle 22b of the packaging nozzle 22a and the packaging nozzle 22b to directly pick up the semiconductor wafer 16 to mount the semiconductor wafer 16 Between the packaging position 14a and the packaging position 14b, move in the Y direction.

The pickup head 33 is equipped with a pickup nozzle 34 that picks up the semiconductor wafer 16 from the wafer 35 and places it on the mounting table 17 of the intermediate platform 31.

Each of the packaging head 21a, the packaging head 21b, the pickup head 33, and the intermediate stage 31 is equipped with a driving unit such as a linear motor. Each driving unit operates according to an instruction of the control unit 50. The control unit 50 includes a computer that includes a central processing unit (Central Processing Unit, CPU) and a memory unit.

Next, referring to FIGS. 2 to 8, the operation of the bonding apparatus 100 will be described. In the following description, as shown in FIG. 1, a case where the semiconductor wafer 16 is packaged on the negative side end portion of each substrate 15 in the Y direction is described.

As shown in FIG. 2, the control unit 50 moves the packaging heads 21 a and 21 b to the initial position, and moves the intermediate stage 31 to the first position on the negative side in the Y direction. Then, the control unit 50 moves the pickup head 33 in the X direction, and uses the pickup nozzle 34 to pick up the semiconductor wafer 16 from the wafer 35 and place them on the two mounting tables 17 of the intermediate stage 31, respectively. The semiconductor wafer 16 is placed on the two mounting tables 17 of the intermediate stage 31 at intervals of a distance W1 in the Y direction.

After the placement of the semiconductor wafer 16 is completed, as shown in FIG. 3, the control unit 50 moves the intermediate stage 31 to the second position on the positive side in the Y direction. When the intermediate stage 31 moves to the second position, the Y-direction positions of the semiconductor wafers 16 placed on the mounting tables 17 become the pickup position 13a and the pickup position 13b, respectively.

As shown in FIG. 4, the control unit 50 controls the packaging head 21 a and the packaging head 21 b so that the center of each packaging nozzle 21 a and 21 b of the packaging head 21 b and the packaging nozzle 22 b becomes the pickup position 13 a and the pickup position 13 b. Move to the negative side in the Y direction. At this time, the control unit 50 activates each of the packaging heads 21a and 21b from the initial position toward the negative side in the Y direction, and causes the centers of the packaging nozzles 22a and 22b to reach the pickup position 13a and the pickup position 13b at the same time. The movement of the packing head 21a and the packing head 21b toward the negative side in the Y direction is simultaneously stopped.

As shown in FIG. 5, the control unit 50 sucks the semiconductor wafer 16 at the tip of each of the packaging heads 21 a and 21 b of the packaging heads 21 b and 22 b, and picks up the semiconductor wafer 16 from the intermediate platform 31. After the pickup is completed, as shown in FIG. 5, the packaging heads 21 a and 21 b are moved from the pickup position 13 a and the pickup position 13 b to the packaging position 14 a and the packaging position 14 b. At this time, the control unit 50 activates each of the packaging heads 21a and 21b toward the positive side in the Y direction at the same time, causes the centers of the packaging nozzles 22a and 22b to reach the packaging positions 14a and 14b at the same time, and causes the packaging heads 21a 1. The movement of the package head 21b toward the positive side in the Y direction is simultaneously stopped.

As described above, the distances ΔYa and ΔYb in the Y direction between the pickup position 13a, the pickup position 13b, the package positions 14a, and the package position 14b are equal. Like line b, at time t0, each packaging head 21a and packaging head 21b are simultaneously started, accelerating to the same speed with the same acceleration until time t1, moving at the same speed in the Y direction to time t2, and decelerating to the same deceleration to The speed is zero until time t3, and it stops simultaneously at time t3. At this time, as shown by the broken line c and the solid line d of FIG. 8, each of the packaging heads 21 a and 21 b reaches the packaging position 14 a and the packaging position 14 b at the same time. In FIG. 7, the broken line a and the solid line b indicate the time change of the speed of each of the packaging heads 21 a and 21 b. In FIG. 8, the broken line c and the solid line d indicate the time at the position of the Y direction of each of the packaging heads 21 a and 21 b. Variety.

