CN115810559A - Mounting apparatus and method for manufacturing semiconductor device - Google Patents

Abstract

The invention provides a mounting apparatus for improving mounting alignment accuracy and a method for manufacturing a semiconductor device. The mounting device is provided with: a stand for mounting the mounting stand; a beam portion extending in a first direction so as to straddle the mount, and having both ends supported on the mount so as to be movable in a second direction; a mounting head portion supported by the beam portion so as to be movable in the first direction; a reference member extending in the first direction and supported at both ends, the reference member being separated from the beam portion; and a detection head provided on the attachment head so as to face the reference member. The detection head is configured to detect a positional relationship with the reference member.

Description

Mounting apparatus and method for manufacturing semiconductor device

Technical Field

The present disclosure relates to a mounting device, and can be applied to a mounting device having a beam portion, for example.

Background

Conventionally, a mounter is known as a component mounting apparatus which holds a component on a fixed substrate from a component supply unit, conveys the component above the substrate, and lowers the component to mount the component on the substrate. The mounter is required to accurately reproduce the position of the held part in the XY direction (in the horizontal plane). On the other hand, in order to improve the productivity of the mounted substrate, it is necessary to increase the speed from the component supply part to the position above the substrate in the XY direction, the speed from the component supply part to the component supply part after the component is mounted, and the like as much as possible.

The mounter as a mounting device has a structure including an X beam extending in an X-axis direction and fixed to a base, a Y beam extending in a Y-axis direction and slidably mounted to the X beam, and a mounting head slidably mounted to the Y beam. Thus, the component can be conveyed accurately and at high speed.

Documents of the prior art

Patent document

Patent document 1: JP patent publication No. 2019-145607

Disclosure of Invention

In the mounting apparatus of this type, a Y beam to which the mounting head is slidably mounted may be bent due to the weight of the Y beam and the mounting head or thermal deformation, and mounting alignment accuracy may be deteriorated.

The problem of the present disclosure is to provide a technique for improving mounting alignment accuracy. Other objects and novel features will become apparent from the description of the specification and the drawings.

A brief summary of representative aspects of the disclosure is as follows.

That is, the mounting device includes: a stand for mounting the mounting stand; a beam portion extending in a first direction so as to straddle the mount, and having both ends supported on the mount so as to be movable in a second direction; a mounting head portion supported by the beam portion so as to be movable in the first direction; a reference member extending in the first direction and having both ends supported, the reference member being separated from the beam portion; and a detection head provided on the attachment head so as to face the reference member. The detection head is configured to detect a positional relationship with the reference member.

According to the present disclosure, the mounting alignment accuracy can be improved.

Drawings

Fig. 1 is a plan view schematically showing a mounting device in a comparative example.

Fig. 2 is a front view schematically showing the mounting device shown in fig. 1.

Fig. 3 is a side view schematically showing the mounting device shown in fig. 1.

Fig. 4 is a schematic front view illustrating a problem point of the mounting device shown in fig. 1.

Fig. 5 is a schematic side view illustrating a problem point of the mounting device shown in fig. 1.

Fig. 6 is a schematic plan view illustrating a problem point of the mounting device shown in fig. 1.

Fig. 7 is a plan view schematically showing the mounting device in the first embodiment.

Fig. 8 isbase:Sub>A view schematically showingbase:Sub>A cross section in the linebase:Sub>A-base:Sub>A shown in fig. 7.

Fig. 9 is a front view schematically showing the mounting device shown in fig. 7.

Fig. 10 is a front view illustrating a state in which the main beam portion shown in fig. 7 is bent.

Fig. 11 is a front view showing a state in which the mounting head shown in fig. 10 is located on the right side.

Fig. 12 isbase:Sub>A cross-sectional view of the mounting device according to the first modification, the cross-section corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 7.

Fig. 13 is a sectional view showing a state in which a main beam portion is twisted in the mounting device shown in fig. 12.

Fig. 14 is a plan view schematically showing a mounting device in the second embodiment.

Fig. 15 is a front view schematically showing the mounting device shown in fig. 14.

Fig. 16 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A shown in fig. 14.

Fig. 17 is a sectional view showing a state where a main beam portion is twisted in the mounting device shown in fig. 16.

Fig. 18 is a diagram illustrating a linear scale according to the second embodiment.

Fig. 19 is a plan view schematically showing a mounting device in a second modification.

Fig. 20 is a plan view showing a state in which the main beam portion shown in fig. 19 is bent.

Fig. 21 is a plan view schematically showing a mounting device in a third embodiment.

Fig. 22 is a front view schematically showing the mounting device shown in fig. 21.

Fig. 23 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A shown in fig. 21.

Fig. 24 is a front view showing a state in which the main beam portion shown in fig. 22 is bent.

Fig. 25 is a sectional view showing a state where the main beam portion shown in fig. 23 is twisted.

Fig. 26 is a front view schematically showing a mounting device in a third modification.

Fig. 27 isbase:Sub>A sectional view atbase:Sub>A position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21.

Fig. 28 is a front view schematically showing a mounting device in a fourth modification.

Fig. 29 isbase:Sub>A sectional view atbase:Sub>A position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21.

Fig. 30 is a front view schematically showing a mounting device in a fifth modification.

Fig. 31 isbase:Sub>A sectional view atbase:Sub>A position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21.

Fig. 32 is a plan view schematically showing a mounting device in the fourth embodiment.

Fig. 33 is a front view schematically showing the mounting device shown in fig. 32.

Fig. 34 is a diagram showing a state in which a mounting head or the like of the mounting device shown in fig. 8 is tilted.

Fig. 35 is a diagram illustrating a method of fixing the support member based on the reference beam.

Fig. 36 is a schematic plan view showing the flip chip mounter of the embodiment.

Fig. 37 is a diagram for explaining the operations of the pick-up and flip head, the transfer head, and the mounting head when viewed from the direction of arrow a in fig. 36.

Fig. 38 is a schematic cross-sectional view showing a main part of the bare chip supply portion of fig. 36.

Fig. 39 is a schematic side view showing a main part of the mount section of fig. 36.

Fig. 40 is a flowchart showing a mounting method implemented by the flip chip mounter shown in fig. 36.

Wherein the reference numerals are as follows:

100 mounting device

110 stand

120 mounting table

140Y Beam

150 mounting head

171 base beam (base component)

174 detection head

Detailed Description

The following describes comparative examples, embodiments, modifications, and examples with reference to the drawings. However, in the following description, the same components are denoted by the same reference numerals, and overlapping description may be omitted. In addition, in order to make the description clearer, the width, thickness, shape, and the like of each part in the drawings are schematically shown as compared with the actual form in some cases, but the present disclosure is not limited to the explanation by way of example only.

