JP6037372B2 - Package substrate splitting device - Google Patents

Description

  The present invention relates to a package substrate dividing apparatus that divides a package substrate into individual package devices and accommodates the divided package devices in a tray.

  A wafer on which a device such as an IC or LSI is formed is divided into individual chips by a dicing apparatus. Thereafter, when each chip is mounted on a package device such as a CSP (Chip Size Package), a plurality of chips are arranged on the substrate and sealed with a resin to constitute a package substrate. Then, by dividing the package substrate along the planned division line, individual package devices are obtained.

  As an apparatus for dividing the package substrate, for example, there is a dividing apparatus described in Patent Document 1 below. This dividing apparatus includes a dividing mechanism that divides a package substrate into individual package devices by a cutting blade, and an accommodation mechanism that picks up the package devices one by one and accommodates them in the accommodation tray, and the package accommodated in the accommodation tray. The device is transported to the assembly process and used for various electronic devices. The storage tray is provided with partition walls for partitioning package devices to be stored, and configured to store the package devices in individual regions partitioned by the partition walls.

JP 2001-24003 A

  However, since the dividing device is composed of a dividing mechanism and a receiving mechanism, there is a problem that the size of the device is increased, the occupied area is widened and uneconomical, and the equipment cost is increased.

  The present invention has been considered in view of such problems, and an object of the present invention is to provide a package substrate dividing apparatus that can be reduced in size and reduced in equipment cost.

The present invention relates to a package substrate dividing apparatus that divides a package substrate in which a plurality of devices are divided by a predetermined division line and is resin-sealed into individual package devices. Means, a package substrate unloading means for unloading the package substrate from the cassette supported by the cassette support means, a temporary placing means for temporarily placing the unloaded package substrate and aligning the package substrate, and a line for dividing the package substrate A conveying means for conveying a package substrate positioned by a temporary placing means on a jig table provided with a suction hole in a region defined by the groove, and a rotatable cutting blade A package substrate held on a jig table A cutting means; an upper surface cleaning means for cleaning the upper surface of the package substrate that has been divided into individual package devices; and an entire upper surface of the package substrate that has been divided into package devices is sucked and held to clean the lower surface of the package substrate. A bottom surface cleaning unit, a drying unit that dries the package substrate that has been cleaned, and a tray that includes a storage unit that has a flat bottom surface and does not have partition walls that partition the package device. Tray storage means, tray carry-out means for carrying out empty trays from empty tray storage means, and transfer of package substrates divided into package devices and dried by drying means to empty trays that have been carried out in units of package substrates Storing means and a tray storing a package substrate divided into package devices At least composed of a laser storage device, and passes the package substrate on a jig table position, the lower surface washing means and drying means are disposed on a straight line in this order, the housing portion of the tray, a sheet having a tack force The transfer means is laid and presses the suction pad that sucks and holds the entire upper surface of the package substrate divided into package devices, and presses the lower surface of the package substrate sucked and held by the suction pad against the sheet having the tack force. It is comprised from a press part .

  In the package substrate dividing apparatus according to the present invention, after dividing the package substrate into individual package devices, the package substrate is divided into trays each having a receiving portion having a flat bottom surface without partition walls for partitioning the package devices. Since the package substrate is transferred in units of the package, a facility for accommodating the individual package devices in the tray becomes unnecessary. Therefore, the mechanism for accommodating the package device in the tray can be reduced in size, the area occupied by the apparatus can be reduced, and the facility cost can be suppressed.

  Further, a sheet having tack force is laid in the tray accommodating portion, and the transfer means sucks and holds the entire upper surface of the package substrate divided into package devices, and the sheet having tack force is attached to the suction pad. Since the pressing portion presses the lower surface of the package substrate held by suction, the pressing portion presses the lower surface of the package substrate against the sheet having the tack force, so that the divided package substrate is shaped as the package substrate. It is stored and held in the tray while maintaining the above. Therefore, the transfer process to the tray is further simplified, and even if there is no partition in the tray, the package device is not moved and damaged in the tray when the tray is transported.

