JP2021034490A - Manufacturing method of storage tray and semiconductor device - Google Patents

Abstract

To provide a manufacturing method of a storage tray and a semiconductor device which can shorten a transfer work time and ensure quality without depending on the skill level of a worker.SOLUTION: A tray body 2 includes a plurality of pockets 3 having an open surface 4 having an open end surface. A plurality of slides 6 are provided on the open surface 4 of the plurality of pockets 3 and are connected to the bottom surfaces of the plurality of pockets 3, respectively.SELECTED DRAWING: Figure 1

Description

The present invention relates to a storage tray and a method for manufacturing a semiconductor device using the storage tray.

A semiconductor chip is formed by dividing and cutting (dicing) a semiconductor wafer. This semiconductor chip is picked up with tweezers, stored in a storage tray, and temporarily stored. The storage tray is generally manufactured by injection molding (see, for example, Non-Patent Document 1). Each chip is taken out from the storage tray taken out again with tweezers or collets, and die-bonded to the frame or mounting substrate using a bonding agent. On the other hand, multiple chips may be die-bonded at once. When the partner of the die bond is a semiconductor wafer on which a semiconductor device having the same size as the semiconductor chip is formed, the semiconductor chip is transferred to a special assembly jig prepared in accordance with the arrangement or size of the semiconductor device of the semiconductor wafer.

In order to take out a semiconductor chip, it is called a collet made of rubber, resin, cemented carbide, etc., which is a special tool for grasping the surface or side surface of the semiconductor chip according to the size or structure of the chip or sucking it with vacuum pressure. Jigs are used. These are used in dedicated devices, but when working manually, vacuum tweezers are used to grasp the side surface of the tip with tweezers or to suck the tip angle with a vacuum pull hole.

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When transferring a semiconductor chip from a storage tray to a dedicated assembly tool, grasp the position of the pocket of the storage tray in which the transfer source chip is stored and the position of the empty pocket of the transfer destination dedicated assembly tool on a one-to-one basis. There is a need to. Then, the semiconductor chip is grabbed using a collet or tweezers, moved to the position of an empty pocket of the special assembly tool, and stored. Therefore, there is a problem that the transfer work takes time. In addition, the transfer work depends on the skill level of the operator, and there is a problem of poor quality such as chip scratches (chipping) due to applying force to the chip or dropping the chip.

The present invention has been made to solve the above-mentioned problems, and an object thereof is a storage tray and a storage tray capable of shortening the transfer work time and ensuring quality without depending on the skill level of the worker. A method for manufacturing a semiconductor device is obtained.

The storage tray according to the present invention is provided on a tray body having a plurality of pockets whose end faces are open surfaces, and on the open surfaces of the plurality of pockets, and is connected to the bottom surfaces of the plurality of pockets, respectively. It is characterized by having a plurality of slides.

In the present invention, a plurality of semiconductor chips can be slid from a plurality of slides provided on the open surfaces of the plurality of pockets and transferred at once. As a result, the work of transferring the semiconductor chip from the storage tray can be simplified. Therefore, the transfer work time can be shortened. In addition, quality can be ensured without depending on the skill level of the worker.

It is a perspective view which shows the storage tray which concerns on Embodiment 1. FIG. It is sectional drawing which shows the storage tray which concerns on Embodiment 1. FIG. It is a side view which shows the separation sheet. It is sectional drawing which shows the state which the tray main body was bent. It is a perspective view which shows the semiconductor chip. It is a perspective view which shows the state which the semiconductor chip is stored in the storage tray. It is a top view which shows the special assembly jig used in the next process. It is a top view which shows the semiconductor wafer. It is a perspective view which shows the manufacturing method of the semiconductor device which concerns on Embodiment 1. FIG. It is sectional drawing which shows the manufacturing method of the semiconductor device which concerns on Embodiment 1. FIG. It is a perspective view which shows the manufacturing stage of the storage tray which concerns on Embodiment 2. FIG. It is a perspective view which shows the completed state of the storage tray which concerns on Embodiment 2. FIG. It is a side view which shows the state in which two rising separation barriers are occluded. It is sectional drawing which shows the relationship between the bottom raising amount and the inclination of the bottom surface of a storage tray. It is a perspective view which shows the storage tray which concerns on Embodiment 3. It is sectional drawing which shows the state which put the tray lid on a plurality of pockets. It is a top view which shows the state which put the tray lid on a plurality of pockets. It is sectional drawing which shows the state in which the storage trays are stacked.

