JP4897033B2 - Semiconductor manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a substrate such as a lead frame.

  In the manufacture of a semiconductor device, in order to bond a semiconductor chip to a substrate, a loader that supplies the substrate to a processing stage, a preform portion that supplies a bonding material to a predetermined position (island) on the substrate, and each island on the substrate A die bonding part for individually bonding the semiconductor chips and an unloader for feeding the substrate to which the semiconductor chips are bonded out of the processing stage are provided.

  For example, as shown in FIGS. 6A and 6B, a conventional semiconductor manufacturing apparatus includes a base 110 at the lower part of the apparatus, a lower frame 121 and an upper frame 122 that rise from the rear part of the base to the upper part of the base. The support frames 131 and 141 of the preform part 130 and the die bonding part 140 are extended from the upper part of the upper frame 122 to the front of the apparatus, and the operation parts 132 and 142 are supported by these.

  Further, the loader 150 for supplying the substrate places an upper stacker 151 for placing a magazine containing the substrate in a partition and stands by, and an elevator 156 for supplying the substrate one by one from the magazine on the upper stacker 151 to the preform unit. , A lower stacker 152 for receiving a substrate-supplied magazine from the elevator 156, and a feeder 153 for sucking and supplying individual substrates in the magazine to the preform unit. The stackers 151 and 152 are supported on a support member 154 rising from the left end of the base 110, and the feeder 153 is supported on an upper portion of the support member 155 rising from the rear end of the base 110.

  Further, the unloader 160 for unloading the substrate after semiconductor chip bonding receives the elevator 164 for raising and lowering the magazine, the upper stacker 162 for setting the empty magazine at the substrate receiving position, and the magazine stored with the substrate from the elevator 164 to the outside of the apparatus. A lower stacker 161 for discharging is provided, and these stackers 161 and 162 and the elevator 164 are supported on a support member 163 rising from the right end of the base 110. This type of semiconductor manufacturing apparatus is disclosed in Patent Document 1, for example.

  In the semiconductor manufacturing apparatus of this embodiment, in the preform part 130, the coating apparatus is moved in the X-axis direction (the left-right direction of the apparatus) in order to supply a bonding agent for bonding the semiconductor chip to a predetermined portion (island) of the substrate. Then, it is moved in the Y-axis direction (front-rear direction of the apparatus) to reach a predetermined position, and the application needle is moved in the Z-axis direction (up-down direction) at that position to immerse in the bonding agent reservoir and apply to the substrate. . In the die bonding unit 140, the collet is placed on the X axis in order to pick up the semiconductor chips arranged on the wafer sheet supported by the XY table 143 and place them on the substrate on the transport mechanism 144 at the rear of the apparatus. Direction, Y-axis direction and Z-axis direction.

High precision is required for the movement of the coating device and the collet in the X-axis direction and the Y-axis direction, and higher precision is being demanded with the recent miniaturization of the chip and the chip mounting area in the substrate. . In order to guarantee the accuracy, the support structure of the operation part is required to have high rigidity, and in particular, the die bonding part 140.
Since the distance from the XY table to the substrate on the transport mechanism is long, the support structure requires high rigidity.

  However, since the conventional semiconductor manufacturing apparatus supports the operation portion on the support frame 141 extending in an overhang shape from the support member 122 rising from the base as described above, the length of the overhang from the support base end. Bending and twisting deformation is likely to occur. In order to cope with this, the support structure portions such as the support member 122 and the support frame 141 have been made thick by thickening or providing a number of reinforcing ribs. As a result, the weight of the support structure is increased, and accordingly, the drive motor needs to be enlarged.

  Further, the stackers 151, 152, 161, 162 and the feeder 153 supported on the support members 154, 155, 163 have a high center of gravity, so that they receive vibrations generated by the preform portion and the die bonding portion. The loader and unloader have caused a large vibration. Therefore, in order to suppress vibration, the support members 154, 155, and 163 are also thick and have a solid structure with many reinforcing ribs.

