CN107225700A - The operating method of package substrate - Google Patents

The operating method of package substrate Download PDF

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Publication number
CN107225700A
CN107225700A CN201710168600.2A CN201710168600A CN107225700A CN 107225700 A CN107225700 A CN 107225700A CN 201710168600 A CN201710168600 A CN 201710168600A CN 107225700 A CN107225700 A CN 107225700A
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CN
China
Prior art keywords
chip
package substrate
collecting pallet
accommodated
incorporating section
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Pending
Application number
CN201710168600.2A
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Chinese (zh)
Inventor
石井茂
马桥隆之
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Disco Corp
Original Assignee
Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN107225700A publication Critical patent/CN107225700A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A kind of operating method of package substrate is provided, shortens the storage time being accommodated in the chip after singualtion in collecting pallet, and suppresses to implement the maximization of the processing unit of subsequent treatment.The standard-sized package substrate (W) for being several times as much as to be accommodated in collecting pallet (50) is divided into each chip (C) and assigns to the operating method of the package substrate stored in multiple collecting pallets and is configured to the steps：The step of being split along segmentation preset lines to package substrate and be divided into multiple chips；Attracting holding is uniformly carried out to the chip of the number that can be accommodated in collecting pallet in whole chips after the segmentation of package substrate using chip transfer pad (45) and the step in collecting pallet is accommodated in；And the step of transported to the collecting pallet for being accommodated with multiple chips.

