九、發明說明： 【發明所屬之技術領域】 本發明係有關一種半導體晶片集取裝置，特別是一種可連 續傳达多個半導體晶片之半導體晶片集取裝置。 【先前技術】 Θ按1半導體科技隨著電腦與網路通訊等產品功能急速提 昇’必需具備多元化、可攜性與輕薄微小化之需求，使晶片封 裝業必須朝高功率、高密度、輕、薄與微小化等高精密度製程 發展。因此’高封裝良率及高生產速度的需求增加，為不可勿、 視的重要環節。 “ 第1_圖所示為習知半導體晶片集取裝置傳送結構方塊圖。 σ所不’半導體晶片需利用半導體作業機臺10内的吸取裳 置2〇將個別的半導體晶片逐一吸取送入加工區3。㈣ 2圖所不"及取裝置包含頂出裝置40及吸嘴50，半導體曰片 置40從膠帶70剝離 ΓΓ送入至基板80上___乍 時間。肖4域内’其來回運送的行程會浪費許多生產 刀干等體晶片因於傳送的過程令，作辈人昌& 會有微塵或猙電破壞等影響，導，=作機臺 會下降。 干导髖B日片的封裝良率可能 日日片方；生產的過程中能有效運 題之一。 因此’如何有效保護半導體 送半導體晶片亦是急需解決的問 1352397 【發明内容】 片华為取了/置決i述問題’本發明目的之-係提供-種半導體晶 多顆半導體晶片傳伊圣摔作機么肉^ 收木 遞時間。μ傳送至㈣機。内，错以縮短半導體晶片的傳 術，係藉由 峰電尊：： 有效減少半導體晶片被微塵或 靜電等因素影響’藉以提昇半導體晶片的封裝良率。\ 片率為取了装解詈=問題，本發明目的之-係提供-種半導體晶 月果取裝置，可藉由取放單元一次夕 送單元傳遞轉作齡内，料^ 導體晶片經由傳 入操作機台== ，完成之半導體晶片载 為了達到上述目的，本發明_ Jgt -i. 包含一⑽η ^實施例半導體晶片集取裝置 :=:半_離_元，藉《有==: 【實施方式】 干立第/IT!為依據本發明—實施例半導體晶片集取裝置之 Γ ;本實施例中，半導體晶片集取裝置UK)包含-取放 早兀102及-收納單元104，其中收納單元1〇4具有一容 6 , 而取放單元102連接收納單元104 ,取放單 工曰 〇 s , 取茂早疋102可褐取多個半導體晶 片至收納h W4及釋放多個半導體晶片離開收納單元似。辱 於一較佳的實施例t，容置空間為—彈央 及扣卡元件或真雜置，㈣多個半導 ’:。4 ’可配5彈箐 争體日日片固弋置放於收納單元 6 内或釋放多個半導體晶片。 〇於一較佳的實施例中，如第4圖所示，半導體晶片集取裝置2〇〇 可連接-傳送單元21〇,如此半導體晶片集取裝置獅的取放單元 2〇t可從位置P1連續操取多個半導體晶片送入收納單元204，若收 ^單元204存放一定數量的半導體晶片，則半導體晶片集取裝置2〇〇 可透過傳送單元210由位置P1從箭頭方向八移動至目標位置p2 ; 接著，半導體晶片集取裝置（標號為2〇〇，）的取放單元2〇2可於位 置P2連續釋放多個半導體晶片，以置放多個半導體晶片。 曰於一較佳的實施例中，如第5圖所示，切割完成之半導體 晶片10a於膠帶12a上，且放置於黏晶機臺（圖中未示）上之載 入位置（loadposition)時，半導體晶片1〇a可藉由頂出裝置31〇 將半導體晶片1 〇a頂起並剝離於膠帶J 2a上，再經由半導體晶 片集取裝置300的取放單元302連續擷取膠帶12a上的多個半 導體晶片10a至收納單元304内，待半導體晶片集取裝置3〇〇 擷取一定數量的半導體晶片l〇b經由傳送單元32〇從箭頭方向B 直接傳送半導體晶片集取裝置（標號為3〇〇，）至黏晶機臺的載 板330上’接著，半導體晶片集取裝置3〇〇，的取放單元3〇2，會 將收納單元304’的半導體晶片i〇c置放於基板330上以進行連 續上片的動作》 第6圖所示為依據第5圖半導體晶片集取裝置之示意圖。 半導體晶片集取裝置400 ' 410可結合履帶42〇、430及承載艮 盒（loadingmagazine)44〇傳遞多個半導體晶片（2如至2〇〇，其 中半導體晶片20a可藉由頂出裝置450將半導體晶片20a頂起 並剝離於膠帶40a上’半導體晶片2〇a經由取放單元402連續 取出半導體晶片20a並置放於收納單元4〇4，若收納單元4〇4内已 容納一定數量的半導體晶片20b後，半導體晶片集取裝置4〇〇 會透過傳送單元(圖中未示)運送至履帶420處；然後，半導體晶片集 1352397 取裝置400的取放單元402可置放多個半導 420上，進而將多個半導體晶片20c往箭頭方向c 440 内。IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a semiconductor wafer stacking device, and more particularly to a semiconductor wafer stacking device that can continuously convey a plurality of semiconductor wafers. [Prior Art] 半导体1 semiconductor technology with the rapid development of products such as computer and network communication, 'the need for diversification, portability and thin and light, so that the chip packaging industry must be high-power, high-density, light High-precision processes such as thin and miniaturization. Therefore, the demand for high packaging yield and high production speed is an important part of the situation. Fig. 1 is a block diagram showing the transmission structure of a conventional semiconductor wafer stacking device. The semiconductor wafer needs to be sucked and processed one by one by using the suction strips in the semiconductor working machine 10. Zone 3. (4) The figure 2 does not include the ejector unit 40 and the nozzle 50, and the semiconductor chip 40 is peeled off from the tape 70 and fed onto the substrate 80. ___乍 time. The trip back and forth will waste a lot of production of the knife and other body wafers due to the process of transmission. As a result, there will