JP6908655B2 - Backup device control method and board processing device - Google Patents

Description

The present invention relates to a control method for a backup device and a substrate processing device.

The board is transported to the production line, the board is lifted (lifted) at each board stop position set on the conveyor of the production line, and a predetermined process is executed at the board processing position set above the board stop position. When doing so, a substrate support device is used. For example, the substrate support device adopted in Patent Document 1 has a supporting member (backup pin, etc.) that can be raised and lowered between a height that faces below the substrate stop position at intervals and a height that lifts the substrate to the substrate processing position. It has a backup device including a unit composed of a backup plate or the like as a single member). The backup device raises the supported member at a predetermined speed and supports the substrate at a substrate processing position set above the substrate stop position.

Japanese Patent No. 4950530

Many substrates, such as flexible substrates, are relatively thin and easily warp. When such a board is lifted by the backup device, if the supporting member of the backup device is brought into contact with the board, the impact at the time of the abutting may adversely affect the components mounted on the board. In particular, in the case of a substrate on which a bare chip (semiconductor chip) diced from a wafer is mounted, the bumps of the bare chip are considerably small (for example, 30 μm to 50 μm), and even if flux is applied and stopped, slight vibration or impact is generated. There is a risk of misalignment. Therefore, when the substrate is lifted by the conventional backup device, the bare chip may be adversely affected by the impact when the supporting member comes into contact with the substrate.

On the other hand, if the speed at which the backup device lifts the substrate is reduced in order to avoid the impact, the impact itself can be avoided, but the tact becomes longer and the productivity may decrease.

The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a control method of a backup device and a board processing device capable of avoiding an impact when the substrate is lowered while suppressing a reduction in productivity. It is supposed to be.

The control method of the backup device according to one aspect of the present invention is between the substrate stop position set on the transfer path of the transfer conveyor that conveys the substrate and the substrate processing position set above the substrate stop position. In the control method of the backup device when the board at the board processing position is lowered to the board stop position and delivered to the transport conveyor by using a backup device including a backup pin capable of raising and lowering the board, the board processing is performed. In the initial descent section from when the backup pin carrying the substrate at the position starts to descend to before the substrate supported by the backup pin lands on the transport conveyor, excessive inertia is not applied to the substrate. The step of increasing the speed at which the backup pin descends to a descent speed set to a predetermined first speed to lower the substrate, and the step of descending the substrate from the substrate after the descending substrate starts to land on the transport conveyor. In the delivery section until leaving, the step of lowering the speed at which the backup pin descends to the delivery speed set to the second speed, which is lower than the first speed, and the step of lowering the backup pin, and the descending substrate are described. In the separation section after landing on the transport conveyor, a step of increasing the speed at which the backup pin descends to a return speed set to a third speed higher than the first speed and lowering the backup pin is provided. The excessive inertia has a magnitude that adversely affects the mounting state of the parts on the board as a result of the transfer speed of the board being too fast with respect to the holding force of the parts mounted on the board. The first speed is characterized in that a speed that does not cause the excessive inertia with respect to the holding force is selected.

The substrate processing apparatus according to another aspect of the present invention is set to a transfer conveyor that conveys the substrate along a transfer path that conveys the substrate, a substrate stop position set in the transfer conveyor, and above the substrate stop position. A backup device including a backup pin capable of raising and lowering the board between the board processing position and a control device for controlling the backup device, and the board at the board processing position is lowered to the board stop position. In the initial stage from when the backup pin carrying the substrate at the substrate processing position starts to descend to before the substrate carried by the backup pin lands on the transfer conveyor. In the descent section, the backup pin descends by increasing the descent speed set to a predetermined first speed that does not cause excessive inertia to act on the substrate, and the descending substrate is the transport conveyor. In the delivery section from the start of landing to the departure of the backup pin from the board, the speed at which the backup pin descends to the delivery speed set to the second speed, which is lower than the first speed, is reduced to lower the backup pin. In the separation section after the descending substrate has landed on the transport conveyor, the speed at which the backup pin descends is increased to the return speed set to the third speed, which is higher than the first speed. The control device for controlling the backup device so as to lower the backup pin is provided, and the excessive inertia causes the transfer speed of the board to be relatively fast with respect to the holding force of the components mounted on the board. As a result, an inertia having a magnitude that adversely affects the mounting state of the components on the substrate, and the first speed is selected so as not to cause the excessive inertia with respect to the holding force. It is a feature.

