CN102582954A - Transportation pallet - Google Patents
Transportation pallet Download PDFInfo
- Publication number
- CN102582954A CN102582954A CN2012100021155A CN201210002115A CN102582954A CN 102582954 A CN102582954 A CN 102582954A CN 2012100021155 A CN2012100021155 A CN 2012100021155A CN 201210002115 A CN201210002115 A CN 201210002115A CN 102582954 A CN102582954 A CN 102582954A
- Authority
- CN
- China
- Prior art keywords
- packaging
- base plate
- suction
- tray
- anchor clamps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention provides a transportation pallet capable of handing parts from a clamp thereto efficiently. The transportation pallet accommodates a plurality of parts and handles the parts, which comprises a pallet body consisting of a part supporting member and a frame member, and an adhesion layer. The part supporting member is provided with a surface for supporting the plurality of parts. The frame member surrounds the outer circumference of the part supporting member. The adhesion layer provides an adhesive force and is arranged on the surface of the part supporting member of the pallet body.
Description
Technical field
The present invention relates to take in semiconductor devices and the transportation tray carried of cuttings such as being cut device (dicing) after device is cut apart.
Background technology
In the semiconductor devices Fabrication procedure; Form IC (Integrated Circuit on the surface of the semiconductor wafer of circular plate shape roughly being a plurality of zones of arranging on reticulation ground; IC), LSI (Large Scale Integration; Large-scale integration circuit) device such as through cutting off along the preset lines of cutting apart of dividing each zone that forms said device, thereby is made device one by one.Device after so cutting apart is packed and be widely used in electrical equipments such as portable phone and Personal Computer.
Electrical equipment such as portable phone and Personal Computer is asked to lightweight more, miniaturization, has also developed the encapsulation technology that can realize miniaturization that is called wafer-level package (CSP, Chip Scale Package) for the encapsulation of semiconductor devices.A kind of as CSP technology is called encapsulation technology that four sides do not have pin flat package (QFN, Quad Flat Non-lead Package) by practicability.This encapsulation technology that is called QFN does; Be at metal sheets such as copper coins and dispose a plurality of devices rectangularly, utilize the resin portion that resin forming is formed from the rear side of device to make metal sheet and device integrated, thus formation csp substrate (base plate for packaging); Wherein, At metal sheets such as said copper coins, be formed with a plurality of and the cooresponding splicing ear of splicing ear device, and be reticulation and be formed with according to what each device was divided and cut apart preset lines.Cut apart preset lines through the edge this base plate for packaging is cut off, thereby be partitioned into packaged device (wafer-level package) one by one.
The cut-out of above-mentioned base plate for packaging is generally implemented through the topping machanism that possesses cutting tool.This topping machanism possesses anchor clamps; These anchor clamps with cut apart the cooresponding zone of preset lines and be the relief groove that reticulation ground is formed with the cutting edge withdrawing that supplies cutting tool; And a plurality of zones being marked off by relief groove are respectively equipped with SS; Base plate for packaging suction remained on be positioned to keep these anchor clamps on the bench board; Keep bench board to relatively move while the cutting tool rotation is made, thus base plate for packaging is cut off and be divided into device one by one along cutting apart preset lines along the preset lines of cutting apart of base plate for packaging.Then, the device that is divided into one by one is accommodated in the transportation tray that possesses a plurality of ingathering chambers and is carried to assembling procedure (for example with reference to patent documentation 1).
Patent documentation 1: TOHKEMY 2001-239365 communique
Yet a plurality of ingathering chambers of being located at transportation tray are to be divided by the next door respectively accordingly with the size of device (wafer-level package) to form, and there is the loaded down with trivial details problem of management in the transportation tray of the big or small cooresponding kind of therefore necessary preparation and device.
In addition, the device that must will be divided into is one by one transferred to transportation tray from anchor clamps one by one, and this transfering process needs the time, aspect capacity rating, not necessarily can satisfy.
Summary of the invention
The present invention accomplishes just in view of the above fact, and its major technology problem is to provide a kind of transportation tray, and this transportation tray can have nothing to do with the size of device and efficiently device transferred to transportation tray from anchor clamps.
