JP4846411B2 - Semiconductor package jig - Google Patents

Description

The present invention includes a plurality of semiconductor chips is concerned jig again and again a semiconductor package used in these semiconductor chips are fixed to obtain a semiconductor package by cutting the package preform which is resin molded for each semiconductor chip.

  In a semiconductor package such as CSP (Chip Size Package), a plurality of semiconductor chips are mounted on a package substrate, and all the semiconductor chips on the substrate are resin-molded to obtain a package base material. It is manufactured by a method in which each semiconductor chip is cut to obtain individual semiconductor packages. In such a manufacturing process, when the package base material is cut and separated into individual semiconductor packages, each semiconductor package can be transported as it is even after the individualization. May be used. For example, a plurality of separated semiconductor packages are transferred together with the jigs to a handler unit that stores a chip tray, and the semiconductor units are transferred one by one from the jigs to a predetermined chip tray for storage. A singulation system is adopted. As a dedicated jig for holding a plurality of semiconductor packages, for example, one described in Patent Document 1 is known.

JP 2003-166867 A

  In the conventional singulation system described above, a cutting base that cuts a package base material held in a jig and divides it into a plurality of semiconductor packages, and a semiconductor package that is transported together with the jig is transferred from the jig to the chip tray. The handler unit is provided with a transfer unit that is transferred one by one. However, the processing capability of the handler unit is usually lower. For example, when the cutting processing unit cuts 10 package base materials per unit time, There are situations where only five package base materials can be stored. Therefore, instead of the handler unit, it was considered to prepare a plurality of chip tray storage devices separate from the cutting unit to achieve a balanced processing capability and improve productivity.

  However, when preparing a plurality of chip tray storage devices separate from the cutting processing unit, the distance from the cutting processing unit to each chip tray storage device becomes long, and when transporting the semiconductor package after singulation together with the jig, There was a problem that the semiconductor package was displaced from the jig or dropped. Although transportation is carried out by an operator or a robot, it is difficult to change the means for performing transportation. Therefore, an improvement measure for preventing the semiconductor package from dropping from the jig even during transportation is required.

The present invention has been made in view of the above circumstances, and a semiconductor package treatment capable of stably holding an individualized semiconductor package without falling during conveyance from the cutting processing unit to the chip tray storage device. The purpose is to provide ingredients .

  The jig for a semiconductor package of the present invention holds a package base material in which a plurality of semiconductor chips are fixed on a substrate and the semiconductor chips are sealed with a molding resin, and the cutting apparatus includes A plate-shaped jig for holding a package base material in a cutting device when a plurality of semiconductor packages are obtained by cutting along a planned dividing line set between semiconductor chips by a cutting blade that A holding surface on which the base material is held, and a plurality of cutting blades formed on the holding surface corresponding to the scheduled division lines, and capable of entering the cutting edge of the cutting blade of the cutting device and penetrating the cutting blade into the package base material A relief groove, formed in a region defined by these cutting blade relief grooves, a holding surface, and an ejection hole penetrating between the back surface opposite to the holding surface; And at least around the ejection holes of the lifting surface, it is characterized by comprising a removable pressure-sensitive means for packaging the base material is provided in a portion in contact.

  According to the semiconductor package jig of the present invention, the package base material is held on the jig by aligning the planned dividing line with the holding surface corresponding to the cutting blade clearance groove and adhering to the re-peeling type adhesive means. Is done. While being held by the jig, the package base material is cut and divided by a cutting blade that cuts along the planned division line. In this case, the cutting blade penetrates the package base material and the cutting edge is the cutting blade. The jig is cut through the escape groove so that the jig is not cut by the cutting blade.

  Even if the package base material is cut and separated into a plurality of semiconductor packages, these semiconductor packages are adhered to the jig by a re-peeling type adhesive means. For this reason, even if it conveys with a jig | tool, it does not shift | deviate from a jig | tool or falls, but it can convey, with being stably hold | maintained at the jig | tool. Therefore, the process of transporting to the chip tray storage device and transferring the semiconductor package from the jig to the chip tray for storage can be performed smoothly. When the semiconductor package is transferred to the chip tray, the semiconductor package can be detached from the jig by inserting the eject pin into the eject hole from the jig side and protruding the semiconductor package.

