KR100598459B1 - Chip bonding apparatus - Google Patents

Abstract

 The present invention relates to a double-sided chip bonding device for bonding the semiconductor chip on both sides of the circuit board at the same time, the lower die and the lower die installed so as to move up and down facing the upper mold supported on the main frame, And an actuator for interfacing with the lower mold, the substrate supporting plate supporting between both upper and lower molds and the interlocking means for interlocking and lowering the lower mold and the substrate supporting plate to support both ends of the substrate. It provides a double-sided chip bonding device that can double the mounting precision and the mounting efficiency of semiconductor chip by the configuration.

Semiconductor chip (component) double-sided bonding / main pressure / mounting

Description

Chip bonding apparatus

1 is a front view schematically showing a chip bonding apparatus according to the present invention,

2 is a side view schematically showing a chip bonding apparatus according to the present invention;

Figure 3 is a schematic perspective view showing an extract of the substrate support plate of the chip bonding apparatus according to the present invention,

Figure 4 is a schematic perspective view showing the lower mold and the substrate support plate interlocking means of the chip bonding apparatus according to the present invention;

Figure 5 is a schematic perspective view showing an extract of the mold cleaning unit of the chip bonding apparatus according to the present invention.

Explanation of symbols on the main parts of the drawings

10 ... substrate 100 ... mainframe

110 Top mold 111 Guide bar

120 ... lower mold 121 ... bed frame

130 ... actuator 140 ... substrate support plate

143 Guide groove 144 Slide bar

150 ... Interlocking means 151 ... 1st link arm

152 ... 2nd link arm 153 ... Coaxial

161 Feed roller 162 Wind roller

163 ... tension roller 164 ... tension roller

170 Cleaning unit 171, 172 Cleaning panel

174 ... Air Blow 175 ... Moving Source

The present invention relates to a chip bonding apparatus for mounting a semiconductor chip on a circuit board, and more particularly, to finally bond a semiconductor chip bonded by pre-pressure to an adhesive film attached to both sides of the circuit board by a main pressure process. It relates to a double-sided chip bonding device for making.

Recently, the demand for miniaturization, thinning, and lightening, high performance, and multifunctionality of electronic devices has been continued for a long time. As a result, chipping and modularization of electronic components are accelerating, and in the case of semiconductor chips, fine pitch, high integration, and high-density packaging technologies are rapidly advanced. For example, as portable electronic products such as mobile phones become smaller and lighter, the space for mounting semiconductor chips is further reduced, and since products are becoming more multifunctional and higher performance, the mounting quantity of semiconductor chips to support them is increasing. In order to cope with this trend, commercialization of flip chip mounting technology for directly attaching bare chips to substrates is becoming common. In recent years, flip chip mounting technology has been widely used in automobiles, computers, communication devices, and networks. It is effectively applied to appliances, home appliances, and the like.

 In general, in a flip chip mounting technology, an anisotropic conductive film (ACF) or non-conductive (NCF) film is attached to a substrate, and a preloading process of picking and positioning a semiconductor chip on the film and finally pressing and bonding the film. The substrate mounting of the flip chip is made through the main pressure process. In the semiconductor chip bonding process, it is essential to develop high performance equipment that satisfies high precision and high efficiency such as accurate positioning.

However, a conventional semiconductor chip bonding apparatus is developed to bond and mount a semiconductor chip only on one surface of a circuit board, thereby reducing the efficiency of bonding and mounting a chip component that is miniaturized to a substrate having an extremely fine circuit pattern. I have a problem.

Accordingly, the present invention has been made to solve the problems of the conventional chip bonding apparatus as described above, and an object of the present invention is to provide double-sided circuit boards so as to double the mounting precision and mounting efficiency of the semiconductor chip. An object of the present invention is to provide a double-sided chip bonding apparatus for finally bonding a semiconductor chip temporarily bonded to an attached adhesive film by a main pressure process by a main pressure process.

In order to achieve the above object, the double-sided chip bonding apparatus according to the present invention, the main frame; An upper mold supported by the main frame; A lower mold installed to raise and lower the upper mold; An actuator for elevating the lower mold; A substrate support plate installed between the upper mold and the lower mold to support lifting and lowering in association with the lower mold; And an interlocking means for interlocking and lowering the lower mold and the substrate support plate together.

