KR101779803B1

KR101779803B1 - Bonding apparatus

Info

Publication number: KR101779803B1
Application number: KR1020100118665A
Authority: KR
Inventors: 쇼지 키타무라; 테츠야 스에다; 히로시 하야시
Original assignee: 캐논 머시너리 가부시키가이샤
Priority date: 2009-12-01
Filing date: 2010-11-26
Publication date: 2017-09-19
Also published as: TWI424509B; CN102097350A; KR20110061483A; TW201133660A; CN102097350B; JP2011119319A; JP4897033B2

Abstract

[PROBLEMS] To provide a semiconductor manufacturing apparatus with high die bonding accuracy assured and low manufacturing cost.
A preform portion 30, a die bonding portion 50, an unloader 70, a support frame 80, and a semiconductor chip 80. The semiconductor chip manufacturing apparatus includes a loader 20, a preform portion 30, The supporting frame 80 has a rectangular frame structure in which a pair of side frame portions 82 and 83 are coupled by a front side beam 84 and a rear side beam 85 The loader 20 and the unloader 70 are respectively supported by the pair of side frame portions and the block body 610 supporting the bonding arm 612 is supported by the front side beam 84 and the rear side beam 85, And the bonding arm 612 is guided by the arm guide portion 630 of the block body 610 so as to be movable in the forward and backward directions (Y-axis direction) and in the vertical direction (Z-axis direction).

Description

BONDING APPARATUS

The present invention relates to a semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a substrate such as a lead frame.

In the manufacture of the semiconductor device, a loader for supplying the substrate to the processing stage for bonding the semiconductor chip to the substrate, a preform section for supplying the bonding material to a predetermined position (island) on the substrate, A die bonding section, and an unloader for sending the substrate bonded with the semiconductor chip out of the processing stage.

6A and 6B, a conventional semiconductor manufacturing apparatus includes a base 110 at the lower portion of the apparatus and a lower frame 121 rising upward from the rear of the base, And the upper frame 122. The supporting frames 131 and 141 of the preform part 130 and the die bonding part 140 are extended from the upper part of the upper frame 122 to the front side of the device in an overhanging manner, The operating portions 132 and 142 are supported by the operating portions 132 and 142, respectively.

The loader 150 for supplying the substrate includes an upper stacker 151 for loading and waiting magazines accommodating the substrates in a plurality of partitions and an elevator for feeding the substrate from the magazine on the upper stacker 151 to the preforming unit, A lower stacker 152 for receiving the substrate supply completion magazine from the elevator 156, and a feeder 153 for sucking each substrate in the magazine and supplying the substrate to the preform portion. The stackers 151 and 152 are supported on a support member 154 rising from the left end of the base 110 and the feeder 153 is supported on an upper portion of the support member 155 rising from the rear end of the base 110.

The unloader 160 for unloading the substrate after the semiconductor chips are bonded includes an elevator 164 for raising and lowering the magazine, an upper stacker 162 for setting the empty magazine to the substrate storage position, and a magazine for storing the substrate, The stacker 161 and the elevator 164 are supported on a support member 163 rising from the right end of the base 110 have. This type of semiconductor manufacturing apparatus is disclosed, for example, in Japanese Patent Laid-Open Publication No. 2008-153557.

In this type of semiconductor manufacturing apparatus, in the preform section 130, a coating apparatus is disposed in the X-axis direction (the left-right direction of the apparatus) and the Y-axis (Forward and backward direction of the apparatus) to reach a predetermined position, and at this position, the dispensing needle is moved in the Z-axis direction (up and down direction) to immerse into the junction reservoir and apply it to the substrate. In the die bonding section 140, the semiconductor chips arranged on the wafer sheet supported on the XY table 143 are lifted and placed on the substrate on the transport mechanism 144 in the rear part of the apparatus. , The Y axis direction, and the Z axis direction.

High precision is required for movement of the coating device and the collet in the X-axis direction and the Y-axis direction, and a higher precision is demanded with the recent miniaturization of the chip mounting area in the chip and the substrate. In order to assure the accuracy, the supporting structure of the operating portion is required to have high rigidity. Particularly, in the die bonding portion 140, since the distance from the XY table 143 to the substrate on the transporting mechanism is long, If necessary.

