SG11202013223TA - Electronic component mounting apparatus - Google Patents

Electronic component mounting apparatus

Info

Publication number
SG11202013223TA
SG11202013223TA SG11202013223TA SG11202013223TA SG11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA SG 11202013223T A SG11202013223T A SG 11202013223TA
Authority
SG
Singapore
Prior art keywords
electronic component
component mounting
mounting apparatus
electronic
mounting
Prior art date
Application number
SG11202013223TA
Inventor
Hidehiro TAZAWA
Masayoshi Kubo
Masahito Tsuji
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202013223TA publication Critical patent/SG11202013223TA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
SG11202013223TA 2018-07-24 2019-07-23 Electronic component mounting apparatus SG11202013223TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018138294 2018-07-24
PCT/JP2019/028891 WO2020022345A1 (en) 2018-07-24 2019-07-23 Electronic component mounting device

Publications (1)

Publication Number Publication Date
SG11202013223TA true SG11202013223TA (en) 2021-01-28

Family

ID=69181982

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202013223TA SG11202013223TA (en) 2018-07-24 2019-07-23 Electronic component mounting apparatus

Country Status (6)

Country Link
JP (1) JP6981700B2 (en)
KR (1) KR102432998B1 (en)
CN (1) CN112368811A (en)
SG (1) SG11202013223TA (en)
TW (1) TWI712100B (en)
WO (1) WO2020022345A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022139913A (en) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 Bonding device and bonding method
JP2022139910A (en) * 2021-03-12 2022-09-26 キヤノンマシナリー株式会社 Bonding device and bonding method

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397423A (en) * 1993-05-28 1995-03-14 Kulicke & Soffa Industries Multi-head die bonding system
JP2001135989A (en) * 1999-11-05 2001-05-18 Juki Corp Collision-preventing device for component-mounting apparatus
US6749100B2 (en) * 2001-11-28 2004-06-15 Asm Technology Singapore Pte Ltd. Multiple-head wire-bonding system
JP4104062B2 (en) * 2002-12-13 2008-06-18 松下電器産業株式会社 Electronic component mounting equipment
JP2005197758A (en) * 2005-02-02 2005-07-21 Matsushita Electric Ind Co Ltd Electronic component mounting device and method of mounting the electronic component
JP4728759B2 (en) * 2005-09-27 2011-07-20 芝浦メカトロニクス株式会社 Electronic component mounting equipment
US7568606B2 (en) * 2006-10-19 2009-08-04 Asm Technology Singapore Pte Ltd. Electronic device handler for a bonding apparatus
JP2008251771A (en) * 2007-03-30 2008-10-16 Hitachi High-Tech Instruments Co Ltd Component mounting device
JP4846649B2 (en) * 2007-04-26 2011-12-28 株式会社日立ハイテクインスツルメンツ Electronic component mounting device
JP5076833B2 (en) 2007-11-22 2012-11-21 ヤマハ株式会社 Amplifier control system
JP2010267771A (en) * 2009-05-14 2010-11-25 Canon Machinery Inc Electronic component mounting apparatus and method for mounting the electronic component
JP5479961B2 (en) 2010-03-16 2014-04-23 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
KR20120096727A (en) * 2011-02-23 2012-08-31 삼성테크윈 주식회사 Apparatus and method for picking up and mounting bare die
KR20130022622A (en) * 2011-08-25 2013-03-07 삼성전자주식회사 Semiconductor element pick-up device
WO2014157134A1 (en) * 2013-03-28 2014-10-02 東レエンジニアリング株式会社 Mounting method and mounting device
KR20150086671A (en) * 2014-01-20 2015-07-29 세메스 주식회사 Apparatus for transferring semiconductor packages
KR102059421B1 (en) * 2016-01-06 2019-12-26 야마하 모터 로보틱스 홀딩스 가부시키가이샤 Electronic component mounting unit
KR102580580B1 (en) * 2016-04-26 2023-09-20 세메스 주식회사 Apparatus and method for bonding dies onto wafer
JP6767613B2 (en) * 2016-05-31 2020-10-14 パナソニックIpマネジメント株式会社 Component mounting device and component mounting method
JP6186053B2 (en) * 2016-07-19 2017-08-23 株式会社新川 Mounting device
KR101896800B1 (en) * 2016-11-30 2018-09-07 세메스 주식회사 Apparatus for picking up semiconductor packages
KR102649912B1 (en) * 2018-10-30 2024-03-22 세메스 주식회사 Bonding module and die bonding apparatus having the same

Also Published As

Publication number Publication date
JP6981700B2 (en) 2021-12-17
KR102432998B1 (en) 2022-08-18
JPWO2020022345A1 (en) 2020-12-17
CN112368811A (en) 2021-02-12
TWI712100B (en) 2020-12-01
WO2020022345A1 (en) 2020-01-30
KR20200138312A (en) 2020-12-09
TW202008495A (en) 2020-02-16

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