JP2008277662A - Semiconductor wafer storing tray - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer storing tray which can prevent damages to a stored semiconductor wafer and improve transportation (conveyance) efficiency. <P>SOLUTION: The semiconductor wafer holding tray 10 is held in a semiconductor wafer conveyance container 20 holding and conveying the semiconductor wafer W, and is positioned inside the semiconductor wafer conveyance container 20. The tray is provided with its planar tray body part 12, on which the semiconductor wafer W is placed and a projection part 14 positioning the semiconductor wafer W, disposed projecting from an outer edge part of the tray body part 12 and placed in the tray body part 12, with respect to the tray main body part 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor wafer storage tray that stores a semiconductor wafer and is stored and positioned in a semiconductor wafer transfer container that transfers the semiconductor wafer.

  In recent years, various electronic devices have been reduced in size and thickness. Semiconductor elements mounted on these electronic devices have also been miniaturized, and in recent years, the thickness has been particularly reduced. Conventionally, there is no standard such as SEMI for a shipping method for shipping a thinned semiconductor wafer, and semiconductor wafers are shipped by a method unique to each company. For example, as a general shipping method, there is a so-called coin stack method in which thin semiconductor wafers and slip sheets are alternately stacked inside one coin stack case (prior art 1).

  As another shipping method for shipping semiconductor wafers, thinned semiconductor wafers are accommodated in FOUPs or FOSBs that are semiconductor wafer containers used in the previous process before thinning the semiconductor wafer. There is a method of shipping (prior art 2). In these FOUP and FOSB, a slot into which the outer peripheral edge of the semiconductor wafer is inserted is formed, but the setting of the size of the slot is set to accommodate a semiconductor wafer before being thinned, that is, a semiconductor wafer having a large thickness. In the prior art 2, the thinned semiconductor wafer is supported by the slot having this setting.

  Note that the above prior art is a public technique, and the present invention has been developed based on the public technique. For this reason, the applicant does not know the existence of a document known invention related to the present invention at the time of filing a patent application, and omits the description of the name of the document known invention and the location of other information related to the document known invention.

  By the way, the above coin stacking method which is the prior art 1 has an advantage that the volume of the coin stack case can be reduced. However, there is no semiconductor transfer device corresponding to the coin stack case, and the semiconductor wafer is packed in the coin stack case. There are drawbacks in that all operations such as taking out the semiconductor wafer from the coin stack case and setting the taken-out semiconductor wafer in the related apparatus in the next process are manually performed by the operator. In addition, the coin stack case is vulnerable to an impact such as dropping, and there is another problem that the internal semiconductor wafer is easily damaged.

  Further, in the method of the prior art 2, since the slot size setting of the FOUP or FOSB is set to accommodate a thick semiconductor wafer, when a thinned semiconductor wafer is accommodated in the slot of this setting (default), Since the strength of the thinned semiconductor wafer is small, the central portion of the thinned semiconductor wafer bends down (hangs down), contacts another semiconductor wafer accommodated in the lower side, or the semiconductor wafer is slotted. May fall out of contact with another semiconductor wafer on the lower side and be damaged. Since various elements (electronic circuits) are formed on the semiconductor wafer at this stage, if the semiconductor wafer is damaged, the amount of damage becomes large. Fortunately, even if these problems do not occur, existing FOUPs and FOSBs have been increased in size to accommodate the semiconductor wafer before thinning, and if a thinned semiconductor wafer is accommodated in this, In addition, there is a problem that a useless space remains in the FOUP or FOSB, and the transportation (conveyance) cost increases more than necessary. As described above, the method of the conventional technique 2 causes a problem of damage to the semiconductor wafer and a problem of lowering the transport (conveyance) efficiency of the semiconductor wafer.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer storage tray capable of achieving both prevention of breakage of a stored semiconductor wafer and improvement in transportation (conveyance) efficiency.

