TWI424509B - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing device Download PDFInfo
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- TWI424509B TWI424509B TW099141257A TW99141257A TWI424509B TW I424509 B TWI424509 B TW I424509B TW 099141257 A TW099141257 A TW 099141257A TW 99141257 A TW99141257 A TW 99141257A TW I424509 B TWI424509 B TW I424509B
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- 239000004065 semiconductor Substances 0.000 title claims description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims description 61
- 230000007246 mechanism Effects 0.000 claims description 39
- 239000007767 bonding agent Substances 0.000 claims description 10
- 230000005484 gravity Effects 0.000 claims description 7
- 238000005304 joining Methods 0.000 claims description 7
- 235000012431 wafers Nutrition 0.000 description 57
- 230000007723 transport mechanism Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Description
本發明是有關於一種具有將半導體晶片接合於引線框架(lead frame)等的基板上的功能的半導體製造裝置。The present invention relates to a semiconductor manufacturing apparatus having a function of bonding a semiconductor wafer to a substrate such as a lead frame.
於半導體裝置的製造中，為了將半導體晶片接合於基板上，而包括將基板供給至加工平台的裝載機(loader)、將接合材料供給至基板上的規定位置(島嶼(island))的預成型部(pre-form)、將半導體晶片分別接合於基板上的各島嶼的黏晶(die bonding)部、以及將接合著半導體晶片的基板向加工平台外部送出的卸載機(un-loader)。In the manufacture of a semiconductor device, in order to bond a semiconductor wafer to a substrate, a loader that supplies the substrate to the processing platform, and a pre-form of a predetermined position (island) that supplies the bonding material to the substrate is provided. A pre-form, a die bonding portion of each of the islands on which the semiconductor wafer is bonded to the substrate, and an un-loader that feeds the substrate on which the semiconductor wafer is bonded to the outside of the processing platform.
先前的半導體製造裝置的側面及正面例如分別如圖6A、圖6B所示，包括裝置下部的基台110、以及自該基台的後部向基台上方立起的下部框架121及上部框架122，自上部框架122的上部向裝置前方以懸突(overhang)狀使預成型部130及黏晶部140的各支撐框架131、141延伸，且將各作動部分132、142支撐於該些支撐框架131、141上。The side surface and the front surface of the conventional semiconductor manufacturing apparatus include, for example, as shown in FIGS. 6A and 6B, respectively, a base 110 including a lower portion of the apparatus, and a lower frame 121 and an upper frame 122 rising from the rear of the base to the base. The support frames 131 and 141 of the preformed portion 130 and the die-bonding portion 140 are extended from the upper portion of the upper frame 122 toward the front of the device in an overhang shape, and the respective actuation portions 132, 142 are supported by the support frames 131. 141.
而且，供給基板的裝載機150包括：將收容著基板的匣盒(magazine)載置於多個間隔件內以使該匣盒待機的上部堆疊器(stacker)151，及自上部堆疊器151上的匣盒將基板逐片向預成型部供給的升降機156，自升降機156接收已供給基板的匣盒的下部堆疊器152，以及用以吸附匣盒內的各個基板並向預成型部供給的給料器(feeder)153。堆疊器151、152支撐於自基台110的左端立起的支撐構件154上，給料器153支撐於自基台110的後端立起的支撐構件155的上部。Further, the loader 150 that supplies the substrate includes an upper stacker 151 that mounts a magazine in which the substrate is housed in the plurality of spacers to make the cassette stand by, and from the upper stacker 151 The cassette 156 that feeds the substrate to the preformed portion one by one, the lower stacker 152 that receives the cassette from the substrate from the lift 156, and the feedstock for adsorbing the respective substrates in the cassette and feeding the preforms Feeder 153. The stackers 151, 152 are supported on a support member 154 rising from the left end of the base 110, and the feeder 153 is supported at an upper portion of the support member 155 rising from the rear end of the base 110.
而且，將接合了半導體晶片後的基板予以搬出的卸載機160包括使匣盒升降的升降機164、將空的匣盒設定於基板承接位置的上部堆疊器162、以及用以自升降機164接收已收納基板的匣盒並向裝置外部排出的下部堆疊器161，該些堆疊器161、162及升降機164支撐於自基台110的右端立起的支撐構件163上。此種半導體製造裝置例如揭示於日本專利特開2008-153557號公報。Further, the unloader 160 that carries out the substrate from which the semiconductor wafer has been bonded includes an elevator 164 that elevates and lowers the cassette, an upper stacker 162 that sets the empty cassette at the substrate receiving position, and receives the received unit from the elevator 164. The cassette of the substrate is discharged to the outside of the apparatus, and the stackers 161, 162 and the elevator 164 are supported on the support member 163 which rises from the right end of the base 110. Such a semiconductor manufacturing apparatus is disclosed, for example, in Japanese Laid-Open Patent Publication No. 2008-153557.
於該形態的半導體製造裝置中，在預成型部130中，為了對基板的規定部位(島嶼)供給用以接合半導體晶片的接合劑，而使塗佈裝置沿X軸方向(裝置的左右方向)及Y軸方向(裝置的前後方向)移動並到達規定位置，且在該位置使塗佈針沿Z軸方向(上下方向)移動以進行用於積存接合劑的浸漬及對基板的塗佈。而且，於黏晶部140中，為了將連接於支撐在X-Y台143的晶圓薄片上的半導體晶片提起並載置於裝置後部的搬送機構144上的基板上，須使夾頭(collet)沿X軸方向、Y軸方向及Z軸方向移動。In the semiconductor manufacturing apparatus of this aspect, in the preform portion 130, in order to supply a bonding agent for bonding a semiconductor wafer to a predetermined portion (island) of the substrate, the coating device is placed in the X-axis direction (left-right direction of the device). The Y-axis direction (the front-rear direction of the apparatus) is moved to reach a predetermined position, and the coating needle is moved in the Z-axis direction (up-and-down direction) at this position to perform immersion for depositing the bonding agent and coating of the substrate. Further, in the die bonding portion 140, in order to lift the semiconductor wafer connected to the wafer sheet supported on the XY stage 143 and place it on the substrate on the transfer mechanism 144 at the rear of the device, the colle is required to be along Move in the X-axis direction, the Y-axis direction, and the Z-axis direction.
該些塗佈裝置及夾頭的X軸方向及Y軸方向的移動中要求高精度，伴隨最近的晶片及基板內的晶片搭載區域的小型化，正在尋求更高的精度。為了保證該精度，對作動部分的支撐結構要求高的剛性，尤其於黏晶部140中，因自X-Y台143至搬送機構上的基板為止的距離長，故而該支撐結構必需為高的剛性。In the movement of the coating device and the chuck in the X-axis direction and the Y-axis direction, high precision is required, and the recent wafer and the wafer mounting region in the substrate are miniaturized, and higher precision is sought. In order to ensure this accuracy, the support structure of the actuating portion requires high rigidity, and in particular, in the die bonding portion 140, since the distance from the X-Y table 143 to the substrate on the transport mechanism is long, the support structure must have high rigidity.
