TW202030816A - Mounting device and manufacturing method of semiconductor device - Google Patents

Abstract

Provided is a mounting device capable of reducing vibration of a mounting head. The mounting device includes: a first mounting head returning a die; a second mounting head having an operation timing different from that of the first mounting head, and returning a die; a first driving part moving the first mounting head freely in a first direction; a second driving part moving the second mounting head freely in the first direction; and a control part controlling the first and second driving parts. The control part is configured to calculate excitation force generated when the first mounting head is moved from a command value, or add a considerable amount of thrust, which is offset in a reverse direction to the exciting force as a pre-measured and registered vibration waveform, to a control amount of the second mounting head as a feed forward component.

Description

Mounting device and manufacturing method of semiconductor device

The present invention relates to a mounting device, and can be applied to, for example, a mounting device in which two mounting heads perform mutually different actions.

As a conventional part mounting device, a mounting head equipped with a plurality of suction nozzles for holding parts, an X beam capable of supporting the mounting head movable in the X direction along the surface of the substrate, and movable in the X direction are known. The two Y beams at both ends of the X beam are supported in the orthogonal Y direction. In the component mounting device of this structure, the X beams with the two ends supported by the individual Y beams move in the Y direction, and the mounting head supported by the X beams moves in the X direction, whereby the mounting head is positioned on the substrate The parts are installed on the substrate.

In addition, in this type of component mounting device, two X-beams are supported between two Y-beams, and two mounting heads movably supported by individual X-beams are used to realize efficient component mounting. . In recent years, in addition to the improvement of the productivity of parts installation, there is also a strong demand for the improvement of parts installation accuracy.

In this type of component mounting device, in order to improve the productivity of component mounting, there are usually two mounting heads that perform different actions simultaneously. For example, it is a situation in which one mounting head performs the installation of the nozzle heads on the parts on the substrate, and the other mounting head performs the operation of removing the parts in the parts supply section. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2011-187468 A

[The problem to be solved by the invention]

In this way, when two mounting heads perform different actions simultaneously, in the component mounting device, the vibration generated by one mounting head and X beam is transmitted to the Y beam, and the vibration is transmitted to the other X beam and mounting head. . The transmission of such vibration may adversely affect the accuracy of the position recognition of parts or the accuracy of installation operations. In order to avoid the influence caused by the transmission of such vibration, it is necessary to restrict the movement of the two mounting heads, which will hinder the improvement of the productivity of the part installation. The subject of the present invention is to provide a mounting device that reduces the vibration of the mounting head. Other issues and novel features can be understood from the description of this specification and the attached drawings. [Means to solve the problem]

To briefly explain the outline of the representative of the present invention, it is as follows. In other words, the mounting device is equipped with a first mounting head that transfers the die, and the operation sequence is different from the first mounting head, and the second mounting head that transfers the die can move the first mounting head freely to the first mounting head. The first driving part of the direction, the second driving part that can freely move the second mounting head in the first direction, and the control part that controls the first driving part and the second driving part. The control unit calculates the excitation force generated when the first mounting head is moved based on the command value, or as a pre-measured and registered vibration waveform, it is equivalent to offsetting the thrust in the opposite direction of the excitation force The component, as a feedforward component, is added to the control quantity of the second mounting head. [Effects of the invention]

According to the aforementioned mounting device, the vibration of the mounting head can be reduced.

Hereinafter, the embodiments and examples will be described using drawings. However, in the following description, the same reference numerals are attached to the same constituent elements, and overlapping descriptions may be omitted. Furthermore, the drawings are to make the description clearer. Compared with the actual state, the drawings show the mode of width, thickness, and shape of each part, but it is only an example and does not limit the interpreter of the present invention.

First, the mounting device of the embodiment will be described with reference to Figs. 1 to 3. Fig. 1 is a top view schematically showing the mounting device of the embodiment. Fig. 2 schematically shows a side view of the mounting device of Fig. 1.

The mounting apparatus 100 of the embodiment is an apparatus that transports the parts 300 from the parts supply unit (not shown) to the upper side of the work 200 and assembles (mounts) the transported parts 300 to the work 200. The mounting device 100 is provided with a bracket 110, a mounting table 120 supported on the bracket 110, X supporting tables 131a, 131b provided on the bracket 110, Y beams 140a, 140b supported on the X supporting tables 131a, 131b, and The mounting heads 150a, 150b supported by the Y beams 140a, 140b, and the driving parts 160a, 160b that drive the mounting heads 150a, 150b in the Y-axis direction and the Z-axis direction. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on the horizontal plane. In this embodiment, as shown in FIG. 1, the direction in which the Y beams 140a, 140b extend is the Y-axis direction (the second direction). ), the description will be given assuming that the direction orthogonal to it is the X-axis direction (first direction). In addition, the Z-axis direction (third direction) is perpendicular to the vertical direction of the XY plane. Furthermore, it is different from the X direction and Y direction described in the item of the prior art.

The mounting heads 150a and 150b are devices that have freely attachable and detachable holding means for the parts 300, and are attached to the Y beams 140a and 140b that can move back and forth in the Y-axis direction.

In the situation of the present embodiment, three mounting heads 150a and 150b are provided, and each mounting head 150a and 150b is provided with a holding means 151a having a suction nozzle that holds the component 300 by vacuum suction. In addition, the holding means of the mounting head 150b is not shown. In addition, the driving parts 160a and 160b are capable of independently raising and lowering the three mounting heads 150a and 150b in the Z-axis direction. The mounting heads 150a and 150b have a function of holding and transporting the component 300, and mounting the component 300 on the workpiece 200 which is sucked and fixed to the mounting table 120.

