TW202329289A - Mounting apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

The invention provides a mounting apparatus for improving mounting alignment accuracy and a method for manufacturing a semiconductor device. The mounting device is provided with: a stand on which the mounting table is mounted; a beam portion extending in a first direction so as to span over the gantry, both ends of the beam portion being supported on the gantry so as to be movable in a second direction; a mounting head part which is supported by the beam part so as to be movable in the first direction; a reference member extending in the first direction and having both ends supported, the reference member being separated from the beam portion; and a detection head provided on the mounting head so as to face the reference member. The detection head is configured to detect a positional relationship with the reference member.

Description

Mounting device and method of manufacturing semiconductor device

The present invention relates to a mounting device, and is applicable to, for example, a mounting device provided with a beam.

Conventionally, as one type of component mounting apparatus, there is a substrate mounter that holds a component from a component supply unit to be transported above the substrate with respect to a fixed substrate, lowers the component, and mounts the component on the component. This mounting machine must accurately reproduce the position of "the XY direction (in the horizontal plane) of the part to be held". In addition, in order to increase the productivity of mounted boards, it is necessary to increase the speed of "transporting parts from the parts supply to the top of the board and positioning them in the XY direction" and "returning to the parts supply after mounting the parts" as much as possible. "up to the end" speed, etc.

In view of this, the component mounting machine as a mounting device has a structure including the following parts: the X beam extends in the X-axis direction and is fixed to the base; the Y beam is mounted so as to be slidable relative to the X beam, and is arranged to Extending in the Y-axis direction; the installation head is installed to be slidable relative to the Y-beam. In this way, it becomes a device that can transport parts accurately and at high speed. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-145607

[Problem to be solved by the invention]

In the mounting device as described above, in the Y beam on which the mounting head is slidably mounted, there is a "bend" caused by "the weight or thermal deformation of the Y beam and the mounting head", and there is a "contrast of the mounting position". Accuracy deterioration".

An object of the present invention is to provide a technique capable of improving the alignment accuracy of mounting positions. Other purposes and novel features can be clearly understood from the records and drawings in the specification of this case. [means to solve the problem]

The most typical examples of the present invention will be briefly described as follows. That is, the mounting device includes: a frame that can be mounted on the mounting table; a beam that extends in a first direction over the frame and is supported on the frame at both ends so that it can move freely in a second direction; The mounting head is supported by the beam freely movable toward the first direction; the reference member is separated from the beam and extends in the first direction and is supported at both ends; the detection head is supported by and The above-mentioned reference member is arranged on the above-mentioned installation head in a manner of facing each other. The foregoing detection head constitutes: it is used to detect the positional relationship with the foregoing reference member. [Effect of the invention]

According to the present invention, mounting position alignment accuracy can be improved.

Hereinafter, comparative examples, embodiments, modifications, and examples will be described in detail using the drawings. However, in the following description, the same components are denoted the same, and the repeated description of these parts may be omitted. In order to explain more clearly, the width, thickness, shape, etc. of each part may be schematically shown in the drawings compared with the actual state, but this is only an example and is not intended to limit the interpretation of the present invention. .

First, a mounting device of a comparative example will be described using FIGS. 1 to 3 . FIG. 1 is a plan view schematically showing a mounting device of a comparative example. FIG. 2 is a front view schematically showing the mounting device of FIG. 1 . FIG. 3 is a side view schematically showing the mounting device of FIG. 1 .

The mounting device 100R of the comparative example is a device that transports the component 300 above the workpiece 200 from a component supply unit (not shown in the drawing), and mounts the transported component 300 on the workpiece 200 . The mounting device 100 includes: a frame 110, a mounting table 120 supported on the frame 110, an X support table 131 provided on the frame 110, a Y beam 140 supported on the X support table 131, and a Y beam 140 supported by the Y beam 140. The mounting head 150. In addition, the X-axis direction and the Y-axis direction are directions perpendicular to each other on a horizontal plane. In this comparative example, the extending direction of the Y beam 140 will be described as the Y-axis direction (first direction), and will be formed with the Y-axis direction. The orthogonal direction will be described as the X-axis direction (second direction). In addition, the Z-axis direction (third direction) is an up-down direction perpendicular to the XY plane. The Y beam 140 is provided with a linear scale 161 extending along the Y-axis direction.

The mounting head 150 includes: a mounting head 151 having holding means for detachably holding the component 300 ; and a driving unit 152 that drives the mounting head 150 in the Z-axis direction. The drive unit 152 is attached to the Y-beam 140 so as to be able to reciprocate freely in the Y-axis direction. The detection head 162 is disposed on the upper part of the driving part 152 of the installation head 150 opposite to the linear scale 161 .

In the case of this comparative example, the mounting head 150 includes three mounting heads 151, and each mounting head 151 includes a holding means 151a having a nozzle for holding the component 300 by vacuum suction. In addition, the driving unit 152 can independently move the mounting heads 151 up and down in the Z-axis direction. The mounting head 151 has a function of holding and conveying the component 300 and mounting the component 300 on “the workpiece 200 adsorbed and fixed on the mounting table 120 ”.

The guide 132 provided on the X support 131 is a member that guides the Y beam 140 slidably in the X-axis direction. In the case of this comparative example, two X supports 131 are arranged in parallel, and each X support 131 is fixed to the frame 110 in a state extending in the X-axis direction. The X support stand 131 may also be integrally formed with the frame 110 .

The sliding member 143 is mounted on the guide member 132 so as to be able to move freely in the X-axis direction. Then, each leg portion 142 of the Y beam 140 is attached to each slider 143 of the two guides 132 . That is to say, the main beam portion 141 of the Y beam 140 extends in the Y-axis direction so as to straddle the mounting table 120, and the leg portions 142 at both ends are mounted on the slider 143, and by being mounted on the X support table The guide 132 of 131 is supported so as to be able to move freely in the X-axis direction. Since the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (upper surface of the slider 143 ) are on the same plane, the main beam portion 141 is provided at a position not higher than the X support platform 131 .

The Y beam 140 is a rod-shaped member arranged to extend in the Y-axis direction. The shape of the XZ cross-section of the Y-beam 140 has a trapezoid which is a combination of a square and a right triangle.

The Y beam 140 is a member used to guide the reciprocating movement of the mounting head 150 in the Y-axis direction. Once the reciprocating mounting head 150 vibrates, problems such as "the held part 300 falls" will occur. In addition, , in order to transport the component 300 to a correct position, it is necessary to suppress warping and the like as much as possible. Therefore, the Y-beam 140 must have sufficient structural strength. In addition, the Y-beam 140 is a member that linearly reciprocates along the X support table 131 together with the mounting head 150 , and the lighter the weight, the higher the speed at which the component 300 can be conveyed.

Next, problems of the mounting device of the comparative example will be described using FIGS. 4 to 6 . Fig. 4 is a schematic front view for explaining a problem of a mounting device of a comparative example. Fig. 5 is a schematic side view for explaining a problem of a mounting device of a comparative example. Fig. 6 is a schematic plan view for explaining a problem of a mounting device of a comparative example.