然而，先前的半導體製造裝置中，如上述般因將作動部分支撐於從自基台立起的支撐構件122以懸突狀延伸的支撐框架141上，故而容易自支撐基端以相當於懸突的長度而發生彎曲或扭轉的變形。為了與此對應，支撐構件122、支撐框架141等的支撐結構部分須厚壁化或設置多個加強肋(rib)而形成堅固結構。其結果，支撐結構部分的重量增大，隨之驅動馬達亦必需大型化。However, in the conventional semiconductor manufacturing apparatus, as described above, since the actuating portion is supported on the support frame 141 extending from the support member 122 rising from the base in an overhanging manner, it is easy to self-support the base end to be equivalent to the overhang. The length of the bend occurs due to bending or twisting. To cope with this, the support structure portion of the support member 122, the support frame 141, and the like must be thickened or provided with a plurality of reinforcing ribs to form a solid structure. As a result, the weight of the support structure portion is increased, and accordingly, the drive motor must be enlarged.
而且，支撐於支撐構件154、155、163上的堆疊器151、152、161、162及給料器153各自的重心變高，因而受到預成型部或黏晶部發生的振動的影響，導致裝載機及卸載機大幅振動。因此，為了抑制振動，支撐構件154、155、163亦厚壁化或利用多個加強肋而形成堅固結構。Moreover, the center of gravity of each of the stackers 151, 152, 161, 162 and the feeder 153 supported on the support members 154, 155, 163 becomes high, and thus is affected by the vibration of the preform or the die-forming portion, resulting in a loader. And the unloader vibrates greatly. Therefore, in order to suppress vibration, the support members 154, 155, and 163 are also thickened or a plurality of reinforcing ribs are used to form a strong structure.
該些結果為，半導體製造裝置的製造成本必然上升。而且，未必能夠藉由此種程度的牢固化而獲得充分的加工精度。尤其，存在伴隨最近的基板尺寸的大型化而使黏晶部的作動距離變大的傾向，隨之使支撐框架等的振動增大，從而加工精度的確保變得困難。因此，亦會發生必需限制加工速度的問題。As a result, the manufacturing cost of the semiconductor manufacturing apparatus is inevitably increased. Moreover, it is not always possible to obtain sufficient processing accuracy by such a degree of solidification. In particular, there is a tendency that the operating distance of the die bonding portion is increased as the size of the substrate is increased in recent years, and the vibration of the support frame or the like is increased, which makes it difficult to secure the machining accuracy. Therefore, there is also a problem that it is necessary to limit the processing speed.
對此，本發明的目的在於提供一種預成型部及黏晶部的高加工精度得到保證且製造成本低的半導體製造裝置。In view of the above, an object of the present invention is to provide a semiconductor manufacturing apparatus in which a high processing precision of a preformed portion and a die-bonded portion is secured and a manufacturing cost is low.
本發明為了達成上述目的而提供一種半導體製造裝置，其具有將半導體晶片接合於基板的規定位置的功能，其特徵在於包括：裝載機，預成型部，黏晶部，卸載機，在沿裝置左右方向配置的狀態下對上述四種組件進行支撐的支撐框架，以及將由上述裝載機供給的基板經由上述預成型部及黏晶部而向上述卸載機移送的搬送機構；上述支撐框架包括：裝置下部的基台，自該基台的左右兩側向上方延伸的一對側框架部，將該一對側框架部的後部側加以結合的後部梁，以及在比該後部梁更前方處將上述側框架部的上部加以結合的前部梁；上述預成型部及黏晶部配置於上述一對側框架部間，將基板供給至上述預成型部的裝載機、及接收自上述黏晶部排出的具有半導體晶片的基板的卸載機是分開支撐於上述一對側框架部的外側面；上述黏晶部包括：支撐於上述前部梁及後部梁的接合塊，以及支撐於上述支撐框架且對上述接合塊進行驅動的塊驅動部；在上述前部梁及後部梁分別支撐著沿裝置左右方向延伸的前部塊導件及後部塊導件；上述接合塊包括：藉由上述前部塊導件及後部塊導件而可移動地支撐的塊本體，支撐於該塊本體且於下端部用來支撐半導體晶片拾取用的夾頭的接合臂，以及支撐於上述塊本體的臂驅動部；上述塊本體由上述前部塊導件及後部塊導件所導引並藉由上述塊驅動部以沿裝置左右方向即X軸方向而驅動，上述接合臂由安裝於上述塊本體的臂導引部所導引並藉由上述臂驅動部以沿裝置前後方向即Y軸方向及上下方向即Z軸方向而驅動。In order to achieve the above object, the present invention provides a semiconductor manufacturing apparatus having a function of bonding a semiconductor wafer to a predetermined position of a substrate, which is characterized by comprising: a loader, a preformed portion, a die-bonding portion, an unloader, and a device along the left and right sides of the device. a support frame for supporting the above four components in a state in which the components are arranged, and a transfer mechanism for transferring the substrate supplied from the loader to the unloader via the preforming portion and the die bonding portion; the support frame includes: a lower portion of the device Abutment, a pair of side frame portions extending upward from the left and right sides of the base, a rear beam joining the rear sides of the pair of side frame portions, and the side at a position further forward than the rear beam a front beam coupled to an upper portion of the frame portion; the preformed portion and the die-bonding portion are disposed between the pair of side frame portions, and a loader that supplies the substrate to the preform portion and receives the discharge from the die bond portion An unloader having a substrate of a semiconductor wafer is separately supported on an outer side surface of the pair of side frame portions; the die bonding portion includes: supported on the above a joint block of the beam and the rear beam, and a block driving portion supported by the support frame and driving the joint block; and the front block and the rear beam respectively support the front block guide extending in the left-right direction of the device and a rear block guide; the joint block includes: a block body movably supported by the front block guide and the rear block guide, supported by the block body and supported at the lower end for holding a clip for semiconductor wafer picking An engaging arm of the head, and an arm driving portion supported by the block body; the block body is guided by the front block guide and the rear block guide and is arranged in the left-right direction, that is, the X-axis direction, by the block driving portion In the driving, the engaging arm is guided by the arm guiding portion attached to the block body, and is driven by the arm driving portion in the Y-axis direction and the vertical direction, that is, the Z-axis direction in the front-rear direction of the apparatus.
於本說明書及專利申請的範圍中，關於半導體製造裝置的位置關係，將晶圓台的某一側稱作前方，將搬送機構的某一側稱作後方。In the scope of the present specification and the patent application, regarding the positional relationship of the semiconductor manufacturing apparatus, one side of the wafer stage is referred to as the front side, and one side of the conveyance mechanism is referred to as the rear side.
【發明的效果】[Effects of the Invention]
本發明的半導體製造裝置藉由上述構成，尤其藉由以下的構成而實現優異的效果。According to the above configuration, the semiconductor manufacturing apparatus of the present invention achieves an excellent effect particularly by the following configuration.
首先，支撐框架包括自裝置的基台的左右兩側向上方延伸的一對側框架部、將該些一對側框架部的後部側加以結合的後部梁、以及在比該後部梁更前方處將上述側框架部的上部加以結合的前部梁，藉此使裝置整體形成牢固的矩形的框結構。First, the support frame includes a pair of side frame portions extending upward from the right and left sides of the base of the apparatus, a rear beam joining the rear sides of the pair of side frame portions, and a front side of the rear beam The front beam that joins the upper portion of the side frame portion described above forms a solid rectangular frame structure as a whole.
