JPH01273396A - Bonder for outer lead - Google Patents

Abstract

PURPOSE:To conduct continuous bonding to a plurality of semiconductor chips of a different kind by using one bonder by transferring the semiconductor chips fed by a plurality of feeders to the specified position of a printed board on a semiconductor-chip sticking stage. CONSTITUTION:A semiconductor-chip sticking stage 36 is installed in a carrying path on the stream side upper than a bonding stage 37, a plurality of feeders 7 to 11 are mounted, and a semiconductor-chip shifter shifts semiconductor chips 2 to 6 supplied by a plurality of the feeders to the predetermined positions of printed boards 1 on the semiconductor-chip sticking stage 36. Consequently, when paste is applied previously to the printed boards 1 or the semiconductor chips 2 to 6, a plurality of the semiconductor chips can be stuck at the fixed positions of the printed boards 1 in the semiconductor-chip sticking stage 37. Since the printed boards 1, at specified positions of which a plurality of the semiconductor chips of a different kind are pasted previously, are fed to the bonding stage 37, bonding is performed instantaneously.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is suitable for outer lead bonding (hereinafter abbreviated as bonding) of a plurality of semiconductor chips such as IC chips of different types to one printed circuit board. The present invention relates to an outer lead bonding device (hereinafter abbreviated as bonding device).

(Prior Art) In recent years, there are boards in which a plurality of different types of semiconductor chips are bonded to a single printed circuit board.

In this case, a bonding device equipped with one outer lead bonder (hereinafter referred to as bonder) and one semiconductor chip supply device (hereinafter referred to as supply device) is used, for example, to
When bonding chips A and B, for example, if the supply device is a carrier tape feeding type, attach the carrier tape holding IC chip A to the supply device, and adapt the bonding tool of the bonder to IC chip A. After forming the printed circuit board into a shape that will hold IC chip B, the printed circuit boards are sent to a bonding device in order, and IC chip A is bonded to all of the printed circuit boards first, and then the carrier tape of the supply device is bonded to the carrier tape holding IC chip B. After the bonding tool of the bonder was replaced with one of a shape compatible with IC chip B, the printed circuit boards were sent to the bonding machine again one after another to bond the ICC chips.

[Problem to be solved by the invention]

Of the above-mentioned bonding tool replacement work and carrier tape replacement work, the bonding tool replacement work involves bonding to one IC chip as proposed by the present inventor in Utility Model Application No. 62-68872. In this case, a versatile bonder is used that displaces the bonding tool in a horizontal plane relative to the IC chip for each bonding operation to bond a part of the IC chip in one bonding operation and bond all of the IC chip in multiple bonding operations. However, the carrier tape had to be replaced.

In addition, a supply device that supplies IC chip A and an IC chip B
It is also possible to have two supply devices, one for supplying the IC chip and one for IC chip B, efficient bonding cannot be performed unless both are provided. In other words, IC Chimp A can be bonded in one bonding stage using a versatile bonder.
, B in order, IC chip A
The supply and bonding of the IC chip B, the supply and bonding of the IC chip B must be performed in sequence, and it takes a long time for one bonding stage, which becomes an obstacle to improving the cycle time of the entire device.

The present invention aims to solve the above-mentioned problems, and is a device for constructing a bonding device that can bond a plurality of semiconductor chips of different types to a single printed circuit board extremely efficiently and improve cycle time. It is intended to be provided in a small number of formats.

[Means to solve the problem]

The present invention provides a transport path for transporting a printed circuit board to a bonding stage, and a bonding tool that is moved in a horizontal plane relative to the semiconductor chip for each bonding operation when bonding one semiconductor chip. A bonding device that includes a bonder that bonds a part with a bonding operation and then bonds the whole thing with a plurality of bonding operations, a supply device, and a semiconductor chip transfer device that transfers the semiconductor chip supplied by the supply device to a predetermined position on a printed circuit board. In the apparatus, a semiconductor chip bonding stage is provided on a conveyance path upstream of the bonding stage, a plurality of the supply devices are provided, and the semiconductor chip transfer device transfers the semiconductor chips supplied by the plurality of supply devices to the semiconductor chip. This bonding device is characterized in that it is used to transfer a printed circuit board to a predetermined position on a bonding stage.

[For production]

The bonding apparatus of the present invention is provided with a semiconductor chip pasting stage on a conveyance path upstream of the bonding stage, a plurality of supply devices, and a semiconductor chip transfer device that transfers the semiconductor chips supplied by the plurality of supply devices to the semiconductor chip. Since it is transferred to a predetermined position on the printed circuit board on the chip adhesion stage, if paste is applied to the printed circuit board or semiconductor chips in advance, multiple semiconductor chips can be transferred to the predetermined position on the printed circuit board on the semiconductor chip adhesion stage. Can be pasted.

