JP2010225704A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve mounting precision of an electronic component on a circuit board in accordance with temporal change of a beam. <P>SOLUTION: A CPU 21 controls a mounting operation for an electronic component by a suction nozzle associated with one mounting head having the suction nozzle for mounting the electronic component on a printed board first based upon a recognition result obtained by performing recognition processing on an image, picked up by a substrate recognition camera 12 provided to the one mounting head, by a recognition processing device 29, and also controls a mounting operation for an electronic component by a suction nozzle associated with the other mounting head while taking into consideration of the recognition result obtained by performing recognition processing on the image, picked up by the substrate recognition camera 12 provided to the one mounting head, by the recognition processing device 29, and a difference stored in a RAM 23. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component supply device that supplies electronic components, a pair of beams that can be moved in one direction by a driving source, a mounting head that can be moved by a driving source in a direction along each beam, and each mounting head. And a board recognition camera that picks up a position confirmation recognition mark attached to the positioned circuit board. The image picked up by the board recognition camera is recognized by the recognition processing device, and the recognition result is obtained. The present invention relates to an electronic component mounting apparatus for mounting an electronic component taken out by a suction nozzle provided in the mounting head from the component supply device on a circuit board.

  An electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but generally, a recognition mark attached to a printed circuit board that is a circuit board by a substrate recognition camera provided on one mounting head for first mounting an electronic component. The image picked up by the substrate recognition camera is recognized by the recognition processing device, and the suction nozzle provided on the one mounting head from the component supply device based on the recognition result, that is, the position of the printed circuit board. The taken out electronic component is mounted on the printed circuit board. The other mounting head is also imaged by the board recognition camera provided on the other mounting head, recognized, and the other mounting head is mounted from the component supply device based on the recognition result. The electronic component taken out by the suction nozzle provided in the head is mounted on the printed circuit board.

JP 2003-283194 A

  However, each printed circuit board to be produced was picked up and recognized by the board recognition camera provided on the mounting head that moves along both beams, which is a problem in improving printed circuit board production efficiency. Met.

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to improve the production efficiency of a circuit board, and further to improve the mounting accuracy of electronic components on the circuit board in response to changes in the beam over time.

For this reason, the first invention is a component supply device that supplies electronic components, a pair of beams that can be moved in one direction by a drive source, a mounting head that can be moved by a drive source in a direction along each beam, A board recognition camera that images a recognition mark for position confirmation attached to a circuit board that is provided in each mounting head, and a recognition processing device recognizes an image captured by the board recognition camera, In the electronic component mounting apparatus for mounting the electronic component taken out by the suction nozzle provided in the mounting head from the component supply device on the circuit board based on the recognition result,
A storage device for storing the difference between the coordinates of the recognition mark on the circuit board obtained by imaging by the board recognition camera corresponding to one beam and the coordinates of the recognition mark obtained by imaging by the board recognition camera corresponding to the other beam When,
The mounting operation of the electronic component by the suction nozzle according to one mounting head having the suction nozzle for mounting the electronic component first on the circuit board is performed by recognizing the image captured by the board recognition camera provided on the one mounting head. In addition to controlling based on the recognition result of the recognition processing by the processing device, the mounting operation of the electronic component by the suction nozzle related to the other mounting head is performed by recognizing the image captured by the board recognition camera provided in the one mounting head. There is provided a control device that performs control based on a recognition result recognized by the processing device and a difference stored in the storage device.

  According to a second invention, in the first invention, each time a predetermined time elapses by a timer, a board recognition camera provided in a mounting head provided on both beams images the recognition mark attached to the circuit board, respectively. The recognition processing device performs recognition processing, and stores the difference between the recognition mark coordinates of the circuit board corresponding to one beam and the recognition mark coordinates corresponding to the other beam in the storage device.

  According to a third invention, in the first invention, for each predetermined number of circuit boards produced, a board recognition camera provided on a mounting head provided on both beams picks up a recognition mark attached to the circuit board. Then, the recognition processing device performs recognition processing, and the difference between the recognition mark coordinates of the circuit board corresponding to one beam and the recognition mark coordinates corresponding to the other beam is stored in the storage device. And

  According to the present invention, while improving the productivity of a circuit board, it is possible to improve the mounting accuracy of electronic components on a circuit board without lowering the production efficiency of the circuit board in response to changes in the beam over time. Can do.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows the flowchart which concerns on board | substrate recognition.