Description

The operating method of package substrate
Technical field
The present invention relates to the operating method for the package substrate for being divided into each chip.
Background technology
The electronic equipments such as mobile phone, personal computer pursue lightweight, miniaturization, the encapsulation on semiconductor devices Develop and be referred to as CSP (Chip Size Package：Chip size packages) can realize the encapsulation technology of miniaturization.With Past, as the operating method after the segmentation of the package substrates such as csp substrate, the known chip to after segmentation carries out individually operated side Method (for example, referring to patent document 1).In the operating method described in patent document 1, cutting tool is being utilized by package substrate It is divided into each chip (pellet：Pellet) after, chip is picked up one by one and held in the palm from keeping workbench to be accommodated in conveyance In disk.
Patent document 1：Japanese Unexamined Patent Publication 2000-150427 publications
But, in the operating method described in patent document 1, due to independent pickup chip, so until will be whole Chip, which is accommodated in collecting pallet, to be needed for quite a long time.It is inferred to from now on when the acquisition quantity of chip is with package substrate When maximizing and increasing, required time chip being accommodated in collecting pallet can be further elongated.And then, in package substrate In the case that size is the substrate greatly that diagonal has exceeded 450mm, 600mm, exist after implementing to the package substrate after segmentation The problem of each processing unit of continuous processing also has to maximization.
The content of the invention
The present invention be in view of the point and complete, its object is to provide a kind of operating method of package substrate, can contract The short chip by after singualtion is accommodated in the storage time in collecting pallet, and suppresses to implement the processing unit of subsequent treatment Maximization.
The operating method of the package substrate of the present invention, the package substrate for being formed with a plurality of segmentation preset lines is divided into multiple Chip is simultaneously accommodated in the collecting pallet with defined profile, and the collecting pallet possesses chip incorporating section and is disposed in the chip Bonding piece in incorporating section, the operating method of the package substrate is characterised by, with the steps：Segmentation step, along Size package substrate bigger than the profile of the standard of the collecting pallet is divided into multiple chips by the segmentation preset lines；It is unified Bonding step, after the segmentation step is implemented, the chip that can be accommodated in whole chips of the package substrate is received The chip attracting holding for the number received in portion is pressed against the core on size chip transfer pad corresponding with the chip incorporating section On the adhesive surface of the bonding piece of piece incorporating section, so that multiple chips of a part are uniformly bonded on the adhesive surface；And Step is transported, is being implemented after this unifies bonding step, multiple cores to being bonded with the part in the chip incorporating section The collecting pallet of piece is transported.
According to the structure, by chip transfer pad to chip incorporating section can be accommodated in whole chips of package substrate In the chip of number carry out attracting holding, and multiple chips are uniformly bonded on the adhesive surface of chip incorporating section.Due to inciting somebody to action Whole chips of package substrate are divided into be accommodated in collecting pallet for several times and uniformly, so with chip is accommodated in one by one Structure in collecting pallet, which is compared, can significantly shorten the storage time.Also, it is many due to whole chips of package substrate being assigned to Transported in individual collecting pallet to follow-up processing unit, so in the case that package substrate is a substrate greatly, also not Need to make the size of follow-up processing unit and package substrate matchingly to maximize.So, the energy before the segmentation of package substrate It is enough to increase the acquisition quantity of chip by increasing substrate size, and can be assigned to outside defined after the segmentation of package substrate Transported in the transport tray of shape, thus, it is possible to suppress the influence to existing production line.
According to the present invention, it is accommodated in for several times and uniformly in collecting pallet by the way that whole chips of package substrate are divided into, The storage time being accommodated in the chip after singualtion in collecting pallet can be shortened, and suppress to implement the processing of subsequent treatment The maximization of device.
Brief description of the drawings
Fig. 1 is the stereogram of the topping machanism of present embodiment.
Fig. 2 is the figure of the operating method for the package substrate for showing comparative example.
Fig. 3 is the figure of one of the segmentation step for showing present embodiment.
Fig. 4 (A) and (B) is the figure of one of the unified bonding step for showing present embodiment.
Fig. 5 is the figure of one of the conveyance step for showing present embodiment.
Label declaration
1：Topping machanism；40：Cutting unit；45：Chip transfer pad；50：Collecting pallet；51：Chip incorporating section；52：It is viscous Tie part；53：Adhesive surface；60：Transport mechanism；65：Processing unit；C：Chip；W：Package substrate.
Embodiment
