JPH06298290A - Chip tray and chip package using the same - Google Patents

Abstract

PURPOSE:To provide a chip tray which is suitable for carrying and storing an LSI chip in a state of a chip so as to stably hold the LSD chip as the chip and a chip package using the chip tray. CONSTITUTION:A chip tray comprises a supporting face 4 with a recess 2 placed in a V-shape. When a semiconductor chip 3 is housed in the recess 2, the supporting face 4 is inclined to a circuit forming face 3b of the semiconductor chip 3, so that the semiconductor chip 3 is supported on an edge 3a of the semiconductor chip 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip tray and a chip package using the same, and more particularly to a chip tray capable of stably holding an LSI chip as a chip and a chip package using the same.

In recent years, with the diversification of LSIs, it has been required by users to supply the LSIs in the form of chips.

If the surface of an LSI chip on which a circuit is formed is slightly damaged, the circuit may be destroyed and the required functions may not be fulfilled. Therefore, it is necessary to sufficiently protect the circuit formation surface when the chip is transported.

[0004]

2. Description of the Related Art FIG. 12 shows a block diagram of a conventional example. The conventional chip tray 111 is used when the semiconductor chip 112 is transferred from the dicer to the next assembly process, and the chip tray 111 has a recess 11 for accommodating the chip 112.
Multiple 3 were arranged.

The recess 113 has a structure in which the chip 112 is held by the bottom surface 114 in which the through hole 115 is formed when the chip 112 is sucked by the suction device. Since it is not desirable that the circuit forming surface 112a of the chip 112 comes into contact with the bottom surface 114 and is damaged, the chip 112 is not formed on the circuit forming surface 112a.
It was housed in the recess 113 so that a was facing upward.

[0006]

However, the conventional chip tray has a structure in which the bottom surface of the semiconductor chip is supported by the bottom surface of the recess, and the circuit of the semiconductor chip is protected so as not to scratch the circuit forming surface of the semiconductor chip. It was mounted with the forming surface facing outward. Therefore, foreign matter such as dust is likely to adhere to the circuit forming surface of the semiconductor chip during transportation of the semiconductor chip.

Further, the conventional chip tray is not designed to carry an IC chip for a long distance or store it for a long time, and is not suitable for shipping the IC as a chip. was there.

The present invention has been made in view of the above points, and an object of the present invention is to provide a chip tray suitable for carrying and storing LSI chips in a chip state, and a chip package using the chip tray.

[0009]

According to the present invention, in a chip tray having a recess for accommodating a semiconductor chip, a supporting surface for supporting the semiconductor chip has a shape for supporting only a peripheral edge portion of the semiconductor chip.

[0010]

Since the supporting surface formed in the recess has a shape to support the semiconductor chip only at the peripheral edge portion of the semiconductor chip, even if the circuit forming surface of the semiconductor chip is housed with the circuit forming surface facing the recess, The formation surface does not come into contact with the bottom surface of the recess or the like.

Therefore, since the circuit forming surface of the semiconductor chip can be stored without being exposed to the outside, it is possible to prevent the circuit forming surface of the semiconductor chip from being easily scratched and to prevent foreign matter such as dust from adhering to the circuit.

[0012]

1 shows a perspective view of a first embodiment of the present invention.
In the figure, 1 indicates a chip tray. Chip tray 1
For example, it is formed of fluorine resin or the like.

A plurality of recesses 2 are formed on the surface of the chip tray 1, and a semiconductor chip 3 is housed in each of the recesses 2. The recess 2 has a rectangular plan shape, and has a V-shaped support surface 4 as an inner surface thereof.

The support surface 4 is planarly formed from the central bottom portion 5 of the recess 2 toward the left and right peripheral portions 6 and 7 (direction of arrow A) to form a V-shaped inclined surface.

The semiconductor chip 3 is housed in the recess 2 so that the circuit forming surface 3b faces downward so as to face the supporting surface 4.
At this time, since the supporting surface 4 is inclined in a V-shape, the circuit forming surface 3b of the semiconductor chip 3 does not contact the supporting surface 4, and the edge portion 3a on the circuit forming surface 3b side does not contact the supporting surface 4. Contacted and supported.

Further, the inclination angle θ ₁ of the supporting surface 4 of the recess 2 is
θ ₂ and the depth d ₀ of the central bottom portion 5 are set so that the non-circuit forming surface 3c of the semiconductor chip 3 does not protrude from the surface 1a of the chip tray 1 when the semiconductor chip 3 is housed in the recess 2.

