CN103871864A - Cutting device - Google Patents
Cutting device Download PDFInfo
- Publication number
- CN103871864A CN103871864A CN201310659804.8A CN201310659804A CN103871864A CN 103871864 A CN103871864 A CN 103871864A CN 201310659804 A CN201310659804 A CN 201310659804A CN 103871864 A CN103871864 A CN 103871864A
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- China
- Prior art keywords
- machined object
- packaging
- base plate
- cutting
- splicing tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
The invention provides a cutting device which is used for achieving the shortening of processing time and good cutting technology for the the packaging of miniaturized semiconductor chips. The cutting device is characterized in that the cutting device is provided with a stack box loading zone which is used for loading a stack box at an uppe opening, wherein the stack box stacks and accommodates processed objects, which are dried by a drying member, pasted to pasting bands and cut into chips, according to each pasting band; a processed object accommodation member which enables the above processed objects to be inserted into the stack box from the top; and a control member which controls a processed object moving-out member, a moving member, a processed object moving-in member, a camera member,a cutting member, the drying memebr, a processed object delivery member, and a processed object accommodation member.
Description
Technical field
The present invention relates to for forming to being clathrate on surface the segmenting device that multiple machined objects of cutting apart preset lines are cut apart.
Background technology
The electric equipment such as portable phone and personal computer is required lightweight more, miniaturization, has also developed and has been known as CSP(Chip Size Package: chip size packages for the encapsulation technology of semiconductor chip) the manufacturing technology of compact package.
As the technology relevant to CSP, for example, be known as QFN(Quad Flat Non-lead Package: four limit flat non-pins encapsulation) encapsulation technology be practical.
Arranged the base plate for packaging of this encapsulation by being cut off along cutting apart preset lines, be divided into one by one the CSP after encapsulation, the package dimension after cutting apart reduces year by year.
And, this base plate for packaging being divided in the processing of encapsulation one by one, as the division processing in semiconductor wafer, consider semiconductor wafer to paste the splicing tape that is installed on frame the processing of carrying out conveyance.
But base plate for packaging exists following situation compared with semiconductor wafer: process time is short, cut apart also easily (the cut time is short), and base plate for packaging having been pasted in the structure of splicing tape, splicing tape proportion in holistic cost is higher.
Therefore, be desirably in the division processing of carrying out base plate for packaging in the situation that does not use band, thereby develop as lower device: directly conveyance/fixing base plate for packaging, and after cutting apart, the encapsulation that becomes chip (disk) is received into conveyance pallet (for example, with reference to patent documentation 1.）。
[patent documentation 1] TOHKEMY 2001-23936 communique
But, due to one by one being transferred to conveyance pallet, receives chip, therefore there is the time-consuming problem of its operation.
In addition, carefully receive one by one chip, be relatively difficult to damaged chip (encapsulation) for not needing, also carried out the processing (excessively specialized) of undue carefulness.
In addition, in the time of division processing, for keeping platform to be arranged in the encapsulation one by one of base plate for packaging, directly attract to fix and carried out along the cutting of cutting apart preset lines, but because the undersized and attraction area encapsulating reduces, therefore there is following problem: work in-process chip moves, cannot carry out good cutting.
Summary of the invention
Therefore, the present invention completes just in light of this situation, and its object is to provide a kind of segmenting device of the encapsulation for the semiconductor chip for the manufacture of miniaturization progress, for realizing the technology of shortening and good cutting of process time.