The guides 132a and 132b provided on the X support bases 131a and 131b are members that can freely slide the Y beams 140a and 140b in the X-axis direction. In the situation of the present embodiment, two X support tables 131a and 131b are arranged in parallel, and each X support table 131a and 131b is fixed to the bracket 110 while extending in the X-axis direction. The X supports 131a and 131b may be formed integrally with the bracket 110. The X support stands 131a and 131b and the guides 132a and 132b are called X beams 130a and 130b. In addition, the X beams 130a and 130b are also referred to as X1 axis and X2 axis. In addition, the Y beams 140a and 140b are also referred to as Y1 axis and Y2 axis.

As shown in FIG. 2, on the guides 132a, 132b, the sliders 143a, 143b are installed so that they can move freely in the X-axis direction. Then, the legs 142aa, 142ba, 142ab, 142bb of the Y beams 140a, 140b are respectively mounted on the sliding members 143a, 143b of the two guides 132a, 132b. In other words, the main beam portions 141a, 141b of the Y beams 140a, 140b extend in the Y-axis direction so as to straddle the mounting table 120, and the legs 142aa, 142ba, 142ab, 142bb at both ends are mounted on the slider 143a , 143b is supported by guides 132a, 132b mounted on the X support bases 131a, 131b so as to move freely in the X-axis direction. The leg portions 142aa, 142ba, 142ab, and 142bb are provided with driving portions 144aa, 144ba, 144ab, and 144bb such as motors that drive the Y beams 140a and 140b in the X-axis direction. Furthermore, the bottom surfaces of the main beam portions 141a, 141b and the bottom surfaces of the legs 142aa, 142ba, 142ab, and 142bb (the upper surfaces of the sliders 143a, 143b) are located on the same surface. Therefore, the main beam portions 141a, 141b are arranged in parallel A position not much higher than the X support stands 131a and 131b.

As shown in FIG. 1, the Y beams 140a and 140b are arranged to extend in the Y-axis direction. The members used to guide the reciprocating movement of the mounting heads 150a and 150b in the Y-axis direction are also driving parts.

Next, the vibration of the Y beam and the mounting head will be described using FIG. 3. Fig. 3 is a schematic front view illustrating the problem of the mounting device of Fig. 1, Fig. 3(a) is a diagram illustrating the independent operation of two opposite shafts, and Fig. 3(b) is a diagram illustrating the operation of one shaft while the other shaft stops Fig. 3(c) is a diagram explaining the vibration deformation of the frame, and Fig. 3(d) is a diagram explaining the vibration of the other shaft.

In the mounting device 100, in order to improve the productivity of component mounting, as shown in FIG. 3(a), there are often situations where two mounting heads 150a and 150b perform different operations simultaneously. For example, there is a situation in which one mounting head 150b performs an operation between mounting nozzles to parts on a substrate, and the other mounting head 150a moves in the X direction.

As shown in Figure 3(b), when the Y1 axis, that is, the Y beam 140a moves in the X axis direction, as shown in Figure 3(c), the mass (Ma) and acceleration (A) of the mounting head 150a and Y beam 140a during acceleration and deceleration ) The multiplied reaction force (Fr=Ma·A) is transmitted to the bracket (frame) 110, and the bracket 110 is excited and deformed like a two-dot dashed line. Here, let the vibration acceleration of the holder 110 be A'. When the bracket 110 vibrates, as shown in Figure 3(d), for the other mounting head 150b, the mass (Mb) of the mounting head 150b and Y beam 140b is multiplied by the vibration acceleration (A') and the inertial force (Fi=Mb)・A') The opposite direction of the vibration applied to the bracket 110. This inertial force is applied as an external force to the motors that hold the driving parts 144ab and 144bb of the other mounting head 150b and Y beam 140b, and it becomes a factor that reduces the positioning accuracy.

In the situation of a two-axis structure, when the Y1 axis, which is the Y beam 140a, moves, the Y2 axis, which is the Y beam 140b, for example, even if it stops, the acceleration and deceleration vibration of the Y1 axis will be transmitted to the frame and become the cause of the Y2 axis vibration. , A positional deviation of several μm to tens of μm occurs. Not only is the stent structure of this embodiment configured with a separate drive system having a shaft driven in the same direction, but also in the case of a mechanism structure in which one side is affected by the operation vibration of the other side, this problem also occurs.

Next, an embodiment for solving the aforementioned problems will be described using FIGS. 4 to 10. Fig. 4 is a front view schematically showing the mounting device of the embodiment, Fig. 4(a) is a diagram showing a state without a vibration measuring device, and Fig. 4(b) is a diagram showing a state having a vibration measuring device. 5A is a diagram illustrating the inertial force applied to the opposite axis and the deviation caused by the movement of the moving axis of the mounting device of FIG. 4(a). Fig. 5B is a diagram illustrating the inertial force applied to the opposite shaft and the deviation caused by the movement of the moving shaft of the mounting device of Fig. 4(b). Fig. 6A is a diagram illustrating the calculation of the thrust of the opposite shaft during long-distance operation. Fig. 6B is a diagram illustrating the calculation of the thrust of the opposite shaft during short-distance operation. Fig. 7A is a block diagram of the device system of the installation device of the comparative example. Fig. 7B is a block diagram of the device system for installing the device. Fig. 8A is a vibration model diagram of the device when the device is installed on a solid floor. Fig. 8B is a vibration model diagram of the device when the device is installed on an unstable floor. Fig. 9 is a diagram illustrating the thrust calculated from the jerk of the motion axis during long-distance motion and the thrust calculated from the vibration waveform. FIG. 10 is a diagram illustrating the thrust calculated from the jerk of the motion axis during short-distance motion and the thrust calculated from the vibration waveform.

