JP5074788B2 - Chip component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip component mounting device capable of easily varying the mounting load of a chip component on a substrate and also varying the mounting load of a plurality of suction nozzles. <P>SOLUTION: When the chip component B is mounted on a substrate P, a rotating drive motor 51 is driven to rotate a nut 56 in a bearing 55 through pulleys 52 and 53 and a timing belt 54 and lower a screw shaft 57. Then a drive current adjusted to generate a predetermined thrust is applied to a voice coil motor 31 corresponding to a suction nozzle 11 to be lowered to mount the chip component B and a spline shaft 32 moves with the thrust as the screw shaft 57 is lowered, so a pressing portion 35 lowers the spline shaft 13 through a lock piece 21 corresponding to the selected suction nozzle 11 against the biasing force of a coil spring 22, so that the chip component B held by the suction nozzle 11 is mounted on the substrate P while placing a predetermined mount load. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a chip component mounting apparatus for picking up a chip component from a component supply device by suction using a suction nozzle and mounting the chip component on a substrate.

This type of chip component mounting apparatus is disclosed in, for example, Patent Document 1 and the like. However, when it is desired to arbitrarily change the mounting load, it must be performed for each suction nozzle, and a chip having a large number of suction nozzles. There was no suitable component mounting device.
JP 2006-286707 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip component mounting apparatus that can easily change the mounting load of a chip component on a substrate and can also change the mounting load of a plurality of suction nozzles.

For this reason, the first invention is a chip component mounting apparatus for picking up and mounting a chip component from a component supply device by a plurality of suction nozzles and mounting the chip component on a substrate. And a mounting load variable mechanism for applying a mounting load to the substrate of the chip component against the biasing force of the biasing mechanism, and a suction nozzle through which the mounting load by the mounting load variable mechanism is applied A selection mechanism for selecting and a load application allowing mechanism for applying a mounting load by the mounting load variable mechanism when mounting the chip component on the substrate are provided.

The second invention is a chip component mounting apparatus for picking up and removing a chip component from a component supply device by a plurality of suction nozzles and mounting the chip component on a substrate. A mounting load variable mechanism for applying a mounting load to the substrate of the chip component against the biasing force of the biasing mechanism by the voice coil motor, and which suction nozzle to apply the mounting load by the mounting load variable mechanism And a load application permission mechanism for applying a mounting load by the mounting load variable mechanism when a chip component is mounted on a substrate.

According to a third aspect of the present invention, there is provided a chip component mounting apparatus in which a mounting head is provided with a plurality of suction nozzles, and a chip component is picked up from a component supply device by an arbitrary suction nozzle and mounted on a substrate. A biasing body disposed between the suction bodies above the suction nozzles and biasing the suction nozzles to be lifted, and a thrust obtained by the voice coil motor against the biasing force of the biasing bodies. A mounting load variable mechanism for applying a mounting load to the substrate of the chip component via the locking body, and a selection mechanism for switching and selecting which suction nozzle applies the mounting load by the mounting load variable mechanism And a load application allowance mechanism for releasing the support of the mounting load variable mechanism and applying a mounting load by the mounting load variable mechanism when the chip component is mounted on the substrate. It is characterized in.

  The present invention can provide a chip component mounting apparatus that can easily change the mounting load of a chip component on a substrate and can also change the mounting load of a plurality of suction nozzles.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of a chip component mounting device (die bonder) 1 for bonding a chip component such as a die to a substrate P or the like, and a component supply device is in front of a machine base (device body) 2 of the chip component mounting device 1. Die supply tables 3A, 3B, 3C, and 3D are provided on the left and right stages S1 and S2, respectively. On each of the die supply tables 3A, 3B, 3C, and 3D, a wafer affixed to a sheet is diced and fixed in a state of being divided into individual chip parts (die). It is taken out while being pushed up by a pin (not shown). The chip parts of the die supply tables 3A, 3B, 3C, and 3D of the left and right stages S1 and S2 are different in type such as thickness, material, and hardness, but may be the same.

  A substrate transfer device 4 extending in the left-right direction is provided at the intermediate portion of the mounting device 1. Further, an adhesive application unit 5 and an adhesive transfer unit 6 are provided on the upstream side. In each of the stages S1 and S2, each substrate P is positioned and a chip component is mounted, but the substrate mounted on the stage S1 is transported to the stage S2 and mounted on the stage S2.

  8A and 8B are a pair of beams that are long in the X direction, and can be moved in the Y direction along a pair of left and right guides by driving each Y-axis drive motor. Can be moved in the X direction by driving each X-axis drive motor. 10A and 10B are component recognition cameras, and the chip components sucked and held by the suction nozzles 11 in one of the two vertical rows provided on the mounting heads 9A and 9B are imaged while moving (fly view method). ).