According to the invention described in the 1st aspect, a kind of segmenting device is provided, it is cut apart machined object along multiple preset lines of cutting apart, this machined object be clathrate on surface and be formed with multiple cut apart preset lines and have by multiple preset lines of cutting apart divide the multiple regions that form, this segmenting device is characterised in that to possess: box mounting region, it loads the box that is accommodated with the machined object before processing, and the machined object before this processing is pasted with the splicing tape with machined object equal sizes overleaf; Machined object is taken out of member, and the machined object loading before the processing of receiving in the box in box mounting region is taken out of interim placement member by it; Keep platform, it carries out attracting holding via splicing tape to machined object; Mobile member, it makes to keep platform to move to machined object is moved into and is taken out of move into/take out of region and machining area; Machined object is moved into member, and the machined object of taking out of before the processing of interim placement member is moved into the maintenance platform that is positioned to move into/take out of region by it; Shooting member, it takes the machining area of answering that keeps the machined object that keeps of platform; Cutting member, it is disposed in machining area and has bite, and this bite is to keeping the machined object before the processing of platform institute attracting holding to cut; Cleaning element, it is to by utilizing cutting member machined object is cut to the multiple chips that are divided into one by one to clean along multiple preset lines of cutting apart; Dry member, it is dried the multiple chips after cleaning; Machined object conveyance member, it has attracting holding pad, this attracting holding pad has multiple attractions hole in the region corresponding at the multiple chips that load with the maintenance platform that is positioned to move into/take out of region, what described machined object conveyance member loaded the maintenance platform that is positioned to move into/take out of region be adhered to splicing tape and be split into chip one by one after machined object conveyance to dry member; Stack of cassettes mounting region, its stack of cassettes to upper opening loads, this stack of cassettes according to each splicing tape stacked and storage by dry member dry and be adhered to splicing tape and be split into chip one by one after machined object; Machined object storage member, it will paste splicing tape according to each splicing tape and be split into one by one chip and carry out dried machined object by dry member and be inserted into stack of cassettes from top; And control member, it is taken out of member, mobile member, machined object to machined object and moves into member, shooting member, cutting member, dry member, machined object conveyance member and machined object storage member and control.
According to the invention described in the 2nd aspect, a kind of segmenting device is provided, in its invention described in aspect the 1st, be characterised in that, keep platform with the length side of machined object cut apart two ends in preset lines cut apart region corresponding to preset lines in there is a pair of escape of the cutting edge of avoiding bite, with there is respectively attraction hole by cutting apart preset lines in dividing region corresponding to multiple regions of forming, this maintenance platform carries out attracting holding via splicing tape to machined object.
According to the present invention, owing to can reliably keeping machined object via splicing tape, also can maintain good machining state even if therefore chip size is less, the area of splicing tape can also be suppressed to the required MIN area equal with machined object, can reduce above-mentioned cost for splicing tape.
And, by using stacked as the base plate for packaging of machined object and be received in stack of cassettes, compared with base plate for packaging being received into one by one to the mode in the past of conveyance pallet, can carry out at short notice taking out of of base plate for packaging, the processing of can implementation efficiency good base plate for packaging.
And, according to the invention described in the 2nd aspect, can from base plate for packaging, remove the leftover pieces part of the end in base plate for packaging.
Accompanying drawing explanation
Fig. 1 is the stereogram of the segmenting device of embodiment of the present invention.
Fig. 2 is the stereogram that keeps platform and base plate for packaging.
Fig. 3 illustrates the cutaway view that by cutting unit, the end line of base plate for packaging is carried out the situation of cut.
Fig. 4 illustrates the cutaway view of cutting apart preset lines and carry out the situation of cut to base plate for packaging by cutting unit.
Fig. 5 illustrates that base plate for packaging is divided into the cutaway view of the state after chip one by one.
Fig. 6 is the end view picking up to base plate for packaging from drying table that illustrates that machined object accommodation device carries out.
Fig. 7 is the end view of the conveyance of the base plate for packaging that illustrates that machined object accommodation device carries out.
Fig. 8 is the end view of the storage to stack of cassettes of the base plate for packaging that illustrates that machined object accommodation device carries out.
Fig. 9 is the end view that the process of picking up that arrives the base plate for packaging that machined object accommodation device carries out is shown.
Label declaration
1: base plate for packaging
2: segmenting device
4: cutting unit
10f: leftover pieces part
10g: leftover pieces part
14: drying table
31: keep platform
35: stack of cassettes
T: splicing tape
Embodiment
Below, with reference to the accompanying drawings of the execution mode of segmenting device of the present invention.