In these aspects, when the substrate is lowered from the substrate processing position to the substrate stop position, the supporting member is driven at the highest possible speed in the section where the substrate does not come into contact with the conveyor to shorten the processing time. At the same time, when the substrate lands on the transfer conveyor and the substrate is delivered from the supporting member to the transfer conveyor, the speed can be reduced and the impact on the substrate can be avoided. Therefore, even in these aspects, the substrate can be raised to the substrate processing position as quickly as possible while avoiding the impact on the substrate.

As described above, according to the present invention, when the substrate is lowered by the supporting member, the substrate can be raised and lowered as quickly as possible while avoiding an impact on the substrate, and as a result, reduction in productivity is suppressed. At the same time, it has a remarkable effect of avoiding the impact when the substrate is lowered.

Further features, objectives, configurations, and effects of the present invention will be readily apparent from the following detailed description, which should be read in conjunction with the accompanying drawings.

It is a top view of the component mounting apparatus including the substrate support apparatus in one Embodiment of this invention. It is a front schematic diagram which shows the schematic structure of the substrate support device of FIG. It is explanatory drawing which shows the substrate lift operation by the substrate support device of FIG. When the pins are at the separation height, (C) is when the backup pin is at the delivery height, (D) is when the backup pin is at the lock start height, and (E) is the backup pin. Is at the lock end height, and (F) is a graph showing the relationship between the movement height and the distance (section) corresponding to (A) to (E). It is explanatory drawing which shows the substrate lowering operation by the substrate support device of FIG. 1, (A) shows the time when the backup pin (element example of a supporting member) of a substrate support device is at a lock end height, (B) is When the backup pin is at the lock start height, (C) is when the backup pin is at the separation height, (D) is when the backup pin is at the delivery height, and (E) is. When the backup pin is at the initial height, (F) is a graph showing the relationship between the moving height and the distance (section) corresponding to (A) to (E).

Hereinafter, the best mode for carrying out the present invention will be described with reference to the accompanying drawings.

In the component mounting device M according to the present embodiment, the bare chip C is taken out from the diced wafer W and mounted (mounted) on a substrate P such as a printed wiring board (PWB), and electronic components and the like are mounted on the substrate. It is a so-called composite substrate processing device that can be mounted on P. The substrate processing apparatus is not limited to the component mounting apparatus, and examples thereof include a screen printing apparatus for applying solder paste to the printed circuit board P and an inspection apparatus for imaging and inspecting the upper surface of the substrate after mounting.

Further, in the illustrated example, the substrate P is a relatively rigid printed circuit board, but in addition to the printed circuit board P, a thin and variable (flexible) flexible substrate, and a printed circuit board and a flexible substrate can be used. It may be a rigid flexible substrate made of.

In the following description, in order to clarify the direction, the horizontal direction in which the substrate P processed by the component mounting device M is conveyed is the X-axis direction, the horizontal direction orthogonal to the X-axis direction is the Y-axis direction, and the vertical direction is Z. The XYZ Cartesian coordinate system in the axial direction will be used. Further, one of the Y-axis directions (the direction corresponding to the lower side of FIG. 1) is assumed to be the front.

With reference to FIG. 1, the component mounting device M has a base 1 having a substantially rectangular shape in a plan view extending long in the Y-axis direction, and a conveyor 2 extending along the width direction (X-axis direction) of the base 1. have. The transfer conveyor 2 is a device that conveys the substrate P along the X-axis direction (board transfer path PH).