However, in the conventional semiconductor manufacturing apparatus, as described above, since the operating portion is supported by the support frame 141 extending in an overhanging shape from the support member 122 raised from the base, the bending or twisting Is likely to be deformed. In order to cope with this, the support structure parts such as the support member 122 and the support frame 141 are thickened or have a rigid structure by providing a plurality of reinforcing ribs. As a result, the weight of the supporting structure portion is increased, and accordingly, the driving motor also needs to be large-sized.

The stackers 151, 152, 161, and 162 and the feeders 153 supported on the support members 154, 155, and 163 have their respective centers of gravity elevated so that the preforms or the die- Causing the unloader to vibrate largely. Therefore, in order to suppress the vibration, the support members 154, 155 and 163 are also made rigid by thickening and many reinforcing ribs.

As a result, the manufacturing cost of the semiconductor manufacturing apparatus can not be increased. In addition, sufficient machining accuracy can not always be obtained by such roughness. Particularly, as the size of the substrate is increased in recent years, the working distance of the die bonding portion tends to become larger, which increases the vibration of the support frame and the like, making it difficult to secure the processing accuracy. For this reason, there has been a problem that the processing speed can not be limited.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a semiconductor manufacturing apparatus which guarantees a high processing accuracy in a preform portion and a die bonding portion and has a low manufacturing cost.

In order to achieve the above object, the present invention provides a semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a predetermined position of a substrate, comprising: a loader, a preform section, a die bonding section, and an unloader; And a transfer mechanism for transferring the substrate supplied from the loader to the unloader through the preform portion and the die bonding portion, wherein the support frame is supported by a base at a lower portion of the apparatus, A pair of side frame portions extending from the pair of side frame portions, a rear side beam connecting the rear side portions of the pair of side frame portions, and a front side beam connecting the top portion of the side frame portion forward of the rear side beam , The preform portion and the die bonding portion being disposed between the pair of side frame portions, the loader supplying the substrate to the preform portion, and And an unloader for receiving the substrate having the semiconductor chip mounted thereon is distributed and supported on the outer surfaces of the pair of side frame portions, and the die bonding portion is bonded to the front side beam and the rear side beam, And a block driving unit supported by the support frame to drive the bonding block. The front sub-block guide and the rear sub-block guide are supported on the front sub-beam and the rear sub-beam, respectively, A bonding arm which is supported by the block body and supports a collet for picking up a semiconductor chip at a lower end thereof; And the block body is provided with the front block guide and the rear block guide And the bonding arm is guided by the arm guide portion mounted on the block body so as to be guided by the arm driving portion in the Y axis direction and in the vertical direction And is driven in the Z-axis direction.

In the present specification and claims, the positional relationship in the semiconductor manufacturing apparatus is referred to as the front side with the wafer table and the side with the transport mechanism is referred to as the rear side.

(Effects of the Invention)

The semiconductor manufacturing apparatus according to the present invention exhibits an excellent effect with the above-described configuration, particularly the following configuration.

First, the support frame includes a pair of side frame portions extending upwardly from the left and right sides of the apparatus, a rear side beam connecting the rear side portions of the pair of side frame portions, By providing a front sub-beam that engages the top of the frame portion, a rectangular frame structure that is robust throughout the device is formed.

Further, the block body of the bonding block is supported by the front sub-block guide and the rear sub-block guide supported by the front sub-beam and the rear sub-beam, and is structured to support both ends. As a result, a significantly higher fastness than that of the conventional overhang structure is obtained, and driving in the lateral direction (X-axis direction) of the apparatus is performed under this support structure.

Further, the bonding arm is guided by the arm guide portion of the block body supported at both ends, and is driven in the front-rear direction (Y-axis direction) and the vertical direction (Z-axis direction). As a result, all axial movement of X, Y, Z is performed under a rigid support structure.

Further, since the operating portions such as the magazine moving mechanism of the loader and the unloader are also supported on the outer side surfaces of the pair of side frame portions constituting a part of the rectangular frame structure, the occurrence of vibration by these operating portions is suppressed to be low.