In Fig. 1, illustrate for cutting off along cutting apart preset lines the segmenting device 2 that keeps the base plate for packaging 1 that keeps of platform 31.At the central portion of the device case 20 of segmenting device 2, be equipped with and keep as the machined object maintaining body 3 of the base plate for packaging 1 of machined object and the cutting unit (cutting member) 4 cutting for the base plate for packaging 1 that machined object maintaining body 3 is kept.
Machined object maintaining body 3 possesses the maintenance platform 31(retaining member that base plate for packaging 1 is carried out to attracting holding) and support the maintenance platform supporting member 32 that keeps platform 31.
Fig. 2 shows base plate for packaging 1 and keeps the stereogram of platform 31, is formed with and arranges the 31m of attracting holding portion that multiple attractions hole 31k forms at the upper surface 31c that keeps platform 31.
The attraction hole 31k of the 31m of attracting holding portion is communicated with not shown attraction member, and is configured in respectively and the cutting apart preset lines 10a and the 2nd by the 1st and cut apart preset lines 10b and be divided into position corresponding to cancellate multiple region of base plate for packaging 1.
In the 31m of attracting holding portion, be set with the position 31h of the mounting regulation that should load base plate for packaging 1, at the position 31h of this mounting regulation mounting base plate for packaging 1, and by attracting 31k place, hole to attract each zoning, base plate for packaging 1 attracting holding is arrived and keeps platform 31.
Be formed with two escape 31e, 31f on the length direction N that is keeping platform 31, extending at the upper surface 31c that keeps platform 31.This escape 31e, 31f keep platform 31 for the cutting edge of avoiding bite described later so that it is not cut into.
Escape 31e, 31f be arranged to base plate for packaging 1 extend at length direction N the 1st to cut apart end line 10d, the 10e of two end portions in preset lines 10a, that be configured in respectively the short degree direction M of base plate for packaging 1 consistent.
Base plate for packaging 1 is rectangle in the time overlooking, cut apart preset lines 10b and be divided in cancellate region cutting apart the 2nd of preset lines 10a and short degree direction M by the 1st of length direction N, dispose chip size packages (CSP) 10c that has carried out molding by synthetic resin part.
In the short degree direction M of base plate for packaging 1, the position in the outside in end line 10d, 10e is removed and discarded as leftover pieces part 10f, 10g.
Be pasted with the band 10T with cementability of sheet in a side (surface or the back side) of base plate for packaging 1.This side entirety that pastes the base plate for packaging being stuck with 10T prevents in the mobile situation of cutting chips size encapsulation, for making after cutting chip size packages 10c one by one there is no deviation, is configured to and has the size equating with base plate for packaging 1.
Specifically by aftermentioned, the base plate for packaging 1 forming is as described above cut apart preset lines 10a and the 2nd along the 1st and is cut apart preset lines 10b and be cut off and be divided into one by one the chip size packages 10c after encapsulation.
In addition, as shown in Figure 1, the maintenance platform supporting member 32 that forms machined object maintaining body 3 is configured to by not shown rotary drive mechanism, when maintenance platform 31 is maintained to level, makes its rotation.In addition, keep platform supporting member 32 by not shown X-direction mobile member, moving into/taking out of region 33, and carry out moving between the machining area 45 of processing of cutting unit 4 shown in Fig. 1.
Main shaft housing 41 is configured to by not shown Y direction mobile member and moves along Y direction.Main shaft 42 drives rotation by drive sources such as not shown servomotors.In the illustrated embodiment, bite 43 adopt with metal or resinoid bond by diamond abrasive grain in conjunction with after discoid gasket type cutter.Cutting fluid supply nozzle 44 is connected with not shown cutting fluid supply member, cutting fluid is supplied to the cutting portion being cut by bite 43.
At the entrance position of machining area 45 that disposes cutting unit 4, be equipped with the upper surface cleaning device 5 for the upper surface that carries out the base plate for packaging 1 after cut at machining area 45 is cleaned.This upper surface cleaning device 5 is disposed in the upside of the mobile route of the maintenance platform 31 that forms machined object maintaining body 3, keeps on platform 31 and by the upper surface jet cleaning liquid of the base plate for packaging 1 after cutting unit 4 cut remaining on.