  In the present invention, since the semiconductor package can be stably conveyed to the chip tray storage device without dropping from the jig as described above, a plurality of chip tray storage devices are attached to the cutting portion as described above. It is possible to improve the processing capability of the singulation system in a comprehensive manner such as providing a semiconductor package and storing it in a chip tray. The semiconductor package is attached to the jig with a re-peeling adhesive to prevent the semiconductor package from falling off. However, since the semiconductor package is a re-peeling adhesive, the jig can be reused.

  Generally, when cutting the package base material, semiconductor wafer, or the like, a dicing tape and a dicing frame are often used as an auxiliary member to be set in a cutting apparatus. The dicing tape is an adhesive tape with one side being an adhesive surface. An annular dicing frame is attached to the adhesive surface of this dicing tape, and the package base material to be cut is attached to the dicing tape inside the dicing frame. By handling the frame, the package base material or the like is set in the cutting device and is transported in the cutting device. Therefore, the jig of the present invention can be mounted on the dicing tape and dicing frame and set in the cutting device.

  Further, it is preferable that the jig itself has the same outer shape as the dicing frame because it can be set in the cutting apparatus without using a dicing tape and a dicing frame. That is, the cutting device has a dicing frame accommodation / conveying means for accommodating and conveying a dicing frame for supporting the package base material, and the outer shape of the semiconductor package jig is formed to be the same as the dicing frame. This is also a feature of the present invention.

  According to the present invention, a semiconductor package obtained by dividing a package base material held in a jig can be smoothly transferred to the next process without dropping from the jig. There is an effect that the processing capacity of the singulation system such as storing in the chip tray can be improved comprehensively.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[1] Package Base Material FIG. 1 shows a procedure for manufacturing a package base material according to the present invention. In FIG. 1, reference numeral 1 denotes a semiconductor package substrate formed in a rectangular shape. As shown in FIG. 1A, a plurality (two in this case) of rectangular chip mounting regions 2 are provided on the surface of the substrate 1, and a large number of chips are formed in the region 2 by dividing lines 3. The laminated portion 4 is partitioned in a lattice shape. In order to obtain a package base material, first, the first semiconductor chip 11 and the second semiconductor chip 12 are stacked and bonded to each chip stack portion 4 of the substrate 1 as shown in FIG. The chips 11 and 12 and the chips 11 and 12 and the substrate 1 are electrically connected and mounted.

  Next, as shown in FIGS. 1C to 1D, a mold die 15 is placed on the substrate 1 for each chip mounting region 2, and a liquid resin is filled in the mold die 15 and solidified. The mold 15 is a rectangular thin case corresponding to the shape and dimensions of the chip mounting region 2, and is formed with a pair of holes 15a and 15b, one serving as a filling port and the other serving as an exhaust port. The mold 15 is positioned in accordance with the chip mounting region 2 and the state thereof is maintained by an appropriate means, and the resin is filled from one hole: the filling port 15a. The air in the mold 15 exits from the other hole: the exhaust port 15b, and when the resin flows out from the exhaust port 15b, it is determined that the mold 15 is filled with the resin. After the resin is solidified, the mold 15 is peeled off and removed from the resin, and the semiconductor chips 11 and 12 (not visible in FIG. 2) stacked on the substrate 1 shown in FIG. A base material 17 is obtained.

  FIG. 3 shows a cross section of one chip stacking portion 4 in the package base material 17, which is a semiconductor package 18 obtained by cutting and dividing the package base material 17. In FIG. 3, for example, the first semiconductor chip 11 with respect to the substrate 1 and the second semiconductor chip 12 with respect to the first semiconductor chip 11 are bonded to each other in advance such as DAF (Die Attach Film). It is physically joined by a film. And each electrode part of each chip | tip 11 and 12 is connected with the electrode part of the surface of the board | substrate 1 with the wires 11a and 12a, respectively, and is electrically connected. The electrode portion on the surface of the substrate 1 leads to a wiring layer laminated inside the substrate 1, and a spherical bump 1 a is attached to the back surface of the substrate 1 so as to be connected to the wiring layer. A protective tape (not shown) that protects the bumps 1 a is attached to the back surface of the substrate 1.