  Each of the mounting heads 9A and 9B has a similar structure in which two suction nozzles 11 in total are provided in two rows on the left and right sides, and one mounting head 9A will be described with reference to FIGS. A spline shaft 13 that can be moved up and down by a bush 12 and rotates together with the bush 12 that rotates in the bearing 14 is provided on the suction nozzle 11. Reference numeral 20 denotes a rotary joint 20 connected to the spline shaft 13 so that the spline shaft 13 does not get entangled even when the spline shaft 13 rotates.

  As shown in FIG. 3, a timing belt is provided between each pulley 15 fixed to the upper portion of the bush 12 and rotated together with each bush 12 and a pulley 17 provided on the output shaft of the nozzle rotation drive motor 16. 18 is stretched. Accordingly, when the nozzle rotation drive motor 16 is driven, the bushes 12, the spline shafts 13, and the suction nozzles 11 are rotated via the pulleys 15, the pulleys 17, and the timing belts 18. That is, when the nozzle rotation drive motor 16 is driven, a total of two suction nozzles 11 in each of the left and right rows rotate.

  A coil spring 22 is wound around the spline shaft 13 between the pulley 15 on the head main body 9H side and the locking piece 21 fixed to the top of the spline shaft 13, and the locking piece 21 and the pulley 15 and the suction nozzle 11 is lifted and biased.

  Reference numeral 30 denotes a load variable mechanism, which will be described in detail below. Reference numeral 31 denotes a voice coil motor capable of adjusting the magnitude of the thrust by adjusting the magnitude of the drive current, and the output shaft of the voice coil motor 31 that moves up and down and rotates is a spline shaft 32. The spline shaft 32 can be moved up and down by a bush 33 and is rotated together with the bush 33 rotating in the bearing 34. Further, a switching body 37 having a pressing portion 35 and a supported portion 36 that press the locking piece 21 corresponding to each suction nozzle 11 from above is fixed to the lower end of the spline shaft 32.

  That is, a pulley 38 fixed to the upper portion of the bush 33 and rotating together with the bush 33, and a pulley 40 provided on an output shaft of a rotary drive motor 39 for switching and selecting which suction nozzle 11 is to be applied with a load. A timing belt 41 is stretched between them, and when the rotary drive motor 39 is driven, the bush 33 and the spline shaft 32 are rotated via the pulleys 40 and 38 and the timing belt 41, and the switching body 37 is moved. It is made to rotate and is locked to the locking piece 21 corresponding to the suction nozzle 11 to be used from above so that it can be pressed.

  Reference numeral 50 denotes an elevating mechanism that raises and lowers the suction nozzle 11 so that the mounting load by the mounting load variable mechanism 30 is applied when the chip component is mounted on the substrate P, and the chip component B is mounted on the substrate P. In this case, it is a load application permission mechanism that applies a mounting load by the load variable mechanism 30, and the screw shaft 57 including the support portion 58 that contacts the supported portion 36 is moved up and down by the rotation of the nut 56, A timing belt 54 is stretched between a pulley 53 fixed on the nut 56 and rotated together with the nut 56 and a pulley 52 provided on the output shaft of the rotary drive motor 51.

  Therefore, when the rotation drive motor 51 is driven, the nut 56 rotates in the bearing 55 via the pulleys 52 and 53 and the timing belt 54, so that the screw shaft 57 moves up and down without rotating. The screw shaft 57 includes a rotation stopping mechanism (not shown).

  With the above configuration, the operation will be described. As shown in FIG. 3, the suction nozzle 11 to be used is the front (FIG. 3) of the suction nozzles 11 in the left two rows of the mounting head 9A. In the following description, it is assumed that the switching body 37 has been switched so that the lower suction nozzle 11 is used.

  First, with the adhesive application unit 5 or the adhesive transfer unit 6, the adhesive is applied to each substrate P, and the substrate is transferred by the substrate transfer device 4 and positioned on the left stage S <b> 1. Then, the beam 8A and the mounting head 9A are moved, and the chip component B to be mounted by the frontmost suction nozzle 11 is sucked and taken out from the back die supply table 3A.

  In this case, the rotation drive motor 51 is driven, the nut 56 is rotated via the pulleys 52 and 53 and the timing belt 54, and the screw shaft 57 is lowered. At the same time, the voice coil motor 31 is driven to lower the suction nozzle 11 for suction of the chip parts, and the spline shaft 32 is lowered as the screw shaft 57 is lowered by a predetermined thrust. The spline shaft 13 is lowered through the locking piece 21 against the urging force, and the chip part B is sucked and taken out from the back die supply table 3A.

