JP2019208042A - Control method of backup unit and substrate processing apparatus - Google Patents

Abstract

To avoid impact when lifting a substrate, while suppressing reduction of productivity.SOLUTION: When lifting a substrate P from a substrate stop position to a substrate processing position by means of a backup device 200, the substrate P is lifted by increasing the speed of a carrier member to an initial speed V1 set previously to the high speed side, in a separation section (H0-H1) until the carrier members (carrier members (203, 204)) of the backup device 200 abut against the lower surface of the substrate P. In a delivery section (H1-H2) from a moment in time when the carrier members come into contact with the substrate P until the substrate P separates upward of a conveyor 103, the substrate P is lifted by decreasing the speed of a delivery speed V1 carrier member previously set to the low speed side. In a section (H2-H3) where the carrier member lifts the substrate P over a delivery section T2, the substrate P is lifted by increasing the speed of the carrier member to a lift speed V2 set farther high speed side than the delivery speed V1.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a backup device control method and a substrate processing apparatus.

  The substrate is transported to the production line, the substrate is lifted (lifted) at each substrate stop position set on the transport conveyor of the production line, and predetermined processing is executed at the substrate processing position set above the substrate stop position. In doing so, a substrate support device is used. For example, the substrate support apparatus adopted in Patent Document 1 is a supporting member (such as a backup pin or the like) that can be moved up and down between a height that faces the substrate stop position at a distance and a height that lifts the substrate to the substrate processing position. A backup device including a unit composed of a backup plate or the like as a single member). The backup device raises the support member at a predetermined speed and supports the substrate at a substrate processing position set above the substrate stop position.

Japanese Patent No. 4950530

  Many of the substrates are relatively thin and easily warped, such as a flexible substrate. When such a substrate is lifted by the backup device, if the support member of the backup device is brought into contact with the substrate, there is a possibility that the components mounted on the substrate are adversely affected by the impact at the time of the contact. In particular, in the case of a substrate on which a bare chip (semiconductor chip) diced from a wafer is mounted, the bump of the bare chip is considerably small (for example, 30 μm to 50 μm), and even if a flux is applied and stopped, slight vibration or impact There is a risk of misalignment. Therefore, when the substrate is lifted by the conventional backup device, there is a possibility that the bare chip may be adversely affected by an impact or the like when the carrying member comes into contact with the substrate.

  On the other hand, if the speed at which the backup device lifts the substrate to reduce the impact is lowered, the impact itself can be avoided, but the tact time becomes longer and the productivity may be lowered.

  The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a control method for a backup apparatus and a substrate processing apparatus capable of avoiding an impact when the substrate is lowered while suppressing a reduction in productivity. It is said.

  A control method for a backup device according to an aspect of the present invention includes a substrate stop position set on a transfer path of a transfer conveyor for transferring a substrate and a substrate processing position set above the substrate stop position. In the control method of a backup device when lowering the substrate at the substrate processing position to the substrate stop position and delivering it to the transfer conveyor using a backup device including a support member capable of moving the substrate up and down, the substrate processing In the initial descending section from when the carrying member carrying the substrate in position starts to descend until the substrate carried by the carrying member lands on the transfer conveyor, the carrying member reaches the lowering speed on the high speed side. The step of lowering the substrate by raising the speed at which the carrier descends, and whether the supporting member is a substrate after the descending substrate starts to land on the conveyor. In the delivery section until leaving, the step of lowering the speed at which the carrier member descends to the delivery speed on the low speed side and lowering the carrier member, and the separation section after the lowered substrate has landed on the conveyor Then, the step of raising the speed at which the carrying member descends to the return speed on the high speed side and lowering the carrying member is provided.