It is a perspective view which shows an example of a package board | substrate division | segmentation apparatus. It is a perspective view which shows an example of a package substrate. It is a perspective view which shows an example of a jig | tool table. It is a perspective view which shows an example of the tray which accommodates a package device. It is sectional drawing which expands and shows a part of the tray. It is sectional drawing which expands and shows schematically the storage state of the empty tray in an empty tray storage means. It is sectional drawing which expands and shows schematically the storage state of the tray by which the package device accommodation is completed in the accommodated tray storage means. It is a perspective view which shows the state which accommodates a package device in a cassette. It is a perspective view which expands and shows the mechanism for storing and conveying the tray in the package substrate dividing apparatus. It is sectional drawing which shows schematically the procedure of taking out the empty tray from an empty tray storage means. It is a perspective view which shows the state in which the package device was accommodated in the tray. It is sectional drawing which shows schematically the procedure which stores the tray in which the package device was accommodated in the accommodated tray storage means.

  A package substrate dividing apparatus 1 shown in FIG. 1 is an apparatus that cuts a package substrate 200 shown in FIG. 2 and divides it into individual package devices. The package substrate 200 is formed by dividing a plurality of devices by a planned division line 200a and resin-sealing, and becomes a package device 200b by cutting along the planned division line 200a. In the package substrate 200 of the example of FIG. 2, the region where the package device 200b is formed is divided into a block 201a and a block 201b.

  At the front of the package substrate dividing apparatus 1 shown in FIG. 1, a cassette support means 2 for supporting a cassette 2a containing a plurality of package substrates 200 before division, and an operation means 3 for giving an operation instruction to the apparatus. And.

  The cassette support means 2 includes a table 20 on which a plurality of (two in the illustrated example) cassettes 2a are placed, and a support base 21 that supports the table 20 so as to be movable in the horizontal direction (X-axis direction). The support base 21 can be moved up and down.

  On the rear side of the cassette support means 2 in the Y-axis direction, package substrate unloading means 4 for unloading the package substrate 200 from the cassette 2a supported by the cassette support means 2 is disposed. The package substrate unloading means 4 includes a sandwiching section 40 for sandwiching the package substrate 200 in the thickness direction, a moving mechanism 41 for moving the sandwiching section 40 in the Y-axis direction, and a temporary placing means 42 for temporarily placing the unloaded package substrate. It has.

  The moving mechanism 41 includes a rail 410 extending in the Y-axis direction and an arm portion 411 that moves in the Y-axis direction along the rail 410, and a clamping portion 40 is formed at the tip of the arm portion 411. With the movement of 411 in the Y-axis direction, the clamping unit 40 is also moved in the same direction.

  The temporary placing means 42 has a pair of rails 420 having an L-shaped cross section whose longitudinal direction is the Y-axis direction, and the pair of rails 420 can move in a direction toward and away from each other. When the pair of rails 420 are close to each other, the package substrate 200 can be supported and aligned at a certain position.

  A jig table 5 that holds the package substrate 200 during cutting is disposed below the package substrate carry-out means 4. As shown in FIG. 3, the jig table 5 is fixed to a rotatable turntable 50 and is rotatable and movable in the X-axis direction.

  The jig table 5 communicates with a groove 51 formed at a position corresponding to the division line 200a of the package substrate 200 and a suction source (not shown) in order to avoid contact with a cutting blade described later when the package substrate 200 is cut. The plurality of suction holes 51 are respectively formed in regions partitioned by the grooves 51.

  As shown in FIG. 1, a cutting means 6 having a rotatable cutting blade 60 is disposed on the movement path of the jig table 5. The cutting means 6 can move in the Y-axis direction and the Z-axis direction, and can cut the package substrate 200 held on the jig table 5.

  Above the movement path of the jig table 5, an upper surface cleaning means 65 for cleaning the upper surface of the package substrate after cutting is completed and divided into individual package devices is disposed. The upper surface cleaning means 65 can remove the cutting waste adhering to the upper surface of the package substrate 200, for example, by spraying a cleaning liquid downward.

  On the rear side of the upper surface cleaning means 65 in the Y-axis direction, a lower surface cleaning means 7 for cleaning the lower surface of the package substrate after cutting is disposed. The lower surface cleaning means 7 is constituted by, for example, a brush, and removes cutting waste adhering to the lower surface by contacting the lower surface of the package substrate 200.

  On the rear side of the lower surface cleaning means 7 in the Y-axis direction, there is disposed a drying means 8 for drying the package substrate after the upper surface and the lower surface are cleaned. The drying means 8 is constituted by a hot plate, for example.

