JPH08316268A - Semiconductor device and housing carrier therefor - Google Patents

Abstract

PURPOSE: To provide a semiconductor device in which a semiconductor chip is sealed in a ball grid array(BGA) package having a predetermined gap between a printed board and a device board, and a housing carrier therefor in which detachment of a solder ball due to an impulse applied during storage or carriage is prevented. CONSTITUTION: A semiconductor device has a spacer 42 provided in a region on the lower surface of a printed board 41 in which a terminal portion 14 is not formed. The spacer 42 forms a predetermined gap between the printed board 41 and a device board 2 when a solder ball 15 is melted. A housing carrier for a semiconductor device has a receiving stage provided at a position within a pocket corresponding to the spacer 42. The receiving stage is abutted against the spacer 42 to support the semiconductor device so that the solder ball 15 on the lower surface of the printed board 41 does not contact the bottom surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a semiconductor chip is enclosed in a ball grid array type (hereinafter referred to as BGA) package, and particularly, a semiconductor device capable of forming an appropriate gap with a device substrate. And a structure of a storage carrier capable of protecting solder balls.

A BGA package is composed of a printed circuit board on which a semiconductor chip is mounted and a resin layer for sealing the semiconductor chip. The printed circuit board has terminal portions arranged at a predetermined pitch on the lower surface and respective terminal portions. With solder balls applied.

A semiconductor device in which a semiconductor chip is mounted on a printed circuit board of such a BGA package is mounted on the device board by melting a solder ball attached to a terminal portion on the lower surface of the printed circuit board to form a conductor on the device board. Connected to the pattern.

However, if the gap between the printed board and the device board is small during mounting, the molten solder spreads and short-circuits between adjacent conductors. Further, there is a problem that a connection failure occurs when the solder balls attached to the terminal portions fall off due to an impact during storage or transportation.

Therefore, the BGA package in which a predetermined gap is always formed between the printed circuit board and the device board at the time of mounting on the device board, and the solder balls do not drop off due to an impact applied during storage or transportation. The development of a storage carrier is desired.

[0006]

2. Description of the Related Art FIG. 6 is a view showing an example of a conventional semiconductor device, and FIG. 7 is a side sectional view showing a conventional storage carrier.

A conventional semiconductor device 1 is a BG composed of a printed circuit board 11 and a sealing resin layer 12 as shown in FIG. 6 (a).
A semiconductor chip 13 having an A package and mounted on the printed board 11 is sealed in a resin layer 12 formed on the upper surface of the printed board 11.

The printed circuit board 11 is shown in FIG. 6 (a) and FIG.
As shown in (b), the lower surface has a plurality of terminal portions 14 arranged in an array at a predetermined pitch, and after the mounted semiconductor chip 13 is sealed, solder balls 15 having a predetermined particle diameter are provided in the respective terminal portions. It is attached to 14.

As shown in FIG. 6C, the semiconductor device 1 is mounted by positioning the terminal portion 14 on the conductor pattern 21 of the device substrate 2 and then mounting the semiconductor device 1 on the device substrate 2 and heating it. The molten solder ball 15 connects the terminal portion 14 and the conductor pattern 21.

On the other hand, the semiconductor device 1 is stored or transported.
An example of a storage carrier 3 for storing a semiconductor device 1 is made of plastic or the like, and has a pocket 31 for opening the upper surface and abutting the solder ball 15 for supporting the semiconductor device 1 as shown in FIG. 7A. .

Another example of the storage carrier 3 for storing the semiconductor device 1 is formed entirely of plastic or the like as shown in FIG. 7 (b), and a pocket 31 opening on the upper surface is provided inside the lower surface of the printed circuit board 11. It comprises a pedestal 32 that abuts and supports the semiconductor device 1.

[0012]

However, when the above semiconductor device using the BGA package is placed on the device substrate and heated, the range in which the molten solder spreads is the size of the solder ball, the printed circuit board and the device substrate. And the size of the conductor pattern on the device substrate.

For example, when the semiconductor device is placed on a device substrate and heated and the gap between the printed circuit board and the device substrate becomes smaller than a predetermined value, the molten solder spreads beyond the allowable range and spreads to the adjacent conductor. Since the gaps are closed, there is a problem that the conductors are short-circuited.

Further, in the conventional storage carrier, the semiconductor device stored therein can be moved back and forth, left and right in the pocket when an impact is applied. For example, in a storage carrier whose bottom surface is in contact with the solder balls, when the semiconductor device is moved, the solder balls are moved. May fall out.

Further, in the case of a storage carrier having a pedestal in the pocket that abuts against the lower surface of the printed circuit board, when the semiconductor device moves, the conductor pattern on the printed circuit board is broken due to friction with the pedestal, or solder balls are generated. There was a problem of falling out.

An object of the present invention is to provide a semiconductor device having a BGA package in which a predetermined gap is always formed between a printed circuit board and a device substrate, and a solder ball may drop off due to an impact applied during storage or transportation. It is to provide a storage carrier that does not exist.

[0017]

FIG. 1 is a view showing a semiconductor device according to the present invention, and FIG. 2 is a side sectional view showing a storage carrier according to the present invention. Note that the same object is denoted by the same symbol throughout the drawings.

The above problems are caused by a plurality of terminal portions formed on the lower surface.
Printed circuit board 41 with solder balls 15 on each 14
A semiconductor device mounted on the device substrate 2 by melting the solder balls 15
The spacer 42, which forms a predetermined gap between the printed board 41 and the device board 2 when the printed circuit board 41 is melted,
A semiconductor device of the present invention provided in a region where the terminal portion 14 is not formed on the lower surface and a pocket 31 for accommodating one semiconductor device at a time is a storage carrier which is opened on the upper surface and contacts the spacer 42 to print. Solder balls on the bottom of the board 41
A pedestal that supports the semiconductor device so that 15 does not contact the bottom surface.
33 is achieved by the storage carrier of the semiconductor device of the present invention provided at the position corresponding to the spacer 42 inside the pocket 31.

[0019]

A BGA package that can form a predetermined gap between the printed board and the device board by providing a spacer 42 for forming a gap in the area where the terminal portion 14 is not formed on the lower surface of the printed board 41 in FIG. A semiconductor device having the semiconductor device can be realized.

Further, by providing a pedestal 33 that abuts the spacer 42 and supports the semiconductor device inside the pocket 31 in FIG. 2, the solder balls may fall off due to an impact applied during storage or transportation. It is possible to realize a storage carrier that does not have.

That is, according to the present invention, a semiconductor device having a BGA package in which a predetermined gap is formed between a printed circuit board and a device substrate, and a solder ball falling off due to an impact applied during storage or transportation. No storage carrier can be realized.

[0022]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 3 is a perspective view showing a first modification of the present invention, FIG. 4 is a perspective view showing a second modification of the present invention, and FIG. 5 is a perspective view showing a third modification of the present invention. is there.

The semiconductor device 4 of the present invention comprises a BGA package composed of a printed board 41 and a resin layer 12 as shown in FIG. 1A, and the semiconductor chip mounted on the printed board 41 is a printed board 41. It is sealed by a resin layer 12 formed on the upper surface of.

The printed circuit board 41 is shown in FIG.
As shown in (b), the lower surface has a plurality of terminal portions 14 arranged in an array at a predetermined pitch, and after the mounted semiconductor chip 13 is sealed, solder balls 15 having a predetermined particle diameter are provided in the respective terminal portions. It is attached to 14.

Further, at least one spacer 42 is formed in a region of the lower surface of the printed board 41 where the terminal portion 14 is not formed. Although the spacer 42 is formed on the lower surface of the printed board 41 in the drawing, the spacer 42 may be a pin that penetrates the printed board 41.

As shown in FIG. 1C, the semiconductor device 4 is mounted by positioning the terminal portion 14 on the conductor pattern 21 of the device substrate 2 and then mounting the semiconductor device 4 on the device substrate 2 and heating it. The molten solder ball 15 connects the terminal portion 14 and the conductor pattern 21.