Hereinafter, the topping machanism of present embodiment is illustrated referring to the drawings.Fig. 1 is the topping machanism of present embodiment Stereogram.Fig. 2 is the figure of the operating method for the package substrate for showing comparative example.In addition, topping machanism as shown below only table Show one, be not limited in the structure.As long as topping machanism can be applicable the operating method of the package substrate of present embodiment, then Can also suitably it change.Also, package substrate is not limited in the small-sized package substrates such as csp substrate, wafer level chip size package substrate, Can also be the size package substrate bigger than csp substrate etc..
As shown in figure 1, topping machanism 1 is configured to：It is maintained at by a pair of 40 pairs of cutting units on chuck table 25 The package substrate W of rectangular plate-like is cut, so that package substrate W is divided into each chip C (reference picture 3).Package substrate W Front clathrate is divided into by a plurality of segmentation preset lines L, be formed with being split by these in each region for marking off of preset lines Multiple device D.In addition, as package substrate W device D, semiconductor devices can be arranged, LED (Light can also be arranged Emitting Diode：Light emitting diode) device.
The cutting feed list for making chuck table 25 move in the X-axis direction is provided with the base station 10 of topping machanism 1 Member 20.Cutting feed unit 20 has：A pair of guide rails 21, they configure on base station 10 and parallel with X-direction；And by electricity The X-axis workbench 22 of motivation driving, it is arranged in the way of it can slide in a pair of guide rails 21.In the back of the body of X-axis workbench 22 Surface side is formed with nut portions (not shown), and the nut portions are screwed togather with ball-screw 23.Also, by making one with ball-screw 23 The drive motor 24 that end links carries out rotation driving, and chuck table 25 is carried out in the X-axis direction along a pair of guide rails 21 Cutting feed.
The card kept to package substrate W is provided with the way of it can rotate about the z axis on the top of X-axis workbench 22 Disk workbench 25.It is provided with package substrate W's in the way of it can assemble and disassemble on the Workbench base 26 of chuck table 25 Holding jig 27.Holding jig 27 is the tabular tool prepared according to package substrate W species, whenever the encapsulation of processing object Substrate W species is just changed when changing to Workbench base 26.Also, holding jig 27 is on the front of stainless-steel sheet by gathering Urethane resin etc. is formed with resin bed, and the retention property to package substrate W is improved by resin bed.
On the front of holding jig 27, being formed with the corresponding position of segmentation preset lines with package substrate W makes to cut The escape 28 (reference picture 3) that the point of a knife of the cutting tool 42 of unit 40 is exited is cut, clathrate is being divided into by escape 28 Multiple suction ports 29 (reference picture 3) are formed with each region.Each suction port 29 by the stream in Workbench base 26 with suction Draw source connection (not shown), attracting holding is carried out to package substrate W by the negative pressure for resulting from suction port 29.Encapsulation before segmentation Substrate W is integrally kept by multiple suction ports 29, and the chip C after package substrate W segmentation passes through multiple suction ports 29 And individually kept.
The standing wall portion 11 for the mobile route for being provided with local openings on base station 10 to avoid chuck table 25.Vertical The indexable feed unit 30 for making a pair of cutting units 40 be moved in Y direction and Z-direction and incision are provided with wall portion 11 Feed unit 35.Indexable feed unit 30 has：A pair of guide rails 31, they are configured on the preceding surface of standing wall portion 11 and and Y-axis Direction is parallel；And Y-axis workbench 32, it is arranged in the way of it can slide in a pair of guide rails 31.Cut feed unit 35 Have：A pair of guide rails 36, they configure on Y-axis workbench 32 and parallel with Z-direction；And Z axis workbench 37, it is with energy The mode enough slided is arranged in a pair of guide rails 36.
Nut portions are formed with the rear side of Y-axis workbench 32, the nut portions are screwed togather with ball-screw 33.Also, in Z axis The rear side of workbench 37 is formed with nut portions, and the nut portions are screwed togather with ball-screw 38.In the ball wire of Y-axis workbench 32 The one end of the ball-screw 38 of thick stick 33 and Z axis workbench 37, is linked with drive motor 34,39 respectively.Driven by these Dynamic motor 34,39 carries out rotation driving to each ball-screw 33,38, and thus, a pair be fixed on Z axis workbench 37 are cut Cut unit 40 and carry out indexable feeding in Y direction along guide rail 31,36, incision feeding is carried out in the Z-axis direction.
A pair of cutting units 40 are configured to cutting tool 42 being arranged on what is protruded from shell 41 in the way of it can rotate The front end of main shaft (not shown).Diamond abrasive grain is for example fixed and is configured to plectane by cutting tool 42 by resinoid bond Shape.Also, the shooting unit shot to package substrate W upper surface is provided with the shell 41 of each cutting unit 40 43, cutting tool 42 is aligned relative to package substrate W according to the shooting image of shooting unit 43.In such cutting dress Put in 1, chuck table 25 is carried out cutting feed relative to cutting tool 42, so that along segmentation preset lines by package substrate W is divided into each chip C (reference picture 3).
