JP6978340B2 - Manufacturing method of mounting equipment and semiconductor equipment - Google Patents

Manufacturing method of mounting equipment and semiconductor equipment Download PDF

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JP6978340B2
JP6978340B2 JP2018026857A JP2018026857A JP6978340B2 JP 6978340 B2 JP6978340 B2 JP 6978340B2 JP 2018026857 A JP2018026857 A JP 2018026857A JP 2018026857 A JP2018026857 A JP 2018026857A JP 6978340 B2 JP6978340 B2 JP 6978340B2
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straightening
mounting device
mounting
pushing
straightening member
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JP2019145607A (en
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一信 酒井
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ファスフォードテクノロジ株式会社
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Priority to TW108103202A priority patent/TWI707613B/en
Priority to KR1020190016047A priority patent/KR102150542B1/en
Priority to CN201910120221.5A priority patent/CN110176411B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)

Description

本開示は実装装置に関し、例えばビームを備える実装装置に適用可能である。 The present disclosure relates to a mounting device and is applicable to, for example, a mounting device including a beam.

従来、部品実装装置の一つとして、固定されている基板に対し、部品供給部から部品を保持し、基板上方まで部品を搬送し、部品を降下させて基板に取り付ける部品実装機がある。当該実装機は、保持した部品のＸＹ方向（水平面内）の位置を正確に再現する必要がある。一方、実装基板の生産性を向上させるため、部品供給部から基板上方まで部品を搬送し、ＸＹ方向の位置決めをするまでの速度や、部品を実装した後に部品供給部まで戻るまでの速度などをできる限り早める必要もある。 Conventionally, as one of the component mounting devices, there is a component mounting machine that holds a component from a component supply unit to a fixed substrate, transports the component to the upper part of the substrate, lowers the component, and mounts the component on the substrate. The mounting machine needs to accurately reproduce the position of the held component in the XY direction (in the horizontal plane). On the other hand, in order to improve the productivity of the mounting board, the speed of transporting the component from the component supply section to the upper part of the board and positioning in the XY direction, the speed of returning to the component supply section after mounting the component, etc. You also need to do it as soon as possible.

そこで、部品実装機は、基台にＹ軸方向に延びて固定されるＹビームと、前記Ｙビームに対してスライド可能に取り付けられるＸ軸方向に延びて配置されるＸビームと、前記Ｘビームに対してスライド可能に取り付けられるヘッドを備える構造となっている。これにより、正確かつ高速に部品を搬送することができるものとなっている（例えば、特開２０１１−２１０８９５号公報）。 Therefore, the component mounting machine includes a Y beam that extends and is fixed to the base in the Y-axis direction, an X beam that is slidably attached to the Y beam and is arranged so as to extend in the X-axis direction, and the X beam. It has a structure equipped with a head that can be slidably attached to the head. As a result, the parts can be transported accurately and at high speed (for example, Japanese Patent Application Laid-Open No. 2011-210895).

特開２０１１−２１０８９５号公報Japanese Unexamined Patent Publication No. 2011-210895

特許文献１に記載されるような実装装置においては、実装ヘッドがスライド可能に取り付けられるビームに、ビームおよび実装ヘッドの重量に起因する撓みが発生し、実装位置合わせ精度が悪くなることがある。
本開示の課題は、ビームの撓みを低減する実装装置を提供することである。
その他の課題と新規な特徴は、本明細書の記述および添付図面から明らかになるであろう。 In a mounting device as described in Patent Document 1, the beam to which the mounting head is slidably mounted may be bent due to the weight of the beam and the mounting head, and the mounting alignment accuracy may be deteriorated.
An object of the present disclosure is to provide a mounting device for reducing beam deflection.
Other issues and novel features will become apparent from the description and accompanying drawings herein.

本開示のうち代表的なものの概要を簡単に説明すれば下記の通りである。
すなわち、実装装置は、実装ステージが取り付けられる架台と、前記架台上を渡るように第一方向に伸びてその両端がそれぞれ第二方向に移動自在に前記架台上に支持されるビームと、前記第一方向に移動自在に前記ビームに支持される実装ヘッドと、を備える。前記ビームは、当該ビーム内部に位置し前記第一方向に延伸する矯正部材と、前記矯正部材を前記ビームの撓み方向に押しその反力で前記撓み方向と逆方向の力を発生させる撓み矯正手段と、を備える。 The following is a brief overview of the representative ones of this disclosure.
That is, the mounting device includes a pedestal on which the mounting stage is mounted, a beam extending in the first direction so as to cross the pedestal, and both ends of the pedestal so as to be movable in the second direction and supported on the pedestal. It includes a mounting head that is movably movable in one direction and is supported by the beam. The beam is a straightening member located inside the beam and extending in the first direction, and a bending straightening means for pushing the straightening member in the bending direction of the beam and generating a force in the direction opposite to the bending direction by the reaction force thereof. And.

上記実装装置によれば、ビームの撓みを低減することができる。 According to the mounting device, the deflection of the beam can be reduced.

図１は比較例の実装装置を模式的に示す正面図である。FIG. 1 is a front view schematically showing a mounting device of a comparative example. 図２は図１の実装装置を模式的に示す上面図である。FIG. 2 is a top view schematically showing the mounting device of FIG. 図３は図１の実装装置を模式的に示す側面図である。FIG. 3 is a side view schematically showing the mounting device of FIG. 図４はビームの撓みと捩れについて説明する図である。FIG. 4 is a diagram illustrating bending and twisting of the beam. 図５は図１の実装装置の課題を説明する模式的な正面図である。FIG. 5 is a schematic front view illustrating a problem of the mounting device of FIG. 図６は図１の実装装置の課題を説明する模式的な側面図である。FIG. 6 is a schematic side view illustrating a problem of the mounting device of FIG. 図７は第一実施形態の実装装置を模式的に示す正面図である。FIG. 7 is a front view schematically showing the mounting device of the first embodiment. 図８は第一実施形態のＹビームを模式的に示す図である。FIG. 8 is a diagram schematically showing the Y beam of the first embodiment. 図９は実装ヘッドの位置によって送り螺子の送り量を調整することを説明する模式的な正面図である。FIG. 9 is a schematic front view illustrating that the feed amount of the feed screw is adjusted according to the position of the mounting head. 図１０は第一変形例のＹビームを模式的に示す図である。FIG. 10 is a diagram schematically showing the Y beam of the first modification. 図１１は第二変形例のＹビームを模式的に示す図である。FIG. 11 is a diagram schematically showing the Y beam of the second modification. 図１２は第三変形例のＹビームを模式的に示す図である。FIG. 12 is a diagram schematically showing the Y beam of the third modification. 図１３は第二実施形態のＹビームを模式的に示す図である。FIG. 13 is a diagram schematically showing the Y beam of the second embodiment. 図１４は第四変形例の実装装置を模式的に示す斜視図である。FIG. 14 is a perspective view schematically showing the mounting device of the fourth modification. 図１５は第四変形例のＹビームを模式的に示す斜視図である。FIG. 15 is a perspective view schematically showing the Y beam of the fourth modification. 図１６は図１５のＹビームの捩れ矯正を説明する模式的な図である。FIG. 16 is a schematic diagram illustrating the twist correction of the Y beam of FIG. 図１７は実装ヘッドの位置により捩れ量が異なることを説明する模式的な図である。FIG. 17 is a schematic diagram illustrating that the amount of twist differs depending on the position of the mounting head. 図１８は実装ヘッドの位置により調整用シムの取付け量を変えることを説明する模式的な図である。FIG. 18 is a schematic diagram illustrating that the mounting amount of the adjusting shim is changed depending on the position of the mounting head. 図１９は第五変形例のＹビームを模式的に示すである。FIG. 19 schematically shows the Y beam of the fifth modification. 図２０は第六変形例のＹビームを模式的に示す図である。FIG. 20 is a diagram schematically showing the Y beam of the sixth modification. 図２１は実施例１のフリップチップボンダの概略を示す上面図である。FIG. 21 is a top view showing an outline of the flip chip bonder of the first embodiment. 図２２は図２１において矢印Ａ方向から見たときに、ピックアップフリップヘッド、トランスファヘッド及びボンディングヘッドの動作を説明する図である。FIG. 22 is a diagram illustrating the operation of the pickup flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21. 図２３は図２１のダイ供給部の主要部を示す概略断面図である。FIG. 23 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 21. 図２４は図２１のボンディング部の主要部を示す概略側面図である。FIG. 24 is a schematic side view showing a main portion of the bonding portion of FIG. 21. 図２５は実施例１のフリップチップボンダで実施されるボンディング方法を示すフローチャートである。FIG. 25 is a flowchart showing a bonding method carried out by the flip chip bonder of the first embodiment. 図２６は実施例２のフリップチップボンダの概略を示す上面図である。FIG. 26 is a top view showing an outline of the flip chip bonder of the second embodiment.

以下、比較例、実施形態、変形例および実施例について、図面を用いて説明する。ただし、以下の説明において、同一構成要素には同一符号を付し繰り返しの説明を省略することがある。なお、図面は説明をより明確にするため、実際の態様に比べ、各部の幅、厚さ、形状等について模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。 Hereinafter, comparative examples, embodiments, modifications and examples will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited.

＜比較例＞
まず、比較例の実装装置について図１〜３を用いて説明する。図１は比較例の実装装置を模式的に示す正面図である。図２は図１の実装装置を模式的に示す上面図である。図３は図１の実装装置を模式的に示す側面図である。 <Comparison example>
First, the mounting device of the comparative example will be described with reference to FIGS. 1 to 3. FIG. 1 is a front view schematically showing a mounting device of a comparative example. FIG. 2 is a top view schematically showing the mounting device of FIG. FIG. 3 is a side view schematically showing the mounting device of FIG.

比較例の実装装置１００Ｒは、部品供給部（図示せず）から部品３００をワーク２００の上方にまで搬送し、搬送した部品３００をワーク２００に取り付ける（実装する）装置である。実装装置１００は、架台１１０と、架台１１０の上に支持される実装ステージ１２０と、架台１１０の上に設けられるＸ支持台１３１と、Ｘ支持台１３１の上に支持されるＹビーム１４０Ｒと、Ｙビーム１４０Ｒに支持される実装ヘッド１５０と、実装ヘッド１５０をＹ軸方向およびＺ軸方向に駆動する駆動部１６０と、を備えている。なお、Ｘ軸方向、Ｙ軸方向は水平面上で互いに直交する方向であり、本比較例では、図２に示すようにＹビーム１４０Ｒが伸びる方向をＹ軸方向（第一方向）、これと直交する方向をＸ軸方向（第二方向）、として説明する。また、Ｚ軸方向（第三方向）は、ＸＹ面に垂直な上下方向である。 The mounting device 100R of the comparative example is a device for transporting the component 300 from the component supply unit (not shown) to the upper part of the work 200 and mounting (mounting) the transported component 300 on the work 200. The mounting device 100 includes a gantry 110, a mounting stage 120 supported on the gantry 110, an X support pedestal 131 provided on the gantry 110, and a Y beam 140R supported on the X support pedestal 131. It includes a mounting head 150 supported by the Y beam 140R, and a drive unit 160 for driving the mounting head 150 in the Y-axis direction and the Z-axis direction. The X-axis direction and the Y-axis direction are orthogonal to each other on the horizontal plane. In this comparative example, the direction in which the Y beam 140R extends is the Y-axis direction (first direction), which is orthogonal to the direction shown in FIG. This direction will be described as the X-axis direction (second direction). Further, the Z-axis direction (third direction) is a vertical direction perpendicular to the XY plane.

実装ヘッド１５０は、部品３００を着脱自在に保持する保持手段を有する装置であり、Ｙ軸方向に往復動自在にＹビーム１４０Ｒに取り付けられている。 The mounting head 150 is a device having a holding means for holding the component 300 in a detachable manner, and is mounted on the Y beam 140R so as to be reciprocating in the Y-axis direction.

本比較例の場合、実装ヘッド１５０を３本備えており、各実装ヘッド１５０は、真空吸着により部品３００を保持するノズルを有する保持手段１５１を備えている。また、駆動部１６０は、実装ヘッド１５０をそれぞれ独立にＺ軸方向に昇降させることができる。実装ヘッド１５０は部品３００を保持して搬送し、実装ステージ１２０に吸着固定されたワーク２００上に部品３００を取り付ける機能を備えている。 In the case of this comparative example, three mounting heads 150 are provided, and each mounting head 150 is provided with a holding means 151 having a nozzle for holding the component 300 by vacuum suction. Further, the drive unit 160 can independently raise and lower the mounting head 150 in the Z-axis direction. The mounting head 150 has a function of holding and transporting the component 300 and mounting the component 300 on the work 200 which is attracted and fixed to the mounting stage 120.

Ｘ支持台１３１の上に設けられたガイド１３２は、Ｙビーム１４０ＲをＸ軸方向に摺動自在に案内する部材である。本比較例の場合、２本のＸ支持台１３１が平行に配置されており、各Ｘ支持台１３１は、架台１１０にＸ軸方向に伸びた状態で固定されている。Ｘ支持台１３１は、架台１１０と一体に形成されるものでもよい。 The guide 132 provided on the X support base 131 is a member that slidably guides the Y beam 140R in the X-axis direction. In the case of this comparative example, two X support bases 131 are arranged in parallel, and each X support base 131 is fixed to the base 110 in a state of being extended in the X-axis direction. The X support base 131 may be integrally formed with the pedestal 110.