When the movement of the packaging heads 21a and 21b to the packaging position 14a and the packaging position 14b is completed and the packaging heads 21a and 21b are stopped, the control unit 50 lowers the packaging nozzles 22a and 22b to be attracted to each. The semiconductor wafer 16 at the tip of the package nozzle 22 a and the package nozzle 22 b is packaged on each substrate 15.

After the packaging of each semiconductor wafer 16 on each substrate 15 is completed, as shown in FIG. 6, the control unit 50 moves each packaging head 21 a and 21 b to the initial position, moves the intermediate stage to the first position, and continues to the next The pickup and packaging operation of the semiconductor wafer 16.

In the case where a plurality of semiconductor wafers 16 are arranged and packaged in the Y direction on the substrate 15, the control unit 50 is such that the respective distances between the pickup positions 13a and 13b and the package positions 14a and 14b become equal Method, each packaging head 21a and 21b are moved to package a plurality of semiconductor wafers 16. For example, as shown in FIG. 1, if the semiconductor wafer 16 is packaged at the negative end of the Y-direction of each substrate 15, then, the semiconductor wafer 16 is packaged at positions shifted by only ΔY1 from the initial packaging position to the positive side in the Y-direction . In this case, the distance in the Y direction between the packaging positions 14a and 14b is W1, so the distances between the pickup position 13a and the pickup position 13b and the packaging positions 14a and 14b are equal to those of the above In the same way, by moving the packaging heads 21a and 21b in the Y direction with the same acceleration and the same speed, they can start simultaneously and reach the packaging position 14a and the packaging position 14b at the same time, so that the packaging heads 21a and 21b are stopped simultaneously .

As described above, in the bonding apparatus 100 of the present embodiment, since the packaging head 21a and the packaging head 21b are arranged on one side of the linear guide 20 in the Y direction, it is possible to package the non-arrangement of the linear guide 20 The space on one side of the head 21a and the packing head 21b serves as an arrangement space for other equipment. Therefore, a reduction in installation space can be achieved. In addition, since the control unit 50 causes the packaging heads 21a and 21b to start simultaneously from the pickup position 13a and the pickup position 13b in the same direction, and simultaneously reaches the packaging position 14a and the packaging position 14b and stops at the same time, it can be packaged in one of them In the pickup operation or the packaging operation of the head 21a, the vibration caused by the movement of the other packaging head 21b is suppressed to interfere with the packaging accuracy, thereby improving the packaging accuracy.

Next, the case where the distances between the pickup position 13a, the pickup position 13b, and the packaging positions 14a1, 14b are different will be described.

As shown in FIG. 9, the semiconductor wafer 16 is packaged at the negative end of the Y-direction of the substrate 15 on the negative side (near the front side) of the Y direction, and the positive end of the Y-direction of the substrate 15 on the positive side (back side) of the Y direction In this case, the distance W2 between the packaging position 14b on the near side and the packaging position 14a1 on the back side is larger than the distance W1 between the pickup position 13b on the near side and the pickup position 13a on the back side. In this case, the distance ΔYa1 of the back picking position 13a and the back packaging position 14a1 is greater than the distance ΔYb between the near front picking position 13b and the near front packaging position 14b. In this case, the control unit 50 causes each of the packing head 21a and the packing head 21b to move each packing head 21a and the packing head 21b by making the movement speed of the packing head 21b of the shorter moving distance slower than that of the packing head 21a of the longer moving distance Simultaneously, the packaging nozzles 21a and 22b of the packaging heads 21a and 21b reach the packaging positions 14a1 and 14b at the same time, and the movement of the packaging heads 21a and 21b in the Y direction is simultaneously stopped.