As shown in FIG. 4 , the main beam portion 141 bends due to the weight of the main beam portion 141 and the attachment head 150 or thermal expansion of the main beam portion 141 (first problem). As a result, the mounting head 150 falls down, which affects the mounting position (bonding position) and the fall of parts (such as die).

In addition, as shown in FIG. 5 , the main beam portion 141 is twisted due to the weight of the main beam portion 141 and the attachment head 150 or thermal expansion of the main beam portion 141 (second problem). As a result, the mounting head 150 falls down, which affects the mounting position (bonding position) and the fall of parts (such as die).

Furthermore, as shown in FIG. 6 , the main beam portion 141 is bent due to thermal expansion of the main beam portion 141 (third problem). As a result, the mounting head 150 falls down, which affects the mounting position (bonding position) and the fall of parts (such as die). Since the "linear scale 161 provided on the main beam portion 141" is also affected by the deformation, the "influence caused by the deformation of the main beam portion 141" cannot be captured by the detection head 162, and thus cannot be corrected.

In the mounting device of the present invention, in order to solve at least one of the above-mentioned problems, a reference member (for example, a rod-shaped member) serving as a "standard for measuring the position of the mounting head" is prepared. It is preferable that the material of the reference member is not easily affected by heat, is light in weight, and has high rigidity. In addition, the reference member is held at a position separated from the main beam portion without being affected by heat, weight, and deformation of the main beam portion. Then, on the installation head, a sensor for detecting the position of the installation head is provided. The measurement object of the sensor is the reference member itself, or the measurement object of the sensor is arranged on the reference member.

Hereinafter, specific examples will be given about typical embodiments and modifications thereof. In the description of the following embodiments and modified examples, the same symbols as those of the above-mentioned comparative example are used for portions having “the same structure and function as those described in the above-mentioned comparative example”. Then, for the description of the relevant parts, the description in the above-mentioned comparative example can be appropriately followed within the range that is not technically contradictory. In addition, all or part of the comparative example, all or part of the plurality of embodiments, and all or part of the plurality of modification examples can be used suitably and integrally within a range that is not technically contradictory.

＜First Embodiment＞ In the first embodiment, the displacement sensor is used as the sensor for detecting the "position of the mounting head", and the reference member itself is used as the measuring object of the sensor.

The structure of the mounting device of the first embodiment will be described using FIGS. 7 to 9 . Fig. 7 is a plan view schematically showing the mounting device of the first embodiment. Fig. 8 is a sectional view of line A-A shown in Fig. 7 . Fig. 9 is a front view schematically showing the mounting device shown in Fig. 7 . Fig. 35 is a view showing a method of fixing a reference rod to a supporting member. The mounting head 151 is omitted in FIGS. 8 and 9 .

The mounting device 100 of the first embodiment has the same structure as the mounting device 100R of the comparative example. However, the mounting device 100 of the first embodiment further includes: a reference rod 171 as a reference member; support members 172 and 173 for supporting the reference rod 171 ; and a detection head 174 .

The reference rod 171 is located below the main beam portion 141 of the Y-beam 140 and at a position separated from the main beam portion 141 , and is provided parallel to the main beam portion 141 . The reference rod 171 is, for example, in the shape of a tetrapod, and is preferably formed of a light-weight, high-rigidity material that is not easily affected by heat (small thermal expansion coefficient). The reference rod 171 can be made of the following materials, for example: ceramics, silicon carbide (SiC), carbon fiber reinforced plastic (Carbon Fiber Reinforced Plastic: CFRP), impregnated aluminum alloy ceramics, invar alloy, and quartz glass (SiO ₂ ). wait. The reference rod 171 is supported by a pair of support members 172 and 173 .

The support members 172, 173 are crank-shaped in the front view, and have: a first extension portion and a second extension portion extending along the Y-axis direction; extending in the up-down direction, and connecting the first extension portion and the second extension portion the third extension of . The first extension part is fixed between the foot part 142 and the slider 143 . The second extension is located below the first extension, and supports the reference rod from below.

The reference rod 171 is deformed in the Y-axis direction of the frame 110 due to expansion of the Y beam 140 or the like. Then, the support members 172, 173 sometimes move together with the deformation of the frame. In order not to be affected by the movement of the support members 172,173, the reference rod 171 is preferably supported by the support members 172,173. For example, one end of the reference rod 171 is fixed to the support member 172 as a reference, and the other end of the reference rod 171 is kept free on the support member 173 .

Specifically, the end of the reference rod 171 in the dotted ellipse A of FIG. The end of the reference rod 171 within the dashed ellipse B in FIG. 9 is provided with a key 171a on the reference rod 171 and a groove 173a on the support member 173 as shown in B1 and B2 of FIG. 9 . Herein, B2 in FIG. 9 is a cross-sectional view along line C-C shown in B1. Thereby, the reference rod 171 is fixed in the rotational direction and movable in the linear direction. In this way, as long as "one end of the reference rod 171 is fixed, the rotation direction is restricted, and the other end is supported by the sliding mechanism", it is not easily affected by the overall distortion. When no load is applied to the reference rod 171 in accordance with the precision of the structure and operation, the fixing of the supporting member 172 by screws or the like is a simple structure, and thus the cost is low. The end of the reference rod 171 within the dotted ellipse A in FIG. 9 may be fixed to the supporting member 172 by a fixing member 176 so as to be rotatable in the XY plane as shown in FIG. 35 . Accordingly, when the support members 172 and 173 cannot be kept parallel, force is less likely to act on the reference rod 171 .

As shown in FIG. 8 , the detection head 174 is installed on the lower part of the driving part 152 under the main beam part 141 . The detection head 174 has a sensor (displacement sensor) for measuring the distance (d) from the reference rod 171 . The installation device 100 has a control device for monitoring and controlling the operation of each part. The control device, based on the position measured by the detection head 174, controls the driving part that "drives the Y beam 140 toward the X-axis direction" and the driving part that "drives the mounting head 150 toward the Y-axis direction" to correct The location of the mounting head 150 . Details will be described later.

Hereinafter, the displacement sensor will be described. Mount the displacement sensor on the mounting head, and measure the distance to the reference rod in each direction. In the case where the reference rod is located below the displacement sensor as in the present embodiment, the distance in the Z direction can be measured. In the case where the reference rod is located on the side of the displacement sensor, the distance in the X direction or the Y direction can be measured. When the reference rod is not deformed, but the measured value has changed, it can be judged as "positioning error". As a displacement sensor, for example, an optical type (triangulation/coaxial confocal) can be used. The coaxial confocal method has the advantages of high precision and space saving. However, once it is out of focus, it cannot be detected, but as long as it is within the focus distance, it can receive light (received light) stably even if the object is tilted. In the case of the triangular ranging method, by using a CMOS or CCD sensor as the light receiving element, it is not easily affected by the color spot or surface state of the object.

Next, position correction of the attachment head 150 will be described using FIGS. 10 and 11 . Fig. 10 is a front view showing a state in which the main beam portion shown in Fig. 7 has been bent. Fig. 11 is a front view showing a state where the mounting head shown in Fig. 10 is located on the right side.