  Above the temporary placing means 42, the lower surface cleaning means 7 and the drying means 8, a conveying means 9 for conveying the package substrate 200 is disposed. The transport unit 9 includes a suction pad 90 that sucks the upper surface of the package substrate 200, a moving mechanism 91 that moves the suction pad 90 in the Y-axis direction, and a lifting mechanism 92 that moves the suction pad 90 up and down in the Z-axis direction. Yes. This transport means 9 has a function of sucking and holding the entire upper surface of the package substrate 200 aligned by the temporary placement means 42 and transporting it to the jig table 5, and sucking the entire upper surface of the divided package substrate 200 after the top surface cleaning. A function of holding and transporting from the jig table 5 to the lower surface cleaning means 7 and a function of sucking and holding the entire upper surface of the divided package substrate 200 after the lower surface cleaning and transporting it from the lower surface cleaning means 7 to the drying means 8. Have.

  On the side of the package substrate dividing apparatus 1, an empty tray storage means 10 for storing empty trays for storing package devices, and a storage for storing trays for storing package substrates divided into package devices are stored. A tray storage means 11 is provided.

  As shown in FIGS. 4 and 5, the tray 30 stored in the empty tray storage unit 9 and the stored tray storage unit 10 includes a bottom plate 300, a side wall 301 erected from the end of the bottom plate 300, and a side wall 301. And a sheet 303 laid on the bottom plate 301. The sheet 303 has a tacking force. As the sheet 303, for example, an assist tape manufactured by Shin-Etsu Polymer Co., Ltd., a flex carrier manufactured by UMI Co., Ltd., a gel base manufactured by EXCIAL Corporation, or the like can be used. . A space surrounded by the sheet 303, the side wall 301, and the protruding portion 302 forms a housing portion 304 for housing the package device. The accommodating portion 304 is not provided with a partition wall that divides the package device, and its bottom surface is formed in a flat shape.

  The empty tray storage means 10 shown in FIG. 1 includes a rack portion 100 for storing empty trays stacked in a plurality of stages, and a locking portion 101 that can be moved in and out from the inner wall of the rack portion 100 and supports empty trays. A lifting table 102 on which the tray is placed from below the rack unit 100, a piston 103 connected to the lifting table 102, and a cylinder 104 that lifts and lowers the piston 103 are provided. The rack portion 100 is formed so as to penetrate in the vertical direction.

  As shown in FIG. 6, the locking portion 101 supports the protruding portion 302 of the empty tray 30 accommodated in the lowest step in the rack portion 100 from below. The locking portion 101 is formed in a T-shaped cross section, and includes a horizontal portion 105 that extends in the horizontal direction and a hanging portion 106 that extends downward from the central portion of the horizontal portion 105, and one end portion of the horizontal portion 105. Enters the lower portion of the protrusion 302 to support the empty tray 30 from below. The hanging portion 106 includes a rotating shaft 106a having a horizontal axis, and the locking portion 101 is rotatable about the rotating shaft 106a. A movable plate 107 is rotatably connected to a lower end of the hanging portion 106 via a connecting shaft 107a having a horizontal axis, and the movable plate 107 is attached to be horizontal by a spring 108. It is energized. An inclined surface 107 b is formed at one end of the movable plate 107. On the other hand, the end surface 102a of the lifting table 102 is formed as an inclined surface having the same angle as the inclined surface 107b.

  As shown in FIG. 1, the stored tray storage means 11 can freely move in and out from a rack portion 110 for storing the stored trays storing the divided package substrates in a plurality of stages, and an inner wall of the rack portion 110. A locking portion 111 for supporting the stored tray, a lifting table 112 on which an empty tray is placed below the rack portion 110, a piston 113 coupled to the lifting table 112, and a cylinder 114 for lifting and lowering the piston 113. I have.

  As shown in FIG. 7, the locking portion 111 supports the protruding portion 302 of the empty tray 30 accommodated in the lowest step in the rack portion 110 from below. The locking portion 111 is formed in an L-shaped cross section, and a hanging portion 115 extending in the vertical direction and a horizontal portion 116 extending in the horizontal direction from the lower end of the hanging portion 115 are integrally formed, and the horizontal portion 116 is a protruding portion. By entering the lower part of 302, the stored tray 30 is supported from below. The lower surface 117 of the horizontal portion 116 is formed in an arc shape. The hanging portion 115 is provided with a rotating shaft 115a having a horizontal axis, and the locking portion 111 is rotatable around the rotating shaft 115a.