Based on these rectangular frame structures and both end support structures of the block body, extremely high processing accuracy in the die bonding portion is assured. In addition, since the support structure is robust in this way, the thickening of the support frame and the block body and the multiple reinforcement ribs can be avoided, and the weight can be reduced. As a result, the drive motor can be miniaturized. As a result, the manufacturing cost of the apparatus can be suppressed to a low level.

1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention, as viewed from the front.
Fig. 2 is a perspective view of the semiconductor manufacturing apparatus shown in Fig. 1 as seen from the rear side. Fig.
3 is a side view of the semiconductor manufacturing apparatus shown in Fig.
4 is a perspective view showing an arm guide portion of a bonding arm in the semiconductor manufacturing apparatus shown in Fig.
Fig. 5 is a perspective view showing a part of the arm guide portion shown in Fig. 4 as seen from another direction; Fig.
FIG. 6 is a view showing an example of a conventional semiconductor manufacturing apparatus, FIG. 6A is a side view, and FIG. 6B is a front view.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. 1 and 2 schematically show a semiconductor manufacturing apparatus according to an embodiment of the present invention. As shown, the semiconductor manufacturing apparatus includes a loader 20, a preform 30, a die bonding portion 50, an unloader 70, and a support frame (not shown) And a transport mechanism 40 for transporting the substrate S supplied from the loader 20 to the unloader 70 via the preform 30 and the die bonding portion 50. The substrate S

The support frame 80 includes a base 81 at the lower portion of the apparatus, a pair of side frame portions 82, 83 extending upward from both the left and right sides of the base, and a pair of side frames 82, A rear beam 85 and a front beam 84 for coupling the upper portion of the side frame portion ahead of the rear beam. As shown in Fig. 3, a front sub-block guide 86 and a rear sub-block guide 87, which extend in the left-right direction of the apparatus, are respectively supported on the front sub-beams 84 and the rear sub-

The transport mechanism 40 includes a front end transport mechanism 41 positioned at the preform section 30 and a rear end transport mechanism 42 positioned at the die bonding section 50. At the rear portion of the preform portion 30 and the die bonding portion 50, a support plate which is elongated in the left-right direction is disposed. The shear transport mechanism 41 includes a shear plate 411 formed of the front portion of the support plate in the substrate transport direction, a gripper 412 movably provided along the shear plate 411, and a gripper drive unit And transfers the substrate S supplied from the loader 20 to the working position of the preform section. The rear stage transport mechanism 42 includes a rear stage plate 421 constituted by the rear half portion of the support plate in the substrate transport direction, a gripper 422 provided movably along the rear stage plate 421, and a driving portion The substrate fed with the bonding agent from the preform section 30 is transferred to the die bonding section 50 and the substrate after the semiconductor chip bonding is transferred to the unloader 70. [

The preform portion 30 and the die bonding portion 50 are disposed between the pair of side frame portions 82 and 83. The loader 20 and the unloader 70 are disposed between the side frame portions 82 and 83, As shown in Fig.

The loader 20 includes an upper stacker 21 and a lower stacker 22 supported on the outer surface of the support frame 80 and capable of loading a magazine for receiving a substrate, A feeder 23 (indicated by a dot-dash line in the figure) for feeding on the shearing plate 411 and an elevator 24 for moving the magazine between the upper and lower stackers. In this embodiment, the magazine on which the substrate is loaded is conveyed from the lower stacker 22 to the upper stacker 21 by the elevator 24. The substrates stored in the magazines on the upper stacker 21 are extruded one by one by the feeder 23 into the preform 30.

The preform part (30) is provided with a supply device (32) for supplying a bonding agent to each substrate on the front end feeding mechanism (41). The substrate is gripped by the gripper 412 and is transported to the right side in Fig. 1 on the shearing plate 411 by the gripper driving unit, and stops below the supply device 32. Fig. In this position, the feeding device 32 places the bonding agent such as an adhesive or solder on the substrate S, and the substrate S on which the bonding agent is placed is transported to the die bonding section 50 by the gripper 412 do.

The die bonding section 50 includes a wafer table 52 for supporting a wafer ring to be carried in from the outside of the apparatus and a semiconductor chip on the wafer sheet supported on the wafer table And a bonding mechanism (60). The substrate S supplied with the bonding agent in the preform portion 30 is sandwiched by the gripper 422 and is transported to the right side in FIG. 1 on the rear end plate 421 by the gripper driving portion. Stop at the bottom.