As shown in Figure 4(a), the thrust (Fp) that cancels the inertial force (Fi) of the Y2 axis that is the Y beam 140b when the Y1 axis or Y beam 140a moves is applied to the Y2 axis to reduce the Y2 axis vibration . Specifically, as shown in FIG. 5A, the bracket vibrates due to the excitation force (jerk (J)) generated by the movement of the Y1 axis, and the inertial force is applied to the opposite axis due to the vibration of the bracket 110. The vibration with the inertial force as the starting point occurs on the opposite axis and appears as a deviation. The vibration system is determined by the rigidity and frequency characteristics of the vibration system formed by the bracket 110 and the Y-axis drive shaft, and the vibration amplitude, frequency, attenuation characteristics, etc., are different according to the structure of each device. The starting point of the vibration is the starting point of the acceleration and deceleration of the motion axis. Therefore, the thrust compensation waveform that adapts to the vibration characteristics of the shaft structure of the bracket and the drive part from which it is the starting point is obtained, and the thrust applied to the opposite shaft is used. To suppress vibration. For example, as shown in Figures 6A and 6B, the excitation force generated by the motion axis is set to the acceleration (A) derived from the command motion speed (V) and the jerk (J) calculated by the differential The amount of thrust offset in the opposite direction (the solid line of thrust compensation in the figure) is added as a feedforward component to the control value of the Y2 axis at the same time, thereby canceling the exciting force and suppressing vibration.

Furthermore, as shown in Fig. 4(b), the vibration of the bracket vibrated by the motion axis is a vibration waveform starting from the jerk (J) of the motion axis as shown in Fig. 5B, because the vibration is applied to The opposite axis appears on the opposite axis as an unnecessary deviation, and the motor control unit of the opposite axis detects the deviation, adds feedback to offset the deviation, and outputs a thrust command to return to the target position. Therefore, the vibration measurement device 170 installed on the stand is used to measure the vibration of the stand. As shown in FIG. 5B, the excitation force applied to the opposite shaft is calculated based on the vibration of the stand 110, and the thrust applied to the opposite shaft is offset The equivalent amount of, as a feedforward component, is added to the control value of the Y2 axis at the same time as the motion axis action, thereby canceling the excitation force and suppressing vibration. The vibration measuring device 170 may be used as a device capable of measuring displacement, velocity, acceleration, etc., such as an acceleration picker or a rotation sensor.

As shown in FIG. 7, in the control of the motor (M) of the drive unit of the comparative example, in the Y1 axis, the position control unit 71a outputs a speed command to the speed control unit 72a based on the operation command and the position information of the motor 75a. The speed control unit 72a outputs current control information according to the speed command and the speed information of the motor 75a. The current control unit 73a controls the amplifier 74a according to the information of the amplifier (AMP) 74a and the current control information. The Y2 axis system is controlled in the same way as the Y1 axis. In this way, in the control method of the comparative example, the action axis and the counterpart axis are independently controlled, and the counterpart axis will be subjected to external disturbance (external force vibration) due to the influence of the vibration generated by the action of the axis.

Therefore, as shown in FIG. 7B, in the embodiment, the thrust compensation units 76a and 76b estimate the excitation force applied to the opposite axis (for example, Y2 axis) based on the motion command of the motion axis (for example, Y1 axis), as the thrust For compensation, the thrust feedforward component of the opposite axis is added and subtracted to the current control units 73a and 73b. As a result, with the action of the operating shaft, the opposite shaft generates a force in the extension direction before vibration occurs, and the relative deviation (deviation) between the bracket 110 and the opposite shaft affected by the vibration can be suppressed, and the vibration influence on the opposite shaft can be reduced and improved. Accuracy.

Furthermore, when it is assumed to be a device installed on a firm floor, it is sufficient to assume a 3-degree-of-freedom vibration system (Xa, Xb, Xframe) as shown in FIG. 8A. Here, Ma is the overall mass of the Y1 axis, Xa is the position of the Y1 axis in the X direction, Xam is the positioning position of the drive unit such as a motor that moves the Y1 axis in the X direction, Vxam is the motion command applied to the Y1 axis, and Mb is The mass of the entire Y2 axis, Xb is the position of the Y2 axis in the X direction, Xbm is the positioning position of the drive unit such as a motor that moves the Y2 axis in the X direction, Mframe is the mass of the entire bracket, and Xframe is the displacement of the bracket. In this case, it is sufficient to calculate the inertial force and vibration of the Y2-axis whose mass is Mb based on the behavior of Xframe (the vibration acceleration (A') of the bracket) caused by the fluctuation of the Y1-axis. At this time, the compensation thrust applied during the assembly adjustment stage of the device manufacturer is also calculated, making it easy to set. However, when there is a problem with the rigidity of the floor, such as the vibration of the floor due to the action of the device, it is represented by the model shown in Fig. 8B (4 degrees of freedom vibration system (Xa, Xb, Xframe, Xfloor)) with 3 degrees of freedom The vibration of the waveform with different conditions will be applied to the opposite axis. Here, Xfloor is a displacement of the floor. The displacement and characteristics of the floor are due to different installation environments. Therefore, it is difficult to estimate in advance the vibration of the bracket caused by the Y1 axis movement, and it is necessary to adjust the installation destination of the device. At this time, by operating the operating shaft at the installation site, the vibration measurement device similar to the vibration measurement device 170 installed on the bracket 110 or the mounting heads 150a, 150b can be used to measure and extract the static torque and The vibration waveform obtained from the deviation waveform, the thrust compensation waveform is calculated based on the waveform, and it is stored in the memory device of the control device described later for correspondence.