  The substrate processing apparatus which concerns on the other situation of this invention is set above the conveyance conveyor which conveys a board | substrate along the conveyance path which conveys a board | substrate, the substrate stop position set to the said conveyance conveyor, and the said substrate stop position. A backup device including a supporting member capable of raising and lowering the substrate between the substrate processing position and a control device for controlling the backup device, wherein the substrate at the substrate processing position is lowered to the substrate stop position. When the substrate carrying the substrate at the substrate processing position begins to descend and before the substrate carried by the carrier member lands on the conveyor. In the descending section, the speed at which the supporting member descends is increased to the descending speed on the high speed side to lower the substrate, and the descending substrate starts to land on the transfer conveyor. In the delivery section until the carrier member is separated from the substrate, the carrier member is lowered by lowering the speed at which the carrier member descends to a low-speed delivery speed, and the lowered substrate is landed on the conveyor. The separation section after finishing comprises the control device for controlling the backup device so as to lower the carrying member by raising the speed at which the carrying member descends to the return speed on the high speed side. To do.

  In these aspects, when the substrate is lowered from the substrate processing position to the substrate stop position, the supporting member is driven as fast as possible in a section where the substrate does not contact the transfer conveyor to shorten the processing time. In addition, when the substrate lands on the conveyor and passes the substrate from the carrying member to the conveyor, it is possible to reduce the speed and avoid the impact on the substrate. Therefore, also in these aspects, the substrate can be raised to the substrate processing position as quickly as possible while avoiding an impact on the substrate.

  As described above, according to the present invention, when the substrate is lowered by the support member, the substrate can be moved up and down as quickly as possible while avoiding an impact on the substrate, thereby suppressing a reduction in productivity. However, a significant effect is achieved that the impact when the substrate is lowered can be avoided.

  Further features, objects, configurations, and advantages of the present invention will be readily understood from the following detailed description that should be read in conjunction with the accompanying drawings.

1 is a schematic plan view of a component mounting apparatus including a board support device according to an embodiment of the present invention. FIG. 2 is a schematic front view showing a schematic configuration of the substrate support apparatus of FIG. 1. FIG. 2 is an explanatory diagram showing a substrate lift operation by the substrate support apparatus of FIG. 1, wherein (A) shows a backup pin (an example of an element of a supporting member) of the substrate support apparatus at an initial height, and (B) shows the backup operation. When the pin is at the separation height, (C) is when the backup pin is at the delivery height, (D) is when the backup pin is at the lock start height, and (E) is when the backup pin is at the transfer height. (F) is a graph showing the relationship between the movement height and distance (section) corresponding to (A) to (E). It is explanatory drawing which shows the board | substrate lowering operation | movement by the board | substrate support apparatus of FIG. 1, (A) shows when the backup pin (element example of a supporting member) of a board | substrate support apparatus exists in lock end height, (B) is When the backup pin is at the lock start height, (C) is when the backup pin is at the separation height, (D) is when the backup pin is at the delivery height, (E) is When the backup pin is at the initial height, (F) is a graph showing the relationship between the movement height and the distance (section) corresponding to (A) to (E).

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.

  The component mounting apparatus M according to the present embodiment takes out the bare chip C from the diced wafer W and mounts (mounts) it on a substrate P such as a printed wiring board (PWB), and also mounts electronic components on the substrate. This is a so-called composite substrate processing apparatus that can be mounted on P. The substrate processing apparatus is not limited to the component mounting apparatus, and examples include a screen printing apparatus that applies a solder paste to the printed board P and an inspection apparatus that images and inspects the upper surface of the mounted board.

  In the illustrated example, the board P is a relatively rigid printed board. However, in addition to the printed board P, a flexible board having a thin and variable shape (flexible), a printed board and a flexible board, A rigid flexible substrate may be used.

  In the following description, in order to clarify the direction, the horizontal direction for transporting the substrate P processed by the component mounting apparatus M is defined as the X-axis direction, the horizontal direction orthogonal to the X-axis direction is defined as the Y-axis direction, and the vertical direction is defined as Z. An XYZ rectangular coordinate system for the axial direction is used. One of the Y-axis directions (the direction corresponding to the lower side in FIG. 1) is assumed to be the front.

  With reference to FIG. 1, the component mounting apparatus M includes a base 1 having a substantially rectangular shape in plan view that extends long in the Y-axis direction, and a conveyor 2 that extends along the width direction (X-axis direction) of the base 1. have. The transport conveyor 2 is a device that transports the substrate P along the X-axis direction (substrate transport path PH).

