SG11202013223TA - Electronic component mounting apparatus - Google Patents
Electronic component mounting apparatusInfo
- Publication number
- SG11202013223TA SG11202013223TA SG11202013223TA SG11202013223TA SG11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic component
- component mounting
- mounting apparatus
- electronic
- mounting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018138294 | 2018-07-24 | ||
PCT/JP2019/028891 WO2020022345A1 (en) | 2018-07-24 | 2019-07-23 | Electronic component mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202013223TA true SG11202013223TA (en) | 2021-01-28 |
Family
ID=69181982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202013223TA SG11202013223TA (en) | 2018-07-24 | 2019-07-23 | Electronic component mounting apparatus |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6981700B2 (en) |
KR (1) | KR102432998B1 (en) |
CN (1) | CN112368811A (en) |
SG (1) | SG11202013223TA (en) |
TW (1) | TWI712100B (en) |
WO (1) | WO2020022345A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022139910A (en) * | 2021-03-12 | 2022-09-26 | キヤノンマシナリー株式会社 | Bonding device and bonding method |
JP2022139913A (en) * | 2021-03-12 | 2022-09-26 | キヤノンマシナリー株式会社 | Bonding device and bonding method |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397423A (en) * | 1993-05-28 | 1995-03-14 | Kulicke & Soffa Industries | Multi-head die bonding system |
JP2001135989A (en) * | 1999-11-05 | 2001-05-18 | Juki Corp | Collision-preventing device for component-mounting apparatus |
US6749100B2 (en) * | 2001-11-28 | 2004-06-15 | Asm Technology Singapore Pte Ltd. | Multiple-head wire-bonding system |
JP4104062B2 (en) * | 2002-12-13 | 2008-06-18 | 松下電器産業株式会社 | Electronic component mounting equipment |
JP2005197758A (en) * | 2005-02-02 | 2005-07-21 | Matsushita Electric Ind Co Ltd | Electronic component mounting device and method of mounting the electronic component |
JP4728759B2 (en) * | 2005-09-27 | 2011-07-20 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
US7568606B2 (en) * | 2006-10-19 | 2009-08-04 | Asm Technology Singapore Pte Ltd. | Electronic device handler for a bonding apparatus |
JP2008251771A (en) * | 2007-03-30 | 2008-10-16 | Hitachi High-Tech Instruments Co Ltd | Component mounting device |
JP4846649B2 (en) * | 2007-04-26 | 2011-12-28 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
JP5076833B2 (en) | 2007-11-22 | 2012-11-21 | ヤマハ株式会社 | Amplifier control system |
JP2010267771A (en) * | 2009-05-14 | 2010-11-25 | Canon Machinery Inc | Electronic component mounting apparatus and method for mounting the electronic component |
JP5479961B2 (en) * | 2010-03-16 | 2014-04-23 | 芝浦メカトロニクス株式会社 | Electronic component mounting apparatus and mounting method |
KR20120096727A (en) * | 2011-02-23 | 2012-08-31 | 삼성테크윈 주식회사 | Apparatus and method for picking up and mounting bare die |
KR20130022622A (en) * | 2011-08-25 | 2013-03-07 | 삼성전자주식회사 | Semiconductor element pick-up device |
KR102232636B1 (en) * | 2013-03-28 | 2021-03-25 | 토레이 엔지니어링 컴퍼니, 리미티드 | Mounting method and mounting device |
KR20150086671A (en) * | 2014-01-20 | 2015-07-29 | 세메스 주식회사 | Apparatus for transferring semiconductor packages |
KR102059421B1 (en) * | 2016-01-06 | 2019-12-26 | 야마하 모터 로보틱스 홀딩스 가부시키가이샤 | Electronic component mounting unit |
KR102580580B1 (en) * | 2016-04-26 | 2023-09-20 | 세메스 주식회사 | Apparatus and method for bonding dies onto wafer |
JP6767613B2 (en) * | 2016-05-31 | 2020-10-14 | パナソニックIpマネジメント株式会社 | Component mounting device and component mounting method |
JP6186053B2 (en) * | 2016-07-19 | 2017-08-23 | 株式会社新川 | Mounting device |
KR101896800B1 (en) * | 2016-11-30 | 2018-09-07 | 세메스 주식회사 | Apparatus for picking up semiconductor packages |
KR102649912B1 (en) * | 2018-10-30 | 2024-03-22 | 세메스 주식회사 | Bonding module and die bonding apparatus having the same |
-
2019
- 2019-07-23 JP JP2020532417A patent/JP6981700B2/en active Active
- 2019-07-23 TW TW108126041A patent/TWI712100B/en active
- 2019-07-23 CN CN201980044544.9A patent/CN112368811A/en active Pending
- 2019-07-23 SG SG11202013223TA patent/SG11202013223TA/en unknown
- 2019-07-23 KR KR1020207030915A patent/KR102432998B1/en active IP Right Grant
- 2019-07-23 WO PCT/JP2019/028891 patent/WO2020022345A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW202008495A (en) | 2020-02-16 |
TWI712100B (en) | 2020-12-01 |
KR102432998B1 (en) | 2022-08-18 |
JP6981700B2 (en) | 2021-12-17 |
CN112368811A (en) | 2021-02-12 |
KR20200138312A (en) | 2020-12-09 |
JPWO2020022345A1 (en) | 2020-12-17 |
WO2020022345A1 (en) | 2020-01-30 |
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