JPH1159725A - Transfer tape for electronic parts and containing method of electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily contain or take out electronic parts in a transfer tape thereof. SOLUTION: This container is constituted of a carrier tape 3 in which a plurality of pockets 3a to contain diodes are formed, and a cover tape 4 connected to the carrier tape 3 to cover the openings 3b of the pockets 3a. Slit holes 3d reducing the rigidity of the pockets 3a are provided to form crosses at the bottom 3c of the pockets 3a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for accommodating and transporting electronic components such as semiconductor devices, and more particularly to an electronic component transport tape and a method for accommodating electronic components that can easily accommodate electronic components in a pocket of a carrier tape. .

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

When shipping and transporting electronic components such as resin-encapsulated semiconductor devices (for example, diodes and transistors), an electronic component transport tape for accommodating these electronic components is
It comprises a carrier tape provided with a plurality of pockets for accommodating electronic components, and a cover tape covering an opening of the pocket.

The carrier tape has a thickness of 0.2.
The pocket is formed by molding into a concave shape, and an opening having a diameter of about 0.5 mm is provided at the bottom in many cases.

The opening hole is used for adjusting the housing state of the semiconductor device in the pocket by vacuum-sucking the semiconductor device from the back side when the semiconductor device is inserted and housed in the pocket.

When the semiconductor device is housed in the pocket, a gap of about 0.2 mm is formed between the semiconductor device and the side wall of the pocket to maintain the housing state of the semiconductor device.

Here, regarding the electronic component conveying tape,
For example, there is one disclosed in JP-A-2-127256.

[0008]

However, in the above-mentioned technique, the gap between the semiconductor device and the side wall of the pocket is limited.
Since the semiconductor device is rotated in the θ direction because the semiconductor device is rotated in the θ direction, the semiconductor device is caught in the side wall of the pocket.
The semiconductor device may be restrained.

Therefore, in order to smoothly house and take out the semiconductor device, there is a problem that the semiconductor device must be positioned with high precision at the time of inserting and housing and at the time of taking out.

Further, since the gap between the semiconductor device and the side wall of the pocket is as small as about 0.2 mm, it is necessary to reduce lead burrs and resin burrs in the sealing portion of the semiconductor device, and it takes time to remove the burrs of the semiconductor device. Is a problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component transport tape and a method for accommodating electronic components, which improve the accommodating property and takeout property of electronic components.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0013]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, an electronic component transport tape according to the present invention has a carrier tape provided with a plurality of pockets for accommodating electronic components, and a cover tape covering an opening of the pocket and joining with the carrier tape. A rigidity reducing means for reducing the rigidity of the pocket is provided on a side wall and / or a bottom of the pocket.

[0015] Thus, since the side wall or the bottom of the pocket is flexible, the side wall can guide the electronic component even when the positional accuracy when the electronic component is accommodated varies, and as a result, Variations in the positional accuracy of electronic components can be absorbed.

Therefore, the positional accuracy of the electronic component when accommodating the electronic component can be relaxed, whereby the accommodating ability of the electronic component can be improved.

Further, an electronic component transport tape according to the present invention accommodates a resin-encapsulated semiconductor device having outer leads, and a carrier tape provided with a plurality of pockets for accommodating the semiconductor device. A cover tape that covers the opening of the pocket and is joined to the carrier tape, and a lead supporting portion that positions and supports the outer lead is provided on a side wall or a bottom portion or both of the pocket and the semiconductor device. When the semiconductor device is accommodated in a pocket, the semiconductor device is supported by the lead supporting portion with a gap formed between the sealing portion and the side wall and the bottom portion.

Further, in the method for accommodating an electronic component according to the present invention, a plurality of pockets for accommodating the electronic component are provided, and rigidity relaxing means for reducing the rigidity of the pocket is provided on a side wall and / or a bottom of the pocket. A carrier tape, a step of preparing an electronic component transport tape having a cover tape covering the pocket, and a step of housing the electronic component in the pocket of the carrier tape,
Bonding the carrier tape and the cover tape by covering the opening of the carrier tape with the cover tape, and adjusting the insertion position accuracy of the electronic component when the electronic component is accommodated in the pocket. It can be relieved by the rigidity relieving means.

[0019]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1A and 1B are views showing an example of an embodiment of the structure of an electronic component transport tape according to the present invention, wherein FIG. 1A is a partial plan view showing a partially broken view, and FIG. FIG. 3C is a partial cross-sectional view illustrating a cross section taken along line BB of FIG. 3A, FIG. 4D is an enlarged plan view illustrating a portion C of FIG.
2A and 2B are views showing an example of a state in which the semiconductor device is accommodated in the electronic component transport tape shown in FIG. 1, wherein FIG. It is a partial sectional view showing a section.

The electronic component conveying tape 1 of the present embodiment is
It is used when a plurality of electronic components are accommodated and transported. Here, the electronic component is a semiconductor device. As an example, as shown in FIG.
The case of a resin-sealed type diode 2 having b and a pellet 2c will be described.

When transporting, the electronic component transport tape 1 is wound on a take-up reel (not shown), and is transported together with the take-up reel in this state.

Electronic component transport tape 1 according to the present embodiment
Is composed of a carrier tape 3 provided with a plurality of pockets 3a for accommodating the diode 2 as an electronic component, and a cover tape 4 covering the opening 3b of the pocket 3a and joining with the carrier tape 3. Bottom 3 of
A slit hole 3d, which is a rigidity reducing means for reducing the rigidity of the pocket 3a, is provided in c.

In the electronic component conveying tape 1 of the present embodiment, as shown in FIGS.
The case where d is provided in the bottom 3c in a cross shape will be described.

Here, the carrier tape 3 is formed of, for example, polyethylene terephthalate and has a thickness of, for example, about 0.2 mm, and a plurality of the carrier tapes 3 are provided at substantially constant intervals along the longitudinal direction of the tape. Pocket 3a
And one side 3e is provided with a plurality of small guide holes 3g used for transportation and the like.

The pocket 3a is an accommodating place for the diode 2 formed in a concave shape by molding.
As shown in (b) and (c), each of the pockets 3a includes a side wall 3j formed in parallel with the depth direction and a bottom 3c for supporting the diode 2, whereby one pocket 2a has one diode 2a. Is to accommodate.

Furthermore, for example, several hundred thousand pockets 3a are provided for one electronic component transport tape 1.

Therefore, in this case, one (one reel)
The electronic component transport tape 1 can accommodate and transport hundreds of thousands of diodes 2.

In this embodiment, as shown in FIG. 2, the electronic component is a sealing portion 2a having a rectangular main body.
, The opening 3b of the pocket 3a has a substantially square planar shape, and the bottom 3c of the pocket 3a is A base 3h (see FIG. 1B), which is a raised portion that supports the sealing portion 2a, is formed.

Since the sealing portion 2a of the diode 2 is supported by the base portion 3h, the outer lead 2b does not come into contact with the bottom portion 3c, and the outer lead 2b is prevented from being deformed by its own weight in the pocket 3a. Can be.

The base 3h is provided with an opening 3i for vacuum suction. The opening 3i is used for adjusting the accommodation state of the diode 2 in the pocket 3a by vacuum-sucking the diode 2 from the back side of the pocket 3a when the diode 2 is inserted and accommodated in the pocket 3a. is there.

Here, the carrier tape 3 of the present embodiment
In the pocket 3a, a slit 3d (rigidity reducing means), which is an elongated notch leading to the opening 3i, is provided with a bottom 3c.
It is formed in a cross shape.

Thus, the rigidity of the bottom 3c is reduced and the rigidity of the entire pocket 3a is also reduced.

The cover tape 4 is made of, for example, polyethylene or the like, and the adhesive surface 4a (the surface facing the carrier tape 3) is provided with an adhesive layer formed of an adhesive over the entire surface. I have. The adhesive melts when it reaches a predetermined temperature and hardens when it drops to a predetermined temperature.

Here, the width of the cover tape 4 is set such that the guide holes 3g provided in the side portions 3e of the carrier tape 3 are exposed when the carrier tape 3 and the cover tape 4 are joined. It is formed narrower than the width.

Further, in the electronic component transport tape 1 of the present embodiment, when the carrier tape 3 and the cover tape 4 are joined after the diode 2 is housed, the outer sides are joined by thermocompression bonding.

Next, a method for accommodating electronic components and a method for transporting the same according to the present embodiment will be described.

First, as shown in FIGS. 1 and 2, a plurality of pockets 3a accommodating a diode 2 as an electronic component.
And a cover tape 4 covering the pocket 3a with a carrier tape 3 in which a slit 3d (rigidity reducing means) for reducing the rigidity of the pocket 3a is formed in the bottom 3c of the pocket 3a. Prepare 1

Subsequently, using an automatic insertion machine (not shown),
For example, the surface of the sealing portion 2a of the diode 2 is vacuum-sucked, whereby the predetermined number of diodes 2 are accommodated in the respective pockets 3a of the carrier tape 3 while positioning the diodes 2.

The carrier tape 3 of the electronic component transport tape 1 according to the present embodiment has a cross-shaped slit hole 3d formed at the bottom 3c of the pocket 3a.

Accordingly, since the rigidity of the pocket 3a is reduced, when the diode 2 is inserted into the pocket 3a, it can be smoothly inserted and accommodated even if the diode 2 contacts the side wall 3j of the pocket 3a.

That is, since the rigidity of the pocket 3a can be reduced by forming the slit hole 3d, the insertion position accuracy of the diode 2 when the diode 2 is housed in the pocket 3a can be reduced.

Subsequently, after a predetermined number of diodes 2 are accommodated in the pockets 3a, the carrier tape 3 and the cover tape 4 are joined by covering the opening 3b of the carrier tape 3 with the cover tape 4.

Here, when the carrier tape 3 and the cover tape 4 are joined, the surface of the carrier tape 3 having the opening 3b of the pocket 3a is brought into contact with the adhesive surface 4a of the cover tape 4 so as to face each other. Then, both outer portions of the cover tape 4 are joined by thermocompression bonding.

As a result, the thermocompression bonding, that is, the bonding between the carrier tape 3 and the cover tape 4 can be performed, and the electronic component transport tape 1 can be manufactured.

Thereafter, the electronic component transport tape 1 containing the diode 2 is wound around a take-up reel (not shown).

Further, the take-up reel having taken up the electronic component carrying tape 1 is carried to a predetermined destination.

For example, when the diode 2 is mounted on a predetermined printed circuit board or the like, the take-up reel on which the electronic component transport tape 1 has been wound is transported to a predetermined location of a mounting device on which the diode 2 can be mounted.

Thereafter, in the mounting device, the cover tape 4 is peeled off from the carrier tape 3, the diode 2 housed in the pocket 3a is taken out by vacuum suction or handling, and the diode 2 is mounted on the predetermined printed circuit board. I do.

According to the electronic component carrying tape and the method for accommodating the electronic component of the present embodiment, the following operation and effect can be obtained.

That is, the pocket 3 of the carrier tape 3
The slit 3d (rigidity reducing means) is provided in the bottom 3c of the pocket 3a in a cross shape, so that the bottom 3c of the pocket 3a is formed.
c has flexibility, whereby the rigidity of the pocket 3a is reduced, so that even if the insertion position accuracy when the diode 2 is housed varies and the diode 2 contacts the side wall 3j, the side wall 3j I can guide you.

As a result, it is possible to absorb variations in the insertion position accuracy of the diode 2.

As a result, the positional accuracy when housing the diode 2 can be relaxed, and as a result, the housing of the diode 2 can be improved.