In the double-sided chip bonding apparatus according to the present invention having the configuration as described above, it is preferable that the substrate support plate is installed so as to move up and down while maintaining an even distance between the upper mold and the lower mold. In addition, the lower mold is preferably installed to be coupled to the guide bar installed in the main frame to guide the lifting movement. In addition, the actuator is preferably configured to include a servo motor, a screw jack provided to connect the lower mold and the servo motor.

According to one aspect of the invention, the linkage means, a plurality of first link arm is installed on the main frame in a state where one end is rotatable, and a plurality of second links installed in the lower mold one end is rotatable state An arm, and the other ends of the plurality of first link arms and the second link arms are coupled to be connected to each other by a pivot, respectively, and fold symmetrically in linkage with the lifting motion of the lower mold. It is preferable that the substrate supporting plate is mounted and supported so as to move up and down with the lower mold.

The substrate support plate is preferably supported by a slide bar coupled to the main frame to guide the lifting movement. In addition, the chip protection tape is preferably provided between the upper mold and the substrate support plate and between the lower mold and the substrate support plate.

According to the present invention, the chip protection tape is supported to be provided with tension by a plurality of rollers installed in the main frame, so that the step movement is installed.

According to another aspect of the invention, it may be configured to further include a cleaning unit installed to advance between them according to the spaced state of the upper mold and the lower mold to clean the processing surface of the upper mold and the lower mold. have.

According to the present invention, the cleaning unit includes a cleaning panel facing the processing surface of the upper mold and the lower mold, an air blower for sucking and injecting air through a plurality of through holes formed in the cleaning panel, It is preferable to include a drive source for advancing and cleaning the cleaning panel.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the double-sided chip bonding apparatus according to the present invention.

1 and 2 is a double-sided chip bonding apparatus according to the present invention, the main frame 100 made in the form of a rectangular box, installed in a fixed state so that the machining surface is downward on the ceiling of the main frame 100. An upper mold 110, a lower mold 120 installed to raise and lower the processing surface to face the upper mold 110, and an actuator 130 for lifting and lowering the lower mold 120. A substrate support plate 140 installed spaced apart from each other between the upper mold 110 and the lower mold 120 to move up and down in conjunction with the lower mold 120 to support both ends of the substrate 10; And an interlocking means 150 for interlocking and lowering the lower mold 120 and the substrate support plate 140 together. Here, reference numeral 101 in the drawings denotes a cover frame provided for modularizing the entire double-sided chip bonding apparatus according to the present invention into one set.

According to the double-sided chip bonding apparatus according to the present invention having the configuration as described above, the substrate support plate 140 is installed to move up and down in conjunction with the lower mold 120. As a result, the substrate support plate 140 moves up and down together while maintaining an even distance between the upper mold 110 and the lower mold 120.

Therefore, when the lower mold 120 is raised, the upper and lower surfaces of the substrate 10 supported by the substrate support plate 140 are processed on the upper mold 110 and the processed surface of the lower mold 120, respectively. At the same time. Therefore, the semiconductor chips (not shown) mounted on both surfaces of the substrate 10 in advance through a preloading process may have a main pressure process by a pressing action performed by the upper mold 110 and the lower mold 120 at the same time. Finally bonded to both sides of the substrate 10 through the mounting is completed.

The lower mold 120 is installed to be mounted on the bed frame 121 installed to move up and down by the driving force of the actuator 130.

The bed frame 121 is coupled to the four guide bars 111 installed in a substantially vertical state in each of the rectangular corners of the main frame 100 so as to be guided by the lifting motion in a state constrained to determine the position coordinates. Is installed.

Therefore, the bed frame 121 is moved up and down by sliding the outer circumferential surface along the guide bar 111, wherein the guide bar 111 is restrained in the state of determining the position coordinates of the bed frame 121 To guide the lifting movement.

According to one aspect of the invention, at least one side end or the lower end of the guide bar 111, for example, by interposing a flow preventing means such as a ball bush 112 (see Fig. 2), the lifting motion of the lower mold 120 It is possible to realize precise linear lifting motion by eliminating the left and right flow and play.

The coil spring 113 is installed on an outer circumferential surface of the guide bar 111. The coil spring 113 is interposed to be located between the bed frame 121 and the top plate of the main frame 100.

Therefore, when the bed frame 121 is raised, the coil spring 113 is compressed in an elastically compressed state, and the elastic repulsive force at this time is provided as an auxiliary driving force when the bed frame 121 is lowered. .

