JP4728759B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component picked up from a component supply unit by a mounting head on a substrate.

  A mounting apparatus for mounting electronic components on a substrate has a mounting head. This mounting head is driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by the driving means. The mounting apparatus is provided with a component supply unit that supplies the electronic component at one end in the horizontal direction, for example, the Y direction, and a mounting unit that transports and positions the substrate and mounts the electronic component at the other end. .

  When the mounting head is driven in the Y direction and positioned at a position facing the component supply unit or the mounting unit, X intersects with the Y direction, which is a direction to advance or retreat with respect to the component supply unit or the mounting unit. Driven in the direction. Accordingly, the mounting head picks up an electronic component from the component supply unit, and mounts the picked-up electronic component on the substrate at the mounting unit.

  In order to improve productivity, it is required to shorten the tact time required for mounting electronic components on a substrate. As one means for shortening the tact time, it is required to move the mounting head in the X and Y directions, particularly in the Y direction, which has a long distance, at a high speed.

  However, if the mounting head is moved at a high speed, the change in acceleration that occurs when the mounting head is started and stopped increases. When the change in acceleration becomes large, the mounting apparatus may vibrate, and this vibration causes a decrease in positioning accuracy and generation of noise, which limits the high-speed movement of the mounting head.

  The present invention provides an electronic component mounting apparatus in which a mounting head is moved at a high speed to improve productivity, and even if acceleration greatly changes at the time of starting and stopping, occurrence of vibration can be prevented. It is to provide.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
A first mounting head;
First driving means for driving the first mounting head in the horizontal direction and the vertical direction;
A second mounting head;
Second driving means for driving the second mounting head in the horizontal direction and the vertical direction;
A component supply unit for supplying the electronic component picked up by at least one of the first mounting head and the second mounting head;
A mounting unit for positioning the substrate and mounting an electronic component picked up from the component supply unit by at least the other of the first mounting head and the second mounting head on the positioned substrate;
When the first and second mounting heads are reciprocated in the horizontal direction between the component supply unit and the mounting unit, the horizontal driving of the first mounting head and the second mounting head is reversed. And an electronic component mounting apparatus comprising: a control means for alternately mounting the electronic component by the first mounting head and the second mounting head.

  The control means is configured such that when one of the first and second mounting heads is driven back and forth with respect to the component supply unit and the other is driven back and forth with respect to the mounting unit, It is preferable to drive the second mounting head in synchronization with the reverse direction.

  It is preferable that the control means drives the first mounting head and the second mounting head in synchronization with the direction opposite to the combined direction of the X direction and the Y direction.

  According to the present invention, since the electronic component is mounted by the first mounting head and the second mounting head, the efficiency can be improved as compared with the case of mounting the electronic component by one mounting head, and a pair of Since the mounting head is driven in the reverse direction, the acceleration generated at the time of starting and stopping is reversed in the reverse direction, so that even if the mounting head is moved at a high speed, vibration can be prevented from occurring.

Embodiments of the present invention will be described below with reference to the drawings.
1 to 4 show a first embodiment of the present invention. FIG. 1 is a plan view showing a schematic configuration of the mounting apparatus, FIG. 2 is a cross-sectional view, and the mounting apparatus includes a base 1. Supports 2 are erected at the four corners of the base 1, and X guide members 3 are installed on each pair of support 2 along the X direction indicated by an arrow in FIG.

  A pair of X guide members 3 includes a first Y guide member 4 </ b> A and a second Y guide body 4 </ b> B that are respectively slidably engaged with the X guide member 3, with receiving members 5 provided at both ends in the longitudinal direction. Is provided. As shown in FIG. 3, the first and second Y guide members 4 </ b> A and 4 </ b> B are driven by the first X drive source 7 </ b> A and the second X drive source 7 </ b> B whose drive are controlled by the control device 6. Driven along. That is, the first and second Y guide members 4A and 4B can be driven in the X direction.

  Although not shown in detail in the first and second X drive sources 7A and 7B, for example, an electromagnetic coil is provided in the X guide member 3 and a permanent magnet is provided in the receiving member 5, and energization of the electromagnetic coil is performed by the control device. The linear motor etc. which drive the 1st, 2nd Y guide members 4A and 4B to a X direction by controlling by 6 are used. Note that the mass when the first Y guide member 4A and the second Y guide member 4B are driven in the X direction is set to be substantially the same.

  The first Y guide member 4A is provided with a first mounting head 11A that is movable in the Y direction along the first Y guide member 4A. One end of the first Y guide member 4A is provided with a first Y drive source 12A such as a pulse motor.

  The first Y drive source 12A rotationally drives a screw shaft (not shown) provided along the longitudinal direction of the first Y guide member 4A. When the screw shaft is driven to rotate, the first mounting head 11A is driven in the Y direction along the first Y guide member 4A.