be dust or electric damage, etc., and the machine will drop. The package yield of the film may be in the form of a daily film; one of the effective processes in the production process. Therefore, 'how to effectively protect the semiconductor to send the semiconductor wafer is also an urgent need to solve the problem 1352397 [Invention content] slice Huawei took / set i The problem of the present invention is to provide a semiconductor wafer with a plurality of semiconductor wafers, and to transfer the wood delivery time. The μ is transmitted to the (four) machine. The error is to shorten the transmission of the semiconductor wafer. By Feng Dian:: Yes Reducing the influence of factors such as dust or static electricity on the semiconductor wafer 'to improve the packaging yield of the semiconductor wafer. \ The film rate is taken as the solution 问题 = problem, the object of the present invention is to provide a semiconductor crystal moon fruit picking device, which can be borrowed The semiconductor wafer is loaded by the pick-and-place unit, and the semiconductor wafer is loaded via the incoming operation machine ==, in order to achieve the above object, the present invention _ Jgt -i. includes one (10) η ^ embodiment Semiconductor wafer stacking device: =: semi-___, by "Yes ==: [Embodiment] Drying / IT! According to the invention - an embodiment of the semiconductor wafer stacking device; in this embodiment, The semiconductor wafer stacking device UK) includes a pick-and-place tray 102 and a storage unit 104, wherein the storage unit 1〇4 has a capacity 6, and the pick-and-place unit 102 is connected to the storage unit 104, and the simplex 曰〇s is taken. The Maochen 102 can brown a plurality of semiconductor wafers to accommodate the h W4 and release a plurality of semiconductor wafers away from the storage unit. In a preferred embodiment t, the accommodation space is - the spring and the buckle component or the real miscellaneous Set, (four) multiple semi-conducting ':. 4' can be matched 5 The magazine is placed in the storage unit 6 or released a plurality of semiconductor wafers. In a preferred embodiment, as shown in FIG. 4, the semiconductor wafer stacking device 2 The connection-transfer unit 21〇, such that the semiconductor wafer stacking device lion pick-and-place unit 2〇t can continuously take a plurality of semiconductor wafers into the storage unit 204 from the position P1, and if the receiving unit 204 stores a certain number of semiconductor wafers, Then, the semiconductor wafer stacking device 2 can be moved from the arrow direction eight to the target position p2 through the transfer unit 210; then, the pick-and-place unit 2〇2 of the semiconductor wafer stacking device (labeled 2〇〇) can be A plurality of semiconductor wafers are continuously released at a position P2 to place a plurality of semiconductor wafers. In a preferred embodiment, as shown in FIG. 5, the completed semiconductor wafer 10a is placed on the tape 12a and placed on a load position on a die attaching machine (not shown). The semiconductor wafer 1A can be lifted and