The actuator 130 preferably has a servomotor 131 as a driving source, and includes a screw jack 132 installed to transfer the power output from the servomotor 131 to the bed frame 121. However, the present invention is not limited to such a configuration, and, for example, various known techniques, such as a general actuator such as a cylinder, can be used.

As shown in FIG. 3, the substrate support plate 140 is formed with a recess 142 processed to remove a portion of one side of the square panel body 141 formed by molding a metal or resin material. Guide grooves 143 are formed on both side surfaces of the recess 142, respectively.

Accordingly, both ends of the substrate 10 are loaded to slide into the guide groove 143 by a separate substrate feeder (not shown), such as a robot arm having a substrate holding function, so that both ends thereof are guide grooves ( 143) is supported in a seated state and both surfaces are exposed upward and downward, respectively.

The substrate support plate 140 is coupled to four slide bars 144 provided in a substantially vertical state, respectively, in the corners of the corners, and each of the slide bars 144 has an upper end on an upper plate of the main frame 100. It is installed so as to be penetrated by lifting.

Accordingly, the position coordinates of the substrate support plate 140 are determined as the slide bar 144 is restrained by the through holes (not shown) of the main frame 110 during the lifting movement of the substrate support plate 140. It will be able to guide the lifting movement in the cleared state. As a result, the slide bar 144 may exclude the left and right flow or play during the lifting movement of the substrate support plate 120 to enable accurate linear lifting movement.

The coil spring 145 is installed on an outer circumferential surface of the slide bar 144. The coil spring 145 is interposed between the substrate support plate 140 and the top plate of the main frame 100.

Therefore, the coil spring 145 is compressed in an elastically compressed state when the substrate support plate 140 is raised, and the elastic repulsive force is provided as an auxiliary driving force when the substrate support plate 140 is lowered. Done.

As shown in FIG. 4, the interlocking means 150 is installed to be symmetrically arranged at one end of the main frame 100 and the corner corners of the bed frame 121 in a rotatable state. The first link arm 151 and the second link arm 152 constituting the set of the pair and the other end of the first link arm 151 and the second link arm 152 of the respective pairs coaxially to serve as a hinge axis At the same time includes a pair of rotating shaft 153 for supporting the substrate support plate 140 is mounted.

Each of the pair of rotating shafts 153 is provided with a plurality of rotating rollers 154 which rotate in contact with the bottom surface of the substrate supporting plate 140, and the rotating roller 154 has the substrate supporting plate 140. When moving, as you move along the bottom will rotate.

Accordingly, the first link arm 151 and the second link arm 152 of the respective groups are symmetrically folded in association with the lifting motion of the bed frame 121. At this time, the rotation shaft 153 is moved in an oblique direction with respect to the moving direction of the bed frame 121. Accordingly, the substrate support plate 140 is rotated along the bottom surface of the rotating roller 154 installed on the rotating shaft 153, so that the driving force transmission in the horizontal direction of the rotating shaft 153 is excluded. Since only the driving force in the vertical direction of the rotation shaft 153 is transmitted, the lifting movement.

On the other hand, according to another aspect of the invention, between the upper mold 110 and the substrate support plate 140, and between the lower mold 120 and the substrate support plate 140, respectively, a chip protection tape (T) has another characteristic configuration in that it is installed to be suspended continuously.

The chip protection tape T is to protect the processing surface of the upper mold 110 and the lower mold 120 from being in direct contact with the chip component.

According to the present invention, the chip protection tape (T) is a pair of feed rollers 161 and winding rollers 162 are installed to be arranged up and down at both ends of the main frame 100, respectively, as shown in FIG. Both ends are wound to be installed to be suspended continuously in a state in which a constant tension is provided, and the pitch is moved in a predetermined step according to the lifting motions of the lower mold 120 and the substrate support plate 140. Here, reference numerals 163 and 164 in FIG. 1 denote tension rollers provided to guide the step movement while giving a constant tension to the chip protection tape T. As shown in FIG.

In addition, the chip protection tape (T) is installed so that the suspended position is constrained by guide rollers 146 respectively installed on both sides of the substrate support plate 140 as shown in FIG. As a result, the chip protection tape T is suspended to maintain a state spaced apart from each other at a predetermined interval with respect to the top and bottom surfaces of the substrate support plate 140 by interlocking with the lifting movement of the substrate support plate 140.

