WO2022190979A1

WO2022190979A1 - Bonding apparatus and bonding method

Info

Publication number: WO2022190979A1
Application number: PCT/JP2022/008799
Authority: WO
Inventors: 祐介久保田
Original assignee: キヤノンマシナリー株式会社
Priority date: 2021-03-12
Filing date: 2022-03-02
Publication date: 2022-09-15
Also published as: JP2022139913A

Abstract

This bonding apparatus 10 comprises a pickup position Pa of a chip C1 (C2), a bonding position Pb1 (Pb2), a delivery position Pc1 (Pc2) for the chip C1 (C2), a pickup head 14, and a bonding head 15. When a feed direction of a member 12 on which the bonding position Pb1 (Pb2) is provided is defined as the X-direction, and a direction orthogonal to the X-direction is defined as the Y-direction, the delivery positions Pc1, Pc2 are provided at a plurality of places in the X-direction so as to correspond to the plurality of bonding positions Pb1, Pb2 adjacent in the X-direction. A delivery stage 13 is provided at a delivery site, a placement part 18 on which the chip C1 (C2) can be placed is provided to the delivery stage 13, and the placement part 18 is movable in the X-direction such that the placement part 18 can be disposed at a desired delivery position from among the plurality of delivery positions Pc1, Pc2.

Description

Bonding device and bonding method

The present invention relates to a bonding apparatus and bonding method.

In the manufacture of semiconductor products, conventionally, a wafer on which a large number of semiconductor elements are collectively fabricated is diced to separate individual semiconductor chips (hereinafter simply referred to as chips), and the separated chips are separated one by one. A method of chip bonding is adopted in which the chip is bonded to a predetermined position (bonding position) of a lead frame or the like.

Conventional methods of this type include a method of transporting chips directly from a wafer to a bonding position, as well as a method of picking up chips at a pickup position and supplying them to an intermediate stage, as described in Patent Document 1 and the like. A system is known in which the chips supplied onto the intermediate stage are picked up again and supplied to the island portion of the lead frame as the bonding position.

Further, as a device for picking up a chip and transporting it to a predetermined position, as described in Patent Document 2, etc., an X movable part capable of reciprocating along the X direction in an XYZ coordinate system orthogonal to each other is used. , a driving device having a Y movable portion capable of reciprocating along the Y direction and a Z movable portion capable of reciprocating along the Z direction; Bonding machines with bonding heads with possible collets are known.

Therefore, the transfer apparatus described in Patent Document 2 and the like is applied to transfer chips between a pickup position and a predetermined position on the intermediate stage, and to transfer chips between a predetermined position on the intermediate stage and a bonding position. By doing so, it becomes possible to supply the chip to the bonding position via the intermediate stage.

Retable No. 2018/225664 Japanese Unexamined Patent Application Publication No. 2020-31078

As described above, when the chip bonding positions are set on the island portions of the lead frame, generally one chip is supplied to each island portion. On the other hand, depending on the type of semiconductor product, two chips may be supplied (mounted) per island.

As shown in FIG. 15, for example, the bonding head 115 is positioned in parallel with the two bonding positions Pb1 and Pb2 (this direction is hereinafter referred to as the X direction) by a predetermined distance. A possible method is to move only In this case, an intermediate position Pc is provided between the pickup position Pa and two bonding positions Pb1 and Pb2, and a bonding head 115 is provided between the bonding positions Pb1 and Pb2 and the intermediate position Pc. Each bonding position Pb1, Pb2 is provided at a predetermined position on the island portion 116 of the lead frame 112. As shown in FIG. These two bonding positions Pb1 and Pb2 are provided adjacent to each other in the X direction. In FIG. 15, the member denoted by reference numeral W is a wafer, the member denoted by reference numeral 111 is a wafer support, the member denoted by reference numeral 113 is an intermediate stage, the member denoted by reference numeral 114 is a pickup head. A member indicated by 117 is a transport support device for the lead frame 112 .

In this case, when supplying a chip (hereinafter referred to as a first chip C1) corresponding to the first bonding position Pb1, the first chip C1 is picked up from the wafer W by the pickup head 114 and placed on the intermediate stage. A first chip C1 is placed at a predetermined position (intermediate position Pc) on 113 . After that, the bonding head 115 picks up the first chip C1 from the intermediate position Pc, moves the bonding head 115 in the X direction and moves it in the Y direction, and moves the picked up first chip C1 to the island portion 116. It is placed on the upper first bonding position Pb1 and a predetermined bonding operation is performed.

When supplying a chip (hereinafter referred to as a second chip C2) corresponding to a second bonding position Pb2 adjacent to the first bonding position Pb1 in the X direction, as shown in FIG. A second chip C<b>2 is picked up from the wafer W by the head 114 and placed on the intermediate position Pc on the intermediate stage 113 . After that, the second chip C2 is picked up from the intermediate position Pc by the bonding head 115, and the bonding head 115 is moved in the X direction and in the Y direction while being moved in the direction opposite to that when the first chip C1 was conveyed. Then, the second chip C2 picked up is placed on the second bonding position Pb2, and a predetermined bonding operation is performed.