The bonding mechanism 60 includes a bonding block 61 supported by the front sub beam 84 and the rear sub beam 85 and a block driving unit 65 supported by the support frame 80 to drive the bonding block 61. [ .

3, the bonding block 61 includes a block main body 610 movably supported at its front end and rear end by the front sub-block guide 86 and the rear sub-block guide 87, And a collet 611 supported by the block body 610 and driven by the bonding arm 612 so that the collet 611 is supported on the wafer table and at the rear end And a bonding arm driving unit 620 that leads to a position on the transport mechanism 42.

The block body 610 has a width for mounting an operation part necessary for bonding, and extends widely in the up-and-down direction and the back-and-forth direction so that the entire body is substantially trapezoidal. The block body 610 is guided by the front sub-block guide 86 and the rear sub-block guide 87 and driven by the block driving unit 65 in the lateral direction (X-axis direction). The bonding arm 612 is guided by the arm guide portion 630 mounted on the block body, and is driven by the arm driving portion in the front-rear direction (Y-axis direction) and the vertical direction (Z-axis direction).

Figs. 4 and 5 show a state in which the constituent parts of the arm guide portion 630 are disassembled. Fig. 4 is a view seen from the left front side, and Fig. 5 is a view seen from the right front side. As shown in the figure, the arm guide portion 630 includes a vertical moving piece 621, a back and forth moving piece 622, and an intermediate supporting body 623 interposed therebetween.

The bonding arm driving unit 620 acting in cooperation with the arm guide unit 630 includes a vertical movement motor 625 supported by the block body 610 to drive the vertical movement piece 621, And a back-and-forth moving motor 626 for driving the pieces 622.

The vertical movement piece 621 is disposed in a hollow portion 610a formed at the center of the block body 610 and linear guides 621a and 621b extending in the vertical direction are provided at both end portions, And guided in the up-and-down direction. The ball screw shaft 625a is connected to the shaft of the vertical movement motor 625 and the vertical cylinder 625 is connected to the ball screw shaft 625a with the outer cylinder 621e attached to the installation hole 621c engaged with the ball screw shaft 625a. The vertical moving piece 621 is driven in the vertical direction.

The front and rear moving pieces 622 are located near the lower right portion of the vertical moving piece 621 and linear guides 622a and 622b extending in the front and rear direction of the device are provided on the upper and lower sides of the right side, 610 in the front and rear directions of the apparatus. The ball screw shaft 626a is connected to the shaft of the back and forth moving motor 626 and the outer cylinder 622c provided on the back and forth moving piece 622 is engaged with the ball screw shaft 626a, So that the front and rear moving pieces 622 are driven in the front and rear direction of the apparatus.

The intermediate support body 623 extends in a plate shape in the vertical direction and holds the bonding arm 612 at the lower portion of the left side face. A linear guide 623a extending in the front-rear direction of the apparatus is attached to an upper portion of the left side surface of the intermediate support body 623. The linear guide 623a is engaged with the guide member 621d so that the intermediate support 623 is moved forward and backward in the forward and backward directions Direction. Linear guides 623b and 623c extending in the vertical direction are fixed to both side portions of the right side surface of the intermediate support body 623 (a surface facing a left side from the front in Fig. 5). Guide members 622d and 622e extending in the vertical direction are fixed to both sides of the left side surface of the front and rear moving piece 622 (Fig. 4), and the linear guides 623b and 623c are fixed to the guide members 622d, 622e, the intermediate support body 623 is guided in the vertical direction.

The vertical movement piece 621 is moved up and down by the operation of the vertical movement motor 625 and the front and rear movement piece 622 is moved back and forth by the operation of the back and forth movement motor 626, 623 are vertically positioned by the up-and-down moving piece 621 and the back-and-forth moving piece 622. The intermediate support body 623 can be freely moved up and down relative to the block body 610 by the up and down moving motor 625 and the back and forth moving motor 626 fixed to the block body 610. [ Accordingly, the bonding arm 612 and the collet 611 held thereon also move up and down.

