JPH10211986A - Tray for storing chip type parts - Google Patents
Tray for storing chip type partsInfo
- Publication number
- JPH10211986A JPH10211986A JP9029782A JP2978297A JPH10211986A JP H10211986 A JPH10211986 A JP H10211986A JP 9029782 A JP9029782 A JP 9029782A JP 2978297 A JP2978297 A JP 2978297A JP H10211986 A JPH10211986 A JP H10211986A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type component
- recesses
- tray
- trays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Wire Bonding (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、チップ型部品収納
用トレイに関し、詳しくは自動実装機へのＩＣ（集積回
路）チップの供給に使用して好適であるチップ型部品収
納用トレイに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type component storage tray, and more particularly to a chip-type component storage tray suitable for use in supplying IC (integrated circuit) chips to an automatic mounting machine. is there.
【０００２】[0002]
【従来の技術】従来のチップ型部品収納用トレイＤは、
図６、図７に示すように、成形材料からなり、方形に形
成された基体２１と、該基体２１の上面側の第一の面２
２と下面側の第二の面２３と、該第一の面２２に設けら
れた格子状の枠部２４と、該枠部２４に囲まれた複数
行、複数列からなる複数個の凹部２５（例えば４行＊８
列の３２個）とから成る。2. Description of the Related Art Conventional chip-type component storage trays D are:
As shown in FIGS. 6 and 7, a base body 21 made of a molding material and formed in a square shape, and a first surface 2 on the upper surface side of the base body 21.
2, a second surface 23 on the lower surface side, a lattice-shaped frame portion 24 provided on the first surface 22, and a plurality of concave portions 25 composed of a plurality of rows and a plurality of columns surrounded by the frame portion 24. (For example, 4 lines * 8
32 rows).
【０００３】また、トレイＤの該凹部２５の形成されて
いる上面側の第一の面２２と、凹部２５の形成されてい
ない下面側の第二の面２３とは、略平行であって平坦に
形成されている。該凹部２５の深さ寸法Ｈは、該凹部２
５に収納される集積回路（ＩＣ）や抵抗やコンデンサな
どのチップ型部品２６の厚さ寸法ｈより僅かに深い寸法
（Ｈ＞ｈ）に形成されている。The first surface 22 on the upper surface of the tray D where the recess 25 is formed and the second surface 23 on the lower surface where the recess 25 is not formed are substantially parallel and flat. Is formed. The depth H of the recess 25 is
5 is formed to have a slightly larger dimension (H> h) than the thickness dimension h of the chip-type component 26 such as an integrated circuit (IC) or a resistor or a capacitor.
【０００４】また、前記凹部２５は、台形状であって、
四方に傾斜した側面２５ａと、平坦に形成され底面２５
ｂとを備えている。そして、トレイＤの複数個の凹部２
５は、チップ型部品２６が、それぞれ収納されるために
形成されており、凹部２５の底面２５ｂの大きさは、該
チップ型部品２６の上面の大きさに対して同等である
か、僅かに大きく形成されている。The recess 25 has a trapezoidal shape,
A side surface 25a inclined in all directions and a flat bottom surface 25
b. Then, the plurality of concave portions 2 of the tray D
5 is formed so that each of the chip components 26 is accommodated therein, and the size of the bottom surface 25b of the concave portion 25 is equal to or slightly smaller than the size of the upper surface of the chip component 26. It is formed large.
【０００５】また、前記凹部２５に収納されるチップ型
部品２６は、所定の機能を備えており、図示されていな
い絶縁基板の回路パターンとの接続のための複数個のバ
ンプ（端子）２６ａが、上面に設けられている。またチ
ップ型部品２６の下面は平坦である。The chip-type component 26 housed in the recess 25 has a predetermined function, and has a plurality of bumps (terminals) 26a for connection with a circuit pattern (not shown) on an insulating substrate. , Provided on the upper surface. The lower surface of the chip component 26 is flat.
【０００６】また、チップ型部品２６が収納されたチッ
プ型部品収納用トレイＤは、通常は図示してないが所定
の個数積層されて、ＩＣ製造メーカから納入される。こ
のときチップ型部品収納用トレイＤの上面側の第一の面
２２と下面側の第二の面２３とは、平坦であることから
積層が容易である。The chip-type component storage trays D in which the chip-type components 26 are stored are usually stacked in a predetermined number (not shown) and delivered from an IC manufacturer. At this time, since the first surface 22 on the upper surface side and the second surface 23 on the lower surface side of the chip-type component storage tray D are flat, lamination is easy.
【０００７】ここで、表面実装型のチップ型部品２６と
しては、抵抗やコンデンサは無論、集積回路（以下ＩＣ
と称する）も、自動実装機の普及とともに広く用いられ
るようになって来ている。このチップ型部品２６（例え
ば、集積回路）は、所望の回路パターンが形成された絶
縁基板上に他のチップ型部品（例えば、抵抗やコンデン
サ）などとともに自動実装機によって載置され、所定の
機能を備えた回路基板が形成される。Here, as the chip type component 26 of the surface mount type, resistors and capacitors are of course used, and integrated circuits (hereinafter referred to as ICs) are used.
) Are also widely used with the spread of automatic mounting machines. The chip-type component 26 (for example, an integrated circuit) is mounted on an insulating substrate on which a desired circuit pattern is formed together with other chip-type components (for example, a resistor and a capacitor) by an automatic mounting machine and has a predetermined function. Is formed.
【０００８】図８に示すように、チップ型部品２６（例
えば、集積回路）は、自動実装機にチップ型部品２６が
収納されたチップ型部品収納用トレイＥをセットし、自
動実装機のバキュームによる吸着腕３０によって、チッ
プ型部品２６の上面を吸着して回路基板上に搬送・載置
されるのである。As shown in FIG. 8, a chip-type component 26 (for example, an integrated circuit) has a chip-type component storage tray E in which the chip-type component 26 is stored in an automatic mounting machine, and a vacuum of the automatic mounting machine. The upper surface of the chip-type component 26 is sucked by the suction arm 30 of the above-described manner, and is conveyed and placed on the circuit board.
【０００９】しかしながら、チップ型部品収納用トレイ
Ｅに収納されたチップ型部品２６は、図７に示すように
ＩＣ製造メーカから納品されてくるときは、回路基板の
回路パターンに接続するためのバンプ（端子）２６ａ
が、上面に配置された形態で納品されてくる。これはチ
ップ型部品収納用トレイＤを搬送するときに、チップ型
部品２６のバンプ２６ａが下面を向き、トレイＤの凹部
２５の底部２５ｂと当接していると擦れなどによって、
バンプ２６ａの表面に傷がつき、バンプ２６ａの半田付
け性が悪くなるという問題を回避するためである。However, when the chip-type components 26 stored in the chip-type component storage tray E are delivered from an IC maker as shown in FIG. 7, bumps for connecting to a circuit pattern on a circuit board are provided. (Terminal) 26a
Are delivered in a form arranged on the upper surface. This is because when the chip-type component storage tray D is conveyed, the bumps 26a of the chip-type components 26 face the lower surface, and when the bumps 26a are in contact with the bottom 25b of the concave portion 25 of the tray D, they are rubbed or the like.
This is to avoid the problem that the surface of the bump 26a is scratched and the solderability of the bump 26a deteriorates.
【００１０】このため、回路基板上にチップ型部品２６
を搬送・載置するためには、図７に示すようにチップ型
部品２６が収納されたチップ型部品収納用トレイＤの上
面に、自動実装機セット用の空のチップ型部品トレイＥ
を裏返した形態で重ね合わせ、この後、重ね合わせたま
ま、トレイＤ、Ｅの天地（上下）をひっくり返すと、収
納されたチップ型部品２６も、バンプ２６ａが下方を向
いた形態に配置される（図８参照）。For this reason, the chip-type component 26 is mounted on the circuit board.
As shown in FIG. 7, an empty chip-type component tray E for an automatic mounting machine is set on the upper surface of the chip-type component storage tray D in which the chip-type component 26 is stored, as shown in FIG.
When the trays D and E are turned upside down (upside down) while the trays D and E are overlaid, the stored chip-type components 26 are also arranged in a form in which the bumps 26a face downward. (See FIG. 8).
【００１１】上述の如くチップ型部品２６のバンプ２６
ａが、下方を向いた形態であることから、このまま自動
実装機（図示せず）の吸着腕３０によって、チップ型部
品２６を吸着して、回路基板上に配置することができ
る。As described above, the bump 26 of the chip-type component 26
Since a is downward, the chip-type component 26 can be sucked by the suction arm 30 of the automatic mounting machine (not shown) and placed on the circuit board.
【００１２】[0012]
【発明が解決しようとする課題】しかしながら、従来の
チップ型部品収納用トレイＤの第一の面２２の凹部２５
に収納されたチップ型部品２６（例えば、集積回路）
は、納品時には、バンプ２６ａが形成された面が上方を
向いて収納されていることから、該チップ型部品２６を
所定の回路パターンが形成されている絶縁基板に載置す
るとき、チップ型部品２６の上下面を反転させることが
必要になる。However, the concave portion 25 of the first surface 22 of the conventional chip-type component storage tray D is required.
Chip type component 26 (for example, integrated circuit)
When the chip-type component 26 is placed on an insulating substrate on which a predetermined circuit pattern is formed, the chip-type component 26 is stored at the time of delivery because the surface on which the bumps 26a are formed faces upward. It is necessary to invert the upper and lower surfaces of 26.
【００１３】このことから、自動実装機にチップ型部品
収納用トレイＤをセットするとき毎に、まず、一個のチ
ップ型部品収納用トレイＤの凹部２５に、自動実装機セ
ット用の空のチップ型部品収納用トレイＥの凹部を重ね
合わせて上下面を反転させることによって、チップ型部
品２６のバンプ２６ａ面を下方に向けさせるという工数
が必要であり、手間が掛かるという問題点があった。For this reason, every time the chip-type component storage tray D is set in the automatic mounting machine, first, an empty chip for the automatic mounting machine setting is set in the recess 25 of one chip-type component storage tray D. The man-hours for turning the bump 26a surface of the chip-type component 26 downward by overlapping the concave portions of the mold component storage tray E and inverting the upper and lower surfaces are required, and there is a problem that it takes time and effort.
【００１４】[0014]
【課題を解決するための手段】本発明のチップ型部品収
納用トレイは、平板状の第一の面と第二の面とのそれぞ
れ対向する位置にチップ型部品を収納するための凹部を
形成したことである。また、本発明のチップ型部品は、
片面にバンプが形成され、該チップ型部品が前記第一の
面又は第二の面のいずれかの凹部に収納されていること
である。According to the present invention, there is provided a tray for storing chip-type components, wherein recesses for storing chip-type components are formed at opposing positions of the first and second flat surfaces. It was done. In addition, the chip-type component of the present invention,
A bump is formed on one surface, and the chip-type component is housed in a concave portion on either the first surface or the second surface.
【００１５】[0015]
【発明の実施の形態】本発明の実施の形態のチップ型部
品収納用トレイＡは、図１〜図５に示すように、成形材
料からなり、方形に形成された基体１と、該基体１の上
面側の第一の面２と、下面側の第二の面３と、該基体１
の第一の面２、および第二の面３にそれぞれ設けられた
格子状の枠部４と、該枠部４に囲まれ、前記第一の面２
および第二の面３のそれぞれに複数行、複数列からなる
複数個の凹部５ａ、５ｂ（例えば片面が４行＊８列の３
２個で、両面に形成されて６４個）とが対向した位置に
設けられている。なお、第一の面２の凹部５ａと第二の
面３の凹部５ｂとは、面対称に設けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip-type component storage tray A according to an embodiment of the present invention, as shown in FIGS. The first surface 2 on the upper surface side, the second surface 3 on the lower surface side,
A grid-like frame portion 4 provided on each of the first surface 2 and the second surface 3 of the first surface 2 and the first surface 2 surrounded by the frame portion 4
And a plurality of recesses 5a, 5b each having a plurality of rows and a plurality of columns (for example, 3 rows each having 4 rows * 8 columns).
2 (64 formed on both sides) are provided at positions facing each other. Note that the concave portion 5a of the first surface 2 and the concave portion 5b of the second surface 3 are provided in plane symmetry.
【００１６】また、チップ型部品収納用トレイＡの該凹
部５ａ、５ｂが形成されている第一の面２と、第二の面
３とは、略平行であって平坦に形成されている。また、
前記凹部５ａ、５ｂは、台形状に形成されており、四方
に傾斜した側面５ｃ、５ｄと、平坦に形成された底面５
ｅ、５ｆとを備えている。そして、チップ型部品収納用
トレイＡの第一の面２と第二の面３との複数個の凹部５
ａ、５ｂは、それぞれチップ型部品６が、それぞれ収納
されるために形成されており、凹部５ａ、５ｂの底面５
ｅ、５ｆの大きさは、該チップ型部品６の大きさに対し
て同等であるか、僅かに大きく形成されている。The first surface 2 on which the recesses 5a and 5b of the chip-type component storage tray A are formed and the second surface 3 are substantially parallel and flat. Also,
The recesses 5a and 5b are formed in a trapezoidal shape, and have side faces 5c and 5d inclined in four directions and a flat bottom face 5d.
e, 5f. Then, a plurality of recesses 5 on the first surface 2 and the second surface 3 of the chip-type component storage tray A are provided.
a, 5b are formed for accommodating the chip-type components 6, respectively, and the bottom surfaces 5 of the recesses 5a, 5b are formed.