According to another aspect of the present invention, as shown in Fig. 2 and 5, further includes a cleaning unit 170 for cleaning the processing surface of the upper mold 110 and the lower mold 120, respectively It is configured by.

The cleaning unit 170 is installed to retreat between them according to the spaced state of the upper mold 110 and the lower mold 120.

According to the present invention, the cleaning unit 170 may include a pair of cleaning panels 171 and 172 facing the processing surfaces of the upper mold 110 and the lower mold 120, and the cleaning panel ( An air blow 174 for sucking and injecting air through a conduit 173 connected to a plurality of through holes (not shown) formed through the surfaces of the 171 and 172, and the pair of cleaning panels 171 and 172. It is configured to include a drive source (175) for advancing).

Hereinafter, the operation state of the double-sided chip bonding apparatus according to the present invention having the above-described configuration will be described in detail with reference to the accompanying drawings.

First, as illustrated in FIG. 3, the substrate 10 has circuit patterns 1 formed on both surfaces thereof, and on the circuit patterns 1, for example, anisotropic conductive film (ACF) or non-conductive ( NCF) film 3 is attached, and the semiconductor chip 4 is temporarily bonded on the film 3 in a state of picking and placing by a preload process.

Guides formed on both sides of the grooves 142 of the substrate support plate 140 by a separate substrate supplier (not shown), such as, for example, a robot arm having a manual operation or a gripping function by the operator. Sliding pull into the groove 143 to load. According to the loading operation, both ends of the substrate 10 are seated in the guide groove 143 and are supported such that both surfaces thereof are exposed upward and downward, respectively.

At this time, the loading state of the substrate 10 is sensed by a non-contact sensor (not shown) such as a vision system such as a CCD camera or an optical sensor or a contact sensor (not shown) such as a limit switch. The signal is sent to the main controller (not shown).

Subsequently, the actuator 130 is driven to ascend the bed frame 121 according to a control signal output from the controller, and at the same time, the lower mold 120 is also interlocked with each other. At this time, the bed frame 121 and the lower mold 120 are constrained in the state in which the position coordinates are determined by the guide bar 111 and the slide bar 144, respectively, to receive the upward movement. As a result, the bed frame 121 and the lower mold 120 are each capable of performing a precise linear upward movement in a state in which left and right flows or clearances are excluded.

Meanwhile, when the bed frame 121 and the lower mold 120 are raised, the substrate support plate 140 is also interlocked by the interlocking means 150 to rise together. That is, when the bed frame 121 is raised, the spaced ends of the first link arm 151 and the second link arm 152 of the respective groups are symmetrically folded so as to be close to each other. In this case, the pivot shaft 153 provided at the coupling end of the link arms 151 and 152 moves in an oblique direction with respect to the moving direction of the bed frame 121. Accordingly, the substrate support plate 140 has the rotation shaft 153 in a state where transmission of driving force in the horizontal direction of the rotation shaft 153 is excluded due to the rotation roller 154 rotating along the bottom surface thereof. Only the driving force in the vertical direction of is transmitted and rises in a straight line.

As the substrate support plate 140 rises, the chip protection tape T is constrained by guide rollers 146 installed on both sides of the substrate support plate 140 so that the suspended state is interlocked, thereby supporting the substrate. The upper and lower surfaces of the plate 140 are maintained at a predetermined interval from each other.

As described above, the bed frame 121, the lower mold 120, and the substrate support plate 140 are interlocked with each other to process the machining surface of the upper mold 110 and the lower mold 120. Surfaces respectively press the upper and lower surfaces of the substrate 10 simultaneously in the form of so-called counter blows. In this case, the chip protection tape between the machining surface of the upper mold 110 and the substrate support plate 140 and between the machining surface of the lower mold 110 and the substrate support plate 140, respectively. (T) is interposed in the form of a curtain. Accordingly, the main pressure process is performed in a state in which the processing surfaces of the upper mold 110 and the lower mold 120 and the semiconductor chip mounted on the substrate 10 are protected by excluding the chip protection tape T. Then, the semiconductor chips preloaded on both surfaces of the substrate 10 are finally bonded to complete the mounting.