  As a result, the manufacturing cost of the semiconductor manufacturing apparatus must be increased. In addition, sufficient processing accuracy cannot always be obtained by such robustness. In particular, the working distance of the die bonding portion tends to increase with the recent increase in substrate dimensions, and accordingly, the vibration of the support frame and the like increases, making it difficult to ensure processing accuracy. For this reason, the problem that the processing speed has to be limited has also occurred.

JP 2008-153557 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor manufacturing apparatus that guarantees high processing accuracy in a preform part and a die bonding part and has a low manufacturing cost.

In order to achieve the above object, the present invention is a semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a predetermined position of a substrate, and includes a loader, a preform part, a die bonding part, an unloader, and these arranged in the lateral direction of the apparatus. A support frame that supports the substrate in a state in which the substrate is supplied, and a transport mechanism that transfers the substrate supplied from the loader to the unloader through the preform unit and the die bonding unit, and the support frame includes a base at the bottom of the apparatus, A pair of side frame portions extending upward from the left and right sides of the base, a rear beam connecting the rear side of the pair of side frame portions, and an upper portion of the side frame portion connected in front of the rear beam. A front beam, and the transport mechanism includes a front transport mechanism located in the preform portion and a rear transport located in the die bonding portion. A loader for supplying a substrate to the preform part, and a semiconductor chip discharged from the die bonding part. receive attached substrate unloader, the pair is supported by distributing the one and the other outer surface of the side frame portion of said preform portion, upper Symbol individual bonding agent on the substrate on the upstream conveying mechanism comprising a supply device for supplying, the die bonding portion, a wafer table for supporting a c Eharingu, the semiconductor chips on the wafer sheet supported on said wafer table mounted on the bonding agent with the substrate on the subsequent transporting mechanism A bonding mechanism for bonding, and the bonding mechanism is supported by the bonding block supported by the front beam and the rear beam. And a block drive unit that is supported by the support frame and drives the bonding block, and a front block guide and a rear block guide that extend in the left-right direction of the apparatus are supported by the front beam and the rear beam, respectively. The bonding block includes a block main body movably supported by the front block guide and the rear block guide, and a collet for a semiconductor chip pickup supported by the block main body and supported by the block main body. A bonding arm, and an arm driving unit that is supported by the block main body and drives the bonding arm to bring the collet to a position on the wafer table and the subsequent transfer mechanism, and the block main body includes the front part The block drive is guided by the block guide and the rear block guide. The bonding arm is guided by an arm guide portion mounted on the block body and is moved in the Y-axis direction and the vertical direction as the apparatus longitudinal direction by the arm drive unit. Driven in the Z-axis direction, the arm guide portion includes a vertically moving piece supported by the block body so as to move up and down, a longitudinally moving piece supported by the block body so as to move back and forth, and the vertically moving piece and An intermediate support body interposed between the longitudinally moving pieces, the intermediate support body holding the bonding arm and engaging with the vertically moving piece so as to be movable back and forth, and with respect to the longitudinally moving piece The bonding arm drive unit is engaged with the block body so as to be vertically movable, and a vertical movement motor that is supported by the block body and drives the vertical movement piece in the vertical direction. And a longitudinally moving motor supported by the block body and driving the longitudinally moving piece in the longitudinal direction of the apparatus.

  In the present specification and claims, the positional relationship in the semiconductor manufacturing apparatus is referred to as the front side with the wafer table and the rear side with the transport mechanism.

  The semiconductor manufacturing apparatus according to the present invention has an excellent effect due to the above configuration, particularly the following configuration.

  First, the support frame includes a pair of side frame portions that extend upward from the left and right sides of the base of the apparatus, a rear beam that connects the rear side of the pair of side frame portions, and a front beam that is in front of the rear beam. By including the front beam that joins the upper part of the side frame part, a solid rectangular frame structure is formed as a whole apparatus.

  In addition, the block main body 610 of the bonding block has a structure in which both the front end and the rear end are supported by the front block guide and the rear block guide supported by the front beam and the rear beam, and both ends are supported. Thereby, much higher robustness is obtained compared to the conventional overhang structure, and driving in the left-right direction of the apparatus (X-axis direction) is performed under this support structure.

  Further, the bonding arm is guided by the arm guide portion in the block body supported at both ends, and is driven in the apparatus front-rear direction (Y-axis direction) and the vertical direction (Z-axis direction). As a result, all axial movements of X, Y, and Z are performed under a robust support structure.

  In addition, the operation parts such as the magazine moving mechanism of the loader and unloader are also supported on the outer side surfaces of the pair of side frame parts forming a part of the rectangular frame structure, so that the generation of vibrations by these operation parts is kept low. It is done.

  Based on the rectangular frame structure and the both-end support structure of the block main body, extremely high processing accuracy in the die bonding portion is guaranteed. In addition, since a robust support structure is obtained in this way, it is possible to reduce the weight by avoiding the thickening of the support frame and the block body and the provision of reinforcing ribs, and as a result, the drive motor can be reduced in size. Become. Thereby, the manufacturing cost of the apparatus can be kept low.

It is the perspective view which looked at the semiconductor manufacturing apparatus which concerns on one Embodiment of this invention from the front. It is the perspective view which looked at the semiconductor manufacturing apparatus shown in FIG. 1 from back. It is a side view of the semiconductor manufacturing apparatus shown in FIG. It is a perspective view which shows the arm guide part of the bonding arm in the semiconductor manufacturing apparatus shown in FIG. It is the perspective view which looked at a part of arm guide part shown in FIG. 4 from the other direction. It is a figure which shows an example of the conventional semiconductor manufacturing apparatus, (a) is a side view, (b) is a front view.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 and 2 schematically show a semiconductor manufacturing apparatus according to an embodiment of the present invention. As shown in the figure, this semiconductor manufacturing apparatus is supplied from a loader 20, a preform part 30, a die bonding part 50, an unloader 70, a support frame 80 that supports them in a state where they are arranged in the left-right direction of the apparatus, and a loader 20. A transport mechanism 40 for transporting the substrate S to the unloader 70 through the preform unit 30 and the die bonding unit 50 is provided.

  The support frame 80 includes a base 81 at the lower portion of the apparatus, a pair of side frame portions 82 and 83 extending upward from the left and right sides of the base, and a rear beam 85 that connects the rear side of the pair of side frame portions. And a front beam 84 that joins the upper portion of the side frame portion in front of the rear beam. As shown in FIG. 3, a front block guide 86 and a rear block guide 87 extending in the left-right direction of the apparatus are supported on the front beam 84 and the rear beam 85, respectively.

  The transport mechanism 40 includes a front-stage transport mechanism 41 located in the preform part 30 and a rear-stage transport mechanism 42 located in the die bonding part 50. A support plate extending in the left-right direction is disposed behind the preform portion 30 and the die bonding portion 50. The front-stage transport mechanism 41 includes a front-stage plate 411 that is a first half of the support plate in the substrate transport direction, a gripper 412 that is movable along the front-stage plate 411, and a gripper drive unit (not shown). The substrate S supplied from 20 is transferred to the working position of the preform unit. The post-stage transport mechanism 42 includes a post-stage plate 421 that is the latter half of the support plate in the substrate transport direction, a gripper 422 that is movable along the post-stage plate 421, and a gripper drive unit (not shown). The substrate supplied with the bonding agent in the reforming unit 30 is transferred to the die bonding unit 50, and the substrate after the semiconductor chip bonding is transferred to the unloader 70.

  The preform part 30 and the die bonding part 50 are disposed between the pair of side frame parts 82 and 83, and the loader 20 and the unloader 70 are distributed and supported on the outer surfaces of the side frame parts 82 and 83, respectively. .

  The loader 20 is supported on the outer surface of the support frame 80 and can be loaded with an upper stacker 21 and a lower stacker 22 on which a magazine for housing the substrate can be placed, and the substrate from the magazine on the stacker is individually placed on the front plate 411 of the preform portion. Feeder 23 (shown by a one-dot chain line in the figure) and an elevator 24 for moving the magazine between the upper and lower stackers. In this embodiment, a magazine loaded with substrates is transferred from the lower stacker 22 to the upper stacker 21 by the elevator 24. The substrates stored in the magazine on the upper stacker 21 are pushed out one by one by the feeder 23 to the preform unit 30.

  The preform unit 30 includes a supply device 32 that supplies a bonding agent to each substrate on the pre-stage transport mechanism 41. The substrate is sandwiched between grippers 412 and conveyed to the right in FIG. 1 on the front plate 411 by the gripper driving unit, and stops below the supply device 32. At this position, the supply device 32 places a bonding agent such as an adhesive or solder on the substrate S, and the substrate S on which the bonding agent is placed is conveyed to the die bonding unit 50 by the gripper 412.

  The die bonding unit 50 is for mounting a wafer table 52 that supports a wafer ring carried in from outside the apparatus and a semiconductor chip on a wafer sheet supported by the wafer table on a substrate on a post-stage transport mechanism 42 and bonding them. And a bonding mechanism 60. The substrate S to which the bonding agent is supplied by the preform unit 30 is sandwiched between the grippers 422 and is conveyed rightward in FIG. 1 by the gripper driving unit, and stops below the bonding mechanism 60.

The bonding mechanism 60 includes a bonding block supported by the front beam 84 and the rear beam 85 and a block driving unit 65 that is supported by the support frame 80 and drives the bonding block.

As shown in FIG. 3, the bonding block includes a block main body 610 that is supported by a front block guide 86 and a rear block guide 87 so that the front end portion and the rear end portion can be moved, and a lower end portion that is supported by the block main body 610. A bonding arm 612 that supports a semiconductor chip pick-up collet 611 and a bonding arm driving unit 620 that is supported by the block body 610 and drives the bonding arm 612 to bring the collet 611 to a position on the wafer table and the subsequent transport mechanism 42. And.

The block main body 610 has a width for mounting an operation part necessary for the bonding process, extends widely in the vertical direction and the front-rear direction, and has a substantially trapezoidal shape as a whole. The block main body 610 is guided by the front block guide 86 and the rear block guide 87 and is driven in the left-right direction (X-axis direction) by the block drive unit 65. The bonding arm 612 is guided by an arm guide portion 630 mounted on the block body 610 and is driven by the bonding arm driving portion 620 in the longitudinal direction of the apparatus (Y-axis direction) and the vertical direction (Z-axis direction).

  4 and 5 show a state in which the constituent parts of the arm guide portion 630 are disassembled. 4 is a view from the left front, and FIG. 5 is a view from the right front. As illustrated, the arm guide portion 630 includes a vertically moving piece 621, a longitudinally moving piece 622, and an intermediate support 623 interposed therebetween.

  The bonding arm driving unit 620 that cooperates with the arm guide unit 630 includes a vertical movement motor 625 that is supported by the block body 610 and drives the vertical movement piece 621, and a longitudinal movement motor 626 that is supported by the block body and drives the longitudinal movement piece 622. And.

  The vertical movement piece 621 is disposed in a hollow portion provided in the center of the block main body 610, and linear guides 621a and 621b extending in the vertical direction are provided at both end portions, and these are related to the guides in the corresponding block main body 610. Together, they are guided up and down. A ball screw shaft 625a is connected to the shaft of the vertical movement motor 625, and the vertical movement motor 625 rotates forward and backward with the outer cylinder 621e attached to the mounting hole 621c engaged with the ball screw shaft 625a. The moving piece 621 is driven in the vertical direction.

  The longitudinally moving piece 622 is located near the lower right side of the vertically moving piece 621, and linear guides 622a and 622b extending in the longitudinal direction of the apparatus are provided on the upper and lower sides of the right side surface, and these are guides 613a in the corresponding block body 610. , 613b and guided in the longitudinal direction of the apparatus. Then, the ball screw shaft 626a is connected to the shaft of the longitudinal motion motor 626, and the longitudinal motion motor 626 rotates forward and backward with the outer cylinder 622c provided on the longitudinal motion piece 622 engaged with the ball screw shaft 626a. The longitudinally moving piece 622 is driven in the longitudinal direction of the apparatus.

  The intermediate support 623 extends in a plate shape in the vertical direction, and holds the bonding arm 612 at the lower portion of the left side surface. A linear guide 623 a extending in the front-rear direction of the apparatus is attached to the upper part of the left side surface of the intermediate support 623. A guide member 621d extending in the left-right direction is fixed to the lower part of the right side surface of the vertical movement piece 621. The linear guide 623a engages with the guide member 621d, so that the intermediate support 623 moves in the front-rear direction of the apparatus. Guided. Further, linear guides 623b and 623c extending in the vertical direction are fixed to both sides of the right side surface of the intermediate support 623 (a surface facing slightly left from the front in FIG. 5). Guide members 622d and 622e extending in the vertical direction are fixed to both side portions of the left side surface of the longitudinally moving piece 622 (FIG. 4), and the linear guides 623b and 623c are engaged with the guide members 622d and 622e. Thus, the intermediate support 623 is guided in the vertical direction.

  Based on this structure, the vertical movement piece 621 moves up and down by the operation of the vertical movement motor 625, the front and rear movement piece 622 moves back and forth by the operation of the front and rear movement motor 626, and the intermediate support 623 includes the vertical movement piece 621 and the front and rear movement piece 621. The moving piece 622 determines the vertical position. Therefore, the intermediate support 623 can be freely moved up and down and forward and backward with respect to the block main body 610 by the vertical movement motor 625 and the forward and backward movement motor 626 fixed to the block main body 610. Along with this, the bonding arm 612 and the collet 611 held by the bonding arm 612 also move up and down and back and forth.

The block drive unit 65 that drives the bonding block includes a left-right motion motor 651 that drives the block body 610 in the left-right direction of the apparatus. A ball screw shaft 651a is connected to the drive shaft of the left / right motion motor 651, an outer cylinder 615 is attached to the block body 610, and the left / right motion motor 651 is forward / reverse with the outer cylinder engaged with the ball screw shaft 651a. By rotating, the bonding block is driven in the horizontal direction of the apparatus.

  Thus, the support frame 80 forms a robust rectangular frame structure with the pair of side frame portions 82 and 83, the front beam 84, and the rear beam 85, and the block body 610 includes the front beam 84 and the front beam 84. The front block guide 86 and the rear block guide 87 supported by the rear beam 85 are supported at both ends. A support structure having high fastness can be obtained. Under the support structure, the left / right motor 651 drives the apparatus in the left / right direction (X-axis direction). Furthermore, the bonding arm 612 is guided in the longitudinal direction (Y-axis direction) and the vertical direction (Z-axis direction) by being guided by the arm guide portion 630 in the block body 610 supported at both ends. As a result, all axial movements of X, Y, and Z are performed under a robust support structure.

  In addition, the operation parts such as the magazine moving mechanism 71 of the loader 20 and the unloader 70 are also supported on the outer surfaces of the pair of side frame parts 82 and 83 forming a part of the rectangular frame structure. The occurrence of is kept low.

  Based on these, high processing accuracy in the die bonding part is guaranteed. Further, based on the robust support structure, the support frame 80 and the block main body 610 can be reduced in thickness by avoiding thickening and the provision of reinforcing ribs, and as a result, the drive motor can be reduced in size. Become. Thereby, the manufacturing cost of the apparatus can be kept low.

  In this embodiment, the left-right motor 651 applies a driving force to the block main body 610 in the moving direction at a position penetrating the vicinity of the center of gravity of the bonding block in the left-right direction of the apparatus. The position of the center of gravity of the bonding block is determined by the block main body 610 and mass parts such as the bonding arm driving unit 620, the bonding arm 612, and the collet 611 coupled thereto. It is most preferable that the driving position of the bonding block by the block driving unit 65 is one of positions that penetrate the vicinity of the center of gravity of the bonding block in the left-right direction of the apparatus. This prevents the bonding block from shaking during driving and improves the smoothness of operation. Combined with the above-described weight reduction, higher-speed and high-precision bonding can be performed. Even when driving in the vicinity thereof, it is desirable that the bonding block is moved within 1/3 of the straight line passing through the center of gravity of the bonding block in the horizontal direction of the apparatus, and within 1/6. It is more desirable to do.

  The longitudinal motor 626 is attached to the front portion of the block body 610 as shown in FIG. As described above, the forward / backward movement motor 626 is arranged at the front portion of the block main body 610, so that the forward / backward movement piece 622 picks up the semiconductor chip on the wafer table 52 as shown in FIG. It will be located in the vicinity of distance L1 from 626. If the longitudinal motion motor 626 is attached to the rear portion of the block body 610, the longitudinal motion piece 622 is positioned in the vicinity of the distance L2 from the longitudinal motion motor when the semiconductor chip is picked up. Since the rear-stage transport mechanism 42 and the like are disposed at the rear of the apparatus, the distance L2 must be increased. On the other hand, it is not necessary to attach a member that must increase the distance L1 to the front portion of the block main body 610. Therefore, the distance L1 can be shortened. The forward / backward movement motor 626 generates heat as it operates, and the heat is transmitted to the ball screw shaft 626a, and the ball screw shaft 626a is thermally expanded accordingly. As a result, an error corresponding to the thermal expansion of the ball screw shaft 626a occurs with respect to the rotational speed and rotational angle of the longitudinal motion motor 626 that determines the longitudinal position of the longitudinal motion piece 622. In this regard, the distance L1 of the present apparatus is significantly shorter than the distance L2 when the longitudinal motor 626 is provided at the rear, and the error is reduced accordingly. Thereby, the front-rear position of the front-rear moving piece 622 when picking up the semiconductor chip from the wafer table 52 can be controlled with high accuracy.

On the other hand, the distance from the forward / backward movement motor 626 to the substrate S on the rear-stage transport mechanism 42 becomes longer, and if it is left as it is, the thermal expansion of the ball screw shaft 626a is greatly affected. However, when the semiconductor chip is mounted on the island on the substrate S and bonded, fine adjustment by the position control device is performed by imaging the position of the island and the semiconductor chip, so that the influence of thermal expansion is avoided. When picking up a semiconductor chip from the wafer table 52, position accuracy that requires fine adjustment by the control device is not required, but in order to cope with high-speed operation and downsizing of the semiconductor chip, a high position is required. Realization of the accuracy is extremely advantageous, and the effect of the forward arrangement of the longitudinal motor 626 is high. In this case as well, the solid frame structure by the front beam 84, the rear beam 85, the both side frame portions 82 and 83 and the both-end support structure of the block main body 610 greatly contribute to the realization of high accuracy.
In the die bonding unit 50, the semiconductor chip is bonded on the substrate as follows. The wafer table 52 is supported at the lower front part of the rear transfer mechanism 42 and is driven in the XY axis direction by a drive motor (not shown). A push-up pin 521 is disposed below the center of the wafer table 52. A wafer sheet holding a large number of semiconductor chips arranged side by side is conveyed from outside the apparatus and fixed on the table 52.

  On the other hand, the substrate is transported on the rear transport mechanism 42 to a position corresponding to the semiconductor chip to be picked up and stops. The bonding block is conveyed to the position corresponding to the semiconductor chip and the substrate by the operation of the left and right moving motor 651. At this position, the forward / backward movement motor 626 is operated to move the bonding arm 612 forward under the guidance of the arm guide portion 630 to reach the position on the semiconductor chip, and the vertical movement motor 625 is operated to operate the bonding arm 612. Is lowered. Then, the lowering of the bonding arm 612, the suction of the collet 611, and the push-up operation of the push-up pin 521 are performed in synchronization, and the semiconductor chip is attracted to the collet 611.

  Next, the bonding arm 612 is moved up and moved backward by the operation of the vertical movement motor 625 and the longitudinal movement motor 626, and the bonding arm 612 is moved down by the operation of the vertical movement motor 625 at the target point (island) on the substrate. Then, the semiconductor chip adsorbed by the collet 611 is placed on the island, the adsorbing operation is canceled, and heating is performed as necessary to bond the semiconductor chip to the substrate. In order to bring the collet 611 to the target semiconductor chip and island, normal control means such as position control while detecting an image of the target portion can be applied.

  In this way, the semiconductor arms are sequentially joined to the islands of the substrate by repeating the up and down movement and the back and forth movement of the bonding arm 612. When the pickup of the semiconductor chip row in the Y-axis direction is completed, the wafer table 52 is moved in the X-axis direction to pick up the next chip row. Further, when the chip bonding to the island row in the Y-axis direction is completed, the left / right motion motor 651 is driven to move the bonding block to bond to the next island row. In this way, chip bonding to the required island is performed while repeating the operation in the XYZ axis directions.

  The substrate after chip bonding to the island is transferred to the unloader 70 by the post-stage transport mechanism 42. As shown in FIG. 2, the unloader 70 includes an upper stacker 71, a lower stacker 72, and an elevator 73. The substrate discharged by the rear-stage transport mechanism 42 is accommodated in a magazine on the upper stacker 71. When the required number of substrates is accommodated in the magazine, the magazine is sent to the lower stacker 72 by the elevator 73. The magazine on the lower stacker 72 is transported outside the apparatus by a transport apparatus (not shown).

  As mentioned above, although one Embodiment of this invention was described, this invention is not limited to this, A various change is possible unless it deviates from the meaning. For example, as a loader, a mechanism including a feeder that pushes out the substrates one by one from the magazine is shown. However, various mechanisms such as a mechanism that lifts the loaded substrate to the magazine by suction or the like and transports it to the preceding transport mechanism are adopted. be able to. Similarly, various mechanisms can be employed for the unloader.

  In the above-described embodiment, the arm guide portion 630 includes the vertically moving piece 621 and the longitudinally moving piece 622 supported by the block main body 610, and the intermediate support 623 engaged therewith, and the bonding arm driving portion 620 includes the block main body 620. Although the vertical movement motor 625 and the forward / backward movement motor 626 supported by 610 are provided, instead of this, the arm guide unit supports the vertical movement piece to be movable up and down on the block body, and the vertical movement piece is It is also possible to support the moving piece so as to be movable back and forth. In this case, the vertical movement motor is fixed to the block body, and the longitudinal movement motor is fixed to the vertical movement piece. Alternatively, it is possible to support the longitudinally moving piece on the block body so as to be movable back and forth, and to support the vertically moving piece on the longitudinally moving piece so as to be movable up and down. In this case, the longitudinal motor is fixed to the block body, and the vertical motor is fixed to the longitudinal piece. In this way, the support structure is somewhat less robust, but in any case the intermediate support can be omitted.

  Various commonly used mechanisms can be adopted as a bonding agent supply mechanism in the preform portion and a handling mechanism for substrates such as collets and wafer tables and semiconductor chips in the die bonding portion.

20: Loader 30: Preform unit 40: Transfer mechanism 41: Pre-stage transfer mechanism 42: Sub-stage transfer mechanism 50: Die bonding unit 42: Sub-stage transfer mechanism 52: Wafer table 60: Bonding mechanism 65: Block drive unit 70: Unloader 80: Support frame 81: base 82, 83: side frame portion 84: front beam 85: rear beam 86: front block guide 87: rear block guide 610: block body 611: collet 612: bonding arm 620: bonding arm driving unit 621: Vertical movement piece 622: Longitudinal movement piece 623: Intermediate support 625: Vertical movement motor 626: Longitudinal movement motor 630: Arm guide portion 651: Left / right movement motor S: Substrate

Claims (3)

A semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a predetermined position of a substrate, comprising a loader, a preform part, a die bonding part, an unloader, a support frame for supporting these in a state arranged in the left-right direction of the apparatus, and the above A transport mechanism for transporting the substrate supplied from the loader to the unloader through the preform part and the die bonding part;
The support frame includes a base at the lower part of the apparatus, a pair of side frame portions extending upward from the left and right sides of the base, a rear beam connecting the rear side of the pair of side frame portions, and the rear beam. A front beam that joins the upper part of the side frame part further forward,
The transport mechanism includes a front-stage transport mechanism located in the preform part, and a rear-stage transport mechanism located in the die bonding part,
The preform part and the die bonding part are disposed between the pair of side frame parts, and receive a loader for supplying a substrate to the preform part, and a substrate with a semiconductor chip discharged from the die bonding part. The unloader is distributed and supported on one and the other outer surfaces of the pair of side frame portions,
It said preform portion is provided with a supply device for supplying a bonding agent onto individual substrates on upper Symbol upstream conveying mechanism,
The die bonding portion, a wafer table for supporting a c Eharingu, the bonding mechanism for bonding the semiconductor chip on the wafer sheet supported on said wafer table mounted on the bonding agent with the substrate on the subsequent transporting mechanism The bonding mechanism includes a bonding block supported by the front beam and the rear beam, and a block driving unit that is supported by the support frame and drives the bonding block,
A front block guide and a rear block guide extending in the left-right direction of the apparatus are supported on the front beam and the rear beam, respectively.
The bonding block supports a block main body movably supported at the front end and the rear end by the front block guide and the rear block guide, and a collet for semiconductor chip pickup supported by the block main body at the lower end. A bonding arm, and an arm drive unit that is supported by the block body and drives the bonding arm to bring the collet to a position on the wafer table and the subsequent transfer mechanism,
The block main body is guided by the front block guide and the rear block guide and is driven in the X-axis direction, which is the left-right direction of the apparatus, by the block driving unit, and the bonding arm is mounted on an arm guide unit mounted on the block main body. Guided and driven by the arm drive unit in the Y-axis direction which is the longitudinal direction of the apparatus and the Z-axis direction which is the vertical direction ,
The arm guide portion is interposed between the vertical movement piece supported by the block body so as to be movable up and down, the longitudinal movement piece supported by the block body so as to be movable forward and backward, and the vertical movement piece and the longitudinal movement piece. An intermediate support that holds the bonding arm, engages with the vertically moving piece so as to move back and forth, and engages with the back and forth moving piece so as to move up and down. And
The bonding arm driving unit includes a vertical movement motor supported by the block body and driving the vertical movement piece in the vertical direction, and a longitudinal movement motor supported by the block body and driving the longitudinal movement piece in the apparatus longitudinal direction. the semiconductor manufacturing apparatus characterized by comprising.   The block drive unit includes a left-right motion motor that drives the block body in the left-right direction of the apparatus, and the left-right movement motor is located at a position penetrating the vicinity of the center of gravity of the bonding block in the left-right direction of the apparatus. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a driving force is applied in a moving direction. The semiconductor manufacturing apparatus according to claim 1 , wherein the longitudinal motor is attached to a front portion of the block body.

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