The sizes of e and 5f are equal to or slightly larger than the size of the chip-type component 6.
【００１７】該凹部５ａの深さ寸法Ｈは、該凹部５ａに
収納されるチップ型部品６の厚さ寸法ｈより僅かに深い
長さ寸法（Ｈ＞ｈ）に形成されている。また、凹部５ａ
の深さ寸法Ｈは、これに限定されず、チップ型部品６の
厚さ寸法と同等であっても、短い寸法に形成されていて
も良いが、短く形成されているときは、凹部５ａに収納
されたチップ型部品６のバンプ６ａが、上部に積層され
た別のトレイＡ２（図２参照）の下面側の第二の面３に
形成された凹部５ｂの底面５ｆ（逆さに配置されてい
る）と当接することない寸法であれば良い。The depth H of the recess 5a is formed to be slightly longer (H> h) than the thickness h of the chip-type component 6 housed in the recess 5a. Also, the recess 5a
Is not limited to this, and may be formed to be equal to or smaller than the thickness of the chip-type component 6. The bumps 6a of the stored chip-type component 6 are placed on the bottom surface 5f of the concave portion 5b formed on the second surface 3 on the lower surface side of another tray A2 (see FIG. ) As long as it does not come into contact with it.
【００１８】上述の如き深さ寸法であれば、チップ型部
品６のバンプ６ａが、トレイＡの凹部５ｂの底面５ｆと
当接することがないため、積層された複数個のトレイＡ
１、Ａ２、Ａ３を搬送する際（図２参照）に、バンプ６
ａに擦れによる傷が付くことはなく、よって傷によるバ
ンプ６ａの半田付け性の悪化が生じることはない。With the depth dimension as described above, the bumps 6a of the chip-type component 6 do not come into contact with the bottom surface 5f of the concave portion 5b of the tray A.
1, A2 and A3 are transported (see FIG. 2).
a is not scratched by rubbing, and therefore, the solderability of the bump 6a is not deteriorated by the scratch.
【００１９】図２に示すように、上述の如きチップ型部
品収納用トレイＡ１、Ａ２、Ａ３にて納品されたチップ
型部品６（例えば、集積回路）を、自動実装機の吸着腕
３０にて吸着させて回路基板に載置する際には、前記ト
レイＡ１、Ａ２、Ａ３と同形状の空のチップ型部品収納
用トレイＢを、最上部のチップ型部品収納用トレイＡ３
に被せて配置し、全体の天地（上下）を一度に反転させ
る。この反転によって、各トレイＡ１、Ａ２、Ａ３の凹
部５ａに収納されていたチップ型部品６は、各上部に配
置されていた各トレイＡ２、Ａ３、Ｂの凹部５ｂに移動
する。As shown in FIG. 2, the chip-type components 6 (for example, integrated circuits) delivered in the chip-type component storage trays A1, A2, A3 as described above are picked up by the suction arm 30 of the automatic mounting machine. When mounting on a circuit board by suction, the empty chip-type component storage tray B having the same shape as the trays A1, A2, A3 is replaced with the uppermost chip-type component storage tray A3.
And flip the entire top (up and down) at once. Due to this inversion, the chip-type components 6 stored in the concave portions 5a of the respective trays A1, A2, A3 move to the concave portions 5b of the respective trays A2, A3, B arranged on the respective upper portions.
【００２０】このチップ型部品６の反転・移動によっ
て、図５に示すように、バンプ６ａは、下方を向いて配
置され、この形態で、チップ型部品６を、自動実装機の
吸着腕３０にて吸着させて回路基板に載置させることが
できる。As shown in FIG. 5, the bumps 6a are arranged to face downward due to the reversal and movement of the chip-type component 6, and in this mode, the chip-type component 6 is attached to the suction arm 30 of the automatic mounting machine. To be mounted on a circuit board.
