WO2012036206A1 - Wafer storing device, and wafer cassette storage case - Google Patents

Wafer storing device, and wafer cassette storage case Download PDF

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Publication number
WO2012036206A1
WO2012036206A1 PCT/JP2011/070992 JP2011070992W WO2012036206A1 WO 2012036206 A1 WO2012036206 A1 WO 2012036206A1 JP 2011070992 W JP2011070992 W JP 2011070992W WO 2012036206 A1 WO2012036206 A1 WO 2012036206A1
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WO
WIPO (PCT)
Prior art keywords
wafer
wafer cassette
storage
storage case
cassette
Prior art date
Application number
PCT/JP2011/070992
Other languages
French (fr)
Japanese (ja)
Inventor
和久 轟
好友 荻村
渡辺　英二
爲則　啓
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP2012534036A priority Critical patent/JP5641050B2/en
Priority to CN201180038872.1A priority patent/CN103069558B/en
Publication of WO2012036206A1 publication Critical patent/WO2012036206A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the present invention relates to a wafer storage tool used for storing a wafer and a storage case of a wafer cassette for storing a wafer.
  • a storage tool for storing a wafer may be used when a wafer is transported between manufacturing apparatuses or when a wafer processed by the manufacturing apparatus is stored.
  • a carrier in which a carrier for storing a wafer is provided on a carrier table and the carrier is covered with a cover, and a carrier in which the wafer is tilted and stored by tilting the carrier are known.
  • the wafer storage tool there is a possibility that the wafer may jump out of the storage unit storing the wafer, or the storage unit and the wafer may rub and generate dust from the wafer during the transfer. Inclining and storing the wafer can exhibit a certain effect in suppressing such protrusion and dust generation of the wafer.
  • the shape of the storage tool such as the tilt angle of the wafer during storage, it may not be possible to sufficiently suppress the protrusion and dust generation of the wafer.
  • the apparatus includes a wafer cassette including a storage unit that stores a wafer, and a storage case that stores the wafer cassette.
  • a wafer container provided with a support portion for supporting the wafer cassette so as to be inclined at an angle of 37 ° to 45 ° with respect to the bottom.
  • a wafer cassette storage case for storing a wafer and storing a wafer cassette having a bottom surface and a side surface perpendicular to the bottom surface
  • the wafer cassette is tilted and supported.
  • a wafer cassette storage case is provided.
  • the wafer storage device of the present invention it is possible to effectively suppress the protrusion of the wafer from the storage unit and the generation of dust from the wafer stored in the storage unit. Further, according to the storage case of the wafer cassette according to the present invention, it is possible to effectively suppress the protrusion of the wafer from the wafer cassette and the generation of dust from the wafer stored in the wafer cassette.
  • FIG. 1 is an explanatory view of a wafer container.
  • FIG. 1A is a diagram schematically showing an example of an opened wafer container
  • FIG. 1B is a diagram schematically showing an example of a closed wafer container.
  • the 1 includes a wafer cassette 100 in which a wafer such as silicon is stored, and a storage case 200 in which the wafer cassette 100 is stored.
  • the wafer cassette 100 is stored in the storage case 200 in an inclined posture.
  • a state in which two wafer cassettes 100 are stored in the storage case 200 is illustrated.
  • the storage case 200 has a box part 210 and a lid part 220 that can be freely opened and closed (in the arrow direction in FIG. 1A) on the box part 210.
  • the storage case 200 is provided with a connecting portion 230 for connecting the box portion 210 and the lid portion 220 that are closed to maintain the closed state.
  • the wafer cassette 100 and the storage case 200 of the wafer storage tool 1 will be described in more detail.
  • a wafer to be stored a wafer that has been thinned by back surface grinding (back grinding) and has a so-called knife edge will be described.
  • FIG. 2 is an explanatory diagram of the wafer cassette.
  • FIG. 2A is a schematic external view of an example of the wafer cassette
  • FIG. 2B is a schematic cross-sectional view when the cross section along the dashed line L1 in FIG. (C) is a cross-sectional schematic diagram when the cross section along the dashed-two dotted line L2 of (A) is seen in ay direction.
  • the wafer cassette 100 illustrated in FIG. 2 is provided with a storage unit 110 that stores the wafer W.
  • the wafer cassette 100 is provided with a plurality of such storage units 110, and the wafers W can be stored in the storage units 110, respectively.
  • the plurality of storage units 110 are provided in parallel with the bottom surface 131 of the wafer cassette 100, so that when the wafers W are stored in the storage units 110, the wafers W are stored in parallel in the wafer cassette 100. It has become. Note that FIG. 2 shows only one wafer W stored in one storage unit 110 for convenience.
  • the storage unit 110 includes an insertion port 111 into which the wafer W is inserted in the z direction, and a mounting unit 112 on which the inserted wafer W is mounted. have.
  • a pair of mounting units 112 are provided for each storage unit 110 so as to protrude inside the housing unit 120 of the wafer cassette 100, and the wafer W is supported by the mounting unit 112 at the edge thereof. It is mounted with.
  • the storage portion 110 is provided with a contact portion 113 that is curved toward the inside of the housing portion 120 on the back side in the insertion direction of the wafer W. Yes.
  • the wafer W inserted in the z direction from the insertion port 111 and placed on the placement unit 112 is brought into contact with the contact portion 113 at the leading end in the insertion direction due to subsequent vibration or inclination of the wafer cassette 100. When it does, it will not move to the back side (back 132 side) any more.
  • the storage of the wafer W in the storage unit 110 and the removal of the stored wafer W from the storage unit 110 are both performed from the insertion port 111.
  • the storage of the wafer W inserted from the insertion port 111 and placed on the mounting unit 112 and the removal of the stored wafer W from the insertion port 111 are performed by, for example, a transfer arm included in the semiconductor manufacturing apparatus.
  • the number of storage units 110 of the wafer cassette 100 can be arbitrarily set.
  • the width w and height h of each storage unit 110 are set based on the size (diameter and thickness) of the wafer W to be stored. For example, the width w and the height h are set such that the wafer W and the storage unit 110 do not collide when stored (inserted or placed) by the transfer arm as described above or taken out from the storage unit 110. Is done.
  • the wafer W is often warped during the manufacturing process of the semiconductor device using the thinned wafer W.
  • the width w and height h of the storage unit 110 in consideration of the occurrence of such warpage of the wafer W, and further the protrusion amount p of the mounting unit 112 may be set.
  • the wafer cassette 100 having the above configuration can be formed of a metal such as aluminum or an aluminum alloy.
  • the wafer cassette 100 having the above-described structure can be formed by grinding or casting such a metal.
  • the inner surface of the storage unit 110 of the wafer cassette 100 is formed using a material harder than the wafer W to be stored, for example.
  • the inner surface of the storage unit 110 is scraped by contact with the wafer W as the wafer cassette 100 is used. It is possible that a deviation occurs in the contact position. In addition, the scraped material may adhere to the wafer W.
  • the edge of the stored wafer W may bite into the inner surface of such a soft storage unit 110.
  • the transfer arm temporarily lifts the wafer W of the mounting unit 112 and then pulls out the wafer W from the insertion port 111.