The method of manufacturing the storage tray and the semiconductor device according to the embodiment will be described with reference to the drawings. The same or corresponding components may be designated by the same reference numerals and the description may be omitted.

Embodiment 1.
FIG. 1 is a perspective view showing a storage tray according to the first embodiment. The tray body 2 of the storage tray 1 has a plurality of pockets 3. The open surface 4 is an open end surface of the pocket 3 in one direction. The separation bank 5 separates the pockets 3 arranged in two rows. A plurality of slides 6 are provided on the open surfaces 4 of the plurality of pockets 3 and are connected to the bottom surfaces of the plurality of pockets 3, respectively. The open surfaces 4 and slides 6 of the plurality of pockets 3 are arranged on both sides of the tray main body 2 with the separation bank 5 interposed therebetween. Notches 7 connected to pockets 3 on both sides of the tray body 2 are provided on the upper surface of the separation bank 5.

Here, the tray body 2 is formed by a vacuum forming process in which a heated resin sheet having a thickness of 0.2 to 1.0 mm is sucked into a mold and formed. In addition, the tray body 2 may be formed by injection molding of a resin material using a mold or cutting of resin or metal. The slide 6 is formed by making a cut in the resin sheet on the open surface 4 side and then inclining it downward.

The separation sheet 8 separates the adjacent pockets 3 out of the plurality of pockets 3 arranged in the same row on the storage tray 1 from each other. The separation sheet 8 is a separate member that is not integrally molded with the tray body 2. Therefore, the material and thickness of the separation sheet 8 can be selected independently of the tray body 2. By combining the tray body 2 and the separation sheet 8 in the vertical direction in this way, it is possible to form a plurality of pockets 3 arranged with minute gaps corresponding to the thickness of the separation sheet 8.

The tray body 2 is provided with a pocket groove 9 between adjacent pockets 3. A gap 10 is provided in the separation bank 5 on the extension line of the pocket groove 9. The gap 10 of the separation bank 5, the pocket groove 9, and the cut 11 of the slide 6 are arranged in a straight line.

FIG. 2 is a cross-sectional view showing a storage tray according to the first embodiment. FIG. 3 is a side view showing the separation sheet. The separation sheet 8 has a sheet body 12, an insertion portion 13 provided at the bottom of the sheet body 12, and a hook 14 provided at the end of the sheet body 12. Then, the sheet body 12 is inserted into the gap 10 of the separation bank 5. The insertion portion 13 is inserted into the pocket groove 9 provided between the adjacent pockets 3. The hook 14 is hooked on the cut 11 between adjacent slides. The separation sheet 8 is attached to the sheet body 12 at these three locations.

Subsequently, a method of assembling the tray main body 2 and the separation sheet 8 will be described. Since the tray body 2 is made of resin having a thickness of 0.2 to 1.0 mm, its shape can be easily changed with a weak force. If it is within the elastic range of the resin, it will return to its original shape when the force is released. Utilizing this property, the tray body 2 is bent with the separation bank 5 as a fulcrum of line symmetry, and the width of the tray body 2 is adjusted so that the groove 15 of the hook 14 of the separation sheet 8 can be inserted into both sides of the tray body 2. Shrink. FIG. 4 is a cross-sectional view showing a state in which the tray body is bent. Then, the sheet body 12 is inserted into the gap 10 of the separation bank 5, and the insertion portion 13 is inserted into the pocket groove 9. The separation sheet 8 is attached by hooking the hooks 14 at both ends of the sheet body 12 into the gaps 10 on both sides of the tray body 2. This completes the assembly of the storage tray 1.