Be provided with box mounting region 6a in a side of the Y direction of machined object maintaining body 3, described box mounting region 6a loads the box that is accommodated with the base plate for packaging 1 before processing, and in box mounting, region 6a is equipped with first mounting table 60 mobile along the vertical direction by not shown lift component.In this first mounting table 60, mounting is accommodated with the box 6 of multiple base plate for packaging 1.Being equipped with interim placement in the front side of box mounting region 6a is accommodated in the base plate for packaging 1 in box 6 and carries out the interim placement mechanism 7 of contraposition and take out of mechanism 8 for the machined object of the base plate for packaging 1 that is accommodated in box 6 being taken out of to interim placement mechanism 7.
At interim placement mechanism 7 and move into/take out of and be equipped with machined object between region 33 and move into device (machined object is moved into member) 9, this machined object move into device 9 for by base plate for packaging 1 conveyance before taking out of interim placement mechanism 7 and having carried out the processing of contraposition to being positioned at the maintenance platform 31 of moving into/take out of region 33.This machined object is moved into device 9 and is made up of following parts: attracting holding pad 91, the supporting attracting holding pad 91 of the upper surface of attracting holding base plate for packaging 1 cylinder mechanism 92, the working arm 93 of supporting cylinder mechanism 92 and the not shown working arm mobile member that working arm 93 is moved along Y direction that attracting holding pad 91 is moved along the vertical direction.
And, by above structure, machined object is taken out of to mechanism 8 and machined object and moves into device 9 and be configured to base plate for packaging 1 from being positioned in box 6 conveyances the first mounting table 60 to the conveyance member performance function that keeps platform 31.
The cylinder mechanism 92 that machined object is moved into device 9 possesses camera head 18, and this camera head 18 is for detection of the machining area of answering of the base plate for packaging 1 being kept by the maintenance platform 31 that is positioned to move into/take out of region 33.This camera head 18 is made up of optical components such as microscope or CCD cameras.
In the Y direction of machined object maintaining body 3, with the position of interim placement mechanism 7 in opposition side, be equipped with the lower surface cleaning device (lower surface cleaning element) 13 cleaning for the lower surface of the base plate for packaging 1 to after cut clipping maintenance platform supporting member 32.In the present embodiment, this lower surface cleaning device 13 is configured to and has: be configured to a pair of cleaning roller 13a being made up of sponge etc. that can rotate; With not shown cleaning solution supplying member from cleaning fluid to cleaning roller 13a that supply with.
Be equipped with drying table 14 in the side of cleaning roller 13a, this drying table 14 blows out dry air for the lower surface of the base plate for packaging 1 after cleaning makes it dry.This drying table 14 for example can use the structure of the dry air of being supplied with by not shown dry air source from the ejection of multiple holes to realize.
Above cleaning roller 13a, be provided with for the machined object carrying device 17 to drying table 14 by base plate for packaging 1 conveyance on maintenance platform 31.Machined object carrying device 17 is configured to be had: the attracting holding pad 17a that carries out attracting holding to loading the upper surface of the machined object after the processing that is split into chip one by one that keeps platform 31; Supporting attracting holding pad 17a also makes attracting holding pad 17a along the mobile cylinder mechanism 17b of Z-direction (above-below direction); The working arm 17c of supporting cylinder mechanism 17b; And the not shown drive unit that working arm 17c is moved along Y direction.
In addition, at attracting holding pad 17a, in multiple regions corresponding in the multiple chip size packages (CSP) that form with cutting base plate for packaging 1, be formed with respectively and attract hole, by this attraction hole, each chip size packages is carried out to attracting holding.
Machined object carrying device 17 be configured to by base plate for packaging 1 from keeping platform 31 conveyances to the process of drying table 14, by suitable driving cylinder mechanism 17b and working arm 17c, the lower surface of base plate for packaging 1 is cleaned with lower surface cleaning device 13, then by base plate for packaging 1 conveyance to drying table 14.
