JP5155218B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that picks up an electronic component from a component supply device by suction using a suction nozzle and mounts the electronic component on a positioned substrate. In particular, a component supply device that supplies electronic components, a pair of beams that can be moved in one direction by a drive source, and a mounting head that includes a suction nozzle and is movable by the drive source in a direction along each beam. The present invention relates to an electronic component mounting apparatus provided.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In general, component supply devices for supplying electronic components are provided on both outer sides of a transfer device for transferring a substrate, and a pair of beams provided with mounting heads are provided corresponding to the component supply devices. That is, each beam corresponds to each component supply device, and the mounting head of one beam generally takes out an electronic component from only the corresponding component supply device and mounts it on the substrate.
JP 2006-286707 A

  However, when both mounting heads adsorb and hold electronic components and move to the mounting position of the substrate, the path of one mounting head interferes with the path of the other mounting head, so as to avoid interference, For example, when one mounting head is retracted in the Y-axis direction and then moved in the X-axis direction, this retracting operation results in a long path for one mounting head, resulting in time loss and mounting time. As a result, production efficiency was poor.

  Accordingly, an object of the present invention is to improve production efficiency as much as possible while avoiding interference between one mounting head and the other mounting head.

For this reason, the first invention comprises a component supply device provided with a plurality of component supply units for supplying electronic components, a pair of beams movable in one axial direction by a drive source, and a suction nozzle, respectively. One mounting head that can be moved by each drive source in the other axial direction along the beam and the other mounting head are provided, and the one mounting head and the other mounting head are driven by driving each driving source. The electronic component is mounted between the component supply device and the component supply device, and the electronic component is taken out from the component supply device by the suction nozzle provided in the one mounting head and the other mounting head. In the apparatus, an interference avoidance area that is set for the other mounting head when the one mounting head moves and the one mounting head should not enter is calculated, and the movement is started. When the direction of movement of one of the mounting heads toward the target position approaches the interference avoidance region in the one axial direction, the direction of the other axis is set as a trigger axis, and the movement of any one of the mounting heads that starts moving is performed. When the moving direction to the target position moves away from the interference avoidance area in the one axial direction, the direction of the one axis is set as a trigger axis, and the target position direction of the trigger axis of the mounting head is set so as to avoid the interference avoidance area And a control means for starting the movement to.

The second invention is the electronic component mounting apparatus according to claim 1, wherein said control means, moving to a different axial direction from the mounting head starts to move in the direction of the trigger axis said trigger shaft The starting position to start is determined such that the position of the mounting head in the trigger axis direction is out of the trigger axis direction range of the interference avoidance region.

  The present invention can improve the production efficiency as much as possible by moving the mounting head while avoiding the interference between the one mounting head and the other mounting head.

It is a schematic plan view of the electronic component mounting apparatus of an embodiment. It is a control block diagram. It is a flowchart which shows control when a mounting head moves. It is explanatory drawing of the path | route which a mounting head moves, avoiding interference. It is explanatory drawing of the other path | route where a mounting head moves, avoiding interference. It is a schematic plan view of the electronic component mounting apparatus of other embodiment.

  A first embodiment of an electronic component mounting apparatus for mounting electronic components on a printed circuit board, for example, a substrate will be described below with reference to FIGS. The electronic component mounting apparatus 1 includes a transport apparatus 2 that transports the printed circuit board P in the X direction, and one side of the transport apparatus 2, that is, the rear side (the rear side in the installed apparatus. For example, a component supply device 5 such as a cart in which a plurality of component supply units 13 are detachably arranged, and the other side of the transport device 2, that is, the front side (the front side in the installed device). , Provided in the lower part of FIG. 1 for supplying electronic components, for example, a component supply device 3 such as a cart in which a plurality of component supply units 13 are detachably arranged, and a pair of beams 7 movable in one direction by a drive source , 8 and mounting heads 10, 11 each having a suction nozzle and movable by each drive source in the direction along the beams 7, 8.

  The transport device 2 is disposed in an intermediate portion of the electronic component mounting device 1 and is sucked and held by the substrate supply unit that inherits the printed circuit board P from the upstream device and the suction nozzles 101 and 111 of the mounting heads 10 and 11. Positioning unit for positioning and fixing the printed circuit board P supplied from the substrate supply unit for mounting the electronic component, and a discharge unit for inheriting the printed circuit board P on which the electronic component is mounted by this positioning unit and conveying it to the downstream device It consists of.