As shown in FIG. 11, the control part 50 controls the speed of each packing head 21a and 21b. In FIG. 11, the dotted line e and the solid line b represent the time changes of the speeds of the packaging heads 21 a and 21 b. In FIG. 12, the dotted line f and the solid line d are in the Y direction position of the packaging heads 21 a and 21 b Indicates time changes.

The control unit 50, as indicated by the dotted line e and the solid line b shown in FIG. 11, simultaneously activates each of the packing heads 21a and 21b at time t0. Since the package head 21b on the near side has a short moving distance, it stops accelerating at time t11 and moves at a constant speed in the Y direction at a slower speed than the package head 21a on the back side. On the other hand, the package head 21a on the back side continues accelerating to the time t1 as described above, and becomes a constant speed movement from the time t1. Furthermore, the packaging head 21a on the back side decelerates from time t2, reaches the packaging position 14a1 at time t3, and becomes zero speed at time t3. The packaging head 21b on the front side continues to move at a constant speed to time t12, decelerates from time t12, reaches the packaging position 14b at time t3, and becomes zero speed at time t3.

At time t3, after the movement of the packaging head 21a and the packaging head 21b in the Y direction is stopped, the control unit 50 packages the semiconductor chips 16 attracted by the packaging nozzles 21a and the packaging nozzles 22a and 22b of the packaging head 21a and the packaging head 21b in each On the substrate 15. After the packaging of each semiconductor wafer 16 on each substrate 15 is completed, as shown in FIG. 10, the control unit 50 moves each of the packaging heads 21 a and 21 b to the initial position, and moves the intermediate stage 31 to the first position to continue The next semiconductor wafer 16 is picked up and packaged.

As described above, in the bonding apparatus 100 of the embodiment, when the distances ΔYa1 and the distance ΔYb between the pickup position 13a, the pickup position 13b, and the packaging position 14a1 and the packaging position 14b are different, the one with the shorter moving distance The movement speed of the packing head 21b is slower than that of the long-distance packing head 21a. Thereby, even when the distance ΔYa1 and the distance ΔYb between the pickup position 13a, the pickup position 13b and the packaging position 14a1, the packaging position 14b are different, the two packaging heads 21a, 21b can be simultaneously started and stopped . In the pickup operation or the packaging operation of one of the packaging heads 21a, the vibration caused by the movement of the other packaging heads 21b can be suppressed to interfere with the packaging accuracy, thereby improving the packaging accuracy.

Next, referring to FIGS. 13 to 15, a bonding apparatus 200 according to another embodiment will be described. The same parts as those of the bonding apparatus 100 described above with reference to FIGS. 1 to 12 are denoted by the same symbols, and descriptions are omitted.

As shown in FIG. 13, the bonding apparatus 200 arranges two linear guides 20 in parallel in the Y direction, and mounts two packaging heads 21 a, 21 b, and 21 c on each linear guide 20. Package head 21d. The packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d are arranged so as to face each other between the two linear guides 20. Therefore, the space on the side of the linear guide 20 where the packing head 21a and the packing head 21b are not arranged and the side where the packing head 21c and the packing head 21d are not arranged can be used as a space for other machines, and two joints are arranged For the device 100, the installation space can be further reduced.

In addition, the joining device 200 is provided with two guide rails 30 and two intermediate platforms 31 guided by each guide rail 30. Furthermore, two pick-up heads 33 are attached to the guide frame 32 extending in the X direction.

The operation of the joining device 200 configured as described above will be described.

The control unit 50 moves the two pick-up heads 33 in the X direction, and from the two wafers 35, puts a total of four semiconductor wafers 16 on each mounting table 17 of the intermediate stage 31, respectively.