First, a mounting device in a comparative example will be described with reference to fig. 1 to 3. Fig. 1 is a plan view schematically showing a mounting device in a comparative example. Fig. 2 is a front view schematically showing the mounting device of fig. 1. Fig. 3 is a side view schematically showing the mounting device of fig. 1.

The mounting apparatus 100R in the comparative example is an apparatus that conveys the component 300 from a component supply unit (not shown) to above the workpiece 200 and mounts the conveyed component 300 on the workpiece 200. The mounting apparatus 100 includes a gantry 110, a mounting table 120 supported on the gantry 110, an X support table 131 provided on the gantry 110, a Y beam 140 supported on the X support table 131, and a mounting head 150 supported by the Y beam 140. In addition, the X-axis direction and the Y-axis direction are directions orthogonal to each other on a horizontal plane, and in this comparative example, a direction extending along the Y beam 140 is the Y-axis direction (first direction), and a direction orthogonal thereto is the X-axis direction (second direction). The Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane. The Y beam 140 is provided with a linear scale 161 extending in the Y axis direction.

The mounting head 150 includes a mounting head 151 having a holding mechanism for detachably holding the component 300, and a driving unit 152 for driving the mounting head 150 in the Z-axis direction. The driving unit 152 is mounted on the Y beam 140 to be reciprocally movable in the Y axis direction. The detection head 162 is provided above the drive unit 152 of the mounting head 150 so as to face the linear scale 161.

In the case of the present comparative example, the mounting head 150 has three mounting heads 151, and each mounting head 151 has a holding mechanism 151a having a nozzle for holding the component 300 by vacuum suction. In addition, the driving unit 152 can independently raise and lower the mounting head 151 in the Z-axis direction. The mounting head 151 has a function of holding and conveying the component 300 and mounting the component 300 on the workpiece 200 sucked and fixed to the mounting table 120.

The guide rail 132 provided on the X support table 131 is a member for slidably guiding the Y beam 140 in the X axis direction. In the case of the present comparative example, two X support bases 131 are arranged in parallel, and each X support base 131 is fixed to the mount 110 in a state of extending in the X axis direction. The X support 131 may be integrally formed with the gantry 110.

A slider 143 is movably attached to the guide rail 132 in the X-axis direction. Further, the leg portions 142 of the Y beam 140 are attached to the sliders 143 of the two guide rails 132, respectively. That is, the main beam portion 141 of the Y beam 140 extends in the Y axis direction so as to straddle above the mounting table 120, and the leg portions 142 at both ends are attached to the slider 143 and supported movably in the X axis direction by the guide rail 132 attached to the X support table 131. Since the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143) are positioned on the same plane, the main beam portion 141 is provided at a position not much higher than the X support base 131.

The Y beam 140 is a rod-shaped member and is disposed to extend in the Y axis direction. The shape of the XZ section of the Y beam 140 has a mesa shape combining a quadrangle and a right triangle.

The Y beam 140 is a member for guiding the reciprocating movement of the mounting head 150 in the Y axis direction, and when the reciprocating mounting head 150 vibrates, a failure such as dropping the held component 300 occurs, and in addition, in order to convey the component 300 to an accurate position, it is necessary to suppress the bending or the like as much as possible. Therefore, the Y beam 140 needs to have sufficient structural strength. On the other hand, the Y beam 140 is a member that linearly reciprocates along the X support 131 together with the mounting head 150, and the lighter the Y beam is, the faster the component 300 can be conveyed.

Next, problems of the mounting device in the comparative example will be described with reference to fig. 4 to 6. Fig. 4 is a schematic front view illustrating a problem point of the mounting device in the comparative example. Fig. 5 is a schematic side view illustrating a problem point of the mounting device in the comparative example. Fig. 6 is a schematic plan view illustrating a problem of the mounting device in the comparative example.

As shown in fig. 4, the main beam portion 141 bends due to the weight of the main beam portion 141 and the mounting head portion 150 or the thermal expansion of the main beam portion 141 (first problem). As a result, the mounting head 150 affects the inclination, the mounting position (mounting position), and the inclination of the component (for example, bare chip).

Further, as shown in fig. 5, the main beam portion 141 is twisted by the weight of the main beam portion 141 and the mounting head portion 150 or the thermal expansion of the main beam portion 141 (second problem point). As a result, the mounting head 150 is tilted, and the mounting position (mounting position) and the tilt of the component (for example, bare chip) are affected.

Further, as shown in fig. 6, the main beam portion 141 is bent by thermal expansion of the main beam portion 141 (third problem point). As a result, the mounting head 150 affects the inclination, the mounting position (mounting position), and the inclination of the component (e.g., bare chip). Since the linear scale 161 provided on the main beam portion 141 is also affected by the deformation, the influence of the deformation of the main beam portion 141 cannot be captured and corrected by the detection head 162.

In the mounting device of the present disclosure, in order to solve at least one of the above-described problems, a reference member (for example, a beam-shaped member) for reference for measuring the position of the mounting head is prepared. The reference member is preferably made of a material that is less susceptible to heat, and is lightweight and highly rigid. The reference member is held at a position separated from the main beam portion without being affected by heat, weight, or deformation of the main beam portion. The mounting head portion is provided with a sensor for detecting the position of the mounting head portion. The reference member itself is the object to be measured by the sensor, or the reference member is the object to be measured by the sensor.

Hereinafter, some representative embodiments and modifications thereof will be exemplified. In the following description of the embodiment and the modified examples, the same reference numerals as in the comparative example are used for portions having the same configurations and functions as those described in the comparative example. In addition, the description of the comparative example is appropriately applied to the description of the part, which is not technically contradictory. All or a part of the comparative example, all or a part of the embodiments, and all or a part of the modifications can be combined and applied as appropriate within a range not technically contradictory.

< first embodiment >

In the first embodiment, a sensor is used to detect the position of the attachment head, and the reference member itself is used as a measurement target of the sensor.

The structure of the mounting device according to the first embodiment will be described with reference to fig. 7 to 9. Fig. 7 is a plan view schematically showing the mounting device in the first embodiment. Fig. 8 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A shown in fig. 7. Fig. 9 is a front view schematically showing the mounting device shown in fig. 7. Fig. 35 is a diagram illustrating a method of fixing the support member based on the reference beam. In fig. 8 and 9, the mounting head 151 is omitted.

The mounting device 100 according to the first embodiment has the same configuration as the mounting device 100R according to the comparative example. However, the mounting device 100 according to the first embodiment further includes a reference beam 171 serving as a reference member, support members 172 and 173 for supporting the reference beam 171, and a detection head 174.