  A second mounting head 11B is provided on the second Y guide member 4B so as to be movable in the Y direction along the second Y guide member 4B. The second mounting head 11B is driven in the Y direction via a screw shaft (not shown) that is rotationally driven by a second Y drive source 12B such as a pulse motor provided at one end of the second Y guide member 4B. It is like that. The first and second Y drive sources 12A and 12B are controlled by the control device 6. That is, the first mounting head 11A and the second mounting head 11B are disposed symmetrically in the X direction with the Y direction in the horizontal direction as the center. The mass of the first mounting head 11A and the second mounting head 11B is set to be substantially the same.

  The first and second mounting heads 11A and 11B each have a head body 13, and a Z table 14 is provided on the front surface of each head body 13 so as to be movable along the Z direction, which is the vertical direction. First and second suction nozzles 16A and 16B are provided on the front surface of each Z table 14 with their axes extending in the Z direction.

  First and second Z drive sources 17A and 17B for driving each Z table 14 in the Z direction are provided at the upper end of each head main body 13, respectively. The driving of the first and second Z drive sources 17A and 17B is controlled by the control device 6.

  Below the pair of Y guide members 4A and 4B and on the side of one X guide member 3, the pair of transport rails 21 constituting the transport means is parallel to the + Y direction at a predetermined interval and along the X direction. Are arranged. A supply stocker 23 for the substrate 22 is provided at one end of the pair of transport rails 21, and a collection stocker 24 is provided at the other end.

  The supply stocker 23 is provided with a pusher (not shown) so that the substrates 22 accommodated in the supply stocker 23 are supplied to the transport rail 21 one by one. The substrate 22 supplied to the transport rail 21 is intermittently driven at a predetermined pitch along the transport rail 21 by a feed mechanism (not shown).

  When the substrate 22 is transported to a predetermined position, the electronic component such as a semiconductor chip picked up from the component supply unit 28 described later by the first suction nozzle 16A or the second suction nozzle 16B is placed on the substrate 22 at that position. 25 is implemented.

  At the time of mounting, the lower surface of the substrate 22 is supported by a mounting stage 26 shown in FIG. The mounting stage 26 can be driven in the Z direction, and rises during mounting to support the lower surface of the substrate 22. A portion where the first suction nozzle 16 </ b> A or the second suction nozzle 16 </ b> B mounts the electronic component 25 on the substrate 22 is referred to as a mounting portion 27.

  A first imaging camera 30 is disposed above the mounting portion 27 as shown in FIG. The first imaging camera 30 images the substrate 22 positioned on the mounting portion 27 and inputs the imaging signal to the control device 6. The control device 6 calculates the mounting position of the electronic component 25 based on the imaging signal from the first imaging camera 30, and positions the first suction nozzle 16A or the second suction nozzle 16B above the mounting position. .

  The electronic component 25 is supplied to the first suction nozzle 16A or the second suction nozzle 16B in the -Y direction below the pair of Y guide members 4A and 4B and on the other X guide member 3 side. A component supply unit 28 is provided. The component supply unit 28 has a mounting table 29, and a tray 31 is supplied onto the mounting table 29 for positioning. A large number of the electronic components 25 such as semiconductor chips are stored in the tray 31 in a predetermined arrangement state.

  A second imaging camera 32 is provided above the mounting table 28 as shown in FIG. The second imaging camera 32 images the electronic component 25 accommodated in the tray 31 and inputs the imaging signal to the control device 6.

  The control device 6 positions the first and second mounting heads 11 </ b> A and 11 </ b> B above the predetermined electronic component 25 of the tray 31 based on the imaging signal from the second imaging camera 32. The first and second mounting heads 11A and 11B positioned above the tray 31 are driven in the downward direction to pick up the electronic component 25 from the tray 31.

Next, the operation when the electronic component 25 is mounted on the substrate 22 by the mounting apparatus having the above configuration will be described with reference to FIG.
Before the mounting of the electronic component 25 is started, the first mounting head 11A and the second mounting head 11B are each positioned at the initial position. As shown in FIG. 4, the initial position of the first mounting head 11A is S1, and the initial position of the second mounting head 11B is S2. Before the first mounting head 11A is positioned at the initial position S1, the first mounting head 11A is manually driven above the component supply unit 28 to suck and hold the electronic component 25 in advance and then positioned at the initial position S1.

  The mounting of the electronic component 25 is started by a start switch (not shown) provided in the control device 6. When mounting is started, the first mounting head 11A is driven in the + Y direction along the path indicated by A in FIG.

  When the first mounting head 11 </ b> A reaches the side of the mounting portion 27, it is driven in the + X direction of the B path approaching the mounting portion 27 and positioned at the mounting position of the mounting portion 27. Next, the first mounting head 11 </ b> A is driven downward in the Z direction to mount the electronic component 25 at a predetermined position on the substrate 22. After mounting, the first mounting head 11A rises and is driven along the B path in the −X direction to the A path, and is driven along the A path in the −Y direction to return to the initial position S1.