而且，接合塊的塊本體支撐於前部塊導件及後部塊導件而成為兩端支撐的結構，上述前部塊導件及後部塊導件支撐於前部梁及後部梁。藉此，獲得比先前的懸突結構更高的牢固性，且於該支撐結構下進行朝向裝置左右方向(X軸方向)的驅動。Further, the block body of the joint block is supported by the front block guide and the rear block guide to be supported at both ends, and the front block guide and the rear block guide are supported by the front beam and the rear beam. Thereby, the firmness is higher than that of the previous overhang structure, and driving in the left-right direction (X-axis direction) of the apparatus is performed under the support structure.
此外，接合臂由兩端被支撐的塊本體中的臂導引部而導引且沿裝置前後方向(Y軸方向)及上下方向(Z軸方向)受到驅動。其結果，X、Y、Z的軸方向上的移動均於牢固的支撐結構下進行。Further, the engagement arm is guided by the arm guide portion in the block body supported at both ends and is driven in the device front-rear direction (Y-axis direction) and the up-and-down direction (Z-axis direction). As a result, the movement in the axial direction of X, Y, and Z is performed under a firm support structure.
並且，裝載機及卸載機的匣盒移動機構等的動作部分亦支撐於形成矩形框結構的一部分的一對側框架部的外側面，因而該些動作部分所引起的振動的發生被抑制得較低。Further, the operating portions of the cassette moving mechanism of the loader and the unloader are also supported by the outer side surfaces of the pair of side frame portions forming a part of the rectangular frame structure, so that the occurrence of vibration caused by the operating portions is suppressed. low.
根據該些矩形框結構及塊本體的兩端支撐結構，保證了黏晶部的極高的加工精度。而且，因如此而獲得牢固的支撐結構，故而避免了支撐框架及塊本體的厚壁化或設置多個加強肋而可實現輕量化，其結果，可實現驅動馬達的小型化。藉此，可將裝置的製造成本抑制得較低。According to the rectangular frame structure and the support structure at both ends of the block body, the extremely high processing precision of the die-bonding portion is ensured. Further, since a strong support structure is obtained in this way, it is possible to reduce the thickness of the support frame and the block body or to provide a plurality of reinforcing ribs, thereby achieving weight reduction, and as a result, the drive motor can be downsized. Thereby, the manufacturing cost of the device can be suppressed low.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
以下，參照隨附圖式來對本發明的實施形態進行說明。圖1及圖2概略地表示本發明的一實施形態的半導體製造裝置。如圖1和圖2所示，該半導體製造裝置包括：裝載機20，預成型部30，黏晶部50，卸載機70，及在沿裝置左右方向配置的狀態下對上述四個組件進行支撐的支撐框架80，以及將由裝載機20供給的基板S經由預成型部30及黏晶部50而向卸載機70移送的搬送機構40。Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 and 2 schematically show a semiconductor manufacturing apparatus according to an embodiment of the present invention. As shown in FIGS. 1 and 2, the semiconductor manufacturing apparatus includes a loader 20, a preforming portion 30, a die bonding portion 50, an unloader 70, and supporting the above four components in a state of being arranged in the left-right direction of the device. The support frame 80 and the transport mechanism 40 that transports the substrate S supplied from the loader 20 to the unloader 70 via the preform portion 30 and the die bonding portion 50.
支撐框架80包括：裝置下部的基台81，自該基台的左右兩側向上方延伸的一對側框架部82、83，將該一對側框架部的後部側加以結合的後部梁85，以及在比該後部梁更前方處將側框架部的上部加以結合的前部梁84。如圖3所示，於前部梁84及後部梁85分別支撐著沿裝置左右方向延伸的前部塊導件86及後部塊導件87。The support frame 80 includes a base 81 at the lower portion of the apparatus, a pair of side frame portions 82 and 83 extending upward from the left and right sides of the base, and a rear beam 85 that joins the rear sides of the pair of side frame portions. And a front beam 84 that joins the upper portion of the side frame portion at a position further forward than the rear beam. As shown in FIG. 3, the front beam guide 84 and the rear beam 85 support the front block guide 86 and the rear block guide 87 extending in the left-right direction of the apparatus, respectively.
搬送機構40包括位於預成型部30的前段搬送機構41、及位於黏晶部50的後段搬送機構42。在預成型部30及黏晶部50的後部，配置著沿左右方向成細長延伸的支撐板。前段搬送機構41包括由支撐板的基板搬送方向前半部分構成的前段板411、沿前段板411可移動地設置的抓爪(gripper)412、以及抓爪的驅動部(省略圖示)，將由裝載機20供給的基板S移送至預成型部的作業位置為止。後段搬送機構42包括由支撐板的基板搬送方向後半部分構成的後段板421、沿著後段板421可移動地設置的抓爪422、以及抓爪的驅動部(省略圖示)，將利用預成型部30來供給接合劑的基板移送至黏晶部50為止，並進而將半導體晶片接合後的基板移送至卸載機70為止。The conveying mechanism 40 includes a front stage conveying mechanism 41 located in the preforming unit 30 and a rear stage conveying mechanism 42 located in the die bonding unit 50. A support plate that extends elongated in the left-right direction is disposed in the rear portion of the preformed portion 30 and the die-bonding portion 50. The front stage conveying mechanism 41 includes a front plate 411 formed of a front half of the support plate in the substrate conveying direction, a gripper 412 movably provided along the front plate 411, and a driving portion (not shown) of the gripper to be loaded The substrate S supplied from the machine 20 is transferred to the working position of the preformed portion. The rear stage conveying mechanism 42 includes a rear stage plate 421 composed of a rear half portion of the support plate in the substrate conveyance direction, a gripper 422 movably provided along the rear stage plate 421, and a driving portion (not shown) of the gripper, which will utilize the preforming. The portion 30 supplies the substrate to which the bonding agent is transferred to the die bonding portion 50, and further transfers the substrate after the semiconductor wafer bonding to the unloader 70.
預成型部30及黏晶部50配置於一對側框架部82、83間，裝載機20及卸載機70分別分開地支撐於側框架部82及83的外側面。The preformed portion 30 and the die-bonding portion 50 are disposed between the pair of side frame portions 82 and 83, and the loader 20 and the unloader 70 are separately supported by the outer side faces of the side frame portions 82 and 83.
裝載機20包括：支撐於支撐框架80的外側面且可載置基板收容用的匣盒的上部堆疊器21及下部堆疊器22，自該堆疊器上的匣盒將基板分別向預成型部的前段板411上移送的給料器23(圖中由一點鏈線表示)，以及使匣盒於上下的堆疊器間移動的升降機24。於該實施形態下，積載著基板的匣盒藉由升降機24自下部堆疊器22而移送至上部堆疊器21。收納於上部堆疊器21上的匣盒的基板藉由給料器23而逐片朝預成型部30擠壓。The loader 20 includes an upper stacker 21 and a lower stacker 22 supported on an outer side surface of the support frame 80 and capable of mounting a cassette for receiving the substrate, and the cassette from the stacker is respectively directed to the preformed portion. A feeder 23 (indicated by a chain of dots) transferred on the front plate 411, and an elevator 24 for moving the cassette between the upper and lower stackers. In this embodiment, the cassette on which the substrate is stacked is transferred from the lower stacker 22 to the upper stacker 21 by the elevator 24. The substrate of the cassette housed in the upper stacker 21 is pressed toward the preform portion 30 piece by piece by the feeder 23.