detached from the tape J 2a by the ejector device 31, and then continuously picked up on the tape 12a via the pick-and-place unit 302 of the semiconductor wafer concentrating device 300. In the plurality of semiconductor wafers 10a to the storage unit 304, the semiconductor wafer stacking device 3 picks up a certain number of semiconductor wafers 10b and directly transfers the semiconductor wafer stacking device from the arrow direction B via the transfer unit 32 (labeled 3). 〇〇,) onto the carrier 330 of the die bonding machine. 'Next, the pick-and-place unit 3〇2 of the semiconductor wafer collecting device 3〇〇 places the semiconductor wafer i〇c of the receiving unit 304' on the substrate. The operation of the continuous wafer on 330 is shown in Fig. 6 is a schematic diagram of the semiconductor wafer stacking device according to Fig. 5. The semiconductor wafer stacking device 400' 410 can transfer a plurality of semiconductor wafers (2 to 2) in conjunction with the tracks 42A, 430 and a loading magazine 44, wherein the semiconductor wafer 20a can be semiconductor by the ejector device 450 The wafer 20a is lifted up and peeled off on the tape 40a. The semiconductor wafer 2A is continuously taken out of the semiconductor wafer 20a via the pick-and-place unit 402 and placed in the storage unit 4〇4. If the storage unit 4〇4 has accommodated a certain number of semiconductor wafers 20b, Thereafter, the semiconductor wafer stacking device 4 is transported to the crawler belt 420 through a transfer unit (not shown); then, the pick-and-place unit 402 of the semiconductor wafer set 1352397 picking device 400 can be placed on the plurality of semiconductor guides 420. Further, the plurality of semiconductor wafers 20c are directed in the arrow direction c 440.
接下來，承載ϋ盒440可連續送出半導體晶片2〇d至 430,如此履帶430上的半導體晶片20e會由箭頭方向〇移動，: 半導體晶片20e傳送至接近半導體晶片集取裝置41〇的區域 時’其半導體晶片集取裝置410之取放單元412會操取 430上的半導體晶片20e並送入收納單元414,待收集預定數θ 半導體晶片20f後，半導體晶片集取裝置410會透過5送二元二， 至基板450,再藉由取放單元412將收納單元414内的半導體晶= 20f釋出並置放於基板450上以進行黏晶作業。因此，切割完成^ 導體晶片需送至距離取放單元較遠的半導體作業機臺時，本發 明可減少半導體晶片載入或載出（l〇ad/unl〇ad)的時間。Next, the carrier cassette 440 can continuously feed the semiconductor wafers 2d to 430 such that the semiconductor wafer 20e on the track 430 is moved by the arrow direction: when the semiconductor wafer 20e is transferred to the area close to the semiconductor wafer collection device 41? The pick-and-place unit 412 of the semiconductor wafer stacking device 410 reads the semiconductor wafer 20e on the 430 and feeds it into the storage unit 414. After the predetermined number θ of the semiconductor wafer 20f is collected, the semiconductor wafer stacking device 410 transmits 5 to 2 Second, to the substrate 450, the semiconductor crystal 20f in the storage unit 414 is released by the pick-and-place unit 412 and placed on the substrate 450 to perform a die bonding operation. Therefore, the present invention can reduce the time during which the semiconductor wafer is loaded or unloaded (d〇ad/unl〇ad) when the wafer is to be transferred to a semiconductor work machine that is far from the pick-and-place unit.