As shown in FIG. 10 , once the main beam portion 141 is deflected, the height of the mounting head 150 will change. The control device can correct the height of the mounting head 151 according to the deflection of the main beam portion 141 by measuring the distance (d) between the “detecting head 174 provided on the mounting head 150 ” and the reference rod 171 .

In addition, the control device calculates the deflection of the beam based on the height change of each position of the mounting head 150 in the Y-axis direction. In this article, the position of the installation head 150 in the Y-axis direction is based on "data obtained by reading the linear scale 161 installed on the main beam part 141 by the detection head 162 installed on the installation head 150". figured out. Then, as shown in FIG. 11, the control device calculates the tilting amount (θ) of the mounting head 150, and corrects the positioning error (Δy) relative to the "target point of the workpiece 200".

(first modified example) A mounting device according to a first modification example will be described with reference to FIGS. 12 and 13 . Fig. 12 is a cross-sectional view of a mounting device according to a first modified example corresponding to a cross section along "line A-A shown in Fig. 7". Fig. 13 is a cross-sectional view showing "the state where the main beam portion is twisted" of the mounting device shown in Fig. 12 .

In the first embodiment, as shown in FIG. 5 , when the main beam portion 141 is twisted, the position of the mounting head 150 cannot be measured. Therefore, in the first modified example, a detection head 175 having a displacement sensor is added.

The detection head 174 is provided on the mounting head 150 in order to be located at a position "separated from the upper surface of the reference rod 171 in the Z direction". The detection head 175 is provided on the mounting head 150 in order to be located at a position where "the side surface of the reference rod 171 is separated in the X direction". The distance in the Z direction can be measured by the detection head 174 , and the distance in the X direction can be measured by the detection head 175 .

As shown in FIG. 13 , when the main beam portion 141 is twisted, the reference rod 171 is close to the detection head 175 , and the reference rod 171 is far away from the detection head 174 . That is, the distance between the detection head 175 and the reference rod 171 in the X direction becomes smaller, and the distance between the detection head 174 and the reference rod 171 in the Z direction becomes larger. Based on this phenomenon, the control device calculates the twist amount of the mounting head 150, and corrects the positioning error (Δx) of the "target point of the workpiece 200".

<Second Embodiment> In the second embodiment, the position reading sensor is used as the sensor for detecting the "position of the installation head", and the linear scale provided on the reference member is used as the measurement of the sensor object used.

Next, a mounting device according to a second embodiment will be described with reference to FIGS. 14 to 17 . Fig. 14 is a plan view schematically showing a mounting device of a second embodiment. Fig. 15 is a front view schematically showing the mounting device shown in Fig. 14 . Fig. 16 is a sectional view taken along line A-A shown in Fig. 14 . Fig. 17 is a cross-sectional view showing "the state where the main beam portion is twisted" of the mounting device shown in Fig. 16 . The mounting head 151 is omitted in FIGS. 15 to 17 .

The mounting device 100 of the second embodiment has the same structure as the mounting device 100 of the first embodiment. However, the mounting device 100 of the second embodiment is provided with a reference rod 271 "with a linear scale 261 on its upper surface" instead of the reference rod 171, and has "a sense of reading the same position as the detection head 162". Detector" detection head 274 to replace the detection head 174. In addition, the linear scale 161 and the detection head 162 of the first embodiment are not provided.

The reference rod 271 has the same structure as the reference rod 171 except that "the linear scale 261 is provided on its side". Like the reference rod 171 , the reference rod 271 is supported by a pair of support members 172 , 173 so as not to be affected by movement of the support members 172 , 173 .

The linear scale 261 will be described using FIG. 18 . Fig. 18 is a diagram illustrating a linear scale of a second embodiment.

The linear scale 261 is composed of the following: the scale 261a is formed with a pattern for reading the position in the Y-axis direction, and the scale 261b is formed with a pattern for reading the X-axis direction. The scale 261a is arranged to extend along the Y-axis direction. The scale 261b is disposed adjacent to the X-axis direction and extends along the Y-axis direction.

The detection head 274 has: sensors 274a and 274b for reading the scale 261a; and a sensor 274c for reading the scale 261b. The sensor 274a is arranged such that its optical axis is perpendicular to the scale 261a. The sensor 274c is arranged such that its optical axis is perpendicular to the scale 261b. The position in the X-axis direction is read by the sensor 274a, and the position in the X-axis direction is read by the sensor 274c.

The sensor 274b is adjacent to the Y-axis direction of the sensor 274a, and is arranged with the optical axis inclined relative to the scale 261a. Once the height of the detection head 274 changes, the intersection position between the optical axis of the sensor 274b and the scale 261a will also change, so the position in the Y-axis direction read by the sensor 274b will also change. Therefore, the control device calculates the difference (dy) between "the position where the sensor 274b reads the scale 261a" and "the position where the sensor 274a reads the scale 261a". The difference (dy) varies according to the height of the probe head 274 . Then, the control device calculates the change (dz) of the position in the Z direction according to the change of the difference (dy), and further calculates the position in the Z direction.

In this way, the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected with one detection head 274 . Accordingly, as shown in FIG. 4 (FIG. 11), in the case where the main beam portion 141 has been deflected, the positioning error in the Y-axis direction can be corrected according to the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction ( Δy). In addition, as shown in FIG. 6 , when the main beam portion 141 is bent, the positioning error (Δx) in the X-axis direction can be corrected according to the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. Moreover, as shown in FIG. 17, in the case where the main beam portion 141 is twisted, the position in the X-axis direction can be corrected according to the position (dx) in the X-axis direction and the position (d) in the Z-axis direction of the mounting head 150. Positioning error (△x).

(second modified example) A mounting device according to a second modified example will be described using FIGS. 19 and 20 . Fig. 19 is a plan view schematically showing a mounting device of a second modified example. Fig. 20 is a plan view showing a state in which the main beam portion shown in Fig. 19 has been bent.

The mounting device 100 of the second modified example has a reference rod 371; supporting members 372, 373 and a detection head 374 for supporting the reference rod 371, instead of the reference rod 271 of the second embodiment; The supporting components 172 , 173 and the detection head 274 .

The reference rod 371 is located on the side of the main beam portion 141 of the Y-beam 140 and is separated from the main beam portion 141 , so as to be parallel to the main beam portion 141 . The reference rod 371 has the same shape as the reference rod 171 and is made of the same material. Like the reference rod 171 , the reference rod 371 is supported by a pair of support members 372 , 373 so as not to be affected by movement of the support members 372 , 373 .

The supporting members 372 and 373 have the same structure as the supporting members 172 and 173 . That is, the support members 372, 373 are crank-shaped in a plan view, and have: a first extension portion and a second extension portion extending along the Y-axis direction; extending in the X direction, and connecting the first extension portion and the second extension portion The third extension of the second extension. The first extension part is fixed to the foot part 142 . The second extension portion is located further away from the main beam portion 141 in the X direction than the first extension portion, and supports the reference rod 371 from the side.