  Carrying out empty trays from the empty tray storage means 10 shown in FIG. 1 and storing trays storing package devices in the stored tray storage means 11 are performed by the tray transport means 12. The tray transport unit 12 includes a tray storage unit 120 that stores an empty tray or a stored tray, and a drive unit 121 that moves the tray storage unit 120 in the Y-axis direction.

  At the rear of the package substrate dividing apparatus 1 in the Y-axis direction, there is provided transfer means 13 for transferring the dried package substrate that has been divided into package devices and dried by the drying means 8 to an empty tray in units of package substrates. . The transfer means 13 includes a suction pad 130 for sucking the entire surface of the package substrate divided into package devices, a lifting / lowering means 131 for moving the suction pad 130 up and down, and a moving unit 132 for moving the suction pad 130 in the X-axis direction. It is configured.

  In the following, in the package substrate dividing apparatus 1 shown in FIG. 1, the package substrate 200 shown in FIG. 2 is cut and divided into individual package devices, and the package devices are placed on the tray 30 shown in FIGS. The storing operation will be described.

  As shown in FIG. 8, a plurality of package substrates 200 to be cut are stored in the cassette 2a. A plurality of cassettes 2a are placed on the table 20 shown in FIG.

  Then, as the support base 21 shown in FIG. 1 is raised, the table 20 slides in the X-axis direction, so that one of the cassettes 2a is positioned in front of the temporary placement means 42. Next, the clamping part 40 moves forward, the clamping part 40 clamps one package substrate 200 in the cassette 2a, and moves to the rear side, whereby the package substrate 200 is unloaded from the cassette 2a. At this time, the pair of rails 420 is set at an interval so that the package substrate 200 can be supported and slid from below.

  The package substrate 200 carried out from the cassette 2a is placed on the rail 420 and released from the gripping portion 40. Then, the package substrate 200 is aligned at a certain position by moving the rails 420 toward each other.

  Next, the suction pad 90 constituting the transport unit 9 moves above the package substrate 200, and the suction pad 90 descends to suck the package substrate 200. Then, the rail 420 moves away from each other, the suction pad 90 descends between the pair of rails 420, the package substrate 200 is placed on the jig table 5, and the suction by the suction pad 90 is released.

  When the package substrate 200 placed in this way is held on the jig table 5, the jig table 5 moves in the X-axis direction, and a division line 200a (see FIG. 2) to be cut is detected and the division is scheduled. The line 200a and the cutting blade 60 are aligned in the Y-axis direction. Then, the jig table 5 moves in the X-axis direction, the cutting means 6 descends while the cutting blade 60 rotates at a high speed, and the detected divisional line 200a is cut.

  While the cutting means 6 is indexed in the Y-axis direction, the division planned lines 200a are sequentially cut to cut all the division planned lines 20a in the same direction. When the jig table 5 is rotated by 90 degrees and then cut in the same manner, all the division lines 200a are cut and divided into individual package devices.

  Since the jig table 5 is formed with suction holes 52 for sucking individual package devices, the package device maintains the shape of the package substrate as a whole and is sucked into the jig table 5 even after being divided. After being cut, the divided package substrate is held on the jig table 5 and returned to the lower side of the temporary placement means 42. In the course of the movement, the upper surface of each package device is cleaned with the cleaning liquid ejected from the upper surface cleaning means 65. At this time, the end material is removed from the jig table 5 by the pressure of the cleaning liquid.

  When the package substrate 200 held on the jig table 5 returns below the temporary placement means 42, the suction pad 90 descends and the entire divided package substrate 200 is sucked with the pair of rails 420 separated. Hold. Then, the suction pad 90 rises, further moves downward as it moves rearward in the Y-axis direction, and moves in the Y-axis direction while bringing the lower surface of the divided package substrate 200 into contact with the lower surface cleaning means 7 to clean the lower surface. To do.

  Next, the suction pad 90 rises and further moves rearward in the Y-axis direction, and the package substrate 200 is dried by causing the lower surface of the divided package substrate 200 to face the lower surface of the drying means 8. Thereafter, all package devices constituting the package substrate 200 are accommodated in the tray 30 shown in FIGS. 4 and 5.