  Two mounting work positions S1 and S2 are set on the transport conveyor 2 at intervals in the transport direction in order to temporarily stop the substrate P and execute mounting of the bare chip C and electronic components. Corresponding to these mounting work positions S1 and S2, the transport conveyor 2 is embodied by a plurality of conveyor units 21 to 23. Each conveyor unit 21-23 is divided | segmented corresponding to two mounting operation position S1, S2 on the board | substrate conveyance path | route PH, between the conveyor unit 21 and the conveyor unit 22, and the conveyor unit 22 and the conveyor unit. A substrate support device 100, which will be described in detail later, is connected to the network 23. Each of the conveyor units 21 to 23 has a configuration including a motor 3 (only the conveyor unit 23 at the downstream end of the transport path PH is illustrated) and a sensor (not shown), and upstream conveyor units (21, 22). ) And the substrate P is stopped at the substrate stop position of the corresponding mounting work position (S1, S2), and the processed substrate P is transferred to the downstream conveyor unit (22, 23). It has a function. The motor 3 can drive the belt conveyor in both directions, and can carry the substrate P from right to left and left to right in FIG. In the present embodiment, it is assumed that the substrate P is transported from left to right. The board support device 100 receives the board P from the upstream conveyor unit (21 or 22), stops the board P at the board stop position at the corresponding mounting work position (S1 or S2), and stops the board. The board P is levitated to the board processing position set above the position, and the board P is used for component mounting work at the board processing position. After the mounting operation of the substrate P, the substrate support device 100 has a function of returning the substrate P from the substrate processing position to the substrate stop position and delivering the processed substrate P to the downstream conveyor units (22, 23). Have. Details of the substrate support apparatus 100 will be described later.

  On the base 1, a wafer storage device 10 disposed in front of the transport conveyor 2, a wafer support device 11 disposed at the rear of the transport conveyor 2 and receiving and supporting the wafer W from the wafer storage device 10, The component mounting unit 13 having the suction nozzle 14 that receives the bare chip C from the wafer head 12 of the wafer support device 11, the fixed camera 15 that images the bump formation surface of the bare chip C received by the suction nozzle 14, and the bare chip C after imaging. A flux application device 16 that applies a flux to the bump forming surface and an electronic component supply device 17 that supplies an electronic component to be mounted after the bare chip C is mounted are provided.

  Control of these units is controlled by the control device 40. The control device 40 includes a CPU, various memories, an HDD, and the like. An input device (not shown) is electrically connected to the control device 40, and various information by the operator is input based on the operation of the input device. The control device 40 also receives an output signal from position detection means such as an encoder (not shown) built in various drive motors such as the motor 3. Furthermore, various drive motors including the motor 3 of the conveyor 2, the fixed camera 15, and the like are electrically connected to the control device 40. Therefore, the control device 40 can comprehensively control the operation of each mechanism including the transport conveyor 2. The control device 40 is functionally provided with a setting unit 41 as setting means, and the setting unit 41 allows the control device 40 to perform the first mounting work position S1 and the second mounting work position S2. The transport direction of the substrate P is set from one to the other. Specifically, the rotation direction of the motor 3 is alternatively set to be clockwise or counterclockwise, and the relationship between the upstream side and the downstream side of the related part is changed in reverse, so that the relationship in the front-rear direction is the same. Set to

  When the bare chip C of the wafer W is mounted on the substrate P by the control of the control device 40, or when the supply component of the electronic component supply device 17 (see FIG. 1) is mounted, the component mounting device M has each mounting work position S1. , A predetermined mounting operation (an example of processing) is performed on the substrate support apparatus 100 installed in S2. In addition, since it is described in detail in the application (for example, Unexamined-Japanese-Patent No. 2014-203916) previously proposed by this applicant about the further detailed structure of each mechanism mentioned above, it abbreviate | omits about the detail. .