  The first mounting head 11 </ b> A that has returned to the initial position S <b> 1 is driven in the −Y direction along the C path toward the component supply unit 28. Then, when reaching the side of the component supply unit 28, the D path is driven in the + X direction so as to approach the component supply unit 28 and positioned above the component supply unit 28. Next, the first mounting head 11A is driven downward in the Z direction to lift and hold the electronic component 25, and then the D path is driven in the -X direction to reach the C path. To return to the initial position S1.

  The second mounting head 11B is driven to synchronize with the first mounting head 11A and to move in the opposite direction to the movement of the first mounting head 11A in the X direction and the Y direction. That is, when the first mounting head 11A is driven in the + Y direction along the A path, the second mounting head 11B is driven in the −Y direction along the E path toward the component supply unit 28. When the first mounting head 11A is driven in the + X direction along the B path, the second mounting head 11B is driven in the −X direction along the F path so as to approach the component supply unit 28. Here, after the second mounting head 11 </ b> B is positioned above the tray 31, the second mounting head 11 </ b> B is driven downward in the Z direction to lift the electronic component 25 at a predetermined position by suction.

  The second mounting head 11B picking up the electronic component 25 is driven in the + X direction along the F path. At this time, the first mounting head 11A is driven along the B path in the -X direction. The second mounting head 11B is driven from the F path to the E path in the + Y direction and returns to the initial position S2.

  The second mounting head 11B having returned to the initial position S2 is driven in the + Y direction along the G path toward the mounting portion 27. At this time, the first mounting head 11A is driven along the C path in the -Y direction.

  When the second mounting head 11 </ b> B reaches the side of the mounting portion 27, the H path is driven in the −X direction toward the mounting portion 27. At this time, the first mounting unit 11A is driven along the D path in the plus X direction.

  When the second mounting head 11B is positioned above the mounting portion 27, it is driven downward in the Z direction, and the electronic component 25 held by suction is mounted on the substrate 22. At this time, the first mounting head 11A is positioned above the component supply unit 28 and then lowered to pick up the electronic component 25 at a predetermined position.

  After the second mounting head 11B mounting the electronic component 25 on the substrate 22 is lifted, the H path is driven in the + X direction, and then the G path is driven in the −Y direction to return to the initial position S2. At this time, the first mounting head 11A is driven in the −X direction along the D path and then is driven in the + Y direction along the C path.

  Thus, when the first mounting head 11A and the second mounting head 11B are driven in the X direction and the Y direction between the mounting unit 27 and the component supply unit 28, the first mounting head 11A and the second mounting head 11B The two mounting heads 11B are controlled so that the driving directions in the X and Y directions are opposite.

  Therefore, when the first mounting head 11A repeatedly starts and stops to change the paths A to D, and when the second mounting head 11B repeatedly starts and stops to change the paths E to H, these The direction of acceleration generated by the start / stop of the mounting heads 11A and 11B is opposite in the X direction and the Y direction.

  Therefore, the acceleration generated by the start and stop of the first mounting head 11A and the second mounting head 11B cancels each other, so that the base 1 is moved via the X guide member 3 and the Y guide members 4A and 4B by the acceleration. It is possible to prevent vibration.

Moreover, since the mounting of the electronic component 25 is alternately performed by the first mounting head 11A and the second mounting head 11B, the tact time is shortened by about half compared to the case of performing by one mounting head. be able to. That is, the electronic component 25 can be mounted efficiently by the two mounting heads 11A and 11B and without causing the base 1 to vibrate.

  FIG. 5 shows a second embodiment of the present invention. In this embodiment, the A path and the B path and the C path and the D path of the first mounting head 11A shown in FIG. 4 of the first embodiment are simultaneously performed, and the second mounting head 11B The E route and the F route, and the G route and the H route are performed simultaneously.

  That is, in the first embodiment, in order to drive the first and second mounting heads 11A and 11B forward and backward with respect to the mounting unit 27 and the component supply unit 28, the heads 11A and 11B are moved in the X direction and the Y direction. However, in the second embodiment, the X direction and the Y direction are not divided, and the X direction and the Y direction are combined and driven in an oblique direction toward the target portion. Moreover, the first mounting head 11A and the second mounting head 11B are driven so that the X direction and the Y direction are opposite directions.

Thus, if the first and second mounting heads 11A and 11B are driven in an oblique direction in which the X direction and the Y direction are combined, the path lengths of the first and second mounting heads 11A and 11B are shortened. Therefore, the tact time required for mounting the electronic component 25 can be shortened.
In addition, as in the first embodiment, since the acceleration generated in the first mounting head 11A and the second mounting head 11B cancels out, the occurrence of vibration can be prevented.