預成型部30包括將接合劑供給至前段搬送機構41上的各個基板的供給裝置32。基板由抓爪412所夾持且藉由抓爪驅動部而於前段板411上朝圖1的右方搬送，並在供給裝置32的下方處停止。於該位置處，供給裝置32將接著劑、焊錫等的接合劑放置於基板S上，且放置有接合劑的基板S藉由抓爪412而被搬送至黏晶部50。The preformed portion 30 includes a supply device 32 that supplies the bonding agent to each of the substrates on the front stage conveying mechanism 41. The substrate is held by the gripper 412 and is conveyed to the right side of FIG. 1 on the front plate 411 by the gripper driving portion, and is stopped at the lower side of the supply device 32. At this position, the supply device 32 places the bonding agent such as an adhesive or solder on the substrate S, and the substrate S on which the bonding agent is placed is transferred to the die bonding portion 50 by the gripper 412.
黏晶部50包括：對自裝置外搬入的晶圓環(wafer ring)進行支撐的晶圓台(table)52，以及用以將支撐於該晶圓台的晶圓薄片上的半導體晶片放置並接合於後段搬送機構42上的基板的接合機構60。利用預成型部30來供給接合劑的基板S由抓爪422所夾持且藉由抓爪驅動部而於後段板421上朝圖1的右方搬送，並於接合機構60的下方處停止。The die bonding portion 50 includes: a wafer table 52 for supporting a wafer ring loaded from the outside of the device, and a semiconductor wafer for placing the wafer wafer supported on the wafer table and The joining mechanism 60 of the substrate joined to the rear stage conveying mechanism 42. The substrate S to which the bonding agent is supplied by the preforming portion 30 is sandwiched by the gripper 422, and is transported to the right side of FIG. 1 on the rear plate 421 by the gripper driving portion, and is stopped at the lower side of the engaging mechanism 60.
接合機構60包括支撐於前部梁84及後部梁85的接合塊61、及支撐於支撐框架80且對接合塊61進行驅動的塊驅動部65。The joint mechanism 60 includes a joint block 61 supported by the front beam 84 and the rear beam 85, and a block drive portion 65 supported by the support frame 80 and driving the joint block 61.
如圖3所示，接合塊61包括：前端部及後端部藉由前部塊導件86及後部塊導件87而可移動地支撐的塊本體610，支撐於該塊本體且下端部支撐著半導體晶片拾取用的夾頭611的接合臂612，支撐於塊本體610且對接合臂612進行驅動而將夾頭611送至晶圓台上及後段搬送機構42上的位置的接合臂驅動部620。As shown in FIG. 3, the joint block 61 includes a block body 610 whose front end portion and the rear end portion are movably supported by the front block guide 86 and the rear block guide 87, supported by the block body and supported at the lower end portion. The engaging arm 612 of the chuck 611 for picking up the semiconductor wafer is supported by the block body 610 and drives the engaging arm 612 to feed the chuck 611 to the bonding arm driving portion at the position on the wafer table and the rear stage conveying mechanism 42. 620.
塊本體610具有用來安裝接合加工所需的作動部分的寬度，沿上下方向及前後方向較寬地延伸，且整體成為大致梯形。該塊本體610由前部塊導件86及後部塊導件87所導引且藉由塊驅動部65而沿裝置左右方向(X軸方向)驅動。而且，接合臂612由安裝於塊本體的臂導引部630所導引且藉由臂驅動部沿裝置前後方向(Y軸方向)及上下方向(Z軸方向)驅動。The block body 610 has a width for mounting an operation portion required for the joining process, and extends widely in the up-and-down direction and the front-rear direction, and has a substantially trapezoidal shape as a whole. The block body 610 is guided by the front block guide 86 and the rear block guide 87 and is driven by the block driving unit 65 in the left-right direction (X-axis direction) of the apparatus. Further, the engagement arm 612 is guided by the arm guide portion 630 attached to the block body and is driven by the arm drive portion in the device front-rear direction (Y-axis direction) and the vertical direction (Z-axis direction).
圖4及圖5表示將臂導引部630的構成部分加以分解後的狀態。圖4是自左前方觀察到的圖，圖5是自右前方觀察到的圖。如圖4及圖5所示，臂導引部630包括上下移動片621、前後移動片622、及介於該些移動片之間的中間支撐體623。4 and 5 show a state in which the components of the arm guide portion 630 are disassembled. 4 is a view seen from the front left side, and FIG. 5 is a view seen from the right front side. As shown in FIGS. 4 and 5, the arm guiding portion 630 includes an upper and lower moving piece 621, a front and rear moving piece 622, and an intermediate supporting body 623 interposed between the moving pieces.
與臂導引部630協動的接合臂驅動部620包括：支撐於塊本體610且對上下移動片621進行驅動的上下移動馬達625，以及支撐於塊本體且對前後移動片622進行驅動的前後移動馬達626。The engaging arm driving portion 620 that cooperates with the arm guiding portion 630 includes: an up-and-down moving motor 625 that is supported by the block body 610 and that drives the upper and lower moving pieces 621, and a front-back moving motor 625 that is supported by the block body and that drives the front-rear moving piece 622 Move the motor 626.
上下移動片621配置於設置在塊本體610的中央的中空部610a，沿上下方向延伸的線性導件621a、621b設置在兩側端部，該些線性導件621a、621b扣合於相對應的塊本體610內的導件且沿上下方向被導引。而且，於上下移動馬達625的軸上連接著滾珠螺桿軸(ball screw axis)625a，在安裝於安裝孔621c的外筒621e扣合於滾珠螺桿軸625a的狀態下，藉由上下移動馬達625正反旋轉而沿上下方向驅動上下移動片621。The upper and lower moving pieces 621 are disposed in the hollow portion 610a provided at the center of the block body 610, and the linear guides 621a, 621b extending in the up and down direction are disposed at both side ends, and the linear guides 621a, 621b are engaged with the corresponding ones. The guides in the block body 610 are guided in the up and down direction. Further, a ball screw axis 625a is connected to the shaft of the vertical movement motor 625, and the outer cylinder 621e attached to the attachment hole 621c is engaged with the ball screw shaft 625a, and the motor 625 is moved up and down. The upper and lower moving pieces 621 are driven in the up and down direction by reverse rotation.
前後移動片622位於上下移動片621的右側下部附近，沿裝置前後方向延伸的線性導件622a、622b設置於右側面的上部及下部，該些線性導件622a、622b扣合於相對應的塊本體610內的導件613a、613b且沿裝置前後方向被導引。而且，於前後移動馬達626的軸上連接著滾珠螺桿軸626a，在設置於前後移動片622的外筒622c扣合於滾珠螺桿軸626a的狀態下，藉由前後移動馬達626正反旋轉而沿裝置前後方向驅動前後移動片622。The front and rear moving pieces 622 are located near the right lower portion of the upper and lower moving pieces 621, and the linear guides 622a, 622b extending in the front-rear direction of the device are disposed at the upper and lower portions of the right side surface, and the linear guides 622a, 622b are fastened to the corresponding blocks. The guides 613a, 613b in the body 610 are guided in the front-rear direction of the device. Further, the ball screw shaft 626a is coupled to the shaft of the front and rear moving motor 626, and the outer cylinder 622c provided on the front and rear moving piece 622 is engaged with the ball screw shaft 626a, and the front and rear moving motor 626 is rotated forward and backward. The device moves the front and rear moving sheets 622 in the front-rear direction.
