JP3812429B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
In a mounting apparatus that mounts an electronic component such as a semiconductor chip on a substrate, the mounting operation of picking up the electronic component from a component supply unit by a suction nozzle mounted on the transfer head and mounting it on the substrate is repeatedly performed. In this mounting operation, a multiple-type transfer with a plurality of unit transfer heads so that a plurality of electronic components can be transferred and mounted in one mounting turn in which the transfer head reciprocates between the component supply unit and the substrate. A head is used.
[0003]
In this case, in a component supply form in which the same type of components such as a semiconductor chip cut out from a semiconductor wafer and an electronic component stored in a tray are supplied, a plurality of electronic components of the same type are taken out in one mounting turn. It is transferred to the substrate to be mounted.
[0004]
[Problems to be solved by the invention]
However, in general, the number of electronic components mounted on one substrate is not an integral multiple of the number of unit transfer heads. For example, considering the case where an electronic component is mounted on a substrate on which 10 electronic components are mounted with a transfer head having eight unit transfer heads, eight unit transfer is performed in the first mounting turn. The electronic component is held by the mounting head and eight electronic components are mounted on the substrate. In the second mounting turn, two electronic components are mounted by the two unit transfer heads. That is, as many as six unit transfer heads that do not hold electronic components are generated in the second mounting turn, the ability of the electronic component mounting apparatus cannot be fully exhibited.
[0005]
Accordingly, the present invention has an object to provide an electronic component mounting method capable of improving the mounting efficiency of an electronic component by minimizing the number of unit transfer heads that move without holding the electronic component in each mounting turn. To do.
[0006]
[Means for Solving the Problems]
The electronic component mounting method according to claim 1, wherein the electronic component is taken out from the component supply unit by a multiple-type transfer head having a plurality of unit transfer heads, and positioned on a substrate positioning unit on which a plurality of substrates can be placed. An electronic component mounting method for transporting and mounting on a substrate, wherein a plurality of electronic components are taken out from the component supply unit by a plurality of unit transfer heads of the transfer head and transferred to the substrate positioning unit; A first component mounting step of mounting a first mounting number of electronic components allocated to the first substrate among the electronic components held by the transfer head on the first substrate of the plurality of substrates. And mounting a second number of electronic components on the second substrate among the plurality of substrates out of the electronic components held unmounted on the transfer head after the first component mounting step. Second component mounting process Including the.
[0007]
According to the present invention, a predetermined number of electronic components allocated to a substrate among the electronic components held by the plurality of unit transfer heads of the transfer head are mounted on the first substrate of the plurality of substrates. If there is an electronic component that is not yet mounted on any unit transfer head of the transfer head, the electronic component is held on each mounting turn by mounting these electronic components on the second substrate. The mounting efficiency of electronic components can be improved by reducing the number of unit transfer heads that move without being reduced as much as possible.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. Sectional views of the unit transfer head of the component mounting apparatus, FIGS. 4, 5, 6, and 7 are process explanatory views of the electronic component mounting method according to the embodiment of the present invention.
[0009]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a component supply unit 2 is disposed on a base 1. The component supply unit 2 includes a holding table 3, and a wafer sheet 4 on which a large number of semiconductor chips 5 (hereinafter simply abbreviated as “chips 5”) as electronic components are attached to the holding table 3. Holding. As shown in FIG. 2, an ejector mechanism 6 is disposed below the holding table 3. The ejector mechanism 6 includes a movable table 6a, and a pin lifting mechanism 7 that lifts and lowers an ejector pin for pushing up a semiconductor chip is attached to the movable table 6a. By driving the movable table 6 a, the pin elevating mechanism 7 moves in the XY direction below the wafer sheet 4.
[0010]
On the side of the component supply unit 2, a substrate carry-in conveyor 8A, a substrate sorting unit 9, a substrate positioning unit 10, a substrate take-out unit 12, and a substrate carry-out conveyor 8B are arranged in series in the X direction. The substrate carry-in conveyor 8A receives the substrate 11 on which the chip 5 is mounted from the upstream side and carries it in. The substrate sorting unit 9 has a configuration in which the transfer conveyor 9a is arranged to be slidable in the Y direction by a slide mechanism 9b, and the substrate 11 received from the substrate carry-in conveyor 8A is mounted in two ways as described below. Selectively distribute to stages.
[0011]
The substrate positioning unit 10 includes two mounting stages 10A and 10B, and positions the substrate 11 distributed by the substrate distribution unit 9 at the mounting position. Similarly to the substrate sorting unit 9, the substrate take-out unit 12 has a configuration in which the conveyor 12a is slidable in the Y direction by the slide mechanism 12b, and the substrate 11 mounted from the two mounting stages 10A and 10B is mounted. This is selectively received and transferred to the substrate carry-out conveyor 8B. The board carry-out conveyor 8B carries the delivered mounted board 11 to the downstream side.