  The invention according to claim 1 is a semiconductor wafer storage tray that stores a semiconductor wafer and is stored in a semiconductor wafer transfer container that transfers the semiconductor wafer, and is positioned inside the semiconductor wafer transfer container. A planar tray main body portion on which the semiconductor wafer is placed, and a semiconductor wafer placed on the tray main body portion, which is provided protruding from the outer edge portion of the tray main body portion, is positioned with respect to the tray main body portion. And a protruding portion.

  According to a second aspect of the present invention, in the semiconductor wafer storage tray according to the first aspect, the protruding portion has a positioning function for positioning the semiconductor wafer transport container with respect to the semiconductor wafer transport container in a state of being accommodated in the semiconductor wafer transport container. It is characterized by having both.

  According to a third aspect of the present invention, in the semiconductor wafer containing tray according to the first or second aspect, a through-hole penetrating in the thickness direction is formed in the tray main body.

  According to a fourth aspect of the present invention, in the semiconductor wafer storage tray according to any one of the first to third aspects, the protrusion is between the protrusions adjacent to each other along the outer edge of the tray main body. It is characterized in that it is provided with a gap.

  According to a fifth aspect of the present invention, in the semiconductor wafer storage tray according to any one of the first to fourth aspects, an inclination angle from the vertical direction of the protruding portion toward the outside of the tray main body portion is 5 degrees or more. It is characterized by being set to 10 degrees or less.

  According to the first aspect of the present invention, the semiconductor wafer is placed on the tray main body, and the semiconductor wafer and the interleaving paper are alternately stacked by an arbitrary number. Then, the semiconductor wafer placed on the tray main body is positioned with respect to the tray main body by the protrusion provided on the outer edge of the tray main body. As described above, the plurality of semiconductor wafer storage trays on which the semiconductor wafers are stacked are respectively stored in the existing semiconductor wafer transfer container and positioned inside the semiconductor wafer transfer container.

  According to the present invention, the semiconductor wafer is accommodated in the semiconductor wafer accommodating tray in a state of being placed on the planar tray body, and the semiconductor wafer accommodating tray is positioned in the semiconductor wafer transport container, so that the semiconductor wafer is It is possible to prevent the semiconductor wafer from being damaged without hanging down (bending) or falling off inside the semiconductor wafer transfer container.

  In addition, since the existing semiconductor wafer transport container can be used as it is, it is not necessary to newly manufacture the semiconductor wafer transport container and the manufacturing cost does not occur. In addition, although the existing semiconductor wafer transfer container has become larger, the space inside the semiconductor wafer transfer container can be effectively used by storing a plurality of semiconductor wafer storage trays containing the semiconductor wafer in the semiconductor wafer transfer container. It can be used for. As a result, the transfer efficiency of the semiconductor wafer can be improved.

  According to the second aspect of the present invention, the projecting portion has a positioning function for positioning with respect to the semiconductor wafer transport container while being accommodated in the semiconductor wafer transport container. As a result, the protruding portion has both a function of positioning the semiconductor wafer with respect to the tray body and a function of positioning the semiconductor wafer storage tray with respect to the semiconductor wafer transport container. As a result, it is not necessary to separately provide a positioning member having a positioning function with respect to the semiconductor wafer transfer container of the semiconductor wafer storage tray in the semiconductor wafer storage tray, the number of parts of the semiconductor wafer storage tray can be reduced, and the manufacturing cost can be reduced. . Note that the positioning member having the positioning function of the semiconductor wafer storage tray with respect to the semiconductor wafer transport container does not need to be provided on the semiconductor wafer transport container side, and the existing semiconductor wafer transport container can be used as it is.

  According to the third aspect of the present invention, since the through-hole penetrating in the thickness direction is formed in the tray main body portion, the semiconductor wafer positioned at the lowermost layer is placed on the tray main body portion. Air between the wafer and the tray body is pushed out of the through hole. As a result, the semiconductor wafer is placed on the tray body in a state where no air is interposed between the semiconductor wafer located at the lowermost layer and the tray body. As a result, the semiconductor wafer is placed on the tray main body in a state where there is no wrinkles or air accumulation in the semiconductor wafer located in the lowermost layer. Therefore, another semiconductor wafer is laminated on the lowermost semiconductor wafer. Even in this case, the lowermost semiconductor wafer can be prevented from being damaged. In other words, if another semiconductor wafer is stacked from above with wrinkles or air pockets on the lowermost semiconductor wafer, the wrinkles or air pockets of the lowermost semiconductor wafer are crushed by the upper semiconductor wafer. Although the lowermost semiconductor wafer may be damaged, this problem can be solved by forming a through hole in the tray body.