図１、図３に示すように、ガイド１３２の上にはスライダ１４３がＸ軸方向に移動自在に取り付けられている。そして、２つのガイド１３２の各スライダ１４３の上には、それぞれＹビーム１４０Ｒの各脚部１４２が取り付けられている。つまり、Ｙビーム１４０Ｒの主梁部１４１は、実装ステージ１２０の上を跨るようにＹ軸方向に伸び、両端の各脚部１４２はスライダ１４３に取り付けられてＸ支持台１３１に取り付けられたガイド１３２によってＸ軸方向に移動自在に支持されている。なお、主梁部１４１の底面と脚部１４２の底面（スライダ１４３の上面）は同一面上に位置するので、主梁部１４１はＸ支持台１３１からそれほど高くない位置に設けられている。 As shown in FIGS. 1 and 3, a slider 143 is mounted on the guide 132 so as to be movable in the X-axis direction. The legs 142 of the Y beam 140R are mounted on the sliders 143 of the two guides 132, respectively. That is, the main beam portion 141 of the Y beam 140R extends in the Y-axis direction so as to straddle the mounting stage 120, and the leg portions 142 at both ends are attached to the slider 143 and the guide 132 attached to the X support base 131. It is supported so as to be movable in the X-axis direction. Since the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143) are located on the same surface, the main beam portion 141 is provided at a position not so high from the X support base 131.

図３に示すように、Ｙビーム１４０Ｒは、棒形状の部材であって、Ｙ軸方向に伸びて配置される部材である。Ｙビーム１４０ＲのＸＺ断面の形状は、四角形と直角三角形とを合わせた台形状を有している。 As shown in FIG. 3, the Y beam 140R is a rod-shaped member, which is a member extending in the Y-axis direction and arranged. The shape of the XZ cross section of the Y beam 140R has a trapezoidal shape that is a combination of a quadrangle and a right triangle.

Ｙビーム１４０Ｒは、実装ヘッド１５０のＹ軸方向の往復動を案内する部材であり、往復動する実装ヘッド１５０が振動すると保持している部品３００を落とすなどの不具合が発生し、また、正確な位置に部品３００を運ぶためには撓みなどを極力抑える必要がある。従って、Ｙビーム１４０Ｒは、構造的な強度を十分に備えている必要がある。一方、Ｙビーム１４０Ｒは、実装ヘッド１５０と共に、Ｘ支持台１３１に沿って直線的に往復動する部材であり、軽量であるほど高速で部品３００を搬送することが可能となる。 The Y-beam 140R is a member that guides the reciprocating movement of the mounting head 150 in the Y-axis direction. When the reciprocating mounting head 150 vibrates, problems such as dropping the holding component 300 occur, and the Y-beam 140R is accurate. In order to carry the component 300 to the position, it is necessary to suppress bending and the like as much as possible. Therefore, the Y beam 140R needs to have sufficient structural strength. On the other hand, the Y beam 140R is a member that reciprocates linearly along the X support base 131 together with the mounting head 150, and the lighter the weight, the faster the component 300 can be conveyed.

次に、ビームの撓みと捩れについて図４を用いて説明する。図４（Ａ）はビームの撓みを説明する図であり、図４（Ｂ）はビームの断面を示す図である。図５は図１の実装装置の課題を説明する模式的な正面図である。図６は図１の実装装置の課題を説明する模式的な側面図である。 Next, the bending and twisting of the beam will be described with reference to FIG. FIG. 4A is a diagram illustrating the deflection of the beam, and FIG. 4B is a diagram showing a cross section of the beam. FIG. 5 is a schematic front view illustrating a problem of the mounting device of FIG. FIG. 6 is a schematic side view illustrating a problem of the mounting device of FIG.

図４（Ａ）に示すように、撓み量（ｄ）はビーム長さ（Ｌ）の３乗に比例して増大する。また、ビームが長くなると、同じ剛性でもビームが捩れ易くなる。また、剛性に寄与する断面２次モーメントは、図４（Ｂ）に示すビーム断面の幅（Ｗ）に比例、高さ（Ｈ）の３乗に比例する。 As shown in FIG. 4A, the amount of deflection (d) increases in proportion to the cube of the beam length (L). Further, the longer the beam, the easier it is for the beam to twist even with the same rigidity. The moment of inertia of area that contributes to rigidity is proportional to the width (W) of the beam cross section shown in FIG. 4 (B) and proportional to the cube of the height (H).

比較例に戻って説明する。図５に示すように、主梁部１４１および実装ヘッド１５０の重さで主梁部１４１が撓む（第一課題）。その結果、実装ヘッド１５０が傾き、実装位置（ボンド位置）、部品（例えばダイ）の傾きに影響する。 It will be described back to the comparative example. As shown in FIG. 5, the main beam portion 141 bends due to the weight of the main beam portion 141 and the mounting head 150 (first problem). As a result, the mounting head 150 is tilted, which affects the mounting position (bond position) and the tilt of the component (for example, die).

また、図６に示すように、主梁部１４１および実装ヘッド１５０の重さで主梁部１４１が捩れる（第二課題）。その結果、実装ヘッド１５０が傾き、実装位置（ボンド位置）、部品（例えばダイ）の傾きに影響する。 Further, as shown in FIG. 6, the main beam portion 141 is twisted by the weight of the main beam portion 141 and the mounting head 150 (second problem). As a result, the mounting head 150 is tilted, which affects the mounting position (bond position) and the tilt of the component (for example, die).

撓みを抑えるには、撓みに比例してＹビーム１４０Ｒの剛性を上げる必要があるが、ビーム断面の幅（Ｗ）または高さ（Ｈ）を単純に増やすと重量が増えるので、軽量、高剛性を維持しつつ実装位置の精度を向上する必要がある。例えば、位置精度を数μｍ程度より小さくするためには変形量は１μｍに程度に抑える必要があるが、主梁部１４１の長さが、例えば、５００ｍｍ以上になると特に７５０ｍｍ以上の長さでは自重による撓みや捩れの変形量を抑えるのが難しい。 In order to suppress bending, it is necessary to increase the rigidity of the Y beam 140R in proportion to the bending, but simply increasing the width (W) or height (H) of the beam cross section increases the weight, so it is lightweight and highly rigid. It is necessary to improve the accuracy of the mounting position while maintaining the above. For example, in order to reduce the position accuracy to less than a few μm, the amount of deformation needs to be suppressed to about 1 μm, but when the length of the main beam portion 141 is, for example, 500 mm or more, its own weight is particularly high at a length of 750 mm or more. It is difficult to suppress the amount of deformation and twisting caused by this.

＜第一実施形態＞
次に、上記の第一課題を解決する第一実施形態について図７、８を用いて説明する。図７は第一実施形態の実装装置を模式的に示す正面図である。図８は第一実施形態のＹビームを模式的に示す図であり、図８（Ａ）はＹビームを撓ませた状態を模式的に示す図であり、図８（Ｂ）はＹビームの撓みを矯正した状態を模式的に示す図である。なお、図８（Ａ）、図８（Ｂ）の各々の左側は正面図であり、右側は側面図であり、内部構造が見えるように一部透視して示している。 <First Embodiment>
Next, the first embodiment for solving the above-mentioned first problem will be described with reference to FIGS. 7 and 8. FIG. 7 is a front view schematically showing the mounting device of the first embodiment. FIG. 8 is a diagram schematically showing the Y beam of the first embodiment, FIG. 8A is a diagram schematically showing a state in which the Y beam is deflected, and FIG. 8B is a diagram of the Y beam. It is a figure which shows typically the state which corrected the bending. The left side of each of FIGS. 8A and 8B is a front view, and the right side is a side view, which is partially seen through so that the internal structure can be seen.

図７に示すように、第一実施形態の実装装置１００はＹビーム１４０を除いて比較例の実装装置１００Ｒと同様である。 As shown in FIG. 7, the mounting device 100 of the first embodiment is the same as the mounting device 100R of the comparative example except for the Y beam 140.

図８に示すように、第一実施形態のＹビーム１４０は、一方の脚部１４２の内部から主梁部１４１の内部を経由して他方の脚部１４２の内部まで延伸する矯正部材１４４と、矯正部材１４４の端部を所定の高さで支持する支持部材１４５と、矯正部材１４４のＹ軸方向の中央部に設けられた雌ネジ部材１４６と、雌ネジ部材１４６に挿入される雄ネジ部材１４７と、雄ネジ部材１４７を回転させるアクチュエータ１４８と、を備える。矯正部材１４４、支持部材１４５、雌ネジ部材１４６および雄ネジ部材１４７はＹビーム１４０の内部に位置し、アクチュエータ１４８は主梁部１４１の上に固定されている。矯正部材１４４は、例えば四角柱状であり、軽量高剛性素材（例えば、炭素繊維強化樹脂（Carbon Fiber Reinforced Plastic：ＣＦＲＰ））で形成され、トーションバー的な機能を有する。アクチュエータ１４８はモータ等で構成される。 As shown in FIG. 8, the Y beam 140 of the first embodiment includes a straightening member 144 extending from the inside of one leg portion 142 to the inside of the other leg portion 142 via the inside of the main beam portion 141. A support member 145 that supports the end of the straightening member 144 at a predetermined height, a female screw member 146 provided at the center of the straightening member 144 in the Y-axis direction, and a male screw member inserted into the female screw member 146. A 147 and an actuator 148 for rotating the male screw member 147 are provided. The straightening member 144, the support member 145, the female screw member 146, and the male screw member 147 are located inside the Y beam 140, and the actuator 148 is fixed on the main beam portion 141. The straightening member 144 is, for example, a square columnar, is made of a lightweight and highly rigid material (for example, Carbon Fiber Reinforced Plastic (CFRP)), and has a torsion bar-like function. The actuator 148 is composed of a motor or the like.

Ｙビーム１４０内に設けられた矯正部材１４４は、主梁部１４１の撓みを矯正可能とするものであり、矯正部材１４４に設けられた雌ネジ部材１４６に挿入された雄ネジ部材１４７をアクチュエータ１４８によって回転することにより、矯正部材１４４のＹ軸方向の中央部を鉛直方向に押すことが可能である。雄ネジ部材１４７の送り量（押さえ量）を変えることで矯正部材１４４の押し量を制御することができる。 The straightening member 144 provided in the Y beam 140 makes it possible to straighten the bending of the main beam portion 141, and the male screw member 147 inserted into the female screw member 146 provided in the straightening member 144 is used as an actuator 148. It is possible to push the central portion of the straightening member 144 in the Y-axis direction in the vertical direction by rotating the orthodontic member 144. By changing the feed amount (pressing amount) of the male screw member 147, the pushing amount of the straightening member 144 can be controlled.

図８（Ａ）に示すように、主梁部１４１が撓んだ状態では、矯正部材１４４は撓んでいない。図８（Ｂ）に示すように、矯正部材１４４を押すことで、主梁部１４１の内部で主梁部１４１の撓み方向と逆方向（持ち上げる方向）の力を発生させ、撓みをキャンセルさせることができる。これにより、実装ヘッド１５０の傾きをフラットに保つことができる。 As shown in FIG. 8A, the straightening member 144 is not bent when the main beam portion 141 is bent. As shown in FIG. 8B, by pushing the straightening member 144, a force is generated inside the main beam portion 141 in the direction opposite to the bending direction (lifting direction) of the main beam portion 141, and the bending is canceled. Can be done. As a result, the inclination of the mounting head 150 can be kept flat.

次に、実装ヘッドの位置によってネジ部材の送り量を調整することについて図９を用いて説明する。図９（Ａ）は実装ヘッドが中央付近に位置する場合の模式的な正面図であり、図９（Ｂ）は実装ヘッドが端付近に位置する場合の模式的な正面図である。図９では内部構造が見えるように一部透視して示している。 Next, adjusting the feed amount of the screw member according to the position of the mounting head will be described with reference to FIG. FIG. 9A is a schematic front view when the mounting head is located near the center, and FIG. 9B is a schematic front view when the mounting head is located near the end. In FIG. 9, a part of the internal structure is seen through so that the internal structure can be seen.

実装ヘッド１５０の位置によって主梁部１４１の撓み量が異なり、実装ヘッド１５０が主梁部１４１のＹ軸方向の中央付近に位置するとき撓み量が大きく、端付近に位置するとき撓み量は小さい。よって、図９（Ａ）に示すように、実装ヘッド１５０が主梁部１４１の中央付近に位置するとき雄ネジ部材１４７の送り量を大きくし、図９（Ｂ）に示すように、実装ヘッド１５０が主梁部１４１の端付近に位置するとき雄ネジ部材１４７の送り量を小さくする。 The amount of deflection of the main beam portion 141 differs depending on the position of the mounting head 150. When the mounting head 150 is located near the center of the main beam portion 141 in the Y-axis direction, the amount of deflection is large, and when it is located near the end, the amount of deflection is small. .. Therefore, as shown in FIG. 9A, when the mounting head 150 is located near the center of the main beam portion 141, the feed amount of the male screw member 147 is increased, and as shown in FIG. 9B, the mounting head is increased. When 150 is located near the end of the main beam portion 141, the feed amount of the male screw member 147 is reduced.

雄ネジ部材１４７はモータ等のアクチュエータ１４８で回転するので、雄ネジ部材１４７の送り量（押さえ量、回転位置）はアクチュエータ１４８を制御装置（不図示）によって制御することにより自動で調整することができる。よって、実装ヘッド１５０の位置に応じて矯正部材１４４を押す量を制御し主梁部１４１の撓みを制御することができる。 Since the male screw member 147 is rotated by an actuator 148 such as a motor, the feed amount (holding amount, rotation position) of the male screw member 147 can be automatically adjusted by controlling the actuator 148 with a control device (not shown). can. Therefore, it is possible to control the amount of pushing the straightening member 144 according to the position of the mounting head 150 and control the bending of the main beam portion 141.

