CN112368811A

CN112368811A - Electronic component packaging device

Info

Publication number: CN112368811A
Application number: CN201980044544.9A
Authority: CN
Inventors: 田泽秀博; 久保晶义; 辻正人
Original assignee: Shinkawa Ltd
Current assignee: Shinkawa Ltd
Priority date: 2018-07-24
Filing date: 2019-07-23
Publication date: 2021-02-12
Also published as: JPWO2020022345A1; KR20200138312A; TWI712100B; SG11202013223TA; TW202008495A; KR102432998B1; WO2020022345A1; JP6981700B2

Abstract

A bonding apparatus (100) for packaging a semiconductor die (16) on a substrate (15) comprises: a common linear guide (20) extending in the Y direction; a plurality of packaging heads (21a, 21b) which are arranged in a Y direction and are guided by a linear guide (20) to move in the Y direction; and a control unit (50) for adjusting the Y-direction position of the packaging heads (21a, 21 b); the control unit (50) simultaneously starts the sealing heads (21a, 21b) in the same direction, and simultaneously stops the sealing heads (21a, 21 b).

Description

Electronic component packaging device

Technical Field

The invention relates to a structure of an electronic part packaging device.

Background

As a packaging device for packaging an electronic component on a substrate, there is used a packaging device including: a pick-up unit for picking up (pick up) a semiconductor die (semiconductor die) from a wafer and placing the semiconductor die on an intermediate stage; and a bonding unit for picking up the semiconductor die from the intermediate stage, transferring the semiconductor die onto the substrate, and bonding the semiconductor die to the substrate.

Further, a package device has been proposed which includes two pickup portions and a bonding portion and alternately performs pickup and bonding to shorten a bonding time (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open No. 2009-130583

Disclosure of Invention

Problems to be solved by the invention

However, in the sealing device described in patent document 1, since the two sealing heads are arranged in a direction orthogonal to the support arm, a large installation space is required. Further, since the pick-up and the bonding are alternately performed, there are cases where: in the bonding of one of the package heads, vibration caused by the operation of the other package head interferes with the packaging accuracy, and the packaging accuracy is affected. The effect becomes more remarkable in the case where the packing head is moved at a high speed in order to shorten the packing time.

Accordingly, an object of the present invention is to reduce an installation space and improve packaging accuracy in an electronic component packaging apparatus including a plurality of packaging heads.

Means for solving the problems

An electronic component packaging device of the present invention is an electronic component packaging device for packaging an electronic component on a substrate or other electronic components, and is characterized by comprising: a linear guide (linear guide) extending in a predetermined direction; a plurality of packaging heads which are arranged in a row in a predetermined direction and are guided by a linear guide to move in the predetermined direction; and a control unit for adjusting the position of the packaging head in a predetermined direction; the control unit simultaneously starts the respective heads in the same direction and simultaneously stops the heads.

As described above, the arrangement of the packaging heads in the predetermined direction can reduce the installation space. Further, by simultaneously starting and stopping the plurality of package heads, it is possible to suppress the interference of vibration caused by the operation of each package head, and to improve the package quality.

The electronic component packaging apparatus of the present invention may be configured such that: each of the package heads is mounted with a package nozzle for picking up and packaging the electronic component, and moves in a predetermined direction between a pick-up position where the electronic component is picked up by the package nozzle and a package position where the electronic component is packaged by the package nozzle of the package head, and the control section simultaneously starts the respective package heads from the respective pick-up positions or the respective package positions in the same direction, and simultaneously stops the respective package heads from reaching the respective package positions or the respective pick-up positions.

The control unit simultaneously starts the respective package heads from the pickup position or the package position in the same direction, and simultaneously stops the respective package heads when the respective package heads reach the package position or the pickup position, so that it is possible to suppress the influence of the disturbance of vibration caused by the movement of the other package head on the package accuracy in the pickup operation or the package operation of one of the package heads.

The electronic component packaging apparatus of the present invention may be configured such that: the package device includes a plurality of package stages for holding a substrate on which electronic components are packaged or a substrate on which other electronic components are packaged on an upper surface, and the pickup positions are spaced from the package stages by a distance in a predetermined direction.

By the structure, the distance between the picking position and the packaging position can be the same, and a plurality of packaging heads can be started and stopped simultaneously, so that the packaging quality is improved.

