JP4846704B2 - Chip component mounting device - Google Patents

Description

  The present invention relates to a chip component mounting apparatus for picking up a chip component from a component supply device by suction using a suction nozzle and mounting the chip component on a substrate.

This type of chip component mounting apparatus is disclosed in, for example, Patent Document 1 and the like. However, when it is desired to arbitrarily change the mounting load, it must be performed for each suction nozzle, and a chip having a large number of suction nozzles. There was no suitable component mounting device.
JP 2006-286707 A

  Therefore, according to the present invention, the mounting load of the chip component on the substrate can be easily changed, and when a mechanism for selectively switching the suction nozzles to which the mounting load is applied among a plurality of suction nozzles is provided, the switching response is provided. It is an object of the present invention to provide a chip component mounting apparatus that can improve the size and can be made compact.

For this reason, the first aspect of the present invention provides a chip component mounting apparatus in which a chip component is picked up by a plurality of suction nozzles from a component supply device and mounted on the substrate. A mounting load variable mechanism for applying a mounting load to the head, a selection mechanism for switching and selecting through which suction nozzle the mounting load by the mounting load variable mechanism is applied, and a support member for supporting the mounting load variable mechanism. A load application permission mechanism that allows a load applied to the chip component by the mounting load variable mechanism when the support member is lowered when the chip component is mounted on the substrate. The motor is configured by a coil motor, and the motor for driving the selection mechanism is provided in a vertical relationship with the voice coil motor and the rotation shaft in common. It is characterized by that.

  According to a second aspect of the present invention, there is provided a chip component mounting apparatus in which a chip component is picked up from a component supply device by a plurality of suction nozzles and mounted on the substrate, and the mounting load for applying a mounting load on the substrate of the chip component is variable. A mechanism for selecting and switching through which suction nozzle the load applied by the mounting load variable mechanism is applied, and a support member for supporting the mounting load variable mechanism, and mounting the chip component on the substrate And a load application permission mechanism that allows the mounting load variable mechanism to apply a load to the chip component when the support member descends, and the mounting load variable mechanism has a rotating shaft that freely passes through the center of the rotor. The rotating mechanism is constituted by a voice coil motor that applies a load to the rotating shaft, and the selection mechanism is provided in a vertical relationship with the voice coil motor. A rotary motor that rotates through the center of the rotor so that the rotary shaft can be driven to rotate, and a rotary arm that is connected to the rotary shaft and is rotated by the rotary motor to select the suction nozzle. It is characterized by.

  According to a third aspect of the present invention, in the chip component mounting apparatus according to the first or second aspect, the voice coil motor and the rotary motor are integrated.

  According to the present invention, the mounting load of the chip component on the substrate can be easily changed, and the responsiveness of switching by the selection mechanism that switches the suction load to which the mounting load is applied among the plurality of suction nozzles is improved. It is also possible to reduce the size.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of a chip component mounting device (die bonder) 1 for bonding a chip component such as a die to a substrate P or the like, and a component supply device is in front of a machine base (device body) 2 of the chip component mounting device 1. Die supply tables 3A, 3B, 3C, and 3D are provided on the left and right stages S1 and S2, respectively. On each of the die supply tables 3A, 3B, 3C, and 3D, a wafer affixed to a sheet is diced and fixed in a state of being divided into individual chip parts (die). It is taken out while being pushed up by a pin (not shown). The chip parts of the die supply tables 3A, 3B, 3C, and 3D of the left and right stages S1 and S2 are different in type such as thickness, material, and hardness, but may be the same.

  A substrate transfer device 4 extending in the left-right direction is provided at the intermediate portion of the mounting device 1. Further, an adhesive application unit 5 and an adhesive transfer unit 6 are provided on the upstream side. In each of the stages S1 and S2, each substrate P is positioned and a chip component is mounted, but the substrate mounted on the stage S1 is transported to the stage S2 and mounted on the stage S2.