體晶片20c於履帶 移動送至承載匣盒 此外，另一較佳的實施例中，半導體晶片集取裝置更可連 接夕個作業機台，藉以實現可同時傳送分配多個半導體晶片至 不同的作業機台，例如，操作者可依生產需求同時將半^體晶 ^送至晶片黏著機、晶片打線機或晶片挑選機，藉以増加實: 接續上述，本發明之半導體晶片集取裝置適用於晶片黏著 機一、一晶片打線機或一晶片挑選機等半導體作業機台，而; 單7L係為—履帶傳輸單元、導轨或機械手臂等傳輸裝置。、 於—較佳的實施例中，半導體晶片集取裝置更可連接押制 元，其係可為電腦或可程式控制器，以控制傳送模組，操^者 ，定作動順序 '運送路徑及其位置。於另一較佳的實施例中，半導體 晶片集取裝1更包含—靜電消除裝置或採用抗靜電的材質 以防止半導體晶片於輸送中產生靜電破壞的現象。 ㈢ 第7圖所示為依據本發明一實施例半導體晶片集取裝置之 8 ^52397 示意圖。半導體晶片集取裝置之收納單元綱為與取放單 分離右收納單元5(34存放一定數f的半導體晶片3〇a後，則 將收=54=取放單元5G2脫離，獨自藉由傳送單元_ 號為5〇4，)可與另 运至位置P4,如此位置P4的收納單元(標 加實用性。 早元506結合’釋放半導體晶片30a，以增 納單元的配^半導體晶片集取裝置係藉由取放單元及收 體晶片集取裝置傳遞=集多顆半導體並藉由傳送單元將半導 晶片傳遞時間；再者°、作機台的加卫區内，藉以縮短半導體 晶片被微塵或靜電I導體Β曰片集取裝置可有效減少半導體 率。场電等因素影響，藉以提昇半導體晶片的封裝良 點 ，其目的:二Ί例僅係為說明本發明之技術思想及特 據以實施，當不ft $技#之人士能夠瞭解本發明之内容並 明所揭示之精神二之限定本發明之專利範 圍’即大凡依本發 專利範圍‘ 之均等變化或修娜 ’仍應涵蓋在本發明之The body wafer 20c is transported to the carrier cassette in the track. In another preferred embodiment, the semiconductor wafer stacking device can be connected to the work machine, thereby enabling simultaneous transfer of a plurality of semiconductor wafers to different jobs. The machine, for example, the operator can simultaneously send the semiconductor wafer to the wafer bonding machine, the wafer bonding machine or the wafer sorting machine according to the production requirements, thereby adding the following: The semiconductor wafer collecting device of the present invention is suitable for the wafer. A semiconductor operation machine such as an adhesive machine, a wafer wire machine or a wafer selection machine; and a single 7L system is a transmission device such as a track transmission unit, a guide rail or a robot arm. In a preferred embodiment, the semiconductor wafer stacking device can be connected to a tamper element, which can be a computer or a programmable controller to control the transfer module, the operator, and the order of the delivery path. Its location. In another preferred embodiment, the semiconductor wafer stacking device 1 further comprises an electrostatic eliminating device or an antistatic material to prevent electrostatic breakdown of the semiconductor wafer during transport. (3) Fig. 7 is a view showing an 8^52397 of a semiconductor wafer stacking apparatus according to an embodiment of the present invention. The storage unit of the semiconductor wafer stacking device separates the right storage unit 5 from the pick-and-place unit (34) after storing a certain number f of semiconductor wafers 3a, the receiving unit 54 is removed from the pick-and-place unit 5G2, and the transfer unit is used alone. _ No. 5〇4,) can be transported to the position P4, such a position P4 storage unit (additive utility. Early 506 combined with 'release semiconductor wafer 30a, to add semiconductor unit semiconductor wafer collection device The semiconductor wafer is dusted by the transfer unit and the wafer stacking device to transfer a plurality of semiconductors and transfer the semiconductor wafers through the transfer unit; Or the electrostatic I-conductor chip collecting