  According to the invention described in claim 4, since the protrusion is provided with a gap formed between adjacent protrusions along the outer edge of the tray body, the semiconductor wafer is placed on the tray body. Every time the stacking is performed, air is pushed out from the gap formed between the protrusions adjacent to each other along the outer edge of the tray main body. As a result, air does not intervene between the semiconductor wafers adjacent in the vertical direction, so that the semiconductor wafers are sequentially stacked without wrinkles or air accumulation on each semiconductor wafer. As a result, each semiconductor wafer can be prevented from being damaged due to the presence of air. In addition, since air does not intervene between semiconductor wafers adjacent in the vertical direction, a large number of semiconductor wafers can be stacked on the semiconductor wafer storage tray.

  According to the fifth aspect of the present invention, since the inclination angle from the vertical direction of the protrusion toward the outside of the tray main body is set to 5 degrees or more and 10 degrees or less, the semiconductor wafer can be easily mounted on the tray main body. It can be placed and stacked.

  On the contrary, if the inclination angle of the protrusion is less than 5 degrees, it is not suitable because the semiconductor wafer is caught by the protrusion when it is taken out from the semiconductor wafer storage tray, and it becomes difficult to take out the semiconductor wafer. .

  If the inclination angle of the protrusion is larger than 10 degrees, a part of the semiconductor wafer may be placed on the inclined surface of the protrusion when the semiconductor wafer is stacked on the tray body. If the semiconductor wafers are sequentially stacked in this state, it is not suitable because cracks or cracks may occur in the portions of the semiconductor wafer protruding on the inclined surface.

  Next, the semiconductor wafer storage tray according to the first embodiment of the present invention will be described with reference to the drawings. The semiconductor wafer storage tray described below is based on the premise that a thinned semiconductor wafer (a semiconductor wafer having a thickness of 30 μm to 200 μm) is stacked.

  As shown in FIGS. 1 to 3, the semiconductor wafer storage tray 10 has a tray main body 12 on which a thinned semiconductor wafer W (see FIG. 3) is placed and which is stored in a semiconductor wafer transfer container (FOSB) 20. It has. The tray body 12 is formed in a disk shape as a whole. A plurality of through holes 16 penetrating the bottom surface 12A in the thickness direction are formed in the bottom surface 12A of the tray main body portion 12 respectively. Further, the bottom surface 12A of the tray main body 12 is formed in a planar shape, and the semiconductor wafer W is placed and laminated on the bottom surface 12A.

  The thickness dimension of the tray main body 12 is formed to be thicker than the thickness dimension of the normal semiconductor wafer W: 775 μm.

  As shown in FIG. 2, a plurality of protrusions 14 are formed on the outer peripheral edge of the tray main body 12. The protruding portion 14 is formed so as to protrude obliquely outward and upward from the tray main body portion 12. That is, a plurality of the protruding portions 14 are formed on the outer peripheral edge of the tray main body portion 12 with an arbitrary interval. In other words, a gap 18 is formed between the protrusions 14 adjacent on the outer peripheral edge of the tray main body 12. The protrusion 14 has a function of positioning the semiconductor wafer W placed on the tray body 12 with respect to the tray body 12.

  Here, as shown in FIG. 2, the protruding portion 14 is formed so as to be inclined to the outside of the tray main body portion 12 from the vertical direction (straight line L). The protruding portion 14 includes a protruding inclined surface 14 </ b> A for guiding the semiconductor wafer W to the tray main body portion 12. As a result, when the semiconductor wafer W is stacked on the tray body 12, the semiconductor wafer W is guided to the protruding inclined surface 14 </ b> A and guided to the tray body 12.