また、ビーム１４０および実装ヘッド１５０にジャイロセンサ、水平検出センサ、ビームの変位センサ等の検出センサを設け、制御装置はこのセンサの信号をもとにアクチュエータ１４８を制御してもよい。これにより、撓みのない状態のセンサ信号位置に戻すように制御することにより、撓みのない状態を常時維持することができる。 Further, the beam 140 and the mounting head 150 may be provided with detection sensors such as a gyro sensor, a horizontal detection sensor, and a beam displacement sensor, and the control device may control the actuator 148 based on the signal of this sensor. As a result, by controlling the sensor signal to return to the position of the sensor signal without bending, it is possible to maintain the state without bending at all times.

第一実施形態によれば、ビーム構造そのものを高剛性（高重量）で構成せず、軽量（低剛性）の部材による撓み変形に応じた補強を行うことができ、ビームの動作に起因する変形、振動も最小限に留めることができる。 According to the first embodiment, the beam structure itself is not configured with high rigidity (high weight), and can be reinforced according to the bending deformation by the lightweight (low rigidity) member, and the deformation caused by the operation of the beam can be performed. , Vibration can be kept to a minimum.

＜第一実施形態の変形例＞
以下、第一実施形態の代表的な変形例について、幾つか例示する。以下の変形例の説明において、上述の実施形態にて説明されているものと同様の構成および機能を有する部分に対しては、上述の実施形態と同様の符号が用いられ得るものとする。そして、かかる部分の説明については、技術的に矛盾しない範囲内において、上述の実施形態における説明が適宜援用され得るものとする。また、上述の実施形態の一部、および、複数の変形例の全部または一部が、技術的に矛盾しない範囲内において、適宜、複合的に適用され得る。 <Modified example of the first embodiment>
Hereinafter, some typical modifications of the first embodiment will be illustrated. In the following description of the modification, the same reference numerals as those in the above-described embodiment may be used for the portions having the same configuration and function as those described in the above-described embodiment. As for the explanation of such a portion, the explanation in the above-described embodiment can be appropriately incorporated within a range that is not technically inconsistent. In addition, a part of the above-described embodiment and all or a part of the plurality of modifications can be appropriately and combinedly applied within a technically consistent range.

第一実施形態では雌ネジ部材１４６と雄ネジ部材１４７を用いて矯正部材１４４を押す例を説明したが、これに限定されるものではなく、Ｙビーム１４０に内蔵する矯正部材１４４を主梁部１４１の上部側から押さえ、その反力で主梁部１４１を持ち上げることができる機構（撓み矯正手段）であればよい。 In the first embodiment, an example of pushing the straightening member 144 by using the female screw member 146 and the male screw member 147 has been described, but the present invention is not limited to this, and the straightening member 144 built in the Y beam 140 is used as the main beam portion. Any mechanism (deflection correction means) that can hold the main beam portion 141 from the upper side of the 141 and lift the main beam portion 141 by the reaction force may be used.

（第一変形例）
第一変形例では矯正部材の上に楔状の平面カム部材を設ける。第一変形例のＹビームについて図１０を用いて説明する。図１０（Ａ）はＹビームを撓ませた状態を模式的に示す図であり、図１０（Ｂ）はＹビームの撓みを矯正した状態を模式的に示す図である。なお、図１０は内部構造が見えるように一部透視して示している。 (First modification)
In the first modification, a wedge-shaped flat cam member is provided on the straightening member. The Y beam of the first modification will be described with reference to FIG. FIG. 10A is a diagram schematically showing a state in which the Y beam is deflected, and FIG. 10B is a diagram schematically showing a state in which the deflection of the Y beam is corrected. Note that FIG. 10 is partially transparent so that the internal structure can be seen.

図１０に示すように、第一変形例のＹビーム１４０Ａは、一方の脚部１４２から主梁部１４１を経由して他方の脚部１４２まで延伸する矯正部材１４４と、矯正部材１４４の端部を所定の高さで支持する支持部材１４５と、矯正部材１４４のＹ軸方向の中央部に設けられた円筒状の回転部材１４９と、楔状の平面カム部材１４Ａと、平面カム部材１４Ａの端部に設けられた受け部材１４６Ａと、送り部材１４７Ａと、送り部材１４７Ａを送るアクチュエータ１４８Ａと、を備える。受け部材１４６Ａ、送り部材１４７Ａ、アクチュエータ１４８Ａおよび平面カム部材１４Ａは矯正部材１４４の上に位置し、回転部材１４９は主梁部１４１の上部に固定されている。 As shown in FIG. 10, the Y beam 140A of the first modification has a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and an end portion of the straightening member 144. A support member 145 that supports the blade at a predetermined height, a cylindrical rotating member 149 provided at the center of the straightening member 144 in the Y-axis direction, a wedge-shaped flat cam member 14A, and an end portion of the flat cam member 14A. The receiving member 146A, the feeding member 147A, and the actuator 148A for feeding the feeding member 147A are provided in the above. The receiving member 146A, the feeding member 147A, the actuator 148A and the flat cam member 14A are located on the straightening member 144, and the rotating member 149 is fixed to the upper part of the main beam portion 141.

矯正部材１４４の上に設けられた受け部材１４６Ａに送り部材１４７Ａをアクチュエータ１４８Ａによって送ることにより、平面カム部材１４Ａが回転部材１４９の下をＹ方向に移動する。これにより、第一実施形態と同様に、矯正部材１４４を鉛直方向に押すことが可能である。 By feeding the feed member 147A to the receiving member 146A provided on the straightening member 144 by the actuator 148A, the flat cam member 14A moves under the rotating member 149 in the Y direction. Thereby, as in the first embodiment, the straightening member 144 can be pushed in the vertical direction.

図１０（Ａ）に示すように、主梁部１４１が撓んだ状態では、矯正部材１４４は撓んでいない。図１０（Ｂ）に示すように、矯正部材１４４を押すことで、主梁部１４１の内部で主梁部１４１の撓み方向と逆方向（持ち上げる方向）の力を発生させ、撓みをキャンセルさせることができる。 As shown in FIG. 10A, the straightening member 144 is not bent when the main beam portion 141 is bent. As shown in FIG. 10B, by pushing the straightening member 144, a force is generated inside the main beam portion 141 in the direction opposite to the bending direction (lifting direction) of the main beam portion 141, and the bending is canceled. Can be done.

第一変形例によれば、重量物であるモータ等のアクチュエータを撓みの影響の少ない両サイドの脚部に設置することができる。 According to the first modification, actuators such as motors, which are heavy objects, can be installed on the legs on both sides, which are less affected by bending.

（第二変形例）
第二変形例ではＹビームの上に楔部材を設ける。第二変形例のＹビームについて図１１を用いて説明する。図１１は第二変形例のＹビームを模式的に示す図であり、図１１（Ａ）はＹビームを撓ませた状態を模式的に示す図であり、図１１（Ｂ）はＹビームの撓みを矯正した状態を模式的に示す図である。なお、図１１（Ａ）、図１１（Ｂ）は内部構造が見えるように一部透視して示している。 (Second modification)
In the second modification, a wedge member is provided on the Y beam. The Y beam of the second modification will be described with reference to FIG. 11 is a diagram schematically showing the Y beam of the second modification, FIG. 11A is a diagram schematically showing a state in which the Y beam is deflected, and FIG. 11B is a diagram of the Y beam. It is a figure which shows typically the state which corrected the bending. It should be noted that FIGS. 11 (A) and 11 (B) are partially transparent so that the internal structure can be seen.

図１１に示すように、第二変形例のＹビーム１４０Ｂは、一方の脚部１４２から主梁部１４１を経由して他方の脚部１４２まで延伸する矯正部材１４４と、矯正部材１４４の端部を所定の高さで支持する支持部材１４５と、矯正部材１４４のＹ軸方向の中央部に設けられた回転部材１４９Ｂと、平面カム部材１４ＡＢと、平面カム部材１４ＡＢに設けられた受け部材１４６Ｂと、送り部材１４７Ｂと、送り部材１４７Ｂを送るアクチュエータ１４８Ｂと、を備える。受け部材１４６Ｂ、送り部材１４７Ｂ、アクチュエータ１４８Ｂおよび平面カム部材１４ＡＢは主梁部１４１の上に位置し、回転部材１４９Ｂは矯正部材１４４の上に固定されている。 As shown in FIG. 11, the Y beam 140B of the second modification has a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and an end portion of the straightening member 144. A support member 145 provided at a predetermined height, a rotating member 149B provided at the center of the straightening member 144 in the Y-axis direction, a flat cam member 14AB, and a receiving member 146B provided on the flat cam member 14AB. , A feeding member 147B and an actuator 148B for feeding the feeding member 147B are provided. The receiving member 146B, the feeding member 147B, the actuator 148B and the flat cam member 14AB are located on the main beam portion 141, and the rotating member 149B is fixed on the straightening member 144.

主梁部１４１の上に設けられた受け部材１４６Ｂに送り部材１４７Ｂをアクチュエータ１４８Ｂによって送ることにより、平面カム部材１４ＡＢが回転部材１４９Ｂの上をＹ方向に移動する。これにより、第一実施形態と同様に、矯正部材１４４を鉛直方向に押すことが可能である。 By feeding the feed member 147B to the receiving member 146B provided on the main beam portion 141 by the actuator 148B, the flat cam member 14AB moves on the rotating member 149B in the Y direction. Thereby, as in the first embodiment, the straightening member 144 can be pushed in the vertical direction.

図１１（Ａ）に示すように、主梁部１４１が撓んだ状態では、矯正部材１４４は撓んでいない。図１１（Ｂ）に示すように、矯正部材１４４を押すことで、主梁部１４１の内部で主梁部１４１の撓み方向と逆方向（持ち上げる方向）の力を発生させ、撓みをキャンセルさせることができる。 As shown in FIG. 11A, the straightening member 144 is not bent when the main beam portion 141 is bent. As shown in FIG. 11B, by pushing the straightening member 144, a force is generated inside the main beam portion 141 in the direction opposite to the bending direction (lifting direction) of the main beam portion 141, and the bending is canceled. Can be done.

（第三変形例）
第三変形例ではＹビームの上に中心からずれた位置に軸が取り付けた円板である偏心カム部材を設ける。第二変形例のＹビームについて図１２を用いて説明する。図１２は第三変形例のＹビームを模式的に示す図であり、図１２（Ａ）はＹビームを撓ませた状態を模式的に示す図であり、図１２（Ｂ）はＹビームの撓みを矯正した状態を模式的に示す図であり、図１２（Ａ）は正面図であり、図１２（Ｂ）は側面図であり、内部構造が見えるように一部透視して示している。 (Third modification example)
In the third modification, an eccentric cam member, which is a disk with a shaft attached at a position deviated from the center, is provided on the Y beam. The Y beam of the second modification will be described with reference to FIG. FIG. 12 is a diagram schematically showing the Y beam of the third modification, FIG. 12A is a diagram schematically showing a state in which the Y beam is deflected, and FIG. 12B is a diagram of the Y beam. It is a figure which shows the state which corrected the bending schematically, FIG. 12A is a front view, and FIG. 12B is a side view, which is partially seen through so that the internal structure can be seen. ..

図１２に示すように、第三変形例のＹビーム１４０Ｃは、一方の脚部１４２から主梁部１４１を経由して他方の脚部１４２まで延伸する矯正部材１４４と、矯正部材１４４の端部を所定の高さで支持する支持部材１４５と、矯正部材１４４のＹ軸方向の中央部に設けられた回転部材１４９Ｃと、偏心カム部材１４Ｂと、偏心カム部材１４Ｂの軸を回転させるアクチュエータ１４８Ｃと、を備える。アクチュエータ１４８Ｃおよび偏心カム部材１４Ｂは主梁部１４１の上に位置し、回転部材１４９Ｃは矯正部材１４４の上に固定されている。 As shown in FIG. 12, the Y beam 140C of the third modification has a straightening member 144 extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and an end portion of the straightening member 144. A support member 145 that supports the eccentric cam member 145 at a predetermined height, a rotating member 149C provided at the center of the straightening member 144 in the Y-axis direction, an eccentric cam member 14B, and an actuator 148C that rotates the axis of the eccentric cam member 14B. , Equipped with. The actuator 148C and the eccentric cam member 14B are located on the main beam portion 141, and the rotating member 149C is fixed on the straightening member 144.

主梁部１４１の上に設けられた偏心カム部材１４Ｂの軸をアクチュエータ１４８Ｃによって回転することにより、偏心カム部材１４Ｂが回転部材１４９Ｃの上を回転する。これにより、第一実施形態と同様に、矯正部材１４４を鉛直方向に押すことが可能である。 By rotating the shaft of the eccentric cam member 14B provided on the main beam portion 141 by the actuator 148C, the eccentric cam member 14B rotates on the rotating member 149C. Thereby, as in the first embodiment, the straightening member 144 can be pushed in the vertical direction.

図１２に示すように、矯正部材１４４を押すことで、主梁部１４１の内部で主梁部１４１の撓み方向と逆方向（持ち上げる方向）の力を発生させ、撓みをキャンセルさせることができる。 As shown in FIG. 12, by pushing the straightening member 144, a force in the direction opposite to the bending direction (lifting direction) of the main beam portion 141 can be generated inside the main beam portion 141 to cancel the bending.