[2] The jig package base material 17 is cut along the planned division line 3 and separated into a large number of semiconductor packages 18 (see FIG. 3). It is held by the jig 20. This jig 20 is a rectangular plate material having an appropriate thickness and having dimensions that are slightly larger than the substrate 1 in both vertical and horizontal dimensions, and is made of stainless steel, ceramics, or the like. On the surface of the jig 20, a plurality of grooves 21 having a predetermined depth extending in parallel with each side of the jig 20 are formed from one side to the other edge. These grooves 21 are escape grooves for preventing a cutting edge of a cutting blade 47 of a cutting apparatus 30 to be described later from being cut into the jig 20, and are formed corresponding to the division lines 3 of the substrate 1. . Therefore, the number, size, and shape of the small rectangular chip-corresponding regions 22 partitioned by these grooves 21 match those of the chip stacking portion 4 of the substrate 1. The package base material 17 holds the substrate 1 so as to overlap the surface of the jig 20, and L-shaped guide pieces 23 that suppress the displacement of the substrate 1 are formed at the four corners on the surface side of the jig 20.

  As shown in FIG. 4, a circular eject hole 24 penetrating the front and back surfaces is formed in the center of each chip corresponding region 22. A re-peeling adhesive 25 is provided on the surface of each chip-corresponding region 22 and around the ejection hole 24 by means such as coating or sealing. Specific examples of the re-peelable pressure-sensitive adhesive 25 include, for example, an adhesive made of a silicone resin or a fluorine resin (for example, “Magic Resin” manufactured by Taisho Electronics Co., Ltd.), an adhesive force by heating or cooling. (For example, “Warm-off”, “Cool-off” manufactured by Nitta Co., Ltd.).

  As shown in FIG. 5, the package base material 17 is overlaid on the surface of the jig 20 with the mold resin 16 side up and the four corners of the substrate 1 aligned with the inside of each guide piece 23. The back surface of the substrate 1 is in a state of being adhered and stuck to the re-peelable pressure-sensitive adhesive 25, whereby the package base material 17 is held by the jig 20 so as not to fall off. In this holding state, the division line 3 of the substrate 1 exactly overlaps with the groove 21 of the jig 20, and each chip stacking portion 4 of the substrate 1, that is, a subsequent process, overlaps the chip corresponding region 22 of the jig 20. The individual semiconductor packages 18 separated into individual pieces correspond to each other. The package base material 17 is cut by the cutting device 30 shown in FIG. 6 along the scheduled division line 3 while being held by the jig 20, and is divided into a large number of semiconductor packages 18.

[3] Cutting Device A cutting device 30 shown in FIG. 6 has a substantially rectangular parallelepiped base 31. A positioning mechanism 32 is provided on the horizontal upper surface of the base 31, and a cassette 33, a cutting mechanism 34, and a cleaning unit 35 are arranged around the positioning mechanism 32 in the clockwise direction. Further, an image recognition camera 36 is installed above the positioning mechanism 32 for photographing the package base material 17 and recognizing the division line 3 to be cut. A plurality of jigs 20 holding the package base material 17 as described above are stacked and accommodated in the cassette 33 with the package base material 17 facing up.

  One jig 20 holding the package base material 17 is taken out from the cassette 33 by a clamp 26, and the jig 20 is transferred to a cutting mechanism 34 via a positioning mechanism 32. The material 17 is cut and divided and separated into a large number of semiconductor packages 18. The jig 20 transferred from the cassette 33 to the positioning mechanism 32 is sandwiched between a pair of guide bars 32a provided in the positioning mechanism 32 and held at a fixed position, and the package base material 17 is photographed by the image recognition camera 36 there. The position of the division planned line 3 is confirmed. Based on the image data photographed by the image recognition camera 36, the θ axis (rotation axis) of the chuck table 42 is rotated so that the X direction and the division planned line 3 of the package base material 17 are adjusted in parallel. The mechanism 34 is controlled.