The reference cross beam 171 is provided below the main beam portion 141 of the Y beam 140 in parallel with the main beam portion 141 at a position apart from the main beam portion 141. The reference beam 171 is, for example, a quadrangular prism, and is preferably formed of a material that is not easily affected by heat (has a small thermal expansion coefficient), and is lightweight and highly rigid. For example, the reference beam 171 may be made of ceramic, silicon carbide (SiC), carbon Fiber Reinforced Plastic (CFRP), ceramic-impregnated aluminum alloy, invar alloy, or quartz glass (SiO) ₂ ) Etc. are formed. The reference beam 171 is supported by a pair of support members 172, 173.

The support members 172 and 173 are crank-shaped in front view, and have a first extension portion and a second extension portion extending in the Y-axis direction, and a third extension portion extending in the vertical direction and connecting the first extension portion and the second extension portion. The first extension is fixed between the foot 142 and the slider 143. The second extension portion is located below the first extension portion, and supports the reference beam from below.

The reference beam 171 is deformed in the Y-axis direction of the gantry 110 by expansion of the Y-beam 140 and the like. Further, the support members 172 and 173 may move along with the deformation of the mount. The reference beam 171 is preferably supported by the support members 172 and 173 so as not to be affected by the movement of the support members 172 and 173. For example, one end of the reference beam 171 is fixed to the support member 172 with reference to the other end, and the other end of the reference beam 171 is freely held by the support member 173.

Specifically, the end of the reference beam 171 in the broken-line ellipse a of fig. 9 is fixed by a screw or the like in the linear direction (Y-axis direction) and the rotational direction (X-axis direction) to be used as a reference for setting the reference beam 171. As shown in B1 and B2 in fig. 9, the end of the reference beam 171 in the broken-line ellipse B of fig. 9 is provided with a key 171a in the reference beam 171 and a groove 173a in the support member 173. Here, B2 of fig. 9 is a sectional view taken along line C-C indicated by B1. Thereby, the reference beam 171 can be fixed in the rotational direction and can be moved in the linear direction. In this manner, if one end portion of the reference cross member 171 is fixed, the rotational direction is restricted, and the other end portion is supported by the slide mechanism, the influence of the entire torsion is not easily exerted. In addition, when the load applied to the reference beam 171 is not considered based on the accuracy of the structure or the operation, the fixing support member 172 is simply structured by a screw or the like, and therefore, the cost is low. As shown in fig. 35, an end of the reference beam 171 in the broken-line ellipse a of fig. 9 may be fixed to the support member 172 by a fixing member 176 so as to be rotatable in the XY plane. Therefore, when the support members 172 and 173 cannot be kept parallel to each other, the reference beam 171 is less likely to be biased.

As shown in fig. 8, the detection head 174 is attached to the lower portion of the driving unit 152 below the main beam portion 141. The detection head 174 includes a sensor (displacement sensor) for measuring a distance (d) from the reference beam 171. The mounting device 100 includes a control device that monitors and controls the operation of each unit. The control device controls a driving unit that drives the Y beam 140 in the X-axis direction, a driving unit that drives the mounting head 150 in the Y-axis direction, and the like based on the position measured by the detection head 174, and corrects the position of the mounting head 150. As will be described in detail later.

Here, a displacement sensor is explained. The mounting head is mounted with a displacement sensor, and the distance from the reference beam is measured for each direction. As in the present embodiment, when the reference beam is positioned below the displacement sensor, the distance in the Z direction can be measured. When the reference beam is positioned on the side of the displacement sensor, the distance in the X direction or the Y direction can be measured. The reference beam is a non-deformable member, and when the measured value changes, it can be determined that an error has occurred in positioning. As the displacement sensor, for example, an optical (triangulation/coaxial confocal) type is used. The coaxial confocal mode has the advantage of high precision/space saving. Here, although the light cannot be detected when the light deviates from the focal point, the light can be stably received even when the object is inclined within the focal distance. In the case of the triangulation method, the light receiving element uses a CMOS or CCD sensor, and thus is less susceptible to color unevenness or surface conditions of the object.

Next, the positional correction of the mounting head 150 will be described with reference to fig. 10 and 11. Fig. 10 is a front view illustrating a state in which the main beam portion shown in fig. 7 is bent. Fig. 11 is a front view showing a state in which the mounting head shown in fig. 10 is located on the right side.

As shown in fig. 10, when the main beam portion 141 is bent, the height of the mounting head portion 150 changes. The control device can correct the height of the mounting head 151 based on the amount of bending of the main beam portion 141 by measuring the distance (d) between the detection head 174 provided to the mounting head portion 150 and the reference beam 171.

The controller calculates the bending of the beam section from the change in height of each position in the Y-axis direction of the attachment head section 150. Here, the position of the mounting head portion 150 in the Y axis direction is calculated based on data obtained by reading the linear scale 161 provided on the main beam portion 141 by the detection head 162 provided on the mounting head portion 150. Then, as shown in fig. 11, the controller calculates the tilting amount (θ) of the mounting head 150, and corrects the positioning error (Δ Y) of the workpiece 200 to the target point.

(first modification)

A mounting device according to a first modification will be described with reference to fig. 12 and 13. Fig. 12 isbase:Sub>A cross-sectional view of the mounting device according to the first modification, the cross-section corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 7. Fig. 13 is a sectional view showing a state in which a main beam portion is twisted in the mounting device shown in fig. 12.

In the first embodiment, as shown in fig. 5, when the main beam portion 141 is twisted, the position of the attachment head portion 150 cannot be measured. Thus, in the first modification, the detection head 175 having a displacement sensor is added.

The detection head 174 is provided with the mounting head portion 150 so as to be located at a position separated in the Z direction with respect to the upper surface of the reference beam 171. The detection head 175 is provided to the mounting head 150 so as to be located at a position separated in the X direction with respect to the side surface of the reference beam 171. The distance in the Z direction can be measured by the detection head 174, and the distance in the X direction can be measured by the detection head 175.

As shown in fig. 13, when the main beam portion 141 twists, the detection head 175 approaches the reference cross member 171, and the detection head 174 moves away from the reference cross member 171. That is, the distance between the detection head 175 and the reference beam 171 in the X direction becomes smaller, and the distance between the detection head 174 and the reference beam 171 in the Z direction becomes larger. Accordingly, the control device calculates the amount of torsion of the mounting head 150, and corrects the positioning error (Δ X) of the workpiece 200 to the target point.

< second embodiment >

In the second embodiment, a position reading sensor is used as a sensor for detecting the position of the attachment head, and a linear scale provided on the reference member is used as a measurement target of the sensor.

Next, a mounting device according to a second embodiment will be described with reference to fig. 14 to 17. Fig. 14 is a plan view schematically showing a mounting device in the second embodiment. Fig. 15 is a front view schematically showing the mounting device shown in fig. 14. Fig. 16 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A shown in fig. 14. Fig. 17 is a sectional view showing a state in which a main beam portion is twisted in the mounting device shown in fig. 16. In fig. 15 to 17, the mounting head 151 is omitted.