  8A and 8B are a pair of beams that are long in the X direction, and can be moved in the Y direction along a pair of left and right guides by driving each Y-axis drive motor. The mounting heads 9A and 9B are moved along the beams 8A and 8B. Can be moved in the X direction by driving each X-axis drive motor. 10A and 10B are component recognition cameras, and the chip components sucked and held by the suction nozzles 11 in one of the two vertical rows provided on the mounting heads 9A and 9B are imaged while moving (fly view method). ). The movement of the chip component may be temporarily stopped, and the chip component may be imaged by the component recognition cameras 10A and 10B.

  Each of the mounting heads 9A and 9B has a similar structure in which two suction nozzles 11 in total are provided in two rows on the left and right sides, and one mounting head 9A will be described with reference to FIGS.

  A spline shaft 13 that can move up and down through the center of the bush 12 and rotates with the bush 12 that rotates within the bearing 14 is provided at the upper portion of the suction nozzle 11. Reference numeral 20 denotes a rotary joint 20 connected to the spline shaft 13 so that the spline shaft 13 does not get entangled even when the spline shaft 13 rotates.

  As shown in FIG. 3, a timing belt is provided between each pulley 15 fixed to the upper portion of the bush 12 and rotated together with each bush 12 and a pulley 17 provided on the output shaft of the nozzle rotation drive motor 16. 18 is stretched. Accordingly, when the nozzle rotation drive motor 16 is driven, the bushes 12, the spline shafts 13, and the suction nozzles 11 are rotated via the pulleys 15, the pulleys 17, and the timing belts 18. That is, when the nozzle rotation drive motor 16 is driven, a total of two suction nozzles 11 in each of the left and right rows rotate.

  A coil spring 22 is wound around the spline shaft 13 between the pulley 15 on the head main body 9H side and the locking piece 21 fixed to the top of the spline shaft 13, and the locking piece 21 is wound around the spline shaft 13. The pulley 15 is biased so as to be separated from each other, and the suction nozzle 11 is lifted and biased.

  Reference numeral 30 denotes a load variable mechanism, which will be described in detail below. Reference numeral 31 denotes a voice coil motor capable of adjusting the magnitude of the thrust by adjusting the magnitude of the drive current. The voice coil motor 31 moves up and down through the center of the rotor 32 and splines the output shaft of the rotatable voice coil motor 31. A shaft (rotating shaft) 33 is used. Reference numeral 34 denotes a coil of the voice coil motor 31.

  Reference numeral 35 denotes a selection mechanism. The selection mechanism 35 is provided integrally with the voice coil motor 31 below the voice coil motor 31, and a pulse motor 36 which is a rotary motor in which the lower part of the spline shaft 33 penetrates the center thereof. A switching body 41 is provided. The spline shaft 33 can be moved up and down by a bush 37 and rotates together with the rotor 38 and the bush 37 that rotate in the bearing 40. Further, a switching body 41 for switching and selecting each suction nozzle 11 is provided at the lower end of the spline shaft 33. The switching body 41 is provided with an arm 42 fixed to the lower end of the spline shaft 33, and provided at the tip of the arm 42. A pressing portion 43 that presses the locking piece 21 corresponding to the suction nozzle 11 from above and a supported portion 44 provided on the lower surface of the arm 42 so as to face the lower end of the spline shaft 33 are provided.

  That is, when the pulse motor 36 is driven and the rotor 38 is rotated, the bush 38 and the spline shaft 33 are rotated, and the arm 42 of the switching body 41 is rotated so that the locking piece 21 corresponding to the suction nozzle 11 to be used is moved. The pressing portion 43 is temporarily fixed from above to enable pressing.

  As described above, since the pulse motor 36 of the selection mechanism 35 is provided below the voice coil motor 31 of the load variable mechanism 30 and each motor is arranged vertically, the horizontal dimensions of the heads 9A and 9B are set as much as possible. The heads 9A and 9B can be made compact. Further, since the voice coil motor 31 and the pulse motor 36 are integrated, the vertical dimension as well as the horizontal direction can be made as small as possible, and the heads 9A and 9B can be made more compact.