  A large number of semiconductor packages 18 separated by the cutting mechanism 34 are held by the jig 20 while being adhered to the re-peelable adhesive 25, and then the jig 20 passes through the positioning mechanism 32. Then, the semiconductor unit 18 is moved to the cleaning unit 35, and the semiconductor package 18 and the jig 20 are cleaned by the cleaning unit 35. Thereafter, the jig 20 holding the package base material 17 is returned to the cassette 33 via the positioning mechanism 32 once again. On the base 31, a transfer robot (not shown) for transferring the jig 20 is provided.

  As shown in FIG. 6, the cutting mechanism 34 is arranged in a parallel state in the X direction above a disk-like chuck table 42 that is rotatably provided on a rectangular table base 41. And two cutting units 45. The table base 41 is provided on the base 31 so as to be movable in the X direction via a guide rail (not shown), and is reciprocated by a drive mechanism (not shown).

  The chuck table 42 has a horizontal upper surface and is supported on the table base 41 so as to be rotatable about the Z direction (vertical direction) as an axis, and is rotated clockwise or counterclockwise by a driving mechanism (not shown). The chuck table 42 is a well-known vacuum chuck type, and adsorbs the workpiece onto the upper surface when a vacuum operation for sucking air on the upper surface side is performed. A bellows-like cover 44 is provided at both ends of the table base 41 in the moving direction so as to cover the moving path of the table base 41 and prevent cutting chips and the like from entering.

  The cutting unit 45 includes a cylindrical spindle housing 46 whose axial direction is held in parallel with the Y direction, and a cutting blade 47 attached to a spindle (not shown) provided in the spindle housing 46. Yes. The spindle housing 46 has a built-in motor for rotating the spindle (not shown), and a frame (not shown) provided on the base 31 holds the state in which the axial direction is parallel to the Y direction. It is supported so as to reciprocate in the direction and move up and down in the Z direction. The frame is provided with a drive mechanism (not shown) that moves the cutting unit 45 in those directions. A blade cover 48 is attached to the end of the spindle housing 46 on the side where the cutting blade 47 is mounted. Cutting blade nozzles 49 </ b> A and 49 </ b> B for supplying cutting water for lubrication, cooling, cleaning, and the like at the time of cutting toward a processing point by the cutting blade blade 47 are attached to the blade cover 48.

[4] Operation of Cutting Device Next, the operation of cutting and dividing the package base material 17 by the cutting device 30 and dividing it into a large number of semiconductor packages 18 will be described.
First, one jig 20 holding the package base material 17 is pulled out from the cassette 33 to the positioning mechanism 32 side by the transfer robot and placed between the two guide bars 32a. Then, the two guide bars 32a move by linking in a direction approaching each other, and stop moving when the jig 20 is sandwiched. As a result, the jig 20 is positioned at the transfer start position to the chuck table 42.

  Next, the jig 20 that holds the package base material 17 is moved and placed on the chuck table 42 that has been previously operated in vacuum by the transfer robot. The jig 20 is sucked and sucked by the chuck table 42, and suction force also acts on the package base material 17 from the eject hole 24 of the jig 20, and the package base material 17 passes through the jig 20 to the chuck table 42. Adsorbed and retained on the surface.

  Next, the chuck table 42 is rotated to align the division line 3 with the cutting blade 47 of the cutting unit 45, and then the cutting blade 47 is lowered, and then the table base 41 is moved in the X direction, as shown in FIG. As described above, the cutting blade 47 that rotates at a high speed is cut along the planned division line 3 and the planned division line 3 is cut. This operation is the basic operation of the cutting mechanism 34. In the cutting mechanism 34, the movement of the two cutting units 45 in the Y direction and the Z direction and the movement of the table base 41 in the X direction are combined appropriately, The planned division line 3 is cut.

  The cutting depth of the cutting blade 47 is adjusted such that the cutting edge penetrates the package base material 17 and the cutting edge enters the groove 21 of the jig 20 so that the cutting edge does not contact the bottom of the groove 21. In this case, by providing two cutting units 45, for example, when the axial direction (Y direction) of the cutting blade 47 of these cutting units 45 is shifted by the interval of the scheduled division line 3, the package base material 17 is once. The two division lines 3 can be cut by moving in the X direction.

