JPH08244877A - Tray for transport and storage of semiconductor element - Google Patents

Abstract

PURPOSE: To reverse the top and bottom of a semiconductor element together with a tray, and improve the loading operatability, etc., by providing a rear pocket which has the same vertical and lateral shape with a pocket part, on the rear side of the pocket part for the tray for transport and storage, which has the pocket to store a semiconductor element on the upper surface. CONSTITUTION: A front pocket 2a is provided on the upper surface of a tray 4, and a semiconductor element 3 is stored in the front pocket 2a. Then, on the rear side of the front pocket 2a, a rear pocket 2b is provided, and the rear pocket 2b is formed into the same vertical and lateral shape with the front pocket 2a. In the meantime, the semiconductor element 3 with a soldering bump is transferred to the front pocket 2a of the tray 4 first, and as soon as the front pocket 2a becomes full, a new tray 4 is placed on the top of the first tray 4, and the transfer is continued. The transport and storage are performed under this state of the tray 4. Then, when the semiconductor element 3 with soldering bump is input in a machine such as a chip mounter, etc., the trays 4 being put together are turned upside-down as they are, and the semiconductor element 3 with soldering bump is used under a state wherein the surface on which a circuit is formed faces down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tray for transporting and storing semiconductor elements, which has a pocket for accommodating semiconductor elements on its upper surface and has a fitting structure designed for stacking.

[0002]

2. Description of the Related Art FIG. 8 is a side sectional view showing a conventional example of a tray for transporting and storing semiconductor elements of this type (hereinafter referred to as tray). In the figure, 1 is a tray, 2 is a pocket 2 provided on the upper surface of the tray, and the semiconductor element 3 is accommodated in the pocket 2. This tray 1 has a fitting structure on the periphery which is intended for stacking.

Since it is assumed that the trays 1 are stacked on each other as described above, the depth of the pocket 2 is set to the semiconductor element 3.
The thickness of the pocket 2 must be equal to or greater than the thickness of the pocket 2, and the size of the pocket 2 is made with an appropriate margin. The operation of the above-described conventional example having the above configuration is as follows. The semiconductor element 3 cut out with the circuit forming surface 3a facing up is transferred into the pocket of the tray 1 by a method such as suction, and transported and stored. When the semiconductor element 3 is mounted on another semiconductor element, a substrate or the like for use, the semiconductor element 3
Are transferred from the pocket 2 of the tray 1 as they are by a method such as suction and connected by a method such as wire bonding.

[0004]

According to the prior art having the above-described structure, a semiconductor element (hereinafter referred to as a semiconductor element with a solder bump) having an electrode (hereinafter referred to as a solder bump) formed by a protrusion such as solder on a circuit formation surface is used. When mounting a semiconductor element with a solder pump on a semiconductor element or a substrate with the circuit forming surface facing down, the circuit forming surface should face up. You have to reverse the front and back depending on the situation.

Also, if the semiconductor element with solder bumps is cut out in advance with the circuit forming surface facing down and transferred to the tray as it is, it is not necessary to reverse it when mounting it on a semiconductor element, a substrate, etc. In the pocket, the solder bumps of the semiconductor element with solder bumps are located underneath, which may cause scratches during transportation. In view of the above problems, the present invention has a circuit forming surface of a semiconductor element with solder bumps facing upward during transportation and storage, and a circuit forming surface of a semiconductor element with solder bumps is already in a tray pocket when mounted on a substrate or the like. An object of the present invention is to provide a tray that has a configuration that is aligned and provided in a downward state, has high transport and storage characteristics, and enhances workability during mounting.

[0006]

To achieve the above object, the present invention enables a semiconductor element with solder bumps, which is accommodated when it is mounted on a substrate or the like, to be turned upside down together with the tray. That is, the present invention has a pocket for accommodating semiconductor elements on the upper surface thereof, and in a tray for transporting and storing semiconductor elements having a fitting structure that is intended for stacked use, it has the same vertical and horizontal shapes just on the back side of the pocket portion. It is characterized by having a back pocket.