The mounting device 100 in the second embodiment has the same configuration as the mounting device 100 in the first embodiment. However, the mounting apparatus 100 according to the second embodiment includes a reference beam 271 having a linear scale 261 on the upper surface thereof in place of the reference beam 171, and includes a detection head 274 having a sensor for reading a position similar to the detection head 162 in place of the detection head 174. The linear scale 161 and the detection head 162 in the first embodiment are not provided.

The reference beam 271 has the same configuration as the reference beam 171, except that the linear scale 261 is provided on the upper surface side thereof. The reference beam 271 is supported by the pair of support members 172 and 173 so as not to be affected by the movement of the support members 172 and 173, similarly to the reference beam 171.

The linear scale 261 will be described with reference to fig. 18. Fig. 18 is a diagram illustrating a linear scale according to the second embodiment.

The linear scale 261 is composed of a scale 261a on which a pattern capable of reading a position in the Y-axis direction is formed, and a scale 261b on which a pattern capable of reading a position in the X-axis direction is formed. The scale 261a is disposed to extend along the Y axis direction. The scale 261b is disposed adjacent to each other in the X-axis direction and extends in the Y-axis direction.

The detection head 274 includes sensors 274a and 274b for reading the scale 261a and a sensor 274c for reading the scale 261 b. The sensor 274a is disposed such that the optical axis is perpendicular to the scale 261 a. The sensor 274c is disposed such that the optical axis is perpendicular to the scale 261 b. The position in the X-axis direction is read by the sensor 274a, and the position in the X-axis direction is read by the sensor 274c.

The sensor 274b is adjacent to the sensor 274a in the Y axis direction, and the optical axis is inclined with respect to the scale 261 a. When the height of the detection head 274 changes, the position where the optical axis of the sensor 274b intersects with the scale 261a changes, and therefore the position in the Y-axis direction read by the sensor 274b changes. Then, the control device calculates the difference (dy) between the position where the sensor 274b reads the scale 261a and the position where the sensor 274a reads the scale 261 a. The difference (dy) varies with the height of the detection head 274. Then, the control device calculates a change (dz) in the position in the Z direction based on the change in the difference (dy), and calculates the position in the Z direction.

This enables the postures of the mounting head 150 in 3 directions of the X-axis direction, the Y-axis direction, and the Z-axis direction to be detected by one detection head 274. Therefore, as shown in fig. 4 (fig. 11), when the main beam portion 141 is bent, the positioning error (Δ Y) in the Y-axis direction can be corrected based on the positions of the attachment head portion 150 in the Y-axis direction and the Z-axis direction. As shown in fig. 6, when the main beam portion 141 is bent, the positioning error (Δ X) in the X-axis direction can be corrected based on the positions of the attachment head portion 150 in the X-axis direction and the Y-axis direction. As shown in fig. 17, when the main beam portion 141 is twisted, the positioning error (Δ X) in the X-axis direction can be corrected based on the position (dX) in the X-axis direction and the position (d) in the Z-axis direction of the attachment head portion 150.

(second modification)

A mounting device according to a second modification will be described with reference to fig. 19 and 20. Fig. 19 is a plan view schematically showing a mounting device in a second modification. Fig. 20 is a plan view showing a state in which the main beam portion shown in fig. 19 is bent.

The mounting apparatus 100 according to the second modification includes support members 372 and 373 that support the reference beam 371, and the detection head 374, instead of the support members 172 and 173 that support the reference beam 271, and the detection head 274 according to the second embodiment.

The reference beam 371 is provided on the side of the main beam portion 141 of the Y beam 140, and is parallel to the main beam portion 141 at a position apart from the main beam portion 141. The reference beam 371 is formed of the same shape and material as those of the reference beam 171. The reference beam 371 is supported by the pair of support members 372 and 373 so as not to be affected by the movement of the support members 372 and 373, similarly to the reference beam 171.

The support members 372 and 373 have the same structure as the support members 172 and 173. That is, the support members 372 and 373 have a crank shape in plan view, and have a first extension portion and a second extension portion that extend in the Y-axis direction, and a third extension portion that extends in the X-direction and connects the first extension portion and the second extension portion. The first extension portion is fixed to the foot portion 142. The second extending portion is located at a position separated from the main beam portion 141 in the X direction than the first extending portion, and supports the reference cross beam 371 from the side.

The reference beam 371 includes a linear scale similar to the reference beam 271 at a position facing the detection head 374. The detection head 374 is provided at the same position as the detection head 162 in the first embodiment, and includes the same sensor as the detection head 274.

The detection head 374 disposed on the attachment head portion 150 reads a linear scale provided on a reference beam 371 disposed apart from the main beam portion 141 in the X direction, and measures the position of the attachment head portion 150. The reference beam 371 does not undergo deformation of the main beam 141, and the positional relationship with the sensor of the detection head 374 varies.

This enables the postures of the mounting head 150 in the 3 directions of the X-axis direction, the Y-axis direction, and the Z-axis direction to be detected by one detection head 374. Therefore, as shown in fig. 4 (fig. 11), when the main beam portion 141 is bent, the positioning error in the Y axis direction can be corrected based on the positions in the Y axis direction and the Z axis direction of the mounting head portion 150. Further, as shown in fig. 20, when the main beam portion 141 is bent, a positioning error in the X-axis direction can be corrected based on the positions in the X-axis direction and the Y-axis direction of the attachment head portion 150. As shown in fig. 17, when the main beam portion 141 is twisted, the positioning error in the X-axis direction can be corrected based on the positions of the attachment head portion 150 in the X-axis direction and the Z-axis direction.

< third embodiment >

In the third embodiment, a position reading sensor is used as a sensor for detecting the position of the mounting head, two reference members are used, and a linear scale provided for each reference member is used as a measurement target of the sensor.

The structure of the mounting device according to the third embodiment will be described with reference to fig. 21 to 23. Fig. 21 is a plan view schematically showing a mounting device in a third embodiment. Fig. 22 is a front view schematically showing the mounting device shown in fig. 21. Fig. 23 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A shown in fig. 21. In fig. 22 and 23, the mounting head 151 is omitted.

The mounting apparatus 100 according to the third embodiment has the same configuration as the mounting apparatus 100 according to the second embodiment. However, the mounting device 100 according to the third embodiment includes support members 472 and 473 instead of the support members 172 and 173, and the mounting device 100 according to the third embodiment further includes a reference beam 471 and a detection head 474.

The reference beam 471 has the same configuration as the reference beam 271. But the reference beam 471 has a linear scale 261 on the lower surface side. The reference beams 271 and 471 are supported by the pair of support members 472 and 473 without being affected by the movement of the support members 472 and 473, similarly to the reference beam 171.