In this manner, by moving the bonding head 115 in the X direction and moving in the Y direction to transport the chip C1 (C2), the chip C1 (C2) is selectively moved to the desired bonding position Pb1 (Pb2). can supply. However, when a mechanism capable of moving three-dimensionally is applied to the bonding head 115, a predetermined moving speed is ensured by reducing the weight of the movable portion in the Y direction, which is the direction of high movement frequency, and the Z direction, which is the vertical direction. Due to the necessity, there is a problem that the movable part in the X direction must be structured so as to bear the weight of the movable parts in the remaining directions. In this case, the size and weight of the movement mechanism including the movable portion in the X direction are increased, so that vibrations of a size that cannot be ignored occur when the bonding head 115 is moved in the X direction. The occurrence of such vibration adversely affects the positional accuracy when supplying the chip C1 (C2) to the bonding position Pb1 (Pb2). In order to suppress this kind of vibration, it is necessary to increase the rigidity of the movement mechanism including the movable portion in the X direction, resulting in further increase in the size and weight of the movement mechanism. Since it becomes more difficult to increase the moving speed of the bonding head 115 as the size or weight increases, the transport time of the chip C1 (C2) to the bonding position Pb1 (Pb2) increases.

The above problem is not limited to the case of supplying two or more chips per island part of the lead frame. For example, when the number of bonding positions arranged in the feed direction is larger than the number of general arrays, or when chips are supplied across two island parts per feed position of the lead frame, etc., it can be done efficiently in a short time. The problems described above can occur in any process that requires chips to be fed to bonding locations.

In view of the above circumstances, the technical problem to be solved in this specification is to avoid an increase in the size of the bonding head moving mechanism, and to enable the chip to be supplied to the bonding position in a short time and with high accuracy.

The solution of the above problems is achieved by the bonding apparatus according to the present invention. That is, in this device, a delivery position serving as a delivery point of the chip is provided between a pickup position and a bonding position of the chip as a semiconductor element, and a pickup head for transporting the chip from the pickup position to the delivery position. , and a bonding head for transporting a chip from a delivery position to a bonding position, where the feeding direction of the member provided with the bonding position is the X direction, and the direction perpendicular to the X direction is the Y direction. Furthermore, the delivery positions are provided at a plurality of locations in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and a delivery stage is provided at the delivery point, and a chip can be placed on the delivery stage. A placement section is provided, and the placement section is movable in the X direction so that the placement section can be arranged at an arbitrary delivery position among a plurality of delivery positions.

Thus, in the bonding apparatus according to the present invention, a plurality of delivery positions are provided in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and a delivery stage is provided at the delivery point. A mounting portion on which a chip can be placed is provided at the , and the mounting portion can be moved in the X direction so that the mounting portion can be arranged at an arbitrary delivery position among a plurality of delivery positions. In this way, by making the mounting section movable in the X direction so that the mounting section can be arranged at an arbitrary delivery position among a plurality of delivery positions, the picked-up chip can be moved in the X direction from the bonding position to be the supply destination. It can be fed to a delivery position in approximately the same position. For example, chips are supplied to the mounting section by the pick-up head while the mounting section is arranged at a predetermined delivery position. At this point, the chip is at approximately the same position in the X direction as the corresponding bonding position, so the bonding head picks up the chip placed at the delivery position and moves it in the Y direction, thereby bonding the chip to the corresponding bonding position. position can be supplied. As described above, according to the bonding apparatus of this configuration, the chip can be transported from the delivery position to the bonding position without moving the bonding head significantly in the X direction. Therefore, the vibration applied to the chip when the chip is placed on the bonding position, particularly the vibration in the X direction, can be minimized, and the chip can be accurately supplied to the bonding position. In addition, since the delivery position can be switched by moving the mounting portion in the X direction, the chip can be transferred by conventional operations (for example, only movement in the YZ direction and correction in the X direction) without increasing the size of the bonding head. can be transported to the bonding position. Therefore, the transfer can be performed at a speed comparable to that of the conventional method, and the chips can be supplied to a plurality of bonding positions in a short time.

Further, in the bonding apparatus according to the present invention, the transfer stage may be made slidable in the X direction so that the placement section can be moved in the X direction.

By making the transfer stage slidable in the X direction as means for moving the placing section in the X direction, the placing section can be moved in the X direction with a simple structure. In addition, the sliding structure facilitates positioning in the X direction.

Further, in the bonding apparatus according to the present invention, the pick-up head may be configured to be movable in the X direction and the Y direction toward the delivery position where the placement section is arranged.

In this way, by making the pickup head movable in the X and Y directions toward the delivery position where delivery is to be performed next, chips are supplied to the desired delivery position in accordance with the switching of the delivery position by the delivery stage. can do. In addition, the movement of the pickup head in the X direction causes considerable vibration in the chips when they are supplied to the transfer position. not so big. Further, even if a predetermined amount of vibration affects the placement accuracy of the chip at the transfer position, there is no particular problem because the placement accuracy of the chip at the bonding position is not as high as that required when placing the chip at the bonding position. Therefore, chips can be supplied to the delivery position in a short time.

Further, in the bonding apparatus according to the present invention, the pickup head may be configured to move linearly from the pickup position to the delivery position by moving in the Y direction along with the movement in the X direction.

By making the pick-up head linearly movable in this way, it is possible to move the pick-up head in the state of picking up chips to the delivery position in the shortest distance while switching the delivery position. Therefore, the chips can be supplied to the delivery position in a shorter time, and the time required for a series of operations from picking up to bonding can be shortened.

Also, in the bonding apparatus according to the present invention, each of the plurality of delivery positions may be provided at the same position in the X direction as the corresponding bonding position.

By providing the transfer position in this way, the bonding head can be moved to the bonding position in the shortest distance without moving in the X direction. Therefore, it is possible to shorten the time required for a series of operations from pick-up to bonding while ensuring the positional accuracy during bonding.

Further, in the bonding apparatus according to the present invention, the island portion may be provided on the lead frame as a member on which the bonding position is provided, and the island portion may be provided with the bonding position. In that case, the X-direction center position of the island portion and the X-direction center position of the wafer on which the pickup position is provided may be set at the same position.

Thus, the present invention can be particularly preferably applied when bonding positions are provided on the island portion of the lead frame. Further, in this case, by aligning the center position of the island portion and the wafer in the X direction, the positioning of the delivery position and the bonding position can be performed using a common reference, so that the positioning can be performed easily and with high precision.

Further, when the bonding positions are provided on the island portion as described above, in the bonding apparatus according to the present invention, a plurality of bonding positions are provided for one island portion, and a plurality of bonding positions are provided at the same positions in the X direction as the respective bonding positions. A delivery location may be provided.

As described above, according to the present invention, a plurality of transfer positions can be handled by moving the pickup head in the X direction, thereby avoiding an increase in the size of the bonding head movement mechanism, and picking up chips in a short time and with high accuracy. Since it can be supplied to bonding positions, it is particularly suitable when a plurality of bonding positions are provided for one island portion and a plurality of transfer positions are provided at the same positions in the X direction as the bonding positions.

Further, the solution of the above problems is also achieved by the bonding method according to the present invention. That is, in this bonding method, a chip transfer position, which is a chip transfer point, is set between a pickup position and a bonding position of a chip as a semiconductor element, and the chip is transported from the pickup position to the transfer position by a pickup head. In a bonding method comprising a first transporting step and a second transporting step of transporting a chip from a transfer position to a bonding position by a bonding head, the feeding direction of the member provided with the bonding position is defined as the X direction and is perpendicular to the X direction. When the direction is the Y direction, the delivery positions are provided at a plurality of locations in the X direction corresponding to a plurality of bonding positions adjacent to each other in the X direction. , a mounting section on which a chip can be mounted is provided, and in the first transfer step, the mounting section is moved in the X direction to correspond to a bonding position to which the picked-up chip is to be supplied, among a plurality of delivery positions. It is characterized by arranging the placement section at the delivered position.

Thus, in the bonding method according to the present invention, a plurality of delivery positions are provided in the X direction corresponding to a plurality of bonding positions adjacent in the X direction, and the delivery stage is moved in the X direction in the first transport step. Then, the mounting portion of the delivery stage is arranged at a delivery position corresponding to the bonding position to which the picked-up chip is to be supplied, among the plurality of delivery positions. In this manner, the chip transfer positions are set at a plurality of locations in the X direction, and the transfer stage is moved in the X direction to dispose the mounting portion of the transfer stage at a predetermined transfer position corresponding to the picked up chip. Then, similarly to the bonding apparatus according to the present invention, the picked-up chip can be supplied to the transfer position which is located at substantially the same position in the X direction as the bonding position to which the chip is to be supplied. Therefore, the chip can be transported from the delivery position to the bonding position without moving the bonding head significantly in the X direction. Therefore, the vibration applied to the chip when the chip is placed on the bonding position, particularly the vibration in the X direction, can be minimized, and the chip can be accurately supplied to the bonding position. In addition, since the transfer position can be switched by moving the mounting portion in the X direction, the chip can be transported to the bonding position by conventional operations without increasing the size of the bonding head. Therefore, the transfer can be performed at a speed comparable to that of the conventional method, and the chips can be supplied to a plurality of bonding positions in a short time.

Further, in the bonding method according to the present invention, the mounting section is moved in the X direction to arrange the mounting section at the delivery position, and the pickup head is moved in the X and Y directions to move the mounting section to the mounting section. You may mount the said chip|tip.

By moving both the placement unit and the pickup head toward a common destination (desired delivery position) in this way, the supply of chips to the delivery position is completed in a shorter time. Therefore, it is possible to perform a series of operations from picking up to bonding in a shorter time.

Alternatively, in the bonding method according to the present invention, after the pick-up head is moved in the Y direction and the chip is placed on the mounting portion, the mounting portion is moved in the X direction to move the mounting portion to the delivery position. may be placed.

If the mounting section and the pickup head are moved in this manner, chips can be supplied to the mounting section without moving the pickup head in the X direction. Therefore, the chip can be supplied to the mounting portion without causing vibration in the X direction, and the positioning accuracy of the chip with respect to the mounting portion can be easily guaranteed.

As described above, according to the present invention, it is possible to avoid an increase in the size of the bonding head moving mechanism and to accurately supply chips to bonding positions in a short period of time.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the outline|summary of the bonding apparatus which concerns on 1st embodiment of this invention. It is the side view which looked at the bonding apparatus shown in FIG. 1 from the direction of arrow A. FIG. FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is picked up by a pickup head; FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which the first chip is transported to a delivery position by a pickup head; 2 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is picked up at a first transfer position by a bonding head; FIG. FIG. 4 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, in which the placement section is moved in the X direction to enable delivery of the second chip at the second delivery position; It is a top view which shows a state. FIG. 3 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a first chip is conveyed to a first bonding position by a bonding head; FIG. 4 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a second chip is picked up at a second transfer position by a bonding head; FIG. 4 is a plan view for explaining an example of a bonding method using the bonding apparatus shown in FIG. 1, and is a plan view showing a state in which a second chip is transported to a second bonding position by a bonding head; FIG. 3 is a plan view showing an overview of a bonding apparatus according to a second embodiment of the invention; FIG. 10 is a plan view for explaining another example (third embodiment of the present invention) of the bonding method using the bonding apparatus shown in FIG. is a plan view showing the trajectory of . FIG. 4 is a plan view for explaining another example (fourth embodiment of the present invention) of the bonding method using the bonding apparatus shown in FIG. It is a plan view showing the. FIG. 13 is a plan view for explaining another example (fourth embodiment of the present invention) of the bonding method using the bonding apparatus shown in FIG. 1, after the state shown in FIG. FIG. 10 is a plan view showing the trajectory of the placement section when arranging; FIG. 10 is a plan view for explaining another example (fifth embodiment of the present invention) of the bonding method using the bonding apparatus shown in FIG. FIG. 4 is a plan view showing an arrangement mode when selectively supplying chips; 1 is a plan view showing an outline of a bonding apparatus according to an invention to be compared with the present invention and an example of its use, and is a plan view showing an arrangement mode when chips are supplied to one bonding position; FIG. 16 is a plan view for explaining a usage example of a bonding method using the bonding apparatus shown in FIG. 15, and is a plan view showing an arrangement mode when chips are supplied to the other bonding position; FIG.

The content of the bonding apparatus and bonding method according to the first embodiment of the present invention will be described below based on the drawings.

FIG. 1 is a plan view showing the outline of the bonding apparatus according to the first embodiment of the present invention. This bonding apparatus 10 is an apparatus for bonding chips C1 and C2 as semiconductor elements, and as shown in FIG. a substrate 12 having a portion of a substrate 12; a transfer stage 13 disposed between the wafer support 11 and the substrate 12; a pickup head 14; and a bonding head 15. Details of each element will be described below.

The wafer support table 11 supports a wafer W composed of a plurality of chips C1 and C2, and is configured to be movable in the X and Y directions in this embodiment. Pickup positions Pa for the chips C1 and C2 are set at predetermined positions on the wafer support table 11 (see FIG. 1). A predetermined controller (not shown) can move the wafer support 11 in the X and Y directions so that the chip picked up by the pickup head 14 is placed at the pickup position Pa.

The base material 12 is, for example, a lead frame, and a plurality of bonding positions Pb1, Pb2, . . . are set on the base material 12. In this embodiment, a plurality of island portions 16 are arranged at predetermined positions on the substrate 12, and two bonding positions Pb1 and Pb2 are provided for each island portion 16. As shown in FIG. The substrate 12 configured as described above is supported by a support/conveying device 17, and configured to feed the substrate 12 by a predetermined pitch (here, the distance between the X-direction center positions of the island portions 16 adjacent in the X-direction). It is Here, the feed direction of the base material 12 coincides with the X direction. In addition, the mounting direction of the substrate 12 with respect to the supporting/conveying device 17 is set so that the first bonding position Pb1 and the second bonding position Pb2 set on each island portion 16 are adjacent to each other in the X direction. there is

The transfer stage 13 is disposed at a Y-direction intermediate position between the wafer W (wafer support table 11), which is the transfer point of the chip C1 (C2), and the base material 12 (support transfer device 17). A plurality of delivery positions Pc1 and Pc2 are alternatively set on the delivery stage 13, and each of the delivery positions Pc1 and Pc2 are aligned with the first and second bonding positions Pb1 and Pb2 adjacent in the X direction, respectively. It is set to the position corresponding to the direction. In addition, the delivery stage 13 has a mounting portion 18 at one location on the delivery stage 13 on which either the first chip C1 or the second chip C2 can be placed. The placement section 18 is configured to be movable in the X direction so as to be at the same position in the X direction as one of the first and second delivery positions Pc1 and Pc2.

In this embodiment, the delivery stage 13 is configured to be slidable in the X direction. As the delivery stage 13 slides, the mounting portion 18 on the delivery stage 13 can move in the X direction. In FIG. 1, the transfer stage 13 is arranged at a predetermined position in the X direction so that the placement unit 18 is at the same position in the X direction as the first transfer position Pc1.

Regarding the positional relationship between the pickup position Pa and the bonding positions Pb1 and Pb2, the X-direction center position of the pickup position Pa and the X-direction center position of the island portion 16 of the base material 12 on which the bonding positions Pb1 and Pb2 are provided. The X-direction positions of the delivery positions Pc1 and Pc2 are set so that the reference line L extending in the Y-direction through and passes through the X-direction intermediate position between the first delivery position Pc1 and the second delivery position Pc2. be.