Since the bonding stage is supplied with a printed circuit board on which a plurality of semiconductor chips of different types are already attached at predetermined positions, bonding can be performed immediately. And since it is equipped with a versatile bonder,
A single bonder can continuously bond a plurality of semiconductor chips of different types.

That is, by providing the semiconductor chip adhesion stage separately from the bonding stage, it is possible to perform continuous bonding on multiple semiconductor chips of different types using one versatile bonder in the bonding stage. .

〔Example〕

Embodiments of the present invention will be described using the drawings.

FIG. 6 shows the printed circuit board 1 with different types of IC chips 2 and 6 bonded to predetermined mounting positions.

FIG. 1.2 shows the entire bonding apparatus for attaching IC chips 2 to 6 to a printed circuit board 1.

36 is an ICC chip bonding stage (hereinafter abbreviated as bonding stage), 37 is a bonding stage, and guides are provided so that the bonding stage 36 is on the upstream side and the bonding stage 37 is on the downstream side in the conveyance path of the printed circuit board 1. rail 1
7.17 and a moving device (
(not shown) is provided. A second transfer device 18 is provided on the adhesion stage 36 and a bonder 19 is provided on the bonding stage 37 in proximity to one side of the conveyance path.

7 to 11 are IC chip supply devices (hereinafter referred to as supply devices) that supply IC chips 2 to 6 to predetermined supply positions, respectively, and a line connecting the supply positions of RC chips 12 to 6 is in the conveyance direction of the printed circuit board l ( They are arranged in the same direction as the X direction (hereinafter referred to as the X direction).

For example, the supply bag W9 is connected to a feeder 13 for the carrier tape 12 holding the IC chip 4 by its outer lead portion and an IC
Winder 1 of carrier tape 12 from which chips 4 have been taken out
4, and a cutting device consisting of a punch 15 and a die 16, which separates the IC chip 4 from the carrier tape 12 by cutting the outer lead portion at a predetermined supply position. The separated IC chip 4 is left on the punch 15 with a predetermined supply position on the punch 15. Other feeding devices 7.8.
10.11 is also formed in a similar manner, including a conveying device for a carrier tape holding each IC chip and a cutting device suitable for each IC chip.

Reference numeral 20 denotes an intermediate pedestal, which is provided between the supply device group and the conveyance path of the printed circuit board 1. Between the intermediate pedestal 20 and the supply device group, IC chips 2 to 6 are placed between the respective supply positions on the intermediate pedestal. A first transfer device 38 is provided for transferring to 20 .

The first transfer device 38, intermediate pedestal 20, and second transfer device 18 form an IC chip transfer device.

The first transfer device 38 is formed by attaching a vacuum suction tool 25 to the tip of an arm 21 that is equipped with an X-direction moving device 22 that moves in the X direction, a vertical movement device 23, and a rotation device 24 that rotates around a vertical axis. has been done.

One or more IC chip placement positions are provided on the intermediate pedestal 20. In this embodiment, there are three mounting positions 26.
27. 28, but it is also possible to provide five IC chips and determine the placement position for each IC chip. In addition, in this embodiment, they are fixedly provided, but if more than one is provided, an X-direction moving device is provided on the intermediate pedestal 20 to move the receiving position from the first transfer device 38 and the second transfer device 18. The delivery position can be set at one fixed position.

The second transfer device 18 is an I
It picks up the C chip and affixes it to the printed circuit board 1 on the adhesion stage 36, and includes an X-direction moving device 29, a Y-direction moving device W30 that moves it in a horizontal direction perpendicular to the X direction,
A vacuum suction tool 34 equipped with a rotation device 33 that rotates around a vertical axis is provided at the tip of an arm 32 equipped with a vertical movement device 31. A position detection device 35 detects the position and orientation of the IC chip on the intermediate pedestal 20.
, and from the detected position, the I of the printed circuit board 1 on the bonding stage 36, where the position of the lead has been detected in advance.
Each device should be moved so that the outer leads of the XC chip and the leads of the printed circuit board 1 are aligned with the C chip mounting position, that is, the position and orientation of the IC chip is corrected, and the IC chip is transferred, placed, and pasted. 30, 31, and 33 are controlled.

FIG. 3 shows a cross-sectional view of the bonding tool 52 of the bonder 19. The bonding tool 52 includes an X-direction moving device,
Equipped with a Y-direction moving device and a vertical movement device and one rotation device (not shown), for example, half of the required bonding part is bonded in the attitude shown by the solid line in the figure, and then the remaining part is moved to the attitude shown by the two-dot chain line. The halves are bonded.