  Further, in the mounting operation of the bare chip C and the mounting operation of the electronic component, the control device 40 also controls the substrate support device 100.

  Next, the substrate support apparatus 100 will be described. The substrate support device 100 installed at the first mounting operation position S1 and the substrate support device 100 installed at the second mounting operation position S2 are both devices having the same specifications, and therefore only one of them is here. explain.

  Referring to FIG. 2, a substrate support apparatus 100 includes a base plate 101 placed on a base 1 and a pair of standing and standing on the base plate 101 and facing each other in the Y-axis direction. 2, a conveyor unit 102 that is fixed inside the conveyor unit 102, a lock piece 104 that is disposed above the conveyor unit 102 and faces above the conveyor 103, and the conveyor unit 102 And a backup device 200 that faces the substrate P conveyed to the conveyor 103 from below.

  The base plate 101 has a rectangular shape in plan view that is long in the X-axis direction.

  The conveyor unit 102 includes a pair of unit pieces 111 and 112 that are vertically disposed on both sides in the Y-axis direction, and constitutes a part of the transport conveyor 2 along the transport path PH.

  The conveyor 103 is provided for each of the corresponding unit pieces 111 and 112, and is attached closer to the upper part on the inner wall side. Each conveyor 103 is embodied by an unillustrated pulley or an endless belt that circulates in the X-axis direction of the conveyor unit 102 by the pulley. These left and right transport conveyors 103 support the lower surface of the edge of the substrate P on both sides of the substrate P in the substrate width direction, and the substrate P is placed at the substrate stop position shown in FIG. 2 (see height H2 in FIGS. 3 and 4). It is responsible for supporting the horizontal posture.

  Each lock piece 104 provided on the conveyor unit 102 is attached above the corresponding conveyor unit 102, and a part of the lock piece 104 protrudes toward the inner wall side of the conveyor unit 102, and its lower surface faces the upper surface of the conveyor 103. ing.

  Next, the backup device 200 will be described.

  The backup device 200 is installed on the base plate 101. Specifically, the backup device 200 includes an elevating device 201 fixed at the center of the base plate 101, an elevating shaft 202 that elevates and lowers from the upper surface of the elevating device 201, and a backup plate 203 provided above the elevating shaft 202. And a plurality of backup pins 204 erected on the upper surface of the backup plate 203.

  The lifting device 201 includes a motor 210, an encoder 211 of the motor 210, and a power transmission mechanism (not shown) that converts the rotational force of the motor 210 into parallel motion in the Z-axis direction and transmits the parallel motion to the lifting shaft 202. The elevating shaft 202 can be alternatively raised and lowered by driving the motor 210 in any driving direction.

  The backup plate 203 is a plate-like structure having pin mounting holes arranged in a matrix on the upper surface, and moves up and down integrally with the lifting shaft 202.

  The backup pins 204 are selectively implanted in the pin mounting holes of the backup plate 203 and protrude at the same height along the Z axis.

  The backup plate 203 and the backup pin 204 are supported so that they can be moved up and down between an initial height H0 facing the substrate P with a space below the substrate stop position and a lock end height H4 for lifting the substrate to the substrate processing position. Configure the member.

  With these configurations, the backup device 200 is set above the substrate stop position and the initial height H0 that faces the substrate P that stops at the substrate stop position set on the transport conveyor 2 with a gap therebetween. It moves up and down between the lift height H4 for lifting the substrate P to the substrate processing position.

  By the way, when a flexible substrate or a rigid flexible substrate is adopted as the substrate P, the substrate P is often warped and the middle portion is often bent downward. Further, such downward warping is more likely to occur after the bare chip C is mounted. Even in such a case, in order to prevent adverse effects on the substrate P and the bare chip C mounted on the substrate P, in the present embodiment, in the control, between the initial height H0 and the lock end height H4, A separation height H1, a delivery height H2, and a lock start height H3 are set.

  Next, the initial height H0, the separation height H1, the delivery height H2, the lock start height H3, and the lock end height H4 will be described with reference to FIG.