The reference rod 371 has the same linear scale as the reference rod 271 at a position facing the detection head 374 . In addition, the detection head 374 is provided in the same position as "the detection head 162 of the first embodiment", and has the same sensor as the detection head 274 .

The detection head 374 arranged on the installation head 150 reads the linear scale provided on the "reference rod 371 arranged to be separated from the main beam part 141 in the X direction", and measures the installation head 150. s position. The reference rod 371 is not affected by the deformation of the main beam portion 141 , and the positional relationship between the reference rod 371 and the sensor of the detection head 374 changes.

In this way, the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected with one detection head 374 . Accordingly, as shown in FIG. 4 ( FIG. 11 ), when the main beam portion 141 is deflected, the positioning error in the Y-axis direction can be corrected according to the positions of the mounting head 150 in the Y-axis direction and the Z-axis direction. In addition, as shown in FIG. 20 , when the main beam portion 141 is deflected, the positioning error in the X-axis direction can be corrected according to the positions of the mounting head 150 in the X-axis direction and the Y-axis direction. Moreover, as shown in FIG. 17 , when the main beam portion 141 is twisted, the positioning error in the X-axis direction can be corrected according to the positions of the installation head 150 in the X-axis direction and the Z-axis direction.

<Third Embodiment> In the third embodiment, the position reading sensor is used as the sensor for detecting the "position of the mounting head", and two reference members are used, and the linear scale provided on each reference member, It is used as the measurement object of the sensor.

The structure of the mounting device of the third embodiment will be described using FIGS. 21 to 23 . Fig. 21 is a plan view schematically showing a mounting device according to a third embodiment. Fig. 22 is a front view schematically showing the mounting device shown in Fig. 21 . Fig. 23 is a cross-sectional view along line A-A shown in Fig. 21. The mounting head 151 is omitted in FIGS. 22 and 23 .

The mounting device 100 of the third embodiment has the same structure as the mounting device 100 of the second embodiment. However, the mounting device 100 of the third embodiment includes support members 472 and 473 instead of the support members 172 and 173 , and the mounting device 100 of the third embodiment further includes a reference rod 471 and a detection head 474 .

The reference rod 471 has the same structure as the reference rod 271 . However, the reference rod 471 has the linear scale 261 on the lower side. Like the reference rod 171 , the reference rods 271 , 471 are supported by a pair of support members 472 , 473 so as not to be affected by movement of the support members 472 , 473 .

The support members 472, 473 have, in the front view: a first extension, a second extension, and a fourth extension extending along the Y-axis direction; extending in the up-down direction, and connecting the first extension and the second extension and the third extension of the fourth extension. The first extension part is fixed between the foot part 142 and the slider 143 . The second extension portion is located below the first extension portion, and supports the reference rod 271 from below. The fourth extension portion is located above the first extension portion, and supports the reference rod 471 from below.

The detecting head 474 is installed on the upper part of the driving part 152 below the main beam part 141 and below the reference rod 471 . The detection head 474 has the same structure as the detection head 274 .

The detection head 274, 474 arranged on the installation head 150 reads the linear scale set on the "reference rod 271, 471 arranged to be separated from the main beam part 141 in the Z direction", and measures The location of the mounting head 150 . The reference rods 271, 471 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 271, 471 and the sensors of the detection heads 274, 474 changes.

Next, position correction of the attachment head 150 will be described using FIGS. 24 and 25 . Fig. 24 is a front view showing a state in which the main beam portion shown in Fig. 22 has been bent. Fig. 25 is a cross-sectional view showing a twisted state of the main beam portion shown in Fig. 23 .

With the detection heads 274 and 474, the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected. Accordingly, as shown in FIG. 24 , when the main beam portion 141 is deflected, Y can be corrected according to the position (dy) in the Y-axis direction and the position (dz) in the Z-axis direction of the detection heads 274, 474. The positioning error in the axial direction (△y). In addition, as shown in FIG. 6 , when the main beam portion 141 is deflected, the positioning error in the X-axis direction can be corrected according to the positions of the detection heads 274 , 474 in the X-axis direction and the Y-axis direction. Moreover, as shown in FIG. 25, in the case where the main beam portion 141 is twisted, the X-axis can be corrected according to the position (dx) in the X-axis direction and the position (dz) in the Z-axis direction of the detection heads 274, 474. Orientation error (△x).

(third modified example) The structure of the attachment apparatus of the 3rd modification is demonstrated using FIG. 26 and FIG. 27. FIG. Fig. 26 is a front view schematically showing a mounting device of a third modified example. Fig. 27 is a cross-sectional view at a position corresponding to "line A-A shown in Fig. 21". In FIGS. 26 and 27 , the mounting head 151 is omitted.

The mounting device 100 of the third modified example has the same structure as the mounting device 100 of the third embodiment. However, the attachment device 100 of the third modified example includes the support members 172 and 173 of the second embodiment instead of the support members 472 and 473 , and includes a reference rod 571 instead of the reference rod 471 .

The reference rod 571 has the same structure as the reference rod 271 . However, the reference rod 571 has the linear scale 261 on the lower side. Like the reference rod 271 , the reference rod 571 is supported by the upper surfaces of the pair of leg parts 142 so as not to be affected by the movement of the leg parts 142 .

In this modified example, the detection heads 274 and 474 arranged on the mounting head 150 read the reference rod 271, which is arranged so as to be separated from the main beam part 141 in the Z direction, as in the third embodiment. 471” linear scale to measure the position of the installation head 150. The reference rods 271, 471 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 271, 471 and the sensors of the detection heads 274, 474 changes. In addition, the detection heads 274 and 474 can detect the posture of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction. Accordingly, in this modified example, the positioning errors (Δx, Δy) can be corrected similarly to the third embodiment.

(Fourth modified example) The structure of the attachment device of the 4th modification is demonstrated using FIG.28 and FIG.29. Fig. 28 is a front view schematically showing a mounting device of a fourth modified example. Fig. 29 is a cross-sectional view at a position corresponding to "line A-A shown in Fig. 21". The mounting head 151 is omitted in FIGS. 28 and 29 .

The mounting device 100 of the fourth modification has the same structure as the mounting device 100 of the third modification. However, the attachment device 100 of the fourth modified example includes a reference rod 671 instead of the support members 172 and 173 and the reference rod 271 , and includes a detection head 674 instead of the detection head 274 .

The reference rod 671 has the same structure as the reference rod 571 . However, like the reference rod 571 , the reference rod 671 is supported by the lower surfaces of the pair of leg parts 142 so as not to be affected by the movement of the leg parts 142 .

The detection head 674 is located below the main beam portion 141 and the reference rod 671 , and is mounted on the lower portion of the driving portion 152 . The detection head 674, although the structure is the same as that of the detection head 274, is mounted to read the linear scale of the reference rod 671 provided above.