In addition, by periodically operating the operating shaft, the vibration waveform of the counterpart shaft is measured by the same vibration measuring device as the vibration measuring device 170 installed on the holder 110 or the mounting heads 150a, 150b, and registered in the control device described later. The device is memorized and corrected, and it can also be corrected for changes in the device over time. This system can also automatically measure and register the waiting time for board loading and unloading that occurs during the production of the device.

In the above-mentioned embodiment, the thrust of the opposite axis (e.g. Y2 axis) is calculated based on the jerk calculated from the command speed of the action axis (e.g. Y1 axis). However, as shown in FIG. Calculate the jerk from the command speed of the axis (e.g. Y1 axis) and differentiate the calculated jerk ((a) Y1 axis jerk), and calculate the rise in jerk as the counter axis (e.g. Y2 axis) Thrust can also be used. In addition, as shown in FIG. 9, the same vibration measuring device as the vibration measuring device 170 installed on the holder 110 or the mounting heads 150a, 150b is used in advance to measure the characteristics (vibration waveform) of the device, and based on the deviation and thrust of the opposite axis The vibration waveform ((b) Y2-axis thrust) of the same vibration waveform can be registered in the memory device of the control device to be canceled, and it may be used as the thrust of the opposite axis. At this time, while operating the Y1 axis and observing the deviation and thrust of the Y2 axis, the optimum cancellation waveform is generated and registered.

As shown in Fig. 10, when the moving distance is short, the jerk ((a) Y1-axis jerk) calculated by differentiating the jerk calculated from the command speed of the motion axis (for example, Y1 axis), The increase in jerk can be calculated as the thrust of the opposite axis (for example, Y2 axis). Also, as shown in FIG. 10, the same vibration measuring device as the vibration measuring device 170 installed on the holder 110 or the mounting heads 150a, 150b is used in advance to measure the characteristics (vibration waveform) of the device, and based on the deviation and thrust of the opposite axis The vibration waveform ((b) Y2-axis thrust) of the same vibration waveform can be registered in the memory device of the control device to be canceled, and it may be used as the thrust of the opposite axis. [Example 1]

Hereinafter, an example of a flip chip bonding machine, which is an example of the mounting device applied to the above-mentioned embodiment, will be described. In addition, the flip chip bonding machine is used, for example, in the manufacture of a package in which the rewiring layer is formed in a wide area exceeding the chip area, that is, a fan-out wafer level package (Fan Out Wafer Level Package: FOWLP).

FIG. 11 is a schematic plan view showing the flip chip bonding machine of the first embodiment. Fig. 12 is a schematic cross-sectional view showing the main part of the die supply part of Fig. 11. The flip-chip bonding machine 10 is roughly divided into a die supply unit 1, a pickup unit 2, a transposition unit 8a, 8b, an intermediate table unit 3a, 3b, a bonding unit 4a, 4b, a transport unit 5, a substrate supply unit 6k, and a substrate The unloading part 6H and the control device 7 which monitors and controls the operation of each part.

First, the die supply unit 1 supplies die D of a substrate P mounted on a substrate or the like. The die supply unit 1 has a wafer holding table 12 containing the divided wafer 11 and a push-up unit 13 shown by a broken line that pushes the die D upward from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means not shown, so that the picked-up die D is moved to the position of the push-up unit 13. The die supply unit 1 moves the wafer ring 14 to the pick-up point in such a way that the desired die D can be picked up from the wafer ring. The wafer ring 14 is a jig that fixes the wafer 11 and can be installed in the die supply unit 1.

The pick-up unit 2 has a reversing pickup head 21 for picking up and reversing the die D, and driving units (not shown) that lift, rotate, reverse, and move the suction nozzle 22 in the X-axis direction. With this structure, the inverting pickup head 21 picks up the die D, and the inverting pickup head 21 is rotated 180 degrees, and the protrusions of the die D are turned over and face downward, and the die D is delivered to the transposed heads 81a, 81b. .

The transposing parts 8a and 8b receive the inverted die D from the inverting pickup head 21 and place them on the intermediate tables 31a and 31b. The transposing parts 8a, 8b have transposing heads 81a, 81b that are equipped with suction nozzles 82a, 82b that suck and hold the die D at the tip in the same manner as the reversing pickup 21, and move the transposing heads 81a, 81b in the X-axis direction. X drive parts 83a, 83b.

The intermediate stages 3a and 3b have intermediate stages 31a and 31b on which the die D is temporarily placed and stage recognition cameras 34a and 34b. The intermediate tables 31a and 31b can be moved in the Y-axis direction by a drive unit not shown.

The bonding parts 4a and 4b pick up the die D from the intermediate tables 31a and 31b, and bond them to the substrate P that is transferred. The bonding portions 4a, 4b are equipped with bonding heads 41a, 41b having suction nozzles 42a, 42b for sucking and holding the die D at the tip in the same manner as the flip pickup 21, and Y beams 43a that move the bonding heads 41a, 41b in the Y-axis direction. 43b. The substrate recognition cameras 44a, 44b, and X supports 451a, 451b that capture the position recognition marks (not shown) of the substrate P and recognize the bonding position. With this structure, the bonding heads 41a, 41b pick up the die D from the intermediate stages 31a, 31b, and bond the die D to the substrate P based on the imaging data of the substrate recognition cameras 44a, 44b.