[0012]
At both ends of the upper surface of the base 1, a first Y-axis table 14A and a second Y-axis table 14B are arranged in a direction orthogonal to the substrate transport direction (X direction). A first X-axis table 15A and a second X-axis table 15B are installed on the first Y-axis table 14A and the second Y-axis table 14B. A multiple transfer head 16 having a plurality of unit transfer heads to be described later is attached to the first X-axis table 15A. A substrate recognition camera 17 is disposed adjacent to and integrally with the transfer head 16.
[0013]
By driving the first Y-axis table 14A and the first X-axis table 15A, the transfer head 16 and the substrate recognition camera 17 move integrally. The first Y-axis table 14 </ b> A and the first X-axis table 15 </ b> A serve as a transfer head moving mechanism that moves the transfer head 16. In addition, an electropneumatic regulator 19 that controls the pressure of the air pressure supplied to the unit transfer head described later is disposed above the transfer head 16. The electropneumatic regulator 19 adjusts the pressure of the air pressure supplied from the air pressure supply unit as described later by being controlled by the control unit 19a.
[0014]
A component recognition camera 18 is mounted on the second X-axis table 15B. By driving the second Y-axis table 14B and the second X-axis table 15B, the component recognition camera 18 moves horizontally in the XY direction. The lower part is imaged by the component recognition camera 18 located above the component supply unit 2, whereby the chip 5 attached to the wafer sheet 4 is imaged. The position of an arbitrary chip 5 can be recognized by performing recognition processing on the image data obtained by the imaging by a recognition unit (not shown).
[0015]
Based on the position recognition result, the transfer head 16 is aligned with the chip 5 to be taken out, and the chip 5 is picked up by the unit transfer head. At the time of this pickup, the movable table 6a of the ejector mechanism 6 is driven to similarly align the pin elevating mechanism 7 with the chip 5, and the pin elevating mechanism 7 raises the ejector pin to push the chip 5 from below. Thereby, the chip 5 is peeled from the wafer sheet 4.
[0016]
At this time, a plurality of chips 5 are picked up by a plurality of unit transfer heads of the transfer head 16, whereby a plurality of transfer heads 16 reciprocate between the substrate 11 and the component supply unit 2 in one mounting turn. The chip 5 can be taken out and transferred and mounted on the substrate 11 of the substrate positioning unit 10.
[0017]
A line camera 13 is disposed between the substrate positioning unit 10 and the component supply unit 2, and the transfer head 16 holding the chip 5 taken out from the component supply unit 2 is positioned in the X direction above the line camera 13. By moving and performing a scanning operation, the chip 5 held by the transfer head 16 is imaged. Then, the image data obtained by this imaging is recognized by a recognition unit (not shown), whereby the positions of these chips 5 are recognized. When the transfer head 16 that has moved above the substrate 11 performs a mounting operation in which the chip 5 is mounted by moving up and down relative to the substrate 11, the mounting position is corrected based on this position recognition result.
[0018]
Next, the structure of the unit transfer head 20 attached to the transfer head 16 will be described with reference to FIG. In FIG. 3, a plurality of unit transfer heads 20 are arranged in parallel on a horizontal common base portion 16a. Here, only two adjacent unit transfer heads 20 are shown. A shaft holding portion 22 is fixed to the lower surface of the base portion 16a, and a slide bearing 25 is mounted inside the shaft holding portion 22 in the vertical direction.
[0019]
A nut member 24 is coupled to an elevating shaft 26 that is slidably fitted to the slide bearing 25 in the vertical direction. The nut member 24 is screwed with a feed screw 23 that is rotationally driven by a motor 21 that is disposed perpendicular to the upper surface of the base portion 16a. By driving the motor 21 to rotate, the elevating shaft 26 moves up and down.
[0020]
A nozzle holding portion 30 is coupled to the lower end portion of the elevating shaft 26 via a connecting block 27. A slide bearing 31 is mounted on the nozzle holding portion 30, and a vertical nozzle shaft 32 is fitted to the slide bearing 31 so as to be slidable in the vertical direction. A dial ram valve 29 mounted on the upper portion of the nozzle holding portion 30 is in contact with the upper surface of the head portion 32 a of the nozzle shaft 32.
[0021]
The air chamber 29 a of the diaphragm valve 29 communicates with the joint 28 through an inner hole 27 a provided in the connection block 27, and the joint 28 is connected to the air pressure supply unit 37 through the electropneumatic regulator 19. . By supplying air pressure into the air chamber 29a by the air pressure supply unit 37, the diaphragm valve 29 applies a downward load corresponding to the air pressure supplied to the head 32a.