In this modified example, the detection heads 674 and 474 arranged on the mounting head 150 read the reference rod 671, which is arranged so as to be separated from the main beam part 141 in the Z direction, as in the third embodiment. 571” linear scale to measure the position of the installation head 150. The reference rods 671, 571 are not affected by the deformation of the main beam portion 141, and the positional relationship between the reference rods 671, 571 and the sensors of the detection heads 674, 474 changes. In addition, with the detection heads 674 and 474, the postures of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected. Accordingly, in this modified example, the positioning errors (Δx, Δy) can be corrected similarly to the third embodiment.

(fifth modified example) The structure of the mounting device of the fifth modified example will be described using FIG. 30 and FIG. 31 . Fig. 30 is a front view schematically showing a mounting device of a fifth modified example. Fig. 31 is a cross-sectional view at a position corresponding to "line A-A shown in Fig. 21". The mounting head 151 is omitted in FIGS. 30 and 31 .

The mounting device 100 of the fifth modified example has the same structure as the mounting device 100 of the third modified example. However, the mounting device 100 of the fifth modified example includes support members 772, 773 and a reference rod 771 instead of the support members 172, 173 and the reference rod 271, and a detection head 774 instead of the detection head 274. Rod 871 and detection head 874, to replace reference rod 571 and detection head 474.

The reference rod 771 has the same structure as the reference rod 271 . However, the reference rod 771 has the linear scale 261 on the side. Like the reference rod 271 , the reference rod 771 is supported by a pair of support members 772 and 773 so as not to be affected by movement of the support members 772 and 773 .

The reference rod 871 has the same structure as the reference rod 571 . However, the reference rod 871 has the linear scale 261 on the side. Like the reference rod 571 , the reference rod 871 is supported by the upper surfaces of the pair of leg parts 142 so as not to be affected by the movement of the leg parts 142 .

The support members 772, 773, the same as the support members 172, 173, are crank-shaped in the front view, and have: a first extension part and a second extension part extending along the Y-axis direction; A third extension of the first extension and the second extension. The first extension part is fixed between the foot part 142 and the slider 143 . The second extension is located below the first extension, and supports the reference rod from below. However, the third extension portion of this modified example is configured to be shorter than the third extension portion of the support members 172 , 173 .

The detection head 774 is attached to the lower part of the driving part 152 below the main beam part 141 and faces the side surface of the reference rod 771 . The detection head 774, although the structure is the same as the detection head 274, is installed to: read the linear scale of the reference rod 771 that is located on the side.

The detection head 874 is attached to the upper part of the driving part 152 above the main beam part 141 and faces the side surface of the reference rod 871 . The detection head 874, although the structure is the same as the detection head 274, is installed to: read the linear scale of the reference rod 871 that is located at the side.

In this modified example, the detection heads 774 and 874 arranged on the attachment head 150 read the reference rod 771, which is arranged so as to be separated from the main beam part 141 in the Z direction, as in the third embodiment. 871” linear scale to measure the position of the installation head 150. The reference rods 771 , 871 are not affected by the deformation of the main beam portion 141 , and the positional relationship between the reference rods 771 , 871 and the sensors of the detection heads 774 , 874 changes. In addition, with the detection heads 774 and 874, the postures of the mounting head 150 in three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected. Accordingly, in this modified example, the positioning errors (Δx, Δy) can be corrected similarly to the third embodiment.

<Fourth Embodiment> A mounting device according to a fourth embodiment will be described using FIGS. 32 to 34 . Fig. 32 is a plan view schematically showing a mounting device according to a fourth embodiment. Fig. 33 is a front view schematically showing the mounting device shown in Fig. 32 . Fig. 34 is a view showing a state in which the mounting head and the like of the mounting device shown in Fig. 8 have been tilted down. The mounting head 151 is omitted in FIGS. 32 to 34 .

In the first embodiment, as shown in FIG. 34 , when the X support table 131 is deformed due to thermal expansion or the like, the guide 132 is also deformed, and the beam 140 and the mounting head that move in the X direction on the guide 132 are deformed. 150, the reference rod 171, and the supporting members 172 and 173 are in a tilted posture. In this case, since the positional relationship between the detection head 174 arranged on the mounting head 150 and the reference rod 171 does not change, it is impossible to grasp the rotation of the mounting head 150 "using the Y-axis as the rotation axis". (dump).

In view of this, the installation device 100 of the fourth embodiment, as shown in FIG. 33 , is further provided with respect to the installation device 100 of the first embodiment: reference rods 971, 972; members 973,974; and detection heads 975,976.

As shown in FIG. 32 , the reference rods 971 and 972 are arranged to extend in the X direction, and are fixed to the frame 110 by fixing members 973 and 974 . The reference rods 971, 972 are parallel to the direction in which the guide 132 extends, and are arranged at positions where they do not interfere with the "reference rod 171; support members 172, 173, and mounting head 151". The reference rods 971 and 972 have the same structure as the reference rod 271 except for the "linear scale provided on the upper surface".

As shown in FIG. 33 , the detection heads 975 and 976 are provided on the supporting members 172 and 173 so as to be located at "positions separated above the reference rods 971 and 972". The detection heads 975 and 976 are components in which the "sensor 274c for reading the scale 261b" is removed from the detection head 274. However, the sensor 274b is adjacent to the X-axis direction of the sensor 274a, and is arranged with the optical axis inclined relative to the scale 261a.

Once the height of the detection heads 975 and 976 changes, the intersection position between the optical axis of the sensor 274b and the scale 261a will also change, so the position in the X-axis direction read by the sensor 274b will also change. Therefore, the control device calculates the difference (dx) between "the position at which the sensor 274b reads the scale 261a" and "the position at which the sensor 274a reads the scale 261a". The difference (dx) varies according to the height of the detection head 274 . Then, the control device calculates the change (dz) of the position in the Z direction according to the change of the difference (dx), and further calculates the position in the Z direction.

In this way, the postures of the reference rod 171 (mounting head 150 ) in two directions of the X-axis direction and the Z-axis direction can be detected by the detection heads 975 and 976 . Accordingly, as shown in FIG. 39 , in the case where the mounting head 150 has fallen over, the position in the X-axis direction can be corrected according to the position (dx) in the X-axis direction and the position (d) in the Z-axis direction of the mounting head 150. Positioning error (△x).

The reference rods 971 , 972 have the same structure as the reference rod 171 , and the detection heads 975 , 976 can also have the same structure as the detection head 174 .

Hereinafter, an example in which "the Y-beam according to the above-mentioned embodiment" is applied to a flip-chip bonder which is one example of a mounting device will be described, but the present invention is not limited thereto, and can also be applied to mounting a "packaged semiconductor device" or the like on a A chip mounter (surface mounter) for a substrate and a die bonder for bonding a semiconductor wafer (die) to a substrate or the like. Flip chip bonders are used, for example, in the manufacture of packages that "form a rewiring layer (rewiring layer) over a wide area exceeding the chip area", that is, Fan Out Wafer Level Package (FOWLP). [Example]

FIG. 36 is a schematic plan view showing the flip chip bonder of the embodiment. Fig. 37 is a diagram explaining "in Fig. 36, when viewed from the direction of the arrow A, the actions of picking up the rotary head, the transfer head and the crimping head" are shown.