The conveyance part 5 is provided with conveyance rails 51 and 52 by which the board|substrate P moves in the X direction. The conveying rails 51 and 52 are arranged in parallel. With this structure, the substrate P is unloaded from the substrate supply part 6K, moved to the bonding position along the conveyance rails 51 and 52, and moved to the substrate unloading section 6H after bonding, and the substrate P is delivered to the substrate unloading section 6H. The die D is bonded to the substrate P, and the substrate supply unit 6K reloads the substrate P and waits on the conveyance rails 51 and 52.

The control device 7 is equipped with a memory device (memory) for storing programs (software) and data for monitoring and controlling the actions of various parts of the flip chip bonding machine 10, and a central processing unit (CPU) for executing the programs stored in the memory.

As shown in FIG. 12, the die supply unit 1 has an extension ring 15 holding a wafer ring 14, a support ring 17, which will be held by the wafer ring 14, and a dicing tape 16 to which a plurality of die D are adhered horizontally positioned, and A push-up unit 13 for pushing the die D upward. In order to pick up the predetermined die D, the push-up unit 13 is moved in the vertical direction by a driving mechanism not shown, and the die supply unit 1 moves in the horizontal direction.

The junction part will be described using FIGS. 2 and 14 while referring to the embodiment. FIG. 14 is a schematic side view showing the main part of the joint 4. Some of the constituent elements are revealed through perspective. Furthermore, the side view of FIG. 14 corresponds to the side view of FIG. 2. Hereinafter, the description will be centered on the Y beam 43a side of the joint 4, but the Y beam 43b has a symmetrical structure to the Y beam 43a.

The joint part 4 is equipped with a joint stand BS (mounting stand 120) supported on the bracket 53 (bracket 110), an X support stand 451a (X support stand 131a) provided near the conveying rails 51 and 52, and is supported on the X The Y beam 43a (Y beam 140a) on the support stand 451a, the joint head 41a (mounting head 150a) supported by the Y beam 43a, and the driving part 46a (drive part) that drives the joint head 41a in the Y-axis direction and the Z-axis direction 160a)

The bonding head 41a is a device having a suction nozzle 42a (holding means 151a) that can detachably hold the die D (component 300), and is attached to the Y beam 43a so as to be able to move back and forth in the Y-axis direction.

In the situation of this embodiment, one bonding head 41a is provided, and the mounting head 41a is provided with a suction nozzle 42a that holds the die D by vacuum suction. In addition, the driving portion 46a can raise and lower the mounting head 41a in the Z-axis direction. The mounting head 41a has a function of holding and transporting the die D picked up from the intermediate table 31a, and mounting the die D on the substrate P (work 200) which is sucked and fixed to the bonding table BS.

The guides 452a and 452b provided on the X support bases 451a and 451b are members that guide the Y beam 43a so as to be slidable in the X-axis direction. In the situation of this embodiment, two X support tables 451a and 451b are arranged in parallel, and each X support table 451a and 451b is fixed to the conveyance rails 51 and 52 in a state extended in the X axis direction. The X support tables 451a and 451b may be formed integrally with the conveyance rails 51 and 52.

As shown in Figs. 11 and 14, on the guides 452a, 452b, the sliders 433a, 433b are installed so as to be freely movable in the X-axis direction. Then, the two ends of the Y beam 43a are respectively installed on the sliding members 433a, 433b of the two guide members 452. That is to say, the Y beam 43a extends in the Y-axis direction so as to straddle the joint BS, and the two ends are installed on the sliders 433a, 433b, and the guides 452a, 452a and 451b are installed on the X support tables 451a, 451b. 452b can move freely in the X-axis direction and is supported. Furthermore, the bottom surface of the Y beam 43a and the upper surface of the sliders 433a and 433b are located on the same surface. Therefore, the Y beam 43a is set at a position not much higher than the X support platforms 451a and 451b.

The Y beam 43a of the first embodiment has basically the same structure as the Y beam 140a of the embodiment. However, the Y beam 43a extends farther to the right than the support stand 451a on the right side of the drawing. This is because the bonding head 41a can pick up the die D from the intermediate table 31a. Furthermore, when the bonding head 41a moves to the right side than the support stand 451a, the bonding head 41a will rise so that the suction nozzle 42a becomes higher than the guide 452a.

Next, the bonding method (the manufacturing method of the semiconductor device) implemented in the flip chip bonding machine of the first embodiment will be described using FIG. 14. 15 is a flowchart showing the bonding method implemented by the flip chip bonding machine of the first embodiment. The description is centered on the Y beam 43a side, but the same applies to the Y beam 43b side. However, the Y-beam 43b side and the Y-beam 43a side operate at different timings. However, there are cases where the same operation is performed at the same time.

Step S1: The control device 7 moves the wafer holding table 12 such that the picked-up die D is located directly above the push-up unit 13 to position the peeling target die on the push-up unit 13 and the suction nozzle 22. The upward pushing unit 13 is moved in such a manner that the upper surface of the upward pushing unit 13 contacts the back surface of the dicing tape 16. At this time, the control device 7 is attached to the upper surface of the push-up unit 13 to suck the dicing tape 16. The control device 7 lowers the suction nozzle 22 while vacuuming, and lands on the die D to be peeled off, so as to adsorb the die D. The control device 7 raises the suction nozzle 22 to peel the die D from the dicing tape 16. Thereby, the die D is picked up by the inverted pickup head 21.

Step S2: The control device 7 moves the inverting pickup head 21.

Step S3: The control device 7 rotates the inverting pickup head 21 by 180 degrees, inverts the protruding surface (surface) of the die D and faces downward, and inverts the protruding surface (surface) of the die D and faces downward to deliver the die D Give the posture of the transposed head 81a.

Step S4: The control device 7 picks up the die D from the suction nozzle 22 of the inverted pickup head 21 through the suction nozzle 82a of the transposition head 81a, and receives the die D.