The pickup head 14 has a collet 19 that can pick up the chip C1 (C2) and place it at a predetermined position. Specifically, as shown in FIG. 2, by configuring the collet 19 to be movable in the Y and Z directions, the chip C1 (C2) on the wafer support table 11 is picked up by suction or the like and picked up. The chip C1 (C2) can be supplied to the delivery position Pc1 (Pc2) on the delivery stage 13. FIG.

Any configuration (moving mechanism) can be adopted for the movement mechanism of the pickup head 14 as long as the collet 19 can be moved in the X, Y, and Z directions. In this embodiment, the movement mechanism of the pickup head 14 includes an XY stage 14a that can reciprocate in the X and Y directions by a motor (not shown), and an XY stage 14a that is supported by the XY stage 14a and moves in the Z direction by a motor (not shown). and a Z stage 14b capable of reciprocating. Of course, although not shown, the movement mechanism of the pickup head 14 includes an X stage that can be reciprocated in the X direction by a motor, a Y stage that is supported by the X stage and can be reciprocated in the Y direction by a motor, and an X stage. Alternatively, it may have a Z stage that is supported by the Y stage and can be reciprocated in the Z direction by a motor.

The bonding head 15 has a collet 20 that can pick up the chip C1 (C2) and place it at a predetermined position. Specifically, as shown in FIG. 2, by configuring the collet 20 to be movable in the Y and Z directions, the chip C1 (C2) on the delivery stage 13 is picked up by suction or the like, and the picked up chip C1 (C2) can be supplied to bonding position Pb1 (Pb2) on substrate 12 .

Here, the movement mechanism of the bonding head 15 can adopt any configuration (movement mechanism) as long as the collet 20 can be moved in the X, Y and Z directions. In this embodiment, the moving mechanism of the bonding head 15 includes an XY stage 15a that can reciprocate in the X and Y directions by a motor (not shown), and an XY stage 15a that is supported by the XY stage 15a and moves in the Z direction by a motor (not shown). and a Z stage 15b capable of reciprocating. Of course, the moving mechanism of the bonding head 15 includes, for example, an X stage that can be reciprocated in the X direction by a motor, a Y stage that is supported by the X stage and can be reciprocated in the Y direction by a motor, and an X stage. Alternatively, it may have a Z stage that is supported by the Y stage and can be reciprocated in the Z direction by a motor.

Since the required performance is different between the pickup head 14 and the bonding head 15, the movement mechanism (such as the XY stage 15a) of the bonding head 15 is made higher in rigidity than the movement mechanism (such as the XY stage 14a) of the pickup head 14. For this reason, the moving mechanism for the bonding head 15 may be made larger than the moving mechanism for the pickup head 14, as shown in FIG.

Next, an example of a bonding method using the bonding apparatus 10 configured as described above will be described mainly based on FIGS. 3 to 9. FIG.

First, as shown in FIG. 3, the pick-up head 14 is moved in the Y direction to place the collet 19 at the pick-up position Pa on the wafer support table 11 . Then, after the collet 19 is lowered to suck the chip at the pickup position Pa (the first chip C1 in this case), the collet 19 is raised to pick up the first chip C1. At this point, the placement section 18 on the transfer stage 13 is arranged at the same position in the X direction as the first transfer position Pc1.

After that, the pick-up head 14 is moved in the X direction and the Y direction, and as shown in FIG. The collet 19 is arranged at the first delivery position Pc1 corresponding to the preceding first bonding position Pb1. Then, the collet 19 is lowered to mount the first chip C1 on the mounting portion 18 arranged at the first delivery position Pc1. In the present embodiment, as indicated by the two-dot chain line in FIG. 4, by moving the pickup head 14 in the X direction and the Y direction, the collet 19 provided on the pickup head 14 and the collet 19 are moved. The first chip C1 held by the pickup position Pa is linearly moved from the pick-up position Pa toward the first delivery position Pc1.

After supplying the first chip C1 to the first delivery position Pc1 in this manner, the collet 19 of the pickup head 14 is retracted from the first delivery position Pc1, and the bonding head 15 is moved in the X and Y directions. and the collet 20 is arranged at the first delivery position Pc1 (see FIG. 5). Then, the collet 20 is lowered, and the first chip C1 is picked up by suction or the like from the mounting portion 18 arranged at the first delivery position Pc1.

After the delivery of the first chip C1 at the first delivery position Pc1 is completed in this manner, the bonding head 15 is moved in the Y direction to perform the first bonding to which the picked up first chip C1 is to be supplied. The collet 20 is arranged at the position Pb1 (see FIG. 7). Then, the collet 20 is lowered to place the first chip C1 at a predetermined position on the island portion 16 corresponding to the first bonding position Pb1, and a predetermined bonding operation is performed.