It is desirable that the separation sheet 8 is raised in the direction perpendicular to the bottom surface of the pocket 3. When that is difficult, a bonding agent may be applied to a portion where the separation sheet 8 is inserted into the sheet body 12, or the resins may be heated and melted to bond the sheets.

FIG. 5 is a perspective view showing a semiconductor chip. The semiconductor chip 16 is formed by dividing and cutting a semiconductor wafer. FIG. 6 is a perspective view showing a state in which the semiconductor chip 16 is stored in the storage tray 1. A plurality of semiconductor chips 16 are stored and stored in a plurality of pockets 3 of the storage tray 1, respectively. The height h3 of the separation sheet 8 may be sufficiently larger than the thickness t1 of the semiconductor chip 16 (h3> t1).

FIG. 7 is a plan view showing a dedicated assembly jig used in the next process. The dedicated assembly jig 17 has a plurality of jig pockets 18. The plurality of pockets 3 of the storage tray 1, the frame portion indicated by the thick line of the special assembly tool 17, and the plurality of jig pockets 18 are provided at positions corresponding to each other. The dedicated assembly tool 17 has a maximum of eight storage numbers corresponding to the number of pockets 3 of the storage tray 1, but the jig tool pocket 18 is indicated by an X in a place where the pocket 3 of the storage tray 1 does not exist. Is not provided.

FIG. 8 is a plan view showing a semiconductor wafer. A plurality of semiconductor devices 20 are formed on the semiconductor wafer 19. A plurality of jig pockets 18 of the dedicated assembly jig 17 are provided at positions corresponding to all the semiconductor devices 20 formed on the semiconductor wafer 19.

Subsequently, a method of manufacturing a semiconductor device using the storage tray according to the present embodiment will be described. FIG. 9 is a perspective view showing a method of manufacturing the semiconductor device according to the first embodiment. FIG. 10 is a cross-sectional view showing a method of manufacturing the semiconductor device according to the first embodiment.

First, as shown in FIG. 6, a plurality of semiconductor chips 16 are stored in a plurality of pockets 3 of the storage tray 1 by using tweezers or a collet as in the conventional technique. The storage tray 1 containing the semiconductor chip 16 is stored in the storage.

The storage tray 1 is taken out from the storage, and the slide 6 is aligned with the jig pocket 18 of the special assembly jig 17 and brought into contact with the slide. As shown in FIG. 9, while tilting the storage tray 1 toward the open surface 4, a plurality of semiconductor chips 16 are stored in the storage tray 1 with an antistatic resin or metal extrusion comb 21 inserted in the notch 7 of the separation bank 5. Push out all at once to the special assembly jig 17 from. As a result, the plurality of semiconductor chips 16 housed in the plurality of pockets 3 are slid from the plurality of slides 6 and transferred to the plurality of jigs and tools pockets 18.

The special assembly jig 17 and the semiconductor wafer 19 are positioned by positioning the jig pocket 18 of the special assembly jig 17 and the semiconductor device 20 of the semiconductor wafer 19 and reversing the special assembly jig 17 while sucking the semiconductor chip 16 in vacuum. To face each other. Then, the vacuum is cut and the plurality of semiconductor chips 16 of the plurality of jig pockets 18 are placed on the plurality of semiconductor devices 20 of the semiconductor wafer 19. The semiconductor chip 16 and the semiconductor device 20 are joined by heating or pressurizing. A semiconductor device is manufactured by the above process.