  As shown in FIG. 2, the inclination angle α from the vertical direction (straight line L) of the protrusion 14 toward the outside of the tray main body 12 is set to be 5 degrees or more and 10 degrees or less. Furthermore, the height dimension H along the vertical direction (straight line L) of the protruding portion 14 is set to be 3.0 mm or more and 5.3 mm or less.

  Further, the tray main body 12 and the protrusion 14 are integrally formed. The tray main body 12 and the protruding portion 14 can be formed of metal, paper, resin, etc., but in consideration of strength, durability, weight, etc., a hard resin (for example, PMMA) that has been particularly antistatic processed. (Polymethyl methacrylate: methacrylic resin), polycarbonate, PEEK (polyether ether ketone), etc.) are preferable.

  Here, the diameter R of the tray main body 12 is set to be slightly smaller than the distance between the side walls 24 and 26 of the container main body 22 described later. For this reason, when the semiconductor wafer storage tray 10 is inserted into the slot 28 of the container body 22, the separation distance between the protruding portion 14 of the semiconductor wafer storage tray 10 and the side walls 24 and 26 of the container body 22 is almost eliminated. The inserted semiconductor wafer storage tray 10 can hardly move along the left-right direction (the direction of arrow B in FIGS. 4 and 5), and is positioned inside the container body 22. The slot 28 is a groove formed by the protrusions 30 and 32 adjacent to each other in the height direction formed on both side walls 24 and 26 of the container body 22.

  In addition, the height dimension H of the projecting portion 14 is a distance dimension between the projecting portions 30 and 32 adjacent to each other in the height direction of the projecting portions projecting on both side walls 24 and 26 of the container body 22 (slot vertical dimension). : 6 mm (minimum)), or set to be slightly smaller. As described above, the height dimension H of the protruding portion 14 is 3.0 mm to 5.3 mm. However, if the height dimension H is shorter than 3.0 mm, the distance between the tip end portion of the protruding portion 14 and the protruding portion 32 increases. Thus, since the semiconductor wafer storage tray 10 can move in the vertical direction (in the direction of arrow A in FIGS. 4 and 5) in the slot 28, it cannot be positioned and is inappropriate. Further, when the height H of the protrusion 14 is larger than 5.3 mm, the distance between the protrusions 30 and 32 (slot vertical dimension: 6 mm) becomes larger, and the semiconductor wafer storage tray 10 is inserted into the slot 28. It becomes unsuitable because it cannot be inserted into.

  As described above, the dimensions of the semiconductor wafer storage tray 10 can be accommodated in the semiconductor wafer transport container 20 without any problem without changing the dimensions on the premise of the dimensions of the existing semiconductor wafer transport container 20, and the semiconductor wafer transport container 20 can be accommodated in the semiconductor wafer transport container 20. It is set so that positioning can be performed in the accommodated state. For this reason, the existing semiconductor wafer transport container 20 can be used as it is.

  Next, a semiconductor wafer transfer container (FOSB) that is a container in which the semiconductor wafer storage tray 10 is stored will be described. This FOSB is conventionally used in the form of accommodating a semiconductor wafer having a normal thickness as it is.

  As shown in FIGS. 4 and 5, the semiconductor wafer transport container 20 includes a box-shaped container body 22. An opening 34 is formed in the container body 22, and the semiconductor wafer storage tray 10 can be accommodated inside the opening 34, or the semiconductor wafer accommodation tray 10 accommodated therein can be taken out.

  A plurality of protrusions 30 and 32 are formed on both side walls 24 and 26 of the container body 22 at a predetermined interval along the height direction (the direction of arrow A in FIGS. 4 and 5). Each of the protrusions 30 and 32 is formed so as to extend in the depth direction of the container body 22 (the direction of arrow C in FIGS. 4 and 5). As described above, the slot 28 serving as a groove is formed between the protrusion 30 and the protrusion 32, and the semiconductor wafer storage tray 10 is inserted into each slot 28.