  Further, a pulse motor 36 that is a drive source of the selection mechanism 35 is provided, for example, in the lateral direction of the voice coil motor 31, and a rotational force of the pulse motor 36 is provided on the rotary shaft, a pulley provided on the spline shaft 33, and Compared to a configuration in which transmission is made to the spline shaft 33 via a timing belt passed between the pulleys, the number of parts can be greatly reduced. Furthermore, in the case of such a configuration, it is necessary to provide a bearing between the spline shaft and the head main body 9 so as to allow the rotation of the spline shaft 33, but it is not necessary to provide such a bearing. It is also possible to simplify.

  Reference numeral 50 denotes an elevating mechanism that raises and lowers the suction nozzle 11 so that a mounting load is applied by the mounting load variable mechanism 30 when the chip component is mounted on the substrate P. In this case, it is a load application permission mechanism that applies a mounting load by the load variable mechanism 30, and the screw shaft 57 as a support member provided with a support portion 58 that contacts the supported portion 44 at the upper end is rotated by the rotation of the nut 56. A timing belt 54 is stretched between a pulley 53 that moves up and down and is fixed to the top of the nut 56 and rotates together with the nut 56 and a pulley 52 provided on the output shaft of the rotary drive motor 51.

  Therefore, when the rotation drive motor 51 is driven, the nut 56 rotates in the bearing 55 via the pulleys 52 and 53 and the timing belt 54, so that the screw shaft 57 moves up and down without rotating. The screw shaft 57 includes a rotation stopping mechanism (not shown).

  With the above configuration, the operation will be described. As shown in FIG. 3, the suction nozzle 11 to be used is the front (FIG. 3) of the suction nozzles 11 in the left two rows of the mounting head 9A. In the following description, it is assumed that the switching body 41 is switched so that the lower suction nozzle 11 is used.

  First, with the adhesive application unit 5 or the adhesive transfer unit 6, the adhesive is applied to each substrate P, and the substrate is transferred by the substrate transfer device 4 and positioned on the left stage S <b> 1. Then, the beam 8A and the mounting head 9A are moved, and the chip component B to be mounted by the frontmost suction nozzle 11 is sucked and taken out from the back die supply table 3A.

  In this case, the rotation drive motor 51 is driven, the nut 56 is rotated via the pulleys 52 and 53 and the timing belt 54, and the screw shaft 57 is lowered. At the same time, the voice coil motor 31 is driven to lower the suction nozzle 11 for suction of chip parts, and the spline shaft 33 is lowered as the screw shaft 57 is lowered by a predetermined thrust. The spline shaft 13 is lowered through the locking piece 21 against the urging force, and the chip part B is sucked and taken out from the back die supply table 3A.

  After the suction, the voice coil motor 31 is continuously driven and the rotational drive motor 51 is rotated in the reverse direction, and the nut 56 is rotated in the bearing 55 via the pulleys 52 and 53 and the timing belt 54, and the screw shaft. Raise 57. Then, as the screw shaft 57 rises, the spline shaft 32 rises in combination with the urging force of the coil spring 22, so that the spline shaft 13 and the suction nozzle 11 in front are raised. The voice coil motor 31 may be de-energized at this ascending limit position.

  Then, the pulse motor 36 is driven to rotate the spline shaft 33 via the bush 37 to rotate the switching body 41, and the upper side of the locking piece 21 corresponding to the back suction nozzle 11 to be used next. It is possible to press it by locking it.

  Accordingly, the beam 8A and the mounting head 9A are moved, and the chip component B to be mounted by the back suction nozzle 11 is suctioned and taken out from the back die supply table 3A. In this case, as described above, the rotary drive motor 51 is driven, the nut 56 is rotated to lower the screw shaft 57, and at the same time, the voice coil motor 31 is driven to lower the suction nozzle 11 for suction of the chip components. Then, the spline shaft 33 is lowered as the screw shaft 57 is lowered by a predetermined thrust, and the pressing portion 43 moves the spline shaft 13 down via the locking piece 21 against the urging force of the coil spring 22. Part B is adsorbed and taken out.