When the semiconductor device 4 is mounted on the device substrate 2, a gap is formed between the printed circuit board 41 and the device substrate 2 by the spacer 42, and, for example, molten solder spreads beyond the permissible range and is adjacent. There is no problem such as short-circuiting with the conductor. On the other hand, the storage carrier 5 of the present invention for storing the semiconductor device 4 is entirely made of plastic or the like as shown in FIG. 2 (a), and the pockets 31 opened on the upper surface are in contact with the spacers 42 at the four corners inside. It comprises a pedestal 33 for supporting the semiconductor device 4. In the semiconductor device 4 housed in the pocket 31 of the housing carrier 5, the printed circuit board 41 does not come into direct contact with the pedestal 33, and even if the semiconductor device 4 moves back and forth, left and right in the pocket 31, the conductor pattern of the conductor pattern 4 is generated by friction. There will be no disconnection. Further, the pedestals 33 which are in contact with the spacers 42 respectively support the semiconductor device 4 so that the solder balls 15 do not contact the bottom plate, and the inside of the pocket 31 is covered with the semiconductor device 4.
Solder balls 15 are not
It will never fall out of 41. In addition, the semiconductor device 4
As shown in FIG. 2 (b), another storage carrier 5 for storing the present invention is made entirely of plastic or the like, and pockets 31 opening at the top face support the semiconductor device 4 by abutting spacers 42 at the inner four corners. It has a cradle 33. Unlike the storage carrier, the cradle 33 inside the pocket 31 has a recess 34 into which the tip of the spacer 42 can be fitted on the upper surface,
In the semiconductor device 4 housed in the pocket 31, the spacer 42 is not fitted in the recess 34 and does not move back and forth and left and right inside the pocket 31. In the first modification of the semiconductor device and the storage carrier for the same according to the present invention, as shown in FIG.
At the center of the storage carrier 5, a pedestal 33 having a recess 34 into which the spacer 42 can be fitted is formed on the central bottom plate of the pocket 31. Terminal part as shown in Fig. 1 (b)
In some cases, 14 are arranged along the outer edge of the printed board 41 and the spacers 42 cannot be formed at the four corners, but in many cases the terminal portion 14 is not formed in the central portion of the printed board 41. It is extremely effective. A second modified example of the semiconductor device according to the present invention has spacers 43 added to the four side surfaces of the printed board 41 as shown in FIG. 4, and the plate-like spacers 43 added to the printed board 41 from the bottom surface. A space is formed between the printed circuit board 41 and the device board so as to project. As shown in FIG. 4, a storage carrier for storing such a semiconductor device has a pedestal 33 having on its upper surface a recess 34 into which a spacer 42 of the semiconductor device 4 is fitted, along four wall surfaces surrounding a pocket 31 opening on the upper surface. It is formed at a position facing the spacer 43. In the semiconductor device according to the third modification of the present invention, a plate-like spacer 44 is added to the side surface of the printed board 41 as shown in FIG. 5, and two spacers 44 facing each other are projected from the lower surface to print. A gap is formed between the substrate 41 and the device substrate. As shown in FIG. 5, a storage carrier for storing such a semiconductor device has a pedestal 33 having a recessed portion 34 on the upper surface thereof, into which a spacer 44 of the semiconductor device can be fitted, along two wall surfaces facing each other with a pocket 31 opened on the upper surface. It is formed at a position facing the spacer 44. As shown in FIG. 1 (b), the terminal portions 14 may be arranged along the outer edge of the printed circuit board 41 and the spacers 42 may not be formed at the four corners. However, as shown in FIGS. It can be added to the side surface, and such a modification is extremely effective. A semiconductor device having a BGA package capable of forming a predetermined gap between the printed board and the device board by providing a spacer for forming a gap in the area where the terminal portion is not formed on the lower surface of the printed board is provided. Can be realized. Further, by providing a pedestal for supporting the semiconductor device in contact with the spacer inside the pocket that opens upward, the storage carrier that does not drop the solder balls due to the impact applied during storage or transportation. Can be realized. That is, according to the present invention, a semiconductor device having a BGA package in which a predetermined gap is formed between a printed circuit board and a device substrate, and a storage carrier in which a solder ball is not dropped due to an impact applied during storage or transportation. Can be realized

..

As described above, according to the present invention, the BGA package type semiconductor device in which a predetermined gap is formed between the printed circuit board and the device substrate, and the solder balls drop off due to the impact applied during storage or transportation. It is possible to provide a storage carrier that does not operate.

[Brief description of drawings]

FIG. 1 is a diagram showing a semiconductor device according to the present invention.

FIG. 2 is a side sectional view showing a storage carrier according to the present invention.

FIG. 3 is a perspective view showing a first modified example of the present invention.

FIG. 4 is a perspective view showing a second modified example of the present invention.

FIG. 5 is a perspective view showing a third modified example of the present invention.

FIG. 6 is a diagram showing an example of a conventional semiconductor device.

FIG. 7 is a side sectional view showing a conventional storage carrier.

[Explanation of symbols]

 2 Device board 4 Semiconductor device 5 Storage carrier 12 Resin layer 13 Semiconductor chip 14 Terminal part 15 Solder ball 21 Conductor pattern 31 Pocket 33 Receiving base 34 Recessed portion 41 Printed circuit board 42, 43, 44 Spacer

Claims (3)

[Claims] 1. A semiconductor device, comprising: a printed circuit board having solder balls adhered to a plurality of terminal portions formed on a lower surface thereof; and a semiconductor device mounted on a device substrate by melting the solder balls. A spacer, which forms a predetermined gap between the printed board and the device board when the solder balls are melted, is provided in an area of the lower surface of the printed board where the terminal portion is not formed. Semiconductor device. 2. A carrier for a semiconductor device, wherein a pocket for accommodating each of the semiconductor devices according to claim 1 is opened on the upper surface, wherein a solder ball on the lower surface of the printed circuit board is in contact with the spacer and a bottom surface is formed on the solder ball. A carrier for a semiconductor device, wherein a pedestal for supporting the semiconductor device so as not to come into contact is provided at a position corresponding to the spacer inside the pocket. 3. The storage carrier for a semiconductor device according to claim 2, wherein the upper surface of said pedestal has a recess into which a tip of a spacer can be fitted.