  Further, as shown in FIGS. 4 and 6, a front lid portion 36 is attached to the container body 22. By mounting the front lid portion 36, the opening 34 of the container body 22 is airtightly closed. As shown in FIG. 6, on the back side of the front lid portion 36 (the side that closes the opening 34 of the container body 22), either the protrusion 14 of the semiconductor wafer storage tray 10 or the outer peripheral edge of the tray body portion 12. A tray pressing member 38 for positioning one of them is detachably attached. As shown in FIG. 7, the tray pressing member 38 is formed with a tray pressing 40. As shown in FIG. 8, the tray retainer 40 is formed at a position corresponding to the slot 28 described above, and the semiconductor wafer inserted into the slot 28 when the front lid portion 36 is attached to the container body 22. Either one of the protrusion 14 of W or the outer peripheral edge of the tray main body 12 is configured to be pressed by the tray presser 40.

  When a normal-thickness semiconductor wafer (semiconductor wafer before thinning) is accommodated in the container body 22, a wafer pressing member (not shown) dedicated to the normal-thickness semiconductor wafer is attached to the front lid portion 36. Thus, the semiconductor wafer having the normal thickness inserted into the slot 28 can be positioned. Thus, since the tray pressing member 38 is detachably attached to the front lid portion 36, the tray pressing member 38 can be freely replaced with a member accommodated in the container body 22 or a pressing member suitable for the application. .

  Next, a method for accommodating (stacking) the thinned semiconductor wafers W in the semiconductor wafer accommodating tray 10 will be described.

  As shown in FIG. 3, first, the lowermost semiconductor wafer W is placed on the bottom surface 12 </ b> A of the tray body 12 of the semiconductor wafer storage tray 10. At this time, a part of the semiconductor wafer W comes into contact with the protruding inclined surface 14 </ b> A of the protruding portion 14 formed on the outer peripheral edge of the tray main body 12, and is guided to the bottom surface 12 </ b> A of the tray main body 12. When the lowermost semiconductor wafer W is placed on the tray body 12, the slip sheet P is placed on the upper surface of the semiconductor wafer W. This interleaving paper P is laid between the stacked semiconductor wafers W and prevents the upper and lower semiconductor wafers W from contacting each other. The interleaving paper P is made of a material (for example, dust-free paper or polyethylene) suitable for low dust generation and antistatic.

  Here, as shown in FIG. 2, since the inclination angle α from the vertical direction (straight line L) of the protrusion 14 toward the outside of the tray main body 12 is set to 5 degrees or more and 10 degrees or less, the semiconductor wafer W is It can be easily placed and stacked on the tray body 12. On the contrary, if the inclination angle α of the protrusion 14 is less than 5 degrees, a part of the semiconductor wafer W is caught by the protrusion 14 when the stored semiconductor wafer W is taken out from the semiconductor wafer storage tray 10, and the semiconductor wafer Since it becomes difficult to take out W, it is not suitable. If the inclination angle α of the protrusion 14 is larger than 10 degrees, when the semiconductor wafer W is stacked on the tray body 12, a part of the semiconductor wafer W is placed on the protrusion inclined surface 14A of the protrusion. It may end up. If the semiconductor wafers W are sequentially stacked in this state, there is a possibility that cracks or cracks may occur in the portion of the protrusion 14 of the semiconductor wafer W that is placed on the protruding inclined surface 14A.