Here, the width W1 of the semiconductor chip 16 is 3 mm, the length L1 is 5 mm, and the thickness t1 is 0.1 mm. The width W2 of the semiconductor device 20 formed on the semiconductor wafer 19 is 3.2 mm, the length L2 is 5.2 mm, the thickness t2 is 0.4 mm, and the cutting width (dicing width) d is 0.4 mm. In this case, the pitch p in the width direction of the pocket 3 is W2 + 0.4 mm. Therefore, ignoring the width of the separation sheet 8, the width W3 of the pocket 3 of the storage tray 1 is designed to be 3.2 + 0.4 = 3.6 mm. W4 is the pocket width of the dedicated assembly tool 17.

As described above, in the present embodiment, the plurality of semiconductor chips 16 can be slid and collectively transferred from the plurality of slides 6 provided on the open surfaces of the plurality of pockets 3. As a result, the transfer work of the semiconductor chip 16 from the storage tray 1 can be simplified. Therefore, the transfer work time can be shortened.

Further, if the thin semiconductor chip 16 collides with the special metal assembly tool 17, there is a risk of destruction. Therefore, it is necessary to loosely store the semiconductor chip 16 in the jig and tool pocket 18 of the dedicated assembly jig and tool 17. However, simply tilting the storage tray 1 causes individual differences, and the positioning of the pocket 3 and the jig tool pocket 18 of the storage tray 1 becomes inaccurate. On the other hand, by providing the slide 6, the semiconductor chip 16 can be gently transferred. Therefore, it is possible to prevent the semiconductor chip 16 from being destroyed and ensure the quality without depending on the skill level of the operator.

Further, since the separation bank 5 separates the pockets 3 arranged in two rows, it is possible to prevent the semiconductor chips 16 in the opposite arrangement from slipping off when the semiconductor chips 16 in one arrangement are transferred.

Conventionally, the semiconductor chip 16 is sandwiched between collets and taken out from the pocket 3 upward. Therefore, the width of the pocket 3 needs to be designed to be large so that the collet does not buffer. On the other hand, in the present embodiment, the semiconductor chip 16 is pushed out from the open surface 4 of the pocket 3 by the extrusion comb 21 inserted in the notch 7 of the separation bank 5. Therefore, since it is not necessary to secure a space for the collet, the width of the pocket 3 of the storage tray 1 can be reduced.

If the bottom surface of the pocket 3 is horizontal, the semiconductor chip 16 may slip out of the pocket 3 even if the tray body 2 is slightly tilted when the tray body 2 is placed in a storage or the like. Therefore, the bottom surfaces of the plurality of pockets 3 have an inclination that descends from the open surface 4 toward the separation bank 5 with the storage tray 1 horizontal. As a result, the semiconductor chip 16 housed in the line-symmetrical pocket 3 centered on the separation bank 5 is attracted to the separation bank 5 side. Therefore, the semiconductor chip 16 is stably stored without slipping out of the pocket 3.

In addition, the storage tray is generally manufactured by injection molding. The cost of manufacturing a mold for molding is high, and the number of storage trays required when used as an in-process tray in the assembly process is small. For this reason, the manufacturing running cost becomes a burden, and the existing storage tray is often used without designing a new storage tray. Therefore, it is difficult to operate with the optimum combination of the chip size and the storage pocket size. On the other hand, in the present embodiment, the separation sheet 8 which is not integrally molded with the tray main body 2 separates the adjacent pocket 3. Thereby, it is possible to easily realize the storage tray 1 having the pockets 3 divided and arranged in the minute gaps which cannot be realized only by the vacuum forming process. Therefore, the manufacturing cost of the storage tray 1 can be reduced and the manufacturing period can be shortened.

When the dimensional difference between the semiconductor chip 16 and the semiconductor device 20 is small, it is necessary to narrow the cutting width (dicing width) d in order to form as many circuits of the semiconductor device 20 as possible on the semiconductor wafer 19. Therefore, the tray body 2 selects a thick material with a large elastic modulus, but the separation sheet 8 needs to be thinned corresponding to the cutting width d. It is also possible to manufacture a resin sheet with a level of several μm. Therefore, even if the cutting width d of the semiconductor wafer is further narrowed in the future, the separation sheet 8 having the corresponding sheet width can be used.