Therefore, the positional accuracy of the diode 2 in the automatic insertion machine can be reduced, and the degree of vacuum at the time of vacuum suction in the automatic insertion machine can be reduced.

Since the housing of the diode 2 can be improved, when the diode 2 is housed in the pocket 3a, the housing (insertion) trouble such as the rollover or displacement of the diode 2 in the pocket 3a can be reduced.

Further, since the rigidity of the pocket 3a can be reduced, it is possible to reduce the restraining force generated when the diode 2 comes into contact with the side wall 3j when taking out the diode 2 from the pocket 3a.

As a result, it is possible to prevent the occurrence of poor suction when taking out the diode 2 by vacuum suction, and as a result, it is possible to improve the takeout property of the diode 2.

In addition, since the accommodation and removal of the diode 2 can be improved, the work of checking whether or not the diode 2 is restrained when the diode 2 is housed in the pocket 3a (whether or not there is something sandwiched between the side walls 3j) is performed. Sorting work) can be omitted (abolished).

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above-described embodiment, the case where the slit holes 3d (rigidity reducing means) in the bottom 3c of the pocket 3a of the carrier tape 3 are provided in a cross shape has been described. The slit hole 3d may not be provided in a cross shape, and the slit hole 3d may be provided in a diagonal direction of the bottom 3c as in the electronic component transport tape 1 of another embodiment shown in FIGS. .

The electronic component transport tape 1 shown in FIGS. 3 and 4 can provide the same operation and effect as the electronic component transport tape 1 of the embodiment shown in FIG.

Further, in the pocket 3a of the electronic component conveying tape 1 shown in FIGS. 3 and 4, the base portion 3h which is the raised portion shown in FIG. 1 is not provided.

That is, the bottom 3c of the pocket 3a of the electronic component transport tape 1 shown in FIGS. 3 and 4 has a flat shape as shown in FIG. 3B. in this case,
The positioning of the diode 2 in the pocket 3a is performed by the side wall 3j.

The slit 3 provided in the bottom 3c
The shape of d may be a shape other than a cross shape or a hole having a shape other than a slit shape as long as the rigidity of the bottom 3c can be reduced.

In the embodiment shown in FIGS. 1 and 2 and the other embodiments shown in FIGS. 3 and 4,
The slit holes 3d, which are means for reducing the rigidity of the pocket 3a,
Although the case where it is provided in the bottom 3c has been described, the slit hole 3d is provided in the side wall 3j in a direction parallel to its height direction like the pocket 3a of another embodiment shown in FIG. Is also good.

According to this, since the rigidity of the side wall 3j of the pocket 3a can be reduced, as a result, the rigidity of the pocket 3a can be reduced, whereby the diode 2 contacts the side wall 3j when the diode 2 is taken out from the pocket 3a. It is possible to weaken the restraining force generated.

As a result, it is possible to prevent the occurrence of poor suction when taking out the diode 2 by vacuum suction.
The take-out of the diode 2 can be improved.

The slit hole 3d may be provided on both the bottom 3c and the side wall 3j.

According to this, substantially the same operation and effect as in the above embodiment can be obtained.

Here, the method of housing the diode 2 (see FIG. 2) in the electronic component transport tape 1 of another embodiment having the pocket 3a shown in FIG. 5 is the same as that described in the above embodiment. is there.

In the electronic component conveying tape 1 shown in FIGS. 1 to 4 and the pocket 3a shown in FIG. 5, the case where the rigidity reducing means is the slit hole 3d has been described. As long as the shape can reduce the rigidity, the shape may be the shape of another embodiment shown in FIG.

Here, the electronic component conveying tape 1 of another embodiment having the pocket 3a shown in FIG. 6 has a relatively large bottom portion 3c (for example, 50 mm in size of the diode 2) as the rigidity reducing means. A rigidity relief opening 3k that is open (with an area of ８０80%) is formed. In addition,
The rigidity relaxation opening 3k is formed to have a size to prevent the diode 2 shown in FIG. 2 from passing therethrough, and relaxes the rigidity of the pocket 3a.