device can effectively reduce the semiconductor rate, and the influence of the field power and the like, thereby improving the packaging of the semiconductor wafer. The purpose of the second embodiment is merely to explain the technical idea and the special feature of the present invention. The implementation of the present invention is not limited to the scope of the present invention and the scope of the invention is limited to the scope of the invention. This hair Mingzhi
9 1352397 , 【圖式簡單說明】 , 第1圖所示為習知半導體晶片集取裝置傳送結構方塊圖。 ' 第2圖所示為另一習知半導體晶片集取裝置傳送結構圖。 第3圖所示為依據本發明一實施例半導體晶片集取裝置之 示意圖。 第4圖所示為依據本發明另一實施例半導體晶片集取裝置 之示意圖。 • 第5圖所示為依據本發明又一實施例半導體晶片集取裝置 之示意圖。 第6圖所示為依據本發明再一實施例半導體晶片集取裝置 之示意圖。 第7圖所示為依據本發明一實施例半導體晶片集取裝置之 示意圖。 【主要元件符號說明】 10 半導體作業機臺 20 吸取裝置 30 加工區 40、310、450 頂出裝置 50 吸嘴 10a ' 10b ' 10c 半導體晶片 20a〜20f、 30a 半導體晶片 60 半導體晶片 10 13523979 1352397, [Simple description of the drawing], Fig. 1 is a block diagram showing the transmission structure of the conventional semiconductor wafer collecting device. Figure 2 is a diagram showing the transfer structure of another conventional semiconductor wafer stacking device. Fig. 3 is a view showing a semiconductor wafer stacking apparatus according to an embodiment of the present invention. Fig. 4 is a view showing a semiconductor wafer stacking apparatus according to another embodiment of the present invention. Figure 5 is a schematic illustration of a semiconductor wafer stacking device in accordance with yet another embodiment of the present invention. Fig. 6 is a view showing a semiconductor wafer collecting apparatus according to still another embodiment of the present invention. Fig. 7 is a view showing a semiconductor wafer stacking apparatus according to an embodiment of the present invention. [Main component symbol description] 10 Semiconductor work machine 20 Suction device 30 Processing area 40, 310, 450 Ejecting device 50 Nozzle 10a ' 10b ' 10c Semiconductor wafer 20a to 20f, 30a Semiconductor wafer 60 Semiconductor wafer 10 1352397
40a、70 80 100 200 、 200， 300 、 300， 400 、 410 、 500 102 ' 202 ' 302 ' 3025 402、412 ' 502、506 104 、 204 304 、 304， 404 、 414 504 、 504， 106 210 、 320 、 600 330 、 450 420 、 430 440 PI、P2、P3、P4 膠帶 基板 半導體晶片集取裝置 半導體晶片集取裝置 半導體晶片集取裝置 半導體晶片集取裝置 取放單元 取放單元 收納單元 收納單元 收納單元 收納單元 容置空間 傳送單元 基板 履帶 承載匣盒 位置40a, 70 80 100 200, 200, 300, 300, 400, 410, 500 102 '202 '302 ' 3025 402, 412 ' 502, 506 104 , 204 304 , 304 , 404 , 414 504 , 504 , 106 210 , 320 600 330 , 450 420 , 430 440 PI, P2, P3, P4 tape substrate semiconductor wafer stacking device semiconductor wafer stacking device semiconductor wafer stacking device semiconductor wafer stacking device pick and place unit pick and place unit storage unit storage unit storage unit Storage unit accommodation space transfer unit substrate crawler carrying cassette position
A、BA, B
C、DC, D
E 半導體晶片集取裝置移動方向 半導體晶片移動方向 收納單元移動方向 11E Semiconductor wafer stacking device moving direction Semiconductor wafer moving direction Storage unit moving direction 11