The support members 472, 473 include a first extension portion, a second extension portion, and a fourth extension portion that extend in the Y-axis direction in plan view, and a third extension portion that extends in the vertical direction and connects the first extension portion, the second extension portion, and the fourth extension portion. The first extension portion is fixed between the foot 142 and the slider 143. The second extension portion is located lower than the first extension portion, and supports the reference beam 271 from below. The fourth extending portion is located above the first extending portion and supports the reference beam 471 from below.

The detection head 474 is located above the main beam portion 141 and below the reference beam 471, and is attached to the upper portion of the drive portion 152. The detection head 474 has the same configuration as the detection head 274.

The detection heads 274 and 474 disposed on the attachment head portion 150 read linear scales provided on the reference beams 271 and 471 disposed apart from the main beam portion 141 in the Z direction, and measure the position of the attachment head portion 150. The reference beams 271 and 471 are not affected by the deformation of the main beam portion 141, and positional relationships between the sensors of the detection heads 274 and 474 vary.

Next, the positional correction of the mounting head 150 will be described with reference to fig. 24 and 25. Fig. 24 is a front view showing a state in which the main beam portion shown in fig. 22 is bent. Fig. 25 is a sectional view showing a state in which the main beam portion shown in fig. 23 is twisted.

The postures of the attachment head 150 in the 3 directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected by the detection heads 274 and 474. Therefore, as shown in fig. 24, when the main beam portion 141 is bent, the positioning error (Δ Y) in the Y-axis direction can be corrected based on the position (dy) of the detection heads 274 and 474 in the Y-axis direction and the position (dz) in the Z-axis direction. As shown in fig. 6, when the main beam portion 141 is bent, the positioning error in the X-axis direction can be corrected based on the positions of the detection heads 274 and 474 in the X-axis direction and the Y-axis direction. As shown in fig. 25, when the main beam portion 141 is twisted, the positioning error (Δ X) in the X-axis direction can be corrected based on the position (dX) in the X-axis direction and the position (dz) in the Z-axis direction of the detection heads 274 and 474.

(third modification)

The structure of the mounting device according to the third modification will be described with reference to fig. 26 and 27. Fig. 26 is a front view schematically showing a mounting device in a third modification. Fig. 27 isbase:Sub>A sectional view of the position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21. In fig. 26 and 27, the mounting head 151 is omitted.

The mounting apparatus 100 according to the third modification has the same configuration as the mounting apparatus 100 according to the third embodiment. However, the mounting device 100 according to the third modification includes the support members 172 and 173 according to the second embodiment in place of the support members 472 and 473, and includes the reference beam 571 in place of the reference beam 471.

The reference beam 571 has the same structure as the reference beam 271. But the reference beam 571 has a linear scale 261 on the lower surface side. The reference beam 571 is supported on the upper surface sides of the pair of leg portions 142 so as not to be affected by the movement of the leg portions 142, similarly to the reference beam 271.

In the present modification, the detection heads 274 and 474 disposed on the mounting head portion 150 read linear scales provided on the reference beams 271 and 471 disposed apart from the main beam portion 141 in the Z direction, and measure the position of the mounting head portion 150, as in the third embodiment. The reference beams 271 and 471 are not affected by the deformation of the main beam portion 141, and positional relationships between the sensors of the detection heads 274 and 474 vary. The postures of the attachment head 150 in the 3 directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected by the detection heads 274 and 474. Therefore, in the present modification, the positioning errors (Δ X, Δ Y) can be corrected, as in the third embodiment.

(fourth modification)

The structure of the mounting device according to the fourth modification will be described with reference to fig. 28 and 29. Fig. 28 is a front view schematically showing a mounting device in a fourth modification. Fig. 29 isbase:Sub>A sectional view of the position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21. In fig. 28 and 29, the mounting head 151 is omitted.

The mounting apparatus 100 according to the fourth modification has the same configuration as the mounting apparatus 100 according to the third modification. However, the mounting device 100 according to the fourth modification includes a reference beam 671 instead of the support members 172 and 173 and the reference beam 271, and includes a detection head 674 instead of the detection head 274.

The reference beam 671 has the same configuration as the reference beam 571. However, the reference beam 671 is supported on the lower side of the pair of leg portions 142 so as not to be affected by the movement of the leg portions 142, similarly to the reference beam 571.

The detection head 674 is located below the main beam portion 141 and the reference beam 671, and is attached to a lower portion of the drive portion 152. The detection head 674 has the same configuration as the detection head 274, but is attached so as to read the linear scale of the reference beam 671 provided above.

The detection heads 674 and 474 disposed on the mounting head portion 150 in the present modification read linear scales provided on the reference beams 671 and 571 disposed apart from the main beam portion 141 in the Z direction, and measure the position of the mounting head portion 150, as in the third embodiment. The reference beams 671 and 571 have a positional relationship with the sensors of the detection heads 674 and 474 that does not affect the deformation of the main beam portion 141. Further, the postures of the mount head 150 in the 3 directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected by the detection heads 674 and 474. Therefore, in the present modification, the positioning errors (Δ X, Δ Y) can be corrected, as in the third embodiment.

(fifth modification)

The structure of the mounting device according to the fifth modification will be described with reference to fig. 30 and 31. Fig. 30 is a front view schematically showing a mounting device in a fifth modification. Fig. 31 isbase:Sub>A sectional view of the position corresponding to the linebase:Sub>A-base:Sub>A shown in fig. 21. In fig. 30 and 31, the mounting head 151 is omitted.

The mounting apparatus 100 according to the fifth modification has the same configuration as the mounting apparatus 100 according to the third modification. However, the mounting device 100 according to the fifth modification includes support members 772, 773 and a reference cross beam 771 instead of the support members 172, 173 and the reference cross beam 271, includes a detection head 774 instead of the detection head 274, and includes a reference cross beam 871 and a detection head 874 instead of the reference cross beam 571 and the detection head 474.

The reference cross member 771 has the same structure as the reference cross member 271. However, the reference beam 771 includes a linear scale 261 on the side surface side. The reference beam 771 is supported by the pair of support members 772 and 773 so as not to be affected by the movement of the support members 772 and 773, similarly to the reference beam 271.

The reference beam 871 has the same structure as the reference beam 571. But the reference beam 871 has a linear scale 261 on the side surface side. Similarly to the reference beam 571, the reference beam 871 is supported on the upper surface sides of the pair of leg parts 142 so as not to be affected by the movement of the leg parts 142.

Like the support members 172 and 173, the support members 772 and 773 have a crank shape in front view, and include a first extension and a second extension extending in the Y axis direction, and a third extension extending in the vertical direction and connecting the first extension and the second extension. The first extension is fixed between the foot 142 and the slider 143. The second extension is located below the first extension and supports the reference cross member from below. However, the third extending portion in the present modification is configured to be shorter than the third extending portion in the support members 172 and 173.