＜第二実施形態＞
次に、上記の第二課題を解決する第二実施形態について図１３を用いて説明する。図１３は第二実施形態のＹビームを模式的に示す図であり、Ｙビームを撓ませた状態を模式的に示す図であり、図１３（Ａ）は正面図であり、図１３（Ｂ）は側面図であり、内部構造が見えるように一部透視して示している。 <Second embodiment>
Next, a second embodiment for solving the above-mentioned second problem will be described with reference to FIG. 13 is a diagram schematically showing the Y beam of the second embodiment, is a diagram schematically showing a state in which the Y beam is deflected, FIG. 13A is a front view, and FIG. 13B is a front view. ) Is a side view, and is partially seen through so that the internal structure can be seen.

図１３に示すように、第二実施形態のＹビーム１４０Ｄは、一方の脚部１４２から主梁部１４１を経由して他方の脚部１４２まで延伸する矯正部材１４４Ｄと、矯正部材１４４Ｄの端部を所定の高さで支持する支持部材１４５Ｄと矯正部材１４４のＹ方向の中央部に設けられた雌ネジ部材１４６Ｄと、雌ネジ部材１４６Ｄと雄ネジ部材１４７と、雄ネジ部材１４７を回転させるアクチュエータ１４８と、を備える。矯正部材１４４Ｄ、支持部材１４５Ｄ、雌ネジ部材１４６Ｄおよび雄ネジ部材１４７はＹビーム１４０Ｄの内部に位置し、アクチュエータ１４８は主梁部１４１の上に固定されている。矯正部材１４４Ｄは軽量高剛性素材（例えば、ＣＦＲＰ（Carbon Fiber Reinforced Plastic））で形成される。 As shown in FIG. 13, the Y beam 140D of the second embodiment has a straightening member 144D extending from one leg portion 142 to the other leg portion 142 via the main beam portion 141, and an end portion of the straightening member 144D. A support member 145D that supports the screw member at a predetermined height, a female screw member 146D provided at the center of the straightening member 144 in the Y direction, a female screw member 146D, a male screw member 147, and an actuator that rotates the male screw member 147. 148 and. The straightening member 144D, the support member 145D, the female thread member 146D, and the male thread member 147 are located inside the Y beam 140D, and the actuator 148 is fixed on the main beam portion 141. The straightening member 144D is made of a lightweight and highly rigid material (for example, CFRP (Carbon Fiber Reinforced Plastic)).

矯正部材１４４Ｄは奥行方向（Ｘ方向）の長さが第一実施形態の矯正部材１４４よりも長く、雌ネジ部材１４６Ｄも第一実施形態の雌ネジ部材１４６よりも奥側（Ｘ軸正方向側）に固定されている。 The length of the straightening member 144D in the depth direction (X direction) is longer than that of the straightening member 144 of the first embodiment, and the female screw member 146D is also deeper than the female screw member 146 of the first embodiment (X-axis positive direction side). ) Is fixed.

矯正部材１４４Ｄに設けられた雌ネジ部材１４６Ｄに挿入された雄ネジ部材１４７をアクチュエータ１４８によって回転することにより、矯正部材１４４Ｄを鉛直方向に押すことが可能である。雄ネジ部材１４７の送り量（押さえ量）を変えることで矯正部材１４４Ｄの押し量を制御することができる。 By rotating the male screw member 147 inserted into the female screw member 146D provided on the straightening member 144D by the actuator 148, the straightening member 144D can be pushed in the vertical direction. By changing the feed amount (pressing amount) of the male screw member 147, the pushing amount of the straightening member 144D can be controlled.

図１３（Ｂ）に示すように、矯正部材１４４Ｄを押すことで、主梁部１４１の内部で主梁部１４１の捩れ方向と逆方向（持ち上げる方向）の力を発生させ、捩れをキャンセルさせることができる。言い換えると、矯正部材１４４Ｄの中心からオフセットしたところを押す駆動機構により、矯正部材１４４Ｄの捩れの回転中心からずれたところを押すことで捩じりモーメントが発生する。矯正部材１４４Ｄおよび実装ヘッド１５０の重量で捩れる成分を打ち消す方向に矯正部材１４４Ｄを押し、捩じりモーメントを発生させ捩れをキャンセルする。 As shown in FIG. 13B, by pushing the straightening member 144D, a force is generated inside the main beam portion 141 in the direction opposite to the twisting direction (lifting direction) of the main beam portion 141, and the twisting is canceled. Can be done. In other words, a twisting moment is generated by pushing a portion of the straightening member 144D deviated from the rotation center of the twist by a drive mechanism that pushes the portion offset from the center of the straightening member 144D. The straightening member 144D is pushed in a direction that cancels the twisting component due to the weight of the straightening member 144D and the mounting head 150, and a twisting moment is generated to cancel the twisting.

第一実施形態と同様に、実装ヘッド１５０のＹ方向の位置に応じて矯正部材１４４Ｄを押す量を制御し主梁部１４１の捩れおよび実装ヘッド１５０の傾きをフラットに保つようにする。捩れ量は実装ヘッド１５０の位置によって変わるため、実装ヘッド１５０Ｄの位置に応じてキャンセルする捩れモーメント量を押す量で制御する。 Similar to the first embodiment, the amount of pushing the straightening member 144D is controlled according to the position of the mounting head 150 in the Y direction so that the twist of the main beam portion 141 and the inclination of the mounting head 150 are kept flat. Since the amount of twist changes depending on the position of the mounting head 150, the amount of twisting moment to be canceled is controlled by the amount to be pushed according to the position of the mounting head 150D.

また、第一実施形態と同様に、ビーム１４０および実装ヘッド１５０にジャイロセンサや水平検出センサなどの角度検出センサ等を設け、制御装置はこのセンサの信号をもとにアクチュエータ１４８を制御してもよい。これにより、常時捩れのない状態のセンサ信号位置に戻すように制御することにより、捩れのない状態を常時維持することができる。 Further, as in the first embodiment, the beam 140 and the mounting head 150 may be provided with an angle detection sensor such as a gyro sensor or a horizontal detection sensor, and the control device may control the actuator 148 based on the signal of this sensor. good. As a result, the sensor signal position can be controlled so as to always return to the sensor signal position without twisting, so that the state without twisting can be maintained at all times.

＜第二実施形態の変形例＞
以下、第二実施形態の代表的な変形例について、幾つか例示する。以下の変形例の説明において、上述の第一実施形態および第二実施形態にて説明されているものと同様の構成および機能を有する部分に対しては、上述の第一実施形態および第二実施形態と同様の符号が用いられ得るものとする。そして、かかる部分の説明については、技術的に矛盾しない範囲内において、上述の第一実施形態および第二実施形態における説明が適宜援用され得るものとする。また、上述の第一実施形態および第二実施形態の一部、および、複数の変形例の全部または一部が、技術的に矛盾しない範囲内において、適宜、複合的に適用され得る。 <Modified example of the second embodiment>
Hereinafter, some typical modifications of the second embodiment will be illustrated. In the following description of the modified examples, the above-mentioned first embodiment and the second embodiment are referred to with respect to the portions having the same configurations and functions as those described in the first embodiment and the second embodiment described above. It is assumed that the same reference numerals as those in the form can be used. As for the explanation of such a portion, the above-mentioned explanations in the first embodiment and the second embodiment can be appropriately incorporated within a technically consistent range. In addition, a part of the above-mentioned first embodiment and the second embodiment, and all or a part of the plurality of modifications can be appropriately and combinedly applied within a technically consistent range.

第二実施形態では雌ネジ部材１４６Ｄと雄ネジ部材１４７を用いて矯正部材１４４Ｄを押す例を説明したが、これに限定されるものではなく、重量で捩れる成分を打ち消す方向に、捩じりモーメントを発生させ捩れをキャンセルすることができる機構（捩れ矯正手段）であればよい。 In the second embodiment, an example of pushing the straightening member 144D by using the female screw member 146D and the male screw member 147 has been described, but the present invention is not limited to this, and twisting is performed in a direction of canceling a component twisted by weight. Any mechanism (twist correction means) that can generate a moment and cancel the twist may be used.

（第四変形例）
第四変形例の実装装置について図１４〜１８を用いて説明する。図１４は第四変形例の実装装置を模式的に示す斜視図である。図１５は第四変形例のＹビームを模式的に示す斜視図である。図１６は図１５のＹビームの捩れ矯正を説明する模式的な図であり、図１６（Ａ）は捩れる前の状態を示す側面図であり、図１６（Ｂ）は捩れた状態を示す側面図であり、図１６（Ｃ）は捩れを矯正した状態を示す模式的側面図である。図１７は実装ヘッドの位置により捩れ量が異なることを説明する模式的な図であり、図１７（Ａ）は実装ヘッドが脚部側に位置する場合を示す側面図であり、図１７（Ｂ）実装ヘッドが脚部側と中央部側の間に位置する場合を示す側面図であり、図１７（Ｃ）は実装ヘッドが中央部に位置する場合を示す側面図である。図１８は実装ヘッドの位置により調整用シムの取付け量を変えることを説明する模式的な図であり、図１８（Ａ）は実装ヘッドが脚部側に位置する場合を示す側面図であり、図１８（Ｂ）実装ヘッドが脚部側と中央部側の間に位置する場合を示す側面図であり、図１８（Ｃ）は実装ヘッドが中央部に位置する場合を示す側面図である。 (Fourth modification)
The mounting device of the fourth modification will be described with reference to FIGS. 14 to 18. FIG. 14 is a perspective view schematically showing the mounting device of the fourth modification. FIG. 15 is a perspective view schematically showing the Y beam of the fourth modification. 16A and 16B are schematic views illustrating the twist correction of the Y beam of FIG. 15, FIG. 16A is a side view showing a state before twisting, and FIG. 16B shows a twisted state. It is a side view, and FIG. 16C is a schematic side view showing a state in which the twist is corrected. FIG. 17 is a schematic view illustrating that the amount of twist differs depending on the position of the mounting head, and FIG. 17A is a side view showing a case where the mounting head is located on the leg side, and FIG. 17B is a side view. ) It is a side view showing the case where the mounting head is located between the leg side and the central portion side, and FIG. 17C is a side view showing the case where the mounting head is located in the central portion. FIG. 18 is a schematic view illustrating that the mounting amount of the adjusting shim is changed depending on the position of the mounting head, and FIG. 18A is a side view showing the case where the mounting head is located on the leg side. FIG. 18B is a side view showing a case where the mounting head is located between the leg side and the central portion side, and FIG. 18C is a side view showing a case where the mounting head is located in the central portion.

第四変形例の実装装置１００Ｅは実施形態の実装装置１００とＹビームの構造が異なるが、他の構造は同様である。第四変形例のＹビーム１４０Ｅは、主梁部１４１の底面と脚部１４２の底面（スライダ１４３の上面）よりも下に位置する。また、Ｙビーム１４０Ｅの背面に（主梁部１４１Ｅの実装ヘッド１５０が取り付けられる面とは反対側の面に）、反り矯正プレート１４Ｃを調整用シム（間隙調整板）１４Ｄを介して取り付けて構成される。調整用シム１４Ｄは隙間を調整する薄鋼板であり、例えば数種の所定の厚さのものを準備しておき、これを適宜選択して組み込まれる。 The mounting device 100E of the fourth modification has a different structure of the Y beam from the mounting device 100 of the embodiment, but the other structures are the same. The Y beam 140E of the fourth modification is located below the bottom surface of the main beam portion 141 and the bottom surface of the leg portion 142 (the upper surface of the slider 143). Further, the warp correction plate 14C is attached to the back surface of the Y beam 140E (on the surface opposite to the surface on which the mounting head 150 of the main beam portion 141E is attached) via the adjustment shim (gap adjustment plate) 14D. Will be done. The adjusting shim 14D is a thin steel plate for adjusting a gap. For example, several kinds of shims having a predetermined thickness are prepared, and the shims 14D are appropriately selected and incorporated.

図１６（Ａ）、図１６（Ｂ）に示すように、実装ヘッド１５０および主梁部１４１Ｅの重量によって主梁部１４１Ｅが捩れる。そこで、図１６（Ｃ）に示すように、主梁部１４１ＥのＹ軸方向の中央部の下部側に捩れる分を矯正する調整用シム１４Ｄを追加する。すなわち、主梁部１４１Ｅの背面に、反りを矯正する捩れ剛性の高いプレートを実装ヘッド１５０等の自重による捩れと逆の方向に捩る形で取り付け、捩れる量に応じて逆方向に捩れる力を主梁部１４１Ｅに付与することで捩れ量を相殺・低減する。これにより、主梁部１４１Ｅを軽量化し剛性低下してもその分を相殺する構造となり、軽量化と高精度の両立を可能にする。 As shown in FIGS. 16A and 16B, the main beam portion 141E is twisted by the weight of the mounting head 150 and the main beam portion 141E. Therefore, as shown in FIG. 16C, an adjusting shim 14D for correcting the twisted portion is added to the lower side of the central portion of the main beam portion 141E in the Y-axis direction. That is, a plate having high torsional rigidity for correcting warpage is attached to the back surface of the main beam portion 141E in a form of twisting in the direction opposite to the twisting due to the weight of the mounting head 150 or the like, and the force of twisting in the opposite direction according to the amount of twisting. Is applied to the main beam portion 141E to offset or reduce the amount of twist. As a result, even if the weight of the main beam portion 141E is reduced and the rigidity is reduced, the structure is offset by that amount, which makes it possible to achieve both weight reduction and high accuracy.