In this case, the front and back pockets have the same depth, and the value is within the thickness of the semiconductor element to be housed.
The sum of the depths of the front and back pockets is equal to or greater than the thickness of the semiconductor element, or the depth of one of the front and back pockets is equal to or greater than the thickness of the semiconductor element, and the depths of the other pockets are equal to or greater than the semiconductor element. It should be less than the thickness of the element. In the latter case,
Only when the depth of the front pocket is equal to or larger than the thickness of the semiconductor element that houses the front pocket, a sheet of an antistatic material or a cushioning material can be sandwiched between the trays.

[0008]

According to the present invention having the above-mentioned structure, at the time of storage, if the semiconductor elements are put in the front pockets and the trays are stacked,
The semiconductor element can be transported and stored with the circuit forming surface facing up. When mounting it on a substrate, etc., turn the whole over and remove the tray. Can be provided in line. Therefore, in this state, even if it is put into a machine such as a mounter as it is, it is not necessary to invert the semiconductor element with solder bumps in the machine.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a first embodiment of the present invention. In FIG. 1, 4 is a tray, 2a is a front pocket provided on the upper surface of the tray, and the semiconductor element 3 is accommodated in the front pocket 2a during storage. The tray 4 has a fitting structure on the periphery that is intended for stacking.

A back pocket 2b is provided just on the back side of the front pocket 2a, and the back pocket 2b has the same vertical and horizontal shapes as the front pocket 2a. FIG. 2 is an enlarged side sectional view of a main part of FIG. Here, the depth of the front pocket 2a is d
1, the depth of the back pocket 2b is d2, and the thickness of the semiconductor element 3 with solder bumps is h.

In this embodiment, the front pocket 2a and the back pocket 2b have the same depth (d1 = d2). Further, the value obtained by adding the depth d1 of the front pocket 2a and the depth d2 of the back pocket 2b is such that the semiconductor element 3 with solder bumps does not collide with the adjacent upper tray when the trays 4 are stacked. The thickness of the bumped semiconductor element 3 is equal to or larger than h (d1 + d2> h), and the difference is 2
About 00 μm is desirable (d1 + d2-h = 200 μm
m).

FIGS. 3 and 4 are side sectional views showing the operation of this embodiment. FIG. 3 shows a state in which the tray front side is on the upper surface = state 1, and FIG. 4 shows a state in which the tray back side is on the upper surface = state 2. Show. The operation of this embodiment having the above configuration will be described below. First, the semiconductor element 3 with solder bumps is cut out with the circuit forming surface facing upward. The cut semiconductor element 3 with solder bumps is transferred onto the front pocket 2a of the tray 4 by a method such as suction, and when the front pocket 2a of the tray 4 becomes full, a new tray 4 is overlaid thereon and transferred. Continue to post. Transport and storage are performed in the state of the tray 4 (state 1: FIG. 3). Next, when the semiconductor element 3 with solder bumps is put into a machine such as a chip mounter for use, the stacked trays 4 are turned upside down as they are (state 2 = FIG. 4).
The tray 4 on the top is removed, and the semiconductor element 3 with solder bumps is used with the circuit forming surface facing down. At this time, in the semiconductor element 3 with solder bumps, the surface which was the ceiling in the state 1 is used as the bottom surface of the pocket in the state 2.

Since the front and back pockets have the same depth,
There is no problem even if you use it in state 2 for transportation and storage and state 1 when using it with a mounter, there is no change in function. Further, as described above, since the difference between the depth d1 of the front pocket 2a + the depth d2 of the back pocket 2b and h is minute, the semiconductor element 3 with solder bumps is adjacent to the tray 4 on which it is mounted. The wall surfaces of both pockets 4 are always in a state close to abutting. Therefore, when the trays 4 are inverted, the semiconductor elements 3 with solder bumps can be smoothly accommodated in the pockets of the adjacent trays 4 without colliding with the wall surfaces of the pockets of the adjacent trays 4 with a strong force.

