JPWO2020022345A1 - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

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JPWO2020022345A1
JPWO2020022345A1 JP2020532417A JP2020532417A JPWO2020022345A1 JP WO2020022345 A1 JPWO2020022345 A1 JP WO2020022345A1 JP 2020532417 A JP2020532417 A JP 2020532417A JP 2020532417 A JP2020532417 A JP 2020532417A JP WO2020022345 A1 JPWO2020022345 A1 JP WO2020022345A1
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mounting
electronic component
positions
pickup
heads
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JP6981700B2 (en
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秀博 田澤
秀博 田澤
晶義 久保
晶義 久保
正人 辻
正人 辻
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Abstract

半導体ダイ（１６）を基板（１５）実装するボンディング装置（１００）であって、Ｙ方向に伸びる共通のリニアガイド（２０）と、Ｙ方向に並べて配置され、リニアガイド（２０）にガイドされてＹ方向に移動する複数の実装ヘッド（２１ａ，２１ｂ）と、実装ヘッド（２１ａ，２１ｂ）のＹ方向の位置を調整する制御部（５０）と、を備え、制御部（５０）は、実装ヘッド（２１ａ，２１ｂ）を同一方向に向かって同時に始動させ、且つ、実装ヘッド（２１ａ，２１ｂ）を同時に停止させる。A bonding device (100) for mounting a semiconductor die (16) on a substrate (15), which is arranged side by side with a common linear guide (20) extending in the Y direction and guided by the linear guide (20). A plurality of mounting heads (21a, 21b) that move in the Y direction and a control unit (50) that adjusts the positions of the mounting heads (21a, 21b) in the Y direction are provided, and the control unit (50) is a mounting head. (21a, 21b) are started at the same time in the same direction, and the mounting heads (21a, 21b) are stopped at the same time.

Description

本発明は、電子部品実装装置の構造に関する。 The present invention relates to the structure of an electronic component mounting device.

電子部品を基板に実装する実装装置として、ウェーハから半導体ダイをピックアップして中間ステージに載置するピックアップ部と、中間ステージの上から半導体ダイをピックアップして基板の上まで移送し、基板の上にボンディングするボンディング部とを備える実装装置が用いられている。 As a mounting device for mounting electronic components on a substrate, a pickup unit that picks up a semiconductor die from a wafer and places it on an intermediate stage, and a semiconductor die that is picked up from above the intermediate stage and transferred to the top of the substrate and transferred onto the substrate. A mounting device including a bonding portion for bonding to is used.

また、実装装置では、ピックアップ部、ボンディング部を２つ備え、ピックアップとボンディングとを交互に行い、ボンディング時間を短縮する装置も提案されている（例えば、特許文献１参照）。 Further, as a mounting device, a device having two pickup portions and two bonding portions and alternately performing pickup and bonding to shorten the bonding time has also been proposed (see, for example, Patent Document 1).

特開２００９−１３０５８３号公報JP-A-2009-130583

しかし、特許文献１に記載された実装装置では、２つの実装ヘッドを支持アームと直交方向に並べて配置しているので、大きな設置スペースが必要となる。また、ピックアップとボンディングとを交互に行うため、一の実装ヘッドのボンディング中に他の実装ヘッドの動作による振動が干渉して実装精度に影響が出る場合がある。この影響は実装時間短縮のために実装ヘッドを高速で移動させた場合より顕著になる。 However, in the mounting device described in Patent Document 1, since the two mounting heads are arranged side by side in the direction orthogonal to the support arm, a large installation space is required. Further, since the pickup and the bonding are alternately performed, the vibration due to the operation of the other mounting head may interfere with the bonding of one mounting head, which may affect the mounting accuracy. This effect becomes more remarkable than when the mounting head is moved at high speed in order to shorten the mounting time.

そこで、本発明は、複数の実装ヘッドを備える電子部品実装装置において、設置スペースの低減と実装精度の向上を図ることを目的とする。 Therefore, an object of the present invention is to reduce the installation space and improve the mounting accuracy in an electronic component mounting device including a plurality of mounting heads.

本発明の電子部品実装装置は、電子部品を基板または他の電子部品に実装する電子部品実装装置であって、所定の方向に伸びるリニアガイドと、所定の方向に並べて配置され、リニアガイドにガイドされて所定の方向に移動する複数の実装ヘッドと、実装ヘッドの所定の方向の位置を調整する制御部と、を備え、制御部は、それぞれの実装ヘッドを同一方向に向かって同時に始動させ、且つ、それぞれの実装ヘッドを同時に停止させること、を特徴とする。 The electronic component mounting device of the present invention is an electronic component mounting device for mounting an electronic component on a substrate or another electronic component, and is arranged with a linear guide extending in a predetermined direction and arranged side by side in a predetermined direction, and is guided by the linear guide. A plurality of mounting heads that are moved in a predetermined direction and a control unit that adjusts the position of the mounting head in a predetermined direction are provided, and the control unit simultaneously starts each mounting head toward the same direction. Moreover, it is characterized in that each mounting head is stopped at the same time.

このように、実装ヘッドを所定の方向に並べて配置することにより、設置スペースの低減を図ることができる。また、複数の実装ヘッドを同時に始動、停止させることにより、各実装ヘッドの動作による振動の干渉を抑制することができ、実装品質を向上させることができる。 By arranging the mounting heads side by side in a predetermined direction in this way, the installation space can be reduced. Further, by starting and stopping a plurality of mounting heads at the same time, it is possible to suppress vibration interference due to the operation of each mounting head, and it is possible to improve the mounting quality.

本発明の電子部品実装装置において、それぞれの実装ヘッドは、電子部品をピックアップ及び実装する実装ノズルが取り付けられ、実装ノズルが電子部品をピックアップするピックアップ位置と、実装ヘッドの実装ノズルが電子部品を実装する実装位置との間で所定の方向に移動し、制御部は、それぞれの実装ヘッドをそれぞれのピックアップ位置またはそれぞれの実装位置から同一方向に向かって同時に始動させ、且つ、それぞれの実装ヘッドをそれぞれの実装位置またはそれぞれのピックアップ位置に同時に到達させて同時に停止させること、としてもよい。 In the electronic component mounting device of the present invention, each mounting head is equipped with a mounting nozzle that picks up and mounts the electronic component, the pickup position where the mounting nozzle picks up the electronic component, and the mounting nozzle of the mounting head mounts the electronic component. Moving in a predetermined direction with and from the mounting position to be mounted, the control unit simultaneously starts each mounting head from each pickup position or each mounting position toward the same direction, and each mounting head is started. It may be possible to reach the mounting position or each pickup position at the same time and stop at the same time.