  After the suction, the voice coil motor 31 is continuously driven and the rotational drive motor 51 is rotated in the reverse direction, and the nut 56 is rotated in the bearing 55 via the pulleys 52 and 53 and the timing belt 54, and the screw shaft. Raise 57. Then, as the screw shaft 57 is lifted, the spline shaft 32 is lifted together with the urging force of the coil spring 22, so that the spline shaft 13 and the suction nozzle 11 on the near side are lifted (see FIG. 2). The voice coil motor 31 may be de-energized at this ascending limit position.

  Then, the rotation drive motor 39 is driven, the bush 33 and the spline shaft 32 are rotated via the pulleys 40 and 38 and the timing belt 41, the switching body 37 is rotated, and the back suction to be used next. The locking piece 21 corresponding to the nozzle 11 is locked from above and can be pressed.

  Accordingly, the beam 8A and the mounting head 9A are moved, and the chip component B to be mounted by the back suction nozzle 11 is suctioned and taken out from the back die supply table 3A. In this case, as described above, the rotary drive motor 51 is driven, the nut 56 is rotated to lower the screw shaft 57, and at the same time, the voice coil motor 31 is driven to lower the suction nozzle 11 for suction of the chip components. The spline shaft 32 is lowered as the screw shaft 57 is lowered by a predetermined thrust, and the pressing portion 35 lowers the spline shaft 13 via the locking piece 21 against the urging force of the coil spring 22. Part B is adsorbed and taken out.

  After this suction, the drive of the voice coil motor 31 is continued and the rotational drive motor 51 is reversed, the nut 56 is rotated and the screw shaft 57 is raised, coupled with the urging force of the coil spring 22. Since the spline shaft 32 rises, the spline shaft 13 and the suction nozzle 11 at the back are raised (see FIG. 2). The voice coil motor 31 may be de-energized at this ascending limit position.

  After the removal, each beam 8A and mounting head 9A are moved, and each chip component B sucked and held by both suction nozzles 11 is imaged while passing over the component recognition camera 10A. Each suction nozzle 11 is rotated by each nozzle rotation drive motor 16 in advance so that the mounting angle is set when the chip component B is mounted on the substrate P in advance. Then, a recognition processing device (not shown) performs recognition processing on the captured image, and based on the result, the component recognition result is added to the mounting coordinates of the mounting data to correct the misalignment, and the beam 8A is corrected in the Y direction. Further, the mounting head 9A is moved in the X direction and the suction nozzle 11 is rotated by the nozzle rotation drive motor 16 to mount the chip components B on the respective substrates P.

  In this case, since each suction nozzle 11 has been rotated by each nozzle rotation drive motor 16 so as to have a mounting angle in advance before this imaging, the correction amount is very small. It is possible to minimize the influence of the lead. In addition, as shown in FIG. 3, the suction nozzles 11 are rotated by a total of two nozzles in each of the left and right rows by each nozzle rotation drive motor 16, but each suction nozzle 11 in the right row is a chip. Since the component B is not sucked and held, there is no influence even if it rotates.

  At the time of mounting, as described above, the switching body 37 can be pressed by being locked to the locking piece 21 corresponding to the back suction nozzle 11 from above, so that it is sucked and held by the back suction nozzle 11. First, the chip part B is mounted. That is, the rotary drive motor 51 is driven, the nut 56 is rotated via the pulleys 52 and 53 and the timing belt 54 to lower the screw shaft 57, and the voice coil motor 31 corresponds to the back suction nozzle 11. The spline shaft 32 is lowered as the screw shaft 57 is lowered by applying a drive current adjusted to have a predetermined thrust, and the pressing portion 35 resists the biasing force of the coil spring 22. The spline shaft 13 is lowered through the locking piece 21 corresponding to the selected suction nozzle 11, and the chip component B sucked and held by the suction nozzle 11 is mounted on the substrate P with a predetermined mounting load.

  In other words, when the suction nozzle 11 is lowered, the chip component B comes into contact with the substrate P, and when the screw shaft 57 is further lowered, the mounting load variable mechanism 30 is applied to the substrate P of the chip component B against the urging force of the coil spring 22. A predetermined mounting load is applied. The lowering operation of the suction nozzle 11 is controlled by the elevating mechanism 50 and is decelerated so that the impact of the contact is reduced immediately before the chip component B hits the substrate P.

  The mounting load is a value obtained by subtracting the urging force of the coil spring 22 from the load (thrust) by the voice coil motor 31 and can be changed according to the type of the chip component B, for example. This control can be performed by the microcomputer CPU according to the data relating to the mounting load stored in the RAM.