Two mounting work positions S1 and S2 are set on the conveyor 2 at intervals in the transport direction in order to temporarily stop the substrate P and mount the bare chips C and electronic components. Corresponding to these mounting work positions S1 and S2, the conveyor 2 is embodied by a plurality of conveyor units 21 to 23. Each of the conveyor units 21 to 23 is divided on the substrate transport path PH corresponding to the two mounting work positions S1 and S2, and is divided between the conveyor unit 21 and the conveyor unit 22 and between the conveyor unit 22 and the conveyor unit 22. A board support device 100, which will be described in detail later, is connected to the 23. Each of the conveyor units 21 to 23 is provided with a motor 3 (only the conveyor unit 23 at the downstream end of the transport path PH is shown) and a sensor shown in the figure, and the conveyor units (21, 22) on the upstream side are provided. ), The substrate P is stopped at the substrate stop position at the corresponding mounting work position (S1, S2), and the processed substrate P is delivered to the conveyor units (22, 23) on the downstream side. Has a function. The motor 3 can drive the belt conveyor in both directions, and can convey the substrate P from right to left or left to right in FIG. In this embodiment, it is assumed that the substrate P is transported from left to right. The board support device 100 is handed over from the conveyor unit (21 or 22) on the upstream side and stops the board P at the board stop position of the corresponding mounting work position (S1 or S2), and the board stops. The substrate P is floated at a substrate processing position set above the position, and the substrate P is provided for component mounting work at the substrate processing position. After the mounting work of the substrate P, the substrate support device 100 has a function of returning the substrate P from the substrate processing position to the substrate stop position and delivering the processed substrate P to the conveyor units (22, 23) on the downstream side. Have. Details of the substrate support device 100 will be described later.

On the base 1, there are a wafer storage device 10 arranged in front of the transfer conveyor 2, a wafer support device 11 arranged behind the transfer conveyor 2 and receiving and supporting the wafer W from the wafer storage device 10. The component mounting unit 13 having a suction nozzle 14 that receives the bare chip C from the wafer head 12 of the wafer support device 11, the fixed camera 15 that images the bump forming surface of the bare chip C received by the suction nozzle 14, and the bare chip C after imaging. A flux application device 16 for applying flux to the bump forming surface and an electronic component supply device 17 for supplying electronic components to be mounted after mounting the bare chip C are provided.

The control of each of these parts is controlled by the control device 40. The control device 40 includes a CPU, various memories, an HDD, and the like. An input device (not shown) is electrically connected to the control device 40, and various information by the operator is input based on the operation of the input device. Further, an output signal from a position detecting means such as an encoder (not shown) built in various drive motors such as the motor 3 is also input to the control device 40. Further, various drive motors including the motor 3 of the conveyor 2, a fixed camera 15, and the like are electrically connected to the control device 40. Therefore, the control device 40 can comprehensively control the operation of each mechanism including the conveyor 2. The control device 40 is functionally provided with a setting unit 41 as a setting means, and the control device 40 is provided with the first mounting work position S1 and the second mounting work position S2 by the setting unit 41. It is configured to set the transport direction of the substrate P from one to the other. Specifically, the rotation direction of the motor 3 is alternately set clockwise or counterclockwise, the relationship between the upstream side and the downstream side of the related parts is changed in reverse, and the relationship in the front-rear direction becomes the same. Is set to.

When the bare chip C of the wafer W is mounted on the substrate P under the control of the control device 40, or when the supply component of the electronic component supply device 17 (see FIG. 1) is mounted, the component mounting device M is placed at each mounting work position S1. , A predetermined mounting operation (an example of processing) is executed on the board support device 100 installed in S2. Further detailed configurations of each mechanism described above are described in detail in, for example, the application previously proposed by the applicant (for example, Japanese Patent Application Laid-Open No. 2014-203916), and the details thereof will be omitted. ..

Further, the control device 40 also controls the board support device 100 in the bare chip C mounting operation and the electronic component mounting operation.

Next, the substrate support device 100 will be described. Since the board support device 100 installed at the first mounting work position S1 and the board support device 100 installed at the second mounting work position S2 are both devices having the same specifications, only one of them is used here. explain.

With reference to FIG. 2, the substrate support device 100 is a pair of a base plate 101 mounted on the base 1 and a base plate 101 erected on the base plate 101, facing each other in the Y-axis direction. A conveyor unit 102 forming a part of 2 and a conveyor 103 fixed inside the conveyor unit 102, a lock piece 104 arranged above the conveyor unit 102 and facing above the conveyor 103, and a conveyor unit 102. It is provided with a backup device 200 which is arranged between the two and faces the substrate P which is conveyed to the conveyor 103 from below.