The detection head 774 is attached to the lower portion of the drive unit 152 at a position below the main beam portion 141 so as to face the side surface of the reference cross beam 771. The detection head 674 has the same configuration as the detection head 274, but is attached to read a linear scale provided on the reference beam 771 on the side.

The detection head 874 is attached to the upper portion of the drive unit 152 at a position above the main beam portion 141 so as to face the side surface of the reference beam 871. The detection head 874 has the same configuration as the detection head 274, but is attached so as to read a linear scale of the reference beam 871 provided on the side.

The detection heads 774 and 874 disposed on the mounting head portion 150 in the present modification read linear scales provided on the reference beams 771 and 871 disposed apart from the main beam portion 141 in the Z direction, as in the third embodiment, and measure the position of the mounting head portion 150. The reference beams 771 and 871 fluctuate in positional relationship with the sensors of the detection heads 774 and 874 without being affected by deformation of the main beam portion 141. The postures of the mounting head 150 in the three directions of the X-axis direction, the Y-axis direction, and the Z-axis direction can be detected by the detection heads 774 and 874. Therefore, in the present modification, as in the third embodiment, the positioning errors (Δ X, Δ Y) can be corrected.

< fourth embodiment >

A mounting device according to a fourth embodiment will be described with reference to fig. 32 to 34. Fig. 32 is a plan view schematically showing a mounting device in the fourth embodiment. Fig. 33 is a front view schematically showing the mounting device shown in fig. 32. Fig. 34 is a diagram showing a state in which the mounting head and the like of the mounting device shown in fig. 8 are tilted. In fig. 32 to 34, the mounting head 151 is omitted.

In the first embodiment, as shown in fig. 34, when the X support base 131 is deformed by thermal expansion or the like, the guide rail 132 is also deformed, and the beam portion 140, the mounting head portion 150, the reference beam 171, and the support members 172 and 173 that move on the guide rail 132 in the X direction are in a tilted posture. In this case, since the positional relationship between the detection head 174 disposed on the mounting head portion 150 and the reference beam 171 does not change, the rotation (inclination) of the mounting head portion 150 about the Y axis as the rotation axis cannot be grasped.

As shown in fig. 33, the mounting apparatus 100 according to the fourth embodiment further includes fixing members 973 and 974 for fixing the reference beams 971 and 972 and the reference beams 971 and 972, and detection heads 975 and 976, respectively, in comparison with the mounting apparatus 100 according to the first embodiment.

As shown in fig. 32, the reference beams 971 and 972 are arranged to extend in the X direction and fixed to the mount 110 by fixing members 973 and 974. The reference beams 971 and 972 are parallel to the direction in which the guide rail 132 extends, and are arranged at positions that do not interfere with the reference beam 171, the support members 172 and 173, and the mounting head 151. The reference beams 971 and 972 have the same configuration as the reference beam 271 except for linear scales provided on the upper surface side thereof.

As shown in fig. 33, the detection heads 975 and 976 are provided on the support members 172 and 173 so as to be located at positions spaced apart from the upper portions of the reference beams 971 and 972. The detection heads 975, 976 remove the sensor 274c that reads the scale 261b from the detection head 274. However, the sensor 274b is adjacent to the sensor 274a in the X axis direction, and the optical axis is arranged obliquely to the scale 261 a.

When the heights of the detection heads 975, 976 change, the position at which the optical axis of the sensor 274b intersects the scale 261a changes, and therefore the position in the X-axis direction read by the sensor 274b changes. Then, the control device calculates a difference (dX) between the position where the sensor 274b reads the scale 261a and the position where the sensor 274a reads the scale 261 a. The difference (dX) varies with the height of the detection head 274. Then, the control device calculates a change (dz) in the position in the Z direction based on the change in the difference (dX), and calculates the position in the Z direction.

This enables the postures of the reference beam 171 (the mount head 150) in both the X-axis direction and the Z-axis direction to be detected by the detection heads 975 and 976. Therefore, as shown in fig. 39, when the mounting head portion 150 is tilted, the positioning error (Δ X) in the X-axis direction can be corrected based on the position (dX) of the mounting head portion 150 in the X-axis direction and the position (d) in the Z-axis direction.

The reference beams 971 and 972 have the same configuration as the reference beam 171, and the detection heads 975 and 976 may have the same configuration as the detection head 174.

The following description deals with an example in which the Y beam of the above-described embodiment is applied to a flip chip mounter as an example of a mounting apparatus, but the present invention is not limited to this, and the present invention can also be applied to a chip mounter (surface mounting machine) that mounts a packaged semiconductor device or the like on a substrate or a chip mounter that mounts a semiconductor chip (bare chip) on a substrate or the like. The flip chip mounter is used for manufacturing a Fan-Out Wafer Level Package (FOWLP) or the like, which is a Package in which a rewiring layer is formed in a wide area exceeding the chip area.

[ examples ] A method for producing a compound

Fig. 36 is a schematic plan view showing the flip chip mounter of the embodiment. Fig. 37 is a diagram for explaining the operations of the pick-up and flip head, the transfer head, and the mounting head when viewed from the direction of arrow a in fig. 36.

The flip chip mounter 10 generally includes a bare chip supply unit 1, a pickup unit 2, a transfer unit 8, an intermediate stage unit 3, a mounting unit 4, a transfer unit 5, a substrate supply unit 6K, a substrate carry-out unit 6H, and a control device 7 that monitors and controls operations of the respective units.

First, the bare chip supply section 1 supplies the bare chip D mounted on the substrate P. The bare chip supply portion 1 includes a wafer holding table 12 for holding the divided wafer 11, a push-up unit 13 indicated by a broken line for pushing up the bare chip D from the wafer 11, and a wafer ring supply portion 18. The bare chip feeder 1 is moved in the XY direction by a drive mechanism not shown, and moves the picked bare chip D to the position of the pushing unit 13. The wafer ring supply unit 18 has a wafer cassette in which wafer rings are stored, and sequentially supplies the wafer rings to the bare chip supply unit 1 and replaces them with new wafer rings. The bare chip supply section 1 moves the wafer ring to a pickup point so that a desired bare chip can be picked up from the wafer ring. The wafer ring is a jig to which a wafer is fixed and which can be attached to the bare chip supply portion 1.

The pick-up section 2 includes a pick-up and flip-up head 21 for picking up and flipping the bare chip D, and driving sections, not shown, for moving the collet 22 up and down, rotating, flipping, and moving in the X direction. The pick-up and flip-chip 21 picks up the bare chip with such a configuration, and the pick-up and flip-chip 21 is rotated by 180 degrees to turn the bumps of the bare chip D over toward the lower surface, and the bare chip D is transferred to the transfer head 81.