  • the wafer W is caught by the bite and is damaged during the lifting operation of the wafer W.
  • the wafer cassette 100 is formed using a material that is harder than a soft material such as a resin and has a hardness that prevents the knife-edge wafer W from being pierced. Further, a material that can be easily processed for the wafer cassette 100 may be selected. For example, an aluminum material is suitable. Furthermore, hardness can also be improved by anodizing the surface.
  • FIG. 3 is an explanatory diagram of the storage case.
  • 3A is a schematic external view of an example of an open storage case
  • FIG. 3B is a schematic external view of an example of a closed storage case
  • FIG. 3C is a point of (B). It is a schematic diagram of the cross section along chain line L3.
  • the storage case 200 includes the box part 210, the lid part 220, and the connecting part 230.
  • the box part 210 is, for example, a box-shaped container having a bottom part 211, a side wall part 212, and an opening 213 opened upward.
  • the lid part 220 is a member that opens and closes the opening 213 of the box part 210, and here, a box-like member is illustrated.
  • one end of the lid portion 220 is pivotally supported on the side wall portion 212 of the box portion 210, and the lid portion 220 is rotated in one direction (the arrow direction in FIG. 3A), thereby opening and closing the box portion 210.
  • the entire lid portion 220 may be attached to and detached from the opening 213 side of the box portion 210, and the box portion 210 may be opened and closed by the attachment and detachment of the lid portion 220.
  • a closed space is formed between the box part 210 and the lid part 220 by closing the lid part 220.
  • connection part 230 is provided with the mechanism for connecting the cover part 220 and the box part 210 closed with the cover part 220, and maintaining a closed state like FIG. 3 (B).
  • the storage case 200 includes first and second surfaces 214a inclined at predetermined angles ⁇ a and ⁇ b, respectively, with respect to the bottom portion 211 of the box portion 210. , 214b are provided. These first and second surfaces 214a and 214b are inclined in a V shape obliquely upward at angles ⁇ a and ⁇ b from the boundary line 214c, respectively.
  • the support part 214 is thus provided in the box part 210 with the first and second surfaces 214a and 214b facing the opening 213 side.
  • the box part 210 is provided with at least one such support part 214.
  • 3A and 3B illustrate a case where two such support portions 214 are provided side by side.
  • the storage case 200 can be formed by a method such as injection molding using a resin material, for example.
  • the wafer cassette 100 is stored in the storage case 200 having such a configuration.
  • one wafer cassette 100 is placed on each of the two support portions 214 arranged in parallel.
  • FIG. 4 is a view showing an example of a state in which the wafer cassette is stored in the storage case.
  • FIG. 4A shows a state where the lid of the storage case is open
  • FIG. 4B shows a state where the lid of the storage case is closed.
  • the wafer cassette 100 When the wafer cassette 100 is stored in the storage case 200, the wafer cassette 100 is supported by the storage case 200 provided with first and second surfaces 214a and 214b in a V shape as shown in FIG. Placed on the unit 214.
  • the wafer cassette 100 is placed on the support 214 so that the insertion port 111 through which the wafer W is taken in and out faces obliquely upward (opening 213 side). That is, the wafer cassette 100 is placed on the support portion 214 so that the bottom surface 131 and the back surface 132 of the wafer cassette 100 face the V-shaped first and second surfaces 214 a and 214 b of the support portion 214. . Wafer cassette 100 is mounted on support 214 with its bottom 131 and back 132 supported by first and second surfaces 214a and 214b.
  • the first and second surfaces 214a and 214b of the support portion 214 are arranged such that when the wafer cassette 100 is placed in this manner, the bottom surface 131 and the back surface 132 of the wafer cassette 100 are the first and second surfaces 214a and 214b.
  • the angles ⁇ a and ⁇ b are set in advance so as to come into contact with 214b.
  • the relationship of the following equation (1) is established between the angle ⁇ w formed by the bottom surface 131 and the back surface 132 of the wafer cassette 100 and the angles ⁇ a and ⁇ b of the first and second surfaces 214a and 214b.
  • the bottom surface 131 of the wafer cassette 100 is the first of the support portion 214.
  • the case where it contacts with the surface 214a is taken as an example.
  • the storage unit 110 provided in parallel to the bottom surface 131 of the wafer cassette 100 is inclined at the same angle ⁇ a as that of the first surface 214a with the insertion port 111 directed obliquely upward.
  • the box part 210 is covered with the cover part 220 as shown in FIG. 4 (B).
  • the wafer cassette 100 is stored in the space between the box part 210 and the lid part 220 of the storage case 200.
  • the wafer W in the wafer cassette 100 is stored in the storage case 200. Can be protected from the external environment.
  • the wafer storage tool 1 in which the wafer cassette 100 is stored in the storage case 200 can be used for transporting the wafer W or used for storing the wafer W.
  • the wafer storage unit 110 is tilted so that the insertion slot 111 faces obliquely upward, and the wafer cassette 100 is placed on the support unit 214. Even if a tilt occurs, the protrusion of the wafer W from the insertion port 111 is suppressed. Furthermore, by adjusting the inclination angle of the storage unit 110 (the angle ⁇ a of the first surface 214a), dust generation from the wafer W can be effectively suppressed.
  • the inclination angle of the storage unit 110 of the wafer cassette 100 will be described.
  • the wafer cassette 100 in which the storage unit 110 storing the wafer W is inclined at a predetermined angle is conveyed by a carriage.
  • the number of dust generated from the wafer W at that time was measured.
  • Such conveyance and measurement of the number of dust generations were performed by changing the inclination angle of the storage unit 110.
  • the conditions excluding the inclination angle of the storage unit 110 (the carriage to be used, the transfer method using the carriage (transfer speed, transfer path, etc.), the storage position of the wafer W in the wafer cassette 100, etc.) are the same.
  • FIG. 5 is a diagram illustrating an example of the relationship between the storage unit inclination angle and the number of dust generation.
  • FIG. 5 shows the number of dust generated from the wafer W when the inclination angle of the storage unit 110 of the wafer cassette 100 is 0 °, 45 °, and 90 °.
  • the inclination angle of 0 ° is when the storage unit 110 is set in the horizontal direction (when the insertion slot 111 is set sideways)
  • the inclination angle of 90 ° is when the storage unit 110 is set in the vertical direction. This is the case (when the insertion slot 111 is directed vertically upward).
  • the inclination angle of 45 ° is when the storage section 110 is inclined by 45 ° with respect to the horizontal direction (when the insertion port 111 is inclined upward by 45 ° with respect to the horizontal direction).
  • the wafer W is stored in the storage unit 110 so that its main surface is parallel to the horizontal direction.
  • the wafer W has few opportunities to collide with the inner surface of the storage unit 110, for example, the contact portion 113, and the force is weak even if it collides.
  • the number of dust generated from the wafer W can be reduced.
  • the wafer W is likely to jump out from the insertion port 111, so that the possibility that the wafer W jumps out of the storage unit 110 and is damaged increases.
  • the wafer W has a main surface parallel to the vertical direction and the edge (lower end) is in contact with the contact unit 113 by its own weight. Thus, it is stored in the storage unit 110. Therefore, it is possible to prevent the wafer W from jumping out of the storage unit 110 as when the inclination angle is 0 °.