中間支撐體623沿上下方向成板狀延伸，將接合臂612保持於左側面的下部。於中間支撐體623的左側面的上部，安裝著沿裝置前後方向延伸的線性導件623a。而且，在上下移動片621的右側面的下部固定著沿前後方向較長地延伸的導引構件621d，藉由線性導件623a扣合於導引構件621d，而使中間支撐體623沿裝置前後方向被導引。此外，在中間支撐體623的右側面(圖5中自正面稍朝向左方的面)的兩側部，固定著沿上下方向延伸的線性導件623b、623c。而且，在前後移動片622(圖4)的左側面的兩側部固定著沿上下方向較長地延伸的導引構件622d、622e，藉由線性導件623b、623c扣合於導引構件622d、622e，中間支撐體623沿上下方向被導引。The intermediate support body 623 extends in a plate shape in the vertical direction, and holds the engagement arm 612 at a lower portion of the left side surface. A linear guide 623a extending in the front-rear direction of the apparatus is attached to an upper portion of the left side surface of the intermediate support body 623. Further, a guide member 621d extending long in the front-rear direction is fixed to a lower portion of the right side surface of the upper and lower moving piece 621, and the intermediate support 623 is engaged with the guide member 621d by the linear guide 623a. The direction is guided. Further, linear guides 623b and 623c extending in the vertical direction are fixed to both side portions of the right side surface of the intermediate support body 623 (the surface slightly toward the left side from the front surface in FIG. 5). Further, guide members 622d and 622e extending in the up-and-down direction are fixed to both side portions of the left-side surface of the front and rear movable sheets 622 (FIG. 4), and the linear guides 623b and 623c are engaged with the guide member 622d. 622e, the intermediate support body 623 is guided in the up and down direction.
根據該結構，藉由上下移動馬達625的作動，上下移動片621上下移動，藉由前後移動馬達626的作動，前後移動片622前後移動，中間支撐體623藉由上下移動片621及前後移動片622來決定上下前後的位置。因此，藉由固定於塊本體610的上下移動馬達625及前後移動馬達626，能夠使中間支撐體623相對於塊本體610朝上下前後自由移動。伴隨於此，接合臂612及保持於該接合臂612的夾頭611亦上下前後地移動。According to this configuration, the upper and lower moving pieces 621 are moved up and down by the movement of the up-and-down moving motor 625, and the front and rear moving pieces 622 are moved back and forth by the movement of the front and rear moving motor 626, and the intermediate supporting body 623 moves the piece 621 up and down and the front and rear moving pieces by the upper and lower moving pieces 621. 622 to determine the position before and after. Therefore, the intermediate support body 623 can be freely moved up and down with respect to the block body 610 by the up-and-down moving motor 625 fixed to the block body 610 and the front-rear movement motor 626. Accordingly, the engagement arm 612 and the collet 611 held by the engagement arm 612 also move up and down.
如圖2所示，對接合塊61進行驅動的塊驅動部65包括將塊本體610沿裝置左右方向驅動的左右移動馬達651。於左右移動馬達651的驅動軸上連接著滾珠螺桿軸651a，於塊本體610上安裝著外筒615，在該外筒扣合於滾珠螺桿軸651a的狀態下，該左右移動馬達651正反旋轉，藉此使該接合塊61沿裝置左右方向受到驅動。As shown in FIG. 2, the block drive unit 65 that drives the joint block 61 includes a left and right moving motor 651 that drives the block body 610 in the left-right direction of the apparatus. A ball screw shaft 651a is coupled to the drive shaft of the right and left moving motor 651, and an outer cylinder 615 is attached to the block body 610. The left and right moving motor 651 is rotated forward and backward in a state where the outer cylinder is engaged with the ball screw shaft 651a. Thereby, the joint block 61 is driven in the left-right direction of the apparatus.
如以上的說明所示，支撐框架80藉由一對側框架部82、83、前部梁84、及後部梁85而形成牢固的矩形的框結構，塊本體610成為支撐於前部塊導件86及後部塊導件87的兩端支撐的結構，其中前部塊導件86及後部塊導件87支撐於前部梁84及後部梁85。藉由該些結構而獲得具有高牢固性的支撐結構。於該支撐結構下藉由左右移動馬達651以進行朝向裝置左右方向(X軸方向)的驅動。此外，接合臂612由兩端受到支撐的塊本體610的臂導引部630所導引且沿裝置前後方向(Y軸方向)及上下方向(Z軸方向)受到驅動。其結果，X、Y、Z的軸方向上的移動均於牢固的支撐結構下進行。As shown in the above description, the support frame 80 forms a strong rectangular frame structure by the pair of side frame portions 82, 83, the front beam 84, and the rear beam 85, and the block body 610 is supported by the front block guide. 86 and the structure supported at both ends of the rear block guide 87, wherein the front block guide 86 and the rear block guide 87 are supported by the front beam 84 and the rear beam 85. With these structures, a support structure having high firmness is obtained. Under the support structure, the motor 651 is moved left and right to drive in the left-right direction (X-axis direction) of the apparatus. Further, the engagement arm 612 is guided by the arm guide portion 630 of the block body 610 whose both ends are supported, and is driven in the device front-rear direction (Y-axis direction) and the up-and-down direction (Z-axis direction). As a result, the movement in the axial direction of X, Y, and Z is performed under a firm support structure.
並且，裝載機20及卸載機70的匣盒移動機構71等的動作部分亦支撐於形成矩形框結構的一部分的一對側框架部82、83的外側面，因而該些動作部分所引起的振動的發生被抑制得較低。Further, the operating portions of the cassette moving mechanism 71 and the like of the loader 20 and the unloader 70 are also supported by the outer side surfaces of the pair of side frame portions 82 and 83 which form part of the rectangular frame structure, and thus the vibrations caused by the operating portions are caused. The occurrence is suppressed to a lower level.
基於上述原因，黏晶部的高加工精度得到保證。而且，基於牢固的支撐結構，避免了支撐框架80及塊本體610的厚壁化或設置多個加強肋而可實現輕量化，其結果，可達成驅動馬達的小型化。藉此，可將裝置的製造成本抑制得較低。For the above reasons, the high processing accuracy of the viscous portion is ensured. Further, based on the strong support structure, the support frame 80 and the block body 610 are prevented from being thickened or a plurality of reinforcing ribs are provided, and weight reduction can be achieved. As a result, the drive motor can be miniaturized. Thereby, the manufacturing cost of the device can be suppressed low.
於該實施形態中，左右移動馬達651於沿裝置左右方向貫穿接合塊61的重心附近的位置處，對於塊本體610朝其移動方向施加驅動力。接合塊的重心藉由塊本體610、與其結合的接合臂驅動部620、接合臂612、夾頭611等的質量部分來定位。就塊驅動部65的接合塊61的驅動位置而言，最理想的是設為沿裝置左右方向貫穿接合塊61的重心附近的位置中的任一位置。藉此，驅動時防止接合塊61的振動，且動作的順暢性提高。而且，伴隨上述的輕量化，可進行更高速且更高精度的接合加工。而且，於對重心的附近進行驅動的情況下，較理想的是設為自沿裝置左右方向貫穿接合塊61的重心的直線上的任一位置算起的接合塊61的移動距離的1/3以內，更理想的是設為1/6以內。In this embodiment, the right and left movement motor 651 applies a driving force to the block body 610 in the moving direction of the block body 610 at a position in the vicinity of the center of gravity of the joint block 61 in the left-right direction of the apparatus. The center of gravity of the joint block is positioned by the mass portion of the block body 610, the joint arm drive portion 620 coupled thereto, the joint arm 612, the chuck 611, and the like. It is preferable that the driving position of the joint block 61 of the block drive unit 65 is any one of the positions in the vicinity of the center of gravity of the joint block 61 in the left-right direction of the apparatus. Thereby, the vibration of the joint block 61 is prevented during driving, and the smoothness of the operation is improved. Further, with the above-described weight reduction, higher speed and higher precision joining processing can be performed. Further, when driving in the vicinity of the center of gravity, it is preferable to set the movement distance of the joint block 61 from any position on the straight line passing through the center of gravity of the joint block 61 in the left-right direction of the apparatus. Within the range, it is more desirable to set it to within 1/6.