The base plate 101 has a rectangular shape in a plan view that is long in the X-axis direction.

The conveyor unit 102 is composed of a pair of unit pieces 111 and 112 arranged vertically on both sides in the Y-axis direction, and constitutes a part of the conveyor 2 along the transport path PH.

The conveyor 103 is provided for each of the corresponding unit pieces 111 and 112, and is attached closer to the upper part on the inner wall side thereof. Each conveyor 103 is embodied by a pulley (not shown) or an endless belt that orbits the conveyor unit 102 in the X-axis direction by the pulley. These left and right conveyors 103 support the lower surface of the edge portion of the substrate P on both sides of the substrate P in the substrate width direction, and support the substrate P at the substrate stop position shown in FIG. 2 (see height H2 in FIGS. 3 and 4). It has the function of supporting a horizontal posture.

Each lock piece 104 provided on the conveyor unit 102 is attached above the corresponding conveyor unit 102, and a part thereof is projected toward the inner wall side of the conveyor unit 102 so that the lower surface thereof faces the upper surface of the conveyor 103. ing.

Next, the backup device 200 will be described.

The backup device 200 is installed on the base plate 101. Specifically, the backup device 200 includes an elevating device 201 fixed to the center of the base plate 101, an elevating shaft 202 that elevates from the upper surface of the elevating device 201, and a backup plate 203 provided above the elevating shaft 202. And a plurality of backup pins 204 erected on the upper surface of the backup plate 203.

The elevating device 201 includes a motor 210, an encoder 211 of the motor 210, and a power transmission mechanism (not shown) that converts the rotational force of the motor 210 into parallel motion in the Z-axis direction and transmits the rotational force to the elevating shaft 202. By driving the motor 210 in any of the driving directions, the elevating shaft 202 can be selectively raised and lowered.

The backup plate 203 is a plate-shaped structure having pin mounting holes arranged in a matrix on the upper surface, and moves up and down integrally with the elevating shaft 202.

The backup pin 204 is selectively planted in the pin mounting hole of the backup plate 203 and protrudes along the Z axis at the same height.

These backup plates 203 and backup pins 204 can be lifted and lowered between the initial height H0 facing the substrate P below the substrate stop position and the lock end height H4 for lifting the substrate to the substrate processing position. Consists of members.

With these configurations, the backup device 200 is set to have an initial height H0 facing from below at intervals with respect to the substrate P that stops at the substrate stop position set on the conveyor 2, and above the substrate stop position. It goes up and down with the lift height H4 that lifts the substrate P to the substrate processing position.

By the way, when a flexible substrate or a rigid flexible substrate is adopted as the substrate P, the substrate P is often warped downward and the intermediate portion is curved downward. Further, such a downward warp is more likely to occur after the bare chip C is mounted. In this embodiment, in order to prevent the substrate P and the bare chip C mounted on the substrate P from being adversely affected even in such a case, in this embodiment, the initial height H0 to the lock end height H4 are controlled. The separation height H1, the delivery height H2, and the lock start height H3 are set.

Next, with reference to FIG. 2, the initial height H0, the separation height H1, the delivery height H2, the lock start height H3, and the lock end height H4 will be described.

The initial height H0 is the height when the backup pin 204 is lowered to the lower limit, and is the height when the backup pin 204 is in the home position. When the backup pin 204 is at the initial height H0, the height H of each backup pin 204 faces the lower surface of the substrate P at a distance from below the substrate P at the substrate stop position, as shown in FIG. It is set to height.

The separation height H1 is the height from the initial height H0 to the height before contacting the lower surface of the substrate P in the process of extending the backup pin 204 in the Z-axis direction. The section in which the backup pin 204 moves between the initial height H0 and the separation height H1 is referred to as a separation section (H0-H1) in the following description.