  • the inclination angle of the storage unit 110 is set to 90 ° in this way, when the wafer cassette 100 vibrates, the wafer W moves up and down along with the vibration, and the edge collides with the contact part 113 of the storage unit 110. It is easy to happen. If the vibration of the wafer cassette 100 is large, the edge of the wafer W will strongly collide with the contact portion 113 accordingly. Further, since the size of the storage unit 110 is larger than the size of the wafer W, the wafer W easily moves in the lateral direction (parallel to the main surface or perpendicular to the main surface) when the wafer cassette 100 vibrates. There may be a case where the wafer W collides with the contact portion 113 and a strong impact is locally applied to the wafer W.
  • the edge of the wafer W is worn out or damaged, and dust generation occurs.
  • the inner surface of the storage unit 110 is formed of a material harder than the wafer W, such dust generation is more likely to occur.
  • the inclination angle of the storage unit 110 when the inclination angle of the storage unit 110 is 90 °, the number of dust generated from the wafer W increases as shown in FIG. On the other hand, when the inclination angle of the storage unit 110 is 45 °, the wafer W is stored in the storage unit 110 with its main surface inclined at an angle of 45 ° or close to 45 ° with respect to the horizontal direction.
  • FIG. 6 is a diagram schematically showing an example of a storage state of a wafer stored in a storage unit having an inclination angle of 45 °.
  • FIG. 6 schematically illustrates a cross-section at the contact portion position of the storage portion, and corresponds to the position of the L4-L4 cross section in FIG.
  • the edge (lower end) of the wafer W comes into contact with the contact part 113 due to its own weight, and the edge is supported by the contact part 113. Further, since the wafer W also abuts on the mounting portion 112 side by its own weight, at least a part of the back surface is supported by the mounting portion 112.
  • the wafer W Since the wafer W is supported in this manner in the storage unit 110, even if the wafer cassette 100 vibrates, the wafer W is less likely to move in the storage unit 110 than when the inclination angle of the storage unit 110 is 90 °. . Therefore, the chance of collision between the inner surface of the storage unit 110 and the wafer W is reduced, and dust generation can be suppressed. Furthermore, the edge of the wafer W (the tip of the knife edge) is also likely to come into contact with the curved surface 114 where the inner surface of the housing unit 120 and the surface of the mounting unit 112 in the storage unit 110 are continuous perpendicularly. Dust is suppressed.
  • FIG. 7 is a diagram showing another example of the relationship between the storage portion inclination angle and the number of dust generation.
  • the same investigation as described above with reference to FIG. 5 is performed with the inclination angles of the storage unit 110 of the wafer cassette 100 set to 10 °, 20 °, 30 °, 37 °, and 45 °. The results of the tilt angle are shown.
  • dust generation can be suppressed with good reproducibility by setting the inclination angle of the storage unit 110 to 45 °.
  • the inclination angle of the storage unit 110 is 37 °, dust generation is suppressed with good reproducibility.
  • the inclination angle of the storage unit 110 is set to 10 °, 20 °, and 30 °, the number of dust generation is greatly increased, and dust generation cannot be suppressed.
  • the number of dust generation can be suppressed to a certain level or less with good reproducibility, as in the case where the inclination angle is 37 ° or 45 °.
  • the inclination angle of the storage unit 110 can be set to 37 ° to 45 °, and preferably 45 ° that can effectively suppress dust generation with good reproducibility. Set.
  • the angle ⁇ a of the first surface 214 a inclines the storage unit 110 so that the bottom surface 131 of the wafer cassette 100 is brought into contact with the first surface 214 a of the support unit 214.
  • the angle is set to 37 ° to 45 °.
  • the angle ⁇ b of the second surface 214b with which the back surface 132 of the wafer cassette 100 comes into contact depends on the angle ⁇ w (usually 90 °) between the bottom surface 131 and the back surface 132 of the wafer cassette 100 according to the above equation (1). Is set.
  • the storage case 200 provided with the support portion 214 having the first and second surfaces 214a and 214b having such angles ⁇ a and ⁇ b is formed.
  • the storage case 200 is provided with the support portion 214 having the first surface 214a having the angle ⁇ a of 37 ° to 45 ° and the second surface 214b having the angle ⁇ b determined based on the angle ⁇ a. Keep it. Accordingly, when the wafer cassette 100 is placed on the support portion 214 of the storage case 200 so that the bottom surface 131 is in contact with the first surface 214a and the back surface 132 is in contact with the second surface 214b, the storage is performed. A state in which the portion 110 is inclined at an angle ⁇ a of 37 ° to 45 ° is obtained. As a result, the protrusion of the wafer W from the storage unit 110 and the generation of dust from the wafer W can be effectively suppressed as described above.
  • any storage unit 110 when the storage unit 110 is inclined at an angle ⁇ a of 37 ° to 45 ° in this way, in any storage unit 110, the wafer W slides to the back side of the storage unit 110 due to its own weight. The edge comes into contact with the contact portion 113. That is, any wafer W is stored in the wafer storage tool 1 in a state of being in contact with the contact portion 113.
  • the transfer arm may not be able to hold the wafer or may cause a collision between the wafer and the wafer cassette or the manufacturing apparatus.
  • the wafer cassette 100 is transported with its storage unit 110 oriented in the horizontal direction or inclined at an angle close to the horizontal direction, the position of the wafer W in each storage unit 110 is different. This is likely to occur, and there is a possibility that problems such as those described above during conveyance by the conveyance arm may occur.
  • the wafer storage tool 1 as described above when the wafer cassette 100 is stored in the storage case 200, the wafer cassette 100 is in a state where a plurality of wafers W are in contact with the contact portion 113. Can be stored in the storage portion 110 of the storage device. For this reason, since all the wafers W are placed at the same position in the storage unit 110, when the wafer W is taken out from the wafer cassette 100 taken out from the storage case 200 by the transfer arm, the above-described troubles at the time of transfer. Can be effectively suppressed.
  • the wafer cassette 100 is stored in the storage case 200 with the bottom surface 131 in contact with the first surface 214a and the back surface 132 in contact with the second surface 214b. did.
  • the wafer cassette 100 can be stored in the storage case 200 with the bottom surface 131 in contact with the second surface 214b and the back surface 132 in contact with the first surface 214a.
  • the angle ⁇ b of the second surface 214b is set to an angle of 37 ° to 45 ° for inclining the storage unit 110, and the angle ⁇ a of the first surface 214a is set using Equation (1). You can do it.
  • first and second surfaces 214a and 214b having the angles ⁇ a and ⁇ b are provided on the support portion 214 that supports the wafer cassette 100 has been described as an example. It is not limited to.
  • FIG. 8 is an explanatory view of a modified example of the storage case.
  • FIG. 8A is a diagram illustrating a first modification of the storage case
  • FIG. 8B is a diagram illustrating a second modification of the storage case.
  • a storage case 200 ⁇ / b> A shown in FIG. 8A is provided with a plurality of linear convex portions 215 arranged in parallel on the wafer cassette 100 mounting surface side of each support portion 214.
  • Each convex part 215 is provided along the 1st, 2nd surface 214a, 214b of the support part 214, and the height from the 1st, 2nd surface 214a, 214b to an upper end is made constant.
  • the upper end 215 a of the convex portion 215 on the first surface 214 a is inclined at an angle ⁇ a with respect to the bottom portion 211
  • the upper end 215 b of the convex portion 215 on the second surface 214 b is relative to the bottom portion 211. It is inclined at an angle ⁇ b.
  • the wafer cassette 100 is placed on the support part 214 provided with such a convex part 215 so that the insertion port 111 of the storage part 110 faces obliquely upward.
  • the wafer cassette 100 to be placed is supported by the upper ends 215a and 215b of the plurality of (here, two) convex portions 215. That is, the wafer cassette 100 is supported by the linear convex portions 215 in contact with the plurality of linear convex portions 215 and inclined at a predetermined angle.
  • the storage case 200B shown in FIG. 8B is provided with a plurality of dot-like convex portions 216 on the wafer cassette 100 mounting surface side of each support portion 214.
  • the height from the first and second surfaces 214a and 214b to the upper end of each convex portion 216 is constant. That is, a plane formed by connecting the upper ends of the plurality of convex portions 216 on the first surface 214a is a plane inclined at an angle ⁇ a with respect to the bottom portion 211, and the upper ends of the plurality of convex portions 216 on the second surface 214b.
  • a plane formed by connecting the two is a plane inclined at an angle ⁇ b with respect to the bottom portion 211.
  • the wafer cassette 100 is placed on the support part 214 provided with such a convex part 216 so that the insertion port 111 of the storage part 110 faces obliquely upward.
  • the wafer cassette 100 to be placed is supported by the upper ends of a plurality (here, four per surface) of the convex portions 216. That is, the wafer cassette 100 is supported by the point-like convex portions 216 in contact with the plurality of point-like convex portions 216 and inclined at a predetermined angle.
  • the wafer storage portion of the wafer cassette is inclined at a predetermined angle. As a result, the jumping out of the wafer from the storage portion of the wafer cassette and the generation of dust from the stored wafer are effectively suppressed.

Abstract

Provided is a wafer storing device capable of ejecting a stored wafer, and reducing particle emissions from the wafer. A wafer storing device (1) includes a wafer cassette (100) comprising a storage portion (110) in which a wafer (W) is stored, and a storage case (200) in which the wafer cassette (100) is stored. The storage case (200) comprises a supporting portion (214) that supports the wafer cassette (100) such that the storage portion (110) of the wafer cassette (100) is tilted at an angle (θa) of 37° to 45° with respect to the bottom of the storage case (200).

Description

ウェハ収納具、及びウェハカセットの収納ケースWafer holder and wafer cassette storage case
　本発明は、ウェハの収納に用いるウェハ収納具、及びウェハを収納するウェハカセットの収納ケースに関する。 The present invention relates to a wafer storage tool used for storing a wafer and a storage case of a wafer cassette for storing a wafer.
　半導体製造分野では、ウェハを製造装置間で搬送したり、製造装置による処理後のウェハを保管したりする際に、ウェハを収納する収納具が用いられる場合がある。例えば、ウェハを収納するキャリアをキャリア台上に設け、そのキャリアをカバーで覆うようにしたものや、キャリアを傾斜させることによってウェハを傾斜させて収納するようにしたもの等が知られている。 In the semiconductor manufacturing field, a storage tool for storing a wafer may be used when a wafer is transported between manufacturing apparatuses or when a wafer processed by the manufacturing apparatus is stored. For example, a carrier in which a carrier for storing a wafer is provided on a carrier table and the carrier is covered with a cover, and a carrier in which the wafer is tilted and stored by tilting the carrier are known.
特開平１１－１５４７００号公報JP 11-154700 A
　ウェハの収納具では、その搬送時に、ウェハを収納している収納部からウェハが飛び出したり、収納部とウェハとが擦れてウェハから発塵したりする可能性があった。ウェハを傾斜させて収納することは、このようなウェハの飛び出しや発塵を抑えるのに一定の効果を示し得る。しかし、収納時のウェハの傾斜角度等、その収納具の形態によっては、ウェハの飛び出しや発塵を十分に抑えられない場合があった。 In the wafer storage tool, there is a possibility that the wafer may jump out of the storage unit storing the wafer, or the storage unit and the wafer may rub and generate dust from the wafer during the transfer. Inclining and storing the wafer can exhibit a certain effect in suppressing such protrusion and dust generation of the wafer. However, depending on the shape of the storage tool, such as the tilt angle of the wafer during storage, it may not be possible to sufficiently suppress the protrusion and dust generation of the wafer.
　本発明の一観点によれば、ウェハが収納される収納部を備えたウェハカセットと、前記ウェハカセットが収納される収納ケースと、を含み、前記収納ケースは、前記収納部が前記収納ケースの底に対して３７°乃至４５°の角度で傾斜するように前記ウェハカセットを支持する支持部を備えるウェハ収納具が提供される。 According to an aspect of the present invention, the apparatus includes a wafer cassette including a storage unit that stores a wafer, and a storage case that stores the wafer cassette. There is provided a wafer container provided with a support portion for supporting the wafer cassette so as to be inclined at an angle of 37 ° to 45 ° with respect to the bottom.
　また、本発明の一観点によれば、ウェハを収納し底面と当該底面に垂直な側面とを有するウェハカセットを収納する、ウェハカセットの収納ケースにおいて、前記ウェハカセットを傾斜させて支持する第１の支持部と、前記第１の支持部に直交する第２の支持部とを有し、前記第１の支持部が、収納ケースの底面に対して３７°乃至４５°の角度で傾斜しているウェハカセットの収納ケースが提供される。 According to another aspect of the present invention, in a wafer cassette storage case for storing a wafer and storing a wafer cassette having a bottom surface and a side surface perpendicular to the bottom surface, the wafer cassette is tilted and supported. And a second support portion orthogonal to the first support portion, the first support portion being inclined at an angle of 37 ° to 45 ° with respect to the bottom surface of the storage case. A wafer cassette storage case is provided.
　本発明に係るウェハ収納具によれば、収納部からのウェハの飛び出し、収納部に収納されたウェハからの発塵を、効果的に抑制することが可能になる。
　また、本発明に係るウェハカセットの収納ケースによれば、ウェハカセットからのウェハの飛び出し、ウェハカセットに収納されたウェハからの発塵を、効果的に抑制することが可能になる。 According to the wafer storage device of the present invention, it is possible to effectively suppress the protrusion of the wafer from the storage unit and the generation of dust from the wafer stored in the storage unit.
Further, according to the storage case of the wafer cassette according to the present invention, it is possible to effectively suppress the protrusion of the wafer from the wafer cassette and the generation of dust from the wafer stored in the wafer cassette.
　本発明の上記および他の目的、特徴および利点は本発明の例として好ましい実施の形態を表す添付の図面と関連した以下の説明により明らかになるであろう。 The above and other objects, features and advantages of the present invention will become apparent from the following description in conjunction with the accompanying drawings which illustrate preferred embodiments as examples of the present invention.