如圖1所示，前後移動馬達626安裝於塊本體610的前部。如此，藉由將前後移動馬達626配置於塊本體610的前部，而如圖4所示，前後移動片622於拾取晶圓台52上的半導體晶片時，位於自前後移動馬達626算起為距離L1的附近。若將前後移動馬達626安裝於塊本體610的後部，則前後移動片622在拾取半導體晶片時位於自前後移動馬達算起為距離L2的附近。因於裝置後部配置著後段搬送機構42等，故而距離L2必需變長。另一方面，於塊本體610的前部，不安裝必需使距離L1變長的構件亦可。因此，可縮短距離L1。該前後移動馬達626伴隨著作動而發熱，該熱會傳遞至滾珠螺桿軸626a，伴隨於此滾珠螺桿軸626a會發生熱膨脹。其結果，相對於決定前後移動片622的前後位置的前後移動馬達626的旋轉數及旋轉角，會發生滾珠螺桿軸626a的熱膨脹部分的誤差。關於此，比起將前後移動馬達626設置於後部的情況下的上述距離L2，本裝置的上述距離L1明顯縮短，從而該部分的誤差減小。藉此，能以高精度對自晶圓台52拾取半導體晶片時的前後移動片622的前後位置進行控制。As shown in FIG. 1, the front and rear moving motor 626 is mounted to the front of the block body 610. Thus, by arranging the front and rear moving motor 626 on the front portion of the block body 610, as shown in FIG. 4, the front and rear moving pieces 622 are located on the semiconductor wafer on the wafer table 52, and are located from the front and rear moving motor 626. Distance to the vicinity of L1. When the front-rear moving motor 626 is attached to the rear of the block body 610, the front-rear moving piece 622 is located in the vicinity of the distance L2 from the front-rear moving motor when picking up the semiconductor wafer. Since the rear stage conveying mechanism 42 or the like is disposed at the rear of the apparatus, the distance L2 must be long. On the other hand, in the front portion of the block body 610, a member which is required to lengthen the distance L1 may not be attached. Therefore, the distance L1 can be shortened. The front and rear moving motor 626 generates heat accompanying the writing, and the heat is transmitted to the ball screw shaft 626a, and the ball screw shaft 626a thermally expands. As a result, an error in the thermal expansion portion of the ball screw shaft 626a occurs with respect to the number of rotations and the rotation angle of the front-rear movement motor 626 that determines the front-rear position of the front and rear moving pieces 622. In this regard, the above-described distance L1 of the present apparatus is significantly shortened as compared with the above-described distance L2 in the case where the front-rear moving motor 626 is disposed at the rear portion, so that the error of the portion is reduced. Thereby, the front and rear positions of the front and rear moving pieces 622 when the semiconductor wafer is picked up from the wafer stage 52 can be controlled with high precision.
另一方面，自前後移動馬達626至後段搬送機構42上的基板S為止的距離變長，只要在此狀態下，則滾珠螺桿軸626a的熱膨脹會產生大的影響。然而，當將半導體晶片放置並接合於基板S上的島嶼時，對島嶼及半導體晶片的位置進行拍攝等並藉由位置控制裝置來進行微調整，因而可避免熱膨脹的影響。當自晶圓台52拾取半導體晶片時，雖並不要求達到控制裝置的微調整所需程度的位置精度，但為了應對動作的高速化或半導體晶片的小型化，高位置精度的實現極為有利，且該前後移動馬達626的前方配置的效果高。於該情況下，前部梁84、後部梁85、兩側框架部82、83的矩形框結構及塊本體610的兩端支撐結構的牢固支撐結構會極大地有助於高精度的實現。On the other hand, the distance from the front and rear moving motor 626 to the substrate S on the rear stage conveying mechanism 42 becomes long, and in this state, the thermal expansion of the ball screw shaft 626a has a large influence. However, when the semiconductor wafer is placed and bonded to the island on the substrate S, the position of the island and the semiconductor wafer is photographed and the like, and fine adjustment is performed by the position control means, so that the influence of thermal expansion can be avoided. When the semiconductor wafer is picked up from the wafer stage 52, it is not required to achieve the positional accuracy required for the fine adjustment of the control device. However, in order to cope with the increase in the speed of operation or the miniaturization of the semiconductor wafer, the realization of high positional accuracy is extremely advantageous. Further, the effect of arranging the front side of the front and rear moving motor 626 is high. In this case, the rectangular frame structure of the front beam 84, the rear beam 85, the side frame portions 82, 83, and the solid support structure of the both end support structures of the block body 610 greatly contribute to high precision.
於黏晶部50中，按照以下的方式來將半導體晶片接合於基板上。晶圓台52支撐於後段搬送機構42的前方下部，並藉由未圖示的驅動馬達而沿X-Y軸方向驅動。在晶圓台52的中央部下方配置頂推銷(ejector pin)521。排列保持著多個半導體晶片的晶圓薄片自裝置外搬送而固定於晶圓台52上。In the die bonding portion 50, the semiconductor wafer is bonded to the substrate in the following manner. The wafer table 52 is supported by the front lower portion of the rear stage conveying mechanism 42, and is driven in the X-Y axis direction by a drive motor (not shown). An ejector pin 521 is disposed below the center portion of the wafer table 52. The wafer sheets in which a plurality of semiconductor wafers are arranged are transported from the outside of the apparatus and fixed to the wafer stage 52.
另一方面，基板於後段搬送機構42上被搬送且在應拾取的半導體晶片所對應的位置處停止。接合塊61藉由該左右移動馬達651的作動而搬送至與該些半導體晶片及基板相對應的位置為止。於該位置處藉由該前後移動馬達626的作動，在臂導引部630的導引下，使接合臂612朝前方移動並到達半導體晶片上的位置，且藉由該上下移動馬達625的作動而使接合臂612下降。而且，接合臂612的下降、夾頭611的吸引、以及頂推銷521的頂推動作同步進行，半導體晶片被吸附於夾頭611。On the other hand, the substrate is transported on the rear stage transport mechanism 42 and stopped at a position corresponding to the semiconductor wafer to be picked up. The joint block 61 is conveyed to a position corresponding to the semiconductor wafer and the substrate by the operation of the left and right moving motor 651. At this position, by the action of the front and rear moving motor 626, under the guidance of the arm guiding portion 630, the engaging arm 612 is moved forward and reaches the position on the semiconductor wafer, and the movement of the up and down moving motor 625 is performed. The engagement arm 612 is lowered. Further, the lowering of the engaging arm 612, the suction of the chuck 611, and the pushing action of the jacking pin 521 are performed in synchronization, and the semiconductor wafer is adsorbed to the chuck 611.