The delivery height H2 is such that when the backup pin 204 is raised, the backup pin 204 is further raised from the separation height H1, so that the board P at the board stop position is a part of the conveyor unit 102. It refers to the height from above to when the backup pin 204 is lowered, and refers to the height at which the descending substrate P begins to sit on the upper surface of the conveyor unit 102. The section in which the backup pin 204 moves between the separation height H1 and the delivery height H2 is referred to as a delivery section (H1-H2) in the following description.

At the lock start height H3, when the backup pin 204 is raised, a part of the substrate P lifted from the delivery height H2 comes into contact with the lock piece 104, and the substrate P is between the lock piece 104 and the backup pin 204. This is the position where the pinching pressure is started, and is the position where the unlocking of the substrate P locked with the lock piece 104 is completed when the backup pin 204 is lowered. In the following description, the section in which the backup pin 204 moves between the delivery height H2 and the lock start height H3 is referred to as a lift section (H2-H3).

The lock end height H4 is a position where the substrate P lifted to the lock start height H3 is locked between the backup pin 204 and the lock piece 104 when the backup pin 204 is raised. At the time of descent, it is a position where the unlocking of the locked substrate P is started. In the following description, the section in which the backup pin 204 moves between the lock start height H3 and the lock end height H4 is referred to as a lock section (H3-H4).

It should be noted that which height H0 to H4 each backup pin 204 is located in can be detected based on the output of the encoder 211 of the motor 210 with respect to the initial height H0 and the delivery height H2. Further, the separation height H1 and the lock start height H3 can be calculated by having a parameter of "maximum warp amount of the substrate" in advance. The "maximum amount of warpage of the substrate" is a parameter derived based on statistical and experimental data that "a substrate P with such a warp may come" based on the processing results so far. The separation height H1 and the lock start height H3 are set based on the "maximum warpage amount of the substrate" parameter and the safety factor, and the motor 210 decelerates at the heights H1 and H3. Set. Further, since the amount of warpage and the mode of deformation of each substrate P are various, the position where the backup pin 204 is estimated to start contacting the substrate P based on the driving amount of the motor 201 and the safety against the position are estimated in advance. The rate may be set, and the motor 201 may be controlled so as to correspond to each section at a predetermined timing based on the set value.

Next, the control when the substrate P is moved up and down between the substrate stop position and the substrate processing position by the control of the control device 40 will be described.

With reference to FIGS. 3A to 3F, first, in the process of lifting the substrate P from the substrate stop position to the substrate processing position, the control device 40 starts ascending the backup pin 204 at the initial height H0. Then, it is moved to the separation height H1 while accelerating to the initial velocity V0. This initial velocity V0 is set to a relatively high speed side (10 mm / sec in the illustrated example). That is, in the separation section (H0-H1), the backup pin 204 is not in contact with the substrate P and does not affect the substrate P regardless of the moving speed. Therefore, the backup pin 204 is raised at a relatively high speed to shorten the travel time.

Next, the control device 40 decelerates immediately before the backup pin 204 arrives at the separation height H1, decelerates to a receiving speed V1 at a relatively low speed (2 mm / sec in the illustrated example), and then the backup pin 204. The backup pin 204 is brought into contact with the lower surface of the substrate P while maintaining the delivery speed until it passes through the delivery section (H1-H2). As a result, even when the substrate P is warped, the backup pin 204 slowly pushes up the lower surface of the substrate P without affecting the bare chips C and electronic components mounted on the substrate P. Start the lift.

Next, after the backup pin 204 has passed through the delivery section (H1-H2), the control device 40 reaches a medium speed (6 mm / sec in the illustrated example) that is faster than the receiving speed V1 and slower than the initial speed V0. The backup pin 204 is raised at the set lift speed V2. The lift speed V2 is appropriately set based on the number of points of the substrate P, the bare chip C mounted on the substrate P, the electronic components, and the like. It is not always necessary to set the lift speed V2 to a medium speed, but it is a preferable speed depending on the type of the substrate P.