  Each of the component supply devices 3 and 5 includes a feeder base 12, and a plurality of component supply units 13 are detachably arranged in each lane of each feeder base 12 so that various electronic components can be taken out. One by one is supplied to the part (part suction position).

  A pair of front and rear beams 7 (tray feeder 7 side) and a beam 8 on the other side (component feeder 3 side) that are long in the X direction are moved forward and backward by a pair of left and right front motors 9 by driving each Y direction linear motor 9. Sliders fixed to the beams slide along the extended guides and individually move in the Y direction. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9a fixed to lower portions of mounting plates provided at both ends of the beams 7 and 8. It consists of.

  The beams 7 and 8 are respectively provided with mounting heads 10 and 11 which move along the guide in the longitudinal direction (X direction) by an X-direction linear motor 23 (see FIG. 2). The directional linear motor includes a pair of front and rear stators fixed to the beams 7 and 8 and a mover provided on the mounting heads 10 and 11 between the stators.

  Accordingly, the mounting heads 10 and 11 are provided inside the beams 7 and 8 so as to face each other, and the components are taken out of the printed circuit board P on the positioning portion of the transport device 2 and the component supply unit 13 of the component supply devices 3 and 5. Move over the position.

  Each mounting head 10, 11 is provided with suction nozzles 101, 111 urged downward by, for example, four springs at predetermined intervals on the circumference. It is also possible to take out electronic components simultaneously from a plurality of component supply units 13 arranged in parallel by suction nozzles located at 3 o'clock and 9 o'clock positions. The suction nozzle can be moved up and down by a vertical axis motor 25 (see FIG. 2), and by rotating the mounting heads 10 and 11 around the vertical axis by a θ-axis motor 26 (see FIG. 2), each mounting head results. Each of the suction nozzles 10 and 11 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.

  The mounting heads 10 and 11 are provided with board recognition cameras 14 and 14, respectively, for imaging a positioning mark attached to the printed board P being positioned. Further, the component recognition camera 15 picks up images of the electronic components sucked and held by the suction nozzles at once.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 16 which is a control device. A ROM (Read Only Memory) 36 for storing a program related to this control and various types A RAM (Random Access Memory) 17 for storing data is connected via a bus line 18. Further, a monitor 20 for displaying an operation screen and the like and a touch panel switch 21 as an input means formed on the display screen of the monitor 20 are connected to the CPU 16 via an interface 22. The Y-direction linear motor 9 and the like are connected to the CPU 16 via a drive circuit 24 and an interface 22.

  The RAM 17 stores NC data for each type of printed circuit board P (substrate type) to be produced. This NC data is composed of operation data, setup data, mounting data, and the like. The operation data includes NC data name comments, the size of the printed circuit board in the X and Y directions, the thickness of the printed circuit board, the presence / absence of advanced parts, the height of advanced parts, and the board finishing mode. In addition, the component supply unit 13 for supplying electronic components to printed circuit boards of a plurality of different board types to be produced is mounted on the RAM 17 as much as possible, and even if the board type to be produced changes, the components of the component supply devices 3 and 5 Parts arrangement data set in advance so as to avoid the replacement operation of the supply unit 13 as much as possible are stored.

  The RAM 17 also stores component library data representing the characteristics of each electronic component composed of shape data, recognition data, control data, and component supply data.

  Further, for example, in the mounting data, the target position of the mounting head 10 when the mounting head 11 starts moving is stored in the RAM 17. The target position of the mounting head 11 is also stored in the RAM 17.

  A recognition processing device 27 is connected to the CPU 16 via the interface 17. The recognition processing device 27 performs recognition processing of an image captured by the board recognition camera 14 or the component recognition camera 15. The processing result is sent to the CPU 16. That is, the CPU 16 outputs an instruction to the recognition processing device 27 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the board recognition camera 14 or the component recognition camera 15, and also recognizes the recognition processing result. 27 is received.

  With the above configuration, the operation will be described below.

  First, the operator presses the touch panel switch 21 displayed on the monitor 20, designates the type of the printed circuit board P to be produced, and presses the operation switch, whereby the electronic component mounting apparatus 1 starts the production operation. .

  Then, as shown by the arrow 33, when the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply unit of the transport device 2, the printed circuit board P on the supply unit is moved to the positioning unit. The printed circuit board P is positioned and fixed in the plane direction and the vertical direction.