  Thus, the semiconductor wafer W and the interleaf paper P are alternately stacked on the semiconductor wafer storage tray 10. At this time, when the lowermost semiconductor wafer W is placed on the tray main body 12, the air between the lowermost semiconductor wafer W and the tray main body 12 passes through the tray main body 12. It is pushed out from the gap 18 formed between the hole 16 and the protrusions 14 adjacent in the outer circumferential direction. As a result, air between the lowermost semiconductor wafer W and the tray main body 12 is eliminated, and the semiconductor wafer W is placed in contact with the tray main body 12. As a result, it is possible to prevent the semiconductor wafer W, which is the lowermost layer, from being wrinkled or trapped. Further, when the slip sheet P is laminated on the lowermost semiconductor wafer W, the through hole 16 formed in the tray body 12 is closed by the lowermost semiconductor wafer W. The air between the lower semiconductor wafer W is pushed out not through the through-holes 16 but from the gaps 18 formed between the protrusions 14 adjacent in the outer circumferential direction. For this reason, since air does not intervene between the interleaving paper P laminated on the upper surface of the lowermost semiconductor wafer W and the lowermost semiconductor wafer W, there are wrinkles, air pockets, etc. on the interposing paper P. It can be prevented from occurring. Note that another semiconductor wafer W is laminated on the upper surface of the interleaving paper P. Also in this case, the air between another semiconductor wafer W and the interleaving paper P is pushed out from the gap portion 18 formed between the protruding portions 14 adjacent in the outer peripheral direction. For this reason, since air does not intervene between the stacked semiconductor wafers W and the interleaving paper P, it is possible to prevent wrinkles or air pockets from being generated on the stacked semiconductor wafers W. Thereafter, in the same manner, each time the interleaving paper P or the semiconductor wafer W is stacked, the air between the interleaving paper P and the semiconductor wafer W is a gap formed between the protrusions 14 adjacent in the outer peripheral direction. Since the portion 18 is extruded to the outside, it is possible to prevent wrinkles and air pockets from being generated on the laminated slips P or the semiconductor wafer W. In particular, since air does not intervene between the semiconductor wafers W adjacent to each other in the vertical direction and the interleaving paper P, more semiconductor wafers W can be stacked on the semiconductor wafer storage tray 10.

  As shown in FIG. 3, a cover member 42 is placed on the upper surface of the semiconductor wafer W located at the uppermost layer. Thereby, it is possible to prevent the semiconductor wafer W from jumping out of the semiconductor wafer storage tray 10 due to an impact or the like while the semiconductor wafer storage tray 10 is being transported. The contact surface of the cover member 42 with the semiconductor wafer W is made of the same material as the interleaving paper P, and prevents contamination of the semiconductor wafer W and electrostatic breakdown of the semiconductor wafer W. An impact absorbing material (not shown) having a low dust generation and antistatic function is attached to the surface of the cover member 42 opposite to the contact surface with the semiconductor wafer W. The impact absorbing material is made of urethane resin or the like, and absorbs the impact force so that the impact force is not transmitted to the semiconductor wafer.

  Here, as shown in FIG. 2, since the height dimension H along the vertical direction (straight line L) of the protruding portion 14 is set to a maximum of 5.3 mm, the thickness of the thinned semiconductor wafer W and the interleaf paper P is reduced. If each dimension is 50 μm, the thickness dimension of the cover member 42 is subtracted, and a maximum of 250 to 350 thinned semiconductor wafers W can be accommodated in one semiconductor wafer accommodation tray 10. Since the semiconductor wafer storage tray 10 storing the thinned semiconductor wafers W for 250 to 350 sheets is stored in one slot 28, (250 to 350) sheets multiplied by the number of slots 28. The number of semiconductor wafers W can be transported by one semiconductor wafer transport container 20. Thus, by setting the height dimension H along the vertical direction (straight line L) of the projecting portion 14 to a maximum of 5.3 mm, the semiconductor wafer storage tray 10 can be stored as it is in the existing semiconductor wafer transport container 20. The slot 28 can be positioned in the vertical direction (in the direction of arrow A in FIGS. 4 and 5), and can accommodate a large amount of thinned semiconductor wafers W up to 250 to 350.

  Next, an effect when the semiconductor wafer storage tray 10 in which the thinned semiconductor wafer W is stored in the semiconductor wafer transfer container (FOSB) will be described.

  As shown in FIGS. 4 and 5, the semiconductor wafer storage tray 10 in which the thinned semiconductor wafer W is stored is accommodated in the container body 22 so as to be inserted into the slot 28 of the container body 22.