As described above, by forming the V-shaped support surface 4 in the recess 2 for housing the semiconductor chip 3, the circuit forming surface 3b of the semiconductor chip 3 is substantially opposed to the support surface 4 of the recess 2. Even if it is housed in
Since the circuit forming surface 3b of the semiconductor chip 3 can be brought into a non-contact state by being supported by the edge portion 3a, the semiconductor chip 3 is not damaged and the circuit forming surface 3b is not exposed to the outside. It can be stored in the chip tray 1.

Therefore, when the semiconductor chips 3 are transported, the quality of the semiconductor chips 3 can be improved and the yield can be improved without damaging the circuit forming surface 3b or adhering dust. Can be measured.

In the present embodiment, the size of the recess 2 is set according to the size of the semiconductor chip 4. However, as shown in FIG. 2, the semiconductor chip 8 smaller than the semiconductor chip 4 is accommodated in the recess 2. However, similarly to the semiconductor chip 4, the edge portion 8a thereof abuts the supporting surface 4 of the recess 2 and the same effect as that of the semiconductor chip 4 can be obtained. As described above, if the chip tray 1 of this embodiment is smaller than the semiconductor chip 4, the same effect as that of the semiconductor chip 4 can be obtained for the semiconductor chips of different sizes and can be shared.

Although the support surface 4 is V-shaped in this embodiment, it is not limited to this. FIG. 3 shows the first of the present invention.
The block diagram of the 1st modification of the recessed part of an Example is shown.

In FIG. 3, the support surface 12 of the recess 11 is formed by a cylindrical surface. By forming the support surface 12 into a cylindrical surface, the semiconductor chip 3 can be supported by the edge portion 3a of the semiconductor chip 3 on the circuit formation surface 3b side as in the first embodiment.

At this time, the curvature of the cylindrical support surface 12 is about 10 times the radius L of the semiconductor chip 3 and has a radius R≈10L.
Is set to. For example, one side of the semiconductor chip 3 is 10 [m
m], the curvature R of the support surface 12 may be 100 [mm].

Even if the structure of this modification is the same as that of the first embodiment, if it is smaller than the semiconductor chip 3, the same effect as the semiconductor chip 3 can be obtained for the semiconductor chips 8 having different sizes.

FIG. 4 shows a configuration diagram of a second modification of the recess of the first embodiment of the present invention. The recess 21 of the present modification has a trapezoidal sectional shape, and the support surface 22 is formed corresponding to the inclined sides of the left and right trapezoids of the bottom surface 23. The edge portion 3 a of the semiconductor chip 3 is supported by the support surface 22 and held in the recess 21 of the chip tray 1. With the above structure, the same effects as those of the first embodiment can be obtained, and the supporting surface 22
Since the recesses 22 can be formed at a steep angle, the opening area of the recesses 22 can be reduced, and the recesses 22 can be arranged at a high density, so that the semiconductor chips 3 can be stored at a higher density.

In this embodiment, as long as the semiconductor chip is larger than the width W _{0 of the} bottom surface 23 and smaller than the semiconductor chip 4, even semiconductor chips of different sizes can be used.
The same effect as can be obtained.

FIG. 5 shows a block diagram of the second embodiment of the present invention. In the figure, the same components as those in FIG.
The description is omitted.

This embodiment is intended to describe a packaging method when the semiconductor chip 3 is shipped as a chip, and is particularly suitable for mass-production type chips to be shipped as a chip. The chip tray 1 in which the chips 3 are housed is sandwiched between the film packages 41 and 42 from the upper and lower surfaces and adhered, and the chip tray 1 is hermetically sealed in the film packages 41 and 42.

The film packages 41, 42 are made of a thin film resin such as polypropylene which has been subjected to antistatic treatment, are arranged above and below the chip tray 1, and a vacuum is formed in the recess 2 in which the semiconductor chip 3 is accommodated. Alternatively, a small amount of an inert gas such as nitrogen (N ₂ ) is injected, and the peripheral edge portion 43 is bonded while keeping the negative pressure below atmospheric pressure, and the chip tray 1 is sealed.

At this time, since the inside of the concave portion 2 of the chip tray 1 is set to a vacuum or a negative pressure, the film package 41 is sucked inside the concave portion 2 (in the direction of arrow A). Therefore, the non-circuit forming surface 3c of the semiconductor chip 3 is pressed in the direction of arrow A by the film package 41, and the semiconductor chip 3 is stably held in the recess 2. Therefore, the semiconductor chip 3 will not be damaged during transportation and the semiconductor chip 3 will not be damaged.

Further, by printing various character characters such as the product number of the semiconductor chip 4 housed in the film package 41 or 42, product management can be easily performed.

The printing is not limited to the characters 43, but may be a bar code or the like.

FIG. 6 shows a block diagram of the third embodiment of the present invention. In the figure, 51 indicates a chip cover. The chip cover 51 corresponds to the chip tray 1 in the first and second embodiments, and is made of a fluororesin like the chip tray 1. In this embodiment, one chip cover 51 is used.
One semiconductor chip 3 is housed and packaged, each semiconductor chip 3 is individually managed, and a necessary amount can be used when necessary.