The electronic component packaging apparatus of the present invention may be configured such that: the substrate is packaged with a plurality of electronic components in a predetermined direction, and the control unit moves each packaging head so that each distance between each pickup position and each packaging position becomes equal, thereby packaging the plurality of electronic components.

Thus, even when a plurality of electronic components are packaged in a predetermined direction on a substrate, the distance between the pickup position and the packaging position can be made equal, and therefore, a plurality of packaging heads can be started and stopped simultaneously, and the packaging quality can be improved.

In the electronic component packaging apparatus according to the present invention, when the respective distances between the respective pickup positions and the respective packaging positions are different, the moving speed of the packaging head having the shorter distance may be made slower than the moving speed of the packaging head having the longer distance.

Thus, even when the respective distances between the pickup position and the package position are different, the plurality of package heads can be simultaneously started and stopped, and the package quality can be improved.

ADVANTAGEOUS EFFECTS OF INVENTION

The invention can reduce the installation space and improve the packaging precision in the electronic component packaging device comprising a plurality of packaging heads.

Drawings

Fig. 1 is a plan view showing a structure of a joining device according to an embodiment.

Fig. 2 is a plan view showing a picking operation of a semiconductor die by a pick-up head of the bonding apparatus shown in fig. 1.

Fig. 3 is a plan view showing a moving operation of the intermediate stage of the joining apparatus shown in fig. 1.

Fig. 4 is a plan view showing the movement of the head of the bonding apparatus shown in fig. 1 to the pickup position.

Fig. 5 is a plan view showing the movement of the sealing head of the bonding apparatus shown in fig. 1 to the sealing position.

Fig. 6 is a plan view showing the movement of the packaging head to the initial position and the movement of the intermediate stage to the first position after the semiconductor die is packaged on the substrate by the bonding apparatus shown in fig. 1.

Fig. 7 is a graph showing a time change in the speed of each of the package heads in the case where the respective distances between each of the pickup positions and each of the package positions are equal in the bonding apparatus shown in fig. 1.

Fig. 8 is a graph showing temporal changes in the position of each package head in the Y direction when the distances between each pickup position and each package position are equal in the bonding apparatus shown in fig. 1.

Fig. 9 is a plan view showing the movement of the sealing head to the sealing position in the case where the respective distances between the respective pickup positions and the respective sealing positions are different in the bonding apparatus shown in fig. 1.

Fig. 10 is a plan view showing the movement of the packaging head to the initial position after the packaging head shown in fig. 9 is moved and the semiconductor die is packaged on the substrate, and the movement of the intermediate stage to the first position.

Fig. 11 is a graph showing a time change in the speed of each of the packing heads when the packing head shown in fig. 9 moves.

Fig. 12 is a graph showing temporal changes in the Y-direction position of each of the sealing heads when the sealing head shown in fig. 9 moves.

Fig. 13 is a plan view showing the structure of a joining apparatus according to another embodiment.

Fig. 14 is a plan view showing the movement of the head of the bonding apparatus shown in fig. 13 to the pickup position.

Fig. 15 is a plan view showing the movement of the sealing head of the bonding apparatus shown in fig. 13 to the sealing position.

Detailed Description

Hereinafter, a bonding apparatus 100 as an electronic component packaging apparatus according to an embodiment will be described with reference to the drawings. The bonding apparatus 100 packages a semiconductor die 16 as an electronic component on a substrate 15 or other semiconductor die 16.

As shown in fig. 1, the joining device 100 includes: a base 10; a common linear guide 20 attached to the base 10 and extending in a Y direction which is a predetermined direction; a plurality of

packing heads

21a and 21b which are guided by the linear guides 20 and move in the Y direction; and a control unit 50 for adjusting the positions of the two

package heads

21a and 21b in the Y direction.

As shown in fig. 1, two sets of the conveying

rails

11a and 11b and two

sealing stages

12a and 12b for conveying the substrate 15 in the X direction are mounted on the base 10 of the bonding apparatus 100. Further, the joining device 100 includes: a guide frame (guide frame)32 attached to the base 10 and extending in the X direction; a pickup head 33 that moves in the X direction while being guided by the guide frame 32; a guide rail (guide rail)30 attached to the base 10 and extending in the Y direction; an intermediate stage 31 that moves in the Y direction while being guided by the guide rail 30; and a wafer holder (not shown) for holding the wafer 35.