2, the block driving unit 65 for driving the bonding block 61 includes a left-right moving motor 651 for driving the block body 610 in the left-right direction of the apparatus. The ball screw shaft 651a is connected to the drive shaft of the left and right movement motor 651. The outer cylinder 615 is mounted to the block body 610. The left and right movement motors 651a, 651 rotate in the forward and reverse directions, so that the bonding block 61 is driven in the lateral direction of the apparatus.

As described above, the support frame 80 forms a rectangular frame structure that is rigid by the pair of side frame portions 82, 83, the front side beam 84, and the rear side beam 85, The main body 610 has a structure of both ends supported by the front sub-block guide 86 and the rear sub-block guide 87 supported by the front sub-beams 84 and the rear sub- As a result, a support structure having high fastness is obtained. Under this support structure, driving in the left-right direction (X-axis direction) of the apparatus is performed by the left-right moving motor 651. The bonding arm 612 is guided by the arm guide portion 630 of the block body 610 supported at both ends and driven in the front-rear direction (Y-axis direction) and the vertical direction (Z-axis direction). As a result, all axial movement of X, Y, Z is performed under a rigid support structure.

The operating portions such as the magazine moving mechanism 71 of the loader 20 and the unloader 70 are also supported on the outer surfaces of the pair of side frame portions 82 and 83 forming a part of the rectangular frame structure. The occurrence of vibration due to the operating portion is suppressed to a low level.

Based on these, high machining accuracy in the die bonding portion is assured. Further, on the basis of the solid support structure, the thickening of the support frame 80 and the block body 610 and the reduction of the reinforcing ribs can be avoided, so that the weight can be reduced, and as a result, the size of the drive motor can be reduced. As a result, the manufacturing cost of the apparatus can be suppressed to a low level.

In this embodiment, the left-right moving motor 651 applies a driving force to the block body 610 in the moving direction thereof at a position passing near the center of gravity of the bonding block 61 in the left-right direction of the apparatus. The center of gravity of the bonding block is positioned according to the mass portion of the block body 610 and the bonding arm driving portion 620, the bonding arm 612, the collet 611, etc. coupled thereto. It is most preferable that the driving position of the bonding block 61 by the block driving unit 65 is any one of positions near the center of gravity of the bonding block 61 passing through in the left and right direction of the apparatus. As a result, vibration of the bonding block 61 is prevented at the time of driving, thereby improving the original activity of the operation. In addition, with the weight reduction described above, it is possible to perform bonding processing at a higher speed and with high accuracy. In addition, even if the vicinity of the center of gravity is driven, it is preferable that the center of gravity of the bonding block 61 is within 1/3 of the moving distance of the bonding block 61 from any position on the straight line passing through the apparatus in the lateral direction , 1/6 or less.

The back and forth moving motor 626 is mounted on the front portion of the block body 610 as shown in Fig. 4, when the semiconductor chip on the wafer table 52 is picked up by the front and rear moving piece 622, the front and rear moving motors 626, 622, Lt; RTI ID = 0.0 > L1. &Lt; / RTI > If the back and forth moving motor 626 is mounted on the rear portion of the block body 610, the front and rear moving pieces 622 are positioned near the distance L2 from the back and forth moving motor at the time of picking up the semiconductor chip. Since the rear end transport mechanism 42 and the like are disposed in the rear portion of the apparatus, the distance L2 must be long. On the other hand, the front portion of the block body 610 does not need to be provided with a member that can increase the distance L1. Therefore, the distance L1 can be shortened. The back and forth moving motor 626 generates heat in accordance with the operation, and the heat is transmitted to the ball screw shaft 626a, whereby the ball screw shaft 626a thermally expands. As a result, there arises an error in the thermal expansion of the ball screw shaft 626a with respect to the rotational speed and the rotational angle of the back-and-forth moving motor 626 that determines the longitudinal position of the front and rear moving piece 622. [ With respect to this, the distance L1 of the present apparatus is significantly shorter than the distance L2 when the back-and-forth moving motor 626 is provided at the rear portion, and the error is reduced accordingly. Thus, the front and rear positions of the front and rear moving pieces 622 when picking up the semiconductor chips from the wafer table 52 can be controlled with high accuracy.