ウェハ収納具の説明図である。It is explanatory drawing of a wafer storage tool. ウェハカセットの説明図である。It is explanatory drawing of a wafer cassette. 収納ケースの説明図である。It is explanatory drawing of a storage case. 収納ケースにウェハカセットを収納した状態の一例を示す図である。It is a figure which shows an example of the state which accommodated the wafer cassette in the storage case. 収納部傾斜角度と発塵数との関係の一例を示す図である。It is a figure which shows an example of the relationship between a storage part inclination angle and the number of dust generation. 傾斜角度４５°の収納部に収納されたウェハの収納状態の一例を模式的に示す図である。It is a figure which shows typically an example of the accommodation state of the wafer accommodated in the accommodating part of 45 degrees of inclination angles. 収納部傾斜角度と発塵数との関係の別例を示す図である。It is a figure which shows another example of the relationship between a storage part inclination angle and the number of dust generation. 収納ケースの変形例の説明図である。It is explanatory drawing of the modification of a storage case.
　図１はウェハ収納具の説明図である。ここで、図１（Ａ）は開状態のウェハ収納具の一例を模式的に示す図、図１（Ｂ）は閉状態のウェハ収納具の一例を模式的に示す図である。 FIG. 1 is an explanatory view of a wafer container. Here, FIG. 1A is a diagram schematically showing an example of an opened wafer container, and FIG. 1B is a diagram schematically showing an example of a closed wafer container.
　図１に例示するウェハ収納具１は、シリコン等のウェハが収納されるウェハカセット１００と、そのウェハカセット１００が収納される収納ケース２００とを有している。ウェハカセット１００は、傾けた姿勢で収納ケース２００に収納されるようになっている。ここでは、収納ケース２００に、２つのウェハカセット１００が収納されている状態を例示している。 1 includes a wafer cassette 100 in which a wafer such as silicon is stored, and a storage case 200 in which the wafer cassette 100 is stored. The wafer cassette 100 is stored in the storage case 200 in an inclined posture. Here, a state in which two wafer cassettes 100 are stored in the storage case 200 is illustrated.
　収納ケース２００は、箱部２１０と、その箱部２１０に開閉（図１（Ａ）の矢印方向）自在に設けられた蓋部２２０とを有している。収納ケース２００には、閉状態とされた箱部２１０と蓋部２２０とを連結して閉状態を維持するための連結部２３０が設けられている。 The storage case 200 has a box part 210 and a lid part 220 that can be freely opened and closed (in the arrow direction in FIG. 1A) on the box part 210. The storage case 200 is provided with a connecting portion 230 for connecting the box portion 210 and the lid portion 220 that are closed to maintain the closed state.
　以下、このようなウェハ収納具１のウェハカセット１００及び収納ケース２００について、より詳細に説明する。尚、ここでは、収納するウェハとして、裏面研削（バックグラインド）により薄型化され、エッジがいわゆるナイフエッジとされたウェハを例にして説明する。 Hereinafter, the wafer cassette 100 and the storage case 200 of the wafer storage tool 1 will be described in more detail. Here, as an example of a wafer to be stored, a wafer that has been thinned by back surface grinding (back grinding) and has a so-called knife edge will be described.
　まず、収納ケース２００に収納されるウェハカセット１００について説明する。
　図２はウェハカセットの説明図である。ここで、図２（Ａ）はウェハカセットの一例の外観模式図、図２（Ｂ）は（Ａ）の一点鎖線Ｌ１に沿った断面をｘ方向に見たときの断面模式図、図２（Ｃ）は（Ａ）の二点鎖線Ｌ２に沿った断面をｙ方向に見たときの断面模式図である。 First, the wafer cassette 100 stored in the storage case 200 will be described.
FIG. 2 is an explanatory diagram of the wafer cassette. Here, FIG. 2A is a schematic external view of an example of the wafer cassette, FIG. 2B is a schematic cross-sectional view when the cross section along the dashed line L1 in FIG. (C) is a cross-sectional schematic diagram when the cross section along the dashed-two dotted line L2 of (A) is seen in ay direction.
　図２に例示するウェハカセット１００には、ウェハＷを収納する収納部１１０が設けられている。ウェハカセット１００には、このような収納部１１０が複数設けられており、各収納部１１０にそれぞれ、ウェハＷを収納することができるようになっている。複数の収納部１１０は、ウェハカセット１００の底面１３１と平行に設けられ、各収納部１１０にそれぞれウェハＷが収納されたときには、それらのウェハＷがウェハカセット１００内に平行に収納されるようになっている。尚、図２には、便宜上、一の収納部１１０に収納された１枚のウェハＷのみを図示している。 The wafer cassette 100 illustrated in FIG. 2 is provided with a storage unit 110 that stores the wafer W. The wafer cassette 100 is provided with a plurality of such storage units 110, and the wafers W can be stored in the storage units 110, respectively. The plurality of storage units 110 are provided in parallel with the bottom surface 131 of the wafer cassette 100, so that when the wafers W are stored in the storage units 110, the wafers W are stored in parallel in the wafer cassette 100. It has become. Note that FIG. 2 shows only one wafer W stored in one storage unit 110 for convenience.
　収納部１１０は、図２（Ａ）～（Ｃ）に示すように、ウェハＷがｚ方向に向かって挿入される挿入口１１１と、挿入されたウェハＷが載置される載置部１１２とを有している。載置部１１２は、ウェハカセット１００の筐体部１２０の内側に突出するように、各収納部１１０につき一対設けられており、ウェハＷは、その縁部を載置部１１２に支持された状態で載置される。 As shown in FIGS. 2A to 2C, the storage unit 110 includes an insertion port 111 into which the wafer W is inserted in the z direction, and a mounting unit 112 on which the inserted wafer W is mounted. have. A pair of mounting units 112 are provided for each storage unit 110 so as to protrude inside the housing unit 120 of the wafer cassette 100, and the wafer W is supported by the mounting unit 112 at the edge thereof. It is mounted with.
　また、収納部１１０には、図２（Ｂ），（Ｃ）に示すように、ウェハＷの挿入方向奥側に、筐体部１２０の内側に向かって湾曲した当接部１１３が設けられている。挿入口１１１からｚ方向に向かって挿入され、載置部１１２に載置されたウェハＷは、その後のウェハカセット１００の振動や傾斜により、その挿入方向の先端部が当接部１１３に当接したときは、それ以上奥側（背面１３２側）に移動しないようになっている。 Further, as shown in FIGS. 2B and 2C, the storage portion 110 is provided with a contact portion 113 that is curved toward the inside of the housing portion 120 on the back side in the insertion direction of the wafer W. Yes. The wafer W inserted in the z direction from the insertion port 111 and placed on the placement unit 112 is brought into contact with the contact portion 113 at the leading end in the insertion direction due to subsequent vibration or inclination of the wafer cassette 100. When it does, it will not move to the back side (back 132 side) any more.