  As shown in FIG. 9, a plurality of empty trays 30 are accommodated in a rack portion 100 of the empty tray storage means 10. The empty tray 30 accommodated at the lowest position is supported by the locking portion 101 as shown in FIG. When taking out the lowest empty tray 30 from this state, as shown in FIG. 10B, the lifting table 102 is raised, the end surface 102a is brought into contact with the inclined surface 107b, and the rotary shaft 106a is used as a center. The stop 101 is rotated in the direction of arrow A. Then, as shown in FIG. 10C, the support of the protruding portion 302 by the horizontal portion 105 is released, and the empty tray 30 falls on the lifting table 102 as shown in FIG. 10D. At this time, the lifting table 102 is located above the movable plate 107. Further, as the lowermost tray 30 is lowered, the second tray 30 from the bottom also falls, but since the locking portion 101 returns to the original state, the second tray 30 has the locking portion 101. Supported by.

  When the empty tray 30 falls on the lifting table 102, the lifting table 102 is then lowered. Then, as shown in FIG. 10E, the movable plate 107 rotates in the direction of arrow B about the connecting shaft 107a against the urging force of the spring 108, and further lowers the lifting table 102. By placing the tray accommodating portion 120 that constitutes the tray conveying means 12 directly below the lifting table 102 and further lowering the lifting table 102, as shown in FIG. It is accommodated in the tray accommodating portion 120.

  Referring to FIG. 1, the empty tray 30 thus taken out of the empty tray storage means 10 is positioned in the vicinity of the drying means 8 as the tray accommodating portion 120 moves in the Y-axis direction. On the other hand, the divided front surface of the package substrate 200 is sucked by the suction pad 130 and the lifting part 131 moves up the suction pad 130, and then the suction pad 130 and the lifting part 131 move in the X-axis direction. Then, the movement is stopped immediately above the empty tray 30 accommodated in the tray accommodating portion 120, and the lifting / lowering portion 131 lowers the suction pad 130 and presses the entire divided package substrate 200 against the empty tray 30. Since the sheet 303 having tack force is laid on the empty tray 30, all the package devices are accommodated and held in the empty tray 30 while maintaining the shape of the package substrate 200 as a whole. As described above, the elevating unit 131 functions as a pressing unit that presses the lower surface of the package substrate 200 sucked and held by the suction pad 130 against the sheet 303 having tack force.

  Thereafter, the suction by the suction pad 130 is released, and the suction pad 130 similarly transports the next divided package substrate 200 to the empty tray 30. In this way, the package device 200b is accommodated in the empty tray 30 as shown in FIG. In the example shown in FIG. 11, the package device 200b is accommodated in the tray 30 in a state of being divided into a block 201a and a block 201b.

  When the package device is accommodated in the tray 30 in this way, the tray accommodating portion 120 that accommodates the tray 30 moves forward in the Y-axis direction, and is positioned directly above the lifting table 112 that constitutes the accommodated tray storage means 11 shown in FIG. Is done. At this time, since the sheet 30 having tack force is laid on the tray 30, the package device 202b does not move in the tray 30 during conveyance.

  When the tray 30 in which the package device 200b is accommodated moves immediately above the elevation table 112, the elevation table 112 is raised as shown in FIG. 12A, and the tray 30 in which the package device 200b is accommodated is pushed up. Then, as shown in FIG. 12B, the protruding portion 302 of the tray 30 rises while being in contact with the lower surface 117 of the horizontal portion 116, and the protruding portion 302 becomes lower surface 117 by the rotation of the locking portion 111 in the arrow C direction. 12C, as shown in FIG. 12C, the locking portion 111 rotates in the direction of arrow D and returns to the original position, and the protruding portion 302 enters above the horizontal portion 116, and the horizontal portion 116 Is supported from below. In this way, the trays 30 in which the package devices 200b are stored are sequentially stored in the stored tray storage unit 11.

  As described above, in the package substrate dividing apparatus 1, the package substrate 200 is taken out from the cassette 2a, the package substrate 200 is divided by cutting, the divided package substrate 200 is washed, and the divided package substrate 200 is transferred to the tray 30. A series of operations such as storing the tray 30 storing the divided package substrates 200 is automatically performed.