【００２１】[0021]
【発明の効果】本発明によれば、片面にバンプ６ａを備
えたチップ型部品６が、ＩＣ製造メーカなどからチップ
型部品収納用トレイＡの上面側の第一の面２の凹部５ａ
に収納され、複数個の各トレイＡ１、Ａ２、Ａ３が積層
されて納品される際に、従来と同様にチップ型部品６の
バンプ６ａが上方を向いた形態で納品できることから、
ＩＣ製造メーカでの作業工数の変更はない。According to the present invention, the chip-type component 6 provided with the bump 6a on one side is provided with the concave portion 5a of the first surface 2 on the upper surface side of the chip-type component storage tray A from an IC maker or the like.
When the plurality of trays A1, A2, and A3 are stacked and delivered, the bumps 6a of the chip-type component 6 can be delivered in the same manner as in the related art, so that the trays A1, A2, and A3 can be delivered.
There is no change in man-hours at the IC manufacturer.
【００２２】そして、チップ型部品収納用トレイＡから
チップ型部品６を、図示しない絶縁基板上の回路パター
ンに載置するために、自動実装機にチップ型部品収納用
トレイＡをセットする際に、積層されて納品された各ト
レイＡ１、Ａ２、Ａ３全体を一度に天地（上下）を反転
させるだけで、各トレイＡ１、Ａ２、Ａ３の第一の面２
の凹部５ａに収納されていたチップ型部品６は、上部に
配置された別の各トレイＡ２、Ａ３、Ｂの第二の面３の
凹部５ｂに反転・移動される。In order to place the chip-type component 6 from the chip-type component storage tray A on a circuit pattern on an insulating substrate (not shown), the chip-type component storage tray A is set in an automatic mounting machine. The first surface 2 of each of the trays A1, A2, A3 is simply inverted upside down (up and down) at a time for all the trays A1, A2, A3 stacked and delivered.
The chip-type component 6 housed in the concave portion 5a is inverted and moved to the concave portion 5b of the second surface 3 of each of the other trays A2, A3, and B arranged on the upper side.
【００２３】この別のチップ型部品収納用トレイＡ２、
Ａ３、Ｂの凹部５ｂへの移動によって、チップ型部品６
の天地（上下）を反転させることが出来、バンプ６ａが
下方を向いて、凹部５ｂに収納される。よって、このチ
ップ型部品６が反転されたチップ型部品収納用トレイＡ
２、Ａ３、Ｂを自動実装機にセットするだけで、回路基
板へのチップ型部品６の自動実装を行うことができる。
これは、チップ型部品収納用トレイＡを、ひとつずつ反
転させる前工程での作業に比較して容易・安価な工数で
あるという効果を奏する。また、本発明のチップ型部品
収納用トレイは、ＩＣメーカから納品されるトレイと自
動実装機セット用のトレイとを兼用することができると
いう効果を奏する。This another chip type component storage tray A2,
The movement of A3 and B to the concave portion 5b causes the chip-type component 6 to move.
Can be turned upside down, and the bump 6a faces downward and is stored in the recess 5b. Therefore, the chip-type component storage tray A in which the chip-type component 6 is inverted.
By simply setting 2, A3, and B in the automatic mounting machine, the chip-type component 6 can be automatically mounted on the circuit board.
This has the effect that the man-hour is easier and cheaper than the work in the previous step of inverting the chip-type component storage trays A one by one. Further, the chip-type component storage tray of the present invention has an effect that the tray delivered from the IC maker and the tray for setting the automatic mounting machine can be used.
【図１】本発明の実施の形態のチップ型部品収納用トレ
イを示す要部断面図である。FIG. 1 is a sectional view of a main part showing a chip-type component storage tray according to an embodiment of the present invention.
【図２】本発明のチップ型部品収納用トレイを積層した
形態を示す要部断面図である。FIG. 2 is a cross-sectional view of a main part showing a form in which chip-type component storage trays of the present invention are stacked.
【図３】本発明のチップ型部品収納用トレイを示す斜視
図である。FIG. 3 is a perspective view showing a chip-type component storage tray of the present invention.
【図４】本発明のチップ型部品収納用トレイを示す要部
上面図である。FIG. 4 is a main part top view showing the chip-type component storage tray of the present invention.