In addition, in the topping machanism 1 of present embodiment, in order to increase the acquisition number of the chip C from package substrate W Amount, uses chuck table 25 corresponding with the package substrate W that diagonal is the big sizes such as 450mm, 600mm.Will envelope Chip C after dress substrate W segmentation is transferred to collecting pallet 50 (reference picture 4) from chuck table 25 and is sent to from follow-up Device is managed, but in the case where the operating method as picks up chip one by one by pickup machine etc. like that, chip C is received The time being contained in needed for collecting pallet 50 can be elongated.Although being added but production efficiency accordingly, there exist chip C acquisition quantity Reduce this unfavorable condition.
In this case, as shown in Figure 2, it is also considered that using large-scale conveyance pad 70 by after package substrate W segmentation Chip C is uniformly accommodated in the structure in collecting pallet, but must coordinate package substrate W maximization and prepare to compare standard size (operation machine standard size) big collecting pallet 71.Similarly, follow-up check device and unloader must also coordinate encapsulation base Plate W maximization and changed from existing apparatus structure.So, during the storage for carrying out unified conveyance to chip C and realizing Between shortening and the cost cutting realized using existing structure be in shifting relation.
Therefore, in the operating method of present embodiment, only according to the number that can be accommodated in collecting pallet 50 from envelope Take out chip in whole chip C after dress substrate W segmentation and be uniformly accommodated in collecting pallet 50 (reference picture 4).That is, by In uniformly storing multiple chip C in units of the number that can be accommodated in collecting pallet 50 every time, thus can shorten by Chip C is accommodated in the storage time in collecting pallet 50.Also, due to can continue to use standard-sized collecting pallet 50, So need not be changed follow-up processing unit from existing apparatus structure, it will not also increase equipment cost.Accordingly, it is capable to It is enough equipment cost is increased and is improved productivity.
Hereinafter, reference picture 3 is illustrated to the operating method of package substrate to Fig. 5.Fig. 3 shows point of present embodiment Cut step one, Fig. 4 shows one of the unified bonding step of present embodiment, and Fig. 5 shows removing for present embodiment Send step one.In addition, Fig. 4 (A) shows one of the picking action of unified bonding step, Fig. 4 (B) shows system One of the storage action of one bonding step.In addition, being set with the appearance and size phase with collecting pallet on chuck table The multiple regions matched somebody with somebody, but arrange in the X-axis direction 3 regions in multiple regions are illustrate only in figs. 3 and 4.
As shown in figure 3, implementing segmentation step first.In segmentation step, in the chuck work of topping machanism 1 (reference picture 1) Make to load package substrate W on platform 25, via holding jig 27 by the package substrate W attracting holdings opened greatly in chuck table 25 On.It is bigger than the defined profile of collecting pallet 50 (reference picture 4) that package substrate W is formed as size, for example, being formed to from 1 Open the size that package substrate W obtains the chip C for the storage number for being several times as much as collecting pallet 50.Therefore, chuck table 25 and guarantor The size for holding tool 27 and package substrate W is matchingly formed as large-scale.
When a pair of cutting tools 42 to be pointed to package substrate W segmentation preset lines L (reference picture 1), make cutting tool 42 are dropped to and can cut off package substrate W height, and chuck table 25 is cut into relative to the cutting tool 42 Give.The package substrate W on chuck table 25 is cut along each segmentation preset lines L by repeating cutting feed So as to be divided into each chip C.Now, due to being correspondingly formed suction port 29, institute with each chip C in holding jig 27 To be attracted the individually attracting holding of mouth 29 from the package substrate W chip C separated in working angles, chip C will not be from holding Tool 27 departs from.
Also, distinguish multiple regions according to the appearance and size of collecting pallet 50 (reference picture 4) on chuck table 25 A1~An (illustrate only region A1~A3) in figure 3.That is, the chip C after package substrate W segmentation is according to collecting pallet 50 Number is stored to be divided into multiple region A1~An and be maintained on chuck table 25.Due to whole chip C to package substrate W with Region division is carried out on the basis of the appearance and size of collecting pallet 50, so whole chip C can be assigned into multiple collecting pallets 50 In transported.Therefore, in collecting pallet 50 to be handled to the follow-up processing unit 65 (reference picture 5) of unit as 1, Can be according to each collecting pallet 50 to chip C processing.
As shown in Fig. 4 (A) and (B), implement unified bonding step after segmentation step is implemented.Such as Fig. 4 (A) institute Show, in the picking action of the first half of unified bonding step, use size and 51 pairs of the chip incorporating section of collecting pallet 50 The chip answered transfers pad 45 to implement chip C pickup.Chip transfer pad 45 retaining surface be formed as with chuck table 25 The corresponding size in 1 region, and be formed with suction port 46 at position corresponding with each chip C in region.Each suction port 46 are connected via open and close valve 47 with attraction source 48, switch the offer and blocking of attraction by the opening and closing of open and close valve 47.
Chip transfer pad 45 is moved to the top of chuck table 25 and is positioned at the region A1 on chuck table 25. When each suction port 46 that chip transfers pad 45 is located at each chip C respective surface, chip transfers pad 45 towards chuck work Make platform 25 to decline.Chip is set to transfer pad 45 close to each chip C so as to can be accommodated in whole chip C to package substrate W The chip C of number in chip incorporating section 51 carries out attracting holding.Now, attraction of the chuck table 25 to chip C is stopped, no Chip can be hindered to transfer the pickup for the chip C that pad 45 is carried out.