The resin sheet constituting the tray body 2 has antistatic or antistatic properties such as PS (polyester), PET (polyester terephthal), PP (polypropylene), and PVC having a thickness of 0.2 to 1.0 mm. It is a sheet of a thermoplastic resin such as (polyvinyl chloride) and PEEK (polyetheretherketone), or an engineering resin such as nylon (polyethylene synthetic resin). The separation sheet 8 is made of the same or different resin material as the resin sheet constituting the tray body 2, a metal thin film of 0.2 mm or less such as aluminum, copper, iron, or a material obtained by laminating a resin using the metal as a base material. ..

Embodiment 2.
FIG. 11 is a perspective view showing a manufacturing stage of the storage tray according to the second embodiment. A perforation 22 is machined at the boundary of the adjacent pockets 3. The strip-shaped rising separation barriers 23 and 24 are cut out from the bottom surfaces of the adjacent pockets 3, respectively. Since the central portion of the bottom surface of the pocket 3 supports the stored semiconductor chip 16, it is necessary to cut out the rising separation walls 23 and 24 from other than the central portion of the bottom surface. The rising separation wall 23 is on the side close to the open surface 4, and the rising separation wall 24 is on the side close to the separation bank 5.

FIG. 12 is a perspective view showing a completed state of the storage tray according to the second embodiment. FIG. 13 is a side view showing a state in which the two rising separation barriers are in mesh with each other. The rising separation barriers 23 and 24 are bent along the perforations 22 and raised vertically. The rising separation barriers 23 and 24 have cross keys 25 and 26 facing each other. By engaging and crossing the crossing keys 25 and 26 of the rising separation barriers 23 and 24, the bite cannot be removed due to the reaction force of each other. In the upper figure of FIG. 13, the crossing keys 25 and 26 of the rising separation barriers 23 and 24 have a claw shape that is point-symmetrical to each other. On the other hand, in the lower figure of FIG. 13, the cross keys 25 and 26 have a claw shape that is line-symmetrical with each other. The cross keys 25 and 26 of the rising separation barriers 23 and 24 are engaged with each other to form a wall that keeps the rising separation walls 23 and 24 standing vertically and separates the adjacent pockets 3.

The heights of the rising separation barriers 23 and 24 are sufficiently larger than the thickness t of the semiconductor chip 16. When the width W4 of the dedicated assembly tool 17 is sufficiently wider than the width W1 of the semiconductor chip 16, the separation sheet 8 can have the same resin sheet thickness as the tray body 2.

Since the rising separation barriers 23 and 24 are raised along the perforations 22, even after the cross keys 25 and 26 are engaged, a force of tilting in the direction of the sheet surface cut out by the elastic force of the resin sheet is applied. That is, since the force that the cross key 25 tilts from the paper surface to the back and the force that the cross key 26 tilts from the paper surface to the front are applied, it is stable only with the rising separation barriers 23 and 24 without any other support. Can be a wall. In this way, the rising separation barriers 23 and 24 can be easily processed and can serve to separate the adjacent pockets 3.

Further, the central portion of the bottom surface of the pocket 3 is raised with respect to the cut-out portion of the rising separation barriers 23 and 24. As a result, it is possible to prevent the cross keys 25 and 26 from sticking out to the inside of the pocket 3 and coming into contact with the semiconductor chip 16 housed in the pocket 3. Further, it is possible to prevent the semiconductor chip 16 from being sandwiched between the holes cut out from the rising separation walls 23 and 24 and becoming an obstacle when the semiconductor chip 16 is slid out of the pocket 3.