On the other hand, the distance from the back-and-forth moving motor 626 to the substrate S on the rear-end transport mechanism 42 becomes long, and the thermal expansion of the ball screw shaft 626a greatly affects the state. However, when the semiconductor chips are mounted on the islands on the substrate S to be bonded, the positions of the islands and the semiconductor chips are picked up and fine adjustment is performed by the position control device, so that the influence of thermal expansion is avoided. When picking up a semiconductor chip from the wafer table 52, it is not required to provide a positional accuracy enough to require fine adjustment by a control device. However, in order to cope with high speed operation and miniaturization of a semiconductor chip, The effect of forward movement of the back and forth moving motor 626 is high. Even in such a case, the rectangular frame structure formed by the front sub beam 84, the rear sub beam 85, the two side frame portions 82, 83, and the solid support structure by the both end supporting structure of the block body 610, This contributes greatly to the realization of the plan.

In the die bonding portion 50, the semiconductor chip is bonded to the substrate in the following manner. The wafer table 52 is supported at the front lower portion of the rear stage transport mechanism 42 and is driven in the X-Y axis direction by a driving motor outside the frame. A push-up pin 521 is disposed below the central portion of the wafer table 52. The wafer sheet in which a plurality of semiconductor chips are arranged and held is conveyed from the outside of the apparatus and fixed on the table 52.

On the other hand, the substrate is transported on the rear end transport mechanism 42 to a position corresponding to the semiconductor chip to be picked up and stopped. The bonding block 61 is transported by the operation of the left-right moving motor 651 to a position corresponding to these semiconductor chips and the substrate. The bonding arm 612 is moved forward under the guidance of the arm guide portion 630 by the operation of the back and forth moving motor 626 at that position and is moved to the position on the semiconductor chip by the operation of the vertical movement motor 625 The bonding arm 612 is lowered. The lowering of the bonding arm 612, the suction of the collet 611, and the push-up operation of the push-up pin 521 are performed in synchronization with each other, so that the semiconductor chip is sucked to the collet 611.

Subsequently, the bonding arm 612 moves upward and backward by the operation of the up-and-down moving motor 625 and the back-and-forth moving motor 626, and the operation of the up-down moving motor 625 at the destination point The bonding arm 612 is lowered to place the semiconductor chip adsorbed on the collet 611 on the island, the suction operation is canceled, and heating is performed as necessary to bond the semiconductor chip to the substrate. In order to lead the collet 611 to the target semiconductor chip and the island, usual control means such as position control while detecting the image of the target portion can be applied.

In this manner, the semiconductor chip is sequentially bonded to the island of the substrate by repeating the upward and downward movement and the back and forth movement of the bonding arm 612. When the pickup of the semiconductor chip row in the Y-axis direction ends, the wafer table 52 is moved in the X-axis direction to pick up the next chip. When the chip joining to the island row in the Y-axis direction is completed, the left-right moving motor 651 is driven to move the bonding block 61 to join the island row to the next island row. In this way, the operation in the X, Y, and Z axis directions is repeated while performing chip bonding to the necessary island.

The substrate on which the chip bonding to the island has been completed is transferred to the unloader 70 by the rear end transport mechanism 42. The unloader 70 includes an upper stacker 71, a lower stacker 72, and an elevator 73 as shown in Fig. The substrate discharged by the rear end transport mechanism 42 is accommodated in the magazine on the upper stacker 71. When the necessary number of substrates are accommodated in the magazine, the magazine is sent to the lower stacker 72 by the elevator 73. The magazine on the lower stacker 72 is transported out of the apparatus by a transport device outside the city.

Although the embodiment of the present invention has been described above, the present invention is not limited thereto, and various modifications can be made without departing from the spirit of the present invention. For example, although a mechanism having a feeder for pushing a substrate one by one from a magazine as a loader has been described, various mechanisms such as a mechanism for lifting the stacked substrate up by attraction or the like to the magazine and transferring the stacked substrate to the shear transport mechanism can be employed . In addition, a variety of mechanisms can be similarly adopted for the unloader.