The control unit 50 is the same as the description with reference to FIG. 4, and as shown in FIG. 14, each of the packaging head 21 a, the packaging head 21 b, the packaging head 21 c, the packaging head 21 d, the packaging nozzle 22 a, the packaging nozzle 22 b, the packaging nozzle 22 c, the packaging The center of the nozzle 22d becomes the pickup position 13a and the pickup position 13b, and moves each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d toward the negative side in the Y direction. At this time, the control unit 50 activates each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d from the initial position toward the negative side in the Y direction, and causes each packaging nozzle 22a, packaging nozzle 22b, packaging nozzle 22c, packaging The center of the nozzle 22d reaches the pickup position 13a and the pickup position 13b at the same time, and the movement of each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d to the negative side in the Y direction is simultaneously stopped. Then, the semiconductor wafer 16 is attracted to the tip of each of the packaging nozzles 21a, 21b, 21c, 21d, 21c, 22c, 22d.

The control unit 50 moves each of the package head 21a, the package head 21b, the package head 21c, and the package head 21d from the pickup position 13a, the pickup position 13b to the package position 14a and the package position 14b in the same manner as described above with reference to FIG. 5. At this time, the control unit 50 causes each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d to start toward the positive side in the Y direction at the same time, and causes the packaging nozzle 22a, the packaging nozzle 22b, the packaging nozzle 22c, and the packaging nozzle 22d The center simultaneously reaches the packaging position 14a and the packaging position 14b, and the movement of each of the packaging head 21a, the packaging head 21b, the packaging head 21c, and the packaging head 21d to the positive side in the Y direction is simultaneously stopped.

When the movement of the packaging heads 21a and 21b to the packaging position 14a and the packaging position 14b is completed and the packaging heads 21a and 21b are stopped, the control unit 50 lowers the packaging nozzles 22a and 22b to be attracted to each. The semiconductor wafer 16 at the tip of the package nozzle 22 a and the package nozzle 22 b is packaged on each substrate 15.

In addition to the function and effect of the bonding apparatus 100, the bonding apparatus 200 of this embodiment can further reduce the installation space compared to the bonding apparatus 100, and can use four packaging heads 21a, 21b, 21c, and 21d. The four semiconductor wafers 16 are packaged at the same time, so the packaging speed can be further accelerated.

In the above description, the case where the two pickup heads 33 pick up the semiconductor wafers 16 from the two wafers 35 and place them on the mounting tables 17 of the intermediate platform 31 has been described, but it is not limited to this, for example Each pick-up head 33 may pick up a semiconductor wafer 16 from one wafer 35 and place it on each mounting table 17 of each intermediate stage 31.

10‧‧‧Dock 11a, 11b‧‧‧Transport rail 12a, 12b‧‧‧Package platform 12c, 12d‧‧‧Y position 13a, 13b‧‧‧ Picking position 14a, 14a1, 14b‧‧‧Package location 15‧‧‧ substrate 16‧‧‧Semiconductor chip 17‧‧‧Stage 20‧‧‧Linear guide 21a, 21b, 21c, 21d 22a, 22b, 22c, 22d 30‧‧‧rail 31‧‧‧Intermediate platform 32‧‧‧Guide frame 33‧‧‧ Pickup head 34‧‧‧ Pick up nozzle 35‧‧‧ Wafer 50‧‧‧Control Department 100、200‧‧‧joining device a, c‧‧‧ dotted line b, d‧‧‧ solid line e, f‧‧‧ dotted line t0, t1, t2, t3, t11, t12; ‧‧‧ X, Y, Z‧‧‧ direction ΔYa, ΔYa1, ΔYb, ΔYc, ΔYd, W1, W2‧‧‧Distance