The paste is then applied to the IC chip mounting position of the printed circuit board 1, and the printed circuit board 1 is conveyed to the pasting stage 36. IC
Assuming that the chips are installed in the order of IC chips 2, 3, 4°5.6, the IC chip 2 is placed in the mounting position 26 on the intermediate pedestal 20, and! ! The IC chip 3 is supplied to the tenth position 27, and the IC chip 4 is supplied to the mounting position 28.

The IC chip 2 is pasted onto the printed circuit board 1 on the pasting stage 36 by the second transfer device 18 . At this time, first, the position detection device 35 is moved above the R placement position 26 of the intermediate pedestal 20 to detect a shift in the position and orientation of the IC chip 2.

Next, the arm 32 is moved in accordance with the negative extraction value, and the IC chip 2 is picked up by the vacuum suction tool 34. Then, the rotating device 33 is rotated based on the misalignment of the IC chip 2 and the previously detected misalignment of the leads corresponding to the IC chip 2 on the printed circuit board 1, so that the directions of the two coincide. Move the vacuum suction tool 34 to the position where the IC chip 2 is to be attached on the printed circuit board 1, and place the IC chip 2 on the printed circuit board 1! ! place

Then, the IC chip 2 is adhered to the printed circuit board 1 on the back surface of the main body using a paste applied in advance.

The Ic chip 2 is picked up by the first transfer device 38 and placed in a supply bag by the first transfer device 38! IC chips 5 are mounted from 10 onwards.

Subsequently, similarly, the IC chips 3, 4, 5.6 are sequentially transferred to the printed circuit board 1 and attached thereto.

The printed circuit board 1 to which all the IC chips 2 to 6 have been pasted is transferred to the bonding stage 37, and the outer leads of the IC chips and the leads of the printed circuit board 1 are bonded to the bonder 19 based on the bonding position data used at the time of pasting.
Bonded by In this case, half of the bonding is performed on the IC chips 12 to 6 while maintaining the posture shown by the solid line in FIG.
The remaining bonding can be continued for IC chips 6, or the bonding can be completed for IC chips 2 to 6 one by one.

When the bonder 19 is continuously bonding the IC chips 2 to 6 at the bonding stage 37, the work of fixing the IC chips 2 to 6 to the next printed circuit board l is done in parallel at the bonding stage 36. It is being done.

In this embodiment, the IC chip transfer device is the first transfer device 3.
8. Intermediate pedestal 20. Since it is formed from the second transfer device 18, it is possible to transfer the IC chips 2 to 2 with a short transfer cycle time.
6 can be transferred and supplied onto the printed circuit board 1 from the supply devices 7 to 11.

In addition, there are three mounting positions 26, 27° 28 on the intermediate pedestal 20.
, it is convenient for one first transfer device 38 to cover a plurality of supply devices 7 to 11. For example, supply bags! 7.11, the time required to transfer the IC chips 2 and 6 onto the intermediate pedestal 20 is longer than the time required to transfer the IC chip 3.4.5, but the second transfer device 18 , 6 can be transferred.

In the above-described embodiment, the printed circuit board support member of the adhesion stage 36 is a fixed member equipped with a vertical movement device if necessary, and the second transfer device 18 moves the printed circuit board 1 leads and ICs.
Misalignment between chip and outer leads (ΔX, Δy, Δθ)
However, it is also possible to provide the printed circuit board support member of the adhesion stage 36 with an X-direction moving device, a Y-direction movement device, and a one-rotation device for the bag placement, thereby allowing the printed circuit board support member to perform the correction operation.

Furthermore, although the bonding tool 52 is provided with each moving device, all or some of the moving devices may be provided on the printed circuit board support member of the bonding stage 37. For example, by moving the printed circuit board support member of the bonding stage 37, the posture of the bonding tool 52 can be relatively displaced.

Furthermore, instead of applying the paste to the printed circuit board 1, it can also be applied to the back surface of the IC chip during the transfer process, for example.

Furthermore, it is also possible to directly transfer the IC chips 2 to 6 from the supply devices 7 to 11 using the second transfer device 18 without using the first transfer g 138 or the intermediate pedestal 20.

FIG. 4.5 shows another embodiment, which differs from the examples in FIGS. 1 and 2 in that the supply device and the first transfer device 38 are equipped with a Y-direction moving device 39. FIG.

The IC chips 2 to 6 are housed in trays 40 to 44, and each tray is transported to the supply position at a time.
Chip 3 is housed in this order.

The supply device 45 that supplies the IC chip 2
a lifting device 46 that lifts the tray 41 containing the contents to the supply height, and a descending device 47 that collects the empty tray 41.
and a device (not shown) for moving the tray 41 from the raising device 46 onto the lowering device 47. Other IC chip supply devices 48 to 51 are similarly formed.