  When all the division lines 3 are cut as described above, the package base material 17 is separated into a large number of semiconductor packages 18. These semiconductor packages 18 remain on the jig 20 while being adhered to the re-peelable adhesive 25 of the jig 20, and the other end material is detached from the jig 20. Thereafter, a large number of jigs 20 with semiconductor packages are transferred to the cleaning unit 35 via the positioning mechanism 32, and the jig 20 and the large number of semiconductor packages 18 are cleaned by the cleaning unit 35. The cleaned jig 20 with a semiconductor package is returned to the cassette 33 via the positioning mechanism 32 once again.

[5] Operational Effects of Embodiment When a large number of package base materials 17 are separated into pieces as described above and a predetermined number of processed semiconductor package-equipped jigs 20 are stored in the cassette 33, the cassette 33 and the next chip It is conveyed to the tray storing process. In the chip tray storing step, one semiconductor package 18 is detached from the jig 20 by inserting the eject pin from the jig 20 side into the eject hole 24 and projecting the semiconductor package 18 by the chip tray storing device. 18 is stored in a predetermined chip tray.

  In the present embodiment, even if the package base material 17 is cut and divided and separated into a plurality of semiconductor packages 18, these semiconductor packages 18 are adhered to the jig 20 with a re-peelable adhesive. For this reason, even if the semiconductor package-equipped jig 20 is conveyed via the cassette 33, the semiconductor package 18 is not displaced or dropped from the jig 20, and is conveyed while being stably held by the jig 20. can do. Therefore, the process of transporting to the chip tray storage device and transferring the semiconductor package 18 from the jig 20 to the chip tray for storage can be performed smoothly. As a result, the processing capability of the singulation system in which a plurality of chip tray storage devices are provided for the cutting device 30 and the semiconductor package 18 is stored in the chip tray after being singulated can be comprehensively improved.

  In the jig 20 of the above embodiment, the re-peelable adhesive 25 is provided only in the chip corresponding region 22 in which the eject hole 24 is formed and the semiconductor package 18 remains after cutting. In addition, a re-peelable pressure-sensitive adhesive 25 may be provided. That is, a re-peeling adhesive is provided on the entire surface of the jig 20, and in this case, after the package base material 17 is cut, the peripheral material around the semiconductor package 18 is also adhered to the jig 20. Is advantageous because it prevents the end material from being scattered around during cutting.

[6] Modification Example of Jig Since the cutting device 30 has a configuration in which the cassette 33 is dedicated to the jig 20 and directly transfers the jig 20 from the cassette 33, the workpieces having different shapes and sizes are processed. It does not support dicing frames that support objects flexibly. FIG. 9 shows a general support form in which a dicing tape 52 is attached to one side of an annular dicing frame 51 used for such an application, and two package base materials 17 are attached to the dicing tape 52 for convenience. Show. The jig 20 of the present invention is useful in place of the dicing frame 51 and the dicing tape 52.

  When the package base material 17 is supported by the dicing frame 51 and the dicing tape 52 as shown in FIG. 9, the package base material 17 is removed by the cutting device 30B having the cassette 37 corresponding to the dicing frame 51 shown in FIG. It can cut | disconnect similarly to the said embodiment. This cutting device 30B has basically the same configuration as the cutting device 30 shown in FIG. 6, but the cassette 37 is large for the dicing frame 51, and the dicing frame 51 is attached to and detached from the table base 41. A clamp 43 is provided for holding it freely. Also, the transfer robot has a specification for transferring the dicing frame 51.

  However, when the package base material 17 is supported and cut by the dicing frame 51 to which the dicing tape 52 is attached, the cutting amount of the cutting blade 47 is halfway through the thickness of the dicing tape 52, so that finally the semiconductor After the package 18 is peeled from the dicing tape 52 and stored in the chip tray, the dicing tape 52 becomes unusable. For this reason, it is necessary to attach a new dicing tape 52 to the dicing frame 51. That is, the dicing tape 52 is disposable, and thus there is a problem that it is costly and requires time for reattachment.