  When the printed circuit board P is positioned, the beam 8 on the near side moves in the Y-axis direction along the guide extending forward and backward by driving the Y-axis linear motor, and the mounting head 11 is moved by the X-axis linear motor. Moves in the X-axis direction, moves to above the component extraction position of the component supply unit 13, and lowers the suction nozzle 111 by driving the vertical axis motor to take out the electronic component from the component supply unit 13. In this case, the plurality of suction nozzles 111 can take out electronic components from the component supply unit 13 by moving and rotating the mounting head 10 in the X-axis direction and further raising and lowering the suction nozzles 111. Similarly to the beam 8 on the near side, the slider 7 slides along the guide extending in the front-rear direction by the drive of the Y-axis direction linear motor 9 and the slider 7 moves in the Y-axis direction and moves in the X-axis direction. The mounting head 10 is moved in the X-axis direction by the linear motor 23, moved to above the component extraction position of the component supply unit 13, and the suction nozzle 101 is lowered by driving the vertical axis motor to take out the electronic component from the component supply unit 13. . In this case, the plurality of suction nozzles 101 can take out the electronic components from the component supply unit 13 by moving and rotating the mounting head 11 in the X-axis direction and further raising and lowering the suction nozzles 101.

  That is, first, in accordance with, for example, steps of the mounting data, four electronic components are sequentially taken out from the component supply unit 13 of the component supply device 5 by the mounting head 11 provided on the beam 8 on the near side, and the component supply device. Four electronic components are sequentially taken out by the mounting head 10 provided on the back beam 7 from the third component supply unit 13. That is, the four suction nozzles 101 of the mounting head 10 provided on the back beam 7 sequentially take out the electronic components from the component supply unit 13 and at the same time, the 4 of the mounting head 11 provided on the front beam 8. Each of the mounting heads 10 and 11 picks up and picks up four electronic components according to the corresponding steps such that the book suction nozzle 111 takes out the electronic components from the component supply unit 13. At this time, the start of component suction by the counter head 10 on the front side and the start of component suction by the mounting head 10 on the back side, and the end of suction of all components by the mounting head 11 on the front side and the mounting head on the back side. There is a case where the end of the suction of all the parts by 10 is shifted.

  Further, after the removal, the suction nozzles 101 and 111 of both mounting heads 10 and 11 are raised so that the mounting heads 10 and 11 pass above the component recognition camera 15 and both mounting heads 10 and 11 are moved during this movement. The four suction nozzles 101 and 111 are respectively picked up and picked up by four electronic components, and the recognition processing device 27 recognizes the picked-up images to process the picked-up images. Grasp the misalignment of electronic components.

  Thereafter, the substrate recognition camera 8 provided on each mounting head 10, 11 of both beams 7, 8 is moved above each printed circuit board P, and the positioning applied to the printed circuit board P positioned on the transport device 2. The mark is picked up, and the picked-up image is recognized by the recognition processing device 27 to grasp the position of each printed circuit board P. Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top.

  That is, the suction nozzle 111 of the mounting head 11 provided on the beam 8 on the near side sequentially mounts the electronic components supplied and sucked and held from the component supply device 3 on the printed circuit board P while correcting the back side beam. The suction nozzle 101 of the mounting head 10 provided in 7 sequentially mounts electronic components supplied from the component supply device 5 and held by suction on the printed circuit board P while correcting them. In this case, the CPU 16 controls the corresponding Y-axis direction linear motor 9 and X-axis direction linear motor 23 so that the mounting head 10 and the mounting head 11 of both beams 7 and 8 do not collide, that is, do not interfere with each other. At this time, the start of component mounting by the mounting head 11 on the front side and the start of component mounting by the mounting head 11 on the back side, the end of mounting of all components by the opposing head 10 on the front side, and the own head on the back side. In some cases, the end of the mounting of all the parts by 11 is shifted.

  Hereinafter, an operation for avoiding interference between the mounting heads when the mounting head 10 on the back side and the mounting head 11 on the near side move will be described.

  For example, the mounting head (hereinafter referred to as the own head) 11 that is the subsequent mounting head moves after the mounting head (hereinafter referred to as the opposing head) 10 that is the preceding mounting head starts to move based on the mounting data. The case of starting will be described.