　即ち、このウェハカセット１００は、収納部１１０へのウェハＷの収納、及び収納されたウェハＷの収納部１１０からの取り出しが、いずれも挿入口１１１から行われるようになっている。尚、挿入口１１１から挿入して載置部１１２に載置するウェハＷの収納、及び収納されたウェハＷの挿入口１１１からの取り出しは、例えば、半導体製造装置が備える搬送アームによって行われる。 That is, in this wafer cassette 100, the storage of the wafer W in the storage unit 110 and the removal of the stored wafer W from the storage unit 110 are both performed from the insertion port 111. Note that the storage of the wafer W inserted from the insertion port 111 and placed on the mounting unit 112 and the removal of the stored wafer W from the insertion port 111 are performed by, for example, a transfer arm included in the semiconductor manufacturing apparatus.
　ウェハカセット１００の収納部１１０の数は、任意に設定することができる。各収納部１１０の幅ｗ及び高さｈは、収納するウェハＷのサイズ（径及び厚さ）に基づいて設定される。例えば、上記のような搬送アームによる収納（挿入、載置）、或いは収納部１１０からの取り出しの際に、ウェハＷと収納部１１０との衝突が生じないような幅ｗ及び高さｈに設定される。 The number of storage units 110 of the wafer cassette 100 can be arbitrarily set. The width w and height h of each storage unit 110 are set based on the size (diameter and thickness) of the wafer W to be stored. For example, the width w and the height h are set such that the wafer W and the storage unit 110 do not collide when stored (inserted or placed) by the transfer arm as described above or taken out from the storage unit 110. Is done.
　また、ウェハＷを薄型化した場合には、そのような薄型化したウェハＷを用いた半導体装置の製造過程において、そのウェハＷにしばしば反りが発生することがある。ウェハカセット１００については、そのようなウェハＷの反りの発生を考慮した収納部１１０の幅ｗ及び高さｈ、更には載置部１１２の突出量ｐを設定してもよい。 Further, when the wafer W is thinned, the wafer W is often warped during the manufacturing process of the semiconductor device using the thinned wafer W. For the wafer cassette 100, the width w and height h of the storage unit 110 in consideration of the occurrence of such warpage of the wafer W, and further the protrusion amount p of the mounting unit 112 may be set.
　上記のような構成を有するウェハカセット１００は、アルミニウムやアルミニウム合金等の金属で形成することができる。例えば、そのような金属の研削加工、鋳造等により、上記のような構造を有するウェハカセット１００を形成することが可能である。 The wafer cassette 100 having the above configuration can be formed of a metal such as aluminum or an aluminum alloy. For example, the wafer cassette 100 having the above-described structure can be formed by grinding or casting such a metal.
　尚、ウェハカセット１００の収納部１１０の内面は、例えば、収納するウェハＷよりも硬質な材料を用いて形成する。
　収納部１１０の内面をウェハＷより軟質な材料を用いて形成した場合には、ウェハカセット１００の使用に伴い、ウェハＷとの接触で収納部１１０の内面が削れ、収納部１１０ごとにウェハＷの当接位置にずれが生じることが起こり得る。また、削れた材料がウェハＷに付着してしまうことも起こり得る。 The inner surface of the storage unit 110 of the wafer cassette 100 is formed using a material harder than the wafer W to be stored, for example.
When the inner surface of the storage unit 110 is formed using a material softer than the wafer W, the inner surface of the storage unit 110 is scraped by contact with the wafer W as the wafer cassette 100 is used. It is possible that a deviation occurs in the contact position. In addition, the scraped material may adhere to the wafer W.
　更にまた、収納されたウェハＷのエッジが、そのような軟質の収納部１１０の内面に食い込んでしまうことも起こり得る。その場合、例えば、搬送アームを使ってウェハＷを収納部１１０から取り出す際に、その搬送アームが載置部１１２のウェハＷを一旦持ち上げ、それからそのウェハＷを挿入口１１１から引き出すような動作をする場合には、ウェハＷの持ち上げ動作のときに、ウェハＷが食い込みに引っ掛かって破損してしまう可能性がある。 Furthermore, the edge of the stored wafer W may bite into the inner surface of such a soft storage unit 110. In this case, for example, when the wafer W is taken out from the storage unit 110 using the transfer arm, the transfer arm temporarily lifts the wafer W of the mounting unit 112 and then pulls out the wafer W from the insertion port 111. In this case, there is a possibility that the wafer W is caught by the bite and is damaged during the lifting operation of the wafer W.
　このような観点から、ウェハカセット１００は、例えば、樹脂等の軟質な材料よりは硬質な材料であって、ナイフエッジ化したウェハＷが突き刺さらない程度の硬度の材料を用いて形成される。また、ウェハカセット１００として加工しやすい材料を選択すればよい。例えばアルミニウム材等が好適である。更に表面をアルマイト処理することで、硬度を高めることもできる。 From such a viewpoint, the wafer cassette 100 is formed using a material that is harder than a soft material such as a resin and has a hardness that prevents the knife-edge wafer W from being pierced. Further, a material that can be easily processed for the wafer cassette 100 may be selected. For example, an aluminum material is suitable. Furthermore, hardness can also be improved by anodizing the surface.
　続いて、ウェハカセット１００が収納される収納ケース２００について説明する。
　図３は収納ケースの説明図である。ここで、図３（Ａ）は開状態の収納ケースの一例の外観模式図、図３（Ｂ）は閉状態の収納ケースの一例の外観模式図、図３（Ｃ）は（Ｂ）の一点鎖線Ｌ３に沿った断面の模式図である。 Next, the storage case 200 in which the wafer cassette 100 is stored will be described.
FIG. 3 is an explanatory diagram of the storage case. 3A is a schematic external view of an example of an open storage case, FIG. 3B is a schematic external view of an example of a closed storage case, and FIG. 3C is a point of (B). It is a schematic diagram of the cross section along chain line L3.
　上記のように、収納ケース２００は、箱部２１０、蓋部２２０及び連結部２３０を有している。
　箱部２１０は、例えば、底部２１１、側壁部２１２、及び上方に開いた開口２１３を有する箱状の容器である。 As described above, the storage case 200 includes the box part 210, the lid part 220, and the connecting part 230.
The box part 210 is, for example, a box-shaped container having a bottom part 211, a side wall part 212, and an opening 213 opened upward.
　蓋部２２０は、その箱部２１０の開口２１３を開閉する部材であって、ここでは箱状の部材を例示している。例えば、蓋部２２０の一端を箱部２１０の側壁部２１２に軸支し、その蓋部２２０を一方向（図３（Ａ）の矢印方向）に回動させることで、箱部２１０の開閉を行う。或いは、蓋部２２０全体を箱部２１０の開口２１３側に脱着できるようにし、蓋部２２０の脱着によって箱部２１０の開閉を行うようにしてもよい。収納ケース２００では、蓋部２２０が閉じられることで、例えば、箱部２１０と蓋部２２０の間に密閉空間が形成される。 The lid part 220 is a member that opens and closes the opening 213 of the box part 210, and here, a box-like member is illustrated. For example, one end of the lid portion 220 is pivotally supported on the side wall portion 212 of the box portion 210, and the lid portion 220 is rotated in one direction (the arrow direction in FIG. 3A), thereby opening and closing the box portion 210. Do. Alternatively, the entire lid portion 220 may be attached to and detached from the opening 213 side of the box portion 210, and the box portion 210 may be opened and closed by the attachment and detachment of the lid portion 220. In the storage case 200, for example, a closed space is formed between the box part 210 and the lid part 220 by closing the lid part 220.
