JPH04267356A - Semiconductor element conveying container - Google Patents

Abstract

PURPOSE:To prevent movement of a semiconductor element due to conveyance and to protect the semiconductor element against breakdown during conveyance by forming a basic material sheet having one plane on the inside of frame part and then forming an adhesive material film for mounting the semiconductor element on one plane of the basic material sheet. CONSTITUTION:A semiconductor conveying container comprises a basic material sheet 2 formed on the inside of a frame part 1 while having a plane normal to the height direction and an adhesive material film 3 for mounting a semiconductor element formed on one plane of the basic material sheet 2 wherein the basic material sheet 2 and the adhesive material film 3 are composed of a material which is bent when being pushed with a needle jig from the side where the adhesive material film is not formed. Since the semiconductor element 10 is positioned on the adhesive material film 3 and adhered thereto, the semiconductor element 10 does not move even if it is conveyed while being stacked and thereby initial positioning accuracy can be maintained.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transport container, and more particularly to a semiconductor device transport container having a structure in which a plurality of semiconductor devices are mounted on one plane and transported.

0002

[Prior Art] A conventional semiconductor device transport container is shown in FIG.
), (b), the stackable base 6 has a plurality of rectangular depressions 61 at predetermined positions for mounting and storing semiconductor elements. And Figure 7(a
), (b), each semiconductor element 10 is mounted and housed in a corresponding manner to each recess 61, and the circuit forming surfaces of these semiconductor elements 10 are opposite to the bottom of the recess 61, In addition, in order to protect the circuit formation surface of the semiconductor element 10, the upper part is covered with a protective sheet 7, and a plurality of semiconductor element transport containers are stacked, and the top is an empty semiconductor element transport container with no semiconductor element mounted thereon, or a dedicated semiconductor element transport container. Cover the lid, secure each semiconductor device transport container or lid,
It was designed to be transported.

0003

[Problems to be Solved by the Invention] The conventional semiconductor device transport container described above has a structure in which the semiconductor device 10 is mounted and stored in the recess 61 formed in the base 6. Since the semiconductor device 10 moves during transportation, there is a drawback that when using the semiconductor device 10, the semiconductor device 10 must be taken out from the semiconductor device transportation container and then accurately positioned again before use. Further, if dust gets into the recess 61 or if the semiconductor element 10 hits the wall of the recess 61 during transportation and is partially chipped and small pieces are generated, the gap between the surface of the semiconductor element 10 and the protective sheet 7 There is a problem in that the dust or small pieces move and damage or stain the semiconductor element 10.

Furthermore, if the recess 61 is excessively large compared to the semiconductor element 10, the semiconductor element 10 will rotate about an axis perpendicular to the semiconductor element 10 during transportation within the recess 61. Another disadvantage is that a container for transporting semiconductor devices must be prepared with a recess 61 of a size corresponding to the size of the container.

Furthermore, when taking out the semiconductor element 10,
Since the position of the semiconductor element 10 is inaccurate, the surface of the semiconductor element 10 must be touched and vacuum suction must be performed, or the surface of the semiconductor element 10 may be scratched or the surface of the semiconductor element 1 must be manually removed.
It also had the disadvantage of damaging the corners of the 0, making it defective.

An object of the present invention is to eliminate the movement of semiconductor elements during transportation, prevent damage to semiconductor elements during transportation or damage when taking them out, eliminate the need for repositioning during use, and reduce the size of semiconductor elements. It is an object of the present invention to provide a semiconductor device transport container that can be used even if the dimensions are different.

[0007]

[Means for Solving the Problems] The semiconductor device transport container of the present invention has a frame portion which has a height higher than the thickness of the semiconductor device, has a predetermined space inside, and can be stacked in the height direction;
The frame has a base sheet formed with a plane perpendicular to the height direction inside the frame, and an adhesive film formed on one surface of the base sheet on which the semiconductor element is adhesively mounted. .

[0008]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a plan view and a cross-sectional side view, respectively, showing a first embodiment of the present invention.

This embodiment has a frame part 1 which has a height higher than the thickness of the semiconductor element, has a predetermined space inside, and can be stacked in the height direction, and a frame part 1 inside the frame part 1 in the height direction. It has a base sheet 2 formed with a plane perpendicular to the base sheet 2, and an adhesive film 3 formed on one surface of the base sheet 2 on which a semiconductor element is adhesively mounted. 3 has a structure made of a material such as a plastic film that bends when pressed with a needle jig from the surface of the base sheet 2 on which the adhesive film 3 is not formed.

In this embodiment, as shown in FIG. 2(a), the semiconductor elements 10 are positioned and adhesively placed on the adhesive material film 3, thereby stacking them as shown in FIG. 2(b). Since the semiconductor element 10 does not move even when it is transported, the positional accuracy at which it was initially placed can be maintained. Therefore, there is no need to reposition the semiconductor element 10 when using it, and there is no need to take out the semiconductor element 10 for this positioning, and there is no damage to the circuit forming surface of the semiconductor element 10 due to this removal. In addition, the semiconductor device 10 being transported
No more damage.

Furthermore, since the base sheet 2 and the adhesive film 3 are bent by the needle jig, as shown in FIG. Ingredients 3
0, a part of the semiconductor element 10 is easily peeled off from the adhesive film 3, and the suction jig 20 can hold only the corner of the semiconductor element 10 and easily take it out while maintaining positional accuracy. . Therefore, damage to the circuit forming surface of the semiconductor element 10 is also eliminated.

Furthermore, since the adhesive material film 3 is one plane, it can be used even if the size of the semiconductor element 10 changes.

[0014] In this example, the thickness of the base sheet 2 and the adhesive film 3 is approximately 100 μm, which is sufficient.
Although it depends on the thickness of the semiconductor element 10, the height of the frame portion 1 is 1.
It can be made as thin as 5 to 2 mm.

FIGS. 4(a) to 4(c) are a plan view and a cross-sectional side view, respectively, showing a second embodiment of the present invention.

In this embodiment, the frame portion 1a has a structure including a partition 11 that divides the base sheet 2 and the adhesive film 3 formed inside thereof into a plurality of sections each having a predetermined area.

In this embodiment, since the area of the section surrounded by the partition 11 of the base sheet 2 and the adhesive film 3 is small, the weight of the semiconductor element 10, high temperature storage, high humidity storage, and base sheet It is possible to prevent the base sheet 2 and the adhesive film 3 from sagging significantly due to factors such as pushing up from below, and it becomes possible to take out the semiconductor element 10 with higher precision.

Note that it is not necessary to mount one semiconductor element 10 in one section, and a plurality of semiconductor elements 10 may be mounted in one section. That is, the dimensions of this section may be set so that the slack of the base sheet 2 and the adhesive film 3 does not become too large.

FIGS. 5(a) and 5(b) are a plan view and a cross-sectional side view, respectively, showing a third embodiment of the present invention.

In this embodiment, instead of the base sheet 2 of the first and second embodiments, the base sheet 2 is made of a material that does not bend under some stress, such as plastic that is slightly thicker and harder than the base sheet 2. A substrate 4 is provided, an adhesive film 3a is formed on one side of the substrate 4, and a plurality of small-diameter holes 5 for element projection are formed through the substrate 4 and the adhesive film 3a. It becomes.

In the first and second embodiments, the substrate sheet 2
If the adhesive film 3 is bent significantly during transportation, the semiconductor element 10 may separate from the adhesive film 3. However, in this third embodiment, the substrate 4 does not bend under some stress. The semiconductor element 10 does not separate from the adhesive film 3a during transportation.

Since the substrate 4 is not bent, the semiconductor element 10
When separating from the adhesive material film 3a, a needle-like jig is inserted into the element projection hole 5.

[0023]

[Effects of the Invention] As explained above, the present invention forms a base material sheet having one plane inside a frame portion, and forms an adhesive film on which a semiconductor element is adhesively mounted on one plane of this base material sheet. By adopting this structure, there is no movement of the semiconductor element during transportation, so there is no damage to the semiconductor element during transportation, and there is no need to reposition the semiconductor element during use, and there is no damage to the semiconductor element during this positioning. It is possible to improve yield, reduce work man-hours, improve reliability and quality, and because the structure is not one in which one semiconductor element is placed in one recess as in the past, the size of the semiconductor element can be reduced. Regardless of the size, it is possible to transport semiconductor elements of different sizes, and this has the effect of reducing costs.

[Brief explanation of the drawing]

FIG. 1 is a plan view and a cross-sectional side view showing a first embodiment of the present invention.

FIG. 2 is a plan view and a cross-sectional side view for explaining how to use the embodiment shown in FIG. 1;

FIG. 3 is a cross-sectional side view for explaining how to use the embodiment shown in FIG. 1;

FIG. 4 is a plan view and a sectional side view showing a second embodiment of the present invention.

FIG. 5 is a plan view and a cross-sectional side view showing a third embodiment of the present invention.

FIG. 6 is a plan view and a cross-sectional side view showing an example of a conventional semiconductor device transport container.

7 is a plan view and a cross-sectional side view for explaining how to use the semiconductor device transport container shown in FIG. 6. FIG.

[Explanation of symbols]

1, 1a Frame 2 Base sheet 3, 3a Adhesive material film 4 Board 5　　　　Element protrusion hole 6 Base 7 Protective sheet 10 Semiconductor device 11 Partition 20 Suction jig 21 Suction hole 30 Needle jig 61 Hollow

Claims (4)

[Claims] Claim 1: A frame having a height higher than the thickness of the semiconductor element, having a predetermined space inside and stackable in the height direction, and having a plane perpendicular to the height direction inside the frame. A semiconductor device transport container comprising: a base sheet; and an adhesive film formed on one surface of the base sheet, on which the semiconductor device is adhesively mounted. 2. The base sheet and the adhesive film are formed of a material that bends when pressed with a needle jig from the surface of the base sheet on which the adhesive film is not formed. 1. The semiconductor device transport container according to 1. 3. The semiconductor device transport container according to claim 2, wherein the frame has a structure including a partition that divides the base sheet and the adhesive film formed inside the container into a plurality of sections each having a predetermined area. 4. The base sheet is made of a material that does not bend under a predetermined stress and has a plurality of through holes of a predetermined diameter, and the adhesive film is located at a position corresponding to each through hole of the base sheet. 2. The semiconductor device transport container according to claim 1, wherein the semiconductor device transport container is formed with a through hole.