  After this suction, the drive of the voice coil motor 31 is continued and the rotational drive motor 51 is reversed, the nut 56 is rotated and the screw shaft 57 is raised, coupled with the urging force of the coil spring 22. Since the spline shaft 32 rises, the spline shaft 13 and the suction nozzle 11 at the back are raised. The voice coil motor 31 may be de-energized at this ascending limit position.

  After the removal, each beam 8A and mounting head 9A are moved, and each chip component B sucked and held by both suction nozzles 11 is imaged while passing over the component recognition camera 10A. Each suction nozzle 11 is rotated by each nozzle rotation drive motor 16 in advance so that the mounting angle is set when the chip component B is mounted on the substrate P in advance. Then, a recognition processing device (not shown) performs recognition processing on the captured image, and based on the result, the component recognition result is added to the mounting coordinates of the mounting data to correct the misalignment, and the beam 8A is corrected in the Y direction. Then, the mounting head 9A is moved in the X direction and the suction nozzle 11 is rotated by the nozzle rotation drive motor 16 to mount the chip component B on each substrate P (see FIG. 2).

  In this case, since each suction nozzle 11 has been rotated by each nozzle rotation drive motor 16 so as to have a mounting angle in advance before this imaging, the correction amount is very small. It is possible to minimize the influence of the lead. In addition, as shown in FIG. 3, the suction nozzles 11 are rotated by a total of two nozzles in each of the left and right rows by each nozzle rotation drive motor 16, but each suction nozzle 11 in the right row is a chip. Since the component B is not sucked and held, there is no influence even if it rotates.

  At the time of mounting, as described above, the switching body 41 can be pressed and locked to the locking piece 21 corresponding to the back suction nozzle 11 from above, so that it is sucked and held by the back suction nozzle 11. First, the chip part B is mounted. That is, a control device (not shown) operates to drive the rotation drive motor 51, rotate the nut 56 via the pulleys 52, 53 and the timing belt 54, and set the screw shaft 57 in advance in a storage means (not shown). The suction shaft is lowered by the stroke of the suction nozzle, and a drive current adjusted so as to have a predetermined thrust corresponding to the suction nozzle 11 in the back is applied to the voice coil motor 31 and the screw shaft 57 is lowered by the predetermined thrust. Accordingly, the spline shaft 33 is lowered. As a result, the pressing portion 43 lowers the spline shaft 13 by the stroke described above via the locking piece 21 corresponding to the suction nozzle 11 selected against the biasing force of the coil spring 22, and the suction nozzle is placed on the substrate P. The chip component B adsorbed and held on 11 is mounted under a predetermined mounting load (see FIG. 2).

  That is, when the suction nozzle 11 is lowered as the screw shaft 57 is lowered, the chip component B comes into contact with the substrate P, and when the screw shaft 57 is further lowered, the support portion 58 at the upper end of the screw shaft 57 and the supported portion 40 are separated from each other. Then, a predetermined mounting load on the substrate P of the chip component B is applied by the mounting load variable mechanism 30 against the urging force of the coil spring 22. The lowering operation of the suction nozzle 11 is controlled by the elevating mechanism 50 and is decelerated so that the impact of the contact is reduced immediately before the chip component B hits the substrate P.

  The mounting load is a value obtained by subtracting the urging force of the coil spring 22 from the load (thrust) by the voice coil motor 31 and can be changed according to the type of the chip component B, for example. This control is performed by a microcomputer CPU (not shown) according to data relating to the mounting load stored in the RAM.

  Next, the drive of the voice coil motor 31 is continued and the rotational drive motor 51 is reversely rotated to raise the screw shaft 57 and to raise the spline shaft 33 in combination with the urging force of the coil spring 22. And the suction nozzle 11 in the back is raised. The voice coil motor 31 may be de-energized at this ascending limit position.