Step S5: The control device 7 turns the pickup head 21 over and turns the suction surface of the suction nozzle 22 downward.

Step S6: Before or in synchronization with step S5, the control device 7 moves the transposition head 81a to the intermediate table 31a.

Step S7: The control device 7 places the die D held by the transposition head 81a on the intermediate table 31a.

Step S8: The control device 7 moves the transposition head 81a to the receiving position of the die D.

Step S9: After or in synchronization with step S8, the control device 7 moves the intermediate table 31a to the receiving position with the bonding head 41a.

Step SA: The control device 7 picks up the die D from the intermediate table 31a through the suction nozzle 42a of the bonding head 41a, and receives the die D.

Step SB: The control device 7 moves the intermediate table 31a to the receiving position with the transposition head 81a.

Step SC: The control device 7 moves the die D held by the suction nozzle 42a of the bonding head 41a onto the substrate P. At this time, the Y beam 43a moves in the X-axis direction, and the bonding head 41a moves in the Y-axis direction.

Step SD: The control device 7 places the die D picked up by the suction nozzle 42a of the bonding head 41a on the substrate P from the intermediate table 31a.

The Y beams 43a and 43b move at different timings. Therefore, the bonding head 41b moves at the timing when the bonding head 41a places the die D on the substrate P. Therefore, as shown in FIG. 7B, the control device 7 estimates the excitation applied to the Y beam 43a (opposing axis) based on the operation command of the Y beam 43b (action axis) in the positioning control of the motor (M) of the drive unit. Vibration force, as thrust compensation, is added or subtracted to the thrust feed forward of the opposite axis.

Step SE: The control device 7 moves the bonding head 41a to the receiving position with the intermediate table 31a. [Example 2]

Hereinafter, a description will be given of an example of a die bonder that is an example of a mounting device that is also applicable to the above-mentioned embodiment, that is, a semiconductor wafer (die) is bonded to a substrate or the like.

Fig. 16 is a schematic plan view of the die bonder of the second embodiment.

The die bonder 10A of the second embodiment is roughly divided into a die supply section 1 for supplying die D mounted on the substrate P, pickup sections 2A, 2B for picking up the die from the die supply section 1, and intermediate placement once The intermediate table portions 3A, 3B of the picked-up die D, and the die D of the intermediate table portions 3A, 3B, are bonded to the substrate P or the bonding portions 4A, 4B on the bonded die D, and the substrate The conveyance part 5 that P is conveyed to the mounting position, the substrate supply part 6k that supplies the substrate to the conveyance part 5, the substrate conveyance part 6H that receives the mounted substrate P, and the control device 7 that monitors and controls the operation of each part.

First, the die supply unit 1 has a wafer holding table 12 that holds a wafer 11 having a plurality of die D, and a push-up unit 13 indicated by a broken line that pushes the die D upward from the wafer 11. The die supply unit 1 is moved in the XY axis direction by a driving means not shown, so that the picked-up die D is moved to the position of the push-up unit 13.

The picking parts 2A, 2B have suction nozzles 22A, 22B that suck and hold the die D pushed up by the push-up unit 13 at the front end, pick up the die D and place it on the intermediate table parts 3A, 3B. 21B, and the X drive parts 23A, 23B of the pickup that move the pickups 21A, 21B in the X-axis direction. In addition, the pickup heads 21A and 21B have respective drive units (not shown) that lift, rotate, and move the suction nozzles 22A and 22B in the X direction. The pick-up head 21A picks up the die D from the wafer 11, moves to the left in the X-axis direction, and places the die D on the intermediate table 31A provided at the intersection of the tracks of the bonding head 41A. The pick-up head 21B picks up the die D from the wafer 11, moves to the right side in the X-axis direction, and places the die D on the intermediate table 31B provided at the intersection of the tracks of the bonding head 41B. The pickup heads 21A and 21B move in opposite directions at different timings.

The intermediate stages 3A and 3B have intermediate stages 31A and 31B on which the die D is temporarily placed, and stage recognition cameras 34A and 34B for recognizing the dies D on the intermediate stages 31A and 31B.

The bonding parts 4A, 4B have the same structure as the pickup head. The die D is picked up from the intermediate tables 31A, 31B and bonded to the substrate P to be transported. The bonding heads 41A, 41B are mounted on the tips of the bonding heads 41A, 41B. , The suction nozzles 42A, 42B that suck and hold the die D, the Y driving parts 43A, 43B that move the bonding heads 41A, 41B in the Y-axis direction, and capture the position identification mark (not shown) of the substrate P that is being transported, The substrate recognition cameras 44A and 44B that recognize the bonding position of the die D to be bonded. The bonding stations BS1 and BS3 are located on the conveying rail 51 side, and the bonding station BS2 is located on the conveying rail 52 side.

With this structure, the bonding heads 41A, 41B are based on the imaging data of the workbench recognition cameras 34A, 34B, correct the picking position and posture, pick up the die D from the intermediate workbenches 31A, 31B, and recognize the cameras 44A, 44B based on the substrate In the imaging data, the die D is bonded to the substrate P.

The conveying section 5 has a conveying rail 51 with two conveying troughs 91 and 93 for placing one or a plurality of substrates P (15 in FIG. 1) and two substrate conveying trays 92. The conveyance rail 52 of the conveying trough is conveyed. For example, the board conveyance trays 91, 92, and 93 are moved by conveyance belts (not shown) provided in two conveyance troughs.

With this structure, the substrate transport trays 91, 92, 93 place the substrate P on the substrate supply section 6K, move along the transport chute to the bonding position, and after bonding, move to the substrate unloading section 6H, and deliver the substrate P .