制御部が各実装ヘッドをピックアップ位置または実装位置から同一方向に向かって同時に始動させ、実装位置またはピックアップ位置に同時に到達させて同時に停止させるので、一の実装ヘッドのピックアップ動作または実装動作中に他の実装ヘッドの移動による振動が干渉して実装精度に影響が出ることを抑制できる。 Since the control unit starts each mounting head from the pickup position or the mounting position in the same direction at the same time, reaches the mounting position or the pickup position at the same time, and stops at the same time, the other during the pickup operation or the mounting operation of one mounting head. It is possible to prevent the vibration caused by the movement of the mounting head from interfering with the mounting accuracy.

本発明の電子部品実装装置において、上面に電子部品を実装する基板または他の電子部品が実装された基板を保持する実装ステージを複数含み、それぞれのピックアップ位置とそれぞれの実装ステージとの間の所定の方向の距離が等しいこと、としてもよい。 The electronic component mounting apparatus of the present invention includes a plurality of mounting stages for holding a substrate on which an electronic component is mounted or a board on which other electronic components are mounted on the upper surface, and a predetermined position between each pickup position and each mounting stage. The distances in the directions of are equal.

この構成により、ピックアップ位置と実装位置との間の距離を同一にすることができ、複数の実装ヘッドを同時に始動、停止させて実装品質を向上させることができる。 With this configuration, the distance between the pickup position and the mounting position can be made the same, and a plurality of mounting heads can be started and stopped at the same time to improve the mounting quality.

本発明の電子部品実装装置において、基板は、所定の方向に複数の電子部品が実装され、制御部は、それぞれのピックアップ位置とそれぞれの実装位置との間のそれぞれの距離が等しくなるように、それぞれの実装ヘッドを移動させて複数の電子部品を実装していくこと、としてもよい。 In the electronic component mounting device of the present invention, a plurality of electronic components are mounted on the substrate in a predetermined direction, and the control unit has the control unit so that the respective distances between the respective pickup positions and the respective mounting positions are equal. It is also possible to move each mounting head to mount a plurality of electronic components.

これにより、基板の所定の方向に複数の電子部品を実装する場合にも、ピックアップ位置と実装位置との間の距離を同一にすることができるので、複数の実装ヘッドを同時に始動、停止させて実装品質を向上させることができる。 As a result, even when a plurality of electronic components are mounted in a predetermined direction on the board, the distance between the pickup position and the mounting position can be the same, so that the plurality of mounting heads can be started and stopped at the same time. The mounting quality can be improved.

本発明の電子部品実装装置において、それぞれのピックアップ位置とそれぞれの実装位置との間のそれぞれの距離が異なる場合には、距離が短い方の実装ヘッドの移動速度を距離が長い方の実装ヘッドの移動速度よりも遅くしてもよい。 In the electronic component mounting device of the present invention, when the respective distances between the respective pickup positions and the respective mounting positions are different, the moving speed of the mounting head having the shorter distance is set to the moving speed of the mounting head having the longer distance. It may be slower than the moving speed.

これにより、ピックアップ位置と実装位置との間のそれぞれの距離が異なる場合でも、複数の実装ヘッドを同時に始動、停止させることができ、実装品質を向上させることができる。 As a result, even if the respective distances between the pickup position and the mounting position are different, a plurality of mounting heads can be started and stopped at the same time, and the mounting quality can be improved.

本発明は、複数の実装ヘッドを備える電子部品実装装置において、設置スペースの低減と実装精度の向上を図ることができる。 INDUSTRIAL APPLICABILITY The present invention can reduce the installation space and improve the mounting accuracy in an electronic component mounting device including a plurality of mounting heads.

実施形態のボンディング装置の構成を示す平面図である。It is a top view which shows the structure of the bonding apparatus of embodiment. 図１に示すボンディング装置のピックアップヘッドによる半導体ダイのピック動作を示す平面図である。It is a top view which shows the pick operation of the semiconductor die by the pickup head of the bonding apparatus shown in FIG. 図１に示すボンディング装置の中間ステージの移動動作を示す平面図である。It is a top view which shows the moving operation of the intermediate stage of the bonding apparatus shown in FIG. 図１に示すボンディング装置の実装ヘッドのピックアップ位置ヘの移動を示す平面図である。It is a top view which shows the movement of the mounting head of the bonding apparatus shown in FIG. 1 to a pickup position. 図１に示すボンディング装置の実装ヘッドの実装位置への移動を示す平面図である。It is a top view which shows the movement of the mounting head of the bonding apparatus shown in FIG. 1 to the mounting position. 図１に示すボンディング装置によって半導体ダイを基板に実装した後の実装ヘッドの初期位置への移動と、中間ステージの第１位置への移動を示す平面図である。FIG. 5 is a plan view showing the movement of the mounting head to the initial position and the movement of the intermediate stage to the first position after mounting the semiconductor die on the substrate by the bonding apparatus shown in FIG. 図１に示すボンディング装置において、各ピックアップ位置と各実装位置との各距離が等しい場合の各実装ヘッドの速度の時間変化を示すグラフである。In the bonding apparatus shown in FIG. 1, it is a graph which shows the time change of the speed of each mounting head when each distance between each pickup position and each mounting position is equal. 図１に示すボンディング装置において、各ピックアップ位置と各実装位置との各距離が等しい場合の各実装ヘッドのＹ方向の位置の時間変化を示すグラフである。In the bonding apparatus shown in FIG. 1, it is a graph which shows the time change of the position of each mounting head in the Y direction when each distance between each pickup position and each mounting position is equal. 図１に示すボンディング装置において、各ピックアップ位置と各実装位置との各距離が異なる場合の実装ヘッドの実装位置への移動を示す平面図である。FIG. 5 is a plan view showing the movement of the mounting head to the mounting position when the distance between each pickup position and each mounting position is different in the bonding apparatus shown in FIG. 1. 図９に示す実装ヘッドの移動の後に半導体ダイを基板に実装した後の実装ヘッドの初期位置への移動と、中間ステージの第１位置への移動を示す平面図である。9 is a plan view showing the movement of the mounting head to the initial position after mounting the semiconductor die on the substrate after the movement of the mounting head shown in FIG. 9 and the movement to the first position of the intermediate stage. 図９に示す実装ヘッドの移動の際の各実装ヘッドの速度の時間変化を示すグラフである。It is a graph which shows the time change of the speed of each mounting head when the mounting head shown in FIG. 9 moves. 図９に示す実装ヘッドの移動の際の各実装ヘッドのＹ方向の位置の時間変化を示すグラフである。It is a graph which shows the time change of the position of each mounting head in the Y direction when the mounting head shown in FIG. 9 is moved. 他の実施形態のボンディング装置の構成を示す平面図である。It is a top view which shows the structure of the bonding apparatus of another embodiment. 図１３に示すボンディング装置の実装ヘッドのピックアップ位置ヘの移動を示す平面図である。It is a top view which shows the movement of the mounting head of the bonding apparatus shown in FIG. 13 to a pickup position. 図１３に示すボンディング装置の実装ヘッドの実装位置への移動を示す平面図である。It is a top view which shows the movement of the mounting head of the bonding apparatus shown in FIG. 13 to the mounting position.