[0022]
At this time, between the lower surface of the head 32 a and the upper surface of the slide bearing 31 in a state where the lower end portion of the nozzle shaft 32 is in contact with the upper surface of the chip 5 as in the right unit transfer head 20 shown in FIG. The downward load generated by the diaphragm valve 29 is transmitted as it is to the nozzle shaft 32 and the chip 5 is pressed against the substrate 11 by lowering the nozzle holding portion 30 so that a slight gap C is generated.
[0023]
The lower portion of the nozzle shaft 32 is a suction nozzle 32b, and a suction hole 32c is formed inside the suction nozzle 32b. The suction hole 32c is connected to a vacuum pump 35 through a joint 33 and a vacuum valve 34. By lowering the suction nozzle 32b on the tip 5 and vacuuming from the suction hole 32c by the vacuum pump 35, The suction nozzle 32b holds the chip 5 by suction. The vacuum valve 34 switches between vacuum suction and suction release by the suction nozzle 32b by connecting and disconnecting a vacuum suction circuit.
[0024]
In the above configuration, the motor 21, the feed screw 23, and the nut member 24 are elevating means for elevating and lowering the nozzle holding portion 30 that holds the nozzle shaft 32 provided with the suction nozzle 32b. The diaphragm valve 29 provided in the nozzle holding unit 30 applies a downward load due to air pressure to the suction nozzle 32b, so that the chip 5 is attached to the substrate 11 via the suction nozzle 32b when the chip 5 is mounted. It is a pressing means to press.
[0025]
Then, air pressure is supplied to each pressing means of the plurality of unit transfer heads 20 by a common air pressure supply unit 37. Here, the chip 5 is mounted on the substrate 11 by adjusting the pressure of the pneumatic pressure supplied from the pneumatic pressure supply unit 37 to each unit transfer head 20 by the electropneumatic regulator 19 controlled by the control unit 19a. The mounting load can be changed. The control unit 19 a and the electropneumatic regulator 19 are air pressure control units that control the air pressure supplied to the pressing means by the air pressure supply unit 37.
[0026]
This electronic component mounting apparatus is configured as described above. Hereinafter, an electronic component mounting method will be described with reference to FIGS. In FIG. 4, a chip 5 is attached to the wafer sheet 4 held on the holding table 3 of the component supply unit 2. In this electronic component mounting, the chip 5 is mounted on the substrate 11 positioned on the two mounting stages 10 </ b> A and 10 </ b> B of the substrate positioning unit 10 by the transfer head 16 including the four unit transfer heads 20.
[0027]
Here, six of the same type of chip 5 are mounted on the substrate 11, but since only a maximum of four chips 5 can be held in one mounting turn of the transfer head 16, one substrate 11. A predetermined number of mountings are completed by two mounting turns by the transfer head 16. In addition, the number of chips 5 mounted on one substrate 11 is not an integral multiple of the number of unit transfer heads 20, and a predetermined number is determined by the second mounting turn when one substrate 11 is viewed. Even after the above mounting is completed, the chip 5 not yet mounted exists in the transfer head 16, and a fraction is generated.
[0028]
First, as shown in FIG. 4A, the component recognition camera 18 is moved above the component supply unit 2, and the four chips 5 to be taken out in the mounting turn are imaged to perform position recognition. Thereafter, as shown in FIG. 4B, the first mounting turn is started. That is, the transfer head 16 is moved above the component supply unit 2, and the four chips 5 are sequentially picked up by the four unit transfer heads 20.
[0029]
Next, as shown in FIG. 5A, the transfer head 16 holding the chip 5 on each unit transfer head 20 performs a scanning operation that moves above the line camera 13. Thereby, the position of the chip 5 held by each unit transfer head 20 is recognized. Thereafter, the transfer head 16 moves above the substrate positioning unit 10 as shown in FIG. 5B, and four chips 5 are sequentially mounted on the substrate 11 positioned on the mounting stage 10B. .
[0030]
In parallel with the mounting operation by the transfer head 16, the component supply unit 2 images the four chips 5 to be taken out in the next mounting turn by the component recognition camera 18 and performs position recognition. Thereafter, the second mounting turn is started. That is, the transfer head 16 is moved above the component supply unit 2 and the four chips 5 are sequentially picked up by the four unit transfer heads 20. Next, as shown in FIG. 6A, the transfer head 16 holding the chip 5 on each unit transfer head 20 moves above the line camera 13 and moves the chip 5 held on each unit transfer head 20. The position is recognized.
[0031]
Thereafter, the transfer head 16 moves above the substrate positioning unit 10 as shown in FIG. 6B, and first, the two chips 5 are mounted on the substrate 11 positioned on the mounting stage 10B. Thereby, the mounting operation on the substrate 11 is completed. Of the four chips 5 taken out from the component supply unit 2 in this mounting turn, the chips 5 held by the two unit transfer heads 20 of the transfer head 16 without being mounted are positioned on the mounting stage 10A. Mounted on the substrate 11.