The control device 7 is equipped with a memory device (memory) for storing programs (software) and data for monitoring and controlling the actions of various parts of the die bonder 10A, and a central processing unit (CPU) for executing the programs stored in the memory.

The bonding heads 41A and 41B move at mutually different timings. Therefore, the bonding head 41A moves at the timing when the bonding head 41B places the die D on the substrate P. Therefore, as shown in FIG. 7B, in the positioning control of the motor (M) of the drive unit, the control device 7 estimates the application to the Y drive unit 43B (opposing axis) based on the operation command of the Y drive unit 43A (action axis) The exciting force of, as thrust compensation, add or subtract to the thrust feed forward of the opposite axis.

In the above, the invention invented by the present inventors has been specifically described based on the embodiments and examples. However, the present invention is not limited to the foregoing embodiments and examples, and various modifications can of course be made.

In addition, in the embodiment, an example of one bonding head (mounting head) has been described, but it is not limited to this, and it may be a plurality of bonding heads as in the embodiment.

In addition, in the embodiment, an example in which the turning mechanism is installed on the turning pickup head, the turning head is used to receive the die from the turning pickup head, place it on the intermediate table, and move the intermediate table, but it is not limited to this. It can also be used as a flip pick head for moving and picking up and flipping the die, or as a worktable unit that places the die D on the front and back of the optional die-turning die, or a mobile worktable unit.

In addition, in the embodiment, an example of a flip chip bonding machine and a chip bonding machine for bonding a semiconductor chip (die) to a substrate, etc. will be described. However, it is not limited to this, and can also be applied to a packaged semiconductor Mounter (surface mounter) etc. where the device is mounted on the board.

1: Die supply part 2, 2A, 2B: Pickup section 3a, 3b, 3A, 3B: middle workbench 4a, 4b, 4A, 4B: joint 5: Transport Department 6K: Board Supply Department 6H: Board unloading department 7: Control device 8a: Transpose part 10, 10A: Flip chip bonding machine 12: Wafer holding table 13: Push up unit 16: cutting tape 21, 21A, 21B: Flip the pickup head 22, 22A, 22B: suction nozzle 31a, 31b, 31A, 31B: middle workbench 34a, 34b, 34A, 34B: Workbench recognition camera 41a, 41b, 41A, 41B: joint head 42a, 42b, 42A, 42B: nozzle 43A, 43B: Y drive section 43a, 43b: Y beam 44a, 44b, 44A, 44B: substrate recognition camera 51, 52: Conveying track 53: bracket 81a, 81b: transposed head 82a, 82b: Nozzle 83a, 83b: X drive section 91, 92, 93: PCB transfer tray 100: installation device 110: bracket 120: installation table 130a, 130b: X beam 131a, 131b: X support station 132a, 132b: guide 140a, 140b: Y beam 141a, 141b: main beam 142aa, 142ba, 142ab, 142bb: feet 143a, 143b: Slider 144aa, 144ba, 144ab, 144bb: drive unit 150a, 150b: Mounting head 160a, 160b: drive unit 170: Vibration Tester 200: Workpiece 300: parts 433a, 433b: Slider 451a, 451b: X support station 452a, 452b: guide BS1, BS2, BS3: Bonding station D: grain P: substrate

[Fig. 1] Fig. 1 is a plan view schematically showing the mounting device of the embodiment. [Fig. 2] Fig. 2 schematically shows a side view of the mounting device of Fig. 1. [Fig. 3] Fig. 3 is a schematic front view illustrating the problem of the mounting device of Fig. 1. [Fig. 4] Fig. 4 is a schematic front view illustrating the mounting device of the embodiment. [Fig. 5A] Fig. 5A is a diagram illustrating the deviation of the inertial force applied to the opposite axis by the movement of the moving shaft of the mounting device of Fig. 4(a). [Fig. 5B] Fig. 5B is a diagram illustrating the deviation of the inertial force applied to the opposite axis by the movement of the moving axis of the mounting device of Fig. 4(b). [Fig. 6A] Fig. 6A is a diagram illustrating the calculation of the thrust of the opposite axis during long-distance operation. [Fig. 6B] Fig. 6B is a diagram illustrating the calculation of the thrust force of the opposite axis during short-distance operation. [Fig. 7A] Fig. 7A is a block diagram of the control system of the mounting device of the comparative example. [Figure 7B] Figure 7B is a block diagram of the control system of the installation device. [Fig. 8A] Fig. 8A is a vibration model diagram of the device when the device is installed on a solid floor. [Fig. 8B] Fig. 8B is a vibration model diagram of the device when the device is installed on an unstable floor. [Fig. 9] Fig. 9 is a diagram illustrating the vibration waveform and the cancellation waveform caused by the jerk of the motion axis. [Fig. 10] Fig. 10 is a diagram illustrating the vibration waveform and the cancellation waveform caused by the jerk of the motion axis. [FIG. 11] FIG. 11 is a schematic plan view showing the flip chip bonding machine of the first embodiment. [Fig. 12] Fig. 12 is a diagram illustrating the operation of the inverted pickup head, the transposition head, and the bonding head when viewed from the direction of arrow A in Fig. 11. [Fig. 13] Fig. 13 is a schematic cross-sectional view showing the main part of the die supply part of Fig. 11. [Fig. 14] Fig. 14 is a schematic side view showing the main part of the joining part of Fig. 11. [FIG. 15] FIG. 15 is a flowchart showing the bonding method implemented by the flip chip bonding machine of FIG. 11. [FIG. 16] FIG. 16 is a schematic plan view showing the die bonder of the second embodiment.