図１７（Ａ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの端部側（脚部１４２Ｅ側）に位置する場合は、主梁部１４１Ｅの支持部に近く捩れにくい。図１７（Ｂ）、図１７（Ｃ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの中央部に移動するほど、主梁部１４１Ｅの剛性に依存し捩れやすい。 As shown in FIG. 17A, when the mounting head 150 is located on the end side (leg portion 142E side) of the main beam portion 141E, it is close to the support portion of the main beam portion 141E and is not easily twisted. As shown in FIGS. 17B and 17C, the more the mounting head 150 moves to the central portion of the main beam portion 141E, the more easily it twists depending on the rigidity of the main beam portion 141E.

そこで、図１８（Ａ）に示すように、主梁部１４１Ｅの端部側（脚部１４２Ｅ側）では、調整用シム１４Ｄを挿入せず、図１８（Ｂ）、図１８（Ｃ）に示すように、主梁部１４１Ｅの中央部に近いほど多くの調整用シム１４Ｄを挿入する。これにより、中央部ほど反り矯正プレート１４Ｃの反力が大きくなり、捩れる量に応じて逆方向に捩れる力を主梁部１４１Ｅに付与することで捩れ量を相殺・低減することができる。 Therefore, as shown in FIG. 18 (A), the adjusting shim 14D is not inserted on the end side (leg portion 142E side) of the main beam portion 141E, and is shown in FIGS. 18 (B) and 18 (C). As described above, the closer to the center of the main beam portion 141E, the more adjustment shims 14D are inserted. As a result, the reaction force of the warp correction plate 14C becomes larger toward the central portion, and the twisting amount can be offset or reduced by applying a twisting force in the opposite direction to the main beam portion 141E according to the twisting amount.

（第五変形例）
第五変形例では反り矯正プレートに向け反力を発生する機構を設ける。第五変形例のＹビームについて図１９を用いて説明する。図１９は第五変形例のＹビームを模式的に示す図であり、図１９（Ａ）は実装ヘッドが脚部側に位置する場合を示す側面図であり、図１９（Ｂ）は実装ヘッドが脚部側と中央部側の間に位置する場合を示す側面図であり、図１９（Ｃ）は実装ヘッドが中央部に位置する場合を示す側面図である。 (Fifth variant)
In the fifth modification, a mechanism for generating a reaction force is provided toward the warp correction plate. The Y beam of the fifth modification will be described with reference to FIG. 19 is a diagram schematically showing the Y beam of the fifth modification, FIG. 19A is a side view showing the case where the mounting head is located on the leg side, and FIG. 19B is a side view showing the case where the mounting head is located on the leg side. Is a side view showing the case where is located between the leg side and the central portion side, and FIG. 19C is a side view showing the case where the mounting head is located in the central portion.

図１９（Ａ）に示すように、第四変形例のＹビーム１４０Ｅは、主梁部１４１Ｅ内に送り部材１４７Ｆと、送り部材１４７Ｆを送るアクチュエータ１４８Ｆと、を備える。 As shown in FIG. 19A, the Y beam 140E of the fourth modification includes a feed member 147F and an actuator 148F for feeding the feed member 147F in the main beam portion 141E.

アクチュエータ１４８Ａによって送り部材１４７ＦをＸ軸方向に送ることにより、反り矯正プレート１４Ｃの下部をＸ方向に押すことができる。 By feeding the feed member 147F in the X-axis direction by the actuator 148A, the lower portion of the warp correction plate 14C can be pushed in the X-direction.

第四変形例と同様、図１７（Ａ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの端部側（脚部１４２Ｅ側）に位置する場合は、主梁部１４１Ｅの支持部に近く捩れにくい。図１７（Ｂ）、図１７（Ｃ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの中央部に移動するほど、主梁部１４１Ｅの剛性に依存し捩れやすい。 Similar to the fourth modification, when the mounting head 150 is located on the end side (leg portion 142E side) of the main beam portion 141E as shown in FIG. 17 (A), it is close to the support portion of the main beam portion 141E. Hard to twist. As shown in FIGS. 17B and 17C, the more the mounting head 150 moves to the central portion of the main beam portion 141E, the more easily it twists depending on the rigidity of the main beam portion 141E.

そこで、図１９（Ａ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの端部側に位置する場合は、送り部材１４７Ｆを押さず、図１９（Ｂ）、図１９（Ｃ）に示すように、実装ヘッド１５０が主梁部１４１Ｅの中央部に近いほど送り部材１４７Ｆを押す量を多くする。これにより、第四変形例と同様に、中央部ほど反り矯正プレート１４Ｃの反力が大きくなり、捩れる量に応じて逆方向に捩れる力を主梁部１４１Ｅに付与することで捩れ量を相殺・低減することができる。 Therefore, as shown in FIG. 19A, when the mounting head 150 is located on the end side of the main beam portion 141E, the feed member 147F is not pushed and is shown in FIGS. 19B and 19C. As described above, the closer the mounting head 150 is to the central portion of the main beam portion 141E, the larger the amount of pushing the feed member 147F. As a result, as in the fourth modification, the reaction force of the warp correction plate 14C becomes larger toward the center, and the twist amount is increased by applying a force that twists in the opposite direction according to the twist amount to the main beam portion 141E. It can be offset / reduced.

また、実装ヘッドの位置決め位置に応じて補正テーブルまたは計算にて押す量を制御することにより、自動的にビームの捩れ補正が可能となる。この場合、ヘッド種類変更、組み換えなどによるヘッド重量変化にも追従可能となり、より簡便に捩れ矯正が可能になる。 Further, by controlling the amount of pushing by the correction table or calculation according to the positioning position of the mounting head, it is possible to automatically correct the twist of the beam. In this case, it becomes possible to follow the head weight change due to the head type change, recombination, etc., and the twist correction becomes possible more easily.

（第六変形例）
第一実施形態ではビームの撓みを矯正する例、第二実施形態ではビームの捩れを矯正する例を説明したが、ビームの撓みおよびビームの捩れの両方を矯正する例（第六変形例）について図２０を用いて説明する。図２０は第六変形例のＹビームを模式的に示す図であり、図２０（Ａ）は撓みが大きく捩れが小さい場合の構造を模式的に示す側面図であり、図２０（Ｂ）は撓みが小さく捩れが大きい場合の構造を模式的に示す側面図である。 (Sixth modification)
An example of correcting the deflection of the beam was described in the first embodiment, and an example of correcting the twist of the beam was described in the second embodiment. However, an example of correcting both the bending of the beam and the twist of the beam (sixth modification) This will be described with reference to FIG. 20 is a diagram schematically showing the Y beam of the sixth modification, FIG. 20A is a side view schematically showing the structure when the deflection is large and the twist is small, and FIG. 20B is a side view schematically showing the structure. It is a side view schematically showing the structure in the case of small bending and large twist.

第六変形例のＹビーム１４０Ｇは第二実施形態のＹビーム１４０Ｄと同様な構造であるが、矯正部材１４４Ｄの押す位置を実機の状態に応じて調整できるように、雌ネジ部材１４６Ｄ、雄ネジ部材１４７およびアクチュエータ１４８のＸ軸方向の位置が変更可能である。 The Y-beam 140G of the sixth modification has the same structure as the Y-beam 140D of the second embodiment, but has a female screw member 146D and a male screw so that the pushing position of the straightening member 144D can be adjusted according to the state of the actual machine. The positions of the member 147 and the actuator 148 in the X-axis direction can be changed.

Ｙビーム１４０Ｇの撓みが大きく、捩れが小さい場合は、図２０（Ａ）に示すように、矯正部材１４４Ｄを押す位置をＸ軸方向の中央寄りに調整する。矯正部材１４４Ｄの中央付近を押すことにより、第一実施形態と同様な作用でＹビーム１４０Ｇの撓みおよび第二実施形態と同様な作用でＹビーム１４０Ｇの捩れを低減することができる。 When the Y beam 140G has a large deflection and a small twist, the position for pushing the straightening member 144D is adjusted toward the center in the X-axis direction as shown in FIG. 20 (A). By pushing near the center of the straightening member 144D, it is possible to reduce the bending of the Y beam 140G by the same action as in the first embodiment and the twisting of the Y beam 140G by the same action as in the second embodiment.

Ｙビーム１４０Ｇの撓みが小さく、捩れが大きい場合は、図２０（Ｂ）に示すように、矯正部材１４４Ｄを押す位置をＸ軸方向の外側寄りに調整する。矯正部材１４４Ｄの端部を押すことにより、第二実施形態と同様な作用でＹビーム１４０Ｇの捩れおよび第一実施形態と同様な作用でＹビーム１４０Ｇの撓みを低減することができる。 When the deflection of the Y beam 140G is small and the twist is large, as shown in FIG. 20B, the position where the straightening member 144D is pushed is adjusted toward the outside in the X-axis direction. By pushing the end of the straightening member 144D, the twisting of the Y beam 140G can be reduced by the same action as in the second embodiment, and the bending of the Y beam 140G can be reduced by the same action as in the first embodiment.

よって、矯正部材１４４Ｄを押す位置を中央から端部の間で調整することにより、Ｙビーム１４０Ｇ撓みおよび捩れの両方を低減することができる。 Therefore, by adjusting the position where the straightening member 144D is pushed from the center to the end, both the Y beam 140G deflection and the twist can be reduced.

以下、上述の実施形態のＹビームを実装装置の一例であるフリップチップボンダに適用した例について説明するが、これに限定されるものではなく、パッケージされた半導体装置等を基板に実装するチップマウンタ（表面実装機）や半導体チップ（ダイ）を基板等にボンディングするダイボンダにも適用することができる。なお、フリップチップボンダは、例えばチップ面積を超える広い領域に再配線層を形成するパッケージであるファンアウト型ウェハレベルパッケージ（Fan Out Wafer Level Package：ＦＯＷＬＰ）等の製造に用いられる。 Hereinafter, an example in which the Y beam of the above-described embodiment is applied to a flip chip bonder which is an example of a mounting device will be described, but the present invention is not limited to this, and a chip mounter for mounting a packaged semiconductor device or the like on a substrate is described. It can also be applied to (surface mounters) and die bonders that bond semiconductor chips (dies) to substrates and the like. The flip chip bonder is used for manufacturing, for example, a fan-out type wafer level package (FOWLP) which is a package for forming a rewiring layer in a wide area exceeding the chip area.

図２１は実施例１のフリップチップボンダの概略を示す上面図である。図２２は図２１において矢印Ａ方向から見たときに、ピックアップフリップヘッド、トランスファヘッド及びボンディングヘッドの動作を説明する図である。 FIG. 21 is a top view showing an outline of the flip chip bonder of the first embodiment. FIG. 22 is a diagram illustrating the operation of the pickup flip head, the transfer head, and the bonding head when viewed from the direction of arrow A in FIG. 21.

フリップチップボンダ１０は、大別して、ダイ供給部１と、ピックアップ部２、トランスファ部８と、中間ステージ部３と、ボンディング部４と、搬送部５と、基板供給部６Ｋと、基板搬出部６Ｈと、各部の動作を監視し制御する制御装置７と、を有する。 The flip chip bonder 10 is roughly divided into a die supply unit 1, a pickup unit 2, a transfer unit 8, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6K, and a substrate carry-out unit 6H. And a control device 7 that monitors and controls the operation of each part.

まず、ダイ供給部１は、基板等の基板Ｐに実装するダイＤを供給する。ダイ供給部１は、分割されたウェハ１１を保持するウェハ保持台１２と、ウェハ１１からダイＤを突き上げる点線で示す突き上げユニット１３と、ウェハリング供給部１８と、を有する。ダイ供給部１は、図示しない駆動手段によってＸＹ方向に移動し、ピックアップするダイＤを突き上げユニット１３の位置に移動させる。ウェハリング供給部１８はウェハリングが収納されたウェハカセットを有し，順次ウェハリングをダイ供給部１に供給し、新しいウェハリングに交換する。ダイ供給部１は、所望のダイをウェハリングからピックアップできるように、ピックアップポイントに、ウェハリングを移動する。ウェハリングは、ウェハが固定され、ダイ供給部１に取り付け可能な治具である。 First, the die supply unit 1 supplies a die D to be mounted on a substrate P such as a substrate. The die supply unit 1 includes a wafer holding table 12 for holding the divided wafer 11, a push-up unit 13 shown by a dotted line for pushing up the die D from the wafer 11, and a wafer ring supply unit 18. The die supply unit 1 is moved in the XY direction by a drive means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13. The wafer ring supply unit 18 has a wafer cassette in which the wafer ring is housed, and sequentially supplies the wafer ring to the die supply unit 1 and replaces it with a new wafer ring. The die supply unit 1 moves the wafer ring to the pickup point so that the desired die can be picked up from the wafer ring. The wafer ring is a jig in which the wafer is fixed and can be attached to the die supply unit 1.

ピックアップ部２は、ダイＤをピックアップして反転するピックアップフリップヘッド２１と、コレット２２を昇降、回転、反転及びＸ方向移動させる図示しない各駆動部と、を有する。このような構成によって、ピックアップフリップヘッド２１は、ダイをピックアップし、ピックアップフリップヘッド２１を１８０度回転させ、ダイＤのバンプを反転させて下面に向け、ダイＤをトランスファヘッド８１に渡す姿勢にする。 The pickup unit 2 has a pickup flip head 21 that picks up the die D and reverses it, and each drive unit (not shown) that moves the collet 22 up / down, rotates, reverses, and moves in the X direction. With such a configuration, the pickup flip head 21 picks up the die, rotates the pickup flip head 21 by 180 degrees, inverts the bump of the die D, faces the lower surface, and makes the die D pass to the transfer head 81. ..

