JP4387825B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that moves a mounting head, picks up an electronic component from a predetermined component supply device by a suction nozzle provided in the mounting head, and mounts the electronic component on a printed board. More specifically, a beam that moves in the Y direction along guide rails of guide bodies provided on a pair of support bases fixed to the apparatus main body by driving a Y-axis drive source, and an X-axis provided on the beam. A mounting head that moves in the X direction along the guide rail by driving the drive source; and a plurality of component supply devices that supply electronic components, and the mounting head is driven by driving the Y-axis drive source and the X-axis drive source. The present invention relates to an electronic component mounting apparatus that moves in the X and Y directions, sucks and extracts electronic components from a predetermined component supply device by a suction nozzle provided in the mounting head, and mounts the electronic components on a printed board.

  In general, this type of electronic component automatic mounting apparatus is precisely manufactured so that the dimensions of the beam and the guide body are accurate in order to increase the mounting accuracy of electronic components on a printed circuit board.

However, when the electronic component mounting apparatus is operated, since the material of the beam and the guide body is different, for example, the former is aluminum and the latter is iron, there is a difference in thermal expansion between the beam and the guide body. The difference irregularly affects the accuracy of picking up electronic components from the component supply apparatus and the accuracy of mounting electronic components on the printed circuit board. For this reason, according to Japanese Patent Laid-Open No. 2002-94295, a technique for suppressing the bending due to temperature change between the beam (X frame) and the X linear guide is proposed.
JP 2002-94295 A

  However, one end of the X frame is supported by the slide block so that it can move in the longitudinal direction of the X frame, and the X frame is prevented from bending to a curve. The X frame is moved faster and stopped. In such a case, it may take time to stop the vibration at the time of stopping. Further, since the X frame is moved by the driving means in the longitudinal direction based on predetermined information (for calculating the expansion / contraction amount), the configuration is complicated.

  In view of this, the present invention has a simple structure to ensure the support rigidity of the beam, to make the end of the vibration at the stop due to the high-speed movement of the beam due to the operation of the electronic component mounting apparatus as much as possible, and the beam and the guide body to be heated. Even if it expands, it is possible to cope with this thermal expansion and to maintain high accuracy of picking up and picking up electronic components from the component supply device and mounting accuracy of electronic components on a printed circuit board.

For this reason, the first invention provides a beam that moves in the Y direction along the guide rails of the guide bodies respectively provided on the pair of support bases fixed to the apparatus main body by the drive of the Y-axis drive source. A mounting head that moves in the X direction along the guide rail by driving the X-axis drive source; and a plurality of component supply devices that supply electronic components; and by driving the Y-axis drive source and the X-axis drive source In the electronic component mounting apparatus that moves the mounting head in the X and Y directions, and sucks and picks up an electronic component from a predetermined component supply device by a suction nozzle provided in the mounting head, and mounts it on a printed circuit board. One of the support bases is provided with a plurality of supports provided at intervals in the longitudinal direction and having wide upper and lower portions and a narrow intermediate portion .

  According to a second aspect of the present invention, there is provided a beam that moves in the Y direction along the guide rails of the guide bodies respectively provided on the pair of support bases fixed to the apparatus main body by driving the Y-axis drive source. A mounting head that moves in the X direction along the guide rail by driving the X-axis drive source, and a plurality of component supply devices that supply electronic components. The drive by the Y-axis drive source and the X-axis drive source In an electronic component mounting apparatus in which the mounting head is moved in the X and Y directions, an electronic component is sucked out from the predetermined component supply device by a suction nozzle provided in the mounting head, and mounted on a printed circuit board. The support base is provided with two plate bodies and a space in the longitudinal direction between the two plate bodies. The wide upper and lower portions are fixed to the plate body, and the narrow intermediate portion is both. Multiple spaced from the board Characterized in that it consists of a reinforcement.