The transfer unit 8 receives the bare chip D turned over from the pick-and-place head 21 and places it on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 having a collet 82 for sucking and holding the bare chip D at the tip thereof, and a Y drive unit 83 for moving the transfer head 81 in the Y direction, similarly to the pick-and-place head 21.

The intermediate stage unit 3 includes an intermediate stage 31 on which the bare chip D is temporarily placed, and a stage recognition camera 34. The intermediate stage 31 is movable in the Y direction by a drive unit not shown.

The mounting unit 4 picks up the bare chip D from the intermediate stage 31 and mounts the bare chip D on the conveyed substrate P. The mounting unit 4 includes a mounting head 41 having a collet 42 for holding the bare chip D by suction at the tip, a Y beam 43 for moving the mounting head 41 in the Y direction, a substrate recognition camera 44 for recognizing the mounting position by imaging a position recognition mark (not shown) of the substrate P, and an X support table 45, similarly to the pick-up and flip-chip 21. With this configuration, the mounting head 41 picks up the bare chip D from the intermediate stage 31, and mounts the bare chip D on the substrate P based on the imaging data of the substrate recognition camera 44.

The conveying unit 5 includes conveying paths 51 and 52 for moving the substrate P in the X direction. The conveyance paths 51 and 52 are provided in parallel. With this configuration, the substrate P is carried out from the substrate supply unit 6K, moved to the mounting position along the conveyance paths 51 and 52, moved to the post-mounting substrate carry-out unit 6H, and delivered to the substrate carry-out unit 6H. In the process of mounting the bare chip D on the substrate P, the substrate supply unit 6K carries out a new substrate P and stands by on the conveyance paths 51 and 52.

The control device 7 includes a memory for storing a program (software) for monitoring and controlling the operations of the respective units of the flip chip mounter 10, and a Central Processing Unit (CPU) for executing the program stored in the memory.

Fig. 38 is a schematic cross-sectional view showing a main part of the bare chip supply portion of fig. 36. The die supply unit 1 includes an extension ring 15 for holding the wafer ring 14, a support ring 17 held by the wafer ring 14 and for horizontally positioning the dicing tape 16 to which the plurality of die D are bonded, and a push-up unit 13 for pushing up the die D. In order to pick up a predetermined bare chip D, the push-up unit 13 is moved in the vertical direction by a driving mechanism not shown, and the bare chip supply portion 1 is moved in the horizontal direction.

The mounting portion will be described with reference to comparative examples and the second embodiment, with reference to fig. 2, 15, and 39. Fig. 39 is a schematic side view showing a main part of the mounting portion 4. A part of the constituent elements is shown in perspective. The side view of fig. 39 corresponds to the front view of fig. 2 and 15. However, in fig. 39, the support members 172 and 173, the reference beam 271, and the detection head 274 are omitted.

The mounting unit 4 includes a mounting table BS (mounting table 120) supported on a gantry 53 (gantry 110), an X support table 451 (X support table 131) provided near the conveyance paths 52 and 53, a Y beam 43 (Y beam 140) supported on the X support table 451, a mounting head 41 (mounting head 151) supported by the Y beam 43, a driving unit 46 (driving unit 152) for driving the mounting head 41 in the Y axis direction and the Z axis direction, and a driving unit (not shown) for driving the Y beam 43 in the X axis direction.

The mounting head 41 is a device including a collet 42 (holding mechanism 151 a) for detachably holding the bare chip D (component 300), and is attached to the Y beam 43 so as to be movable back and forth in the Y axis direction.

In this embodiment, the number of the mounting heads 41 is 1, and the mounting heads 41 include a collet 42 for holding the bare chip D by vacuum suction. The driving unit 46 can move the mounting head 41 up and down in the Z-axis direction. The mounting head 41 has the following functions: the bare chip D picked up from the intermediate stage 31 is held and conveyed, and is mounted on the substrate P (workpiece 200) which is suction-fixed to the mounting stage BS.

The guide rail 132 provided on the X support base 451 is a member for slidably guiding the Y beam 43 in the X axis direction. In the present embodiment, the two X support bases 451 are arranged in parallel, and each X support base 451 is fixed to the conveyance paths 52 and 53 in a state of extending in the X axis direction. The X support base 451 may be formed integrally with the conveyance paths 52 and 53.

As shown in fig. 36 and 39, a slider 433 is attached to the guide rail 452 to be movable in the X-axis direction. Then, both end portions of the Y beam 43 are attached to the sliders 433 of the two guide rails 452. That is, the Y beam 43 extends in the Y axis direction so as to straddle the mount BS, and both ends thereof are attached to the slider 433 and supported movably in the X axis direction by the guide rail 452 attached to the X support base 451. Since the bottom surface of the Y beam 43 and the upper surface of the slider 433 are positioned on the same plane, the Y beam 43 is not positioned so much higher than the X support base 451.

The Y-beam 43 of the example has substantially the same configuration as the Y-beam 140 of the second embodiment. However, the Y beam 43 extends to the right side more largely than the support base 451 on the right side in the drawing. This is because the mounting head 41 can pick up the bare chip D from the intermediate stage 31. When the mounting head 41 moves to the right side of the support base 451, the mounting head 41 is raised so that the collet 42 is higher than the guide rail 452.

Next, a mounting method (a manufacturing method of a semiconductor device) implemented in the flip chip mounter of the embodiment will be described using fig. 40. Fig. 40 is a flowchart showing a mounting method implemented by the flip chip mounter shown in fig. 36.

A wafer ring 14 holding a dicing tape 16 to which bare chips D separated from the wafer 11 are attached is stored in a wafer cassette (not shown), and is carried into the flip chip mounter 10. The controller 7 supplies the wafer ring 14 to the die supply portion 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate P is prepared and carried into the flip chip mounter 10. The controller 7 mounts the substrate P to the substrate transfer claw by the substrate supply unit 6K.

(step S1: die bare chip pickup)

The controller 7 moves the wafer holding stage 12 so that the picked bare chip D is positioned directly above the push-up unit 13, and positions the bare chip to be peeled between the push-up unit 13 and the collet 22. The push-up unit 13 is moved in such a manner that the upper surface of the push-up unit 13 contacts the back surface of the dicing tape 16. At this time, the control device 7 sucks the dicing tape 16 on the upper surface of the push-up unit 13. The control device 7 lowers the collet 22 while evacuating the collet 22, and drops the collet onto the bare chip D to be stripped, thereby sucking the bare chip D. The control device 7 raises the collet 22 to peel the bare chip D from the dicing tape 16. Thereby, the bare chip D is picked up by the pick-up flip head 21.

(step S2: pickup head moving)

The control device 7 moves the pick-up and flip-chip head 21.

(step S3: flip-chip pickup head)

The control device 7 rotates the pick-up and flip-chip 21 by 180 degrees, turns the bump surface (surface) of the bare chip D over and toward the lower surface, turns the bump (surface) of the bare chip D over and toward the lower surface, and delivers the bare chip D to the transfer head 81.