That is, if it is only for avoiding the impact acting on the substrate P, it is preferable that the speed after the backup pin 204 lifts the substrate P is high. However, the higher the speed, the higher the inertia acting on the substrate and the components mounted on the substrate. Therefore, when the speed of transporting the substrate P is too fast with respect to the holding force of the bare chip C or the like. , There is a concern that the inertia acting on the bare chip C or the like adversely affects the mounting state on the substrate P. In particular, when the rigidity of the substrate is relatively small with respect to the total mass of the components mounted on the substrate, such inertia may adversely affect the substrate. On the other hand, if the substrate P is raised at a speed lower than the initial velocity V0 as in the present embodiment, it is possible to avoid an adverse effect due to inertia. On the other hand, since this medium speed is set faster than the receiving speed V1, it is possible to shorten the transport time after lifting the substrate P.

Next, the control device 40 decelerates immediately before the backup pin 204 arrives at the lift section (H2-H3), decelerates to a relatively low lock speed V3 again, and then the backup pin 204 has a lock end height H4. The backup pin 204 is raised in the lock section (H3-H4) until it reaches. As a result, even when the substrate P is warped, the backup pin 204 slowly pushes up the lower surface of the substrate P and lock pieces without affecting the bare chips C and electronic components mounted on the substrate P. The substrate P can be locked to the substrate processing position with the 104. The mounting operation described with reference to FIG. 2 is performed in a state where the substrate P is locked at the substrate processing position shown in FIG. 3 (E).

Next, referring to FIGS. 4A to 4F, in the process of lowering the substrate P from the substrate processing position to the substrate stop position and delivering it to the conveyor unit 102 as a part of the conveyor 2, the control device. 40 is a motor 210 until the backup pin 204 that lifts up the substrate P to the locked position reaches a descent speed V4 set to a predetermined medium speed (6 mm / sec, which is the same as the lift speed V2 in the illustrated example). Start the descent operation while increasing the rotation speed of. This makes it possible to lower the processed substrate P without applying an excessive inertia to the substrate P. The sections where the backup pin 204 descends at the descent speed V4 are the lock section (H3-H4) and the lift section (H2-H3) in the illustrated example, and in this embodiment, these sections are the initial descent period. ..

Next, the control device 40 suppresses the speed at which the backup pin 204 descends immediately before the lift section (H2-H3), and decelerates to a predetermined low speed (2 mm / sec, which is the same as the receiving speed V1 in the illustrated example). The delivery speed is lowered to V5, and the backup pin 204 is slowly lowered so that the substrate P starts to sit on the conveyor unit 102. As a result, the substrate P can deliver the substrate P to the conveyor 103 without adversely affecting the bare chip C and the like after mounting.

After the backup pin 204 is further lowered and completely separated from the lower surface of the substrate P, the control device 40 is set to a speed on the high speed side (10 mm / sec, which is the same as the initial speed V0 in the illustrated example). Lower with V6. In this separation section (H0-H1), the backup pin 204 is not in contact with the substrate P and does not affect the substrate P regardless of the moving speed. Therefore, the backup pin 204 is lowered at a relatively high speed to shorten the moving time.

In the above example, the initial speed V0 and the return speed V6 are set to the same high speed (10 mm / sec), and the receiving speed V1, the delivery speed V5, and the lock speed V3 are set to the same low speed (2 mm / sec). It is set, and the lift speed V2 and the descent speed V4 are set to the same medium speed (6 mm / sec), but these may be set individually according to the respective driving modes.

As described above, in the present embodiment, the supporting member (a unit composed of the backup plate 203, the supporting member 204, etc. is represented as a single component. Hereinafter, it is referred to as a “supporting member (203, 204)”. The backup device 200 including the) can be used to provide a control means for lifting the substrate P at the substrate stop position to the substrate processing position.

According to the same means, in the separation section (H0-H1) from the initial height H0 to before the supporting member (203, 204) comes into contact with the lower surface of the substrate P, the carrier member (203, 204) is supported at the initial velocity V0 set in advance on the high speed side. The speed of the member (203, 204) is increased to raise the substrate P, and the delivery section (H1) from the time when the supported member (203, 204) comes into contact with the substrate P until the substrate P is separated above the transfer conveyor 2. In −H2), the speed of the supporting member (203, 204) is lowered to the receiving speed V1 set in advance on the low speed side to raise the substrate P, and the supporting member (203, 204) sets the delivery section (H1-H2). The speed of the supporting member (203, 204) is set to the lift speed V2 set on the higher speed side than the receiving speed V1 in the section where the substrate P is raised beyond the section (at least in the lift section (H2-H3) in the illustrated example). It is possible to raise the substrate P by raising it.