FIG. 5 is a side sectional view of the structure of the tray 4 showing the second embodiment of the present invention, and FIG. 6 is an enlarged side sectional view of the essential parts of FIG. In the present embodiment, the depth d1 of the front pocket 2a is set to be equal to or larger than the thickness h of the semiconductor element 3 with solder bumps (d1> h), and the depth d2 of the back pocket 2b is equal to that of the semiconductor element 3 with solder bumps. Make sure that the thickness is not more than h (d2> h).

Further, since the same function can be obtained even when the tray 4 is turned upside down, the depth d1 of the front pocket 2a existing on the upper surface of the tray 4 is not less than the thickness h of the semiconductor element 3 with solder bumps in FIG. However, the depth d2 of the back pocket 2b existing on the lower surface of the tray 4 may be changed to be equal to or larger than the thickness of the semiconductor element 3 with solder bumps. The operation of the second embodiment having the above configuration is the same as that of the first embodiment described above.

FIG. 7 is a side view showing a third embodiment of the present invention. In the third embodiment, when the structure of FIG. 5, that is, when the depth of the front pocket 2a is equal to or larger than the thickness h of the semiconductor element 3 with solder bumps, a static film such as a film or Japanese paper is provided between the trays 4. A sheet 5 of antistatic material or cushioning material is sandwiched. When the semiconductor element with solder bumps is put into a machine such as a chip mounter for use, the sheet 5 is removed beforehand.

According to the third embodiment having the above construction, the function of protecting the semiconductor element 3 with solder bumps is further enhanced. In each of the above embodiments, a semiconductor element with solder bumps is assumed as one of the semiconductor elements, but the BGA (Ball Gr.
It can also be applied to the transportation and storage of id Array packages.

[0018]

As described in detail above, according to the present invention, there is provided a tray for transporting and storing semiconductor elements, which has a pocket for accommodating semiconductor elements on its upper surface and has a fitting structure designed for stacking. Since the back pocket having the same vertical and horizontal shapes is provided just on the back side of the pocket portion, the semiconductor element with solder bumps stored at the time of mounting on a substrate or the like can be turned upside down together with the tray.

As a result, the circuit forming surface of the semiconductor element with solder bumps is on the top during transport and storage, and the circuit forming surface of the semiconductor element with solder bumps is already on the bottom in the pocket of the tray when it is mounted on a substrate or the like. It is possible to provide the trays in line with each other, and it is possible to provide a tray that has a high transport and storage property and enhances the workability at the time of mounting.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a first embodiment of the present invention.

FIG. 2 is an enlarged side sectional view of a main part of FIG.

FIG. 3 is a side sectional view showing the operation of the present embodiment.

FIG. 4 is a side sectional view showing the operation of the present embodiment.

FIG. 5 is a side sectional view showing a second embodiment of the present invention.

6 is an enlarged side sectional view of a main part of FIG.

FIG. 7 is a side sectional view showing a third embodiment of the present invention.

FIG. 8 is a sectional view showing a conventional example.

[Explanation of symbols]

 4 Tray 2a Front pocket 3b Back pocket 3 Semiconductor element 5 Sheet

Claims (4)

[Claims] 1. A tray for transporting and storing semiconductor elements, which has a pocket for accommodating semiconductor elements on the upper surface and has a fitting structure for stacking, and has the same vertical and horizontal shapes just on the back side of the pocket portion. A tray for transporting and storing semiconductor devices, which has a back pocket. 2. The front and back pockets have the same depth, the value is within the thickness of the semiconductor element to be housed, and the value obtained by adding the depths of the front and back pockets is not less than the thickness of the semiconductor element. The tray for transporting and storing a semiconductor device according to claim 1, which is characterized in that. 3. The depth of one of the front and back pockets is set to be equal to or larger than the thickness of the semiconductor element to be accommodated, and the depth of the other pockets is set to be equal to or smaller than the thickness of the semiconductor element.
A tray for transporting and storing the semiconductor device according to the item. 4. A sheet of an antistatic material or a cushioning material is sandwiched between the trays when the depth of the front pocket is equal to or larger than the thickness of the semiconductor element to be stored. Tray for transporting and storing semiconductor devices.