Here, in this embodiment, in parallel with the transportation of the first chip C1 from the first transfer position Pc1 to the first bonding position Pb1, the second chip C2 is transported from the pickup position Pa to the second transfer position. Carry out transportation up to Pc2. Therefore, as shown in FIG. 5, when the bonding head 15 picks up the first chip C1 at the first transfer position Pc1, the pickup head 14 picks up the second chip C2 at the pickup position Pa on the wafer W. in a state of

Therefore, from the state shown in FIG. 5, the bonding head 15 starts moving toward the first bonding position Pb1, and the pickup head 14 starts moving toward the second delivery position Pc2. At the same time, the placement section 18 of the delivery stage 13 is moved in the X direction so that the placement section 18 is placed at the same position in the X direction as the second delivery position Pc2 (see FIG. 6 for both).

With the mounting portion 18 arranged at the second delivery position Pc2 in this manner, the pickup head 14 is moved in the X and Y directions to arrange the collet 19 at the second delivery position Pc2 (see FIG. 7). ). Then, the collet 19 is lowered to mount the second chip C2 on the mounting portion 33 arranged at the second delivery position Pc2.

Thereafter, the collet 19 of the pickup head 14 is retracted from the second delivery position Pc2, and the bonding head 15 is moved in the X and Y directions to place the collet 20 at the second delivery position Pc2 (Fig. 8). Then, the collet 20 is lowered, and the second chip C2 is picked up by suction or the like from the mounting portion 18 arranged at the second delivery position Pc2.

After the delivery of the second chip C2 at the second delivery position Pc2 is completed in this way, as shown in FIG. 9, the bonding head 15 is moved in the Y direction to supply the picked-up second chip C2. The collet 20 is arranged at the second bonding position Pb2, which is the first. Then, the collet 20 is lowered to place the second chip C2 at a predetermined position on the island portion 16 corresponding to the second bonding position Pb2, and a predetermined bonding operation is performed.

Each time the base material 12 is conveyed by the supporting/conveying device 17 by the distance between the center positions of the

island portions

16, 16 adjacent in the X direction, the above operation is repeated, thereby obtaining a predetermined number of substrates 12 for the base material 12. are bonded to chips C1 and C2.

As described above, according to the bonding apparatus 10 or the bonding method according to the present invention, the placement unit 18 can be placed at any delivery position Pc1 (Pc2) among the plurality of delivery positions Pc1 and Pc2. By making the portion 18 movable in the X direction, the picked-up chip C1 (C2) can be supplied to the delivery position Pc1 (Pc2) at the same position in the X direction as the bonding position Pb1 (Pb2) as the supply destination. Therefore, according to the bonding apparatus 10 according to this configuration, the chip C1 (C2) can be transported from the delivery position Pc1 (Pc2) to the bonding position Pb1 (Pb2) without moving the bonding head 15 in the X direction. . Therefore, when the chip C1 (C2) is placed on the bonding position Pb1 (Pb2), the vibration applied to the chip C1 (C2), especially the vibration in the X direction, is minimized, and the chip C1 (C2) is accurately bonded. It becomes possible to supply to position Pb1 (Pb2). In addition, since the delivery position Pc1 (Pc2) can be switched by moving the placing section 18 in the X direction, the bonding head 15 can be moved in the conventional manner (for example, only by moving in the Y direction) without increasing the size of the bonding head 15 . Chip C1 (C2) can be transported to bonding position Pb1 (Pb2). Therefore, the transfer can be performed at a speed comparable to that of the conventional method, and the chips C1 (C2) can be supplied to a plurality of bonding positions Pb1 (Pb2) in a short time.

Further, as in the present embodiment, the delivery stage 13 is made slidable in the X direction as a means for moving the mounting section 18 in the X direction, thereby moving the mounting section 18 in the X direction with a simple structure. be able to. Further, a slide structure is preferable because positioning in the X direction can be easily performed.

Further, as in the present embodiment, the pickup head 14 can be moved in the Y direction along with the movement in the X direction, and can be linearly moved from the pickup position Pa toward one of the delivery positions Pc1 (Pc2). to move the pickup head 14 picking up the chip C1 (C2) to the corresponding delivery position Pc1 (Pc2) in the shortest distance while switching the delivery position Pc1 (Pc2). can be done. Therefore, a series of operations from picking up to bonding can be performed in a shorter time, and production efficiency can be further improved.

Further, as in this embodiment, by providing the plurality of delivery positions Pc1 and Pc2 at the same positions in the X direction as the corresponding bonding positions Pb1 and Pb2, the bonding head 15 can be completely moved in the X direction and the It can be moved to the bonding position Pb1 (Pb2) in the shortest distance. Therefore, it is possible to further shorten the time required for a series of operations from pick-up to bonding while assuring the positional accuracy at the time of bonding.

Further, in the present embodiment, the pickup head 14 retracted from the first transfer position Pc1 is moved to the pickup position Pa, and the bonding head 15 picks up the first chip C1 and the pickup head 14 picks up the second chip C1. Chip C2 was picked up at the same time (see FIGS. 4 and 5). Also, the first chip C1 picked up by the bonding head 15 is conveyed toward the first bonding position Pb1, and the second chip C2 picked up by the pickup head 14 is conveyed toward the second delivery position Pc2. In addition, the placing section 18 on the delivery stage 13 is moved from the first delivery position Pc1 toward the second delivery position Pc2 (see FIGS. 6 and 7). By simultaneously moving the pickup head 14, the bonding head 15, and the mounting portion 18 (the transfer stage 13) in this way, it is possible to supply the second chip C2 from the wafer W to the second bonding position Pb2. At least a part of the series of operations from picking up the first chip C1 from the wafer W to supplying the first chip C1 to the first bonding position Pb1 can be overlapped in terms of time. Therefore, it is possible to greatly reduce the time required for a series of operations from picking up the chips C1 and C2 to bonding, thereby further improving the working efficiency.