  The present invention has a simple configuration to ensure the support synthesis of the beam, and even if the beam and the guide body are thermally expanded due to the operation of the electronic component mounting apparatus, it can cope with this thermal expansion. It is possible to maintain high accuracy of picking up and taking out electronic components and mounting accuracy of electronic components on a printed circuit board.

  Hereinafter, embodiments will be described with reference to the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus 1, and FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and the components are supplied to the front and rear of the machine base (device main body) 2 of the electronic component mounting apparatus 1. A plurality of known component supply units 3 for supplying electronic components as a device one by one to a component pick-up position (component suction position) are arranged in parallel in four blocks. A supply conveyor 4 is provided at an intermediate portion of the mounting device 1 so that the transport direction of the printed circuit board P is the left-right direction. The supply conveyor 4 is provided with a positioning mechanism for positioning the printed circuit board P received from the upstream in the two positioning portions, and after the electronic components are mounted on the board P, the printed circuit board P is transported to the downstream apparatus.

  The lower part of the support bases 5A, 5B, and 5C extending in the front-rear direction is fixed to the machine base 2, and one guide body 6 is provided above the support bases 5A and 5C, and two guides are provided above the support base 5B. A body 6 is provided. All of the guide bodies 6 have the same structure and will be described with reference to FIG. 4, but only the guide body 6 above the support base 5A will be described for convenience of description.

  A concave portion extending in the front-rear direction is formed on the outer upper portion of the guide body 6, and a stator 7A (a linear motor 7 serving as a Y-axis drive source) is formed on the inner surface of a pair of opposed pieces that form the concave portion. A guide rail 8 extending in the front-rear direction is formed on the inner upper portion. A slider 9 to which the guide rail 8 is fitted is provided at the inner lower part, and a movable element 7B is provided at the outer lower part with a slight gap from the stator 7A. The guide rail 8 of the guide body 6 is driven by the linear motor 7. The slider 9 slides along the beam and the beam 10 moves in the Y direction.

  That is, by driving the linear motor 7, each slider 9 slides along the guide rail 8 of the guide body 6 above the support bases 5A and 5B, so that the beams 10 before and after the left part in FIG. When the slider 9 is moved along the guide rail 8 of the guide body 6 on the support bases 5B and 5C by driving the linear motor 7, the beams 10 before and after the right part in FIG. Move in the direction.

  As shown in FIGS. 2 and 5, each beam 10 has a head body 22 that moves along the upper and lower guide rails 21 in the longitudinal direction, that is, in the X direction by driving a linear motor 20 that is an X-axis drive source. Provided. A mover 20B of the linear motor 20 is fixed to a head base 23 to which the head body 22 is fixed via a fixing portion 24, and a slider 25 in which the guide rail 21 is fitted to the top and bottom of the head base 23 is provided. Provided.

  A mounting head 27 having a suction nozzle 26 for sucking and holding electronic components is provided below the head body 22. The suction nozzle 26 can be moved up and down by a vertical axis motor and a θ-axis motor (not shown) and can be rotated around a vertical axis. In addition, by making the mounting head 27 or the head body 22 vertically movable, the suction nozzle 26 may be emotionally movable as a result.

  The pair of mounting pieces facing the top and bottom of the beam 10 having a substantially H-shaped cross section has a small gap between the stator 20A of the linear motor 20 and the movable element 20B via the fixed portion 30. Provided.

  Next, the structure of the support bases 5A, 5B, and 5C will be described with reference to FIGS. First, the support base 5 </ b> B is composed of two plate bodies 30 and a support member 31 having a wide prism shape extending in the front-rear direction where the side surface portion is fixed between the two plate bodies 30. The lower part of the support member 31 is fixed to the machine base 2, and the two guide bodies 6 are fixed to the upper parts of the both plate bodies 30 and the support member 31, and a pair of front and rear beams in the left part of the electronic component mounting apparatus 1. 10 and the inner part of the pair of front and rear beams 10 in the right part of the electronic component mounting apparatus 1 are supported to enable guidance when moving in the front-rear direction.