  After the package substrate 200 is divided into individual package devices 200b, the package substrate 200 divided into trays each having a receiving portion 304 having a flat bottom surface without partition walls that divide the package device is packaged as a package substrate unit. Therefore, a facility for accommodating each package device 200b in the tray 30 becomes unnecessary. Therefore, the mechanism for accommodating the package device 200b in the tray 30 can be reduced in size, the area occupied by the apparatus can be reduced, and the equipment cost can be reduced. Further, since the partition wall is not formed on the tray 30, fine control for aligning each package device with each region partitioned by the partition wall becomes unnecessary.

  4 and FIG. 5, the sheet 303 having tack force is laid in the accommodating portion 304 of the tray 30, and the transfer means 13 shown in FIG. 1 is divided into package devices 200b. 200 is composed of a suction pad 130 that sucks and holds the entire upper surface of 200, and an elevating part (pressing part) 131 that presses the lower surface of the package substrate 200 sucked and held by the suction pad 130 on a sheet 303 having tack force. The elevator unit (pressing unit) 131 simply presses the lower surface of the package substrate against the sheet having the tack force, so that the divided package substrate is accommodated and held in the tray while maintaining the shape of the package substrate. Therefore, the transfer process to the tray is further simplified, and even if there is no partition in the tray, the package device is not moved and damaged in the tray when the tray is transported.

1: Package substrate splitting device 2: Cassette support means 20: Table 21: Support stand 2a: Cassette 3: Operation means 4: Package substrate carry-out means 40: Holding part 41: Moving mechanism 410: Rail 411: Arm part 42: Temporary placement Means 420: Rail 5: Jig table 50: Turntable 51: Groove 52: Suction hole 6: Cutting means 60: Cutting blade 65: Upper surface cleaning means 7: Lower surface cleaning means 8: Drying means 9: Conveyance means 90: Suction pad 91: Movement mechanism 92: Lifting mechanism 10: Empty tray storage means 100: Rack part 101: Locking part 102: Lifting table 103: Piston 104: Cylinder 105: Horizontal part 106: Hanging part 107: Movable plate 107a: Connecting shaft 107b : Inclined surface 11: Stored tray storage means 110: Rack part 111: Locking part 112: Lifting table 113 Piston 114: Cylinder 115: hanging part 116: horizontal portion 117: lower surface 12: the tray conveying means 120: a tray accommodating portion 121: driving portion 13: sorting means 130: suction pad 131: elevating unit (pressing portion)
132: Drive unit 200: Package substrate 200a: Divided line 200b: Package device 30: Tray 300: Bottom plate 301: Side wall 302: Projection part 303: Sheet 304: Storage part

Claims (1)

A package substrate dividing apparatus that divides a package substrate in which a plurality of devices are partitioned by dividing lines and sealed with resin into individual package devices,
Cassette support means for supporting a cassette containing a plurality of package substrates;
Package substrate unloading means for unloading the package substrate from the cassette supported by the cassette support means;
Temporary placement means for temporarily placing the unloaded package substrate and aligning the package substrate;
Transport for transporting the package substrate aligned by the temporary placement means to a jig table having grooves formed at positions corresponding to the division lines of the package substrate and suction holes in the regions defined by the grooves. Means,
A cutting means provided with a rotatable cutting blade for cutting the package substrate held on the jig table;
An upper surface cleaning means for cleaning the upper surface of the package substrate which has been cut and divided into individual package devices;
A lower surface cleaning means for cleaning the lower surface of the package substrate that is divided into package devices and whose upper surface is sucked and held;
A drying means for drying the package substrate after cleaning;
An empty tray storage means for storing a tray having an accommodating portion in which the bottom surface is formed in a flat shape without a partition partitioning the package device;
Tray unloading means for unloading an empty tray from the empty tray storage means;
Transfer means for transferring the package substrate divided into package devices and dried by the drying means to the unloaded empty tray in units of the package substrate;
It is comprised at least from a stored tray storage means for storing a tray storing the package substrate divided into package devices,
The position where the package substrate is transferred to the jig table, the lower surface cleaning means and the drying means are arranged in a straight line in this order ,
A sheet having tack force is laid in the tray accommodating portion, and the transfer means sucks and holds the entire upper surface of the package substrate divided into package devices, and sucks and holds the suction pads on the suction pads. A pressing portion that presses the lower surface of the packaged substrate against the sheet having the tack force;
Package substrate splitting device consisting of

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