　また、連結部２３０は、蓋部２２０と、蓋部２２０で閉じられた箱部２１０とを連結し、図３（Ｂ）のような閉状態を維持するための機構を備える。
　更に、収納ケース２００には、図３（Ａ）～（Ｃ）に示したように、箱部２１０の底部２１１に対して所定の角度θａ，θｂでそれぞれ傾斜した第１，第２の面２１４ａ，２１４ｂを備える支持部２１４が設けられている。これら第１，第２の面２１４ａ，２１４ｂは、境界線２１４ｃからそれぞれ角度θａ，θｂで斜め上方に向かってＶ字状に傾斜している。支持部２１４は、このように第１，第２の面２１４ａ，２１４ｂを開口２１３側に向けて、箱部２１０に設けられている。 Moreover, the connection part 230 is provided with the mechanism for connecting the cover part 220 and the box part 210 closed with the cover part 220, and maintaining a closed state like FIG. 3 (B).
Further, as shown in FIGS. 3A to 3C, the storage case 200 includes first and second surfaces 214a inclined at predetermined angles θa and θb, respectively, with respect to the bottom portion 211 of the box portion 210. , 214b are provided. These first and second surfaces 214a and 214b are inclined in a V shape obliquely upward at angles θa and θb from the boundary line 214c, respectively. The support part 214 is thus provided in the box part 210 with the first and second surfaces 214a and 214b facing the opening 213 side.
　箱部２１０には、このような支持部２１４が、少なくとも１つ設けられる。図３（Ａ），（Ｂ）には、このような支持部２１４が２つ、並設されている場合を例示している。
　収納ケース２００は、例えば、樹脂材料を用い、射出成型等の方法で形成することができる。 The box part 210 is provided with at least one such support part 214. 3A and 3B illustrate a case where two such support portions 214 are provided side by side.
The storage case 200 can be formed by a method such as injection molding using a resin material, for example.
　このような構成を有する収納ケース２００に、上記のウェハカセット１００が収納される。尚、この例では、並設された２つの支持部２１４のそれぞれに１つずつウェハカセット１００が載置される。 The wafer cassette 100 is stored in the storage case 200 having such a configuration. In this example, one wafer cassette 100 is placed on each of the two support portions 214 arranged in parallel.
　図４は収納ケースにウェハカセットを収納した状態の一例を示す図である。ここで、図４（Ａ）には収納ケースの蓋部が開いている状態を示し、図４（Ｂ）には収納ケースの蓋部が閉じている状態を示している。 FIG. 4 is a view showing an example of a state in which the wafer cassette is stored in the storage case. Here, FIG. 4A shows a state where the lid of the storage case is open, and FIG. 4B shows a state where the lid of the storage case is closed.
　ウェハカセット１００を収納ケース２００に収納する際、ウェハカセット１００は、図４（Ａ）に示すように、収納ケース２００の、Ｖ字状に第１，第２の面２１４ａ，２１４ｂを設けた支持部２１４上に載置される。 When the wafer cassette 100 is stored in the storage case 200, the wafer cassette 100 is supported by the storage case 200 provided with first and second surfaces 214a and 214b in a V shape as shown in FIG. Placed on the unit 214.
　このときウェハカセット１００は、ウェハＷの出し入れが行われる挿入口１１１が斜め上方（開口２１３側）を向くように、支持部２１４上に載置される。即ち、ウェハカセット１００の底面１３１と背面１３２が、支持部２１４のＶ字状の第１，第２の面２１４ａ，２１４ｂと対向するように、ウェハカセット１００が支持部２１４上に載置される。ウェハカセット１００は、その底面１３１と背面１３２を、第１，第２の面２１４ａ，２１４ｂで支持されて、支持部２１４上に載置される。 At this time, the wafer cassette 100 is placed on the support 214 so that the insertion port 111 through which the wafer W is taken in and out faces obliquely upward (opening 213 side). That is, the wafer cassette 100 is placed on the support portion 214 so that the bottom surface 131 and the back surface 132 of the wafer cassette 100 face the V-shaped first and second surfaces 214 a and 214 b of the support portion 214. . Wafer cassette 100 is mounted on support 214 with its bottom 131 and back 132 supported by first and second surfaces 214a and 214b.
　支持部２１４の第１，第２の面２１４ａ，２１４ｂは、このようにウェハカセット１００が載置されたときに、ウェハカセット１００の底面１３１と背面１３２が、第１，第２の面２１４ａ，２１４ｂと接触するように、予め角度θａ，θｂが設定される。尚、ウェハカセット１００の底面１３１と背面１３２のなす角度θｗと、第１，第２の面２１４ａ，２１４ｂの角度θａ，θｂとの間には、次式（１）の関係が成立する。 The first and second surfaces 214a and 214b of the support portion 214 are arranged such that when the wafer cassette 100 is placed in this manner, the bottom surface 131 and the back surface 132 of the wafer cassette 100 are the first and second surfaces 214a and 214b. The angles θa and θb are set in advance so as to come into contact with 214b. The relationship of the following equation (1) is established between the angle θw formed by the bottom surface 131 and the back surface 132 of the wafer cassette 100 and the angles θa and θb of the first and second surfaces 214a and 214b.
　θｗ＝１８０°－（θａ＋θｂ）・・・（１）
　上記のようにウェハカセット１００の挿入口１１１を斜め上方に向けて載置する場合において、ここでは、図４（Ａ）に示したように、ウェハカセット１００の底面１３１が支持部２１４の第１の面２１４ａと接触する場合を例にする。この場合、ウェハカセット１００の、底面１３１に平行に設けられた収納部１１０は、第１の面２１４ａと同じ角度θａで、挿入口１１１を斜め上方に向けて、傾斜した状態になる。 θw = 180 ° − (θa + θb) (1)
In the case where the insertion slot 111 of the wafer cassette 100 is placed obliquely upward as described above, here, as shown in FIG. 4A, the bottom surface 131 of the wafer cassette 100 is the first of the support portion 214. The case where it contacts with the surface 214a is taken as an example. In this case, the storage unit 110 provided in parallel to the bottom surface 131 of the wafer cassette 100 is inclined at the same angle θa as that of the first surface 214a with the insertion port 111 directed obliquely upward.
　図４（Ａ）に示したようにウェハカセット１００を支持部２１４上に載置した後は、図４（Ｂ）に示したように、蓋部２２０によって箱部２１０に蓋をする。これにより、ウェハカセット１００が、収納ケース２００の箱部２１０と蓋部２２０の間の空間内に収納される。このとき、箱部２１０と蓋部２２０の間に密閉空間が形成されるようにしておき、そのような密閉空間にウェハカセット１００を収納すれば、ウェハカセット１００内のウェハＷを、収納ケース２００外部の環境から保護することができる。 After the wafer cassette 100 is placed on the support part 214 as shown in FIG. 4 (A), the box part 210 is covered with the cover part 220 as shown in FIG. 4 (B). As a result, the wafer cassette 100 is stored in the space between the box part 210 and the lid part 220 of the storage case 200. At this time, if a sealed space is formed between the box part 210 and the lid part 220 and the wafer cassette 100 is stored in such a sealed space, the wafer W in the wafer cassette 100 is stored in the storage case 200. Can be protected from the external environment.