As shown in Fig. 4 (B), in the storage action of the latter half of unified bonding step, pad 45 is transferred by chip In the collecting pallet 50 that multiple chip C are accommodated in the chip incorporating section 51 with defined profile.In collecting pallet 50, rule The chip incorporating section 51 of fixed profile is formed as concavity, and it is big that chip incorporating section 51 is open into that chip transfer pad 45 can enter It is small.Also, the bonding piece 52 of sheet is equipped on the bottom surface of chip incorporating section 51 and is uploaded in the adhesive surface 53 of bonding piece 52 Chip C is put, so as to prevent the position of the chip C during the conveyance carried out by collecting pallet 50 from offseting.Bonding piece 52 for example by The flex carrier (registration mark) of UMI companies production are constituted, and the bonding piece 52 is pasted onto into chip by two-sided tape etc. On the bottom surface of incorporating section 51.In addition, on bonding piece 52, can also be hard by ultraviolet instead of adhesive boards such as flex carrier Change the resin sheets such as resin, thermosetting resin and bonding agent is constituted.
Chip transfer pad 45 is moved to the top of the collecting pallet 50 and chip is transferred the multiple of 45 attracting holdings of pad Chip C is located at the surface of chip incorporating section 51.Chip transfers pad 45 in the state of multiple chip C are remain towards storage support Disk 50 declines and multiple chip C is pressed against on the adhesive surface 53 of the bonding piece 52 of chip incorporating section 51 viscous so as to uniformly be bonded in In junction 53.So, multiple chip C of the region A1 in whole chip C on chuck table 25 are uniformly transferred to storage In pallet 50.Unify bonding step by repeating this, whole chip C on chuck table 25 are assigned into multiple store and held in the palm Stored in disk 50.
As shown in figure 5, implementing conveyance step after unified bonding step is implemented.In conveyance step, pass through belt The transport mechanisms such as transveyer 60 will be bonded with multiple chip C collecting pallet 50 towards follow-up processing in chip incorporating section 51 Device 65 is transported.Due in follow-up processing unit 65 according to each standard-sized collecting pallet 50 to chip C progress at Reason, so existing apparatus structure can not be changed and multiple chip C are implemented with follow-up processing.Therefore, for follow-up dress Put, no matter whether package substrate W maximizes, existing device can be continued to use to cut down cost.
As described above, in the package substrate W of present embodiment operating method, 45 pairs of encapsulation of pad are transferred by chip The chip C of the number that can be accommodated in chip incorporating section 51 in substrate W whole chip C carries out attracting holding and will be multiple Chip C is uniformly bonded on the adhesive surface 53 of chip incorporating section 51.Due to by package substrate W whole chip C be divided into for several times and Uniformly it is accommodated in collecting pallet 50, so can compared with the structure that chip is accommodated in collecting pallet 50 one by one Significantly shorten the storage time.Also, in the case that package substrate W is substrate greatly, due to by package substrate W whole Chip C is assigned in multiple collecting pallets 50 and transported to follow-up processing unit 65, it is not required that follow-up processing unit 65 maximize with package substrate W matching size.So, can be by increasing substrate size before package substrate W segmentation And increase chip C acquisition quantity and be divided into the collecting pallet 50 of defined profile after package substrate W segmentation to be removed Send, thus, it is possible to suppress the influence to existing production line.
In addition, the present invention is not limited in above-mentioned embodiment, various changes can be implemented.In the above-described embodiment, Size, shape for illustrating in the accompanying drawings etc. are not limited to that it is appropriate to be carried out in the range of the effect of the present invention is played Change.In addition, the scope without departing from the purpose of the present invention just can implement appropriate change.
For example, in the above-described embodiment, being configured in segmentation step divide package substrate W by topping machanism 1 Each chip C is cut into, it is not limited to the structure.In segmentation step, package substrate W is divided into along segmentation preset lines Each chip C, for example, it is also possible to which package substrate W is divided into each chip C by laser machining.
Also, in the above-described embodiment, it is configured in conveyance step by the transport mechanisms such as band conveyer 60 Collecting pallet 50 is transported towards follow-up processing unit 65, it is not limited to the structure.Transport mechanism 60 is can The structure of collecting pallet 50 is transported, for example, it is also possible to be constituted using linear motor.Also, in conveyance step, and It is not limited only to transport the structure of collecting pallet 50 by transport mechanism 60, collecting pallet 50 can also be transported by operator. And then, can also be transported collecting pallet 50 to follow-up device using conveyance pad in conveyance step etc..
As described above, the present invention is with when can shorten the storage being accommodated in multiple chips in collecting pallet Between and suppress follow-up processing unit maximization effect, 450mm, 600mm encapsulation have been exceeded particularly with diagonal The operating method of substrate is useful.