以下、図面を参照しながら実施形態の電子部品実装装置であるボンディング装置１００について説明する。ボンディング装置１００は、電子部品である半導体ダイ１６を基板１５または他の半導体ダイ１６に実装するものである。 Hereinafter, the bonding device 100, which is the electronic component mounting device of the embodiment, will be described with reference to the drawings. The bonding device 100 mounts a semiconductor die 16 which is an electronic component on a substrate 15 or another semiconductor die 16.

図１に示すように、ボンディング装置１００は、ベース１０と、ベース１０に取り付けられて所定の方向であるＹ方向に伸びる共通のリニアガイド２０と、リニアガイド２０にガイドされてＹ方向に移動する複数の実装ヘッド２１ａ，２１ｂと、２つの実装ヘッド２１ａ，２１ｂのＹ方向の位置を調整する制御部５０と、を備えている。 As shown in FIG. 1, the bonding apparatus 100 moves in the Y direction guided by the base 10, a common linear guide 20 attached to the base 10 and extending in the Y direction, which is a predetermined direction, and the linear guide 20. A plurality of mounting heads 21a and 21b and a control unit 50 for adjusting the positions of the two mounting heads 21a and 21b in the Y direction are provided.

また、図１に示すように、ボンディング装置１００のベース１０には、基板１５をＸ方向に搬送する２組の搬送レール１１ａ，１１ｂと、２つの実装ステージ１２ａ，１２ｂと、が取り付けられている。更に、ボンディング装置１００には、ベース１０に取り付けられてＸ方向に伸びるガイドフレーム３２と、ガイドフレーム３２にガイドされてＸ方向に移動するピックアップヘッド３３と、ベース１０に取り付けられてＹ方向に伸びるガイドレール３０と、ガイドレール３０にガイドされてＹ方向に移動する中間ステージ３１と、ウェーハ３５を保持するウェーハホルダ（図示せず）を備えている。 Further, as shown in FIG. 1, two sets of transport rails 11a and 11b for transporting the substrate 15 in the X direction and two mounting stages 12a and 12b are attached to the base 10 of the bonding apparatus 100. .. Further, the bonding device 100 includes a guide frame 32 that is attached to the base 10 and extends in the X direction, a pickup head 33 that is guided by the guide frame 32 and moves in the X direction, and a pickup head 33 that is attached to the base 10 and extends in the Y direction. It includes a guide rail 30, an intermediate stage 31 that is guided by the guide rail 30 and moves in the Y direction, and a wafer holder (not shown) that holds the wafer 35.

２つの実装ステージ１２ａ，１２ｂの中心のＹ方向位置はそれぞれ１２ｃ，１２ｄであり、各実装ステージ１２ａ，１２ｂの中心のＹ方向の距離はＷ１である。また、中間ステージ３１の上面には半導体ダイ１６をプレース及びピックアップする２つの載置台１７が設けられている。２つの載置台１７のＹ方向の間隔は、実装ステージ１２ａ，１２ｂのＹ方向の間隔と同じＷ１である。 The Y-direction positions of the centers of the two mounting stages 12a and 12b are 12c and 12d, respectively, and the Y-direction distance of the centers of the two mounting stages 12a and 12b is W1. Further, on the upper surface of the intermediate stage 31, two mounting stands 17 for placing and picking up the semiconductor die 16 are provided. The distance between the two mounting tables 17 in the Y direction is W1, which is the same as the distance between the mounting stages 12a and 12b in the Y direction.

中間ステージ３１は、図１に実線で示す第１位置と、一点鎖線で示す第２位置との間でＹ方向に移動する。中間ステージ３１が一点鎖線で示す第２位置に来ると、２つの載置台１７のＹ方向位置は、ピックアップ位置１３ａ，１３ｂとなる。先に説明したように、２つの載置台１７のＹ方向の間隔は、実装ステージ１２ａ，１２ｂのＹ方向の間隔と同じＷ１であるから、各ピックアップ位置１３ａ，１３ｂと各実装ステージ１２ａ，１２ｂの各中心のＹ方向位置１２ｃ，１２ｄとの間の各Ｙ方向の距離ΔＹｃとΔＹｄとは等しくなっている。 The intermediate stage 31 moves in the Y direction between the first position shown by the solid line in FIG. 1 and the second position shown by the alternate long and short dash line. When the intermediate stage 31 comes to the second position indicated by the alternate long and short dash line, the Y-direction positions of the two mounting tables 17 become the pickup positions 13a and 13b. As described above, since the distance between the two mounting bases 17 in the Y direction is W1 which is the same as the distance between the mounting stages 12a and 12b in the Y direction, the pickup positions 13a and 13b and the mounting stages 12a and 12b The distances ΔYc and ΔYd in each Y direction between the positions 12c and 12d in the Y direction of each center are equal to each other.

図１に示すように、各基板１５のＹ方向マイナス側端部に半導体ダイ１６を実装する場合、半導体ダイ１６を実装するＹ方向の位置は実装位置１４ａ，１４ｂとなる。この場合、実装位置１４ａ，１４ｂの間のＹ方向の距離は、２つの載置台１７の間のＹ方向の距離と同様、Ｗ１となる。この場合、各ピックアップ位置１３ａ，１３ｂと各実装位置１４ａ，１４ｂとの間の各Ｙ方向の距離ΔＹａとΔＹｂとは等しくなる。 As shown in FIG. 1, when the semiconductor die 16 is mounted on the negative end in the Y direction of each substrate 15, the positions in the Y direction on which the semiconductor die 16 is mounted are the mounting positions 14a and 14b. In this case, the distance in the Y direction between the mounting positions 14a and 14b is W1, which is the same as the distance in the Y direction between the two mounting tables 17. In this case, the distances ΔYa and ΔYb in each Y direction between the pickup positions 13a and 13b and the mounting positions 14a and 14b are equal.

各実装ヘッド２１ａ，２１ｂは、リニアガイド２０の一方の側にＹ方向に並べて取り付けられ、リニアガイド２０にガイドされてＹ方向に移動する。各実装ヘッド２１ａ，２１ｂには、半導体ダイ１６をピックアップ及び実装する実装ノズル２２ａ，２２ｂが取り付けられている。各実装ヘッド２１ａ，２１ｂは、実装ノズル２２ａ，２２ｂが載置台１７の直上に来て半導体ダイ１６をピックアップするピックアップ位置１３ａ，１３ｂと、実装ノズル２２ａ，２２ｂが半導体ダイ１６を実装する実装位置１４ａ，１４ｂとの間でＹ方向に移動する。 The mounting heads 21a and 21b are mounted side by side in the Y direction on one side of the linear guide 20, and are guided by the linear guide 20 to move in the Y direction. Mounting nozzles 22a and 22b for picking up and mounting the semiconductor die 16 are attached to the mounting heads 21a and 21b. The mounting heads 21a and 21b have pickup positions 13a and 13b in which the mounting nozzles 22a and 22b come directly above the mounting table 17 to pick up the semiconductor die 16 and mounting positions 14a in which the mounting nozzles 22a and 22b mount the semiconductor die 16. , 14b and move in the Y direction.

ピックアップヘッド３３には、ウェーハ３５から半導体ダイ１６をピックアップして中間ステージ３１の載置台１７の上にプレースするピックアップノズル３４が取り付けられている。 A pickup nozzle 34 that picks up the semiconductor die 16 from the wafer 35 and places it on the mounting table 17 of the intermediate stage 31 is attached to the pickup head 33.

各実装ヘッド２１ａ，２１ｂ、ピックアップヘッド３３、中間ステージ３１には、リニアモータ等の駆動部が取り付けられており、各駆動部は制御部５０の指令によって動作する。制御部５０は、内部にＣＰＵと記憶部とを含むコンピュータで構成されている。 Drive units such as linear motors are attached to the mounting heads 21a and 21b, the pickup head 33, and the intermediate stage 31, and each drive unit operates according to a command from the control unit 50. The control unit 50 is composed of a computer including a CPU and a storage unit inside.

次に、図２から図８を参照しながら、ボンディング装置１００の動作について説明する。以下の説明では、図１に示すように、各基板１５のＹ方向マイナス側端部に半導体ダイ１６を実装する場合について説明する。 Next, the operation of the bonding apparatus 100 will be described with reference to FIGS. 2 to 8. In the following description, as shown in FIG. 1, a case where the semiconductor die 16 is mounted on the negative end in the Y direction of each substrate 15 will be described.

図２に示すように、制御部５０は、各実装ヘッド２１ａ，２１ｂを初期位置に移動させると共に、中間ステージ３１をＹ方向マイナス側の第１位置に移動させる。そして、制御部５０は、ピックアップヘッド３３をＸ方向に移動させてピックアップノズル３４によりウェーハ３５から半導体ダイ１６をピックアップして中間ステージ３１の２つの載置台１７の上にそれぞれプレースする。半導体ダイ１６は、中間ステージ３１の２つの載置台１７の上にＹ方向の距離Ｗ１の間隔でプレースされる。 As shown in FIG. 2, the control unit 50 moves the mounting heads 21a and 21b to the initial positions and the intermediate stage 31 to the first position on the minus side in the Y direction. Then, the control unit 50 moves the pickup head 33 in the X direction, picks up the semiconductor die 16 from the wafer 35 by the pickup nozzle 34, and places it on the two mounting tables 17 of the intermediate stage 31. The semiconductor dies 16 are placed on the two mounting tables 17 of the intermediate stage 31 at a distance W1 in the Y direction.

半導体ダイ１６のプレースが終了したら、制御部５０は、図３に示すように、中間ステージ３１をＹ方向プラス側に第２位置まで移動させる。中間ステージ３１が第２位置に移動すると、各載置台１７にプレースされた各半導体ダイ１６のＹ方向位置は、それぞれピックアップ位置１３ａ，１３ｂとなっている。 When the placement of the semiconductor die 16 is completed, the control unit 50 moves the intermediate stage 31 to the second position on the positive side in the Y direction as shown in FIG. When the intermediate stage 31 moves to the second position, the Y-direction positions of the semiconductor dies 16 placed on the mounting tables 17 are the pickup positions 13a and 13b, respectively.

図４に示すように、制御部５０は、各実装ヘッド２１ａ，２１ｂの各実装ノズル２２ａ，２２ｂの中心がピックアップ位置１３ａ，１３ｂとなるように、Ｙ方向マイナス側に各実装ヘッド２１ａ，２１ｂを移動させる。この際、制御部５０は、各実装ヘッド２１ａ，２１ｂを同時に初期位置からＹ方向マイナス側に向かって始動し、同時に各実装ノズル２２ａ，２２ｂの中心をピックアップ位置１３ａ，１３ｂに到達させて、同時に各実装ヘッド２１ａ，２１ｂのＹ方向マイナス側への移動を停止させる。 As shown in FIG. 4, the control unit 50 sets the mounting heads 21a and 21b on the minus side in the Y direction so that the centers of the mounting nozzles 22a and 22b of the mounting heads 21a and 21b are the pickup positions 13a and 13b. Move it. At this time, the control unit 50 simultaneously starts the mounting heads 21a and 21b from the initial position toward the minus side in the Y direction, and at the same time causes the centers of the mounting nozzles 22a and 22b to reach the pickup positions 13a and 13b, and at the same time. The movement of the mounting heads 21a and 21b to the negative side in the Y direction is stopped.

図５に示すように、制御部５０は、各実装ヘッド２１ａ，２１ｂの各実装ノズル２２ａ，２２ｂの先端にそれぞれ半導体ダイ１６を吸着して半導体ダイ１６を中間ステージ３１からピックアップする。ピックアップが終了したら、図５に示すように、各実装ヘッド２１ａ，２１ｂをピックアップ位置１３ａ，１３ｂから実装位置１４ａ，１４ｂに移動させる。この際、制御部５０は、各実装ヘッド２１ａ，２１ｂを同時にＹ方向プラス側に向かって始動し、同時に各実装ノズル２２ａ，２２ｂの中心を実装位置１４ａ，１４ｂに到達させて、同時に各実装ヘッド２１ａ，２１ｂのＹ方向プラス側への移動を停止させる。 As shown in FIG. 5, the control unit 50 attracts the semiconductor die 16 to the tips of the mounting nozzles 22a and 22b of the mounting heads 21a and 21b, respectively, and picks up the semiconductor die 16 from the intermediate stage 31. When the pickup is completed, the mounting heads 21a and 21b are moved from the pickup positions 13a and 13b to the mounting positions 14a and 14b as shown in FIG. At this time, the control unit 50 simultaneously starts the mounting heads 21a and 21b toward the positive side in the Y direction, simultaneously causes the centers of the mounting nozzles 22a and 22b to reach the mounting positions 14a and 14b, and simultaneously causes the mounting heads 21a and 14b to reach the mounting positions 14a and 14b. The movement of 21a and 21b to the plus side in the Y direction is stopped.

先に説明したように、各ピックアップ位置１３ａ，１３ｂと各実装位置１４ａ，１４ｂとの間の各Ｙ方向の距離ΔＹａとΔＹｂとは等しいので、制御部５０は、図７に示す破線ａ、実線ｂのように時刻ｔ０に同時に各実装ヘッド２１ａ，２１ｂを始動し、時刻ｔ１まで同様の加速度で同一速度まで加速し、時刻ｔ２まで同一の速度でＹ方向に移動させ、時刻ｔ３まで同一の減速度で速度ゼロまで減速し、時刻ｔ３に同時に停止する。この際、図８の破線ｃ，実線ｄに示すように各実装ヘッド２１ａ，２１ｂは、同時に実装位置１４ａ，１４ｂに到達する。図７において破線ａ，実線ｂは、各実装ヘッド２１ａ，２１ｂの速度の時間変化を示し、図８において、破線ｃ、実線ｄは、各実装ヘッド２１ａ，２１ｂのＹ方向位置に時間変化を示す。 As described above, since the distances ΔYa and ΔYb in each Y direction between the pickup positions 13a and 13b and the mounting positions 14a and 14b are equal, the control unit 50 has a broken line a and a solid line shown in FIG. As in b, the mounting heads 21a and 21b are started at the same time at time t0, accelerated to the same speed with the same acceleration until time t1, moved in the Y direction at the same speed until time t2, and reduced in the same way until time t3. It decelerates to zero at speed and stops at the same time at time t3. At this time, as shown by the broken line c and the solid line d in FIG. 8, the mounting heads 21a and 21b reach the mounting positions 14a and 14b at the same time. In FIG. 7, the broken line a and the solid line b indicate the time change of the speed of the mounting heads 21a and 21b, and in FIG. 8, the broken line c and the solid line d indicate the time change in the Y direction position of the mounting heads 21a and 21b. ..

制御部５０は、各実装ヘッド２１ａ，２１ｂの実装位置１４ａ，１４ｂへの移動が終了し、各実装ヘッド２１ａ，２１ｂが停止したら、各実装ノズル２２ａ，２２ｂを降下させて、各実装ノズル２２ａ，２２ｂの先端に吸着していた半導体ダイ１６を各基板１５の上に実装する。 When the movement of the mounting heads 21a and 21b to the mounting positions 14a and 14b is completed and the mounting heads 21a and 21b are stopped, the control unit 50 lowers the mounting nozzles 22a and 22b to lower the mounting nozzles 22a and 22a, respectively. The semiconductor die 16 attracted to the tip of 22b is mounted on each substrate 15.

各半導体ダイ１６の各基板１５への実装が完了したら、図６に示すように、制御部５０は、各実装ヘッド２１ａ，２１ｂを初期位置に移動させ、中間ステージを第１位置に移動させ、次の半導体ダイ１６のピックアップ実装動作を続ける。 After the mounting of the semiconductor dies 16 on the substrates 15 is completed, the control unit 50 moves the mounting heads 21a and 21b to the initial positions and the intermediate stage to the first position as shown in FIG. The pickup mounting operation of the next semiconductor die 16 is continued.

基板１５に複数の半導体ダイ１６をＹ方向に並べて実装する場合には、制御部５０は、各ピックアップ位置１３ａ，１３ｂと各実装位置１４ａ，１４ｂとの間の各距離が等しくなるように、各実装ヘッド２１ａ，２１ｂを移動させて複数の半導体ダイ１６を実装していく。例えば、図１に示すように、各基板１５のＹ方向マイナス側端部に半導体ダイ１６を実装したら、次に、最初の実装位置からＹ方向プラス側にそれぞれΔＹ１だけずれた位置に半導体ダイ１６を実装する。この場合、各実装位置１４ａ，１４ｂの間のＹ方向距離はＷ１であるから、ピックアップ位置１３ａ，１３ｂと各実装位置１４ａ，１４ｂとの間の各距離は等しく、先に説明したと同様、各実装ヘッド２１ａ，２１ｂを同一の加速度、同一の速度でＹ方向に移動させることにより、同時に始動し、同時に実装位置１４ａ，１４ｂに到達し同時に各実装ヘッド２１ａ，２１ｂを停止させることができる。 When a plurality of semiconductor dies 16 are mounted side by side in the Y direction on the substrate 15, the control unit 50 sets each of the pickup positions 13a and 13b so that the distances between the pickup positions 13a and 13b and the mounting positions 14a and 14b are equal. A plurality of semiconductor dies 16 are mounted by moving the mounting heads 21a and 21b. For example, as shown in FIG. 1, after mounting the semiconductor die 16 on the negative end in the Y direction of each substrate 15, the semiconductor die 16 is then displaced by ΔY1 from the initial mounting position on the positive side in the Y direction. To implement. In this case, since the Y-direction distance between the mounting positions 14a and 14b is W1, the distances between the pickup positions 13a and 13b and the mounting positions 14a and 14b are equal, and as described above, each By moving the mounting heads 21a and 21b in the Y direction at the same acceleration and the same speed, the mounting heads 21a and 21b can be started at the same time, reach the mounting positions 14a and 14b at the same time, and stop at the same time.

以上説明したように、本実施形態のボンディング装置１００では、実装ヘッド２１ａ，２１ｂをリニアガイド２０の一方の側にＹ方向に並べて配置するので、リニアガイド２０の実装ヘッド２１ａ，２１ｂの配置されていない側のスペースを他の機器の配置スペースとすることができる。このため、設置スペースの低減を図ることができる。また、制御部５０が各実装ヘッド２１ａ，２１ｂをピックアップ位置１３ａ，１３ｂから同一方向に向かって同時に始動させ、実装位置１４ａ，１４ｂに同時に到達させて同時に停止させるので、一の実装ヘッド２１ａのピックアップ動作または実装動作中に他の実装ヘッド２１ｂの移動による振動が干渉して実装精度に影響が出ることを抑制し、実装精度を向上させることができる。 As described above, in the bonding apparatus 100 of the present embodiment, the mounting heads 21a and 21b are arranged side by side in the Y direction on one side of the linear guide 20, so that the mounting heads 21a and 21b of the linear guide 20 are arranged. The space on the non-existent side can be used as the placement space for other devices. Therefore, the installation space can be reduced. Further, since the control unit 50 simultaneously starts the mounting heads 21a and 21b from the pickup positions 13a and 13b in the same direction, reaches the mounting positions 14a and 14b at the same time and stops them at the same time, the pickup of one mounting head 21a It is possible to improve the mounting accuracy by suppressing the vibration caused by the movement of the other mounting head 21b from interfering with the mounting accuracy during the operation or the mounting operation.

次に、各ピックアップ位置１３ａ，１３ｂと各実装位置１４ａ１，１４ｂとの間のそれぞれの距離が異なる場合について説明する。 Next, a case where the respective distances between the pickup positions 13a and 13b and the mounting positions 14a and 14b are different will be described.