The flip chip bonder 10 generally includes: a die supply unit 1, a pick-up unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6K, a substrate carry-out unit 6H, a monitoring and control The control device 7 of the above-mentioned various parts.

First, the die supply unit 1 supplies dies D for mounting on a substrate P. As shown in FIG. The crystal grain supply part 1 has: a wafer holding table 12, which is used to hold the divided wafer 11; a lifting unit 13, which is indicated by a dotted line in the drawing, lifts the crystal grain D from the wafer 11; the wafer ring supply part 18. The die supply unit 1 moves in the XY direction by a driving means not shown in the drawing, and moves the picked-up die D to the position of the lifting unit 13 . The wafer ring supply unit 18 has a cassette containing wafer rings, sequentially supplies the wafer rings to the die supply unit 1 , and exchanges new wafer rings. The die supply unit 1 moves the wafer ring to a pick-up point so that a desired die can be picked up from the wafer ring. The wafer ring is a jig that can fix the wafer and be installed in the die supply unit 1 .

The pick-up unit 2 has: a pick-up turret 21 that picks up the die D and reverses it; various drive units not shown in the figure are used to lift, rotate, reverse and move the collet 22 in the X direction. With such a structure, the pick-up rotary head 21 picks up the die, rotates the pick-up rotary head 21 by 180 degrees, and reverses the bump of the die D to face downward, forming a "transfer die D to transfer Head 81" posture.

The transfer unit 8 receives the inverted die D from the pick-up turret 21 and places it on the intermediate stage 31 . The transfer part 8 has: a transfer head 81 with a collet 82, which is the same as the pick-up turret 21, and the collet 82 absorbs and holds the die D at the front end; a Y drive part 83 urges the transfer head 81 to move in the Y direction.

The intermediate stage part 3 has: an intermediate stage (intermediate stage) 31 for temporarily placing the die D; a platform (stage) identification camera 34 . The intermediate table 31 can move in the Y direction by a driving unit not shown in the figure.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it to the substrate P that has been carried. The joint part 4 has: a crimping head 41, which is equipped with a collet 42, which is the same as the pick-up turret 21, and the collet 42 absorbs and holds the die D at the front end; a Y beam 43, which promotes the crimping head 41 to move in the Y direction; the substrate The recognition camera 44 photographs the position recognition mark (not shown in the figure) of the substrate P, and recognizes the joining position; the X supporting table 45 . With such a structure, the crimping head 41 picks up the die D from the intermediate stage 31 and bonds the die D to the substrate P according to the photographed data of the substrate recognition camera 44 .

The conveyance part 5 is equipped with the conveyance rails 51 and 52 by which the board|substrate P can move to X direction. The conveyance rails 51 and 52 are provided in parallel. With such a structure, the substrate P is unloaded from the substrate supply unit 6K, moved to the joining position along the transport rails 51, 52, moved to the substrate carry-out unit 6H after bonding, and then transferred to the substrate carry-out unit 6H. In the process of bonding the die D to the substrate P, the substrate supply unit 6K unloads a new substrate P and waits on the conveyance rails 51 and 52 .

The control device 7 has: a memory for storing programs (software) for “monitoring the actions of various parts of the flip chip bonder 10”; a central processing unit (CPU) for executing the programs stored in the memory.

FIG. 38 is a schematic cross-sectional view showing main parts of the crystal grain supply unit shown in FIG. 36 . The die supply unit 1 has: an expand ring 15 for holding the wafer ring 14; a support ring 17 for horizontally positioning the wafer to which "a plurality of die D held by the wafer ring 14" has been pasted. A dicing tape 16 ; a jacking unit 13 for jacking up the die D upward. In order to pick up a specific die D, the lifting unit 13 moves in the vertical direction by a driving mechanism not shown in the figure, so that the die supply unit 1 moves in the horizontal direction.

Referring to the comparative example and the second embodiment, the joining portion will be described using FIG. 2 , FIG. 15 , and FIG. 39 . FIG. 39 is a schematic side view showing the main part of the junction part 4. As shown in FIG. Some constituent elements are shown in perspective. The side view of FIG. 39 corresponds to the front views of FIGS. 2 and 15 . However, in FIG. 39, the support members 172, 173; the reference rod 271 and the detection head 274 are omitted.

The junction part 4 is equipped with: a junction table BS (mounting table 120), which is supported on the frame 53 (frame 110); Y beam 140), is supported on the X supporting table 451; Crimping head 41 (mounting head 151), is supported by Y beam 43; Driving part 46 (driving part 152), makes crimping head 41 towards Y axis direction and Z axis direction driving; the driving part (not shown in the figure) drives the Y beam 43 towards the X direction.

The crimp head 41 is a device having "a collet 42 (holding means 151a) that detachably holds the die D (part 300)", and is attached to the Y beam 43 so as to be reciprocable in the Y-axis direction.

In the case of this embodiment, one crimp head 41 is provided, and the crimp head 41 includes a collet 42 for holding the die D by vacuum suction. In addition, the drive unit 46 can move the crimping head 41 up and down in the Z-axis direction. The crimp head 41 has a function of holding and transporting the "die D picked up from the intermediate stage 31" and mounting the die D on the "substrate P (workpiece 200) adsorbed and fixed on the bonding stage BS".

The guide 132 provided on the X support 451 guides the Y beam 43 slidably in the X-axis direction. In the case of this embodiment, two X support stands 451 are arranged in parallel, and each X support stand 451 is fixed to the conveyance rails 52 and 53 in a state extending in the X-axis direction. The X support table 451 may be integrally formed with the conveyance rails 52 and 53 .

As shown in FIG. 36 and FIG. 39 , the slider 433 is mounted on the guide 452 so as to be able to move freely in the X-axis direction. Then, both ends of the Y beam 43 are attached to the respective sliders 433 of the two guides 452 . That is, the Y-beam 43 extends in the Y-axis direction so as to straddle the joining table BS, and the both ends are attached to the slider 433, and are supported by the guide 452 attached to the X support table 451. Can move freely in the X-axis direction. Since the bottom surface of the Y beam 43 is located on the same plane as the upper surface of the slider 433 , the Y beam portion 43 is provided at a position not higher than the X supporting table 451 .

The Y-beam 43 of the embodiment basically has the same structure as the Y-beam 140 of the second embodiment. However, the Y-beam 43 extends farther to the right than the support stand 451 on the right side in the drawing. This is because the crimping head 41 can pick up the die D from the intermediate stage 31 . When the crimping head 41 is moved to the right side of the support table 451 , the crimping head 41 is raised so that the collet 42 is higher than the guide 452 .

Next, a bonding method (method of manufacturing a semiconductor device) implemented in the flip chip bonder of the embodiment will be described with reference to FIG. 40 . FIG. 40 is a flow chart showing "bonding method implemented by the flip chip bonder shown in FIG. 36".

The wafer ring 14 holding “the dicing tape 16 attached with the die D separated from the wafer 11 ” is stored in a wafer cassette (not shown in the drawing), and loaded into the flip chip bonder 10 . The control device 7 supplies the wafer ring 14 to the die supply unit 1 from the cassette loaded with the wafer ring 14 . In addition, the substrate P is prepared and carried into the flip chip bonder 10 . The control device 7 mounts the substrate P on the substrate conveying claws using the substrate supply unit 6K.