  Next, the support bases 5A and 5C are provided so that each of the two plate bodies 32 is perpendicular to both the plate bodies 32 with a space in the longitudinal direction between the two plate bodies 32. The portion 33A is fixed to the plate body 32, and the narrow intermediate portion 33B is composed of a plurality of (four in this embodiment) thin plate-like reinforcing plates 33 spaced apart from both plate bodies 32, The lower portions of both plate bodies 32 and the reinforcing plate 33 are fixed to the machine base 2, and two guide bodies 6 are fixed to the upper portions of the both plate bodies 32 and the reinforcing plate 33, and the front and rear of the left part of the electronic component mounting apparatus 1. The outer portions of the pair of beams 10 and the outer portions of the pair of front and rear beams 10 on the right portion of the electronic component mounting apparatus 1 are supported to enable guidance when moving in the front-rear direction.

  By configuring the support bases 5A, 5B, and 5C in this way, when the beam 10 is made of, for example, aluminum and the guide body 6 is made of iron, when the electronic component mounting apparatus 1 is operated, Due to the difference in thermal expansion between the beam 10 and the guide body 6, even if each beam 10 expands and contracts, the difference can be received by the outer support bases 5A and 5C being in the left-right direction.

  Reference numeral 35 denotes a component recognition camera provided on the machine base 2 corresponding to the mounting head 27. The component recognition camera 35 picks up an image of the electronic component taken out from the component supply unit 3 and sucked and held by the suction nozzle 26, and is not shown in the drawing. Thus, the position of the electronic component is recognized.

  Reference numeral 40 denotes a board recognition camera provided on the mounting head 27, which images a positioning mark (not shown) attached to the printed board P positioned on the conveyor 4 and recognizes the position of the board P by a recognition processing apparatus (not shown). .

  With the above configuration, the operation of the electronic component mounting apparatus will be described. First, two printed circuit boards P are conveyed and positioned and fixed by a supply conveyor 4 from an upstream device by a conveyor (not shown). The electronic components taken out from the component supply unit 3 are placed on the printed circuit board P. Mounting is performed according to mounting data (data on the position in the XY direction, the orientation in the plane direction, and the type of electronic component) stored in a storage device (not shown).

  That is, in the Y direction, the linear motor 7 is driven and the slider 9 slides along the pair of guide rails 8 to move the beam 10, and in the X direction, the linear motor 20 is driven along the upper and lower guide rails 21. Thus, the slider 25 slides and the head body 22 and the mounting head 27 move without colliding, and moves so as to be positioned above the component supply unit 3 for storing the electronic components to be sequentially mounted. 3 is driven and the part can be taken out at the part picking position (part picking position). Therefore, the picking nozzle 26 is lowered by the vertical axis motor to pick up and pick up the electronic part, and rises to recognize the corresponding part. The electronic component is moved above the camera 35 and picked up and picked up by the suction nozzle 26, and the recognition processing device recognizes the position of the electronic component.

  Then, based on the recognition result by the recognition processing device, the amount of positional deviation is calculated by a control device (not shown), and the calculated result is added to the mounting data, and it is moved above the printed circuit board P and moved around the vertical axis by the θ-axis motor. The electronic component is mounted in a predetermined direction (angle) at a predetermined position of the printed circuit board P.

  The position of the substrate P positioned by the positioning unit on the conveyor 4 is recognized by the substrate recognition camera 40 by imaging a positioning mark (not shown) attached to the upper surface thereof. Even if the beam 10 on which the mounting head 27 on which the substrate recognition camera 40 is mounted is thermally expanded, the position of the substrate P is grasped each time the substrate P is positioned by the camera 40. The head 27 can be moved by correcting the displacement of the movement position of the head 27 due to expansion.