  Here, as shown in FIGS. 2 and 3, the diameter R of the tray body 12 of the semiconductor wafer storage tray 10 is set to be slightly smaller than the distance between the side walls 24 and 26 of the container body 22. ing. For this reason, when the semiconductor wafer storage tray 10 is inserted into the slot 28 of the container body 22, the separation distance between the protruding portion 14 of the semiconductor wafer storage tray 10 and the side walls 24 and 26 of the container body 22 is almost eliminated. The inserted semiconductor wafer storage tray 10 can hardly move along the left-right direction (the direction of arrow B in FIGS. 4 and 5), and is positioned inside the container body 22.

  Further, the height dimension of the projecting portion 14 is the distance between the projecting portions 30 and 32 adjacent to each other in the height direction of the projecting portions formed on the both side walls 24 and 26 of the container body 22 (slot vertical dimension: 6 mm). ), The movement in the vertical direction (in the direction of arrow A in FIGS. 4 and 5) in the slot 28 of the semiconductor wafer storage tray 10 can be restricted. As described above, the semiconductor wafer storage tray 10 is restricted from moving in the left-right direction (arrow B direction in FIGS. 4 and 5) and the vertical direction (arrow A direction in FIGS. 4 and 5) in the slot 28. The semiconductor wafer storage tray 10 can be transported in a state where the semiconductor wafer storage tray 10 is positioned.

  As shown in FIG. 4, the front lid portion 36 is airtightly attached to the container main body 22 in a state where the semiconductor wafer storage tray 10 is stored in the container main body 22. At this time, as shown in FIGS. 6 to 8, the outer peripheral edge of the tray main body 12 of the semiconductor wafer storage tray 10 is pressed by the tray pressing 40 of the tray pressing member 38 attached to the front lid 36. It has become. Thus, by attaching the front lid part 36 to the container body 22, the semiconductor wafer storage tray 10 is positioned in the depth direction of the container body 22 (front-rear direction, arrow C direction in FIGS. 4 and 5). .

  As shown in FIG. 4, in a state where the semiconductor wafer storage tray 10 is completely stored in the semiconductor wafer transfer container 20, the horizontal direction (the direction of arrow B in FIGS. 4 and 5) and the vertical direction (in FIGS. 4 and 5). It will be in the state positioned in the arrow A direction) and the front-back (depth) direction (arrow C direction in FIG.4 and FIG.5).

  In particular, the protrusion 14 has a positioning function for positioning the semiconductor wafer transport container 20 in the vertical direction while being accommodated in the semiconductor wafer transport container 20. As a result, the protrusion 14 has both functions of positioning the semiconductor wafer W with respect to the tray main body 12 and positioning the semiconductor wafer storage tray 10 with respect to the vertical direction of the semiconductor wafer transport container 20. . As a result, it is not necessary to separately provide a positioning member having a positioning function of the semiconductor wafer storage tray 10 with respect to the vertical direction of the semiconductor wafer transport container 20, so that the number of parts of the semiconductor wafer storage tray 10 can be reduced and manufactured. Cost can be reduced. The positioning member having the positioning function of the semiconductor wafer storage tray 10 with respect to the vertical direction of the semiconductor wafer transport container 20 does not need to be provided on the semiconductor wafer transport container 20 side, and the existing semiconductor wafer transport container 20 can be used as it is. it can.

  The existing semiconductor wafer transport container 20 is designed to withstand impacts such as dropping after undergoing various impact resistance tests stipulated in the SEMI standard, and in a state where the semiconductor wafer storage tray 10 is stored. Even when the semiconductor wafer transport container 20 is dropped, the semiconductor wafer W accommodated in the semiconductor wafer accommodating tray 10 can be prevented from being damaged.

  Moreover, since the existing semiconductor wafer transfer container 20 for storing the semiconductor wafer storage tray 10 is used as it is, a conventional load port (not shown) can be used as it is in a subsequent process. That is, the front lid portion 36 of the semiconductor wafer transport container 20 placed on the load port is removed from the container body 22 and the semiconductor wafer storage tray 10 is taken out by a robot (not shown). A tray stage (not shown) is placed on the taken-out semiconductor wafer storage tray 10, and the cover member 42, the semiconductor wafer W, and the interleaf paper P are identified and conveyed by a robot equipped with a non-contact hand or the like. Then, the cover member 42 and the interleaf paper P are conveyed to a dedicated accommodation position, and the semiconductor wafer W is conveyed to a processing apparatus or the like.