  The initial height H0 is the height when the backup pin 204 is lowered to the lower limit, and is the height when the backup pin 204 is at the home position. When the backup pins 204 are at the initial height H0, the height H of each backup pin 204 faces the lower surface of the substrate P at a distance from below the substrate P at the substrate stop position, as shown in FIG. It is set to height.

  The separation height H <b> 1 is a height from the initial height H <b> 0 to before contacting the lower surface of the substrate P in the process in which the backup pin 204 extends in the Z-axis direction. Note that a section in which the backup pin 204 moves between the initial height H0 and the separation height H1 is referred to as a separation section (H0-H1) in the following description.

  When the backup pin 204 is raised, the delivery height H2 is further increased from the separation height H1 so that the substrate P at the substrate stop position is part of the conveyor unit 102. This refers to the height until it leaves the upper side, and when the backup pin 204 is lowered, it refers to the height at which the lowered substrate P starts to be seated on the upper surface of the conveyor unit 102. The section in which the backup pin 204 moves between the separation height H1 and the delivery height H2 is referred to as a delivery section (H1-H2) in the following description.

  The lock start height H3 is such that when the backup pin 204 is raised, a part of the substrate P lifted from the delivery height H2 comes into contact with the lock piece 104, and the substrate P is between the lock piece 104 and the backup pin 204. Is a position where the unlocking of the substrate P locked with the lock piece 104 is completed when the backup pin 204 is lowered. In the following description, a section in which the backup pin 204 moves between the delivery height H2 and the lock start height H3 is referred to as a lift section (H2-H3).

  The lock end height H4 is a position where the substrate P lifted to the lock start height H3 is locked between the backup pin 204 and the lock piece 104 when the backup pin 204 is raised. At the time of lowering, it is a position where unlocking of the locked substrate P is started. In the following description, a section in which the backup pin 204 moves between the lock start height H3 and the lock end height H4 is referred to as a lock section (H3-H4).

  Note that the height H0 to H4 of each backup pin 204 can be detected based on the output of the encoder 211 of the motor 210 with respect to the initial height H0 and the delivery height H2. Further, the separation height H1 and the lock start height H3 can be calculated by providing a parameter “maximum warpage amount of the substrate” in advance. The “maximum warpage amount of the substrate” is a parameter derived based on statistical and experimental data that “the substrate P warped so much may come” based on the past processing results. The separation height H1 and the lock start height H3 are set based on the “maximum warpage amount of the substrate” parameter and the safety factor, and the motor 210 is decelerated at the heights H1 and H3. Is set. Further, since the amount of warping and deformation of each substrate P are various, based on the drive amount of the motor 201, the position where the backup pin 204 starts to contact the substrate P in advance and the safety for it. A rate may be set, and the motor 201 may be controlled to correspond to each section at a predetermined timing based on the set value.

  Next, control when the substrate P is moved up and down between the substrate stop position and the substrate processing position under the control of the control device 40 will be described.

  Referring to FIGS. 3A to 3F, first, in the process of lifting the substrate P from the substrate stop position to the substrate processing position, the control device 40 starts to raise the backup pin 204 at the initial height H0. Then, it is moved to the separation height H1 while accelerating to the initial speed V0. This initial motion speed V0 is set to a relatively high speed side (10 mm / second in the illustrated example). That is, in the separation section (H0-H1), the backup pin 204 is not in contact with the substrate P and does not affect the substrate P regardless of the moving speed. Therefore, the backup pin 204 is raised at a relatively high speed to shorten the movement time.

  Next, the control device 40 decelerates immediately before the backup pin 204 arrives at the separation height H1, decelerates to a receiving speed V1 of a relatively low speed (2 mm / sec in the illustrated example), and then the backup pin 204. The back-up pin 204 is brought into contact with the lower surface of the substrate P while maintaining the delivery speed until it passes through the delivery section (H1-H2). As a result, even when the substrate P is warped, the backup pin 204 slowly pushes up the lower surface of the substrate P, and does not affect the bare chip C and electronic components mounted on the substrate P. Start the lift.