The bottom raising amount k is about 0.2 to 1.0 mm, which is the thickness of the resin sheet. FIG. 14 is a cross-sectional view showing the relationship between the amount of raising the bottom and the inclination of the bottom surface of the storage tray. When the bottom raising amount k is 0, the angle between the bottom surface of the pocket 3 and the slide 6 is α. When the bottom is raised, a boundary portion 28 between the bottom surface 27 of the pocket 3 and the slide 6 is provided. The inclination angles α of the bottom surface of the pocket 3 and the slide 6 are constant, and when the bottom raising amounts k are 0.2 mm and 1.0 mm, the inclination angles of the bottom surface of the pocket 3 and the boundary portion 28 are β and γ, respectively. Since α <β and α <γ, the angles that the semiconductor chip 16 overcomes are π / 2-β <π / 2-α and π / 2-γ <π / 2-α. The smaller the angle that the semiconductor chip 16 gets over, the easier it is to get over. Therefore, the semiconductor chip 16 can smoothly get over the boundary portion 28 by raising the bottom surface of the pocket 3. The same effect can be obtained even if the bottom surface 27 to the slide 6 is curved.

Embodiment 3.
FIG. 15 is a perspective view showing a storage tray according to the third embodiment. The tray lid 29 is connected to the tray body 2 via a bellows (bellows) or a perforated connecting portion 30. The connecting portion 30 is bent toward the tray body 2 side, and the tray lid 29 is put on the entire plurality of pockets 3. The tray lid 29 is opened by bending the connecting portion 30 to the opposite side. By utilizing the fact that the resin sheet is an elastic body and forming the connecting portion 30 between the tray body 2 and the tray lid 29 into bellows or perforations, the tray lid 29 can be easily opened and closed. When the connecting portion 30 is a bellows, the resin sheet is patterned when it is vacuum formed, and has durability that does not break even if it is repeatedly opened and closed. When the connecting portion 30 is perforated, it is formed by a cutting mold after vacuum forming, but since the connecting portion is partially cut, it is easily damaged if it is repeatedly opened and closed.

FIG. 16 is a cross-sectional view showing a state in which the tray lid is put on a plurality of pockets. FIG. 17 is a plan view showing a state in which the tray lid is put on a plurality of pockets. A convex portion 31 is provided on the upper surface of the tray lid 29 in a state where the tray lid 29 is covered with the plurality of pockets 3. A concave portion 32 having a shape corresponding to the convex portion 31 is provided on the lower surface of the tray main body 2.

FIG. 18 is a cross-sectional view showing a state in which the storage trays are stacked. When storing a plurality of storage trays 1, the plurality of storage trays 1 are stacked by fitting the convex portion 31 of the tray lid 29 of one storage tray 1 into the concave portion 32 of the tray body 2 of the other storage tray 1. Can be done. At this time, bending is appropriately performed so that the insertion portion 13 and the hook 14 of the separation sheet 8 do not buffer the surface of the tray lid 29. Semiconductor chips are often stored together according to the number of pockets to be stored in the divided wafer units or the dedicated assembly tool at the transfer destination, but by stacking multiple storage trays 1, they are occupied during storage. The area can be reduced.

Further, the storage tray 1 often requires antistatic characteristics so as not to cause dielectric breakdown of the internal circuit of the semiconductor chip 16. For this reason, conventionally, an additive such as carbon is added to the molding resin of the base material of the storage tray 1 to turn black, and the inside of the tray cannot be seen. Therefore, in order to check the internal state of the tray, it is stored from the storage. It was necessary to take out the tray 1 and open the tray lid 29. On the other hand, in the present embodiment, a translucent resin sheet such as conductive PET may be used as the material for the tray body 2 and the tray lid 29. This makes it possible to easily check the chip state inside the tray.