  Next, the drive of the voice coil motor 31 is continued and the rotational drive motor 51 is reversed to raise the screw shaft 57 and, together with the urging force of the coil spring 22, raise the spline shaft 32. And the suction nozzle 11 in the back is raised. The voice coil motor 31 may be de-energized at this ascending limit position.

  Then, in order to select whether to apply the mounting load through the suction nozzle 11 in front, the rotation drive motor 39 is driven, the bush 33 and the spline shaft 32 are rotated, the switching body 37 is rotated, and the front is used. The locking piece 21 corresponding to the suction nozzle 11 is locked from above and can be pressed. Then, as described above, the rotation drive motor 51 is driven to lower the screw shaft 57, and the voice coil motor 31 is supplied with a drive current adjusted to have a predetermined thrust corresponding to the suction nozzle 11 at the back. Since the spline shaft 32 is lowered as the screw shaft 57 is lowered by applying a predetermined thrust force, the pressing piece 35 is a locking piece 21 corresponding to the suction nozzle 11 selected against the urging force of the coil spring 22. Then, the spline shaft 13 is lowered, and the chip component B sucked and held by the suction nozzle 11 is mounted on the substrate P under a predetermined mounting load.

  Next, using the suction nozzles 11 in the two vertical rows provided on the mounting head 9A, the chip component B is sucked and taken out from the front die supply table 3B and mounted on the substrate P. When sucking and mounting the chip component B, the rotation drive motor 39 is driven to rotate and select the switching body 37 so as to select whether the mounting load is applied through the front or back suction nozzle 11. The locking piece 21 corresponding to the suction nozzle 11 to be used is locked from above and can be pressed. The mounting load is performed by controlling the drive current of the voice coil motor 31 of the mounting load variable mechanism 30.

  Then, after the chip component B is mounted on the substrate P in the left stage S1, the substrate P is transferred to the stage S2, and the chip component B is mounted as described above, and after all the chip components B are mounted. Transport to downstream equipment.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of a chip component mounting apparatus. It is a front view in which a chip part mounting device in the state where a chip part was taken out is partially broken. It is a schematic plan view of the principal part of a chip component mounting apparatus. FIG. 3 is a front view of the chip component mounting apparatus in a state in which the chip component is mounted on a substrate, in which the chip component is partially broken.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip component mounting apparatus 3 Die supply table 8A, 8B Beam 9A, 9B Mounting head 11 Suction nozzle 13 Spline shaft 21 Locking piece 22 Coil sling 30 Load variable mechanism 31 Boil coil motor 32 Spline shaft 33 Bush 35 Press part 36 Supported Part 37 switching body 39 rotation drive motor 50 lifting mechanism 51 rotation drive motor 57 screw shaft 58 bearing part P printed circuit board

Claims (3)

  In a chip component mounting apparatus for picking up chip components from a component supply device by a plurality of suction nozzles and mounting them on a substrate, an urging mechanism for urging each suction nozzle to be lifted, and an urging mechanism A mounting load variable mechanism for applying a mounting load to the substrate of the chip component against the force, a selection mechanism for selecting and selecting which suction nozzle the mounting load by the mounting load variable mechanism is applied to, and the substrate A chip component mounting apparatus, comprising: a load application permission mechanism that applies a mounting load by the mounting load variable mechanism when mounting the chip component.   In a chip component mounting device that picks up and picks up a chip component from a component supply device using a plurality of suction nozzles and mounts the chip component on a substrate, the urging mechanism that urges each suction nozzle to lift and a voice coil motor A mounting load variable mechanism for applying a mounting load to the substrate of the chip component against the biasing force of the biasing mechanism, and a selection mechanism for switching and selecting through which suction nozzle the mounting load by the mounting load variable mechanism is applied And a load application allowing mechanism for applying a mounting load by the mounting load variable mechanism when the chip component is mounted on the substrate.   The mounting head includes a plurality of suction nozzles, and a chip component is picked up by an arbitrary suction nozzle from a component supply device, and mounted on a substrate. An urging body disposed between the urging body and energizing the suction nozzles so as to lift up; and a thrust plate obtained by a voice coil motor against the urging force of the urging body. A mounting load variable mechanism for applying a mounting load to the mounting body via the locking body, a selection mechanism for switching and selecting which suction nozzle applies the mounting load by the mounting load variable mechanism, and A load application permission mechanism is provided to disengage the support of the mounting load variable mechanism and to apply a mounting load by the mounting load variable mechanism when the chip component is mounted. That chip component mounting apparatus.

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