  Next, after the backup pin 204 passes through the delivery section (H1-H2), the control device 40 has a medium speed (6 mm / second in the illustrated example) that is faster than the receiving speed V1 and slower than the initial movement speed V0. The backup pin 204 is raised at the set lift speed V2. The lift speed V2 is appropriately set based on the board P, the number of bare chips C or electronic components mounted on the board P, and the like. Although it is not always necessary to set the lift speed V2 to a medium speed, it is a preferable speed depending on the type of the substrate P.

  That is, if it is only to avoid an impact acting on the substrate P, it is preferable that the speed after the backup pin 204 lifts the substrate P is higher. However, the higher the speed, the higher the inertia acting on the board and the components mounted on the board. Therefore, when the speed at which the board P is transported is too high relative to the holding force of the bare chip C or the like. In some cases, there is a concern that the mounting state on the substrate P may be adversely affected by inertia acting on the bare chip C or the like. In particular, when the rigidity of the board is relatively small with respect to the total mass of the components mounted on the board, such inertia can adversely affect the board. On the other hand, if the substrate P is raised at a speed lower than the initial movement speed V0 as in this embodiment, it is possible to avoid adverse effects due to inertia. On the other hand, since the intermediate speed is set faster than the receiving speed V1, it is possible to shorten the transport time after the substrate P is lifted.

  Next, the control device 40 decelerates immediately before the backup pin 204 arrives at the lift section (H2-H3), decelerates again to the relatively low lock speed V3, and then the backup pin 204 has the lock end height H4. The backup pin 204 is raised in the lock section (H3-H4) until it reaches. As a result, even when the substrate P is warped, the backup pin 204 slowly pushes up the lower surface of the substrate P, and does not affect the bare chip C and electronic components mounted on the substrate P. The substrate P can be locked to the substrate processing position with respect to 104. The mounting operation described in FIG. 2 is performed in a state where the substrate P is locked at the substrate processing position shown in FIG.

  Next, referring to FIGS. 4A to 4F, in the process of lowering the substrate P from the substrate processing position to the substrate stop position and delivering it to the conveyor unit 102 as a part of the transfer conveyor 2, the control device 40, the motor 210 is moved until the backup pin 204 that lifts up the substrate P to the locked position reaches a lowering speed V4 set at a predetermined medium speed (same as the lifting speed V2 is 6 mm / second in the illustrated example). The descent operation is started while increasing the rotation speed. As a result, the processed substrate P can be lowered without exerting excessive inertia on the substrate P. The sections where the backup pin 204 descends at the descending speed V4 are the lock section (H3-H4) and the lift section (H2-H3) in the illustrated example, and these sections are the initial descending period in this embodiment. .

  Next, the control device 40 suppresses the speed at which the backup pin 204 descends immediately before the lift section (H2-H3), and decelerates to a predetermined low speed (in the example shown, 2 mm / second, which is the same as the reception speed V1). Then, the backup pin 204 is lowered so that the substrate P starts to be seated on the conveyor unit 102. As a result, the substrate P can be transferred to the conveyor 103 without adversely affecting the mounted bare chip C and the like.

  After the backup pin 204 further descends and completely separates from the lower surface of the substrate P, the control device 40 returns the return speed set to the high speed side speed (10 mm / second, which is the same as the initial movement speed V0 in the illustrated example). Lower with V6. In this separation section (H0-H1), the backup pin 204 is not in contact with the substrate P and does not affect the substrate P regardless of the moving speed. For this reason, the backup pin 204 is lowered at a relatively high speed to shorten the movement time.

  In the example described above, the initial movement speed V0 and the return speed V6 are set to the same high speed (10 mm / second), and the reception speed V1, the delivery speed V5, and the lock speed V3 are the same low speed (2 mm / second). Although the lift speed V2 and the descent speed V4 are set to the same medium speed (6 mm / second), these may be set individually according to each driving mode.

  As described above, in the present embodiment, the supporting member (a unit constituted by the backup plate 203, the supporting member 204, etc. is represented as a single component. Hereinafter, referred to as “supporting members (203, 204)”. .) Can be used to provide a control means for lifting the substrate P at the substrate stop position to the substrate processing position.

  According to this means, in the separation section (H0-H1) from the initial height H0 to the time when the supporting member (203, 204) is in contact with the lower surface of the substrate P, the supporting member (203, 204) is supported at the initial speed V0 set in advance on the high speed side. The speed of the members (203, 204) is increased to raise the substrate P, and the delivery section (H1) from when the carrier member (203, 204) contacts the substrate P until the substrate P is separated above the transfer conveyor 2 -H2), the substrate P is raised by lowering the speed of the holding member (203, 204) to the receiving speed V1 set in advance on the low speed side, and the holding member (203, 204) moves the delivery section (H1-H2). In a section where the substrate P is lifted over (in the example shown, at least in the lift section (H2-H3), the speed of the carrier member (203, 204) is set to the lift speed V2 set on the higher speed side than the receiving speed V1. Raise It is possible to increase the substrate P.

  For this reason, in this embodiment, when the substrate P is lifted from the substrate stop position to the substrate processing position, the substrate is not in contact with the substrate P or the substrate is moved by the support member (203, 204). In a state where P is supported, that is, in a section in which impact to the substrate P is unlikely to occur (in the illustrated example, the separation section (H0-H1) or the lift section (H2-H3)), the substrate P is raised at a high speed. In the section where the impact can be applied to the substrate P (in the illustrated example, the delivery section (H1-H2) and the lock section (H3-H4)), the substrate is slowly lowered by lowering the speed at which the support members (203, 204) are raised. Since P can be raised, the substrate P can be raised to the substrate processing position as quickly as possible while avoiding an impact on the substrate P.

  In particular, the control device 40 according to the present embodiment has a medium speed that is lower than the initial movement speed V0 and higher than the reception speed V1 in the section that rises beyond the delivery section (H1-H2), that is, the lift section (H2-H3). The backup device is controlled to raise the substrate P at the lift speed V2 set to. Therefore, in the present embodiment, the inertia acting on the substrate P when the supporting members (203, 204) raise the substrate P to the substrate processing position can be suppressed to a relatively small value. That is, if it is only for avoiding the impact, it is preferable that the speed after the support member (203, 204) lifts the substrate P is higher, but the higher the speed, the more the substrate P and the substrate P are subjected. Inertia acting on the mounted components is also increased. In particular, when the rigidity of the board P is relatively small with respect to the total mass of components mounted on the board P, there is a possibility that the board P is adversely affected by such inertia. On the other hand, if the substrate P is raised at a speed lower than the initial movement speed V0 as in this embodiment, it is possible to avoid adverse effects due to inertia. On the other hand, since the medium speed is set faster than the receiving speed V1, it is possible to shorten the transport time after the substrate P is lifted.

  Further, in the present embodiment, a lock that receives the upper edge of the substrate P and sandwiches the substrate P between the holding members (203, 204) and locks it to the substrate processing position so as to position the substrate P at the substrate processing position. The control device 40 further includes a piece 104, and the control device 40 includes a lock section (H3-H4) from the height at which the upper edge of the substrate P that has been raised to the substrate processing position starts to contact the lock piece 104 to the lift height H4. The backup device is controlled to raise the substrate P at the lock speed V3 set to the low speed side. Therefore, in the present embodiment, even when the substrate P is clamped by the lock piece 104, an impact when the substrate P comes into contact with the lock piece 104 is avoided, and an adverse effect on the substrate P is suppressed, while the substrate is fast. P can be raised from the substrate stop position to the substrate processing position.

  Next, in the phase where the substrate P is lowered from the substrate processing position to the substrate stop position, a means for lowering the substrate P at a relatively high speed while avoiding an impact acting on the substrate P as much as possible is configured.

  In this means, the initial lowering section from when the supporting members (203, 204) at the lift height H4 start to descend to before the substrate P supported by the supporting members (203, 204) lands on the conveyor 2. (In this embodiment, in the lock section (H3-H4) and the lift section (H2-H3)), the speed of the carrier member (203, 204) is lowered to the lowering speed on the high speed side to lower the substrate P. In the delivery section (H1-H2) from when the descending substrate P starts to land on the transfer conveyor 2 to when the carrying members (203, 204) move away from the substrate P, the carrying member ( 203, 204), the carrier member (203, 204) is lowered, and in the separation section (H0-H1) after the lowered substrate P has landed on the conveyor 2, return The degree V6 by increasing the speed of the bearing member (203, 204) are lowered the bearing member (203, 204).

  For this reason, in the present embodiment, when the substrate P is lowered from the substrate processing position to the substrate stop position, the section in which the substrate P does not contact the transport conveyor 2 (the lock section (H3-H4) and the lift section (H2-H3). Until the carrier member (203, 204) is driven as fast as possible to shorten the processing time, and the substrate P is landed on the transport conveyor 2, and the carrier member (203, 204) 204), when transferring the substrate P to the transport conveyor 2, it is possible to reduce the speed and avoid the impact on the substrate P. Therefore, also in these aspects, the substrate P can be raised to the substrate processing position as quickly as possible while avoiding an impact on the substrate P.

  The present invention is not limited to the embodiment described above, and it goes without saying that various modifications can be made without departing from the scope of the present invention.

2 Conveyor 40 Control device 100 Substrate support device 104 Lock piece 200 Backup device 203 Backup plate (an example of an element of a supporting member)
204 Backup pin (element example of support member)
210 Motor 211 Encoder C Bare chip H0 Initial height H1 Separation height H2 Delivery height H3 Lock start height H4 Lock end height (H0-H1) Separation zone (H1-H2) Delivery zone (H2-H3) Lift zone ( H3-H4) Lock section P Substrate PH Substrate transport path S1 Mounting work position S2 Mounting work position V0 Initial movement speed (high-speed side speed)
V1 receiving speed (low speed side)
V2 Lift speed (medium speed side)
V3 Lock speed (low speed side)
V4 descending speed (medium speed side)
V5 delivery speed (low speed)
V6 Return speed (speed on the high speed side)
W wafer

Claims (2)

Using a backup device including a support member capable of moving the substrate up and down between a substrate stop position set on a transfer path of a transfer conveyor for transferring a substrate and a substrate processing position set above the substrate stop position In the control method of the backup device when lowering the substrate at the substrate processing position to the substrate stop position and delivering it to the transfer conveyor,
In the initial descending section from when the carrying member carrying the substrate at the substrate processing position starts to descend to before the substrate carried by the carrying member lands on the transfer conveyor, the descent speed on the high speed side is reached. Increasing the speed at which the carrier member descends and lowering the substrate;
In the delivery section from when the descending substrate starts to land on the conveyor, until the carrier member leaves the substrate, the step of lowering the carrier member by lowering the speed at which the carrier member descends to the low-speed delivery speed. When,
In a separation section after the descending substrate has landed on the conveyor, the step of lowering the supporting member by increasing the speed at which the supporting member descends to the return speed on the high speed side is provided. A control method for a backup device. A transport conveyor for transporting the substrate along a transport path for transporting the substrate;
A backup device including a supporting member capable of moving the substrate up and down between a substrate stop position set on the transfer conveyor and a substrate processing position set above the substrate stop position;
A control device that controls the backup device, and carries the substrate at the substrate processing position when the substrate at the substrate processing position is lowered to the substrate stop position and delivered to the transfer conveyor. In the initial lowering section from when the carrying member starts to descend to before the substrate carried by the carrying member lands on the conveyor, the substrate is increased by increasing the speed at which the carrying member descends to the lowering speed on the high speed side. In the delivery section from when the descending substrate starts to land on the conveyor, until the carrier member leaves the substrate, the carrier member is lowered by lowering the speed at which the carrier member descends to the low-speed delivery speed. In the separation section after the lowered substrate has landed on the conveyor, the speed at which the carrier member descends is increased to the return speed on the high speed side. The substrate processing apparatus characterized by and a said control device for controlling the backup device so as to drop the bearing member.