First, when the opposing head 10 starts to move in order to mount an electronic component on the printed circuit board P, that is, when the CPU 16 outputs an operation command, the CPU 16 passes the driving circuit 24 to the X-axis direction related to the opposing head 10. An operation signal is output to the linear motor 23 and the Y-axis direction linear motor 9, each linear motor operates, the XY axes start, and the opposed head 10 immediately starts moving. The opposing head 10 moves until the opposing head 10 reaches the target position and the positioning is completed.
During the movement of the opposed head 10, the CPU 16 acquires the target position stored in the RAM 17 for the opposed head 10 (as will be described later, the target position is stored as the own head when the movement is started). To do. Further, the CPU 16 reads and acquires information of a detector such as an encoder for detecting the current position of the opposing head 10 in the linear motors 9 and 23 in the X direction and the Y direction. Based on the acquired target position and current position, an operation area (hereinafter referred to as an interference avoidance area) for avoiding interference is calculated by the CPU 16 and temporarily stored in the RAM 17. For example, as shown in FIG. 4, the interference avoidance region 72 is a current position 70 before the start of movement, which is the current position of the opposing head 10, and a movement target position, for example, a mounting position of a printed board (hereinafter referred to as a target position). ) In order to reliably avoid interference with another head, that is, the head 11 around the rectangular lock area (inside the area indicated by the dotted line 73) whose diagonal line connecting to 71 is a diagonal line. This is an area where a preset safety area is added in consideration of the moving speed of the head and the like. Each side of the rectangular interference avoidance area 72 is set parallel to the X-axis direction and the Y-axis direction.

  Note that the method for setting the interference avoidance area is not limited to the above-described method, and avoids interference between both heads when the own head (one mounting head) 11 or the opposite head (the other mounting head) 10 moves. What is necessary is just to set as an area | region for doing.

  Further, the target position of the head 11 is stored in the RAM 17, and the CPU 16 stores the target position stored in the RAM 17 for the head 11 that starts moving from the stopped state after the opposing head 10 starts moving. The position is acquired, and further the current position of the head 11 is acquired.

  Next, interference avoidance control when the head 11 moves will be described in detail based on the flowchart shown in FIG. 3 and the route explanatory diagram shown in FIG.

  First, the CPU 16 acquires information on an interference avoidance area from the RAM 17 (step 1). Then, the trigger axis is determined based on the data of the interference avoidance area 72 when the own head 11 moves and the moving direction of the own head 11 that starts moving (step 2).

  At the time of determining the trigger axis, the moving direction of the head 11 to start moving to the target position is the direction of approaching the interference avoidance region 72 in the direction of one axis that is the moving direction of the beam 8, that is, the Y-axis direction. In this case, the other axis, that is, the direction of the X axis is determined as the trigger axis. When the movement direction of the head 11 to the target position is a direction away from the interference avoidance region 72 in the Y-axis direction, the Y-axis (one axis) direction is determined as the trigger axis.

  That is, when the Y-axis direction in the direction of movement of the head 11 from the current position 76 to the target position 77 as indicated by the solid line arrow 75 in FIG. The direction of the X axis is determined as the trigger axis. Hereinafter, the arrow 78 is a trigger shaft 78.

  Further, the CPU 16 sets the starting position, which is the position at which the head 11 that has started moving in the direction of the trigger shaft 78, starts moving in an axial direction different from the trigger shaft 78, that is, in the Y-axis direction, in the interference avoidance region 72. Obtained based on the data (step 3).

  The starting position is determined such that the position of the head 11 in the trigger axis 78 direction is out of the range of the interference avoidance area 72 in the trigger axis 78 direction (range 80 shown in FIG. 4). As shown in FIG. 4, the activation position 81 is a position further away from the range 80 to the outside of the dimension 82 set in advance in the X-axis direction, and the activation position 81 is determined in this way. Interference with the opposing head 10 during the movement can be reliably avoided.

  Note that, for example, the activation position may be closer to the current position 76 in accordance with the interval in the Y-axis direction between the head 11 and the interference avoidance region 72, that is, the larger the interval, the trigger axis 78 direction of the interference avoidance region 72 is. It may be located within the range (range 80 shown in FIG. 4). By doing in this way, the path | route until the self-head 11 reaches | attains a target position can be shortened as much as possible, As a result, production efficiency can be improved as much as possible.

  Then, the X-direction drive motor 23 is driven based on the signal from the CPU 16, and the trigger shaft is activated (step 4). The own head 11 first moves along the beam 8 while maintaining a distance from the interference avoidance region 72. As a result, the own head 11 moves in the direction of the trigger shaft 78 while avoiding interference with the opposing head 10. can do.