其次，藉由該上下移動馬達625及前後移動馬達626的作動，接合臂612上升而朝後方移動，於基板上的目標地點(島嶼)，藉由該上下移動馬達625的作動而使接合臂612下降，將被吸附於夾頭611的半導體晶片放置於島嶼上，解除吸附動作，且視需要來進行加熱，而將半導體晶片接合於基板。為了使夾頭611到達作為目標的半導體晶片及島嶼，而可適用一邊偵測對象部分的圖像一邊進行位置控制等通常的控制方法。Then, by the movement of the vertical movement motor 625 and the forward/backward movement motor 626, the engagement arm 612 is raised and moved rearward, and the engagement arm 612 is actuated by the movement of the vertical movement motor 625 at the target point (island) on the substrate. When it descends, the semiconductor wafer adsorbed by the chuck 611 is placed on the island, the adsorption operation is released, and heating is performed as needed, and the semiconductor wafer is bonded to the substrate. In order to allow the chuck 611 to reach the target semiconductor wafer and the island, a general control method such as position control while detecting the image of the target portion can be applied.
如此，藉由重複該接合臂612的上下移動及前後移動，將半導體晶片依序接合於基板的島嶼。若Y軸方向的半導體晶片列的拾取結束，則將晶圓台52沿X軸方向移動並於下一晶片列進行拾取。而且，若朝向Y軸方向的島嶼列的晶片接合結束，則驅動左右移動馬達651以使接合塊61移動並進行朝向下一島嶼列的接合。如此，一邊重複進行朝向XYZ軸方向的動作，一邊進行朝向所需的島嶼的晶片接合。In this manner, the semiconductor wafer is sequentially bonded to the island of the substrate by repeating the vertical movement and the forward and backward movement of the joint arm 612. When the pickup of the semiconductor wafer row in the Y-axis direction is completed, the wafer stage 52 is moved in the X-axis direction and picked up in the next wafer row. Then, when the wafer bonding in the island row in the Y-axis direction is completed, the right and left movement motor 651 is driven to move the bonding block 61 and perform the joining toward the next island row. In this manner, the wafer bonding to the desired island is performed while repeating the operation in the XYZ-axis direction.
朝向島嶼的晶片接合已結束的基板藉由後段搬送機構42而被朝卸載機70移送。卸載機70如圖2所示，包括上部堆疊器71、下部堆疊器72、及升降機73。藉由後段搬送機構42排出的基板收容於上部堆疊器71上的匣盒。當所需數量的基板收容於匣盒時，匣盒藉由升降機73而被朝向下部堆疊器72運送。下部堆疊器72上的匣盒藉由未圖示的搬送裝置而被朝向裝置外搬送。The substrate on which the wafer bonding to the island is completed is transferred to the unloader 70 by the rear stage transport mechanism 42. The unloader 70, as shown in FIG. 2, includes an upper stacker 71, a lower stacker 72, and an elevator 73. The substrate discharged by the rear stage conveying mechanism 42 is housed in a cassette on the upper stacker 71. When the required number of substrates are housed in the cassette, the cassette is transported toward the lower stacker 72 by the elevator 73. The cassette on the lower stacker 72 is conveyed toward the outside of the apparatus by a conveying device (not shown).
以上，已對本發明的一實施形態進行了說明，但本發明並不限定於此，只要不脫離其主旨則可進行各種變更。例如，以表示包括自匣盒逐片擠壓基板的給料器的機構來作為裝載機，但亦可採用於匣盒上藉由吸附等將積載基板朝上方提昇並搬送至前段搬送機構的機構等各種機構。而且，關於卸載機亦可同樣地採用各種機構。The embodiment of the present invention has been described above, but the present invention is not limited thereto, and various modifications can be made without departing from the spirit thereof. For example, a mechanism that includes a feeder that presses a substrate one by one from a cassette is used as a loader, but a mechanism for lifting the stacked substrate upward by suction or the like and transporting it to the front stage conveying mechanism by suction or the like may be employed. Various institutions. Further, various mechanisms can be similarly applied to the unloader.
於上述實施形態中，臂導引部630包括支撐於塊本體610的上下移動片621及前後移動片622、以及扣合於該些移動片的中間支撐體623，接合臂驅動部620包括支撐於塊本體610的上下移動馬達625及前後移動馬達626，但亦可取代該結構，臂導引部將上下移動片可上下移動地支撐於塊本體，將前後移動片可前後移動地支撐於該上下移動片。於該情況下，將上下移動馬達固定於塊本體，將前後移動馬達固定於上下移動片。或者，將前後移動片可前後移動地支撐於塊本體，將上下移動片可上下移動地支撐於該前後移動片。於該情況下，將前後移動馬達固定於塊本體，將上下移動馬達固定於前後移動片。藉此，支撐結構的牢固性雖然稍微降低，但任一情況下均可省略中間支撐體。In the above embodiment, the arm guiding portion 630 includes an upper and lower moving piece 621 and a front and rear moving piece 622 supported by the block body 610, and an intermediate supporting body 623 fastened to the moving pieces. The engaging arm driving part 620 includes a support. The block body 610 moves the motor 625 up and down and the front and rear moving motor 626. However, instead of this configuration, the arm guiding portion supports the upper and lower moving pieces so as to be movable up and down on the block body, and the front and rear moving pieces are supported on the upper and lower sides. Move the film. In this case, the up-and-down moving motor is fixed to the block body, and the front-rear moving motor is fixed to the upper and lower moving pieces. Alternatively, the front and rear moving pieces may be supported by the block body so as to be movable back and forth, and the upper and lower moving pieces may be supported by the front and rear moving pieces by moving up and down. In this case, the front and rear moving motor is fixed to the block body, and the up and down moving motor is fixed to the front and rear moving pieces. Thereby, although the firmness of the support structure is slightly lowered, the intermediate support can be omitted in either case.
於預成型部中的接合劑的供給機構、及黏晶部中的夾頭、晶圓台等的基板及半導體晶片的處理機構中，可採用通常所使用的各種機構。Various mechanisms that are generally used can be employed in the supply means of the bonding agent in the preformed portion, and in the substrate such as the chuck, the wafer table, and the semiconductor wafer in the die bonding portion.
雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
20．．．裝載機20. . . Loader
21、71、151、162．．．上部堆疊器21, 71, 151, 162. . . Upper stacker
22、72、152、161．．．下部堆疊器22, 72, 152, 161. . . Lower stacker
23、153．．．給料器23,153. . . Feeder
24、73、156、164．．．升降機24, 73, 156, 164. . . elevator
30．．．預成型部30. . . Preform
32．．．供給裝置32. . . Supply device
40．．．搬送機構40. . . Transport agency
41．．．前段搬送機構41. . . Front section conveying mechanism
42．．．後段搬送機構42. . . Rear transport mechanism
50．．．黏晶部50. . . Glue
52．．．晶圓台52. . . Wafer table
60．．．接合機構60. . . Joint mechanism
61．．．接合塊61. . . Joint block
65．．．塊驅動部65. . . Block driver
70．．．卸載機70. . . Unloader
71．．．匣盒移動機構71. . .移动 box moving mechanism
80．．．支撐框架80. . . Support frame
81．．．基台81. . . Abutment
82、83．．．側框架部82, 83. . . Side frame
84．．．前部梁84. . . Front beam
85．．．後部梁85. . . Rear beam
86．．．前部塊導件86. . . Front block guide
87．．．後部塊導件87. . . Rear block guide
110．．．基台110. . . Abutment
121．．．下部框架121. . . Lower frame
122．．．上部框架122. . . Upper frame
130．．．預成型部130. . . Preform
131、141．．．支撐框架131, 141. . . Support frame
132、142．．．作動部分132, 142. . . Actuating part
140．．．黏晶部140. . . Glue
143．．．X-Y台143. . . X-Y station
144．．．搬送機構144. . . Transport agency
150．．．裝載機150. . . Loader
154、155、163．．．支撐構件154, 155, 163. . . Support member
160．．．卸載機160. . . Unloader
411．．．前段板411. . . Front plate
412、422．．．抓爪412, 422. . . Gripper
421．．．後段板421. . . Rear panel
521．．．頂推銷521. . . Top sales
610．．．塊本體610. . . Block ontology
610a．．．中空部610a. . . Hollow part
611．．．夾頭611. . . Chuck
612．．．接合臂612. . . Joint arm
613a、613b．．．導件613a, 613b. . . Guide
615．．．外筒615. . . Outer tube
620．．．接合臂驅動部620. . . Joint arm drive
621．．．上下移動片621. . . Move the film up and down
621a、621b、623a、623b、623c、622a、622b‧‧‧線性導件621a, 621b, 623a, 623b, 623c, 622a, 622b‧‧‧ linear guides
621c‧‧‧安裝孔621c‧‧‧ mounting hole
621d、622d、622e‧‧‧導引構件621d, 622d, 622e‧‧‧ guiding members
621e、622c‧‧‧外筒621e, 622c‧‧‧ outer tube
622‧‧‧前後移動片622‧‧‧ moving film
623‧‧‧中間支撐體623‧‧‧Intermediate support
625‧‧‧上下移動馬達625‧‧‧Up and down moving motor
625a、626a、651a‧‧‧滾珠螺桿軸625a, 626a, 651a‧‧‧ ball screw shaft
626‧‧‧前後移動馬達626‧‧‧ moving motor before and after
630‧‧‧臂導引部630‧‧‧arm guide
651‧‧‧左右移動馬達Moving motor around 651‧‧
L1、L2‧‧‧距離L1, L2‧‧‧ distance
S‧‧‧基板S‧‧‧Substrate
圖1是自前方觀察到的本發明的一實施形態的半導體製造裝置的立體圖。Fig. 1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention as seen from the front.
圖2是自後方觀察到的圖1所示的半導體製造裝置的立體圖。FIG. 2 is a perspective view of the semiconductor manufacturing apparatus shown in FIG. 1 as seen from the rear.
圖3是圖1所示的半導體製造裝置的側視圖。3 is a side view of the semiconductor manufacturing apparatus shown in FIG. 1.
圖4是表示圖1所示的半導體製造裝置的接合臂的臂導引部的立體圖。4 is a perspective view showing an arm guide portion of a joint arm of the semiconductor manufacturing apparatus shown in FIG. 1.
圖5是自另一方向觀察到的圖4所示的臂導引部的一部分的立體圖。Fig. 5 is a perspective view of a portion of the arm guiding portion shown in Fig. 4 as viewed from another direction.
圖6A和圖6B是表示先前的半導體製造裝置的一例的圖，圖6A是側視圖，圖6B是正視圖。6A and 6B are views showing an example of a conventional semiconductor manufacturing apparatus, and Fig. 6A is a side view and Fig. 6B is a front view.
20．．．裝載機20. . . Loader
21．．．上部堆疊器twenty one. . . Upper stacker
22．．．下部堆疊器twenty two. . . Lower stacker
23．．．給料器twenty three. . . Feeder
24．．．升降機twenty four. . . elevator
30．．．預成型部30. . . Preform
32．．．供給裝置32. . . Supply device
40．．．搬送機構40. . . Transport agency
41．．．前段搬送機構41. . . Front section conveying mechanism
42．．．後段搬送機構42. . . Rear transport mechanism
50．．．黏晶部50. . . Glue
52．．．晶圓台52. . . Wafer table
60．．．接合機構60. . . Joint mechanism
65．．．塊驅動部65. . . Block driver
70．．．卸載機70. . . Unloader
80．．．支撐框架80. . . Support frame
81．．．基台81. . . Abutment
82、83．．．側框架部82, 83. . . Side frame
84．．．前部梁84. . . Front beam
85．．．後部梁85. . . Rear beam
411．．．前段板411. . . Front plate
412、422．．．抓爪412, 422. . . Gripper
421．．．後段板421. . . Rear panel
521．．．頂推銷521. . . Top sales
620．．．接合臂驅動部620. . . Joint arm drive
625．．．上下移動馬達625. . . Move the motor up and down
626．．．前後移動馬達626. . . Moving the motor forward and backward
651．．．左右移動馬達651. . . Moving the motor left and right
S．．．基板S. . . Substrate
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009273126A JP4897033B2 (en) | 2009-12-01 | 2009-12-01 | Semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201133660A TW201133660A (en) | 2011-10-01 |
| TWI424509B true TWI424509B (en) | 2014-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099141257A TWI424509B (en) | 2009-12-01 | 2010-11-29 | Semiconductor manufacturing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4897033B2 (en) |
| KR (1) | KR101779803B1 (en) |
| CN (1) | CN102097350B (en) |
| TW (1) | TWI424509B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976595A (en) * | 2024-04-02 | 2024-05-03 | 珠海市硅酷科技有限公司 | Die bonding device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435095A (en) * | 1990-05-31 | 1992-02-05 | Sanyo Electric Co Ltd | Component mounting device |
| JPH09232342A (en) * | 1996-02-20 | 1997-09-05 | Nec Corp | Die bonding device |
| JP2006324598A (en) * | 2005-05-20 | 2006-11-30 | Shinkawa Ltd | Chip bonding equipment |
| JP2009004557A (en) * | 2007-06-21 | 2009-01-08 | Renesas Technology Corp | Bonding device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281873B (en) * | 2007-04-06 | 2011-08-03 | 均豪精密工业股份有限公司 | Apparatus for installing semiconductor chip |
-
2009
- 2009-12-01 JP JP2009273126A patent/JP4897033B2/en active Active
-
2010
- 2010-11-26 KR KR1020100118665A patent/KR101779803B1/en active IP Right Grant
- 2010-11-29 CN CN201010568207.0A patent/CN102097350B/en active Active
- 2010-11-29 TW TW099141257A patent/TWI424509B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0435095A (en) * | 1990-05-31 | 1992-02-05 | Sanyo Electric Co Ltd | Component mounting device |
| JPH09232342A (en) * | 1996-02-20 | 1997-09-05 | Nec Corp | Die bonding device |
| JP2006324598A (en) * | 2005-05-20 | 2006-11-30 | Shinkawa Ltd | Chip bonding equipment |
| JP2009004557A (en) * | 2007-06-21 | 2009-01-08 | Renesas Technology Corp | Bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4897033B2 (en) | 2012-03-14 |
| KR101779803B1 (en) | 2017-09-19 |
| CN102097350A (en) | 2011-06-15 |
| JP2011119319A (en) | 2011-06-16 |
| KR20110061483A (en) | 2011-06-09 |
| CN102097350B (en) | 2014-09-24 |
| TW201133660A (en) | 2011-10-01 |
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