トランスファ部８は、反転したダイＤをピックアップフリップヘッド２１から受けとり、中間ステージ３１に載置する。トランスファ部８は、ピックアップフリップヘッド２１と同様にダイＤを先端に吸着保持するコレット８２を備えるトランスファヘッド８１と、トランスファヘッド８１をＹ方向に移動させるＹ駆動部８３と、を有する。 The transfer unit 8 receives the inverted die D from the pickup flip head 21 and places it on the intermediate stage 31. The transfer unit 8 includes a transfer head 81 having a collet 82 that attracts and holds the die D to the tip thereof like the pickup flip head 21, and a Y drive unit 83 that moves the transfer head 81 in the Y direction.

中間ステージ部３は、ダイＤを一時的に載置する中間ステージ３１およびステージ認識カメラ３４を有する。中間ステージ３１は図示しない駆動部によりＹ方向に移動可能である。 The intermediate stage unit 3 has an intermediate stage 31 and a stage recognition camera 34 on which the die D is temporarily placed. The intermediate stage 31 can be moved in the Y direction by a drive unit (not shown).

ボンディング部４は、中間ステージ３１からダイＤをピックアップし、搬送されてくる基板Ｐ上にボンディングする。ボンディング部４は、ピックアップフリップヘッド２１と同様にダイＤを先端に吸着保持するコレット４２を備えるボンディングヘッド４１と、ボンディングヘッド４１をＹ方向に移動させるＹビーム４３と、基板Ｐの位置認識マーク（図示せず）を撮像し、ボンディング位置を認識する基板認識カメラ４４と、Ｘ支持台４５と、を有する。
このような構成によって、ボンディングヘッド４１は、中間ステージ３１からダイＤをピックアップし、基板認識カメラ４４の撮像データに基づいて基板ＰにダイＤをボンディングする。 The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the conveyed substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 that sucks and holds the die D at the tip like the pickup flip head 21, a Y beam 43 that moves the bonding head 41 in the Y direction, and a position recognition mark on the substrate P. It has a substrate recognition camera 44 that captures an image (not shown) and recognizes the bonding position, and an X support base 45.
With such a configuration, the bonding head 41 picks up the die D from the intermediate stage 31, and bonds the die D to the substrate P based on the image pickup data of the substrate recognition camera 44.

搬送部５は、基板ＰがＸ方向に移動する搬送レール５１，５２を備える。搬送レール５１，５２は平行に設けられる。このような構成によって、基板供給部６Ｋから基板Ｐを搬出し、搬送レール５１，５２に沿ってボンディング位置まで移動し、ボンディング後基板搬出部６Ｈまで移動して、基板搬出部６Ｈに基板Ｐを渡す。基板ＰにダイＤをボンディング中に、基板供給部６Ｋは新たな基板Ｐを搬出し、搬送レール５１，５２上で待機する。 The transport unit 5 includes transport rails 51 and 52 in which the substrate P moves in the X direction. The transport rails 51 and 52 are provided in parallel. With such a configuration, the board P is carried out from the board supply part 6K, moved to the bonding position along the transport rails 51 and 52, moved to the board carry-out part 6H after bonding, and the board P is moved to the board carry-out part 6H. hand over. While the die D is being bonded to the substrate P, the substrate supply unit 6K carries out a new substrate P and stands by on the transfer rails 51 and 52.

図２３は図２１のダイ供給部の主要部を示す概略断面図である。図２３に示すように、ダイ供給部１は、ウェハリング１４を保持するエキスパンドリング１５と、ウェハリング１４に保持され複数のダイＤが粘着されたダイシングテープ１６を水平に位置決めする支持リング１７と、ダイＤを上方に突き上げるための突き上げユニット１３と、を有する。所定のダイＤをピックアップするために、突き上げユニット１３は、図示しない駆動機構によって上下方向に移動し、ダイ供給部１は水平方向には移動するようになっている。 FIG. 23 is a schematic cross-sectional view showing a main part of the die supply part of FIG. 21. As shown in FIG. 23, the die supply unit 1 includes an expanding ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held on the wafer ring 14 and to which a plurality of dies D are adhered. , A push-up unit 13 for pushing up the die D upward. In order to pick up a predetermined die D, the push-up unit 13 is moved in the vertical direction by a drive mechanism (not shown), and the die supply unit 1 is moved in the horizontal direction.

ボンディング部について実施形態を参照しながら図７、２４を用いて説明する。図２４はボンディング部４の主要部を示す概略側面図である。一部の構成要素は透視して示されている。なお、図２４の側面図は図７の正面図に対応している。 The bonding portion will be described with reference to FIGS. 7 and 24 with reference to the embodiments. FIG. 24 is a schematic side view showing a main portion of the bonding portion 4. Some components are shown see through. The side view of FIG. 24 corresponds to the front view of FIG. 7.

ボンディング部４は、架台５３（架台１１０）の上に支持されるボンディングステージＢＳ（実装ステージ１２０）と、搬送レール５２，５３の近傍に設けられるＸ支持台４５１（Ｘ支持台１３１）と、Ｘ支持台４５１の上に支持されるＹビーム４３（Ｙビーム１４０）と、Ｙビーム４３に支持されるボンディングヘッド４１（実装ヘッド１５０）と、ボンディングヘッド４１をＹ軸方向およびＺ軸方向に駆動する駆動部４６（駆動部１６０）と、を備えている。 The bonding portion 4 includes a bonding stage BS (mounting stage 120) supported on the gantry 53 (mounting pedestal 110), an X support pedestal 451 (X support pedestal 131) provided in the vicinity of the transport rails 52 and 53, and X. The Y beam 43 (Y beam 140) supported on the support base 451 and the bonding head 41 (mounting head 150) supported by the Y beam 43 and the bonding head 41 are driven in the Y-axis direction and the Z-axis direction. It includes a drive unit 46 (drive unit 160).

ボンディングヘッド４１は、ダイＤ（部品３００）を着脱自在に保持するコレット４２（保持手段１５１）を有する装置であり、Ｙ軸方向に往復動自在にＹビーム４３に取り付けられている。 The bonding head 41 is a device having a collet 42 (holding means 151) that removably holds the die D (part 300), and is attached to the Y beam 43 so as to be reciprocating in the Y-axis direction.

本実施例の場合、ボンディングヘッド４１を１本備えており、ボンディングヘッド４１は、真空吸着によりダイＤを保持するコレット４２を備えている。また、駆動部４６は、ボンディングヘッド４１をＺ軸方向に昇降させることができる。ボンディングヘッド４１は中間ステージ３１からピックアップしたダイＤを保持して搬送し、ボンディングステージＢＳに吸着固定された基板Ｐ（ワーク２００）上にダイＤを取り付ける機能を備えている。 In the case of this embodiment, one bonding head 41 is provided, and the bonding head 41 is provided with a collet 42 that holds the die D by vacuum suction. Further, the drive unit 46 can raise and lower the bonding head 41 in the Z-axis direction. The bonding head 41 has a function of holding and transporting the die D picked up from the intermediate stage 31 and mounting the die D on the substrate P (work 200) which is adsorbed and fixed to the bonding stage BS.

Ｘ支持台４５１の上に設けられたガイド１３２は、Ｙビーム４３をＸ軸方向に摺動自在に案内する部材である。本実施例の場合、２本のＸ支持台４５１が平行に配置されており、各Ｘ支持台４５１は、搬送レール５２，５３上にＸ軸方向に伸びた状態で固定されている。Ｘ支持台４５１は、搬送レール５２，５３と一体に形成されるものでもよい。 The guide 132 provided on the X support base 451 is a member that slidably guides the Y beam 43 in the X-axis direction. In the case of this embodiment, two X support bases 451 are arranged in parallel, and each X support base 451 is fixed on the transport rails 52 and 53 in a state of extending in the X-axis direction. The X support base 451 may be integrally formed with the transport rails 52 and 53.

図２１、図２４に示すように、ガイド４５２の上にはスライダ４３３がＸ軸方向に移動自在に取り付けられている。そして、２つのガイド４５２の各スライダ４３３の上には、それぞれＹビーム４３の両端部が取り付けられている。つまり、Ｙビーム４３は、ボンディングステージＢＳの上を跨るようにＹ軸方向に伸び、両端部はスライダ４３３に取り付けられてＸ支持台４５１に取り付けられたガイド４５２によってＸ軸方向に移動自在に支持されている。なお、Ｙビーム４３の底面とスライダ４３３の上面は同一面上に位置するので、Ｙビーム４３はＸ支持台４５１からそれほど高くない位置に設けられている。 As shown in FIGS. 21 and 24, a slider 433 is mounted on the guide 452 so as to be movable in the X-axis direction. Both ends of the Y beam 43 are mounted on each slider 433 of the two guides 452. That is, the Y beam 43 extends in the Y-axis direction so as to straddle the bonding stage BS, and both ends thereof are movably supported in the X-axis direction by the guide 452 attached to the slider 433 and attached to the X support base 451. Has been done. Since the bottom surface of the Y beam 43 and the top surface of the slider 433 are located on the same surface, the Y beam 43 is provided at a position not so high from the X support base 451.

実施例１のＹビーム４３は第一実施形態のＹビーム１４０と基本的には同様な構成である。ただし、Ｙビーム４３は図面上右側の支持台４５１よりも右側に大きく延伸している。これは、ボンディングヘッド４１が中間ステージ３１からダイＤをピックアップすることが可能とするためである。なお、ボンディングヘッド４１が支持台４５１よりも右側に移動する場合は、コレット４２がガイド４５２よりも高くなるようにボンディングヘッド４１が上昇する。 The Y beam 43 of the first embodiment has basically the same configuration as the Y beam 140 of the first embodiment. However, the Y beam 43 extends to the right side of the support base 451 on the right side in the drawing. This is because the bonding head 41 can pick up the die D from the intermediate stage 31. When the bonding head 41 moves to the right side of the support base 451 the bonding head 41 rises so that the collet 42 is higher than the guide 452.

次に、実施例１のフリップチップボンダにおいて実施されるボンディング方法（半導体装置の製造方法）について図２５を用いて説明する。図２５は実施例１のフリップチップボンダで実施されるボンディング方法を示すフローチャートである。 Next, the bonding method (method for manufacturing a semiconductor device) carried out in the flip chip bonder of Example 1 will be described with reference to FIG. 25. FIG. 25 is a flowchart showing a bonding method carried out by the flip chip bonder of the first embodiment.

ステップＳ１：制御装置７はピックアップするダイＤが突き上げユニット１３の真上に位置するようにウェハ保持台１２を移動し、剥離対象ダイを突き上げユニット１３とコレット２２に位置決めする。ダイシングテープ１６の裏面に突き上げユニット１３の上面が接触するように突き上げユニット１３を移動する。このとき、制御装置７は、ダイシングテープ１６を突き上げユニット１３の上面に吸着する。制御装置７は、コレット２２を真空引きしながら下降させ、剥離対象のダイＤの上に着地させ、ダイＤを吸着する。制御装置７はコレット２２を上昇させ、ダイＤをダイシングテープ１６から剥離する。これにより、ダイＤはピックアップフリップヘッド２１によりピックアップされる。 Step S1: The control device 7 moves the wafer holding table 12 so that the die D to be picked up is located directly above the push-up unit 13, and positions the die to be peeled off at the push-up unit 13 and the collet 22. The push-up unit 13 is moved so that the upper surface of the push-up unit 13 comes into contact with the back surface of the dicing tape 16. At this time, the control device 7 attracts the dicing tape 16 to the upper surface of the push-up unit 13. The control device 7 lowers the collet 22 while evacuating it, lands it on the die D to be peeled off, and adsorbs the die D. The control device 7 raises the collet 22 and peels the die D from the dicing tape 16. As a result, the die D is picked up by the pickup flip head 21.

ステップＳ２：制御装置７はピックアップフリップヘッド２１を移動させる。 Step S2: The control device 7 moves the pickup flip head 21.

ステップＳ３：制御装置７はピックアップフリップヘッド２１を１８０度回転させ、ダイＤのバンプ面（表面）を反転させて下面に向け、ダイＤのバンプ（表面）を反転させて下面に向け、ダイＤをトランスファヘッド８１に渡す姿勢にする。 Step S3: The control device 7 rotates the pickup flip head 21 by 180 degrees, flips the bump surface (front surface) of the die D toward the lower surface, flips the bump (front surface) of the die D toward the lower surface, and turns the die D. To the transfer head 81.

ステップＳ４：制御装置７はピックアップフリップヘッド２１のコレット２２からトランスファヘッド８１のコレット８２によりダイＤをピックアップして、ダイＤの受渡しが行われる。 Step S4: The control device 7 picks up the die D from the collet 22 of the pickup flip head 21 by the collet 82 of the transfer head 81, and the die D is delivered.

ステップＳ５：制御装置７は、ピックアップフリップヘッド２１を反転し、コレット２２の吸着面を下に向ける。 Step S5: The control device 7 inverts the pickup flip head 21 so that the suction surface of the collet 22 faces downward.

ステップＳ６：ステップＳ５の前または並行して、制御装置７はトランスファヘッド８１を中間ステージ３１に移動する。 Step S6: Before or in parallel with step S5, the control device 7 moves the transfer head 81 to the intermediate stage 31.