The chip cover 51 has a recess 52 for accommodating the semiconductor chip 3 as shown in FIG.
A support surface 53 for supporting is formed. Support surface 53
Is formed in a cylindrical shape like the second modified example of the concave portion of the first embodiment, and the supporting surface 53 thereof is, for example, the semiconductor chip 2
If the length of one side is L, the radius of curvature R is 10 times that
It is set to 10L.

The semiconductor chip 3 is housed in the chip cover 51 such that the circuit forming surface 3b faces the recess 52 of the chip cover 51. At this time, the support surface 53 of the recess 52
Is formed into a cylindrical surface, the semiconductor chip 3 has a support surface 53 of the recess 52 at the edge portion 3a on the circuit formation surface 3b side.
Supported by.

Therefore, the circuit forming surface 3b of the semiconductor chip 3 can be held by the chip cover 51 without coming into contact with the recess. At this time, the depth d of the recess 52 is set so that the non-circuit forming surface 3c of the semiconductor chip 3 does not protrude from the upper end of the chip cover 51.

The chip cover 51 in which the semiconductor chip 3 is housed in the recess 52 is sealed by the film packages 54 and 55. The film packages 54 and 55 are made of polypropylene or the like in a thin film shape and subjected to band-preventing treatment, and are arranged above and below the chip cover 51, and the recess 52 is filled with vacuum or an inert gas such as nitrogen (N ₂ ). The chip cover 51 is hermetically sealed by adhering the peripheral portions 56 and 57 to each other while maintaining the negative pressure state.

With the above structure, the same effect as the second embodiment can be obtained. Further, in the present embodiment, since the semiconductor chips 3 are individually packaged, the required number of packages can be opened and used.

The characters 58 are added to the film package 56.
Etc., and the product number of the semiconductor chip stored is printed, so that product management can be easily performed.

At this time, if the characteristics of each chip are also printed together, the chips having the characteristics that meet the conditions can be selected and used.

FIG. 7 shows a modification of the chip cover of the third embodiment of the present invention. FIG. 7A shows a V-shaped support surface 63 formed in the recess 62 of the chip cover 61.
Since 1 has an angle with the circuit forming surface 3b of the semiconductor chip 3, the edge portion 3 on the circuit forming surface 3b side of the semiconductor chip 3 is formed.
It abuts a and supports the semiconductor chip 3.

FIG. 7B shows the recess 72 of the chip cover 71.
Is composed of a bottom surface 73 and supporting surfaces 74 arranged on the left and right sides thereof, and the supporting surface 74 is formed at an angle of 90 ° or more with respect to the bottom surface 73. The width W _{1 of the} bottom surface 73 is set smaller than the length l of one side of the semiconductor chip 3.

Therefore, the semiconductor chip 3 is supported by the support surface 74. At this time, since the support surface 74 has an angle with respect to the circuit formation surface 3b, the support surface 74 has a circuit formation surface 3b.
The edge portion 3a on the side abuts and supports the semiconductor chip 3.

The chip cover having the above-mentioned structure shown in FIG. 7 can also obtain the same effect as that of the third embodiment.
Further, similar to the first embodiment, the same effect can be obtained for semiconductor chips having different sizes in the recess 72. However, since this modification has the bottom surface 73, the size of the semiconductor chip is limited to be larger than the width W _{1 of the} bottom surface 73.

FIG. 8 shows a block diagram of the fourth embodiment of the present invention. In the figure, the same components as in FIG.
The description is omitted.

In the present embodiment, a plurality of chip covers 51 each containing the semiconductor chip 3 are integrally sealed in a belt shape by band-shaped film packages 71 and 72.

The film packages 71 and 72 are made of a thin film of polypropylene or the like, and in the same manner as the third embodiment, the inside of the recess 52 of the chip cover 51 is vacuumed or an inert gas is injected to make the pressure negative, and the chip cover 51 is formed. The chip cover 51 is sealed by bonding the peripheral edge. Therefore, similarly to the third embodiment, the semiconductor chip 3 is pressed into the recess 52 by the film package 71, and the semiconductor chip 3 can be stably held in the recess 52 of the chip cover 51.

As described above, the chip cover 51 in which the semiconductor chip 3 is housed is provided in the strip-shaped film packages 71 and 7.
By arranging the two in a row in a belt shape, the core material 81 can be wound around as shown in FIG. 9 and the transportation becomes convenient.

Also, packaged or packaged semiconductor chips 3
Even when it is automated when it is taken out and used, as shown in FIG. 10, the moving axis of the moving part 91 such as the stage and the head need only be in the X-axis direction, so that automation can be easily performed.