  During the movement of the trigger shaft 78, the CPU 16 reads and acquires information of a detector such as an encoder provided in the linear motor 23 with respect to the current position of the head 11 in the trigger axis direction in the X direction (step 5). Then, after the head 11 starts moving in the direction of the trigger shaft 78, the CPU 16 starts the movement of the current position of the head 11 in the direction of the trigger shaft 78 in the Y-axis direction, that is, another axis. It is determined whether or not the starting position 81 in the direction has been reached (step 6).

  When the CPU 16 determines that the head 11 has moved and the current position in the trigger axis direction has reached the starting position 81, the CPU 16 outputs a signal, and the Y-direction drive motor 9 is driven based on this signal. One axis is activated (step 7). As a result, as indicated by a broken line arrow 83 in FIG. 4, the own head 11 moves in the Y-axis direction different from the trigger shaft 78 direction along with the trigger shaft 78 direction while avoiding interference with the opposing head 10. Start. As a result, during the movement of the head 11 in the direction of the trigger shaft 78, the movement in the Y-axis direction can be started as quickly as possible while avoiding the interference with the opposing head 10, thereby improving the production efficiency as much as possible. it can.

  Thereafter, the CPU 16 continues to read and acquire information on detectors such as encoders provided in the linear motors 9 and 23 in the X direction (trigger axis direction) and the Y direction as to the current position of the head 11. It is determined whether or not the position 77 has been reached, that is, whether or not the positioning has been completed, and the completion is awaited (step 8).

  When the head 11 reaches the target position 77 and positioning is completed, the linear motors 9 and 23 stop simultaneously at the target position.

In the above example, the head 11 has reached the target position 77 at the same time in the ■ direction and the Y-axis direction. However, the head 11 only needs to move while avoiding interference with the opposing head 10, and either The head direction may reach the target position (coordinates) first. For example, the head 11 has reached the target position earlier than the other direction in either the X direction (trigger axis direction) or the Y direction. Sometimes, the movement in the reached direction stops first, and the head 11 moves only in the unreached direction.

  Hereinafter, another interference avoidance control when the head 11 moves will be described based on the flowchart shown in FIG. 3 and the route explanatory diagram shown in FIG. 5. In addition, about the structure similar to FIG. 4, the same code | symbol is attached | subjected and the detailed description is abbreviate | omitted.

  First, the CPU 16 acquires information on the interference avoidance area from the RAM 17 as in the example shown in FIG. 4 (step 1). Then, the trigger axis is determined based on the data of the interference avoidance area 72 when the own head 11 moves and the moving direction of the own head 11 that starts moving (step 2).

  That is, when the Y-axis direction in the direction of movement of the head 11 from the current position 96 to the target position 97 as indicated by the solid line arrow 95 in FIG. Thus, the direction of the Y axis is determined as the trigger axis. Hereinafter, the arrow 98 is referred to as a trigger shaft 98.

  Further, the CPU 16 sets the starting position, which is the position where the head 11 that has started moving in the direction of the trigger shaft 98, starts moving in the axial direction different from the trigger shaft 98, that is, in the X-axis direction, in the interference avoidance region 72. Obtained based on the data (step 3).

  The starting position is determined so that the position of the head 11 in the trigger axis 98 direction is out of the range of the interference avoidance region 72 in the trigger axis 98 direction (range 90 shown in FIG. 5). As shown in FIG. 5, the starting position 91 is a position further away from the range 90 outside the dimension 92 set in advance in the Y-axis direction, and the starting position 91 is thus determined. Interference with the opposing head 10 during the movement can be reliably avoided.

  Note that, for example, the activation position may be closer to the current position 96 according to the distance in the X-axis direction between the head 11 and the interference avoidance area 72, that is, the larger the distance, the trigger axis 98 direction of the interference avoidance area 72 is. It may be located within the range (range 90 shown in FIG. 5). By doing in this way, the path | route until the own head 11 arrives at the target position can be shortened as much as possible.

  Then, the Y-direction drive motor 9 is driven based on the signal from the CPU 16, and the trigger shaft is activated (step 4). First, the beam 8 moves, and the head 11 moves while maintaining a distance from the interference avoidance region 72. As a result, the head 11 moves in the direction of the trigger axis 98 while avoiding interference with the opposing head 10. can do.