1 storage tray, 2 tray body, 3 pockets, 4 open surface, 5 separation bank, 6 slide, 7 notch, 8 separation sheet, 9 pocket groove, 10 gap, 11 cut, 12 sheet body, 13 insertion part, 14 hooks, 16 semiconductor chips, 17 dedicated assembly jigs, 18 jig pockets, 19 semiconductor wafers, 20 semiconductor devices, 23, 24 rising separation walls, 25, 26 cross keys, 29 tray lids, 31 convex parts, 32 concave parts.

Claims (12)

A tray body with multiple pockets with open end faces,
A storage tray provided on the open surface of the plurality of pockets and provided with a plurality of slides connected to the bottom surfaces of the plurality of pockets. The tray body has a separation bank that separates the plurality of pockets arranged in two rows.
The open surface of the plurality of pockets and the slide are arranged on both sides of the tray body with the separation bank in between.
The storage tray according to claim 1, wherein the upper surface of the separation bank is provided with notches connected to the pockets on both sides of the tray body. The storage tray according to claim 2, wherein the bottom surface of the plurality of pockets has an inclination that descends from the open surface toward the separation bank. A separation sheet for separating the adjacent pockets is provided.
The tray body and the slide are made of an integrally molded resin sheet.
The storage tray according to claim 2 or 3, wherein the separation sheet is not integrally molded with the resin sheet. The separation sheet has a sheet body, insertion portions provided at the lower part of the sheet body, and hooks provided at both ends of the sheet body.
The insertion portion is inserted into a pocket groove provided between the adjacent pockets, and the insertion portion is inserted into a pocket groove provided between the adjacent pockets.
The sheet body is inserted into the gap of the separation bank,
The storage tray according to claim 4, wherein the hook is hooked on a cut between adjacent slides. The resin sheet is a sheet of a thermoplastic resin or an engineering resin having antistatic or antistatic properties.
The storage tray according to claim 4 or 5, wherein the separation sheet is made of the same or different resin material as the resin sheet, a metal thin film, or a material obtained by laminating a resin with a metal as a base material. The tray body has first and second rising separation barriers that are cut out from the bottom surface of the adjacent pockets and raised, respectively.
The first and second rising separation barriers have cross keys that face each other and
The cross keys of the first and second rising separation walls are occluded to form a wall that separates the adjacent pockets by holding the first and second rising separation walls in an upright state. The storage tray according to any one of claims 1 to 3, wherein the storage tray is characterized by the above. The storage tray according to claim 7, wherein the central portion of the bottom surface of the pocket is raised with respect to the cut-out portion of the first and second rising separation walls. Further provided with a tray lid connected to the tray body via bellows or perforations.
A convex portion is provided on the upper surface of the tray lid with the tray lid covered with the plurality of pockets.
The storage tray according to any one of claims 1 to 8, wherein a concave portion having a shape corresponding to the convex portion is provided on the lower surface of the tray main body. A method for manufacturing a semiconductor device, which comprises using the storage tray according to any one of claims 1 to 9. A step of storing a plurality of semiconductor chips in the plurality of pockets of the storage tray, and
A dedicated assembly jig and tool having a plurality of jig and tool pockets at positions corresponding to a plurality of semiconductor devices formed on the semiconductor wafer are prepared, and the plurality of semiconductor chips housed in the plurality of pockets are respectively placed on the plurality of slides. The step of sliding from and transferring to the multiple jig pockets,
10. A aspect of claim 10, wherein the dedicated assembly jig tool and the semiconductor wafer are opposed to each other, and the plurality of semiconductor chips in the plurality of jig tool pockets are mounted on the plurality of semiconductor devices of the semiconductor wafer. The method for manufacturing a semiconductor device according to. A step of storing a plurality of semiconductor chips in the plurality of pockets of the storage tray according to claim 2, respectively.
A semiconductor device including a step of extruding the plurality of semiconductor chips from the plurality of pockets at once with an extrusion comb inserted into the notch of the separation bank and sliding the plurality of semiconductor chips from the plurality of slides to transfer the semiconductor chips. Manufacturing method.

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