  An embodiment of an electronic component mounting apparatus 1 for mounting an electronic component on a printed circuit board P, which is a circuit board provided with a circuit on the substrate, will be described below with reference to FIG. The electronic component mounting device 1 includes a transport device 2 for transporting the printed circuit board P, a component supply device 3 for supplying electronic components disposed on the front side and the back side across the transport device 2, and a drive. A pair of beams 4A and 4B movable in one direction (Y direction) by a source and a plurality of (for example, twelve) suction nozzles 5 respectively, and each drive source in a direction along each of the beams 4A and 4B. A movable mounting head 6 is provided.

  The transport device 2 is disposed at an intermediate portion of the electronic component mounting device 1 and mounts a substrate supply unit that inherits the printed circuit board P from the upstream device and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head 6. In order to do so, the printed circuit board P is supplied with a printed circuit board P. The printed circuit board P is positioned and fixed, and the printed circuit board P on which the electronic component is mounted is transferred to the downstream device. Is done.

  The component supply device 3 includes a feeder base 3A attached to the main body of the electronic component mounting device 1, and a plurality of electronic components arranged in parallel on the feeder base 3A, one for each component take-out portion (component suction position). It is composed of a group of component supply units 3B that supply each one. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, the electronic components are supplied one by one to the component extraction position of the component supply unit 3B, and are extracted from each storage portion by the suction nozzle 5 of the mounting head 6.

  The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved by sliding the sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 7. Move in the Y direction. The Y-direction linear motor 7 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 9, respectively. A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

  Each mounting head 6 is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor 10, and the mounting head 6 is rotated around a vertical axis by a θ-axis motor 11. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 8 denotes a component recognition camera for imaging an electronic component sucked and held by the suction nozzle 5, and reference numeral 12 denotes a substrate recognition camera 12 for capturing a recognition mark for confirming the position of the printed circuit board P, which is mounted on each mounting head 6. Has been.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 21 and stores a ROM (Read Only Memory) 22 for storing a program related to this control and various data. A RAM (Random Access Memory) 23 is connected via a bus line 24. Further, a monitor 25 for displaying an operation screen and the like, and a touch panel switch 26 as input means formed on the display screen of the monitor 25 are connected to the CPU 21 via an interface 27. The Y-direction linear motor 9 and the like are connected to the CPU 21 via a drive circuit 28 and an interface 27.

  The RAM 23 stores mounting data as shown in FIG. 3 for each type of printed circuit board P. This mounting data is used for mounting each electronic component in the printed circuit board P for each mounting order (step number). Coordinate X direction, Y direction and mounting angle information, arrangement number information of each component supply unit 3B (feeder arrangement number of the rear side component supply unit 3B group is 100 series, feeder arrangement number of the front side component supply unit 3B group No. 200), suction nozzle number information (indicated by “1” to “12”), number information of the mounting head 6 (the mounting head provided on the back beam 4A is “1”, the front beam 4B) The mounting head provided in (2) is configured with “2”.

  The RAM 23 stores information on the type (component ID) of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 3B, that is, component arrangement data. Parts library data representing features and the like are also stored.

  A recognition processing device 29 is connected to the CPU 21 via the interface 27. The recognition processing device 29 performs recognition processing of an image captured by the board recognition camera 8 or the component recognition camera 12. The processing result is sent to the CPU 21. That is, the CPU 21 outputs an instruction to the recognition processing device 29 so as to perform recognition processing (calculation of misalignment amount, etc.) on an image captured by the board recognition camera 8 or the component recognition camera 12, and also recognizes the recognition processing result. 29 is received.

  With the above configuration, when the setup change is completed and the electronic component mounting apparatus 1 is automatically operated, the first printed board P is transported from the upstream apparatus to the board positioning unit by the transport apparatus 2, and is positioned and fixed by the positioning mechanism. The

  Next, according to the mounting data as shown in FIG. 3 stored in the RAM 23, each mounting head 6 moves, and the electronic component to be mounted by the suction nozzle 5 corresponding to the component type of the electronic component is set to a predetermined component supply unit 3B. Take it out by adsorption. More specifically, the suction nozzle 5 with the nozzle number “2” of the mounting head with the head number “1” (hereinafter referred to as the mounting head with the back side) 6 provided on the back beam 4A has the step number “0001”. It moves so as to be positioned above the component supply unit 3B of the feeder number “103”. In the Y direction, the Y direction linear motor 7 is driven to move the beam 4A, and in the X direction, the X direction linear motor 9 is driven. Since the mounting head 6 on the back side has moved and the component supply unit 3B has already been driven by the feed motor and the peeling motor, and the component can be taken out at the component pickup / removal position, the vertical axis motor 10 is in the suction state. The nozzle 5 is lowered to suck and take out the electronic components, and then the mounting head 6 on the back side is raised.