Above drying table 14, be equipped with upper surface drying device 16, this upper surface drying device 16 blows out dry air for the upper surface of the base plate for packaging 1 after cleaning makes it dry.This upper surface drying device 16 be configured to there is the jetting nozzle 16a of ejection dry air, for make its cylinder mechanism 16b moving along the vertical direction, the working arm 16c of supporting cylinder mechanism 16b and the not shown mobile member that working arm 16c is moved along Y direction in supporting jetting nozzle 16a.
Be provided with stack of cassettes mounting region 38 in the side of drying table 14, this stack of cassettes mounting region 38 is for loading the stack of cassettes 35 of can stacked multiple base plate for packaging 1 that cut receiving.
The position of the front surface in device case 20 in stack of cassettes mounting region 38, is provided with the pull-out element 34 for stack of cassettes 35 is come in and gone out.
Carry out dried base plate for packaging 1 by drying table 14 and pass through 36 conveyances of machined object accommodation device to stack of cassettes 35, and receive in stacked mode in stack of cassettes 35.
Machined object accommodation device 36 is configured to be had: to loading the attracting holding pad 36a that carries out attracting holding in the upper surface of the dried base plate for packaging 1 of drying table 14; Supporting attracting holding pad 36a also makes attracting holding pad 36a along the mobile cylinder mechanism 36b of Z-direction (above-below direction); The working arm 36c of supporting cylinder mechanism 36b; And the not shown drive unit that working arm 36c is moved along Y direction.
Can, by above structure, realize and be used for implementing apparatus structure of the present invention.; a kind of segmenting device 2; it is cut apart the base plate for packaging 1 as machined object along multiple preset lines of cutting apart; described base plate for packaging 1 be clathrate on surface and form multiple cut apart preset lines 10a, 10b and have by multiple preset lines 10a, 10b cut apart divide the multiple regions that form; in this segmenting device 2; be made as the structure having with lower member: box mounting region 6a; it loads the box 6 that is accommodated with the base plate for packaging 1 before processing, and the base plate for packaging 1 before this processing is pasted the splicing tape T with base plate for packaging 1 equal sizes overleaf; Machined object is taken out of mechanism's (machined object is taken out of member) 8, and the base plate for packaging 1 loading before the processing of receiving in the box 6 of box mounting region 6a is taken out of interim placement mechanism (interim placement member) 7 by it; Keep platform 31, it carries out attracting holding via splicing tape T to base plate for packaging 1; Not shown X-direction mobile member (mobile member), it makes to keep platform 31 to move to base plate for packaging 1 is moved into and is taken out of move into/take out of region 33 and machining area 45; And machined object moves into device (machined object is moved into member) 9, the base plate for packaging 1 of taking out of before the processing of interim placement mechanism (interim placement member) 7 is moved into the maintenance platform 31 that is positioned to move into/take out of region 33 by it.
Be made as the structure also having with lower member: camera head (shooting member) 18, it takes the machining area of answering that keeps the base plate for packaging 1 that keeps of platform 31; Cutting unit (cutting member) 4, it is disposed in machining area 45 and has bite 43, and this bite 43 is to by keeping the base plate for packaging 1 before the processing of platform 31 attracting holdings to cut; Upper surface cleaning device 5 and lower surface cleaning device 13, they are respectively as carrying out work by the cleaning element that multiple chips are cleaned, and described multiple chips are by being cut base plate for packaging 1 and they are divided into obtain one by one along multiple preset lines 10a, 10b cut apart by cutting unit 4; Drying table 14 and upper surface drying device 16, they carry out work as the dry member that the multiple chips after cleaning are dried respectively.
In addition, also have: machined object carrying device (machined object conveyance member) 17, it has attracting holding pad 17a, this attracting holding pad 17a has multiple attractions hole in the region corresponding at the multiple chips that load with the maintenance platform 31 that is positioned to move into/take out of region 33, what described machined object carrying device 17 loaded the maintenance platform 31 that is positioned to move into/take out of region 33 be adhered to splicing tape T and be split into chip one by one after base plate for packaging 1 conveyance to drying table 14; Stack of cassettes mounting region 38, its stack of cassettes 35 to upper opening loads, and described stack of cassettes 35 is the stacked and storage base plate for packaging 1 after being dried, being adhered to splicing tape T by drying table 14 and being split into chip one by one according to each splicing tape T; And machined object accommodation device (machined object storage member) 36, it will paste splicing tape T according to each splicing tape T and be split into one by one chip and be inserted into stack of cassettes 35 from top by the dried base plate for packaging 1 of drying table 14.