[0032]
Next, as shown in FIG. 7A, the mounted substrate 11 is unloaded from the mounting stage 10B, and a new substrate 11 is loaded into the mounting stage 10B. In parallel with this board carry-out operation, a third mounting turn is started, and the component supply unit 2 takes out the chip 5 by the transfer head 16. The transfer head 16 holding the chip 5 in each unit transfer head 20 moves above the line camera 13 and the position of the chip 5 held in each unit transfer head 20 is recognized.
[0033]
Thereafter, the transfer head 16 moves above the substrate positioning portion 10 as shown in FIG. 7B, and mounts four chips 5 on the substrate 11 positioned on the mounting stage 10A. Thereby, the mounting operation on the substrate 11 is completed. In the electronic component mounting method, the mounting operation on the two substrates 11 is completed by three mounting turns. Thereafter, similarly, the mounting operation of the chip 5 on the substrate 11 sequentially carried into the two mounting stages 10A and 10B is repeatedly executed.
[0034]
Among the electronic component mounting methods described above, the mounting process shown in FIGS. 6A and 6B includes a multiple transfer head 16 provided with four unit transfer heads 20 from the component supply unit 2 to the chip 5. Thus, the two substrates 11 are transferred and mounted on the substrate 11 positioned on the substrate positioning unit 10 on which the two substrates 11 can be placed.
[0035]
In this mounting operation, first, four chips 5 are taken out from the component supply unit 2 by the four unit transfer heads 20 of the transfer head 16 and transferred to the substrate positioning unit 10 (component transfer step). Then, the substrate 11 (first substrate) positioned on the mounting stage 10B of the two substrates 11 is allocated to the first substrate among the four chips 5 held by the transfer head 16. Two (first mounting number) chips 5 are mounted (first component mounting step).
[0036]
Next, the chip 5 held unmounted on the transfer head 16 on the substrate 11 (second substrate) positioned on the mounting stage 10A of the two substrates 11 after the first component mounting step. 2 (second mounting number) of the chips 5 are mounted (second component mounting step). Here, an example is shown in which in the second component mounting step, all the chips 5 that are held unmounted are mounted.
[0037]
By adopting such an electronic component mounting method, even when the number of electronic components mounted on one substrate is not an integral multiple of the number of unit transfer heads, the electronic components are mounted in each mounting turn. The number of unit transfer heads that move without being held can be reduced as much as possible to prevent a reduction in efficiency. That is, conventionally, when an electronic component that is a fraction left unmounted in any of the mounting turns is generated, the transfer head does not hold the electronic component in the unit transfer head for the fraction in the mounting turn. I had a mounting turn.
[0038]
On the other hand, in the electronic component mounting method shown in the above embodiment, there is an electronic component that is not mounted on any unit transfer head of the transfer head after mounting on the first substrate. For example, since these electronic components are mounted on the second substrate, the number of unit transfer heads that move without holding the electronic components in each mounting turn can be reduced as much as possible.
[0039]
【The invention's effect】
According to the present invention, a predetermined number of electronic components allocated to a substrate among the electronic components held by the plurality of unit transfer heads of the transfer head are mounted on the first substrate of the plurality of substrates. If any of the unit transfer heads of the transfer head has electronic components that are not yet mounted, these electronic components are mounted on the second substrate. The mounting efficiency of electronic components can be improved by minimizing the number of unit transfer heads that move without holding.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of a unit transfer head of an electronic component mounting apparatus. FIG. 4 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
2 Component supply unit 5 Chip 10 Substrate positioning unit 10A, 10B Mounting stage 11 Substrate 16 Transfer head 18 Component recognition camera 19 Electropneumatic regulator 20 Unit transfer head 21 Motor 26 Lifting shaft 29 Diaphragm valve 30 Nozzle holding unit 32 Nozzle shaft 32b Suction nozzle 35 Vacuum pump 37 Air pressure supply unit

Claims (1)

Electronic component mounting method in which an electronic component is taken out from a component supply unit by a multiple-type transfer head having a plurality of unit transfer heads, and transferred and mounted on a substrate positioned on a substrate positioning unit capable of mounting a plurality of substrates A component transfer step of taking out a plurality of electronic components from the component supply unit by a plurality of unit transfer heads of the transfer head and transferring them to the substrate positioning unit; and a first of the plurality of substrates A first component mounting step of mounting a first mounting number of electronic components allocated to the first substrate among the electronic components held by the transfer head on the substrate; and a second of the plurality of substrates. And a second component mounting step of mounting a second number of mounted electronic components among the electronic components held unmounted on the transfer head after the first component mounting step. Characteristic of electronic parts Method.

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