FIG. 1 is a plan view showing the configuration of the bonding apparatus of the embodiment. 2 is a plan view showing a pickup operation of a semiconductor wafer using a pickup head of the bonding apparatus shown in FIG. 1. Fig. 3 is a plan view showing the movement operation of the intermediate platform of the joining device shown in Fig. 1. 4 is a plan view showing the movement of the packaging head of the bonding apparatus shown in FIG. 1 to a pickup position. 5 is a plan view showing the movement of the packaging head of the bonding apparatus shown in FIG. 1 to the packaging position. 6 is a plan view showing the movement of the packaging head after packaging the semiconductor wafer on the substrate to the initial position and the movement of the intermediate stage to the first position using the bonding apparatus shown in FIG. 1. 7 is a graph showing the time change of the speed of each packaging head in the case where the distance between each pickup position and each packaging position in the bonding apparatus shown in FIG. 1 is equal. 8 is a graph showing the time change of the Y-direction position of each package head in the case where the distance between each pickup position and each package position in the bonding apparatus shown in FIG. 1 is equal. 9 is a plan view showing the movement of the packaging head to the packaging position in the case where the distance between each pickup position and each packaging position in the bonding apparatus shown in FIG. 1 is different. 10 is a plan view showing the movement of the packaging head after packaging the semiconductor chip on the substrate to the initial position and the movement of the intermediate stage to the first position after the movement of the packaging head shown in FIG. 9. FIG. 11 is a graph showing the time change of the speed of each packing head during the movement of the packing head shown in FIG. 9. FIG. 12 is a graph showing the time change of the position of each package head in the Y direction when the package head shown in FIG. 9 is moved. 13 is a plan view showing the configuration of a bonding apparatus according to another embodiment. 14 is a plan view showing the movement of the packaging head of the bonding apparatus shown in FIG. 13 to the pickup position. 15 is a plan view showing the movement of the packaging head of the bonding apparatus shown in FIG. 13 to the packaging position.

10‧‧‧Dock

11a, 11b‧‧‧Transport rail

12a, 12b‧‧‧Package platform

12c, 12d‧‧‧Y position

13a, 13b‧‧‧ Picking position

14a, 14b‧‧‧Packing location

15‧‧‧ substrate

16‧‧‧Semiconductor chip

17‧‧‧Stage

20‧‧‧Linear guide

21a, 21b‧‧‧Packing head

22a, 22b ‧‧‧ package nozzle

30‧‧‧rail

31‧‧‧Intermediate platform

32‧‧‧Guide frame

33‧‧‧ Pickup head

34‧‧‧ Pick up nozzle

35‧‧‧ Wafer

50‧‧‧Control Department

100‧‧‧joining device

X, Y, Z‧‧‧ direction

ΔYa, ΔYb, ΔYc, ΔYd, W1‧‧‧Distance

Claims (5)

An electronic component packaging device is an electronic component packaging device for packaging electronic components on a substrate or other electronic components, including: Linear guide, extending in the specified direction; A plurality of packaging heads arranged in a prescribed direction and guided by the linear guide to move in a prescribed direction; and A control unit that adjusts the position of the package head in a predetermined direction; and The control unit causes each of the packaging heads to start simultaneously in the same direction, and simultaneously stops each of the packaging heads. The electronic part packaging device as described in item 1 of the patent application scope, wherein Each packaging head is equipped with a packaging nozzle for picking up and packaging the electronic component, and a pick-up position for picking up the electronic component at the packaging nozzle and the packaging nozzle for the packaging head to carry out the electronic component Between the packaging positions of the package, move in the specified direction, and The control unit causes each of the packaging heads to simultaneously start from each of the pickup positions or each of the packaging positions toward the same direction, and causes each of the packaging heads to reach each of the packaging positions or each of the pickup positions at the same time And at the same time stop. The electronic part packaging device as described in item 2 of the patent application scope, in which Including a plurality of packaging platforms, holding the substrate on which the electronic parts are packaged or the substrate on which the other electronic parts are packaged on the upper surface; and The distance between each of the pickup positions and each of the packaging platforms in a predetermined direction is equal. The electronic part packaging device as described in item 3 of the patent application scope, in which The substrate encapsulates a plurality of the electronic components in a predetermined direction, and The control unit moves each of the packaging heads to package the plurality of electronic components so that the distances between the pickup positions and the packaging positions are equal. The electronic part packaging device as described in item 2 or item 3 of the patent application scope, wherein The control unit, when each distance between each of the pickup positions and each of the packaging positions is different, The moving speed of the packaging head on the shorter distance is slower than the moving speed of the packaging head on the longer distance.

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