In order to solve above-mentioned major technology problem, according to the present invention, a kind of transportation tray is provided, this transportation tray is taken in a plurality of devices and is carried, it is characterized in that,
This transportation tray possesses:
Tray main body, said tray main body comprise device support and frame portion, and said device support has the surface of a plurality of devices of supporting, and said frame portion forms round the periphery of this device support; And
Viscous layer, said viscous layer have force of cohesion and are installed on the surface of the device support of said tray main body.
Preferably, the device support and the viscous layer of said tray main body have light transmission.
Transportation tray of the present invention possesses: tray main body, and it comprises device support and frame portion, and said device support has the surface of a plurality of devices of supporting, and said frame portion forms round the periphery of this device support; And viscous layer; It has force of cohesion and is installed on the surface of the device support of said tray main body; Therefore, need not to be provided with a plurality of ingathering chambers that mark off accordingly with one by one device, need not to prepare pallet with the big or small cooresponding kind of one by one device.Therefore, can tackle various devices by enough a kind of transportation trays, management is able to simplify.In addition; Transportation tray of the present invention in the mounted on surface of device support have a viscous layer of force of cohesion; Therefore can a plurality of devices that cutter sweeps such as utilizing topping machanism is partitioned into one by one be transferred on the viscous layer through the device Handling device together, can increase productivity.
Description of drawings
Fig. 1 is as the block diagram of the base plate for packaging of machined object and cutaway view.
Fig. 2 is the maintenance anchor clamps of the expression base plate for packaging that is used to keep shown in Figure 1 and is keeping anchor clamps to maintain the block diagram of the state of base plate for packaging.
Fig. 3 is the block diagram that is used for base plate for packaging shown in Figure 1 is divided into the topping machanism of device one by one.
Fig. 4 is the instruction diagram through the cut-out operation of topping machanism enforcement shown in Figure 3.
Fig. 5 is that the block diagram that base plate for packaging after the cut-out operation shown in Figure 4 is divided into the state behind the device has one by one been implemented in expression.
Fig. 6 is the block diagram according to the transportation tray of the present invention's formation.
Fig. 7 is the cutaway view along the A-A line of Fig. 6.
Fig. 8 is the instruction diagram that the state of Fig. 6 and transportation tray shown in Figure 7 is transferred to a plurality of devices shown in Figure 5 in expression.
Fig. 9 is the instruction diagram of expression state that a plurality of devices of transferring to transportation tray are as illustrated in fig. 8 picked up.
Label declaration
1: base plate for packaging;
113: device;
2: keep anchor clamps;
20: the suction maintaining part;
21,22: relief groove;
23: SS;
3: topping machanism;
32: the suction operation platform;
33: main axle unit;
333: cutting tool;
5: transportation tray;
51: tray main body;
511: the device support;
512: frame portion;
52: viscous layer;
6: the device Handling device;
61: suction keeps pad;
7: pick up chuck.
The specific embodiment
Below, for the transportation tray that constitutes according to the present invention preferred embodiment, describe in further detail with reference to accompanying drawing.
(a) of Fig. 1 and (b) expression as the block diagram and the cutaway view of the base plate for packaging of machined object.(a) of Fig. 1 and (b) shown in base plate for packaging 1 possess metal sheet 11, the surperficial 11a of metal sheet 11 be reticulation ground be formed with along predetermined direction extend a plurality of first cut apart preset lines 111 and edge with this first cut apart preset lines 111 quadratures direction extend second cut apart preset lines 112.Cut apart a plurality of zones that preset lines 112 is divided into and dispose device (wafer-level package) 113 respectively cutting apart preset lines 111 and second by first, this device 113 is utilized synthetic resin part 12 to carry out moulding from the rear side of metal sheet 11.The base plate for packaging 1 that so forms is cut apart preset lines 111 and second along first and is cut apart preset lines 112 cut-outs and be divided into packaged one by one device 113.
When above-mentioned base plate for packaging 1 is cut apart preset lines 111 and second and cut apart preset lines 112 and cut off along a plurality of first, keep through maintenance anchor clamps 2 like (a) of Fig. 2 with (b).