Further, as shown in FIG. 8, the characters 73 and the like are printed on the film package 71 and the product number and the like of the stored semiconductor chips are printed, so that the product management can be easily performed. In addition, at this time, if the characteristics of each chip are also printed, it is possible to select the chip that meets the conditions by observing the printing, and select a chip that is better for use in harsh conditions. It can be selected and used.

FIG. 11 shows a block diagram of the fifth embodiment of the present invention. In this embodiment, a chip cover and a film package under the chip cover are integrated, and are composed of a film package 101 and a plastic package 102.

The film package 101 is a thin film of polypropylene or the like, which has been subjected to antistatic treatment. A recess 103 is integrally formed in the plastic package 102, and the semiconductor chip 3 is housed in the recess 103.

The recess 103 is a support surface 10 having a substantially cylindrical surface shape.
4, the semiconductor chip 3 is held in the recess 103 by contacting the supporting surface 104 with the edge portion 3a on the circuit forming surface 3b side in the same manner as in the first to fourth embodiments.

In the film package 101, after the semiconductor chip 3 is housed in the recess 103 of the plastic package 102, the inside of the recess 103 is set to a negative pressure state in which a vacuum or a small amount of inert gas such as nitrogen (N ₂ ) is injected. Is connected to the peripheral part 104. For this reason, the film package 101 is not affected by the atmospheric pressure.
3, and the semiconductor chip 3 is pressed into the recess 103. Therefore, the semiconductor chip 3 is stably held in the recess 103.

According to this embodiment, the same effect as that of the third embodiment can be obtained, and since the structure can be constituted only by the film package 101 and the plastic package 102,
Packaging can be performed easily and at low cost.

Further, the characters 105 and the like are printed on the film package 101 or the plastic package 102, and the product number of the stored semiconductor chip is printed, so that the product management can be easily performed. Further, at this time, if the characteristics of each chip are also printed together, the chips having the characteristics meeting the conditions can be selected and used.

[0056]

As described above, according to the present invention, since the semiconductor chip is accommodated and held in the chip tray by supporting the edge thereof, the circuit forming surface of the semiconductor chip is accommodated so as to face the chip tray. Also, the circuit forming surface of the semiconductor chip does not come into contact with the chip tray, so that the circuit forming surface of the semiconductor chip can be stored without being exposed and the circuit forming surface of the semiconductor chip can be housed. It has the feature that it can be transported without adhering dust to the circuit formation surface.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a first embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a first modified example of the recess according to the first embodiment of the present invention.

FIG. 4 is a configuration diagram of a second modified example of the recess according to the first embodiment of the present invention.

FIG. 5 is a configuration diagram of a second embodiment of the present invention.

FIG. 6 is a configuration diagram of a third embodiment of the present invention.

FIG. 7 is a configuration diagram of a modified example of the chip cover of the third embodiment of the present invention.

FIG. 8 is a configuration diagram of a fourth embodiment of the present invention.

FIG. 9 is an operation explanatory diagram of the fourth embodiment of the present invention.

FIG. 10 is an operation explanatory diagram of the fourth embodiment of the present invention.

FIG. 11 is a configuration diagram of a fifth embodiment of the present invention.

FIG. 12 is a configuration diagram of a conventional example.

[Explanation of symbols]

1 chip tray 2, 52, 62, 72, 103 recessed part 3 semiconductor chip 3a edge part 3b circuit formation surface 4, 104 support surface 5 center bottom part 41, 42, 56, 57, 71, 72, 101 film package 53, 63, 74 support surface 102 plastic package

Claims (7)

[Claims] 1. A chip tray having a recess for accommodating a semiconductor chip (3), wherein a supporting surface (4, 12, 22, 53, 63, 74, for supporting the semiconductor chip (3) is provided.
104) is a peripheral edge portion (3) of the semiconductor chip (3).
A chip tray having a shape for supporting only a). 2. The chip tray according to claim 1, wherein the supporting surface (4, 22, 62, 74) is an inclined surface. 3. The chip tray according to claim 1, wherein the support surface (12, 53, 104) is a curved surface. 4. The recesses (2, 52, 62, 72, 10)
3) a thin film package (41, 42; 5
6, 57; 71, 72; 101), and a chip package using the chip tray according to claim 1 or 2 or 3. 5. The chip package according to claim 4, wherein a plurality of the recesses (2, 52, 103) are integrally formed. 6. The chip package according to claim 4, wherein the recesses (62, 72) are formed as a single unit. 7. The film package (41, 42;
56, 57; 71, 72; 101) in the recesses (2, 5)
7. The information (43, 58, 73, 105) corresponding to the semiconductor chip (4) housed in (2, 62, 72, 103) is printed. Chip package.