  Then, in order to switch and select whether the mounting load is applied to the electronic component via the suction nozzle 11 on the front side, the pulse motor 36 is driven, the bush 37 and the spline shaft 33 are rotated, the switching body 41 is rotated, The pressing portion 43 is locked to the locking piece 21 corresponding to the suction nozzle 11 on the near side to be used from above and can be pressed. Then, as described above, the rotation drive motor 51 is driven to lower the screw shaft 57, and the voice coil motor 31 is supplied with a drive current adjusted to have a predetermined thrust corresponding to the suction nozzle 11 at the back. Since the spline shaft 33 is lowered as the screw shaft 57 is lowered by applying a predetermined thrust, the pressing portion 43 pushes the locking piece 21 corresponding to the suction nozzle 11 selected against the urging force of the coil spring 22. Then, the spline shaft 13 is lowered, and the chip component B sucked and held by the suction nozzle 11 is mounted on the substrate P under a predetermined mounting load.

  Next, using the suction nozzles 11 in the two vertical rows provided on the mounting head 9A, the chip component B is sucked and taken out from the front die supply table 3B and mounted on the substrate P. In the suction and mounting of the chip part B, the pulse motor 36 is driven to rotate the spline shaft 33 in order to switch and select whether the mounting load is applied through the front or back suction nozzle 11. The switching body 41 is rotated so that it can be pressed by being locked to the locking piece 21 corresponding to the suction nozzle 11 to be used from above. The mounting load is performed by controlling the drive current of the voice coil motor 31 of the mounting load variable mechanism 30.

  As described above, when the suction nozzle 11 is switched and selected, the pulse motor 36 integrated with the voice coil motor 31 can be driven to rotate the spline shaft 33 directly, and the spline can be rotated via a pulley, a timing belt, or the like. The inertia load of the selection mechanism 35 can be reduced as compared with the mechanism for rotating the shaft, and as a result, the responsiveness can be improved.

  Then, after the chip component B is mounted on the substrate P in the left stage S1, the substrate P is transferred to the stage S2, and the chip component B is mounted as described above, and after all the chip components B are mounted. Transport to downstream equipment.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of a chip component mounting apparatus. It is a front view in which a chip part mounting device in the state where a chip part was taken out is partially broken. It is a schematic plan view of the principal part of a chip component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip component mounting apparatus 3 Die supply table 8A, 8B Beam 9A, 9B Mounting head 11 Adsorption nozzle 13 Spline shaft 21 Locking piece 22 Coil sling 30 Load variable mechanism 31 Boil coil motor 33 Spline shaft 35 Selection mechanism 36 Pulse motor 41 Switching Body 50 Elevating mechanism 51 Rotation drive motor 57 Screw member (support member)
P Printed circuit board

Claims (3)

In a chip component mounting device that picks up a chip component from a component supply device by using a plurality of suction nozzles and mounts the chip component on a substrate, a mounting load variable mechanism for applying a mounting load to the substrate of the chip component, and the mounting load A selection mechanism for switching and selecting which suction nozzle is used to apply the mounting load by the variable mechanism; and a support member for supporting the mounting load variable mechanism, and the support member when the chip component is mounted on the substrate A load application permission mechanism that allows the chip component to be loaded by the mounting load variable mechanism by lowering
A chip component mounting apparatus, wherein the mounting load variable mechanism is constituted by a voice coil motor, and a motor for driving the selection mechanism is provided in a vertical relationship with the voice coil motor and a rotation shaft in common. In a chip component mounting device that picks up a chip component from a component supply device by using a plurality of suction nozzles and mounts the chip component on a substrate, a mounting load variable mechanism for applying a mounting load to the substrate of the chip component, and the mounting load A selection mechanism for switching and selecting which suction nozzle is used to apply the mounting load by the variable mechanism; and a support member for supporting the mounting load variable mechanism, and the support member when the chip component is mounted on the substrate A load application permission mechanism that allows the chip component to be loaded by the mounting load variable mechanism by lowering
The mounting load variable mechanism is configured by a voice coil motor that rotatably penetrates the center of the rotor and applies a load to the rotation shaft, and the selection mechanism is provided in a vertical relationship with the voice coil motor, A rotary motor that rotates through the center of the rotor so that the rotary shaft can be driven to rotate, and a rotary arm that is connected to the rotary shaft and is rotated by the rotary motor to select the suction nozzle. A chip component mounting apparatus characterized by the above.   3. The chip component mounting apparatus according to claim 1, wherein the voice coil motor and the rotary motor are integrated.