Although the first embodiment of the present invention has been described above, the bonding apparatus and bonding method according to the present invention can adopt configurations other than those described above without departing from the scope of the present invention.

FIG. 10 shows a plan view of the bonding apparatus 30 according to the second embodiment of the invention. This bonding apparatus 30 differs from the bonding apparatus 10 according to the first embodiment in the configuration of the transfer stage 31 . Specifically, the transfer stage 31 has a rotating shaft 32 extending in the Z direction and a mounting portion 33 . Here, the first and second transfer positions Pc1 and Pc2 are set at positions corresponding in the X direction to the first and second bonding positions Pb1 and Pb2 adjacent in the X direction, respectively, as in the first embodiment. ing. Further, the placement unit 33 provided at one location on the transfer stage 31 moves in the X direction as the transfer stage 31 rotates around the rotary shaft 32, and moves to the first transfer position Pc1 and the second transfer position Pc1. The arrangement can be switched between Pc2. In FIG. 10, the delivery stage 31 is arranged at a predetermined phase around the rotary shaft 32 so that the mounting portion 33 is at the same position in the X direction as the first delivery position Pc1.

By configuring the delivery stage 31 in this manner, the placement section 33 is also moved in the X direction to arrange the placement section 33 at either the first delivery position Pc1 or the second delivery position Pc2. be able to. Further, since the delivery stage 31 can be moved by a drive mechanism different from that of the first embodiment, the delivery stage 13 according to the first embodiment and the delivery stage 31 according to the present embodiment can be switched according to the usage environment, for example. can be used properly.

In the embodiment shown in FIGS. 1 and 10, the placement section 18 (33) is movable in the X direction so that one placement section 18 (33) can handle two delivery positions Pc1 and Pc2. Although the case where it did was illustrated, of course, you may employ|adopt a form other than this. For example, although not shown, the placement section 18 (33) may be movable in the X direction so that one placement section can handle three or more delivery positions. Alternatively, these receivers may be made movable in the X direction so that two receivers can handle three or more transfer sections. In short, the placement units may be configured to be movable in the X direction so that the number of placement units smaller than the number of delivery positions can be used.

Further, in the above-described embodiment, as shown in FIG. 4 and the like, the pickup head 14 is moved in the Y direction along with the movement in the X direction, thereby moving from the pickup position Pa toward each delivery position Pc1 (Pc2). Although the case of linear movement has been exemplified, of course, other movement forms may be adopted. FIG. 11 shows an example of a bonding method according to one example (third embodiment of the present invention). In this embodiment, in the bonding apparatus 10 shown in FIG. 1, the pick-up head 14 picking up the first chip C1 is moved in the Y direction so that the collet 19 is linearly moved from the pick-up position Pa along the reference line L. to move. After the collet 19 is moved to a predetermined position on the transfer stage 13 in the Y direction, the pickup head 14 is moved in the X direction to move the collet 19 to the first transfer position Pc1.

Alternatively, although not shown, for example, the collet 19 moves the pickup head 14 at the pickup position Pa linearly along the X direction first, and then linearly along the Y direction. The collet 19 may be moved to the first delivery position Pc1.

In the above embodiment, the pickup head 14 picking up the chip C1 (C2) is linearly moved toward the placing section 18 arranged in advance at the corresponding delivery position Pc1 (Pc2). Although exemplified (see FIG. 4 and the like), of course, the supply mode of the delivery position Pc1 (Pc2) of the chip C1 (C2) is not limited to this. 12 and 13 show an example of the bonding method according to the example (fourth embodiment of the present invention). In this embodiment, in the bonding apparatus 10 shown in FIG. 1, the pick-up head 14 picking up the first chip C1 from the pick-up position Pa is moved in the Y direction. Then, the first chip C1 is conveyed onto the mounting portion 18 which is arranged in advance such that the center position in the X direction coincides with the reference line L (see FIG. 12). After the first chip C1 is mounted on the mounting portion 18, the pickup head 14 is retracted to the wafer W side, and the transfer stage 13 is slid, for example, in the X direction, whereby the first chip C1 is mounted. The placing section 18 in the placed state is moved toward the first delivery position Pc1 (see FIG. 13). In this way, by devising the arrangement of the placing section 18, it is possible to supply each chip C1 (C2) to the corresponding delivery position Pc1 (Pc2) only by moving the pickup head 14 only in the Y direction. becomes.