【図５】本発明のチップ型部品収納用トレイを反転した
形態を示す要部断面図である。FIG. 5 is a cross-sectional view of a main part showing an inverted form of the chip-type component storage tray of the present invention.
【図６】従来のチップ型部品収納用トレイを示す要部断
面図である。FIG. 6 is a sectional view of a main part showing a conventional chip-type component storage tray.
【図７】従来のチップ型部品収納用トレイを積層した形
態を示す要部断面図である。FIG. 7 is a cross-sectional view of a main part showing a configuration in which conventional chip-type component storage trays are stacked.
【図８】従来のチップ型部品収納用トレイを反転した形
態を示す要部断面図である。FIG. 8 is a cross-sectional view of a main part showing an inverted form of a conventional chip-type component storage tray.
Ａ チップ型部品収納用トレイ １ 基体 ２ 第一の面 ３ 第二の面 ５ａ、５ｂ 凹部 ６、６０ チップ型部品（集積回路） ６ａ、２６ａ バンプ A Tray for storing chip-type components 1 Base 2 First surface 3 Second surface 5a, 5b Recess 6, 60 Chip-type component (integrated circuit) 6a, 26a Bump
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中川 泰蔵 東京都大田区雪谷大塚町１番７号 アルプ ス電気株式会社内 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Taizo Nakagawa 1-7 Yukitani Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd.
Claims (2)
れ対向する位置にチップ型部品を収納するための凹部を
形成したことを特徴とするチップ型部品収納用トレイ。1. A chip-type component storage tray, wherein a recess for storing a chip-type component is formed at a position facing each of a first plate-shaped surface and a second surface.
成され、該チップ型部品が前記第一の面又は第二の面の
いずれかの凹部に収納されていることを特徴とする請求
項１記載のチップ型部品収納用トレイ。2. The chip-type component according to claim 1, wherein a bump is formed on one surface, and the chip-type component is housed in a concave portion on either the first surface or the second surface. 2. The tray for storing chip-type components according to 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9029782A JPH10211986A (en) | 1997-01-29 | 1997-01-29 | Tray for storing chip type parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9029782A JPH10211986A (en) | 1997-01-29 | 1997-01-29 | Tray for storing chip type parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10211986A true JPH10211986A (en) | 1998-08-11 |
Family
ID=12285594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9029782A Withdrawn JPH10211986A (en) | 1997-01-29 | 1997-01-29 | Tray for storing chip type parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10211986A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
| US7757862B2 (en) | 2007-08-20 | 2010-07-20 | Seiko Epson Corporation | Semiconductor chip housing tray |
| JP2012099631A (en) * | 2010-11-02 | 2012-05-24 | Fujitsu Semiconductor Ltd | Semiconductor chip tray, and method of conveying semiconductor chip |
| KR101405124B1 (en) * | 2013-01-07 | 2014-06-11 | 주식회사 고려반도체시스템 | Apparatus and method of transferring chips between trays having different positional tolerance |
| JP2018064077A (en) * | 2016-10-14 | 2018-04-19 | 株式会社ディスコ | Device chip, housing tray, and housing method of device chip |
| JP2021034490A (en) * | 2019-08-21 | 2021-03-01 | 三菱電機株式会社 | Manufacturing method of storage tray and semiconductor device |
-
1997
- 1997-01-29 JP JP9029782A patent/JPH10211986A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116762A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device |
| US8164181B2 (en) | 2003-10-07 | 2012-04-24 | Fujitsu Semiconductor Limited | Semiconductor device packaging structure |
| US8268670B2 (en) | 2003-10-07 | 2012-09-18 | Fujitsu Semiconductor Limited | Method of semiconductor device protection |
| US7757862B2 (en) | 2007-08-20 | 2010-07-20 | Seiko Epson Corporation | Semiconductor chip housing tray |
| JP2012099631A (en) * | 2010-11-02 | 2012-05-24 | Fujitsu Semiconductor Ltd | Semiconductor chip tray, and method of conveying semiconductor chip |
| KR101405124B1 (en) * | 2013-01-07 | 2014-06-11 | 주식회사 고려반도체시스템 | Apparatus and method of transferring chips between trays having different positional tolerance |
| JP2018064077A (en) * | 2016-10-14 | 2018-04-19 | 株式会社ディスコ | Device chip, housing tray, and housing method of device chip |
| JP2021034490A (en) * | 2019-08-21 | 2021-03-01 | 三菱電機株式会社 | Manufacturing method of storage tray and semiconductor device |
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