And, be made as and also possessed control device (control member) 70(Fig. 1) structure, described control device 70 is to forming controlling with lower member of segmenting device 2: machined object is taken out of mechanism's (machined object is taken out of member) 8, make the X-direction mobile member (mobile member) that keeps platform 31 to move, machined object is moved into device (machined object is moved into member) 9, camera head (shooting member) 18, cutting unit (cutting member) 4, drying table 14, upper surface drying device 16(is dried member), machined object carrying device (machined object conveyance member) 17 and machined object accommodation device (machined object storage member) 36.
The example of the processing of then, the segmenting device 2 forming as above being carried out describes.
Fig. 3 illustrates the cutaway view that carries out the situation of cut by cutting unit 4 to being kept the end line 10d of base plate for packaging 1 of platform 31 attracting holdings.
Thus, keep platform 31 with the length side of the base plate for packaging 1 as machined object cut apart two ends in preset lines 10a, 10a cut apart region corresponding to preset lines in there is a pair of escape 31e, the 31f of the cutting edge of avoiding bite 43, with in cutting apart region corresponding to multiple regions that preset lines 10a, 10a divide, there is respectively hole 31k, the 31k of attraction, be that machined object has carried out attracting holding via splicing tape T to base plate for packaging 1.
Thus, can remove from base plate for packaging 1 the leftover pieces part 10f of the end of the short degree direction M in base plate for packaging 1.In addition,, for the opposing party's leftover pieces part 10g, can, by carrying out the cutting of end line 10e, be made as shown in Figure 4 the state of removing after leftover pieces part 10f, 10g from base plate for packaging 1 too.
Fig. 4 illustrates by cutting unit 4 being kept the cutaway view of cutting apart preset lines 10a and carry out the situation of cut of base plate for packaging 1 of platform 31 attracting holdings.
Carry out like this cut to cutting apart preset lines 10a.In addition, bite 43 in Y direction by index feed, the preset lines 10a of cutting apart extending at length direction for base plate for packaging 1 carries out cut, then make to keep platform 31 90-degree rotations by the rotation that keeps platform supporting member 32, carry out for base plate for packaging 1 extend at length direction cut apart preset lines 10b(Fig. 2) cut.
By above use Fig. 3 and the illustrated content of Fig. 4, as shown in Figure 5, base plate for packaging 1 becomes the state being split into after chip (chip size packages 10c) one by one.But chip 10c, 10c are owing to being the state that is adhered to splicing tape T, therefore becoming to be arranged in the surperficial state of splicing tape T one by one.
And, in this processing, owing to can reliably keeping machined object via splicing tape T, also can maintain good machining state even if therefore chip size is less, and the area of splicing tape T can be suppressed to the required MIN area equal with machined object, can reduce above-mentioned cost for splicing tape T.
In addition, as shown in Figure 2, in base plate for packaging 1, for leftover pieces part 10j, the 10k of the end of length direction N, be finally can remove and discarded part, but do not carry out the removal processing of the full cutting of the utilization shown in Fig. 3.This is owing to for example considering in the time peeling off the operation of each chip from splicing tape T, leftover pieces part 10j, 10k are used as conveyance by handle part etc.
Fig. 6 is the end view picking up to base plate for packaging 1 from drying table 14 that illustrates that machined object accommodation device 36 carries out.Attracting holding pad 36a is by working arm 36c(Fig. 1) be positioned to the top of drying table 14, and drop to wording depth H2 by cylinder mechanism 36b from standby height H 1.
By starting to attract after attracting holding pad 36a decline wording depth H2, by attracting holding pad 36a attracting holding base plate for packaging 1, become the state that can pick up from drying table 14 base plate for packaging 1.