Therefore, in the present embodiment, when the substrate P is lifted from the substrate stop position to the substrate processing position, the carrier member (203, 204) is not in contact with the substrate P, or the carrier member (203, 204) causes the substrate. In the state where P is supported, that is, in the section where the impact on the substrate P is unlikely to occur (in the illustrated example, the separation section (H0-H1) and the lift section (H2-H3)), the substrate P rises at high speed and at the same time. In the section where an impact can be applied to the substrate P (in the illustrated example, the delivery section (H1-H2) and the lock section (H3-H4)), the speed at which the supporting member (203, 204) rises is reduced and the substrate is slowly increased. Since P can be raised, the substrate P can be raised to the substrate processing position as quickly as possible while avoiding an impact on the substrate P.

In particular, the control device 40 according to the present embodiment has a medium speed that is slower than the initial speed V0 and faster than the receiving speed V1 in the section that rises beyond the delivery section (H1-H2), that is, the lift section (H2-H3). It is configured to control the backup device so as to raise the substrate P at the lift speed V2 set to. Therefore, in the present embodiment, the inertia acting on the substrate P when the supporting member (203, 204) raises the substrate P to the substrate processing position can be suppressed to be relatively small. That is, if it is only for avoiding an impact, it is preferable that the speed after the supporting member (203, 204) lifts the substrate P is high, but the higher the speed, the more the substrate P or the substrate P The inertia acting on the mounted components also increases. In particular, when the rigidity of the substrate P is relatively small with respect to the total mass of the components mounted on the substrate P, such inertia may adversely affect the substrate P. On the other hand, if the substrate P is raised at a speed lower than the initial velocity V0 as in the present embodiment, it is possible to avoid an adverse effect due to inertia. On the other hand, since this medium speed is set to be faster than the receiving speed V1, it is possible to shorten the transport time after lifting the substrate P.

Further, in the present embodiment, a lock that receives the upper edge of the substrate P, sandwiches the substrate P with the supporting members (203, 204), and locks the substrate P to the substrate processing position so as to position the substrate P at the substrate processing position. In the lock section (H3-H4) from the height at which the upper edge of the substrate P raised to the substrate processing position starts to abut on the lock piece 104 to the lift height H4, the piece 104 is further provided. The backup device is configured to control the substrate P so as to rise at the lock speed V3 set on the low speed side. Therefore, in the present embodiment, even in the case of the specification in which the substrate P is pressed by the lock piece 104, the impact when the substrate P comes into contact with the lock piece 104 is avoided, the adverse effect on the substrate P is suppressed, and the substrate P is suppressed at high speed. P can be raised from the substrate stop position to the substrate processing position.

Next, in the phase of lowering the substrate P from the substrate processing position to the substrate stop position, a means for lowering the substrate P at a relatively high speed while avoiding an impact acting on the substrate P as much as possible is configured.

In the same means, the initial descent section from when the supporting member (203, 204) at the lift height H4 starts to descend to before the substrate P supported by the supporting member (203, 204) lands on the conveyor 2. (In the present embodiment, in the lock section (H3-H4) and the lift section (H2-H3)), the speed of the supporting member (203, 204) is reduced to the descent speed on the high speed side to lower the substrate P. In the delivery section (H1-H2) from when the descending substrate P starts landing on the transfer conveyor 2 until the supporting member (203, 204) separates from the substrate P, the supporting member (supporting member (203, 204) is set to the delivery speed V5 on the low speed side. In the separation section (H0-H1) after the speed of 203, 204) is lowered to lower the supporting member (203, 204) and the descending substrate P finishes landing on the conveyor 2, the high speed side is used. The speed of the supporting members (203, 204) is increased to the return speed V6 to lower the supporting members (203, 204).