  Next, as described above, the mounting head 6 on the back side moves above the component supply unit 3B of the feeder number “107” of the step number “0002” and the vertical axis motor 10 has the nozzle number “4”. The electronic components up to the step number “0012” are placed on the 12 suction nozzles 5 of the mounting head 6 on the back side so that the suction nozzle 5 is lowered to pick up and take out the electronic components, and then the mounting head 6 is lifted. Is taken out and held by suction.

  Then, the mounting head 6 on the back side moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit. While moving the mounting head 6, the component recognition is performed while moving. The electronic component sucked and held by each suction nozzle 5 when passing the upper position of the camera 8 is imaged by the component recognition camera 10 (fly recognition).

  Based on this imaging result, the recognition processing device 29 recognizes how much the electronic component is displaced and held with respect to the suction nozzle 5 by the recognition processing device 29, and the Y-direction linear motor 7 is recognized. The suction nozzle 5 that holds the electronic component by driving the X-direction linear motor 9 moves to the printed circuit board P.

  Then, before the electronic component is mounted on the printed circuit board P, control relating to the circuit board recognition as shown in the flowchart of FIG. 4 is performed. First, whether or not the CPU 21 is in a mode of correcting using the difference in the processing step S101. Is judged. And if it is not the mode which judges based on the setting data set to RAM23 and correct | amends using a difference, the board | substrate provided in the mounting head 6 attached to one beam 4A which mounts an electronic component first. The recognition camera 12 images the recognition marks M1 and M2 attached to the printed circuit board P, and the recognition processor 29 recognizes the image captured by the board recognition camera 12 provided on the mounting head 6 on the back side. Based on the recognition result, that is, the position of the printed circuit board, the electronic component taken out by the suction nozzle 5 provided on one mounting head 6 from the component supply unit 3B is mounted on the printed circuit board P and the other beam. When the suction nozzle 5 of the mounting head 6 attached to 4A is used for mounting, the substrate recognition camera 12 provided on the mounting head 6 on the back side described above takes a picture. So that the control for mounting electronic components on the printed circuit board P is performed by using the recognition result of the recognition processing by the recognition processing device 29 with.

  When the CPU 21 determines in the processing step 101 that the mode is a correction mode using the difference, the timing at which the difference in the processing step S102 is calculated and stored before the electronic component is mounted on the printed circuit board P. Therefore, the board recognition camera 12 provided on the mounting head 6 on the back side images the recognition marks M1 and M2 attached to the printed circuit board P, and the recognition processing device 29 performs recognition processing to determine the position of the printed circuit board P. Be grasped. That is, the coordinates of the recognition mark M1 captured by the substrate recognition camera 12 attached to the mounting head 6 attached to the back beam 4A and recognized by the recognition processor 29 are (Xa1, Ya1). The coordinates of the recognition mark M2 are (Xa2, Ya2) and are stored in the RAM 23.

  On the other hand, during the operation of taking out the electronic component from the component supply unit 3B before the mounting component 6 on the back side mounts the electronic component on the printed circuit board P, the front side provided in the beam 4B on the near side. The board recognition camera 12 attached to the mounting head 6 on the side picks up the recognition marks M1 and M2 attached to the printed board P, and the recognition processing device 29 performs recognition processing to grasp the position of the printed board P. At this time, the coordinates of the recognition mark M1 captured by the substrate recognition camera 12 attached to the mounting head 6 attached to the beam 4B on the near side and recognized by the recognition processing device 29 are (Xb1, Yb1). ), The coordinates of the recognition mark M2 are (Xb2, Yb2) and are stored in the RAM 23.

  In processing step S103, the coordinates (Xa1, Ya1) of the recognition mark M1 obtained by imaging by the substrate recognition camera 12 of the beam 4A and the coordinates of the recognition mark M1 obtained by imaging of the substrate recognition camera 12 of the beam 4B ( Xb1, Yb1) (ΔX1 = Xb1−Xa1, ΔY1 = Yb1−Ya1) and the coordinates (Xa2, Ya2) of the recognition mark M2 obtained by the substrate recognition camera 12 of the beam 4A. The CPU 21 calculates the difference (ΔX2 = Xb2−Xa2, ΔY2 = Yb2−Ya2) from the coordinates (Xb2, Yb2) of the recognition mark M1 obtained by imaging the substrate recognition camera 12 of the beam 4B. Stored in the RAM 23.