図９に示すように、Ｙ方向マイナス側（手前側）の基板１５のＹ方向マイナス側端部と、Ｙ方向プラス側（奥側）の基板１５のＹ方向プラス側端部に半導体ダイ１６を実装する場合、手前側の実装位置１４ｂと奥側の実装位置１４ａ１との間の距離Ｗ２は、手前側のピックアップ位置１３ｂと奥側のピックアップ位置１３ａとの間の距離Ｗ１より大きくなる。この場合、奥側のピックアップ位置１３ａと奥側の実装位置１４ａ１との距離ΔＹａ１は、手前側のピックアップ位置１３ｂと手前側の実装位置１４ｂとの間の距離ΔＹｂよりも大きくなっている。この場合、制御部５０は、移動距離が短い方の実装ヘッド２１ｂの移動速度を移動距離が長い方の実装ヘッド２１ａの移動速度よりも遅くすることによって、各実装ヘッド２１ａ，２１ｂを同時に始動し、同時に各実装ヘッド２１ａ，２１ｂの各実装ノズル２２ａ，２２ｂを各実装位置１４ａ１，１４ｂに到達させ、各実装ヘッド２１ａ，２１ｂのＹ方向の移動を同時に停止する。 As shown in FIG. 9, the semiconductor die 16 is attached to the Y-direction minus side end of the Y-direction minus side (front side) and the Y-direction plus side end of the Y-direction plus side (back side) substrate 15. In the case of mounting, the distance W2 between the mounting position 14b on the front side and the mounting position 14a1 on the back side is larger than the distance W1 between the pickup position 13b on the front side and the pickup position 13a on the back side. In this case, the distance ΔYa1 between the pickup position 13a on the back side and the mounting position 14a1 on the back side is larger than the distance ΔYb between the pickup position 13b on the front side and the mounting position 14b on the front side. In this case, the control unit 50 starts the mounting heads 21a and 21b at the same time by making the moving speed of the mounting head 21b having the shorter moving distance slower than the moving speed of the mounting head 21a having the longer moving distance. At the same time, the mounting nozzles 22a and 22b of the mounting heads 21a and 21b are brought to the mounting positions 14a and 14b, and the movement of the mounting heads 21a and 21b in the Y direction is stopped at the same time.

制御部５０は、図１１に示すように、各実装ヘッド２１ａ，２１ｂの速度を制御する。図１１において一点鎖線ｅ，実線ｂは、各実装ヘッド２１ａ，２１ｂの速度の時間変化を示し、図１２において、一点鎖線ｆ、実線ｄは、各実装ヘッド２１ａ，２１ｂのＹ方向位置に時間変化を示す。 As shown in FIG. 11, the control unit 50 controls the speeds of the mounting heads 21a and 21b. In FIG. 11, the alternate long and short dash line e and the solid line b indicate the time change of the speed of the respective mounting heads 21a and 21b, and in FIG. 12, the alternate long and short dash line f and the solid line d change with time in the Y direction position of the respective mounting heads 21a and 21b. Is shown.

制御部５０は、図１１に示す一点鎖線ｅ、実線ｂのように時刻ｔ０に同時に各実装ヘッド２１ａ，２１ｂを始動する。手前側の実装ヘッド２１ｂは、移動距離が短いので、時刻ｔ１１に加速を停止し、奥側の実装ヘッド２１ａよりも遅い速度でＹ方向に等速移動する。一方、奥側の実装ヘッド２１ａは、先に説明したと同様、時刻ｔ１まで加速を続け、時刻ｔ１から等速移動となる。そして、奥側の実装ヘッド２１ａは、時刻ｔ２から減速を開始して時刻ｔ３に実装位置１４ａ１に到達し、時刻ｔ３に速度ゼロとなる。手前側の実装ヘッド２１ｂは、時刻ｔ１２まで等速移動を続け、時刻ｔ１２から減速を開始して時刻ｔ３に実装位置１４ａ１に到達し、時刻ｔ３に速度ゼロとなる。 The control unit 50 starts the mounting heads 21a and 21b at the same time at time t0 as shown by the alternate long and short dash line e and the solid line b shown in FIG. Since the mounting head 21b on the front side has a short moving distance, acceleration is stopped at time t11, and the mounting head 21b on the back side moves at a constant speed in the Y direction at a speed slower than that of the mounting head 21a on the back side. On the other hand, the mounting head 21a on the back side continues accelerating until the time t1 and moves at a constant speed from the time t1 as described above. Then, the mounting head 21a on the back side starts deceleration at time t2, reaches the mounting position 14a1 at time t3, and becomes zero speed at time t3. The mounting head 21b on the front side continues to move at a constant speed until time t12, starts deceleration at time t12, reaches the mounting position 14a1 at time t3, and reaches zero speed at time t3.

制御部５０は、時刻ｔ３に各実装ヘッド２１ａ，２１ｂのＹ方向の移動が停止した後、各実装ヘッド２１ａ，２１ｂの各実装ノズル２２ａ，２２ｂが吸着していた半導体ダイ１６を各基板１５の上に実装する。そして、各半導体ダイ１６の各基板１５への実装が完了したら、図１０に示すように、制御部５０は、各実装ヘッド２１ａ，２１ｂを初期位置に移動させ、中間ステージ３１を第１位置に移動させ、次の半導体ダイ１６のピックアップ実装動作を続ける。 After the movement of the mounting heads 21a and 21b in the Y direction is stopped at time t3, the control unit 50 attaches the semiconductor die 16 to which the mounting nozzles 22a and 22b of the mounting heads 21a and 21b are attracted to each substrate 15. Implement above. Then, when the mounting of the semiconductor dies 16 on the substrates 15 is completed, as shown in FIG. 10, the control unit 50 moves the mounting heads 21a and 21b to the initial positions and sets the intermediate stage 31 to the first position. It is moved and the pickup mounting operation of the next semiconductor die 16 is continued.

以上説明したように、実施形態のボンディング装置１００では、ピックアップ位置１３ａ，１３ｂ実装位置１４ａ１，１４ｂとの間の各距離ΔＹａ１、ΔＹｂが異なる場合には、移動距離が短い方の実装ヘッド２１ｂの移動速度を距離が長い方の実装ヘッド２１ａの移動速度よりも遅くする。これにより、ピックアップ位置１３ａ，１３ｂと実装位置１４ａ１，１４ｂとの間の各距離ΔＹａ１、ΔＹｂが異なる場合でも、２つの実装ヘッド２１ａ，２１ｂを同時に始動、停止させることができる。一の実装ヘッド２１ａのピックアップ動作または実装動作中に他の実装ヘッド２１ｂの移動による振動が干渉して実装精度に影響が出ることを抑制し、実装精度を向上させることができる。 As described above, in the bonding apparatus 100 of the embodiment, when the distances ΔYa1 and ΔYb between the pickup positions 13a and 13b and the mounting positions 14a and 14b are different, the mounting head 21b having the shorter moving distance is moved. The speed is made slower than the moving speed of the mounting head 21a having a longer distance. As a result, even if the distances ΔYa1 and ΔYb between the pickup positions 13a and 13b and the mounting positions 14a and 14b are different, the two mounting heads 21a and 21b can be started and stopped at the same time. It is possible to prevent the vibration caused by the movement of the other mounting head 21b from interfering with each other during the pickup operation or the mounting operation of one mounting head 21a and affecting the mounting accuracy, and to improve the mounting accuracy.