ステップＳ７：制御装置７はトランスファヘッド８１に保持しているダイＤを中間ステージ３１に載置する。 Step S7: The control device 7 places the die D held by the transfer head 81 on the intermediate stage 31.

ステップＳ８：制御装置７はトランスファヘッド８１をダイＤの受渡し位置に移動させる。 Step S8: The control device 7 moves the transfer head 81 to the delivery position of the die D.

ステップＳ９：ステップＳ８の後または並行して、制御装置７は中間ステージ３１をボンディングヘッド４１との受渡し位置に移動させる。 Step S9: After or in parallel with step S8, the control device 7 moves the intermediate stage 31 to the delivery position with the bonding head 41.

ステップＳＡ：制御装置７は中間ステージ３１からボンディングヘッド４１のコレットによりダイＤをピックアップして、ダイＤの受渡しが行われる。 Step SA: The control device 7 picks up the die D from the intermediate stage 31 by the collet of the bonding head 41, and the die D is delivered.

ステップＳＢ：制御装置７は中間ステージ３１をトランスファヘッド８１との受渡し位置に移動させる。 Step SB: The control device 7 moves the intermediate stage 31 to the transfer position with the transfer head 81.

ステップＳＣ：制御装置７は、ボンディングヘッド４１のコレット４２が保持しているダイＤを基板Ｐ上に移動する。 Step SC: The control device 7 moves the die D held by the collet 42 of the bonding head 41 onto the substrate P.

ステップＳＤ：制御装置７は、中間ステージ３１からボンディングヘッド４１のコレット４２でピックアップしたダイＤを基板Ｐ上に載置する。 Step SD: The control device 7 places the die D picked up by the collet 42 of the bonding head 41 from the intermediate stage 31 on the substrate P.

ステップＳＥ：制御装置７はボンディングヘッド４１を中間ステージ３１との受渡し位置に移動させる。 Step SE: The control device 7 moves the bonding head 41 to a transfer position with the intermediate stage 31.

図２６は実施例２のフリップチップボンダの概略を示す上面図である。 FIG. 26 is a top view showing an outline of the flip chip bonder of the second embodiment.

フリップチップボンダ１０Ａは、大別して、ダイ供給部１と、ピックアップ部２、トランスファ部８Ａ，８Ｂと、中間ステージ部３と、ボンディング部４Ａ，４Ｂと、搬送部５と、基板供給部６Ｋと、基板搬出部６Ｈと、各部の動作を監視し制御する制御装置７と、を有する。 The flip chip bonder 10A is roughly divided into a die supply unit 1, a pickup unit 2, a transfer unit 8A, 8B, an intermediate stage unit 3, a bonding unit 4A, 4B, a transport unit 5, a substrate supply unit 6K, and the like. It has a board carry-out unit 6H and a control device 7 that monitors and controls the operation of each unit.

ダイ供給部１は実施例１と同様である。ピックアップ部２は実施例１と同様であり、ピックアップフリップヘッド２１は、ダイをピックアップし、ピックアップフリップヘッド２１を１８０度回転させ、ダイＤのバンプを反転させて下面に向け、ダイＤをトランスファヘッド８１Ａ，８１Ｂに渡す姿勢にする。 The die supply unit 1 is the same as that of the first embodiment. The pickup unit 2 is the same as that of the first embodiment, and the pickup flip head 21 picks up the die, rotates the pickup flip head 21 by 180 degrees, reverses the bump of the die D and faces the lower surface, and transfers the die D to the transfer head. Make it a posture to pass to 81A and 81B.

トランスファ部８Ａ，８Ｂは、反転したダイＤをピックアップフリップヘッド２１から受けとり、中間ステージ３１Ａ，３１Ｂに載置する。トランスファ部８Ａ，８Ｂは、ピックアップフリップヘッド２１と同様にダイＤを先端に吸着保持するコレット８２Ａ，８２Ｂを備えるトランスファヘッド８１Ａ，８１Ｂと、トランスファヘッド８１Ａ，８１ＢをＸ軸方向に移動させるＸ駆動部８３Ａ，８３Ｂと、を有する。 The transfer units 8A and 8B receive the inverted die D from the pickup flip head 21 and place it on the intermediate stages 31A and 31B. The transfer units 8A and 8B are transfer heads 81A and 81B having collets 82A and 82B that attract and hold the die D at the tip like the pickup flip head 21, and an X drive unit that moves the transfer heads 81A and 81B in the X-axis direction. It has 83A and 83B.

中間ステージ部３Ａ，３Ｂは、ダイＤを一時的に載置する中間ステージ３１Ａ，３１Ｂおよびステージ認識カメラ３４Ａ，３４Ｂを有する。中間ステージ３１Ａ，３１Ｂは図示しない駆動部によりＹ軸方向に移動可能である。 The intermediate stage portions 3A and 3B include intermediate stages 31A and 31B on which the die D is temporarily placed and stage recognition cameras 34A and 34B. The intermediate stages 31A and 31B can be moved in the Y-axis direction by a drive unit (not shown).

ボンディング部４Ａ，４Ｂは、中間ステージ３１Ａ，３１ＢからダイＤをピックアップし、搬送されてくる基板Ｐ上にボンディングする。ボンディング部４Ａ，４Ｂは、ピックアップフリップヘッド２１と同様にダイＤを先端に吸着保持するコレット４２Ａ，４２Ｂを備えるボンディングヘッド４１Ａ，４１Ｂと、ボンディングヘッド４１Ａ，４１ＢをＹ軸方向に移動させるＹビーム４３Ａ，４３Ｂと、基板Ｐの位置認識マーク（図示せず）を撮像し、ボンディング位置を認識する基板認識カメラ４４Ａ，４４Ｂと、Ｘ支持台４５と、を有する。
このような構成によって、ボンディングヘッド４１Ａ，４１Ｂは、中間ステージ３１Ａ，３１ＢからダイＤをピックアップし、基板認識カメラ４４Ａ，４４Ｂの撮像データに基づいて基板ＰにダイＤをボンディングする。 The bonding portions 4A and 4B pick up the die D from the intermediate stages 31A and 31B and bond them onto the conveyed substrate P. The bonding portions 4A and 4B include bonding heads 41A and 41B having collets 42A and 42B that attract and hold the die D at the tip like the pickup flip head 21, and a Y beam 43A that moves the bonding heads 41A and 41B in the Y-axis direction. , 43B, substrate recognition cameras 44A and 44B that image a position recognition mark (not shown) of the substrate P and recognize the bonding position, and an X support base 45.
With such a configuration, the bonding heads 41A and 41B pick up the die D from the intermediate stages 31A and 31B, and bond the die D to the substrate P based on the image pickup data of the substrate recognition cameras 44A and 44B.

搬送部５は、基板ＰがＸ方向に移動する搬送レール５１，５２を備える。搬送レール５１，５２は平行に設けられる。このような構成によって、基板供給部６Ｋから基板Ｐを搬出し、搬送レール５１，５２に沿ってボンディング位置まで移動し、ボンディング後基板搬出部６Ｈまで移動して、基板搬出部６Ｈに基板Ｐを渡す。基板ＰにダイＤをボンディング中に、基板供給部６Ｋは新たな基板Ｐを搬出し、搬送レール５１，５２上で待機する。 The transport unit 5 includes transport rails 51 and 52 in which the substrate P moves in the X direction. The transport rails 51 and 52 are provided in parallel. With such a configuration, the board P is carried out from the board supply part 6K, moved to the bonding position along the transport rails 51 and 52, moved to the board carry-out part 6H after bonding, and the board P is moved to the board carry-out part 6H. hand over. While the die D is being bonded to the substrate P, the substrate supply unit 6K carries out a new substrate P and stands by on the transfer rails 51 and 52.

Ｙビーム４３Ａは実施例１のＹビーム４３と同様であり、Ｙビーム４３ＢはＹビーム４３Ａと対称な構成である。 The Y beam 43A is the same as the Y beam 43 of the first embodiment, and the Y beam 43B has a configuration symmetrical to the Y beam 43A.

以上、本発明者によってなされた発明を実施形態、変形例および実施例に基づき具体的に説明したが、本発明は、上記実施形態、変形例および実施例に限定されるものではなく、種々変更可能であることはいうまでもない。 Although the invention made by the present inventor has been specifically described above based on the embodiments, modifications and examples, the present invention is not limited to the above embodiments, modifications and examples, and various modifications are made. It goes without saying that it is possible.

例えば、実施形態では、矯正部材に軽量高剛性素材（ＣＦＲＰ）を用いる例を説明したが、これに限定されるものではなく、矯正部材に形状記憶合金を用い、形状が戻る時にビームの撓みまたは捩れに反力が働く形状とし、形状記憶温度をコントロールすることで撓み量または捩れ量をコントロールするようにしてもよい。また、磁性形状記憶合金を用いてもよい。さらに、バイメタルを用いてリニアに温度で反力を調整できるようにしてもよい。 For example, in the embodiment, an example in which a lightweight and highly rigid material (CFRP) is used for the straightening member has been described, but the present invention is not limited to this, and a shape memory alloy is used for the straightening member, and the beam is bent or bent when the shape returns. The shape may be such that a reaction force acts on the twist, and the amount of bending or the amount of twist may be controlled by controlling the shape memory temperature. Further, a magnetic shape memory alloy may be used. Further, a bimetal may be used so that the reaction force can be linearly adjusted by the temperature.

また、第一実施形態および第二実施形態では、ビーム１４０および実装ヘッド１５０にジャイロセンサや水平検出センサなどの角度検出センサ等を設け、このセンサの信号をもとにアクチュエータ１４８を制御する例を説明したが、以下のようにしてもよい。事前に実装する製品の実装動作プログラムで動作させた時にサンプリングしたセンサ出力信号を制御装置の記憶部に記憶し、記憶部に記憶したセンサ信号出力と撓みまたは捩れを矯正するためのアクチュエータ出力の相関を事前に算出して記憶部に記憶する。その記憶した相関およびセンサの信号に基づいて、撓みや捩れをキャンセルさせる制御を実装製品毎のプログラム（レシピ：製品毎の動作シーケンス）に応じて実施し、レスポンスよく撓みや捩れをなくすようにしてもよい。 Further, in the first embodiment and the second embodiment, an example in which an angle detection sensor such as a gyro sensor or a horizontal detection sensor is provided on the beam 140 and the mounting head 150, and the actuator 148 is controlled based on the signal of this sensor. As explained, the following may be used. The sensor output signal sampled when operated by the mounting operation program of the product to be mounted in advance is stored in the storage unit of the control device, and the correlation between the sensor signal output stored in the storage unit and the actuator output for correcting bending or twisting. Is calculated in advance and stored in the storage unit. Based on the memorized correlation and sensor signals, control to cancel bending and twisting is performed according to the program for each mounted product (recipe: operation sequence for each product) so that bending and twisting are eliminated with good response. May be good.

また、実施例１、２では第一実施形態のＹビームを用いた例を説明したが、これに限定されるものではなく、第二実施形態、第一変形例から第六変形例のいずれか一つまたは組み合わせたＹビームを用いてもよい。 Further, in Examples 1 and 2, an example using the Y beam of the first embodiment has been described, but the present invention is not limited to this, and any of the second embodiment and the first to sixth modifications. One or a combination of Y beams may be used.

また、実施例１、２ではボンディングヘッド（実装ヘッド）が一つの例を説明したが、これに限定されるものではなく、実施形態と同様に複数のボンディングヘッドであってもよい。 Further, in Examples 1 and 2, one example of the bonding head (mounting head) has been described, but the present invention is not limited to this, and a plurality of bonding heads may be used as in the embodiment.

また、実施例１、２では反転機構をピックアップフリップヘッドに設けて、トランスファヘッドでピックアップフリップヘッドからダイを受け取り中間ステージに載置し、中間ステージを移動する例を説明したが、これに限定されるものではなく、ダイをピックアップして反転したピックアップフリップヘッドを移動するようにしてもよいし、ダイの表裏を回転できるステージユニットにピックアップしたダイＤを載置し、ステージユニットを移動するようにしてもよい。 Further, in Examples 1 and 2, an example in which a reversing mechanism is provided in the pickup flip head, a die is received from the pickup flip head by the transfer head, placed on the intermediate stage, and the intermediate stage is moved has been described, but the present invention is limited to this. Instead of a thing, you may pick up the die and move the inverted pickup flip head, or place the picked up die D on the stage unit that can rotate the front and back of the die and move the stage unit. You may.