Shown in Fig. 2 (a), keep anchor clamps 2 in the outstanding suction maintaining part 20 that is provided with the above-mentioned base plate for packaging 1 of suction maintenance of the surperficial central portion that forms rectangular shape.At the upper surface (maintenance face) of suction maintaining part 20, be formed at base plate for packaging 1 first cut apart preset lines 111 and second and cut apart preset lines 112 cooresponding zones, be formed with the relief groove 21 and 22 of the cutting edge withdrawing of the cutting tool of stating after the confession with being reticulation.In addition, in suction maintaining part 20, be formed with SS 23 respectively in a plurality of zones that marked off by relief groove 21 and 22, said SS 23 is communicated with not shown aspiration means.In addition, in four jiaos that keep anchor clamps 2 holes 24 that are provided with location usefulness.At the maintenance anchor clamps 2 that so constitute, the upper surface (maintenance face) that is shown in suction maintaining part 20 like (b) of Fig. 2 year is put above-mentioned base plate for packaging 1.
Then, explain that with reference to Fig. 3 will carry the base plate for packaging 1 that places above-mentioned maintenance anchor clamps 2 cuts apart the topping machanism that preset lines 111 and second is cut apart preset lines 112 cut-outs along first.
Topping machanism 3 possesses the main axle unit 33 as cutting unit.Main axle unit 33 moves along the index feed direction shown in the arrow Y among Fig. 3 through not shown index feed member, and moves along the cutting-in direction of feed shown in the arrow Z among Fig. 3 through not shown cutting-in feeding member.This main axle unit 33 possesses: main shaft housing 331, and it is installed on not shown mobile foundation and is that direction shown in the arrow Y and cutting-in direction are to move adjustment on the direction shown in the arrow Z in index direction; Live spindle 332, it is rotatably freely supported on this main shaft housing 331; And cutting tool 333, it is installed on the leading section of this live spindle 332.
In addition, topping machanism 3 possesses takes member 34, and this shootings member 34 is used for the surface that remains on the machined object on the above-mentioned suction operation platform 32 is taken, and detects the zone that should be cut by above-mentioned cutting tool 333.The optical system that this shooting member 34 possesses capturing element (CCD) and is made up of microscope, and this shooting member 34 is delivered to not shown control member with the picture signal that photographs.
At first, upload to put at the suction operation platform 32 of topping machanism 3 and keep anchor clamps 2, these maintenance anchor clamps were equipped with base plate for packaging 1 in 2 years.At this moment, through making the hole 24 of being located at four jiaos a plurality of location usefulness that keeps anchor clamps 2 chimeric, be positioned preposition thereby will carry the maintenance anchor clamps 2 that are equipped with base plate for packaging 1 with four jiaos the locating dowel pin 323 that is provided in suction operation platform 32.Then; Through making not shown aspiration means action; Come via suction operation platform 32 pump orifice 322, suction recess 321, be located at a plurality of SSs 23 that keep anchor clamps 2 and each device 113 that carries the base plate for packaging 1 that places the suction maintaining part 20 that keeps anchor clamps 2 done in order to negative pressure, each device 113 suction of base plate for packaging 1 are remained on the suction maintaining part 20 that keeps anchor clamps 2 (base plate for packaging maintenance operation).
After having implemented above-mentioned base plate for packaging and having kept operation, make not shown cutting feeding member action and the maintenance anchor clamps 2 that kept base plate for packaging 1 are moved to take member 34 under.When keep anchor clamps 2 to be positioned taking member 34 under after, carry out calibrating operation through taking member 34 with not shown control member, this calibrating operation detects the machining area that should carry out cutting of base plate for packaging 1.Promptly; Take member 34 and carry out image processing such as pattern match with not shown control member and carry out carrying out the calibration of the machining area of cutting, image processing such as said pattern match be used to carry out base plate for packaging 1 along predetermined direction form first cut apart preset lines 111 with along first cut apart the cutting tool 333 that preset lines 111 cuts position alignment.In addition, second cut apart preset lines 112, carry out similarly and should carry out the calibration of the machining area of cutting for what the direction of edge that on base plate for packaging 1, forms and above-mentioned predetermined direction quadrature was extended.