(Step S1: pick up wafer die) The control device 7 moves the wafer holding table 12 so that the die D to be picked up is located directly above the lifting unit 13 , and positions the “strip target die” on the lifting unit 13 and the collet 22 . The lifting unit 13 is moved so that the upper surface of the lifting unit 13 is in contact with the back surface of the dicing tape 16 . At this time, the control device 7 adsorbs the dicing tape 16 to the upper surface of the movable jacking unit 13 . The control device 7 lowers the collet 22 while vacuum-suctioning it, lands on the die D to be peeled, and further adsorbs the die D. The control device 7 lifts the collet 22 to peel the die D from the dicing tape 16 . In this way, the die D is picked up by the pick-up rotary head 21 .

(Step S2: Move and pick up the rotary head) The control device 7 causes the pick-up turret 21 to move.

(Step S3: Reverse the pick-up rotary head) The control device 7 rotates the pick-up turret 21 by 180 degrees so that the bump surface (surface) of the die D is reversed to face downward, forming a posture of "transferring the die D to the transfer head 81".

(Step S4: Delivery of transfer head) The control device 7 picks up the die D from the collet 82 of the pick-up turret 21 through the collet 22 of the transfer head 81 to deliver the die D.

(Step S5: reverse pick up rotary head) The control device 7 reverses the pickup turret 21 so that the suction surface of the collet 22 faces downward.

(step S6: moving the transfer head) Before or simultaneously with step S5 , the control device 7 moves the transfer head 81 to the intermediate stage 31 .

(Step S7: Loaded on the intermediate station) The control device 7 places the die D held by the transfer head 81 on the intermediate stage 31 .

(step S8: moving the transfer head) The control device 7 urges the transfer head 81 to move to the delivery position of the die D.

(step S9: move the position of the intermediate station) After or at the same time as step S8 is performed, the control device 7 moves the intermediate table 31 to a delivery position between the crimping head 41 .

(Step SA: Deliver crimp head) The control device 7 picks up the die D from the intermediate table 31 through the collet of the crimping head 41 , and executes the delivery of the die D.

(Step SB: Move the position of the intermediate station) The control device 7 urges the intermediate table 31 to move to the delivery position between the transfer head 81 .

(Step SC: Move crimping head) The control device 7 moves the die D held by the collet 42 of the crimping head 41 onto the substrate P. At this time, the control device 7 controls the driving part 46 and the driving part "used to drive the Y beam 43" according to the positional relationship with the "reference rod detected by the detection head", and corrects the position of the crimping head 41 .

(Step SD: Engagement) The control device 7 picks up the die D from the intermediate table 31 by the collet 42 of the pressure head 41 and places it on the substrate P.

(Step SE: Move crimping head) The control device 7 urges the crimping head 41 to move to the delivery position between the intermediate platform 31 .

After bonding all the dies D to the substrate P, the control device 7 conveys the substrate P to the substrate carry-out unit 6H. The control device 7 takes out the "substrate S to which the die D is bonded" from the substrate conveying claws in the substrate carrying out section 6H. The substrate P is unloaded from the flip chip bonder 10 .

As mentioned above, although the invention proposed by the inventor of this application was concretely demonstrated based on embodiment, a modification, and an Example, this invention is not limited to the said embodiment, a modification, and an Example, and various changes are possible. point is indisputable.

For example, although an example using the Y-beam of the second embodiment has been described in the embodiment, the present invention is not limited thereto, and any of the first embodiment, the third embodiment, and these modification examples may be employed. Any type, or combination of Y-beams.

In addition, in the embodiment, although the example in which the number of crimping heads (mounting heads) was one was described, it is also possible to have a plurality of crimping heads as in the embodiment.

In addition, in the embodiment, although the example in which the number of each of the transfer part, the intermediate table part, and the joining part was one was demonstrated, each may have plural numbers.

In addition, in the embodiment, although the example of "installing the reversing mechanism on the pick-up rotary head, using the transfer head to receive the die from the pick-up rotary head, place the intermediate stage on it, and then move the intermediate stage" has been described, it may also be Form "moving the pick-up rotary head that picks up the die and has been reversed", or can also form "place the picked-up die D on the platform unit on the front and back of the rotatable die, and then move the platform unit" .

100: Installation device 110: frame 120: Installation platform 140: Y beam 150: Install the head 171: Reference pole (reference member) 174: Detection head

[ Fig. 1] Fig. 1 is a plan view schematically showing a mounting device of a comparative example. [ Fig. 2] Fig. 2 is a front view schematically showing the mounting device shown in Fig. 1 . [ Fig. 3] Fig. 3 is a side view schematically showing the mounting device shown in Fig. 1 . [ Fig. 4] Fig. 4 is a schematic front view for explaining problems of the mounting device shown in Fig. 1 . [ Fig. 5] Fig. 5 is a schematic side view for explaining problems of the mounting device shown in Fig. 1 . [ Fig. 6] Fig. 6 is a schematic plan view for explaining problems of the mounting device shown in Fig. 1 . [ Fig. 7] Fig. 7 is a plan view schematically showing the mounting device of the first embodiment. [ Fig. 8] Fig. 8 is a side view schematically showing a cross section along line A-A shown in Fig. 7 . [ Fig. 9] Fig. 9 is a front view schematically showing the mounting device shown in Fig. 7 . [ Fig. 10] Fig. 10 is a front view showing a state where the main beam portion shown in Fig. 7 has been bent. [ Fig. 11] Fig. 11 is a front view showing a state where the mounting head shown in Fig. 10 is located on the right side. [ Fig. 12] Fig. 12 is a cross-sectional view corresponding to "the cross-section along line A-A shown in Fig. 7" of the mounting device according to the first modification. [ Fig. 13] Fig. 13 is a cross-sectional view showing "the state where the main beam portion is twisted" of the mounting device shown in Fig. 12 . [ Fig. 14] Fig. 14 is a plan view schematically showing a mounting device according to a second embodiment. [ Fig. 15] Fig. 15 is a front view schematically showing the mounting device shown in Fig. 14 . [ Fig. 16] Fig. 16 is a sectional view taken along line A-A shown in Fig. 14 . [ Fig. 17] Fig. 17 is a cross-sectional view showing "the state where the main beam portion is twisted" of the mounting device shown in Fig. 16 . [ Fig. 18] Fig. 18 is a diagram illustrating a linear scale according to a second embodiment. [ Fig. 19] Fig. 19 is a plan view schematically showing a mounting device of a second modified example. [ Fig. 20] Fig. 20 is a plan view showing a state in which the main beam portion shown in Fig. 19 has been bent. [ Fig. 21] Fig. 21 is a plan view schematically showing a mounting device according to a third embodiment. [ Fig. 22] Fig. 22 is a front view schematically showing the mounting device shown in Fig. 21 . [ Fig. 23] Fig. 23 is a sectional view taken along line A-A shown in Fig. 21 . [ Fig. 24] Fig. 24 is a front view showing a state in which the main beam portion shown in Fig. 22 has been bent. [ Fig. 25] Fig. 25 is a cross-sectional view showing "the state where the main beam portion is twisted" shown in Fig. 23 . [ Fig. 26] Fig. 26 is a front view schematically showing a mounting device of a third modified example. [ Fig. 27] Fig. 27 is a cross-sectional view at a position corresponding to "line A-A shown in Fig. 21". [ Fig. 28] Fig. 28 is a front view schematically showing a mounting device of a fourth modified example. [ Fig. 29] Fig. 29 is a cross-sectional view at a position corresponding to "line A-A shown in Fig. 21". [ Fig. 30] Fig. 30 is a front view schematically showing a mounting device of a fifth modified example. [ Fig. 31] Fig. 31 is a cross-sectional view at a position corresponding to "A-A line shown in Fig. 21". [ Fig. 32] Fig. 32 is a plan view schematically showing a mounting device according to a fourth embodiment. [ Fig. 33] Fig. 33 is a front view schematically showing the mounting device shown in Fig. 32 . [ Fig. 34] Fig. 34 is a view showing a state in which the mounting head and the like of the mounting device shown in Fig. 8 have been tilted down. [ Fig. 35] Fig. 35 is a view showing a fixing method of fixing a reference rod to a supporting member. [ Fig. 36] Fig. 36 is a schematic plan view showing a flip chip bonder (filp-chip bonder) of an embodiment. [Fig. 37] Fig. 37 is a description of "in Fig. 36, when viewed from the direction of the arrow A, pick up the action of the rotary head (pickup flip head), transfer head (transfer head) and crimping head (bonding head)" picture. [ Fig. 38] Fig. 38 is a schematic cross-sectional view showing main parts of a die supply unit shown in Fig. 36 . [ Fig. 39] Fig. 39 is a schematic side view showing the main part of the joint portion of Fig. 36 . [ Fig. 40] Fig. 40 is a flow chart showing "bonding method implemented by the flip chip bonder shown in Fig. 36".