  In other words, prints that have been imaged by the substrate recognition camera 12 attached to the mounting head 6 on the back side and recognized by the recognition processing device 29 at the mounting coordinates of the mounting data from step numbers “0001” to “0012”. The Y direction linear motor 7, the X direction linear motor 9 and the θ axis motor 11 are corrected and controlled by the CPU 21 in consideration of the position recognition result of the substrate P and the position recognition processing result of each component, and the suction of the mounting head 6 on the back side is controlled. Each of the electronic components is mounted at a predetermined position on the printed circuit board P while the nozzle 5 corrects the positional deviation. Next, the suction nozzle 5 of the nozzle number “3” of the mounting head 6 of the head number “2” provided on the beam 4B on the near side is positioned above the component supply unit 3B of the feeder number “204” of the step number “0013”. The suction nozzle 5 is lowered by the vertical axis motor 10 to suck and take out the electronic components, and the front mounting head 6 is then lifted. Electronic components up to the step number “0024” are taken out and held by twelve suction nozzles 5.

  Then, the mounting head 6 on the near side moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit. While moving the mounting head 6, the component recognition is performed while moving. The electronic component picked up and held by each suction nozzle 5 when passing the upper position of the camera 8 is imaged by the component recognition camera 10. Based on this imaging result, how much the electronic component is displaced and held with respect to the suction nozzle 5 is recognized by the recognition processing device 29 for the XY direction and the rotation angle, and the Y-direction linear motor 7 and X The suction nozzle 5 that holds the electronic component by driving the directional linear motor 9 moves to the printed board P.

  Then, the substrate recognition camera 12 attached to the mounting head 6 attached to the beam 4B on the near side picks up an image at each of the mounting coordinates from the mounting data to the step numbers “0013” to “0024”. The Y direction linear motor 7, the X direction linear motor 9, and the θ axis motor 11 are corrected and controlled by the CPU 21 in consideration of the position recognition result of the printed circuit board P and the position recognition processing result of each component that have been subjected to the recognition process 29. Each of the electronic components is mounted at a predetermined position on the printed circuit board P while the suction nozzle 5 of the mounting head 6 corrects the positional deviation.

  Similarly, by mounting the electronic components up to the last step number on the printed circuit board P, the mounting operation on the first printed circuit board P is completed, and the printed circuit board P is moved downstream.

  The above is the mounting operation of the electronic component on the first printed circuit board P. Regarding the mounting operation on the second and subsequent printed circuit boards P, the back side component supply unit from step numbers “0001” to “0012” is used. Before the electronic components are taken out from 3B and mounted on the printed circuit board P, the recognition marks M1 and M2 attached to the printed circuit board P are newly installed on the mounting head 6 on the back side, that is, on the back side. Board recognition processing result obtained by the board recognition camera 12 corresponding to the beam 4A and the recognition processing apparatus 29 and the component recognition processing of each electronic component taken by the part recognition camera 8 and recognized by the recognition processing apparatus 29 In consideration of the result, the electronic component is mounted on the printed circuit board P.

  However, in order to improve the production efficiency of the printed circuit board P before taking out the electronic components from the front-side component supply unit 3B up to the next step numbers “0013” to “0024” and mounting them on the printed circuit board P, The board recognition camera 12 provided on the mounting head 6 on the side, that is, the board recognition camera 12 corresponding to the beam 4B on the near side does not capture the recognition marks M1 and M2 on the printed board P.

  That is, when the electronic component is mounted by the mounting head 6 attached to the beam 4B on the near side, it is not the timing to store the difference determined in the processing step S102, so the correction correction processing shown in step S104 is performed. .

  That is, the substrate recognition processing results obtained by imaging the recognition marks M1 and M2 attached to the second printed circuit board P by the substrate recognition camera 12 corresponding to the back beam 4A and performing the recognition processing by the recognition processing device 29 are described above. The CPU 21 reads out and adds the difference (ΔX1, ΔY1) related to the recognition mark M1 and the difference (ΔX2, ΔY2) related to the recognition mark M2 stored in the RAM 23, which are made in the processing step S103. In consideration of the result of component recognition processing of each electronic component sucked and held by the suction nozzle 5 of the front mounting head 6 captured by the component recognition camera 8 and recognized by the recognition processing device 29, the electronic component is applied to the printed circuit board P. Wear.

  As a result, it is possible to improve the mounting efficiency of the electronic components on the circuit board in response to the temporal change of the beam while improving the production efficiency of the circuit board.