  In this case, in the left part of the electronic component mounting apparatus 1, the front and rear beams 10 and the suction nozzle 26 of the mounting head 27 moving along each beam 10 mount the electronic component on the left printed board P. In the right part, the front and rear beams 10 and the suction nozzle 26 of the mounting head 27 that moves along each beam 10 mount the electronic component on the right printed circuit board P.

  In this manner, the operation of the electronic component mounting apparatus 1 sequentially causes the beam 10 to thermally expand, but the support base 5B can be obtained by making the support bases 5A, 5B, and 5C as described above. The rigidity of the support base 5B and the beam 10 is ensured, and the rigidity for supporting the beam 10 can be secured. When the beam 10 is moved at a higher speed, the vibration is stopped when stopped. In the case where there is a difference in thermal expansion between the beam 10 and the guide body 6, the inner support base 5B is made strong, and the horizontal strength (rigidity) of the support bases 5A and 5C is higher than that of the support base 5B. Since the outer support bases 5A and 5C are in the left-right direction, the difference can be received, the deflection of the beam 10 is suppressed to a negligible range, and the beam 10, the guide body 6 and the like can be prevented from being damaged.

  In addition, since the positioning part of the printed circuit board P mentioned above is supported by the machine base 2, it can avoid that the bending of the support bases 5A and 5C reaches the positioning part and the printed circuit board P.

  In addition, in this case, since one of the pair of support bases for one beam is structured as described above, the direction in which the position of the suction nozzle is displaced is always a constant direction. The correction can be easily performed by controlling the linear motors 7 and 20 and the θ-axis motor by the control device.

  The support bases 5A and 5C are each provided with two plate bodies 32, and are provided so as to be orthogonal to both the plate bodies 32 with a space in the longitudinal direction between the two plate bodies 32. 33A and a plurality of reinforcing plates 33 having a narrow intermediate portion 33B, but without using a plate body, for example, by increasing the thickness of the reinforcing plate or increasing the number of reinforcing plates 33 However, it may be a beam support.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of an electronic component mounting apparatus. It is an AA arrow line view of FIG. It is a front view of an electronic component mounting apparatus. It is a right view of an electronic component mounting apparatus. It is an enlarged view of the left end part of a beam. It is a vertical side view of a beam.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Machine stand 3 Component supply unit 5A, 5B, 5C Support stand 6 Guide body 7 Linear motor 8 Guide rail 10 Beam 20 Linear motor 21 Guide rail 26 Adsorption nozzle 27 Mounting head 32 Plate body 33 Reinforcement plate 33A Wide width Upper and lower part 33B Narrow middle part

Claims (2)

A beam that moves in the Y direction along the guide rails of the guide bodies respectively provided on a pair of support bases fixed to the apparatus main body by driving of the Y-axis drive source, and driving of the X-axis drive source provided on this beam And a plurality of component supply devices for supplying electronic components, and the mounting head is moved in the X and Y directions by driving the Y axis drive source and the X axis drive source. is moved, in the electronic component mounting apparatus for mounting a predetermined said component supply device from the withdrawn to suck the electronic component on a printed board by the suction nozzles provided in the mounting head, the one of the support base, the longitudinal An electronic component mounting apparatus comprising: a plurality of supports provided at intervals in a direction and having wide upper and lower portions and a narrow intermediate portion . A beam that moves in the Y direction along the guide rails of the guide bodies respectively provided on a pair of support bases fixed to the apparatus main body by driving of the Y-axis drive source, and driving of the X-axis drive source provided on this beam And a plurality of component supply devices for supplying electronic components, and the mounting head is moved in the X and Y directions by driving the Y axis drive source and the X axis drive source. In the electronic component mounting apparatus that picks up an electronic component from a predetermined component supply device by a suction nozzle provided in the mounting head and mounts the electronic component on a printed circuit board, the one support base is set to 2 A plurality of reinforcing members in which a wide upper and lower portions are fixed to the plate body and a narrow intermediate portion is separated from both plates. Composed of body and An electronic component mounting apparatus according to claim Rukoto.

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