The Y-direction positions of the centers of the two

package lands

12a and 12b are 12c and 12d, respectively, and the distance between the centers of the

package lands

12a and 12b in the Y direction is W1. Two tables 17 for placing and picking up the semiconductor die 16 are provided on the upper surface of the intermediate stage 31. The distance between the two mounting tables 17 in the Y direction is W1, which is the same as the distance between the

package lands

12a and 12b in the Y direction.

The intermediate stage 31 moves in the Y direction between a first position indicated by a solid line in fig. 1 and a second position indicated by a dot-dashed line. When the intermediate stage 31 reaches the second position indicated by the dotted line, the Y-direction positions of the two tables 17 become the pickup position 13a and the pickup position 13 b. As described above, since the distance in the Y direction between the two mounting tables 17 is W1, which is the same as the distance in the Y direction between the package stage 12a and the package stage 12b, the distances Δ Yc and Δ Yd in the Y direction between the

pickup positions

13a and 13b and the

Y direction positions

12c and 12d at the centers of the package stage 12a and the package stage 12b become equal to each other.

As shown in fig. 1, when the semiconductor die 16 is packaged at the Y-direction negative-side end of each substrate 15, the Y-direction positions at which the semiconductor die 16 is packaged are the package position 14a and the package position 14 b. In this case, the distance in the Y direction between the

mounting positions

14a and 14b is W1, similarly to the distance in the Y direction between the two mounting tables 17. In this case, the distances Δ Ya and Δ Yb in the Y direction between the

pickup positions

13a and 13b and the

sealing positions

14a and 14b are equal to each other.

The

respective package heads

21a and 21b are mounted on one side of the linear guide 20 in a row in the Y direction, and are guided by the linear guide 20 to move in the Y direction. Each of the

package heads

21a and 21b is mounted with a

package nozzle

22a and 22b for picking up and packaging the semiconductor die 16. The package heads 21a and 21b move in the Y direction between the pick-up position 13a and the pick-up position 13b at which the package nozzles 22a and 22b come to the position directly above the mounting table 17 to pick up the semiconductor die 16, and the package position 14a and the package position 14b at which the package nozzles 22a and 22b package the semiconductor die 16.

At the pick-up head 33, a pick-up nozzle 34 is mounted, the pick-up nozzle 34 picking up the semiconductor die 16 from the wafer 35 and placing on the stage 17 of the intermediate stage 31.

Driving units such as linear motors are attached to the

respective package heads

21a, 21b, the pickup head 33, and the intermediate stage 31, and the respective driving units operate in accordance with instructions from the control unit 50. The control Unit 50 includes a computer including a Central Processing Unit (CPU) and a memory Unit.

Next, the operation of the bonding apparatus 100 will be described with reference to fig. 2 to 8. In the following description, as shown in fig. 1, a case where the semiconductor die 16 is mounted on the negative side end portion in the Y direction of each substrate 15 will be described.

As shown in fig. 2, the controller 50 moves the respective package heads 21a and 21b to the initial positions and moves the intermediate stage 31 to the first position on the Y-direction negative side. Then, the control unit 50 moves the pickup head 33 in the X direction, picks up the semiconductor die 16 from the wafer 35 by the pickup nozzle 34, and places the semiconductor die on the two tables 17 of the intermediate stage 31. The semiconductor dies 16 are placed on the two tables 17 of the intermediate stage 31 at an interval of a distance W1 in the Y direction.

After the placement of the semiconductor die 16 is completed, the control unit 50 moves the intermediate stage 31 to the second position on the Y-direction positive side as shown in fig. 3. When the intermediate stage 31 moves to the second position, the Y-direction positions of the semiconductor dies 16 placed on the mounting tables 17 become the pickup position 13a and the pickup position 13b, respectively.

As shown in fig. 4, the control unit 50 moves the respective package heads 21a and 21b to the negative side in the Y direction so that the centers of the

respective package nozzles

22a and 22b of the respective package heads 21a and 21b become the pickup positions 13a and 13 b. At this time, the control unit 50 simultaneously starts the respective package heads 21a and 21b from the initial positions to the Y direction negative side, simultaneously reaches the pickup positions 13a and 13b at the centers of the

respective package nozzles

22a and 22b, and simultaneously stops the movement of the respective package heads 21a and 21b to the Y direction negative side.