110: bracket

140a, 140b: Y beam

150a, 150b: Mounting head

170: Vibration Tester

Claims (14)

An installation device characterized by: The first mounting head is for transferring the die; The second mounting head has a different action sequence from the aforementioned first mounting head and is used to transport the die; The first driving part allows the aforementioned first mounting head to move freely in the first direction; The second driving part allows the second mounting head to move freely in the first direction; and The control unit controls the aforementioned first drive unit and the aforementioned second drive unit; The control unit calculates the excitation force generated when the first mounting head is moved based on the command value, or as a pre-measured and registered vibration waveform, the equivalent of the thrust that cancels the excitation force in the opposite direction , As a feedforward component, added to the control amount of the aforementioned second mounting head. Such as the installation device described in item 1 of the scope of patent application, where: The aforementioned excitation force is a jerk calculated from the differentiation of the commanded movement speed of the aforementioned first mounting head. Such as the installation device described in item 1 of the scope of patent application, where: The aforementioned excitation force is a jerk calculated from the differentiation of the command movement speed of the aforementioned first mounting head. Such as the installation device described in item 1 of the scope of patent application, where: The aforementioned excitation force is a vibration waveform corresponding to the pre-measured jerk of the aforementioned first mounting head. For example, the installation device described in item 1 of the scope of patent application, which has: The bracket is installed with an installation table; and The vibration tester is set on the aforementioned bracket; The control unit measures the vibration waveform by the vibration measuring device, calculates and stores the vibration component applied to the second mounting head based on the vibration waveform, and corrects the control amount of the second mounting head based on the vibration component. Such as the installation device described in item 1 of the scope of patent application, where: Furthermore, it is provided with a vibration measuring device mounted on the aforementioned second mounting head; The control unit measures the vibration waveform by the vibration measuring device, calculates and stores the vibration component applied to the second mounting head based on the vibration waveform, and corrects the control amount of the second mounting head based on the vibration component. Such as the installation device described in item 1 of the scope of patent application, where: Furthermore, it has a vibration tester; The control unit moves the first mounting head to vibrate with the mounting device installed on the floor of the production site, and uses the vibration measuring device to measure the vibration waveform of the second mounting head, based on the vibration waveform , Adjust the thrust correction waveform of the aforementioned second mounting head. Such as the installation device described in item 1 of the scope of patent application, where: Furthermore, it has a vibration tester; The control unit moves the first mounting head to vibrate during the standby time or the waiting time during the operation of the mounting device, and uses the vibration measuring device to measure and save the vibration waveform of the second mounting head, and according to the aforementioned The vibration waveform is to correct the vibration compensation waveform of the second mounting head. Such as the installation device described in item 8 of the scope of patent application, where: The control unit obtains the thrust force or deviation waveform of the motor driver of the second drive unit by the vibration measuring device, and calculates and saves the thrust correction waveform of the second mounting head based on the thrust force or deviation waveform. For example, the installation device described in item 1 of the scope of patent application, which has: Bracket, is installed with an installation table; The first beam extends in the first direction across the bracket, and its two ends are respectively supported on the bracket so as to be free to move in the second direction; and The second beam extends in the aforementioned first direction in a manner of straddling the aforementioned support, and its two ends are respectively supported on the aforementioned support so as to be free to move in the aforementioned second direction; The aforementioned first mounting head is supported by the aforementioned first beam so as to be freely movable in the aforementioned second direction; The aforementioned second mounting head is supported by the aforementioned second beam so as to be freely movable in the aforementioned second direction; The control part is configured by the first driving part to move the first beam in the first direction, and the second driving part to move the second beam in the first direction. For example, the installation device described in item 10 of the scope of patent application, which has: Flip the pick-up head, which picks up and flips the die from the die supply part; The first transposing head can freely move in the aforementioned first direction, and pick up the aforementioned crystal grains picked up by the aforementioned reversing pick-up head; The second transposing head can freely move in the aforementioned first direction, and pick up the aforementioned crystal grains picked up by the aforementioned reversing pick-up head; The first intermediate worktable is free to move in the second direction and holds the crystal grains picked up by the first transposition head; and The second intermediate worktable is free to move in the aforementioned second direction and carries the aforementioned crystal grains picked up by the aforementioned first transposition head; The aforementioned first mounting head picks up the aforementioned die placed on the aforementioned first intermediate table; The second mounting head picks up the crystal grains placed on the second intermediate table. For example, the installation device described in item 1 of the scope of patent application, which has: The first pick-up head is capable of moving freely in the second direction and supplies and picked up the crystal grains from the crystal grains; The second pick-up head can move freely in the aforementioned second direction and supply and pick up the crystal grains from the aforementioned crystal grains; The first intermediate workbench is for placing the aforementioned crystal grains picked up by the aforementioned first pick-up head; and The second intermediate workbench is for placing the aforementioned crystal grains picked up by the aforementioned second pick-up head; The aforementioned first mounting head picks up the aforementioned die placed on the aforementioned first intermediate table; The second mounting head picks up the crystal grains placed on the second intermediate table. A method of manufacturing a semiconductor device, which is characterized by having: Prepare to apply for the installation project described in any one of items 1 to 11 of the scope of patent; The process of preparing the substrate; The process of picking up the aforementioned crystal grains from the crystal grain supply part; The process of reversing the aforementioned die that was picked up; and The process of picking up the inverted die and placing it on the substrate. A method of manufacturing a semiconductor device, which is characterized by having: Prepare to apply for the installation of the device described in any one of items 1 to 9 and 12 of the patent scope; The process of preparing the substrate; The process of picking up the aforementioned crystal grains from the crystal grain supply part; The process of picking up the picked-up die and placing it on the substrate.

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