Fig. 7 is the end view of the conveyance of the base plate for packaging 1 that illustrates that machined object accommodation device 36 carries out.Attracting holding pad 36a makes it rise to standby height H 1 under the state that remains potted substrate 1 by cylinder mechanism 36b, and by working arm 36c(Fig. 1) move it stack of cassettes mounting region 38.
In stack of cassettes mounting region 38, dispose stack of cassettes 35, on the base plate 35a of this stack of cassettes 35, the overlapping base plate for packaging 1 that is placed with.
The top of stack of cassettes 35 is open, can make base plate for packaging 1 and attracting holding pad 36a enter in stack of cassettes 35 from top.
Stack of cassettes 35 has base plate 35a that can be mobile along the vertical direction, can be on this base plate 35a stacked configuration packages substrate 1.Thus, by by stacked base plate for packaging 1 and be received in stack of cassettes 35, compared with base plate for packaging 1 being received into one by one to the mode in the past of conveyance pallet, can carry out at short notice taking out of of base plate for packaging 1, the processing of can implementation efficiency good base plate for packaging 1.
The supporting station 37b of the upper end of the base plate 35a of stack of cassettes 35 by being arranged at the bar 37a moving up and down is supported from below.The height of this supporting station 37b is controlled as the height of the base plate 35a in stack of cassettes 35 or loads the height H 3 that is controlled as regulation in the upper level of the base plate for packaging 1 of topmost.The height H 3 of this regulation is set to the height of the upper surface 14a of drying table 14 roughly the same.
Fig. 8 is the figure of the storage to stack of cassettes 35 of the base plate for packaging 1 that illustrates that machined object accommodation device 36 carries out.Attracting holding pad 36a is by working arm 36c(Fig. 1) be positioned to the top of stack of cassettes 35, and drop to wording depth H2 by cylinder mechanism 36b from standby height H 1.
Attracting stopping after attracting holding pad 36a decline wording depth H2, removing the attracting holding of attracting holding pad 36a to base plate for packaging 1, becoming base plate for packaging 1 is placed on to the state on the base plate for packaging 1 that has been placed on base plate 35a.
In addition, as shown in Figure 8, in drying table 14, next want conveyance to the base plate for packaging 1 of stack of cassettes 35 and implement dry processing by 17 conveyances of machined object carrying device.
Fig. 9 is the figure that the process of picking up that arrives the base plate for packaging 1 that machined object accommodation device 36 carries out is shown.Attracting holding pad 36a rises to standby height H 1 again by cylinder mechanism 36b, and by working arm 36c(Fig. 1) move to the top of drying table 14.
The mobile while with attracting holding pad 36a herein, moves to by bar 37a the position that below reduces base plate 35a, and the upper level that is placed on the base plate for packaging 1 of topmost is configured to the height H 3 of regulation.
By this setting, as shown in Figure 8, by making attracting holding pad 36a drop to wording depth H2, can on the base plate for packaging 1 of having received, load new base plate for packaging 1 in stack of cassettes 35.
And, in the above embodiment, because the position of the above-below direction of attracting holding pad 36a can be set to standby height H 1 and these two positions of wording depth H2, therefore can, by having used the simple and easy control of cylinder mechanism 36b, implement the storage from drying table 14 to stack of cassettes 35 of base plate for packaging 1.