In the above description, two bonding positions Pb1 and Pb2 are set for each island portion 16 provided on the substrate 12, and the corresponding chips C1 and C2 are attached to these two bonding positions Pb1 and Pb2. Although the case of selectively supplying is exemplified, of course, other forms may be adopted. FIG. 14 shows an outline of a bonding method according to one example (fifth embodiment of the present invention). In this embodiment, the bonding apparatus 10 shown in FIG. 1 is used to set the position of the substrate 12 in the X direction with respect to the reference line L so that the reference line L passes through the intermediate position between the

island portions

16, 16 that are adjacent in the X direction. It is In this case, two bonding positions (hereinafter referred to as a third bonding position Pb3 and a fourth bonding position Pb4) are set across the two

island portions

16, 16, and these third and fourth bonding positions are set. Two delivery positions (hereinafter referred to as a third delivery position Pc3 and a fourth delivery position Pc4) are set at the X direction positions of the delivery points corresponding to the bonding positions Pb3 and Pb4. In this case, the transfer stage 13 can move in the X direction and stop at a predetermined position in the X direction so that the placement unit 18 can be placed at the third and fourth transfer positions Pc3 and Pc4. .

According to the bonding method of the aspect described above, although the details are omitted, the second chip C2 picked up at the pickup position Pa on the wafer W is supplied to the corresponding third transfer position Pc3 by the pickup head 14, and The second chip C2, which has been delivered at the third delivery position Pc3 by the bonding head 15, can be supplied to the corresponding third bonding position Pb3. When the first chip C1 is picked up at the pickup position Pa on the wafer W, the pickup head 14 supplies the first chip C1 to the corresponding fourth transfer position Pc4, and the bonding head 15 supplies the first chip C1 to the corresponding fourth delivery position Pc4. The first chip C1 that has been delivered at the four delivery positions Pc4 can be supplied to the corresponding fourth bonding positions Pb4. Thus, according to the bonding apparatus or bonding method of the present invention, it is possible to deal with various types of bonding.

Also, in the above description, the case where chip bonding is performed on the island portion 16 of the base material 12 is exemplified, but the present invention can of course be applied to bonding objects other than the island portion 16 of the base material 12 .

Reference Signs List

10, 30 bonding device 11 wafer support table 12 base material 13, 31 transfer stage 14 pickup head 15 bonding head 16 island section 17 support and

transfer apparatus

18, 33 mounting

section

19, 20 collet 32 rotating shaft 111 wafer support table 112 lead frame 113 Intermediate stage 114 Pickup head 115 Bonding head 116 Island part 117 Supporting and conveying devices C1, C2 Chip L Reference line Pa Pickup positions Pb1, Pb2, Pb3, Pb4 Bonding position Pc Intermediate positions Pc1, Pc2, Pc3, Pc4 Delivery position W Wafer

Claims

a pickup head for transporting the chip from the pickup position to the transfer position; A bonding apparatus comprising a bonding head for transporting a chip from the delivery position to the bonding position,
When the feeding direction of the member on which the bonding positions are provided is the X direction, and the direction orthogonal to the X direction is the Y direction, the delivery positions are arranged in X directions corresponding to the plurality of bonding positions adjacent in the X direction. Along with being provided at multiple locations in the direction,
A delivery stage is provided at the delivery point, and the delivery stage is provided with a mounting portion on which the chip can be placed,
A bonding apparatus according to claim 1, wherein said mounting section is movable in the X direction so that said mounting section can be placed at any one of said plurality of transfer positions.
The bonding apparatus according to claim 1, wherein the transfer stage is made slidable in the X direction so that the placement section can be moved in the X direction.
The bonding apparatus according to claim 1 or 2, wherein the pick-up head is configured to be movable in the X direction and the Y direction toward the delivery position where the placement section is arranged.
The bonding apparatus according to claim 3, wherein the pick-up head is configured to be linearly movable from the pick-up position to the delivery position by moving in the Y direction along with the movement in the X direction.
The bonding apparatus according to any one of claims 1 to 4, wherein each of the plurality of delivery positions is provided at the same position in the X direction as the corresponding bonding position.
An island portion is provided on a lead frame as a member on which the bonding position is provided, and the bonding position is provided on the island portion,
6. The bonding apparatus according to claim 1, wherein the X-direction center position of the island portion and the X-direction center position of the wafer on which the pickup position is provided are set to be the same position.
7. The bonding apparatus according to claim 6, wherein two bonding positions are provided for one island portion, and two delivery positions are provided at the same positions in the X direction as the respective bonding positions.
A first transfer step of setting a delivery position as a delivery point of the chip between a pickup position and a bonding position of a chip as a semiconductor element, and transporting the chip from the pickup position to the delivery position by a pickup head. and a second transporting step of transporting the chip from the delivery position to the bonding position by a bonding head,
When the feeding direction of the member on which the bonding positions are provided is the X direction, and the direction orthogonal to the X direction is the Y direction, the delivery positions are arranged in X directions corresponding to the plurality of bonding positions adjacent in the X direction. Along with being provided at multiple locations in the direction,
A delivery stage is provided at the delivery point, the delivery stage is provided with a mounting portion on which the chip can be placed,
In the first transport step, the mounting section is moved in the X direction, and the mounting section is moved to a delivery position corresponding to the bonding position to which the picked-up chip is to be supplied, among the plurality of delivery positions. A bonding method characterized by arranging.
The mounting section is moved in the X direction to place the mounting section at the delivery position, and the pickup head is moved in the X and Y directions to mount the chip on the mounting section. The bonding method according to claim 8.
9. After the pick-up head is moved in the Y direction to place the chips on the placement section, the placement section is moved in the X direction to place the placement section at the delivery position. The bonding method described in .