As stated; Behind the calibrating operation of carrying out the machining area that should carry out cutting that detects base plate for packaging 1; Make to keep anchor clamps 2 to move to cutting zone, shown in Fig. 4 (a), will be scheduled to first cut apart preset lines 111 an end be positioned to compare cutting tool 333 under in (a) of Fig. 4 slightly on the right side position.Then,, make cutting tool 333 carry out the cutting-in feeding of scheduled volume to the direction shown in the arrow Z1 while make cutting tool 333 make not shown cutting-in feeding member action to the rotation of the direction shown in the arrow 333a, and the penetraction depth that is positioned to be scheduled to.The outer peripheral edges that this penetraction depth is set at the cutting edge of cutting tool 333 arrive the position of the relief groove 21 (with reference to (a) of Fig. 2) be formed at the suction maintaining part 20 that keeps anchor clamps 2.Then, make not shown cutting feeding member action and suction operation platform 32 direction shown in the arrow X1 in Fig. 4 (a) is moved with predetermined cutting Feeding speed.And; Via keep anchor clamps 2 remain in suction operation platform 32 base plate for packaging 1 predetermined first cut apart preset lines 111 the other end shown in Fig. 4 (b), arrive compare cutting tool 333 under keep left slightly behind the position of side; The mobile of suction operation platform 32 stopped; And cutting tool 333 is risen to the direction shown in the arrow Z2, and index feed first is cut apart preset lines 111 and is repeated cutting operation to what next should cut then.Consequently, base plate for packaging 1 is cut apart preset lines 111 cut-outs (first cuts off operation) along first.
After having implemented the above-mentioned first cut-out operation; Make suction operation platform 32 rotate 90 degree; To second cut apart preset lines 112 to be positioned at the cutting direction of feed be the direction shown in the arrow X what form via the base plate for packaging 1 that keeps anchor clamps 2 to remain in suction operation platform 32; Then, cutting off operation for base plate for packaging 1 and above-mentioned first likewise cuts apart preset lines 112 along all second and implements to cut off operations (second cuts off operation).
As shown in Figure 5, implemented first as previously discussed and cut off operation and second and cut off the base plate for packaging 1 of operation and cut apart preset lines 111 and second along first and cut apart preset lines 112 cut-outs, be divided into device (wafer-level package) 113 one by one.The device one by one 113 that so is partitioned into maintains the state that is kept by the suction maintaining part that keeps anchor clamps 2 20 suctions.
The transportation tray of stating after the device 113 that is partitioned into as stated is incorporated in and to be transferred to subsequent processing be assembling procedure.Herein, the transportation tray that constitutes according to the present invention is described with reference to Fig. 6 and Fig. 7.
Fig. 6 and transportation tray 5 shown in Figure 7 are made up of with the viscous layer 52 that is installed on the surface of this tray main body 51 tray main body 51 of rectangular shape.Tray main body 51 is formed by the synthetic resin with light transmission (for example acrylic resin); This tray main body 51 comprises device support 511 and frame portion 512; Said device support 511 has the above-mentioned a plurality of devices of supporting (wafer-level package) 113 surperficial 511a, and said frame portion 512 forms round the periphery of this device support 511.Device support 511 has the recess of the rectangular shape of the upper surface that is formed at tray main body 51, and the bottom surface of the recess of this rectangular shape is as the surperficial 511a performance function of a plurality of devices 113 of supporting.In the bottom surface of this device support 511, respectively be provided with 2 engaging recessed part 511b, the 511b (engaging recessed part 511b, the 511b of a side only are shown among Fig. 6) that engages with the support unit of not shown Handling device in the short side direction both sides.Surperficial 511a at the device support 511 that so forms is equipped with viscous layer 52.Viscous layer 52 is made up of the thin slice with force of cohesion.As thin slice, can use new タ Star Network to change into the product that Co., Ltd. makes the commodity of selling " セ パ レ ス " or " Ha Application デ コ タ Star Network " by name with force of cohesion.The device support 511 and the viscous layer 52 of the tray main body 51 of the transportation tray 5 that preferably, so constitutes have light transmission.
Then, explain that with reference to Fig. 8 a plurality of devices (wafer-level package) 113 that will be divided into as illustrated in fig. 5 one by one are received into the method for transportation tray 5 from the suction maintaining part 20 that keeps anchor clamps 2.
With a plurality of devices 113 when the suction maintaining part 20 that keeps anchor clamps 2 is received into transportation tray 5, use device Handling device 6 to implement in the illustrated embodiment.Device Handling device 6 possesses suction and keeps the suction maintenance pad 61 of a plurality of devices and the carrying arm 62 that this suction of portion's supporting at one end keeps pad 61, carries arm 62 and moves by not shown actuating mechanism.Suction keeps pad 61 to be made up of with absorption layer 612 pad main body 611, and pad main body 611 possesses the recess 611a with the onesize rectangular shape of the base plate for packaging that forms above-mentioned a plurality of devices 113 1 at lower surface, and absorption layer 612 is embedded in the recess 611a of this pad main body 611.Pad main body 611 is provided with the pump orifice 611b that is communicated with above-mentioned recess 611a at central portion.This pump orifice 611b is communicated with not shown aspiration means.Above-mentioned absorption layer 612 forms rectangular shape, and this absorption layer 612 likewise is being provided with a plurality of SS 612a with a plurality of devices 113 cooresponding positions with the SS 23 that is located at the suction maintaining part 20 of above-mentioned maintenance anchor clamps 2.Therefore, when not shown aspiration means is moved, a plurality of SS 612a are done in order to negative pressure via pump orifice 611b and recess 611a.
When use above-mentioned device Handling device 6 with a plurality of devices 113 when the suction maintaining part 20 that keeps anchor clamps 2 is received into transportation tray 5; Shown in Fig. 8 (a), make the action of not shown actuating mechanism and the lower surface that will aspirate the absorption layer 612 that keeps pad 61 is positioned to carry the upper surface of putting a plurality of devices 113 on the suction maintaining part 20 of maintenance anchor clamps 2.Then; Move through removing the suction that the aspiration means is communicated with suction operation platform 32 sides carries out and making with aspirating the not shown aspiration means that the pump orifice 611b that keeps pad 61 is communicated with, thus via pump orifice 611b and recess 611a to a plurality of SS 612a works of being located at absorption layer 612 in order to negative pressure.Consequently, a plurality of device 113 suctions are remained on a plurality of SS 612a that are located at absorption layer 612.After so a plurality of device 113 suctions being remained in a plurality of SS 612a that are arranged on absorption layer 612; Make not shown actuating mechanism action; Shown in Fig. 8 (b), will aspirate and keep pad 61 to be carried on the transportation tray 5; The lower surface of a plurality of devices 113 that suction is remained on the lower surface (adsorption plane) of absorption layer 612 carries on the viscous layer 52 that places tray main body 51, and this viscous layer 52 is installed on the surperficial 511a of device support 511.Then; Remove the suction that not shown aspiration means carries out and make not shown actuating mechanism action and make suction keep pad 61 to keep out of the way from transportation tray 5, thus as Fig. 8 (c) shown in a plurality of devices 113 be transferred to transportation tray 5 on the viscous layer 52 of the surperficial 511a installation of device support 511.In addition, a plurality of devices 113 that are transferred on the viscous layer 52 of transportation tray 5 are held and unlikely coming off by means of the force of cohesion of viscous layer 52.
As previously discussed; Transportation tray 5 of the present invention is installed the viscous layer 52 with force of cohesion at the surperficial 511a of device support 511; Therefore need not to be provided with a plurality of ingathering chambers that mark off accordingly with one by one device 113, need not to prepare pallet with the big or small cooresponding kind of one by one device 113.Therefore, can tackle various devices 113 by enough a kind of transportation trays 5, management is simplified.In addition; Transportation tray 5 of the present invention is installed the viscous layer 52 with force of cohesion at the surperficial 511a of device support 511; Therefore can a plurality of devices 113 be shifted on the suction maintaining part 20 that keeps anchor clamps 2 through device Handling device 6 as described above together, can increase productivity.
The a plurality of devices 113 that are accommodated in transportation tray 5 as previously discussed are moved to assembling procedure.As illustrated in fig. 9; In assembling procedure; The chuck 7 that picks up through pickup device picks up according to each device 113; But have light transmission owing to constitute the device support 511 of the tray main body 51 of transportation tray 5 with viscous layer 52 this moment, therefore through from the downside of transportation tray 5 by light source 8 irradiates lights, thereby can discern device 113 one by one reliably.Promptly; Device 113 is one by one cut apart that preset lines 111 and second cuts apart that preset lines 112 is cut off and the cut-out groove of formation separates along first as described above; Therefore by means of downside irradiates light from transportation tray 5; Light passes through through the cut-out groove that is divided into device 113 one by one, so can discern the device 113 that is surrounded by this light that passes through reliably.
Claims (2)
1. transportation tray, this transportation tray is taken in a plurality of devices and is carried, it is characterized in that,
This transportation tray possesses:
Tray main body, said tray main body comprise device support and frame portion, and said device support has the surface of a plurality of devices of supporting, and said frame portion forms round the periphery of this device support; And
Viscous layer, said viscous layer have force of cohesion and are installed on the surface of the device support of said tray main body.
2. transportation tray according to claim 1 is characterized in that,
The said device support and the said viscous layer of said tray main body have light transmission.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-002248 | 2011-01-07 | ||
| JP2011002248A JP2012144261A (en) | 2011-01-07 | 2011-01-07 | Transport tray |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102582954A true CN102582954A (en) | 2012-07-18 |
Family
ID=46472336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100021155A Pending CN102582954A (en) | 2011-01-07 | 2012-01-05 | Transportation pallet |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012144261A (en) |
| CN (1) | CN102582954A (en) |
| TW (1) | TW201236954A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935536A (en) * | 2015-12-24 | 2017-07-07 | 株式会社迪思科 | Chip collecting pallet |
| CN107225700A (en) * | 2016-03-25 | 2017-10-03 | 株式会社迪思科 | The operating method of package substrate |
| CN113212943A (en) * | 2021-07-07 | 2021-08-06 | 杭州硅土科技有限公司 | Self-cleaning vacuum release adsorption box for packaging precision devices and self-cleaning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104724336B (en) * | 2013-12-19 | 2017-01-04 | 福士瑞精密工业(晋城)有限公司 | Cutting agency |
| JP2016201511A (en) * | 2015-04-14 | 2016-12-01 | 株式会社ディスコ | Carrying jig |
| TWI567011B (en) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Method and device for conveying the components of the bonding process |
| TWI567008B (en) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Assembly of the components of the transfer device |
| TWI574901B (en) * | 2016-06-15 | 2017-03-21 | All Ring Tech Co Ltd | Method and device for fitting method of fitting process |
| TWI579220B (en) * | 2016-06-15 | 2017-04-21 | All Ring Tech Co Ltd | Method and device for component extraction of fitting process |
| CN108792279A (en) * | 2018-06-26 | 2018-11-13 | 厦门市豪尔新材料股份有限公司 | A kind of protecting box and preparation method thereof, purposes |
| JP7183731B2 (en) * | 2018-11-27 | 2022-12-06 | 日本電気硝子株式会社 | Tray, work package, and work packing method |
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- 2012-01-05 CN CN2012100021155A patent/CN102582954A/en active Pending
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| US5099522A (en) * | 1989-05-29 | 1992-03-24 | Rohm Co., Ltd. | Method and apparatus for performing head-tail discrimination of electronic chip components |
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| CN106935536A (en) * | 2015-12-24 | 2017-07-07 | 株式会社迪思科 | Chip collecting pallet |
| CN106935536B (en) * | 2015-12-24 | 2022-02-18 | 株式会社迪思科 | Chip storage tray |
| CN107225700A (en) * | 2016-03-25 | 2017-10-03 | 株式会社迪思科 | The operating method of package substrate |
| CN113212943A (en) * | 2021-07-07 | 2021-08-06 | 杭州硅土科技有限公司 | Self-cleaning vacuum release adsorption box for packaging precision devices and self-cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201236954A (en) | 2012-09-16 |
| JP2012144261A (en) | 2012-08-02 |
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Application publication date: 20120718 |