The arm guide portion 630 includes the vertical moving piece 621 and the back and forth moving piece 622 supported by the block body 610 and the intermediate supporting body 623 engaged with the vertical moving piece 621 and the back and forth moving piece 622, The driving unit 620 includes the up-and-down moving motor 625 and the back-and-forth moving motor 626 supported by the block body 610. Alternatively, the arm guide unit may support the block body so that the up- The up-and-down moving piece may be supported to be movable back and forth in the up-and-down moving piece. In this case, the up-and-down moving motor is fixed to the block body, and the back-and-forth moving motor is fixed to the up-down moving piece. Alternatively, the front and rear moving pieces may be supported on the block body so as to be movable back and forth, and the up and down moving pieces may be supported on the front and rear moving pieces so as to be movable up and down. In this case, the back and forth moving motor is fixed to the block body, and the up-and-down moving motor is fixed to the back and forth moving piece. By doing so, the support structure will somewhat lower the fastness, but in any case the intermediate support can be omitted.

Various mechanisms commonly used can be employed for the supply mechanism of the bonding agent in the preform portion, the substrate of the collet, the wafer table, etc., and the handling mechanism of the semiconductor chip in the die bonding portion.

20: Loader 30: Preform section
40: conveying mechanism 41: front end conveying mechanism
42: rear end transport mechanism 50: die bonding part
42: rear end transport mechanism 52: wafer table
60: bonding mechanism 61: bonding block
65: block driver 70: unloader
80: Support frame 81: Expectation
82, 83: side frame portion 84: front side beam
85: Rear beam 86: Front block guide
87: rear block guide 610: block body
611: Collet 612: Bonding arm
620: bonding arm driving part 621: vertical moving piece
622: front and rear moving piece 623: intermediate supporting body
625: a vertical movement motor 626: a back and forth movement motor
630: arm guide portion 651: left and right moving motor
S: substrate

Claims

1. A semiconductor manufacturing apparatus having a function of bonding a semiconductor chip to a predetermined position of a substrate, comprising:
A load frame, a loader, a preform section, a die bonding section, an unloader, a support frame for supporting the loader and the loader in a state in which they are arranged in the left-right direction of the apparatus, and a substrate fed from the loader, A mechanism;
The support frame includes a base at a lower portion of the apparatus, a pair of side frame portions extending upward from both the left and right sides of the base, a rear side beam coupling the rear side portions of the pair of side frame portions, And a front sub beam joining an upper portion of the side frame portion forward;
Wherein the preform part and the die bonding part are disposed between the pair of side frame parts and the unloader which receives the loader for supplying the substrate to the preform part and the substrate to which the semiconductor chip to be discharged from the die bonding part is attached, Is distributed and supported on the outer surface of the pair of side frame portions;
Wherein the die bonding unit includes a bonding block supported by the front sub-beam and the rear sub-beam, and a block driver supported by the support frame to drive the bonding block;
The front sub-block and the rear sub-beam are respectively supported on the front sub-block guide and the rear sub-block guide extending in the left-right direction of the apparatus;
The bonding block includes a block body movably supported by the front sub block guide and the rear sub block guide, a bonding arm supported by the block main body and supporting a collet for picking up a semiconductor chip at a lower end thereof, And a supported arm drive;
Wherein the block body is guided by the front sub block guide and the rear sub block guide and is driven by the block driving unit in the X axis direction which is the left and right direction of the apparatus and the bonding arm is guided by the arm guide unit mounted on the block body, And is driven in the Y-axis direction, which is the forward and backward direction of the apparatus, and the Z-axis direction, which is the vertical direction,
The arm guide section includes a vertically movable piece supported by the block body so as to be movable up and down, a back and forth moving piece supported by the block body so as to be movable back and forth, and an intermediate support body interposed between the up and down movement piece and the back and forth moving piece and; Wherein the intermediate support body is engaged with the up-and-down moving piece so as to be movable back and forth with respect to the up-and-down moving piece while vertically movably holding the bonding arm;
The arm driving part includes a vertical movement motor supported by the block body to drive the vertical movement piece in the vertical direction and a longitudinal movement motor supported by the block body to drive the longitudinal movement piece in the longitudinal direction of the device Wherein the semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus.

The method according to claim 1,
Wherein the block driving unit includes a left and right moving motor for driving the block body in the left-right direction of the apparatus, and the left-right moving motor moves the block body in the moving direction And a driving force is applied to the semiconductor wafer.

delete

3. The method according to claim 1 or 2,
Wherein the back-and-forth moving motor is mounted on a front portion of the block body.