  During the movement of the trigger shaft 98, the CPU 16 reads and acquires information of a detector such as an encoder provided in the linear motor 9 in the Y direction for the current position of the head 11 in the trigger axis direction (step 5). After the head 11 starts moving in the trigger shaft 98 direction, the CPU 16 starts the movement of the current position of the head 11 in the trigger shaft 98 direction in the X-axis direction, that is, another axis. It is determined whether or not the starting position 91 in the direction has been reached (step 6).

  When the CPU 16 determines that the head 11 has moved and the current position in the trigger axis direction has reached the starting position 91, the CPU 16 outputs a signal, and the X-direction drive motor 23 is driven based on this signal. One axis is activated (step 7). As a result, as indicated by a broken line arrow 93 in FIG. 5, the own head 11 moves in the X axis direction, which is different from the trigger axis 98 direction, while avoiding interference with the opposing head 10. Start.

  Thereafter, the CPU 16 continues to read and acquire information on detectors such as encoders provided in the linear motors 9 and 23 in the X direction (trigger axis direction) and the Y direction as to the current position of the head 11. It is determined whether or not the position 97 has been reached, that is, whether or not the positioning has been completed, and the completion is awaited (step 8).

  When the head 11 reaches the target position 97 and the positioning is completed, the linear motors 9 and 23 are stopped.

  In this example as well, when the head 11 moves, the head 11 reaches the target position in one of the X direction (trigger axis direction) and the Y direction earlier than the other. The movement in the direction stops first, and the head 11 moves only in the unreachable direction.

  In the above-described embodiment, the example in which the own head 11 moves while avoiding interference with the opposing head 10 has been described. However, the own head 10 is not the opposing head, but another structure, for example, a component supply unit. 13, in the case of a tray unit in which trays for supplying electronic components are stacked, in order to avoid interference with the tray unit, as shown in the flowchart of FIG. It may be determined and the head 11 may be moved.

  Further, when the head 11 may interfere with the opposed beam 7 and moves while reliably avoiding the interference with the beam 7, the trigger shaft and the activation position as shown in the flowchart of FIG. May be determined and the head 11 may be moved.

  Furthermore, for example, when the head 11 moves to discard an electronic component that has missed suction, the head 11 moves while avoiding the top of the printed circuit board with a flux that needs to avoid dropping the electronic component as much as possible. Alternatively, the printed circuit board may be used as an interference avoidance area, and the trigger axis and the activation position may be determined as shown in the flowchart of FIG.

  Further, as shown in FIG. 6, both the head 11 and the opposing head 10 enter, for example, above the component supply device 5 to avoid the interference of the mounting heads when taking out the electronic components. As described above, the interference between the heads can be avoided by controlling according to the flowchart shown in FIG.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 5 Component supply apparatus 7, 8 Beam 10 Mounting head (opposite head)
11 Mounting head (own head)
13 Component supply unit 16 CPU (control device)
17 RAM (Storage device 72 Interference avoidance area 78, 98 Trigger shaft 81, 91 Start position 101, 111 Suction nozzle P Printed circuit board

Claims (2)

A component supply device provided with a plurality of component supply units for supplying electronic components, a pair of beams that can be moved in one axial direction by a drive source, and the other axial direction along each of the beams, each having a suction nozzle One mounting head and the other mounting head that are movable by each driving source, and driving each driving source to connect the one mounting head and the other mounting head between the substrate and the component supply device. In the electronic component mounting apparatus for removing the electronic component from the component supply device by the suction nozzle provided in the one mounting head and the other mounting head and mounting the electronic component on the substrate,
It is set for the other mounting head when the one mounting head moves, calculates an interference avoidance area where the one mounting head should not enter, and moves to the target position of any one of the mounting heads. When the moving direction approaches the interference avoidance region in the one axial direction, the direction of the other axis is used as a trigger axis, and the moving direction to the target position of any one of the mounting heads that starts moving is the one axial direction And a control means for starting movement of the mounting head in the direction of the target position of the trigger shaft so as to avoid the interference avoidance region when the direction of the one axis is away from the interference avoidance region. An electronic component mounting apparatus characterized by that. The control means determines a starting position where the mounting head that has started moving in the direction of the trigger axis starts moving in an axial direction different from the trigger axis, and a position in the trigger axis direction of the mounting head avoids the interference. The electronic component mounting apparatus according to claim 1, wherein the position is determined to be out of a range in the trigger axis direction of the region .

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