Therefore, in the present embodiment, when the substrate P is lowered from the substrate processing position to the substrate stop position, the section (lock section (H3-H4) and lift section (H2-H3)) in which the substrate P does not come into contact with the conveyor 2 In the section up to), the supporting members (203, 204) can be driven as fast as possible to shorten the processing time, and the substrate P lands on the conveyor 2 to land the supporting members (203, 204,). When the substrate P is delivered from 204) to the transfer conveyor 2, the speed can be reduced to avoid an impact on the substrate P. Therefore, even in these aspects, the substrate P can be raised to the substrate processing position as quickly as possible while avoiding the impact on the substrate P.

It goes without saying that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

2 Conveyor conveyor 40 Control device 100 Board support device 104 Lock piece 200 Backup device 203 Backup plate (example of elements of supporting member)
204 Backup pin (example of element of supporting member)
210 Motor 211 Encoder C Bare chip H0 Initial height H1 Separation height H2 Delivery height H3 Lock start height H4 Lock end height (H0-H1) Separation section (H1-H2) Delivery section (H2-H3) Lift section ( H3-H4) Lock section P Board PH Board transfer path S1 Mounting work position S2 Mounting work position V0 Initial speed (high-speed side speed)
V1 receiving speed (speed on the low speed side)
V2 lift speed (medium speed side speed)
V3 lock speed (speed on the low speed side)
V4 descent speed (speed on the medium speed side)
V5 delivery speed (speed on the low speed side)
V6 return speed (high speed side speed)
W wafer

Claims (2)

Using a backup device including a backup pin capable of raising and lowering the board between the board stop position set on the transfer path of the transfer conveyor for transporting the board and the board processing position set above the board stop position. In the control method of the backup device when the substrate in the substrate processing position is lowered to the substrate stop position and delivered to the transfer conveyor.
In the initial descent section from the start of descent of the backup pin carrying the substrate at the substrate processing position to the time when the substrate carried by the backup pin lands on the transfer conveyor, excessive inertia is applied to the substrate. The step of increasing the speed at which the backup pin descends to a descent speed set to a predetermined first speed that does not act, and the step of lowering the substrate.
In the delivery section from when the descending substrate starts to land on the conveyor until the backup pin separates from the substrate, the backup pin descends to a delivery speed set to a second speed lower than the first speed. Steps to slow down and lower the backup pin,
In the separation section after the descending substrate has landed on the conveyor, the backup pin is lowered to a return speed set to a third speed higher than the first speed. With steps to lower the
The excessive inertia is an inertia having a magnitude that adversely affects the mounting state of the components on the board as a result of the transfer speed of the board being too fast with respect to the holding force of the components mounted on the board. There,
The first speed is a control method for a backup device, wherein a speed that does not cause the excessive inertia with respect to the holding force is selected. A conveyor that transports the board along the transport path that transports the board,
A backup device including a backup pin capable of raising and lowering the substrate between the substrate stop position set on the conveyor and the substrate processing position set above the substrate stop position.
A control device that controls the backup device, and supports a substrate at the substrate processing position when the substrate at the substrate processing position is lowered to the substrate stop position and delivered to the transfer conveyor. In the initial descent section from the start of descent of the backup pin to the time when the substrate carried by the backup pin lands on the transport conveyor, a predetermined first speed is set so as not to apply excessive inertia to the substrate. In the delivery section from when the backup pin descends to the descending speed to lower the substrate and the descending substrate starts to land on the transport conveyor until the backup pin separates from the substrate, the first speed is used. In the separation section after the backup pin is lowered to the delivery speed set to the lower second speed to lower the backup pin and the descending substrate has landed on the transport conveyor. It is provided with the control device that controls the backup device so as to increase the speed at which the backup pin descends to a return speed set to a third speed higher than the first speed and lower the backup pin.
The excessive inertia is an inertia having a magnitude that adversely affects the mounting state of the components on the board as a result of the transfer speed of the board being too fast with respect to the holding force of the components mounted on the board. There,
The substrate processing apparatus is characterized in that the first speed is selected so as not to cause the excessive inertia with respect to the holding force.

Images