Claims (1)

1. a kind of operating method of package substrate, multiple chips are divided into simultaneously by the package substrate for being formed with a plurality of segmentation preset lines It is accommodated in the collecting pallet with defined profile, the collecting pallet possesses chip incorporating section and is disposed in the chip incorporating section In bonding piece, the operating method of the package substrate is characterised by, with the steps：
Segmentation step, divides size package substrate bigger than the defined profile of the collecting pallet along the segmentation preset lines It is cut into multiple chips；
Unified bonding step, after the segmentation step is implemented, by can be accommodated in whole chips of the package substrate The chip attracting holding of number in the chip incorporating section is pressed on size chip transfer pad corresponding with the chip incorporating section On the adhesive surface for being pressed in the bonding piece of the chip incorporating section, so that multiple chips of a part are uniformly bonded in into the adhesive surface On；And
Step is transported, is being implemented after this unifies bonding step, to being bonded with many of the part in the chip incorporating section The collecting pallet of individual chip is transported.
CN201710168600.2A 2016-03-25 2017-03-21 The operating method of package substrate Pending CN107225700A (en)

Applications Claiming Priority (2)

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JP2016061818A JP2017175055A (en) 2016-03-25 2016-03-25 Handling method for package wafer

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Publication number Priority date Publication date Assignee Title
JP6952515B2 (en) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 Work transfer device, electronic component manufacturing device, workpiece transfer method, and electronic component manufacturing method
JP2020171991A (en) * 2019-04-11 2020-10-22 株式会社ディスコ Blade with base

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330103A (en) * 1998-05-11 1999-11-30 Matsushita Electric Ind Co Ltd Part transfer method and device
CN102582954A (en) * 2011-01-07 2012-07-18 株式会社迪思科 Transportation pallet
JP2014038947A (en) * 2012-08-17 2014-02-27 Disco Abrasive Syst Ltd Conveyance tray
CN103871864A (en) * 2012-12-10 2014-06-18 株式会社迪思科 Cutting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330103A (en) * 1998-05-11 1999-11-30 Matsushita Electric Ind Co Ltd Part transfer method and device
CN102582954A (en) * 2011-01-07 2012-07-18 株式会社迪思科 Transportation pallet
JP2014038947A (en) * 2012-08-17 2014-02-27 Disco Abrasive Syst Ltd Conveyance tray
CN103871864A (en) * 2012-12-10 2014-06-18 株式会社迪思科 Cutting device

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KR20170113189A (en) 2017-10-12
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JP2017175055A (en) 2017-09-28

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