As shown in fig. 5, the control unit 50 sucks the semiconductor die 16 at the tip of each of the

package nozzles

22a and 22b of the package heads 21a and 21b, respectively, and picks up the semiconductor die 16 from the intermediate stage 31. After the picking, as shown in fig. 5, the respective package heads 21a and 21b are moved from the picking

positions

13a and 13b to the package positions 14a and 14 b. At this time, the control unit 50 simultaneously starts the respective package heads 21a and 21b to face the Y direction positive side, simultaneously reaches the package positions 14a and 14b at the centers of the

respective package nozzles

22a and 22b, and simultaneously stops the movement of the respective package heads 21a and 21b to the Y direction positive side.

As described above, since the distances Δ Ya and Δ Yb in the Y direction between the pickup positions 13a and 13b and the package positions 14a and 14b are equal to each other, the controller 50 activates the package heads 21a and 21b simultaneously at time t0, accelerates the same acceleration up to the same speed up to time t1, moves the same speed in the Y direction up to time t2 at the same speed, decelerates the same deceleration up to speed zero up to time t3, and stops the same at time t3, as indicated by broken lines a and solid lines b shown in fig. 7. At this time, as shown by the broken line c and the solid line d in fig. 8, the package heads 21a and 21b reach the package positions 14a and 14b at the same time. In fig. 7, the broken lines a and the solid lines b show temporal changes in the speed of each of the package heads 21a and 21b, and in fig. 8, the broken lines c and the solid lines d show temporal changes in the Y-direction position of each of the package heads 21a and 21 b.

When the movement of the package heads 21a and 21b to the package positions 14a and 14b is completed and the package heads 21a and 21b are stopped, the controller 50 lowers the

package nozzles

22a and 22b, and packages the semiconductor dies 16 adsorbed to the tips of the

package nozzles

22a and 22b on the substrates 15.

After the semiconductor dies 16 are mounted on the substrates 15, the control unit 50 moves the mounting

heads

21a and 21b to the initial positions, moves the intermediate stage to the first position, and continues the package pickup operation for the next semiconductor die 16, as shown in fig. 6.

When the plurality of semiconductor dies 16 are arranged and packaged in the Y direction on the substrate 15, the control unit 50 moves the respective package heads 21a and 21b so that the distances between the respective pick-up

positions

13a and 13b and the

respective package positions

14a and 14b become equal to each other, thereby packaging the plurality of semiconductor dies 16. For example, as shown in fig. 1, when the semiconductor die 16 is mounted on the Y-direction negative side end portion of each substrate 15, the semiconductor die 16 is mounted at a position shifted by Δ Y1 from the initial mounting position to the Y-direction positive side. In this case, since the Y-direction distance between the package positions 14a and 14b is W1, the distances between the

pickup position

13a and 13b and the package positions 14a and 14b are equal, and the package heads 21a and 21b are moved in the Y-direction at the same acceleration and the same speed as described above, so that they can be simultaneously started up, and simultaneously reach the package positions 14a and 14b, so that the package heads 21a and 21b are simultaneously stopped.

As described above, in the bonding apparatus 100 according to the present embodiment, since the package heads 21a and 21b are arranged in the Y direction on one side of the linear guide 20, the space on the side of the linear guide 20 where the package heads 21a and 21b are not arranged can be used as the arrangement space of another device. Therefore, a reduction in the installation space can be achieved. Further, since the control unit 50 simultaneously starts the respective package heads 21a and 21b from the pickup position 13a and the pickup position 13b in the same direction and simultaneously stops the same by reaching the package positions 14a and 14b, it is possible to suppress the influence of the vibration caused by the movement of the other package head 21b on the package accuracy in the pickup operation or the package operation of one of the package heads 21a, thereby improving the package accuracy.

Next, a case where the respective distances between the pickup positions 13a and 13b and the package positions 14a1 and 14b are different will be described.

As shown in fig. 9, when the semiconductor die 16 is packaged at the Y-direction negative-side end of the substrate 15 on the Y-direction negative side (near side) and the Y-direction positive-side end of the substrate 15 on the Y-direction positive side (far side), the distance W2 between the near-side packaging position 14b and the far-side packaging position 14a1 is greater than the distance W1 between the near-side pickup position 13b and the far-side pickup position 13 a. In this case, the distance Δ Ya1 between the pickup position 13a on the far side and the package position 14a1 on the far side is greater than the distance Δ Yb between the pickup position 13b on the near side and the package position 14b on the near side. In this case, the control unit 50 simultaneously starts the respective package heads 21a and 21b by making the moving speed of the one package head 21b having a shorter moving distance slower than the moving speed of the one package head 21a having a longer moving distance, simultaneously reaches the respective package positions 14a1 and 14b by the

respective package nozzles

22a and 22b of the respective package heads 21a and 21b, and simultaneously stops the movement of the respective package heads 21a and 21b in the Y direction.

As shown in fig. 11, the controller 50 controls the speed of each of the packing heads 21a and 21 b. In fig. 11, dotted lines e and solid lines b show temporal changes in the speed of the respective package heads 21a and 21b, and in fig. 12, dotted lines f and solid lines d show temporal changes in the Y-direction positions of the respective package heads 21a and 21 b.

As shown by the dotted line e and the solid line b shown in fig. 11, the control unit 50 simultaneously activates the package heads 21a and 21b at time t 0. Since the lead sealing head 21b has a short travel distance, acceleration is stopped at time t11, and the lead sealing head 21b moves at a constant speed in the Y direction at a speed slower than that of the lead sealing head 21 a. On the other hand, the back side package head 21a continues acceleration up to the time t1 and moves at a constant speed from the time t1, as described above. Then, the pack head 21a on the back side decelerates from time t2, reaches the pack position 14a1 at time t3, and reaches a speed of zero at time t 3. The front side sealing head 21b continues to move at the same speed to time t12, starts decelerating from time t12, reaches the sealing position 14a1 at time t3, and reaches zero speed at time t 3.

At time t3, after the movement of the package heads 21a and 21b in the Y direction is stopped, the control unit 50 packages the semiconductor dies 16 sucked by the

package nozzles

22a and 22b of the package heads 21a and 21b on the substrates 15. After the semiconductor dies 16 are mounted on the substrates 15, the controller 50 moves the mounting

heads

21a and 21b to the initial positions and moves the intermediate stage 31 to the first position to continue the package pickup operation of the next semiconductor die 16, as shown in fig. 10.

As described above, in the bonding apparatus 100 according to the embodiment, when the distances Δ Ya1 and Δ Yb between the pickup position 13a and the pickup position 13b and the sealing positions 14a1 and 14b are different from each other, the moving speed of the sealing head 21b having a shorter moving distance is made slower than the moving speed of the sealing head 21a having a longer moving distance. Thus, even when the distances Δ Ya1 and Δ Yb between the pickup position 13a and the pickup position 13b and the sealing positions 14a1 and 14b are different from each other, the two sealing

heads

21a and 21b can be simultaneously started and stopped. In the picking-up operation or the packaging operation of one of the packaging heads 21a, the packaging accuracy can be improved by suppressing the influence of the interference of the vibration caused by the movement of the other packaging head 21b on the packaging accuracy.

Next, a description will be given of a bonding apparatus 200 according to another embodiment with reference to fig. 13 to 15. The same parts as those of the joining apparatus 100 described above with reference to fig. 1 to 12 are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 13, the bonding apparatus 200 has two linear guides 20 arranged in parallel in the Y direction, and two

package heads

21a, 21b, 21c, and 21d are attached to each linear guide 20. The respective package heads 21a and 21b are disposed so as to face the package heads 21c and 21d between the two linear guides 20. Therefore, the spaces on the side where the package heads 21a and 21b are not arranged and the spaces on the side where the package heads 21c and 21d are not arranged of the linear guides 20 can be set as spaces for other devices, and the installation space can be further reduced compared to the case where two bonding apparatuses 100 are arranged.

In addition, the joining device 200 is provided with two guide rails 30 and two intermediate stages 31 guided by the respective guide rails 30. Further, two pickup heads 33 are attached to a guide frame 32 extending in the X direction.

The operation of the joining device 200 configured in the above-described manner will be explained.

The controller 50 moves the two pick-up heads 33 in the X direction, and places one semiconductor die 16, for a total of four, on each of the tables 17 of the intermediate stage 31 from the two wafers 35.

Similarly to the description with reference to fig. 4, as shown in fig. 14, the control unit 50 moves the respective package heads 21a, 21b, 21c, 21d toward the Y direction negative side so that the centers of the respective package heads 21a, 21b, 21c, and 21d and the

respective package nozzles

22a, 22b, 22c, and 22d of the package head 21d are the pickup position 13a and the pickup position 13 b. At this time, the control unit 50 simultaneously starts the respective package heads 21a, 21b, 21c, and 21d from the initial positions to the Y direction negative side, simultaneously reaches the pickup positions 13a and 13b at the centers of the

respective package nozzles

22a, 22b, 22c, and 22d, and simultaneously stops the movement of the respective package heads 21a, 21b, 21c, and 21d to the Y direction negative side. The semiconductor dies 16 are respectively sucked to the tips of the

package nozzles

22a, 22b, 22c, 22d of the package heads 21a, 21b, 21c, 21 d.

The controller 50 moves the respective package heads 21a, 21b, 21c, and 21d from the pickup positions 13a and 13b to the package positions 14a and 14b, as described above with reference to fig. 5. At this time, the control unit 50 simultaneously starts the respective package heads 21a, 21b, 21c, and 21d toward the Y direction positive side, simultaneously reaches the center of the

respective package nozzles

22a, 22b, 22c, and 22d to the

package position

14a and 14b, and simultaneously stops the movement of the respective package heads 21a, 21b, 21c, and 21d toward the Y direction positive side.

package nozzles

22a and 22b, and packages the semiconductor dies 16 adsorbed to the tips of the

package nozzles

22a and 22b on the substrates 15.

The bonding apparatus 200 of the present embodiment can reduce the installation space further than the bonding apparatus 100 in addition to the operation and effect of the bonding apparatus 100, and can package four semiconductor dies 16 at the same time by using four

package heads

21a, 21b, 21c, and 21d, thereby further increasing the packaging speed.

In the above description, the case where the two pick-up heads 33 pick up the semiconductor dies 16 from the two wafers 35 and place them on the respective stages 17 of the intermediate stage 31 has been described, but the present invention is not limited to this, and may be configured such that: each pick-up head 33 picks up the semiconductor die 16 from one wafer 35 and places the semiconductor die on each stage 17 of each intermediate stage 31.

Description of the symbols

10: base seat

11a, 11 b: conveying rail

12a, 12 b: packaging platform

12c, 12 d: position in Y direction

13a, 13 b: pick-up position

14a, 14a1, 14 b: packaging location

15: substrate

16: semiconductor bare chip

17: placing table

20: linear guide

21a, 21b, 21c, 21 d: packaging head

22a, 22b, 22c, 22 d: encapsulation nozzle

30: guide rail

31: intermediate platform

32: guide frame

33: pick-up head

34: pick-up nozzle

35: wafer with a plurality of chips

50: control unit

100. 2000: joining device

Claims

1. An electronic component packaging device for packaging an electronic component on a substrate or other electronic components, comprising:

a linear guide extending in a predetermined direction;

a plurality of packing heads arranged in a row in a predetermined direction and guided by the linear guide to move in the predetermined direction; and

a control unit that adjusts a position of the packaging head in a predetermined direction; and is

The control unit simultaneously activates the packaging heads in the same direction and simultaneously stops the packaging heads.

2. The electronic part packaging apparatus of claim 1,

each of the package heads is mounted with a package nozzle for picking up and packaging the electronic component, and is moved in a predetermined direction between a pick-up position where the electronic component is picked up by the package nozzle and a packaging position where the electronic component is packaged by the package nozzle of the package head

The control unit may simultaneously start the respective package heads from the respective pickup positions or the respective package positions in the same direction, and simultaneously stop the respective package heads from reaching the respective package positions or the respective pickup positions.

3. The electronic part packaging apparatus of claim 2,

a plurality of package stages holding the substrate on which the electronic parts are packaged or the substrate on which the other electronic parts are packaged on an upper surface; and is

The distances in the prescribed direction between each of the pickup positions and each of the package landings are equal.

4. The electronic part packaging apparatus of claim 3,

the substrate is packaged with a plurality of the electronic components in a predetermined direction, and

the control unit moves the respective package heads so that the respective distances between the respective pickup positions and the respective package positions become equal, and packages the plurality of electronic components.

5. The electronic part packaging apparatus according to claim 2 or 3,

the control section, in a case where respective distances between the respective pickup positions and the respective package positions are different,

the moving speed of the packaging head on the side with the shorter distance is made slower than the moving speed of the packaging head on the side with the longer distance.