On the other hand, when the semiconductor chip is mounted on the substrate 10 through the main pressure process as described above, the bed frame 121 and the lower mold (B) by reverse driving of the actuator 130 under sequence control of the main controller. 120 and the substrate support plate 140 are interlocked with each other. In this case, the repulsive force acting in the state in which the coil springs 113 and 145 are respectively elastically compressed is provided as an auxiliary driving force when the bed frame 121 and the substrate support plate 140 are lowered. Such a driving force is configured such that the bed frame 121 and the substrate support plate 140 can effectively function when the bed frame 121 and the substrate support plate 140 are in a state where the flow is not easy due to the peripheral mechanism.

As described above, when the bed frame 121, the lower mold 120, and the substrate support plate 140 are interlocked with each other, the processing surface of the upper mold 110 and the lower mold 120 are lowered. ) Are gradually separated from the upper and lower surfaces of the substrate 10 to return to the state before the loading operation of the substrate 10. At this time, the cleaning unit 170 is advanced to perform an operation for cleaning the processing surface of the upper mold 110 and the lower mold 120. That is, the pair of cleaning panels 171 and 172 may be connected to the upper mold 110, the substrate support plate 140, and the lower mold 120 by the driving source 175 of the cleaning unit 170, respectively. The drive is controlled to advance to the space portion formed according to the spacing. Subsequently, in the state where the pair of cleaning panels 171 and 172 are set to face the processing surfaces of the upper mold 110 and the lower mold 120, respectively, by the operation of the air blow 174. While performing the operation of injecting air through the through-hole penetrated to the surface of the conduit 173 and the cleaning panel 171, 172 connected thereto, the operation of sucking the injected air at the same time to perform the operation of the upper mold ( 110 and the processed surface of the lower mold 120 is cleaned for a predetermined time.

When the cleaning operation as described above is completed, as a preparatory process for performing a bonding process for another new substrate, the chip protection tape (T) of the supply roller 115 and the winding roller 116 respectively supporting both ends thereof. By action, the pitch shifts in a constant step so that a new, uncontaminated portion is set to protect the semiconductor chip.

As described above, according to the double-sided chip bonding apparatus according to the present invention, since the semiconductor chips are simultaneously bonded to both sides of the circuit board by bonding at the same time, the mounting efficiency can be obtained while doubling the mounting efficiency.

The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes are intended to fall within the scope of the claims set forth.

Claims (10)

Mainframe; An upper mold supported by the main frame; A lower mold installed to raise and lower the upper mold; An actuator for elevating the lower mold; A substrate support plate installed between the upper mold and the lower mold to support lifting and lowering in association with the lower mold; And And interlocking means for interlocking and lowering the lower mold and the substrate support plate together. The method of claim 1, The substrate supporting plate is a double-sided chip bonding device, characterized in that installed to move up and down while maintaining an even interval between the upper mold and the lower mold. The method of claim 1, The lower mold is coupled to the guide bar installed on the main frame is a double-sided chip bonding device, characterized in that installed to guide the lifting movement. The method of claim 1, wherein the actuator, And a servojack, and a screw jack provided to connect the lower mold and the servomotor. The method of claim 1, The substrate supporting plate is a double-sided chip bonding device, characterized in that the support is supported by the slide bar penetrately coupled to the main frame is installed to guide the lifting movement. The method of claim 1, wherein the interlocking means, A plurality of first link arms installed at one end of the main frame in a rotatable state, and a plurality of second link arms installed at one end of the lower mold in a rotatable state; The other ends of the plurality of first link arms and the second link arms are coupled to be coaxially connected to each other by a rotation shaft, respectively, and are symmetrically folded in linkage with the lifting motion of the lower mold. And the substrate support plate is mounted on the pivot shaft and installed to move up and down with the lower mold. The method of claim 1, A double-sided chip bonding apparatus, wherein a chip protective tape is suspended between the upper mold and the substrate support plate and between the lower mold and the substrate support plate. The method of claim 7, wherein The chip protection tape is a double-sided chip bonding apparatus, characterized in that the support is provided so that the tension is given by a plurality of rollers installed in the main frame so as to move step. The method of claim 1, And a cleaning unit installed to advance and retreat between the upper mold and the lower mold to clean the processing surfaces of the upper mold and the lower mold. The method of claim 9, wherein the cleaning unit, A cleaning panel facing the processing surfaces of the upper mold and the lower mold, an air blower for sucking and injecting air through a plurality of through holes formed in the cleaning panel, and a driving source for advancing and cleaning the cleaning panel. Double-sided chip bonding apparatus, characterized in that.

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