(step S4: transfer head Handover)

The control device 7 picks up the bare chip D from the collet 22 of the pick-up and flip-chip 21 by the collet 82 of the transfer head 81, and delivers the bare chip D.

(step S5: flip-chip pickup head)

The control device 7 turns the pick-up and flip-up head 21 so that the suction surface of the collet 22 faces downward.

(step S6: transfer head movement)

Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

(step S7: intermediate stage mounting)

The controller 7 places the bare chip D held by the transfer head 81 on the intermediate stage 31.

(step S8: transfer head movement)

The controller 7 moves the transfer head 81 to the delivery position of the bare chip D.

(step S9: intermediate stage position moving)

After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the delivery position to the mounting head 41.

(step SA: mounting head connection)

The control device 7 picks up the bare chip D from the intermediate stage 31 by the collet of the mounting head 41, and delivers the bare chip D.

(step SB: intermediate stage position moving)

The controller 7 moves the intermediate stage 31 to the transfer position with the transfer head 81.

(step SC: mounting head moving)

The control device 7 moves the bare chip D held by the collet 42 of the mounting head 41 onto the substrate P. At this time, the control device 7 controls the driving unit 46 and the driving unit that drives the Y beam 43 based on the positional relationship with the reference beam detected by the detection head, and corrects the position of the mounting head 41.

(step SD: surface mount)

The control device 7 places the bare chip D picked up by the collet 42 of the mounting head 41 on the substrate P from the intermediate stage 31.

(step SE: mounting head moving)

The controller 7 moves the mounting head 41 to the transfer position with the intermediate stage 31.

After all the bare chips D are mounted on the substrate P, the control device 7 conveys the substrate P to the substrate carry-out section 6H. The controller 7 takes out the substrate S with the bare chip D mounted thereon from the substrate transfer claw by the substrate carry-out section 6H. The substrate P is carried out from the flip chip mounter 10.

The present disclosure proposed by the present disclosure has been specifically described above based on the embodiments, modifications, and examples, but the present invention is not limited to the embodiments, modifications, and examples described above, and various modifications can be made.

For example, in the examples, the Y beam according to the second embodiment is used, but the present invention is not limited thereto, and any one or a combination of the Y beams according to the first embodiment, the third embodiment, and other modifications may be used.

In the embodiment, an example in which the mounting head (mounting head) is one is described, but a plurality of mounting heads may be used as in the embodiment.

In the embodiment, the transfer unit, the intermediate stage unit, and the mounting unit are described as one example, but a plurality of transfer units, intermediate stage units, and mounting units may be provided.

In the embodiment, the example in which the inverting mechanism is provided in the pick-up and flip-chip head, the bare chip is received from the pick-up and flip-chip head by the transfer head and placed on the intermediate stage, and the intermediate stage is moved is described.

Claims (16)

1. A mounting device is provided with:

a stand for mounting the mounting stand;

a beam section extending in a first direction so as to straddle the mount, and both ends of the beam section being supported on the mount so as to be movable in a second direction;

a mounting head portion supported by the beam portion so as to be movable in the first direction;

a reference member extending in the first direction and having both ends supported, the reference member being separated from the beam portion; and

a detection head provided on the attachment head portion so as to face the reference member,

the detection head is configured to detect a positional relationship with the reference member.

2. The mounting location of claim 1,

further comprises a pair of supporting members for supporting the reference member,

one of the support members fixes one end of the reference member, and the other support member is configured to movably support the other end of the reference member.

3. The mounting location of claim 1,

the detection head is positioned above the reference member and has a displacement sensor for measuring a distance to the reference member.

4. The mounting location of claim 3,

the sensor further includes a detection head which is located on a side of the reference member and has a displacement sensor for measuring a distance to the reference member.

5. The mounting location of claim 1,

the reference member is provided with a linear scale,

the detection head has a sensor that reads the scale of the linear scale.

6. The mounting location of claim 5,

the reference member is provided with a first linear scale for detecting a position in the first direction and a second linear scale for detecting a position in the second direction,

the detection head has a first sensor for reading a scale from a direction perpendicular to the first linear scale, a second sensor for reading a scale from a direction inclined with respect to the first linear scale, and a third sensor for reading a scale from a direction perpendicular to the second linear scale.

7. The mounting location of claim 5,

the reference member is located below the beam portion,

the detection head is provided to the attachment head so as to face an upper surface of the reference member.

8. The mounting location of claim 5,

the reference member is located on the opposite side of the mounting head portion with the beam portion therebetween,

the detection head is provided on the attachment head so as to face a side surface of the reference member.

9. The mounting location of claim 5,

further provided with:

a second reference member extending in the first direction and having both ends supported, the second reference member being separated from the beam portion; and

and a second detection head provided to the mounting head so as to face the second reference member.

10. The mounting location of claim 9,

the reference member is located below the beam portion,

the detection head is provided to the attachment head portion so as to face an upper surface of the reference member,

the second reference member is located above the beam portion,

the second detection head is provided on the mounting head so as to face a lower surface of the second reference member.

11. The mounting location of claim 9,

the reference member is located below the beam portion,

the detection head is provided to the attachment head portion so as to face a lower surface of the reference member,

the second reference member is located above the beam portion,

the second detection head is provided on the mounting head so as to face a lower surface of the second reference member.

12. The mounting location of claim 9,

the reference member is located below the beam portion,

the detection head is provided to the attachment head portion so as to face a side surface of the reference member,

the second reference member is located above the beam portion,

the second detection head is provided to the mounting head so as to face a side surface of the second reference member.

13. The mounting location of claim 1,

further provided with:

a pair of supporting members for supporting the reference member;

a second reference member provided on the stage and extending in the second direction; and

a second detection head provided to the support member so as to face the second reference member,

the second detection head is configured to detect a positional relationship with the second reference member.

14. The mounting location of claim 2,

one of the support members is configured to be able to fix one end of the reference member so as to be rotatable.

15. A method of manufacturing a semiconductor device, comprising:

a step of carrying a substrate into a mounting apparatus, the mounting apparatus including a stage on which a mounting table is mounted, a beam portion extending in a first direction so as to straddle the stage and having both ends supported movably in a second direction on the stage, a mounting head portion supported movably in the first direction on the beam portion, a reference member extending in the first direction so as to be separated from the beam portion and having both ends supported, and a detection head provided on the mounting head portion so as to be opposed to the reference member, the detection head being configured to detect a positional relationship with the reference member; and

and picking up a bare chip from the wafer held by the wafer ring.

16. A manufacturing method of the semiconductor device according to claim 15, further comprising:

turning over the picked bare chip; and

picking up the bare chip after the flip by the mounting head and placing the bare chip on the substrate.

Images