Claims (2)
1. a segmenting device, it is cut apart machined object along multiple preset lines of cutting apart, this machined object be clathrate on surface and be formed with multiple cut apart preset lines and have by the plurality of preset lines of cutting apart divide the multiple regions that form,
This segmenting device is characterised in that to possess:
Box mounting region, it loads the box that is accommodated with this machined object before processing, and this machined object before this processing is pasted with the splicing tape with this machined object equal sizes overleaf;
Machined object is taken out of member, and this machined object loading before the processing of receiving in this box in this box mounting region is taken out of interim placement member by it;
Keep platform, it carries out attracting holding via this splicing tape to this machined object;
Mobile member, it moves to this maintenance platform to move into/take out of region and machining area, moves into/takes out of region this machined object is moved into and taken out of at this;
Machined object is moved into member, and it moves into by taking out of machined object before the processing of this interim placement member this maintenance platform that is positioned this and moves into/take out of region;
Shooting member, it takes the machining area of answering of machined object that this maintenance platform keeps;
Cutting member, it is disposed in this machining area and has bite, and the machined object of this bite before to the processing of this maintenance platform institute attracting holding cuts;
Cleaning element, it cleans multiple chips, and the plurality of chip is by utilizing this cutting member along multiple preset lines of cutting apart, machined object to be cut and is divided into one by one;
Dry member, it is dried the multiple chips after cleaning;
Machined object conveyance member, it has attracting holding pad, this attracting holding pad has multiple attractions hole in the region corresponding with being positioned multiple chips that this this maintenance platform of moving into/taking out of region loads, this machined object conveyance member by be positioned that this this maintenance platform of moving into/taking out of region loads be adhered to this splicing tape and be split into chip one by one after machined object conveyance to this dry member;
Stack of cassettes mounting region, its stack of cassettes to upper opening loads, this stack of cassettes according to each this splicing tape stacked and storage by this dry member carried out dry and be adhered to this splicing tape and be split into chip one by one after this machined object;
Machined object storage member, it will be adhered to this splicing tape according to each this splicing tape and be split into one by one chip and carried out dried this machined object by this dry member and be inserted into stack of cassettes from top; And
Control member, it is taken out of member, this mobile member, this machined object to this machined object and moves into member, this shooting member, this cutting member, this dry member, this machined object conveyance member and this machined object storage member and control.
2. segmenting device according to claim 1, is characterized in that,
Described maintenance platform
With described in the length side of described machined object, cut apart two ends in preset lines this there is a pair of escape of the cutting edge of avoiding described bite in cutting apart region corresponding to preset lines,
With cut apart preset lines by this and there is respectively attraction hole in dividing region corresponding to multiple regions of forming,
Via described splicing tape, this machined object is carried out to attracting holding.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012269429A JP2014116461A (en) | 2012-12-10 | 2012-12-10 | Dividing device |
| JP2012-269429 | 2012-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103871864A true CN103871864A (en) | 2014-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310659804.8A Pending CN103871864A (en) | 2012-12-10 | 2013-12-09 | Cutting device |
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| Country | Link |
|---|---|
| JP (1) | JP2014116461A (en) |
| CN (1) | CN103871864A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107225700A (en) * | 2016-03-25 | 2017-10-03 | 株式会社迪思科 | The operating method of package substrate |
| CN108527499A (en) * | 2017-03-06 | 2018-09-14 | 株式会社迪思科 | Processing unit (plant) |
| CN108987326A (en) * | 2017-06-02 | 2018-12-11 | 株式会社迪思科 | Chip accommodation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6389755B2 (en) * | 2014-12-22 | 2018-09-12 | 株式会社ディスコ | Cutting apparatus and cutting method |
| CN105415135A (en) * | 2015-10-30 | 2016-03-23 | 深圳市远洋翔瑞机械股份有限公司 | Automatic feeding and discharging machining device of numerically-controlled machine tool |
| JP2020061453A (en) * | 2018-10-10 | 2020-04-16 | 株式会社ディスコ | Package substrate processing method |
| JP7308621B2 (en) * | 2019-02-19 | 2023-07-14 | 株式会社ディスコ | Conveyor |
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| JP4309084B2 (en) * | 2001-11-26 | 2009-08-05 | アピックヤマダ株式会社 | Dicing machine |
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| CN107225700A (en) * | 2016-03-25 | 2017-10-03 | 株式会社迪思科 | The operating method of package substrate |
| CN108527499A (en) * | 2017-03-06 | 2018-09-14 | 株式会社迪思科 | Processing unit (plant) |
| CN108527499B (en) * | 2017-03-06 | 2021-06-04 | 株式会社迪思科 | Processing device |
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| CN108987326B (en) * | 2017-06-02 | 2024-02-20 | 株式会社迪思科 | Chip storage method |
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| Publication number | Publication date |
|---|---|
| JP2014116461A (en) | 2014-06-26 |
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Application publication date: 20140618 |