Therefore, the diode 2 can be accommodated in the pocket 3a in a state where the rigidity is relaxed by the rigidity relaxing opening 3k without dropping the diode 2 from the pocket 3a.

Further, like the electronic component transport tape 1 of another embodiment shown in FIG. 7, the outer leads 2 of the diode 2 are supported by the lead supporting portions 3f formed in the pockets 3a.
b may be supported.

Here, the pocket 3a shown in FIG. 7 is provided with a lead supporting portion 3f for positioning and supporting the outer lead 2b on the side wall 3j, and when the diode 2 is accommodated in the pocket 3a, The diode 2 forms a predetermined gap 31 between the sealing portion 2a and the side wall 3j and the bottom 3c, and supports the diode 2 by the lead supporting portion 3f.

As a result, the gap 3l between the sealing portion 2a of the diode 2 and the side wall 3j and bottom 3c of the pocket 3a can be formed relatively large, so that the sealing portion 2a and the side wall 3j,
In addition, interference between the sealing portion 2a and the bottom portion 3c can be eliminated.

As a result, the width of the dimensional accuracy of the pocket 3a can be made large, whereby the positioning of the diode 2 can be easily performed.

The lead supporting portion 3f is provided in the pocket 3a.
Not only the side wall 3j, but also the bottom 3c or both the side wall 3j and the bottom 3c may be provided.

Further, in the electronic component transport tape 1 or the pocket 3a shown in FIGS. 1 to 7, the electronic component is a semiconductor device, and the diode 2 has been described as an example of the semiconductor device. Other than the semiconductor device, for example, a QFP (Quad Flat Package) type semiconductor device may be used, and the electronic component may be a resistor component, a transistor, or a capacitor other than the semiconductor device.

Further, in the above-described embodiment and the other embodiments, the rigidity reducing means is provided with the slit hole 3d.
Or the case of the rigidity relaxation opening 3k has been described,
The rigidity reducing means may be holes of other shapes or other means as long as the rigidity of the pocket 3a can be reduced.

As an example of the other means, the pocket 3a
May be formed as thin as less than 0.2 mm, for example, about 50 to 100 μm.

With this configuration, the rigidity of the pocket 3a can be reduced, and substantially the same operation and effect as those described in the above embodiment can be obtained.

[0083]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). Since the rigidity reducing means is provided on the side wall and / or the bottom of the pocket of the carrier tape, the side wall can guide the electronic component, so that the variation in the insertion position accuracy of the electronic component can be absorbed. As a result, the positional accuracy of the electronic component when housing the electronic component can be reduced, and
The housing capacity of electronic components can be improved.

(2). According to the above (1), the positional accuracy of the automatic insertion machine for electronic components can be reduced, and the degree of vacuum of the automatic insertion machine can be reduced.

(3). Since the housing property of the electronic component can be improved, when the electronic component is housed in the pocket, it is possible to reduce the housing (insertion) trouble such as the rollover and the displacement of the electronic component in the pocket.

(4). Since the rigidity of the side wall of the pocket can be reduced, it is possible to reduce the restraining force generated when the electronic component comes into contact with the side wall when the electronic component is taken out of the pocket. As a result, it is possible to prevent the occurrence of suction failure when taking out the electronic component by vacuum suction, and as a result, it is possible to improve the ease of taking out the electronic component.

(5). When the electronic component is a resin-sealed semiconductor device having outer leads, the outer leads can be positioned and supported only by the lead support provided in the pocket. Thereby, a large gap can be formed between the sealing portion of the semiconductor device and the side wall and the bottom of the pocket, so that interference between the sealing portion and the side wall and between the sealing portion and the bottom can be eliminated. As a result, a large dimensional accuracy width of the pocket can be obtained, whereby the semiconductor device can be easily positioned.

(6). Since the accommodating property and the taking-out property of the electronic component can be improved, the work of checking whether or not the electronic component is restrained when the electronic component is accommodated in the pocket can be omitted (abolished).