１００：実装装置
１１０：架台
１２０：実装ステージ
１３１：Ｘ支持台
１３２：ガイド
１４０：Ｙビーム
１４１：主梁部
１４２：脚部
１４３：スライダ
１５０：実装ヘッド
１６０：駆動部
２００：ワーク
３００：部品 100: Mounting device 110: Mount 120: Mounting stage 131: X support stand 132: Guide 140: Y beam 141: Main beam part 142: Leg part 143: Slider 150: Mounting head 160: Drive part 200: Work 300: Parts

Claims (22)

実装ステージが取り付けられる架台と、
前記架台の上を渡るように第一方向に伸びてその両端がそれぞれ第二方向に移動自在に前記架台の上に支持されるビームと、
前記第一方向に移動自在に前記ビームに支持される実装ヘッドと、
を備え、
前記ビームは、当該ビームの内部に位置し前記第一方向に延伸する矯正部材と、前記矯正部材を前記ビームの撓み方向に押しその反力で前記撓み方向と逆方向の力を発生させる撓み矯正手段と、を備える実装装置。 The mount on which the mounting stage is mounted and
A beam that extends in the first direction so as to cross over the gantry and is supported on the gantry at both ends so as to be movable in the second direction.
A mounting head that is movable in the first direction and is supported by the beam,
Equipped with
The beam has a straightening member located inside the beam and extending in the first direction, and a bending straightening member that pushes the straightening member in the bending direction of the beam and generates a force in the direction opposite to the bending direction by the reaction force. A mounting device comprising means. 請求項１の実装装置において、
実装ヘッド位置に応じて前記矯正部材を押す量を制御する実装装置。 In the mounting device of claim 1,
A mounting device that controls the amount of pushing the straightening member according to the mounting head position. 請求項２の実装装置において、
前記撓み矯正手段は、前記矯正部材をネジ部材の回転動作で前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 2,
The bending straightening means is a mounting device capable of pushing the straightening member in the bending direction by the rotational operation of the screw member and changing the amount of pushing the straightening member. 請求項３の実装装置において、
前記撓み矯正手段は、
前記撓み方向に伸びる雄ネジ部材と、
前記ビームの前記第一方向の中央であって前記ビームの上に固定され、前記雄ネジ部材を回転させるアクチュエータと、
前記ビームの内部に固定される前記矯正部材に固定され、前記雄ネジ部材が挿入される雌ネジ部材と、
を備え、
前記アクチュエータは前記雄ネジ部材を回転させることにより前記矯正部材を前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 3,
The deflection correcting means is
The male screw member extending in the bending direction and
An actuator that is fixed on the beam at the center of the beam in the first direction and rotates the male screw member.
A female screw member fixed to the straightening member fixed to the inside of the beam and into which the male screw member is inserted.
Equipped with
The actuator is a mounting device capable of pushing the straightening member in the bending direction by rotating the male screw member and changing the amount of pushing the straightening member. 請求項２の実装装置において、
前記撓み矯正手段は、前記矯正部材を楔状の平面カム部材の前記第一方向の移動動作で前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 2,
The bending straightening means can push the straightening member in the bending direction by the moving operation of the wedge-shaped flat cam member in the first direction, and can change the amount of pushing the straightening member. .. 請求項５の実装装置において、
前記撓み矯正手段は、
前記矯正部材の上に設けられた前記平面カム部材に接続された受け部材と、
前記第一方向に伸びる送り部材と、
前記矯正部材の前記第一方向の端部であって前記矯正部材の上に固定され、前記送り部材を前記第一方向に移動させるアクチュエータと、
前記ビームの前記第一方向の中央であって前記矯正部材の上方に固定され、前記平面カム部材と当接する回転部材と、
を備え、
前記アクチュエータは前記送り部材を移動させることにより前記矯正部材を前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 5,
The deflection correcting means is
A receiving member connected to the flat cam member provided on the straightening member, and a receiving member.
The feed member extending in the first direction and
An actuator that is an end portion of the straightening member in the first direction and is fixed on the straightening member to move the feeding member in the first direction.
A rotating member at the center of the beam in the first direction, fixed above the straightening member, and in contact with the flat cam member.
Equipped with
The actuator is a mounting device capable of pushing the straightening member in the bending direction by moving the feeding member and changing the amount of pushing the straightening member. 請求項５の実装装置において、
前記撓み矯正手段は、
前記ビームの上に設けられた前記平面カム部材に接続された受け部材と、
前記第一方向に伸びる送り部材と、
前記ビームの前記第一方向の端部であって前記ビームの上に固定され、前記送り部材を前記第一方向に移動させるアクチュエータと、
前記矯正部材の前記第一方向の中央であって前記矯正部材の上に固定され、前記平面カム部材と当接する回転部材と、
を備え、
前記アクチュエータは前記送り部材を移動させることにより前記矯正部材を前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 5,
The deflection correcting means is
A receiving member connected to the flat cam member provided on the beam and
The feed member extending in the first direction and
An actuator that is an end portion of the beam in the first direction and is fixed on the beam to move the feed member in the first direction.
A rotating member that is at the center of the straightening member in the first direction, is fixed on the straightening member, and comes into contact with the flat cam member.
Equipped with
The actuator is a mounting device capable of pushing the straightening member in the bending direction by moving the feeding member and changing the amount of pushing the straightening member. 請求項２の実装装置において、
前記撓み矯正手段は、前記矯正部材を偏心カム部材の回転動作で前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 2,
The bending straightening means is a mounting device capable of pushing the straightening member in the bending direction by the rotational operation of the eccentric cam member, and changing the amount of pushing the straightening member. 請求項８の実装装置において、
前記撓み矯正手段は、
前記ビームの前記第一方向の中央であって前記ビームの上に固定され、前記ビームの上に設けられた前記偏心カム部材の軸を回転させるアクチュエータと、
前記矯正部材の前記第一方向の中央であって前記矯正部材の上に固定され、前記偏心カム部材と当接する回転部材と、
を備え、
前記アクチュエータは前記偏心カム部材を回転させることにより前記矯正部材を前記撓み方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 8,
The deflection correcting means is
An actuator which is at the center of the beam in the first direction and is fixed on the beam and rotates the axis of the eccentric cam member provided on the beam.
A rotating member that is at the center of the straightening member in the first direction, is fixed on the straightening member, and comes into contact with the eccentric cam member.
Equipped with
The actuator is a mounting device capable of pushing the straightening member in the bending direction by rotating the eccentric cam member and changing the amount of pushing the straightening member. 実装ステージが取り付けられる架台と、
前記架台の上を渡るように第一方向に伸びてその両端がそれぞれ第二方向に移動自在に前記架台の上に支持されるビームと、
前記第一方向に移動自在に前記ビームに支持される実装ヘッドと、
を備え、
前記ビームは、前記第一方向に延伸する矯正部材と、前記矯正部材に前記ビームの捩れ回転中心からずれた位置に前記捩れ方向と逆方向の力を発生させる捩れ矯正手段と、を備える実装装置。 The mount on which the mounting stage is mounted and
A beam that extends in the first direction so as to cross over the gantry and is supported on the gantry at both ends so as to be movable in the second direction.
A mounting head that is movable in the first direction and is supported by the beam,
Equipped with
The beam is a mounting device including a straightening member extending in the first direction and a twist straightening means for generating a force in the straightening member in a position deviated from the twisting rotation center of the beam in the direction opposite to the twisting direction. .. 請求項１０の実装装置において、
実装ヘッド位置に応じて前記捩れ方向と逆方向の力を制御する実装装置。 In the mounting device of claim 10,
A mounting device that controls the force in the direction opposite to the twisting direction according to the mounting head position. 請求項１１の実装装置において、
前記矯正部材は前記ビームの内部に位置し、
前記捩れ矯正手段は、前記矯正部材の捩れの回転中心からずれたところをネジ部材の回転動作で下方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 11,
The straightening member is located inside the beam and
The twist straightening means can push downward by the rotational operation of the screw member at a position deviated from the rotation center of the twist of the straightening member, and can change the amount of pushing the straightening member. .. 請求項１２の実装装置において、
前記捩れ矯正手段は、
前記下方向に伸びる雄ネジ部材と、
前記ビームの前記第一方向の中央であって前記捩れ回転中心からずれた位置における前記ビームの上に固定され、前記雄ネジ部材を回転させるアクチュエータと、
前記ビームの内部に固定される前記矯正部材に固定され、前記雄ネジ部材が挿入される雌ネジ部材と、
を備え、
前記アクチュエータは前記雄ネジ部材を回転させることにより前記矯正部材を前記下方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 12,
The twist correction means is
The male screw member extending downward and
An actuator fixed on the beam at a position deviated from the torsional rotation center at the center of the beam in the first direction to rotate the male screw member.
A female screw member fixed to the straightening member fixed to the inside of the beam and into which the male screw member is inserted.
Equipped with
The actuator is a mounting device capable of pushing the straightening member downward by rotating the male screw member and changing the amount of pushing the straightening member. 請求項１１の実装装置において、
前記矯正部材は前記実装ヘッドとは反対側の前記ビームの側面に取り付けられるプレートであり、
前記捩れ矯正手段は、前記ビームと前記矯正部材との下部側に間隙を設け、前記間隙の量を変えることが可能である実装装置。 In the mounting device of claim 11,
The straightening member is a plate attached to the side surface of the beam opposite to the mounting head.
The twist straightening means is a mounting device capable of providing a gap on the lower side between the beam and the straightening member and changing the amount of the gap. 請求項１４の実装装置において、
前記間隙はシムで形成し、シムの位置および枚数により前記捩れ方向と逆方向の力を調整する実装装置。 In the mounting device of claim 14,
A mounting device in which the gap is formed by shims and the force in the direction opposite to the twisting direction is adjusted according to the position and number of shims. 請求項１４の実装装置において、
前記捩れ矯正手段は前記矯正部材と当接する送り部材と前記送り部材を送るアクチュエータとを有し、前記送り部材の送り量により前記捩れ方向と逆方向の力を調整する実装装置。 In the mounting device of claim 14,
The twist straightening means is a mounting device having a feed member that comes into contact with the straightening member and an actuator that feeds the feed member, and adjusts a force in a direction opposite to the twist direction according to the feed amount of the feed member. 請求項１１の実装装置において、
前記ビームは、さらに、前記矯正部材を前記ビームの撓み方向に押しその反力で前記撓み方向と逆方向の力を発生させる撓み矯正手段を備える実装装置。 In the mounting device of claim 11,
The beam is a mounting device including a bending straightening means that pushes the straightening member in the bending direction of the beam and generates a force in the direction opposite to the bending direction by the reaction force thereof. 請求項１７の実装装置において、
前記撓み矯正手段および前記捩れ矯正手段は、共通の手段であり、
下方向に伸びる雄ネジ部材と、
前記ビームの前記第一方向の中央であって前記捩れ回転中心からずれた位置における前記ビームの上に固定され、前記雄ネジ部材を回転させるアクチュエータと、
前記ビームの内部に固定される前記矯正部材に固定され、前記雄ネジ部材が挿入される雌ネジ部材と、
を備え、
前記アクチュエータは前記雄ネジ部材を回転させることにより前記矯正部材を前記下方向に押すことが可能であり、前記矯正部材を押す量を変えることが可能である実装装置。 In the mounting device of claim 17,
The deflection correcting means and the twist correcting means are common means, and are common means.
A male screw member that extends downward and
An actuator fixed on the beam at a position deviated from the torsional rotation center at the center of the beam in the first direction to rotate the male screw member.
A female screw member fixed to the straightening member fixed to the inside of the beam and into which the male screw member is inserted.
Equipped with
The actuator is a mounting device capable of pushing the straightening member downward by rotating the male screw member and changing the amount of pushing the straightening member. 請求項４、６、７、９、１３、１８の何れか一つの実装装置において、
さらに、制御装置を備え、
前記ビームおよび実装ヘッドは、それぞれジャイロセンサまたは水平検出センサまたはビームの変位センサを備え、
前記制御装置は前記ジャイロセンサまたは前記水平検出センサまたは前記ビームの変位センサからのセンサ出力信号に基づいて前記アクチュエータを制御する実装装置。 In the mounting device according to any one of claims 4, 6, 7, 9, 13, and 18.
In addition, it is equipped with a control device
The beam and mounting head are equipped with a gyro sensor or a horizontal detection sensor or a beam displacement sensor, respectively.
The control device is a mounting device that controls the actuator based on a sensor output signal from the gyro sensor, the horizontal detection sensor, or the displacement sensor of the beam. 請求項１９の実装装置において、
前記制御装置は、
実装する製品の実装動作プログラムで動作させた時にサンプリングした前記ジャイロセンサまたは前記水平検出センサまたは前記ビームの変位センサからの事前センサ出力信号と撓みまたは捩れを矯正するためのアクチュエータ出力との相関を記憶する記憶部を備え、
前記センサ出力信号と前記相関とに基づいて前記アクチュエータを制御する実装装置。 In the mounting device of claim 19,
The control device is
The correlation between the pre-sensor output signal from the gyro sensor, the horizontal detection sensor, or the displacement sensor of the beam sampled when operated by the mounting operation program of the product to be mounted and the actuator output for correcting bending or twisting is stored. Equipped with a storage unit
A mounting device that controls the actuator based on the sensor output signal and the correlation. 請求項１乃至１８の何れか一つの実装装置において、
前記実装ヘッドは、ダイ供給からピックアップされ反転されたダイをピックアップし、前記実装ステージの上の基板の上に前記ダイを載置する実装装置。 In the mounting device according to any one of claims 1 to 18.
The mounting head is a mounting device that picks up an inverted die picked up from a die supply and mounts the die on a substrate on the mounting stage. 請求項１乃至１８の何れか一つの実装装置を準備する工程と、
分割されたウェハを保持するウェハリングを準備する工程と、
基板を準備する工程と、
前記ウェハからダイをピックアップする工程と、
ピックアップされた前記ダイを反転する工程と、
反転された前記ダイを前記実装ヘッドでピックアップして前記基板に載置する工程と、
を備える半導体装置の製造方法。 The step of preparing the mounting device according to any one of claims 1 to 18.
The process of preparing a wafer ring to hold the divided wafers and
The process of preparing the board and
The process of picking up the die from the wafer and
The process of reversing the picked-up die and
The process of picking up the inverted die with the mounting head and placing it on the substrate,
A method for manufacturing a semiconductor device.
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