  Therefore, as shown in FIG. 10, when a jig 20B having the same outer shape as the dicing frame 51 shown in FIG. 9 is prepared and the package base material 17 is held in the jig 20B, the dicing frame 51 and the dicing tape 52 are provided. Without using the jig 20B, the package base material 17 can be cut by setting the jig 20B in the general-purpose cutting apparatus shown in FIG. Of course, like the jig 20 of the previous embodiment, the jig 20 is provided with a groove 21 corresponding to the package base material 17, an eject hole 24, and a re-peelable adhesive 25. It can be used.

  Note that the rectangular jig 20 of the previous embodiment can also be applied to the cutting device 30B of the type that conveys the dicing frame 51 shown in FIG. For this purpose, the dicing frame 51 and the dicing tape 52 shown in FIG. 9 may be used. That is, if the jig 20 is affixed to the adhesive surface of the dicing tape 52 and the package base material 17 is placed and held on the jig 20, it can be accommodated in the cassette 37 of the cutting device 30B. In this case, in order to apply vacuum suction also to the package base material 17, air suction holes equal to or greater than the eject holes 24 are formed at locations corresponding to the eject holes 24 of the dicing tape 52. That is, this method is a method in which a hole is formed at a position corresponding to the eject hole 24 of the dicing tape 52 with the jig 20 interposed between the package base material 17 and the dicing tape 52 of FIG.

  In addition to this, the jig 20 is attached to a thin plate-like substrate having the same outer shape as the dicing frame 51 with an adhesive or a double-sided tape, and the package base material 17 is held on the jig 20. There is also a method of conveying in the cutting device 30B. In this case, an air suction hole communicating with the eject hole 24 is formed on the substrate having the dicing frame shape.

It is a perspective view which shows the manufacturing process of the package base material hold | maintained with the jig | tool of one Embodiment of this invention. It is a perspective view which shows the jig | tool of one Embodiment of this invention, and the package base material hold | maintained with this jig | tool. It is sectional drawing of the part of the semiconductor chip of the package base material shown in FIG. It is (a) top view which shows the chip | tip corresponding area | region of a jig | tool, (b) It is BB sectional drawing. It is a perspective view which shows the state which hold | maintained the package base material with the jig | tool of one Embodiment of this invention. It is a perspective view of the cutting device concerning one embodiment. It is a perspective view which shows the state which has cut | disconnected the package base material with the cutting unit of the cutting device. It is a perspective view of a general-purpose type cutting apparatus that holds and cuts a package base material with a general dicing frame with a dicing tape. It is (a) top view of the state holding a package base material with a dicing frame with a dicing tape, and (b) sectional view. It is (a) top view and (b) sectional view showing the modification of the jig of the present invention.

Explanation of symbols

3 ... Line to be divided 11, 12 ... Semiconductor chip 16 ... Resin for molding 17 ... Package base material 18 ... Semiconductor package 20, 20B ... Jig 21 ... Cutting blade relief groove 24 ... Eject hole 25 ... Re-peelable adhesive ( Re-peeling adhesive means)
30, 30B ... Cutting device 47 ... Cutting blade 51 ... Dicing frame

Claims (2)

A package base material in which a plurality of semiconductor chips are fixed on a substrate, and these semiconductor chips are sealed with a molding resin is held in a cutting device, and set between semiconductor chips by a cutting blade provided in the cutting device. A plate-shaped jig for holding the package base material in the cutting device when obtaining a plurality of semiconductor packages by cutting along the division line to be formed,
A holding surface on which the package base material is held;
A plurality of cutting blade relief grooves formed on the holding surface corresponding to the scheduled division lines and capable of penetrating the cutting blade of the cutting blade of the cutting apparatus and allowing the cutting blade to penetrate the package base material,
Formed in a region defined by these cutting blade relief grooves, the holding surface, and an eject hole penetrating between the back surface opposite to the holding surface;
A jig for a semiconductor package, comprising: a re-peeling type adhesive means provided at least around the eject hole of the holding surface and in contact with the package base material.   The cutting apparatus has a dicing frame accommodating / conveying means for accommodating and conveying a dicing frame for supporting the package base material, and the outer shape of the semiconductor package jig is the same as the dicing frame. The semiconductor package jig according to claim 1, wherein the jig is formed.

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