Since the first transfer device 38 is equipped with the Y-direction moving device 39, the position of the IC chip 2 in the tray 41,
If the take-out order is determined in advance, the IC chips 2 can be taken out one by one from the tray 41 at the supply position.

When the tray 41 at the supply position is empty, the lowering device 4
7 is lowered one tray level, the empty tray 41 is moved onto the tray of the lowering device 47, and the lifting device 46 is raised one level to remove the next tray 41 containing the IC chip 2.
to the supply position.

In the embodiment shown in FIG. 1.2, an IC chip whose main body is adhered to a carrier tape so that it can be peeled off using a vacuum suction tool is also used, and in that case, a cutting device is not required.

Further, in the embodiment shown in Fig. 4.5, instead of the tray, an adhesive sheet on which a large number of IC chips are held in a releasable manner with a vacuum suction tool is used, and the supply device supplies the adhesive sheet to the supply position. You can also do that.

〔Effect of the invention〕

The bonding apparatus of the present invention includes a transport path for transporting a printed circuit board to a bonding stage, and a bonding tool that is displaced in a horizontal plane relative to the semiconductor chip for each bonding operation when bonding one semiconductor chip. The present invention includes a bonder for bonding a part in one bonding operation and bonding all the chips in multiple bonding operations, a supply device, and a semiconductor chip transfer device for transferring the semiconductor chips supplied by the supply device to a predetermined position on a printed circuit board. In the bonding apparatus, a semiconductor chip bonding stage is provided on a conveyance path upstream of the bonding stage, a plurality of the supply devices are provided, and the semiconductor chip transfer device transfers the semiconductor chips supplied by the plurality of supply devices to the Since the semiconductor chip is transferred to a predetermined position on the printed circuit board on the semiconductor chip adhesion stage, it is possible to perform continuous bonding on multiple semiconductor chips of different types using one versatile bonder on the bonding stage. can.

Therefore, it is possible to provide a bonding apparatus with a small number of constituent devices that can extremely efficiently bond a plurality of semiconductor chips of different types to one printed circuit board and improve cycle time.

[Brief explanation of the drawing]

Fig. 1 is a plan view of an embodiment of the present invention, and Fig. 2 is its r-1
Line cross-sectional side view, Figure 3 is a cross-sectional view of the bonding tool,
FIG. 4 is a plan view of another embodiment of the present invention, FIG. 5 is a left side view thereof, and FIG. 6 is a plan view of a printed circuit board. 1...Printed circuit board, 2...IC chip, 3...
IC chip, 4... IC chip, 5... IC chip, 6... IC chip, 7... Supply device, 8... Supply device, 9... Supply device, 10... Supply device, 11
... Supply device, 12... Carrier tape, 13...
・Feeding machine, 14...Scatterer, 15...Punch, 16
...Gui, 17...Guide rail, 18...Second
Transfer device, 19... Bonder, 20... Intermediate pedestal, 21... Arm, 22... X direction moving device, 23
...Vertical movement device, 24...Rotating device, 25...Vacuum suction tool, 26...i! Placement position 27... Placement position, 28...i! Placement position 29... X direction moving device, 30... Y direction moving device, 31... Vertical movement device, 32... Arm, 33... Rotating device, 34...
Vacuum suction tool, 35...Position detection device, 36...
Pasting stage, 37... Bonding stage, 38
...first transfer device, 39...Y direction movement device, 4
0... Tray, 41... Tray, 42... Tray, 43... Tray, 44... Tray, 45... Feeding device, 46... Lifting device, 47... Descending device , 4
8... Supply device, 49... Supply device, 50... Supply device, 51... Supply device, 52... Bonding tool. Figure 4 Figure 5

Claims (1)

[Claims] (1) A transport path for transporting a printed circuit board to a bonding stage, where the bonding tool is displaced in a horizontal plane relative to the semiconductor chip for each bonding operation when performing outer lead bonding on one semiconductor chip. Outer lead bonder, semiconductor chip supply equipment, which bonds part with one bonding operation and bonds all with multiple bonding operations,
In an outer lead bonding apparatus equipped with a semiconductor chip transfer device that transfers a semiconductor chip supplied by the semiconductor chip supply device to a predetermined position on a printed circuit board, a semiconductor chip adhesion stage is provided on a conveyance path upstream of the bonding stage. and a plurality of the semiconductor chip supply devices are provided, and the semiconductor chip transfer device transfers the semiconductor chips supplied by the plurality of semiconductor chip supply devices to a predetermined position on the printed circuit board of the semiconductor chip adhesion stage. An outer lead bonding device featuring: