JPH05193684A - Semiconductor element transporting container - Google Patents
Semiconductor element transporting containerInfo
- Publication number
- JPH05193684A JPH05193684A JP115492A JP115492A JPH05193684A JP H05193684 A JPH05193684 A JP H05193684A JP 115492 A JP115492 A JP 115492A JP 115492 A JP115492 A JP 115492A JP H05193684 A JPH05193684 A JP H05193684A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- adhesive film
- area
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体素子搬送容器に関
し、特に個片にした半導体素子を収納し搬送する半導体
素子搬送容器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device carrying container, and more particularly to a semiconductor device carrying container for housing and carrying individual semiconductor devices.
【０００２】[0002]
【従来の技術】従来の半導体素子搬送容器は、図３
（ａ），（ｂ）に示すように、基材シート４の片面全面
に粘着膜３が形成されており、基材シート４と半導体素
子搬送容器枠１は、粘着膜３を介して接着さている。半
導体素子２は、粘着膜３により基材シート４に固定され
る。半導体素子搬送容器枠１は、積重ね可能な構造とな
っており、最上部には、空容器あるいは専用のふたをか
ぶせ、各容器、あるいは、ふたを固定し搬送する様な構
造となっていた。2. Description of the Related Art A conventional semiconductor device transport container is shown in FIG.
As shown in (a) and (b), the adhesive film 3 is formed on one entire surface of the base sheet 4, and the base sheet 4 and the semiconductor element transport container frame 1 are bonded via the adhesive film 3. There is. The semiconductor element 2 is fixed to the base material sheet 4 by the adhesive film 3. The semiconductor element carrying container frame 1 has a stackable structure, and the uppermost part is covered with an empty container or a dedicated lid, and each container or lid is fixed and carried.
【０００３】また、半導体素子２を取り出す際は、図４
に示すように、半導体素子２の角部のみ保持する治具５
で治具中央の穴６から真空吸着して保持し、さらに、基
材シート４の下部より針状突起７によって突き上げるこ
とにより取り出していた。Further, when taking out the semiconductor element 2, FIG.
As shown in FIG. 5, a jig 5 that holds only the corners of the semiconductor element 2
It was taken out by vacuum suction from the hole 6 in the center of the jig and holding it, and further by pushing it up from the lower part of the base material sheet 4 by the needle-like projections 7.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の半導体
素子搬送容器では、粘着膜が基材シートの片面全面に施
してあるため、面積の小さな半導体素子から面積の大き
な半導体素子まで使用する場合、接着力は接着面積に比
例する為、すなわち、半導体素子の面積によって接着力
が異なるため半導体素子を安定して搬送したり取り出す
ためには、接着力の異なる粘着膜を施した基材シートを
用意しなければならないという欠点があった。In the conventional semiconductor element transport container described above, since the adhesive film is applied to the entire one surface of the base sheet, when a semiconductor element having a small area to a semiconductor element having a large area is used, Since the adhesive force is proportional to the adhesive area, that is, the adhesive force differs depending on the area of the semiconductor element, so in order to stably transport and take out the semiconductor element, prepare a base sheet with an adhesive film with different adhesive force. It had the drawback of having to do it.
【０００５】本発明の目的は、半導体素子を安定して搬
送したり取り出すことが可能な半導体素子搬送容器を提
供することにある。An object of the present invention is to provide a semiconductor element transport container which can stably transport and take out semiconductor elements.
【０００６】[0006]
【課題を解決するための手段】本発明は、個片にした半
導体素子を収納し搬送する半導体素子搬送容器におい
て、前記半導体素子が載置される載置面に前記半導体素
子を粘着する粘着面積が前記半導体素子の底面の面積よ
りも小さい粘着膜を有している。DISCLOSURE OF THE INVENTION The present invention is a semiconductor element transport container for accommodating and transporting individual semiconductor elements, and an adhesive area for adhering the semiconductor elements to a mounting surface on which the semiconductor elements are mounted. Has an adhesive film smaller than the area of the bottom surface of the semiconductor element.
【０００７】[0007]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００８】図１（ａ），（ｂ）は本発明の第１の実施
例の平面図及びそのＸ−Ｘ′線断面図である。1 (a) and 1 (b) are a plan view and a sectional view taken along line XX 'of the first embodiment of the present invention.
【０００９】第１の実施例は、図１（ａ），（ｂ）に示
すように、粘着膜３は基材シート４の片面の半導体素子
２の載置面に部分的に配置されている。粘着膜３の間隔
は、載置対象とする半導体素子２のうちもっとも辺の長
さの長い半導体素子以上としておけばよく、また、粘着
膜３の粘着力は、載置対象とする半導体素子２のうちも
っとも質量の大きな半導体素子を、載置対象とする半導
体素子２のうちもっとも面積の小さな半導体素子の面積
より小さい面積で保持できる程度とし、粘着膜３の面積
は、載置対象とする半導体素子２のうちもっとも質量の
大きな半導体素子を保持できる程度とする。In the first embodiment, as shown in FIGS. 1 (a) and 1 (b), the adhesive film 3 is partially disposed on the mounting surface of the semiconductor element 2 on one surface of the base material sheet 4. . The distance between the adhesive films 3 may be set to be equal to or larger than that of the semiconductor element 2 to be mounted having the longest side length, and the adhesive force of the adhesive film 3 may be set to the semiconductor element 2 to be mounted. The semiconductor element having the largest mass among the semiconductor elements 2 to be mounted is set to a size smaller than the area of the semiconductor element having the smallest area, and the area of the adhesive film 3 is set to the semiconductor to be mounted. The semiconductor element having the largest mass among the elements 2 can be held.
【００１０】一方、基材シート４は、外周部にも粘着膜
が施され、粘着膜３を介して半導体素子搬送容器枠１に
固定されている。On the other hand, the base material sheet 4 is also provided with an adhesive film on the outer peripheral portion and is fixed to the semiconductor element carrying container frame 1 via the adhesive film 3.
【００１１】この例では、半導体素子の大きさに無関係
に一定の力で保持できるため、搬送時に安定して保持す
ることができ、また、安定した取り出しが可能となる。In this example, since the semiconductor element can be held with a constant force regardless of its size, the semiconductor element can be held stably during transportation and can be taken out stably.
【００１２】図２（ａ），（ｂ），（ｃ）は本発明の第
２の実施例の平面図及びそのＸ−Ｘ′，Ｙ−Ｙ′線断面
図である。2 (a), 2 (b) and 2 (c) are a plan view and a sectional view taken along line XX 'and YY' of the second embodiment of the present invention.
【００１３】第２の実施例は、図２（ａ），（ｂ），
（ｃ）に示すように、粘着膜３は、基材シート４の一辺
に対して平行に一定間隔をおいて配置されている。粘着
膜３の間隔は、載置対象とする半導体素子２のうちもっ
とも辺の長さの長い半導体素子以上とし、粘着膜３の粘
着力は載置対象とする半導体素子２のうちもっとも質量
の大きな半導体素子を、載置対象とする半導体素子２の
うちもっとも辺の長さの短い半導体素子よりも短い長さ
の幅で保持可能の程度とする。The second embodiment is shown in FIGS. 2 (a), 2 (b),
As shown in (c), the adhesive film 3 is arranged in parallel to one side of the base material sheet 4 at a constant interval. The distance between the adhesive films 3 is set to be equal to or larger than that of the semiconductor element 2 to be placed having the longest side length, and the adhesive force of the adhesive film 3 is the largest of the semiconductor elements 2 to be placed. The semiconductor element is set to such a degree that the semiconductor element 2 to be placed can be held with a width shorter than that of the semiconductor element 2 having the shortest side length.
【００１４】一方、基材シート４は、外周部にも粘着膜
３が施され、粘着膜３を介して半導体素子容器枠１に固
定されている。On the other hand, the base material sheet 4 is also provided with an adhesive film 3 on its outer peripheral portion and is fixed to the semiconductor element container frame 1 via the adhesive film 3.
【００１５】この例では、粘着膜３の施されている方向
に平行な半導体素子２の辺の長さに比例した接着力とな
るが、半導体素子２の搭載密度を上げることが可能であ
る。In this example, the adhesive strength is proportional to the length of the side of the semiconductor element 2 parallel to the direction in which the adhesive film 3 is applied, but the mounting density of the semiconductor element 2 can be increased.
【００１６】[0016]
【発明の効果】以上説明したように本発明は、半導体素
子搬送容器において、半導体素子が載置される載置面に
半導体素子を粘着する粘着面積が半導体素子の底面の面
積よりも小さい粘着膜を備えているため、半導体素子の
大きさにより接着力が大きく変化することを防止できる
ため、半導体素子の大きさに応じた接着力の異なる粘着
膜を有する基材シートを用意する必要なしに、安定した
搬送時の半導体素子の保持及び安定した取り出しを可能
にするという効果を有する。As described above, according to the present invention, in the semiconductor element transport container, the adhesive area for adhering the semiconductor element to the mounting surface on which the semiconductor element is mounted is smaller than the area of the bottom surface of the semiconductor element. Since it is possible to prevent the adhesive force from greatly changing depending on the size of the semiconductor element, it is not necessary to prepare a base sheet having an adhesive film having different adhesive force according to the size of the semiconductor element, This has the effect of making it possible to hold and stably take out the semiconductor element during stable transportation.
【００１７】例えば、１ｍｍ平方から１５ｍｍ平方とし
た場合、従来の方法では接着力の違いは２２５倍となる
のに対し、第１の実施例では１倍、第２の実施例で１５
倍となり、接着力が大きく変化するのを防止する効果が
有る。For example, in the case of 1 mm square to 15 mm square, the difference in adhesive force is 225 times in the conventional method, whereas it is 1 time in the first embodiment and 15 times in the second embodiment.
It doubles and has the effect of preventing a large change in the adhesive force.
【図１】本発明の第１の実施例の平面図及びそのＸ−
Ｘ′線断面図である。FIG. 1 is a plan view of a first embodiment of the present invention and its X-
It is a X'line sectional view.
【図２】本発明の第２の実施例の平面図及びそのＸ−
Ｘ′，Ｙ−Ｙ′線断面図である。FIG. 2 is a plan view of a second embodiment of the present invention and its X-
FIG. 6 is a cross-sectional view taken along line X ′, YY ′.
【図３】従来の半導体素子搬送容器の一例の平面図及び
そのＸ−Ｘ′線断面図である。FIG. 3 is a plan view of an example of a conventional semiconductor device transport container and a cross-sectional view taken along line XX ′ thereof.
【図４】図３の半導体素子搬送容器から半導体素子を取
り出す方法を説明する断面図である。FIG. 4 is a cross-sectional view illustrating a method of taking out a semiconductor element from the semiconductor element transport container of FIG.
１ 半導体素子搬送容器枠 ２ 半導体素子 ３ 粘着膜 ４ 基材シート ５ 治具 ６ 治工具中央の孔 ７ 針状突起 1 Semiconductor element transport container frame 2 Semiconductor element 3 Adhesive film 4 Base material sheet 5 Jig 6 Hole in the center of jig / tool 7 Needle-like protrusion
Claims (1)
半導体素子搬送容器において、前記半導体素子が載置さ
れる載置面に前記半導体素子を粘着する粘着面積が前記
半導体素子の底面の面積よりも小さい粘着膜を有してい
ることを特徴とする半導体素子搬送容器。1. A semiconductor element transport container for accommodating and transporting individual semiconductor elements, wherein an adhesive area for adhering the semiconductor element to a mounting surface on which the semiconductor element is mounted is an area of a bottom surface of the semiconductor element. A semiconductor element transport container having a smaller adhesive film than the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP115492A JPH05193684A (en) | 1992-01-08 | 1992-01-08 | Semiconductor element transporting container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP115492A JPH05193684A (en) | 1992-01-08 | 1992-01-08 | Semiconductor element transporting container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05193684A true JPH05193684A (en) | 1993-08-03 |
Family
ID=11493520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP115492A Withdrawn JPH05193684A (en) | 1992-01-08 | 1992-01-08 | Semiconductor element transporting container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05193684A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100479624B1 (en) * | 1997-06-02 | 2005-08-31 | 엔테그리스, 아이엔씨. | Sticky Film Frame for Electronic Device Storage |
| CN100389051C (en) * | 2006-06-07 | 2008-05-21 | 友达光电股份有限公司 | Packing structure |
| CN102582954A (en) * | 2011-01-07 | 2012-07-18 | 株式会社迪思科 | Transportation pallet |
| JP2017036059A (en) * | 2015-08-10 | 2017-02-16 | 信越ポリマー株式会社 | Holder for inspection and manufacturing method of the same |
-
1992
- 1992-01-08 JP JP115492A patent/JPH05193684A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100479624B1 (en) * | 1997-06-02 | 2005-08-31 | 엔테그리스, 아이엔씨. | Sticky Film Frame for Electronic Device Storage |
| CN100389051C (en) * | 2006-06-07 | 2008-05-21 | 友达光电股份有限公司 | Packing structure |
| CN102582954A (en) * | 2011-01-07 | 2012-07-18 | 株式会社迪思科 | Transportation pallet |
| JP2017036059A (en) * | 2015-08-10 | 2017-02-16 | 信越ポリマー株式会社 | Holder for inspection and manufacturing method of the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990408 |