  FIG. 6 shows a third embodiment of the present invention. In this embodiment, a delivery unit 35 is provided between the mounting unit 27 and the component supply unit 28. The second mounting head 11 </ b> B supplies and places the electronic component 25 picked up from the component supply unit 28 on the delivery unit 35. The first mounting head 11 </ b> A receives the electronic component 25 placed on the transfer unit 35 and mounts it on the substrate 22 by the mounting unit 27.

  Therefore, the path of the first mounting head 11A is the A path and the B path shown in the first embodiment, and the I path that advances and retreats from the initial position S1 to the transfer unit 35. The path of the second mounting head 11B is the E path and F path shown in the first embodiment, and the J path that advances and retreats from the initial position S2 to the transfer unit 35.

  When the first mounting head 11A is driven along the A path and the B path, the second mounting head 11B causes the E path and the F path to be opposite to the first mounting head 11A in the Y direction and the X direction. Driven. As a result, the acceleration generated in the first and second mounting heads 11A and 11B is canceled out, so that generation of vibration can be prevented.

  If the I path of the first mounting head 11A and the J path of the second mounting head 11B are performed in opposite directions, the first head 11A and the second head 11B interfere with each other at the transfer section 35. , 11B are driven by shifting the timing of reaching the transfer section 35. Accordingly, when the first head 11A and the second head 11B are driven along the I path and the J path, the acceleration caused by the start and stop of the mounting heads 11A and 11B is not canceled out.

  However, the driving of the I path and the J path along the X direction of the mounting heads 11A and 11B has a short driving distance, so that there is little influence on the time if the moving speed is not increased. Therefore, since the increase and decrease of the acceleration that occurs when the mounting heads 11A and 11B are driven in the I path and the J path are small, the first and second mounting heads 11A and 11B are reversed in the I path and the J path. Even if it cannot be driven in synchronization with the direction, the mounting apparatus hardly vibrates.

  In the third embodiment, the electronic component 25 is picked up from the component supply unit 28 by the first mounting head 11A and supplied to the transfer unit 35, and the electronic component 25 is transferred from the transfer unit 35 by the second mounting head 11B. 25 may be mounted on the substrate 22 by the mounting unit 27.

  In the above embodiment, the linear motor is used as the first and second X drive sources for driving the first and second Y guide members in the X direction. However, a pulse motor may be used instead of the linear motor. The type of drive source is not limited.

The top view which shows schematic structure of the mounting apparatus of 1st Embodiment of this invention. FIG. 2 is a side sectional view of the mounting apparatus shown in FIG. 1. The block diagram of a control circuit. FIG. 6 is an operation diagram for explaining the movement of the first mounting head and the second mounting head. The operation | movement diagram for demonstrating the motion of the 1st mounting head which shows 2nd Embodiment of this invention, and a 2nd mounting head. The operation | movement diagram for demonstrating the motion of the 1st mounting head which shows the 3rd Embodiment of this invention, and a 2nd mounting head.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base, 3 ... X guide member, 4A, 4B ... Y guide member, 7A, 7B ... X drive source, 11A ... 1st mounting head, 11B ... 2nd mounting head, 12A, 12B ... Y drive source, 16A, 16B ... suction nozzle, 17A, 17B ... Z drive source, 22 ... substrate, 25 ... electronic component, 27 ... mounting part, 28 ... component supply part.

Claims (4)

A mounting device for mounting electronic components on a substrate,
A first mounting head;
First driving means for driving the first mounting head in the horizontal direction and the vertical direction;
A second mounting head;
Second driving means for driving the second mounting head in the horizontal direction and the vertical direction;
A component supply unit for supplying the electronic component picked up by at least one of the first mounting head and the second mounting head;
A mounting unit for positioning the substrate and mounting an electronic component picked up from the component supply unit by at least the other of the first mounting head and the second mounting head on the positioned substrate;
When the first and second mounting heads are reciprocated in the horizontal direction between the component supply unit and the mounting unit, the horizontal driving of the first mounting head and the second mounting head is reversed. And a control means for alternately mounting the electronic component by the first mounting head and the second mounting head.   The control means is configured such that when one of the first and second mounting heads is driven back and forth with respect to the component supply unit and the other is driven back and forth with respect to the mounting unit, 2. The electronic component mounting apparatus according to claim 1, wherein the second mounting head is driven in synchronization in the reverse direction.   2. The electronic device according to claim 1, wherein the control unit drives the first mounting head and the second mounting head in synchronization with a direction opposite to a direction obtained by combining the X direction and the Y direction. 3. Component mounting equipment.   2. The electronic component mounting apparatus according to claim 1, wherein the first driving means and the second driving means are disposed on the same base.

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