[Brief description of the drawings]

1 (a), 1 (b), 1 (c) and 1 (d) are views showing an example of an embodiment of the structure of an electronic component conveying tape according to the present invention, and FIG. (B) is a partial cross-sectional view showing the AA cross section of (a), and (c) is (a)
(D) is an enlarged plan view showing a portion C of (a).

FIGS. 2A and 2B are diagrams showing an example of a housing state of a semiconductor device in the electronic component transport tape shown in FIG. 1; FIG. (b) is a partial sectional view showing a DD section of (a).

FIGS. 3 (a), (b), (c), and (d) are views showing the structure of an electronic component conveying tape according to another embodiment of the present invention, and FIG. (B) is a partial cross-sectional view showing the EE cross section of (a), (c) is (a)
FIG. 3D is a partial cross-sectional view showing the FF cross section, and FIG. 4D is an enlarged plan view showing the G portion of FIG.

4 (a) and 4 (b) are views showing an example of a housing state of the semiconductor device in the electronic component transport tape shown in FIG. 3, and FIG. (b) is a partial sectional view showing an HH section of (a).

FIG. 5 is a perspective view showing a structure of a pocket of an electronic component transport tape according to another embodiment of the present invention.

FIG. 6 is a plan view partially broken away showing a structure of a pocket of an electronic component transport tape according to another embodiment of the present invention.

FIGS. 7A and 7B are diagrams showing an example of an accommodation state of a semiconductor device in an electronic component transport tape according to another embodiment of the present invention, and FIG. FIG. 3B is a partial cross-sectional view showing a II cross section of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component conveyance tape 2 Diode (electronic component) 2a Sealing part 2b Outer lead 2c Pellet 3 Carrier tape 3a Pocket 3b Opening 3c Bottom 3d Slit hole (rigidity reducing means) 3e Side 3f Lead support 3g Guide hole 3h Base 3i Opening hole 3j Side wall 3k Rigidity reducing opening (rigidity reducing means) 3l Gap 4 Cover tape 4a Adhesive surface

Claims (6)

[Claims] 1. An electronic component transport tape for housing electronic components, comprising: a carrier tape provided with a plurality of pockets for housing the electronic components; and a cover covering an opening of the pocket and joining with the carrier tape. An electronic component conveying tape, comprising: a tape; and a side wall and / or a bottom portion of the pocket, and a rigidity reducing means for reducing a rigidity of the pocket. 2. The electronic component conveying tape according to claim 1, wherein a slit hole is provided as said rigidity reducing means. 3. The electronic component conveying tape according to claim 2, wherein said slit hole is provided in a cross shape at said bottom portion. 4. The electronic component conveying tape according to claim 1, wherein a rigidity relaxing opening formed in the bottom portion as the rigidity relaxing means is formed in a size that prevents passage of the electronic component. An electronic component conveying tape characterized by the above-mentioned. 5. An electronic component carrying tape for housing a resin-sealed semiconductor device having outer leads, comprising: a carrier tape provided with a plurality of pockets for housing the semiconductor device; and an opening of the pocket. A cover tape that covers and joins the carrier tape, and a lead support portion for positioning and supporting the outer lead is provided on a side wall and / or a bottom portion of the pocket, and the semiconductor device is accommodated in the pocket. The electronic component transport tape, wherein the semiconductor device is supported by the lead support portion with a gap formed between the sealing portion and the side wall and the bottom portion. 6. A carrier tape provided with a plurality of pockets for accommodating electronic components and provided with stiffness reducing means for reducing the stiffness of the pocket on a side wall and / or a bottom of the pocket, and a cover for covering the pocket. Preparing an electronic component transport tape having a tape; storing the electronic component in the pocket of the carrier tape; covering the opening of the carrier tape with the cover tape; and the carrier tape and the cover tape. And a step of joining the electronic component, wherein the accuracy of the insertion position of the electronic component when the electronic component is stored in the pocket can be reduced by the rigidity reducing means.