  As described above, according to the present embodiment, the semiconductor wafer W is accommodated in the semiconductor wafer accommodation tray 10 while being placed on the bottom surface 12A of the planar tray body 12, and the semiconductor wafer accommodation tray 10 is a semiconductor. Since the semiconductor wafer W is positioned in the wafer transfer container 20, the semiconductor wafer W is prevented from sagging (bending) or falling off inside the semiconductor wafer transfer container 20, and the semiconductor wafer W can be prevented from being damaged.

  In addition, since the existing semiconductor wafer transport container 20 can be used as it is, it is not necessary to newly manufacture the semiconductor wafer transport container 20 and the manufacturing cost does not occur. In addition, although the existing semiconductor wafer transfer container 20 is upsized, a space inside the semiconductor wafer transfer container 20 can be obtained by storing a plurality of semiconductor wafer storage trays 10 in which the semiconductor wafers W are stored in the semiconductor wafer transfer container 20. (Space) can be used effectively. As a result, the transfer efficiency of the semiconductor wafer W can be improved.

1 is a perspective view of a semiconductor wafer storage tray according to a first embodiment of the present invention. It is an enlarged view of the protrusion part of the semiconductor wafer accommodation tray which concerns on 1st Embodiment of this invention. FIG. 3 is a partially enlarged view of the semiconductor wafer storage tray according to the first embodiment of the present invention in which the semiconductor wafer is stacked and the semiconductor wafer storage tray is stored in the semiconductor wafer transfer container. It is a perspective view of the state where the semiconductor wafer accommodation tray concerning a 1st embodiment of the present invention was completely accommodated in the semiconductor wafer conveyance container. FIG. 3 is a perspective view of a state in which the semiconductor wafer storage tray according to the first embodiment of the present invention is stored in a container body constituting the semiconductor wafer transport container (a state in which a front lid portion is not attached to the container body). It is a perspective view of the front cover part which comprises the semiconductor wafer conveyance container in which the semiconductor wafer accommodation tray which concerns on 1st Embodiment of this invention is accommodated. It is a perspective view of the holding member for trays attached to the front lid part which constitutes the semiconductor wafer conveyance container in which the semiconductor wafer storage tray concerning a 1st embodiment of the present invention is stored. It is a perspective view in the state where the semiconductor wafer accommodation tray concerning a 1st embodiment of the present invention was supported by the tray pressing member attached to a front cover part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Semiconductor wafer accommodation tray 12 Tray main-body part 14 Protrusion part 16 Through-hole 18 Cavity part 20 Semiconductor wafer conveyance container (FOSB)
W Semiconductor wafer

Claims (5)

A semiconductor wafer storage tray that stores a semiconductor wafer and is stored in a semiconductor wafer transport container that transports the semiconductor wafer and is positioned inside the semiconductor wafer transport container,
A planar tray body on which the semiconductor wafer is placed;
A protruding portion that protrudes from an outer edge portion of the tray body portion and positions the semiconductor wafer placed on the tray body portion with respect to the tray body portion;
A semiconductor wafer storage tray, comprising:   2. The semiconductor wafer storage tray according to claim 1, wherein the protruding portion also has a positioning function of positioning with respect to the semiconductor wafer transport container in a state of being stored in the semiconductor wafer transport container.   The semiconductor wafer accommodation tray according to claim 1, wherein a through-hole penetrating in the thickness direction is formed in the tray main body portion.   The said protrusion part forms the space | gap part between the said protrusion parts adjacent along the outer edge of the said tray main-body part, and is provided in any one of Claim 1 thru | or 3 characterized by the above-mentioned. Semiconductor wafer storage tray.   5. The semiconductor wafer according to claim 1, wherein an inclination angle from a vertical direction of the protruding portion toward an outside of the tray main body portion is set to 5 degrees or more and 10 degrees or less. Containment tray.

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