次に図１３から図１５を参照して他の実施形態のボンディング装置２００について説明する。先に図１から図１２を参照して説明したボンディング装置１００と同様の部位には同様の符号を付して説明は省略する。 Next, the bonding apparatus 200 of another embodiment will be described with reference to FIGS. 13 to 15. The same parts as those of the bonding apparatus 100 described above with reference to FIGS. 1 to 12 are designated by the same reference numerals, and the description thereof will be omitted.

図１３に示すように、ボンディング装置２００は、２本のリニアガイド２０をＹ方向に平行に２本配置し、各リニアガイド２０のそれぞれ２つずつ実装ヘッド２１ａ，２１ｂ及び２１ｃ，２１ｄを取り付けたものである。各実装ヘッド２１ａ，２１ｂと２１ｃ，２１ｄは２本のリニアガイド２０の間に対向するように配置されている。このため、リニアガイド２０の実装ヘッド２１ａ，２１ｂの配置されていない側及び実装ヘッド２１ｃ，２１ｄの配置されていない側のスペースを他の機器のためのスペースとすることができ、ボンディング装置１００を二台並べるよりも更に設置スペースを低減することができる。 As shown in FIG. 13, in the bonding apparatus 200, two linear guides 20 are arranged in parallel in the Y direction, and two mounting heads 21a, 21b and 21c, 21d are attached to each of the linear guides 20. It is a thing. The mounting heads 21a, 21b and 21c, 21d are arranged so as to face each other between the two linear guides 20. Therefore, the space on the side where the mounting heads 21a and 21b of the linear guide 20 are not arranged and the space on the side where the mounting heads 21c and 21d are not arranged can be used as a space for other equipment, and the bonding device 100 can be used. The installation space can be further reduced compared to arranging two units side by side.

また、ボンディング装置２００には、２つのガイドレール３０と各ガイドレール３０にガイドされる２つの中間ステージ３１が設けられている。更に、Ｘ方向に伸びるガイドフレーム３２には、２つのピックアップヘッド３３が取りつけられている。 Further, the bonding device 200 is provided with two guide rails 30 and two intermediate stages 31 guided by each guide rail 30. Further, two pickup heads 33 are attached to the guide frame 32 extending in the X direction.

以上の様に構成されたボンディング装置２００の動作について説明する。 The operation of the bonding apparatus 200 configured as described above will be described.

制御部５０は、２つのピックアップヘッド３３をＸ方向に移動させて２つのウェーハ３５からそれぞれ中間ステージ３１の各載置台１７に一つずつ合計４つの半導体ダイ１６をプレースする。 The control unit 50 moves the two pickup heads 33 in the X direction to place a total of four semiconductor dies 16 from the two wafers 35 on each mounting table 17 of the intermediate stage 31.

制御部５０は、図４を参照して説明したと同様、図１４に示すように、各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄの各実装ノズル２２ａ，２２ｂ，２２ｃ，２２ｄの中心がピックアップ位置１３ａ，１３ｂとなるように、Ｙ方向マイナス側に各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄを移動させる。この際、制御部５０は、各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄを同時に初期位置からＹ方向マイナス側に向かって始動し、同時に各実装ノズル２２ａ，２２ｂ，２２ｃ，２２ｄの中心をピックアップ位置１３ａ，１３ｂに到達させて、同時に各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄのＹ方向マイナス側への移動を停止させる。そして、各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄの各実装ノズル２２ａ，２２ｂ，２２ｃ，２２ｄの先端にそれぞれ半導体ダイ１６を吸着させる。 In the control unit 50, as shown in FIG. 14, the center of each mounting nozzle 22a, 22b, 22c, 22d of each mounting head 21a, 21b, 21c, 21d is the pickup position 13a, as described with reference to FIG. , 13b, and the mounting heads 21a, 21b, 21c, and 21d are moved to the minus side in the Y direction. At this time, the control unit 50 simultaneously starts the mounting heads 21a, 21b, 21c, 21d from the initial position toward the minus side in the Y direction, and at the same time, simultaneously centers the mounting nozzles 22a, 22b, 22c, 22d at the pickup position 13a. , 13b, and at the same time, the movement of the mounting heads 21a, 21b, 21c, 21d to the negative side in the Y direction is stopped. Then, the semiconductor die 16 is attracted to the tips of the mounting nozzles 22a, 22b, 22c, 22d of the mounting heads 21a, 21b, 21c, and 21d, respectively.

制御部５０は、先に図５を参照して説明したと同様、各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄをピックアップ位置１３ａ，１３ｂから実装位置１４ａ，１４ｂに移動させる。この際、制御部５０は、各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄを同時にＹ方向プラス側に向かって始動し、同時に各実装ノズル２２ａ，２２ｂ，２２ｃ，２２ｄの中心を実装位置１４ａ，１４ｂに到達させて、同時に各実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄのＹ方向プラス側への移動を停止させる。 The control unit 50 moves the mounting heads 21a, 21b, 21c, 21d from the pickup positions 13a, 13b to the mounting positions 14a, 14b in the same manner as described above with reference to FIG. At this time, the control unit 50 simultaneously starts the mounting heads 21a, 21b, 21c, 21d toward the positive side in the Y direction, and at the same time, centers the mounting nozzles 22a, 22b, 22c, 22d at the mounting positions 14a, 14b. At the same time, the mounting heads 21a, 21b, 21c, and 21d are stopped from moving in the positive direction in the Y direction.

制御部５０は、各実装ヘッド２１ａ，２１ｂの実装位置１４ａ，１４ｂへの移動が終了し、各実装ヘッド２１ａ，２１ｂが停止したら、各実装ノズル２２ａ，２２ｂを降下させて、各実装ノズル２２ａ，２２ｂの先端に吸着していた半導体ダイ１６を各基板１５の上に実装する。 When the movement of the mounting heads 21a and 21b to the mounting positions 14a and 14b is completed and the mounting heads 21a and 21b are stopped, the control unit 50 lowers the mounting nozzles 22a and 22b to lower the mounting nozzles 22a and 22a, respectively. The semiconductor die 16 attracted to the tip of 22b is mounted on each substrate 15.