  The above is the mounting operation of the electronic component on the second and subsequent printed circuit boards P. When mounting the electronic component on the second and subsequent printed circuit boards P, the electronic component of the first step number “0001” is selected. Since the suction nozzle 5 of the mounting head 6 on the back side is taken out and mounted, the mounting operation has been performed as described above. However, it is foremost that the electronic component of the first step number “0001” is taken out and mounted. In the case of the suction nozzle 5 of the mounting head 6 on the side, the substrate recognition camera 12 corresponding to the front beam 4B images and recognizes the second recognition marks M1 and M2, and the recognition processing result Based on the above, when mounting with the suction nozzle 5 of the mounting head 6 on the front side and mounting with the suction nozzle 5 of the mounting head 6 on the back side, the substrate recognition camera 12 related to the beam 4A on the back side is imaged again. The difference (ΔX1, ΔY1) stored in the RAM 23 and the recognition processing result based on the imaging of the recognition mark of the second printed circuit board P by the substrate recognition camera 12 corresponding to the beam 4B on the near side, and You may mount | wear so that ((DELTA) X2, (DELTA) Y2) may be considered.

  The electronic components are mounted on the second and subsequent printed circuit boards P as described above, but the beams 4A and 4B change with time, so that the differences (ΔX1, ΔY1) and (ΔX2) described above are used. , ΔY2) for a long time may cause problems in mounting accuracy of electronic components.

  Therefore, in order for the CPU 21 to grasp the above-described difference and store it in the RAM 23, the two board recognition cameras 12 are connected to the CPU 21 via the interface 27 from when the recognition marks M1 and M2 of the printed board P are imaged. When the timer 30 measures that a predetermined time, for example, 10 minutes has elapsed, the CPU 21 determines that it is time to store the difference determined in the processing step S102. The recognition marks M1 and M2 attached are imaged by the board recognition cameras 12 and the recognition processor 29 recognizes and stores the difference calculated by the CPU 21, and the rewritten difference is stored in the subsequent printed board P. Used for mounting electronic parts on

  In this case, when the timer 30 counts that the predetermined time has elapsed, the above-described rewriting operation may be performed immediately. However, when all the mounting operations of the electronic components on the printed circuit board P are not completed, The rewriting operation for imaging and recognizing the recognition marks M1 and M2 may be performed on the next printed circuit board P after the mounting is completed.

  In addition, a counter (not shown) may be provided, and the above-described rewriting operation may be performed every predetermined number of produced printed circuit boards P, for example, every 10 sheets.

  As described above, according to the present invention, even when the beams 4A and 4B change with time, the mounting accuracy of electronic components can be stabilized and maintained high.

  In addition, although the imaging of the recognition mark attached | subjected to the printed circuit board P by the board | substrate recognition camera 12 was performed after taking out an electronic component from the components supply apparatus 3, you may carry out before taking out an electronic component.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3B Component supply unit 21 CPU
23 RAM
29 recognition processing device 30 timer

Claims (3)

A component supply device that supplies electronic components, a pair of beams that can be moved in one direction by a driving source, a mounting head that can be moved by a driving source in a direction along each beam, and a positioning head provided in each mounting head. And a board recognition camera for picking up a recognition mark for position confirmation attached to the circuit board. The image picked up by the board recognition camera is recognized by a recognition processing device, and the component is based on the recognition result. In the electronic component mounting apparatus for mounting the electronic component taken out by the suction nozzle provided in the mounting head from the supply device on the circuit board,
A storage device for storing the difference between the coordinates of the recognition mark on the circuit board obtained by imaging by the board recognition camera corresponding to one beam and the coordinates of the recognition mark obtained by imaging by the board recognition camera corresponding to the other beam When,
The mounting operation of the electronic component by the suction nozzle according to one mounting head having the suction nozzle for mounting the electronic component first on the circuit board is performed by recognizing the image captured by the board recognition camera provided on the one mounting head. Control is performed based on the recognition result obtained by the recognition processing by the processing device, and the mounting operation of the electronic component by the suction nozzle related to the other mounting head is performed by recognizing the image captured by the board recognition camera provided in the one mounting head. An electronic component mounting apparatus, comprising: a control device that performs control based on a recognition result recognized by a processing device and a difference stored in the storage device.   Each time a predetermined time by the timer elapses, a substrate recognition camera provided on the mounting heads provided on both beams images the recognition marks attached to the circuit boards, respectively, and the recognition processing device performs recognition processing, 2. The electronic component mounting apparatus according to claim 1, wherein a difference between the coordinates of the recognition mark on the circuit board corresponding to the beam and the coordinates of the recognition mark corresponding to the other beam is stored in the storage device.   For each predetermined number of circuit boards produced, a board recognition camera provided on the mounting heads provided on both beams images each of the recognition marks attached to the circuit boards, and the recognition processing device performs recognition processing. 2. The electronic component mounting apparatus according to claim 1, wherein a difference between the coordinates of the recognition mark on the circuit board corresponding to one beam and the coordinates of the recognition mark corresponding to the other beam is stored in the storage device. .

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