100: Installation device

110: frame

120: Installation platform

131: X support table

132: guide

141: Main beam part

142: feet

143: Slider

150: Install the head

152: drive unit

161: Linear scale

162: Head detection

171: Reference pole (reference member)

171a: key

172, 173: support member

173a: Groove

174: Detection head

200: workpiece

Claims (16)

A mounting device having: a frame, which can be mounted on a mounting table; a beam extending in a first direction so as to straddle the frame, and supported on the frame at both ends so as to be free to move in a second direction; a mounting head supported by the beam so as to be freely movable in the first direction; a reference member, which is separated from the beam, extends in the first direction, and is supported at both ends; The detection head is arranged on the aforementioned installation head in a manner opposite to the aforementioned reference member, The foregoing detection head constitutes: it is used to detect the positional relationship with the foregoing reference member. The installation device as described in Claim 1, wherein Furthermore, a pair of support members for supporting the aforementioned reference member is provided, One of the support members fixes one end of the reference member, and the other support member movably supports the other end of the reference member. The installation device as described in Claim 1, wherein The aforementioned detection head has: a displacement sensor located above the aforementioned reference component and used to measure the distance to the aforementioned reference component. The installation device as described in claim 3, wherein It further has a detection head, which has: a displacement sensor located on the side of the aforementioned reference member for measuring the distance from the aforementioned reference member. The installation device as described in Claim 1, wherein The aforementioned reference member has a linear scale, The aforementioned detection head has a sensor for reading the scale of the aforementioned linear scale. The installation device as described in claim 5, wherein The aforementioned reference member has: a first linear scale for detecting the position in the first direction, a second linear scale for detecting the position in the second direction, The aforementioned detection head has: relative to the aforementioned first linear scale, a first sensor that reads the scale from a vertical direction; relative to the aforementioned first linear scale, reads the first sensor of the scale from an oblique direction Two sensors; relative to the aforementioned second linear scale, the third sensor reads the scale from the vertical direction. The installation device as described in claim 5, wherein the aforementioned datum member, located below the aforementioned beam, The detection head is provided on the installation head so as to face the upper surface of the reference member. The installation device as described in claim 5, wherein The aforementioned reference member is located on the opposite side of the aforementioned mounting head across the aforementioned beam, The detection head is provided on the installation head so as to face the side surface of the reference member. The installation device as described in claim 5, which further has: a second reference member, which is separated from the beam, extends in the first direction, and is supported at both ends; The second detecting head is arranged on the aforementioned installation head in a manner facing the aforementioned second reference member. The installation device as described in Claim 9, wherein the aforementioned datum member, located below the aforementioned beam, The aforementioned detection head is provided on the aforementioned installation head in such a manner as to face the upper surface of the aforementioned reference member, The aforementioned second reference member is located above the aforementioned beam, The aforementioned second detection head is arranged on the aforementioned installation head in a manner facing the lower surface of the aforementioned second reference member. The installation device as described in Claim 9, wherein the aforementioned datum member, located below the aforementioned beam, The aforementioned detection head is arranged on the aforementioned installation head in such a manner as to face the lower surface of the aforementioned reference member, The aforementioned second reference member is located above the aforementioned beam, The aforementioned second detection head is arranged on the aforementioned installation head in a manner facing the lower surface of the aforementioned second reference member. The installation device as described in Claim 9, wherein the aforementioned datum member, located below the aforementioned beam, The aforementioned detecting head is provided on the aforementioned mounting head in such a manner as to face the side of the aforementioned reference member, The aforementioned second reference member is located above the aforementioned beam, The aforementioned second detection head is provided on the aforementioned mounting head in such a manner as to face the side surface of the aforementioned second reference member. The installation device as described in Claim 1, which further has: A pair of supporting members for supporting the aforementioned reference member; a second reference member extending in the aforementioned second direction and disposed on the aforementioned frame; The second detection head provided on the aforementioned support member in a manner opposite to the aforementioned second reference member, The aforementioned second detection head is configured to detect the positional relationship with the aforementioned second reference member. The installation device as described in claim 2, wherein One of the above-mentioned support members is configured by fixing one end of the above-mentioned reference member so as to be rotatable. A method of manufacturing a semiconductor device, comprising a loading step and a picking step, The above-mentioned carrying-in step carries the substrate into the installation device, and the installation device includes: a frame that can be installed on the installation table; is supported on the aforementioned frame; the mounting head is supported by the aforementioned beam in a freely movable manner toward the aforementioned first direction; the reference member is separated from the aforementioned beam and extends in the aforementioned first direction and is supported at both ends A detection head, which is arranged on the aforementioned installation head in a manner opposite to the aforementioned reference member, and the aforementioned detection head constitutes: used to detect the positional relationship with the aforementioned reference member; The aforementioned picking step, which picks up dies from the wafer held by the wafer ring. The method for manufacturing a semiconductor device as described in claim 15, further comprising: an inverting step, which inverts the aforementioned grains picked up; The placing step is to pick up the reversed die with the mounting head and place it on the substrate.

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