本実施形態のボンディング装置２００は、ボンディング装置１００の作用、効果に加えて、ボンディング装置１００よりも更に設置スペースを低減することができ、４つ実装ヘッド２１ａ，２１ｂ，２１ｃ，２１ｄによって４つの半導体ダイ１６を同時に実装することができるので、更に実装速度を早くすることができる。 In addition to the actions and effects of the bonding device 100, the bonding device 200 of the present embodiment can further reduce the installation space as compared with the bonding device 100, and has four semiconductors by four mounting heads 21a, 21b, 21c, and 21d. Since the dies 16 can be mounted at the same time, the mounting speed can be further increased.

なお、以上の説明では、２つのピックアップヘッド３３がそれぞれ２つのウェーハ３５から半導体ダイ１６をピックアップして中間ステージ３１の各載置台１７にプレースすることとして説明したが、これに限定されず、例えば、各ピックアップヘッド３３がそれぞれ１つのウェーハ３５から半導体ダイ１６をピックアップして各中間ステージ３１の各載置台１７にプレースするように構成してもよい。 In the above description, the two pickup heads 33 pick up the semiconductor dies 16 from the two wafers 35 and place them on the mounting tables 17 of the intermediate stage 31, but the present invention is not limited to this, for example. Each pickup head 33 may pick up the semiconductor die 16 from one wafer 35 and place it on each mounting table 17 of each intermediate stage 31.

１０ ベース、１１ａ，１１ｂ 搬送レール、１２ａ，１２ｂ 実装ステージ、１２ｃ，１２ｄ Ｙ方向位置、１３ａ，１３ｂ ピックアップ位置、１４ａ，１４ａ１，１４ｂ 実装位置、１５ 基板、１６ 半導体ダイ、１７ 載置台、２０ リニアガイド、２１ａ，２１ｂ，２１ｃ，２１ｄ 実装ヘッド、２２ａ，２２ｂ，２２ｃ，２２ｄ 実装ノズル、３０ ガイドレール、３１ 中間ステージ、３２ ガイドフレーム、３３ ピックアップヘッド、３４ ピックアップノズル、３５ ウェーハ、５０ 制御部、１００，２０００ ボンディング装置。 10 Base, 11a, 11b Conveyance rail, 12a, 12b mounting stage, 12c, 12d Y direction position, 13a, 13b pickup position, 14a, 14a1, 14b mounting position, 15 board, 16 semiconductor die, 17 mounting base, 20 linear guide , 21a, 21b, 21c, 21d mounting head, 22a, 22b, 22c, 22d mounting nozzle, 30 guide rail, 31 intermediate stage, 32 guide frame, 33 pickup head, 34 pickup nozzle, 35 wafer, 50 control unit, 100, 2000 Bonding equipment.

Claims (5)

電子部品を基板または他の電子部品に実装する電子部品実装装置であって、
所定の方向に伸びるリニアガイドと、
所定の方向に並べて配置され、前記リニアガイドにガイドされて所定の方向に移動する複数の実装ヘッドと、
前記実装ヘッドの所定の方向の位置を調整する制御部と、を備え、
前記制御部は、
それぞれの前記実装ヘッドを同一方向に向かって同時に始動させ、且つ、前記それぞれの前記実装ヘッドを同時に停止させること、
を特徴とする電子部品実装装置。An electronic component mounting device that mounts electronic components on a board or other electronic components.
A linear guide that extends in a predetermined direction,
A plurality of mounting heads arranged side by side in a predetermined direction and guided by the linear guide to move in a predetermined direction.
A control unit for adjusting the position of the mounting head in a predetermined direction is provided.
The control unit
Simultaneously starting each of the mounting heads in the same direction and stopping each of the mounting heads at the same time.
An electronic component mounting device characterized by. 請求項１に記載の電子部品実装装置であって、
それぞれの前記実装ヘッドは、前記電子部品をピックアップ及び実装する実装ノズルが取り付けられ、前記実装ノズルが前記電子部品をピックアップするピックアップ位置と、前記実装ヘッドの前記実装ノズルが前記電子部品を実装する実装位置との間で所定の方向に移動し、
前記制御部は、
それぞれの前記実装ヘッドをそれぞれの前記ピックアップ位置またはそれぞれの前記実装位置から同一方向に向かって同時に始動させ、且つ、それぞれの前記実装ヘッドをそれぞれの前記実装位置またはそれぞれの前記ピックアップ位置に同時に到達させて同時に停止させること、
を特徴とする電子部品実装装置。The electronic component mounting device according to claim 1.
A mounting nozzle for picking up and mounting the electronic component is attached to each mounting head, and a pickup position where the mounting nozzle picks up the electronic component and a mounting where the mounting nozzle of the mounting head mounts the electronic component. Move in a given direction to and from the position,
The control unit
The respective mounting heads are simultaneously started from the respective pickup positions or the respective mounting positions in the same direction, and the respective mounting heads are simultaneously reached at the respective mounting positions or the respective pickup positions. And stop at the same time,
An electronic component mounting device characterized by. 請求項２に記載の電子部品実装装置であって、
上面に前記電子部品を実装する前記基板または前記他の電子部品が実装された前記基板を保持する実装ステージを複数含み、
それぞれの前記ピックアップ位置とそれぞれの前記実装ステージとの間の所定の方向の距離が等しいこと、
を特徴とする電子部品実装装置。The electronic component mounting device according to claim 2.
A plurality of mounting stages for holding the substrate on which the electronic component is mounted or the substrate on which the other electronic component is mounted are included on the upper surface thereof.
The distance between each pickup position and each mounting stage in a predetermined direction is equal.
An electronic component mounting device characterized by. 請求項３に記載の電子部品実装装置であって、
前記基板は、所定の方向に複数の前記電子部品が実装され、
前記制御部は、
それぞれの前記ピックアップ位置とそれぞれの前記実装位置との間のそれぞれの距離が等しくなるように、それぞれの前記実装ヘッドを移動させて複数の前記電子部品を実装していくこと、
を特徴とする電子部品実装装置。The electronic component mounting device according to claim 3.
A plurality of the electronic components are mounted on the substrate in a predetermined direction.
The control unit
To mount the plurality of electronic components by moving each mounting head so that the respective distances between the respective pickup positions and the respective mounting positions are equal.
An electronic component mounting device characterized by. 請求項２または３に記載の電子部品実装装置であって、
前記制御部は、
それぞれの前記ピックアップ位置とそれぞれの前記実装位置との間のそれぞれの距離が異なる場合には、
前記距離が短い方の前記実装ヘッドの移動速度を前記距離が長い方の前記実装ヘッドの移動速度よりも遅くすること、
を特徴とする電子部品実装装置。The electronic component mounting device according to claim 2 or 3.
The control unit
If the respective distances between the respective pickup positions and the respective mounting positions are different,
To make the moving speed of the mounting head having the shorter distance slower than the moving speed of the mounting head having the longer distance.
An electronic component mounting device characterized by.
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