　このように収納ケース２００にウェハカセット１００が収納されたウェハ収納具１を、ウェハＷの搬送のために使用したり、ウェハＷの保管に使用したりすることができる。
　ウェハ収納具１では、ウェハＷの収納部１１０をその挿入口１１１が斜め上方に向くように傾斜させて、ウェハカセット１００を支持部２１４上に載置するため、ウェハ収納具１の搬送時に振動や傾斜が生じたとしても、ウェハＷの挿入口１１１からの飛び出しが抑制される。更に、収納部１１０の傾斜角度（第１の面２１４ａの角度θａ）を調整することにより、ウェハＷからの発塵も効果的に抑制することが可能になる。 Thus, the wafer storage tool 1 in which the wafer cassette 100 is stored in the storage case 200 can be used for transporting the wafer W or used for storing the wafer W.
In the wafer storage tool 1, the wafer storage unit 110 is tilted so that the insertion slot 111 faces obliquely upward, and the wafer cassette 100 is placed on the support unit 214. Even if a tilt occurs, the protrusion of the wafer W from the insertion port 111 is suppressed. Furthermore, by adjusting the inclination angle of the storage unit 110 (the angle θa of the first surface 214a), dust generation from the wafer W can be effectively suppressed.
　ここで、ウェハカセット１００の収納部１１０の傾斜角度について説明する。
　ウェハカセット１００の収納部１１０の傾斜角度と、ウェハＷからの発塵数の関係を調査するため、ウェハＷを収納した収納部１１０を所定の角度で傾斜させたウェハカセット１００を台車で搬送し、そのときのウェハＷからの発塵数を測定した。このような搬送と発塵数の測定を、収納部１１０の傾斜角度を変えて、行った。尚、収納部１１０の傾斜角度を除く条件（用いる台車、台車による搬送方法（搬送速度、搬送経路等）、ウェハＷのウェハカセット１００内での収納位置等）は同じにしている。 Here, the inclination angle of the storage unit 110 of the wafer cassette 100 will be described.
In order to investigate the relationship between the inclination angle of the storage unit 110 of the wafer cassette 100 and the number of dust generation from the wafer W, the wafer cassette 100 in which the storage unit 110 storing the wafer W is inclined at a predetermined angle is conveyed by a carriage. The number of dust generated from the wafer W at that time was measured. Such conveyance and measurement of the number of dust generations were performed by changing the inclination angle of the storage unit 110. The conditions excluding the inclination angle of the storage unit 110 (the carriage to be used, the transfer method using the carriage (transfer speed, transfer path, etc.), the storage position of the wafer W in the wafer cassette 100, etc.) are the same.
　図５は収納部傾斜角度と発塵数との関係の一例を示す図である。
　図５には、ウェハカセット１００の収納部１１０の傾斜角度が０°，４５°，９０°のそれぞれの場合での、ウェハＷからの発塵数を示している。ここで、傾斜角度０°とは、収納部１１０を水平方向にした場合（挿入口１１１が横向きになるようにした場合）であり、傾斜角度９０°とは、収納部１１０を鉛直方向にした場合（挿入口１１１が鉛直上向きになるようにした場合）である。また、傾斜角度４５°とは、収納部１１０を水平方向に対して４５°傾けた場合（挿入口１１１が水平方向に対して４５°斜め上方に向くようにした場合）である。 FIG. 5 is a diagram illustrating an example of the relationship between the storage unit inclination angle and the number of dust generation.
FIG. 5 shows the number of dust generated from the wafer W when the inclination angle of the storage unit 110 of the wafer cassette 100 is 0 °, 45 °, and 90 °. Here, the inclination angle of 0 ° is when the storage unit 110 is set in the horizontal direction (when the insertion slot 111 is set sideways), and the inclination angle of 90 ° is when the storage unit 110 is set in the vertical direction. This is the case (when the insertion slot 111 is directed vertically upward). Further, the inclination angle of 45 ° is when the storage section 110 is inclined by 45 ° with respect to the horizontal direction (when the insertion port 111 is inclined upward by 45 ° with respect to the horizontal direction).
　まず、収納部１１０の傾斜角度を０°とした場合、ウェハＷは、その主面が水平方向と平行になるように、収納部１１０に収納される。この場合、この例での搬送条件では、ウェハＷは、収納部１１０の内面、例えば当接部１１３等に衝突する機会が少なく、また、衝突してもその力が弱いために、図５に示すように、ウェハＷからの発塵数が少なく抑えられる。但し、ウェハＷをこのような向きで収納している場合には、挿入口１１１からのウェハＷの飛び出しが起こり易くなるため、ウェハＷが収納部１１０外に飛び出して破損する可能性が高まる。 First, when the inclination angle of the storage unit 110 is set to 0 °, the wafer W is stored in the storage unit 110 so that its main surface is parallel to the horizontal direction. In this case, under the transfer conditions in this example, the wafer W has few opportunities to collide with the inner surface of the storage unit 110, for example, the contact portion 113, and the force is weak even if it collides. As shown, the number of dust generated from the wafer W can be reduced. However, when the wafer W is stored in such a direction, the wafer W is likely to jump out from the insertion port 111, so that the possibility that the wafer W jumps out of the storage unit 110 and is damaged increases.
　これに対し、収納部１１０の傾斜角度を９０°とした場合、ウェハＷは、その主面が鉛直方向と平行になり、その自重により、エッジ（下端）が当接部１１３に当接した状態で、収納部１１０に収納される。そのため、傾斜角度を０°としたときのようにウェハＷが収納部１１０から飛び出してしまうのを、防止することができる。 On the other hand, when the inclination angle of the storage unit 110 is 90 °, the wafer W has a main surface parallel to the vertical direction and the edge (lower end) is in contact with the contact unit 113 by its own weight. Thus, it is stored in the storage unit 110. Therefore, it is possible to prevent the wafer W from jumping out of the storage unit 110 as when the inclination angle is 0 °.
　しかし、このように収納部１１０の傾斜角度を９０°とした場合、ウェハＷは、ウェハカセット１００が振動すると、その振動に伴って上下動し、エッジが収納部１１０の当接部１１３に衝突することが起こり易くなる。ウェハカセット１００の振動が大きければ、その分、ウェハＷのエッジが当接部１１３に強く衝突するようになる。また、収納部１１０のサイズがウェハＷのサイズよりも大きいため、ウェハカセット１００の振動時にウェハＷが横方向（主面と平行方向或いは主面と垂直方向）にも動き易く、ウェハＷが当接部１１３に偏って衝突し、ウェハＷに局所的に強い衝撃が加わることも起こり得る。このようにウェハＷが当接部１１３に衝突することで、ウェハＷのエッジが摩耗したり破損したりして、発塵が起こる。収納部１１０の内面をウェハＷよりも硬質の材料で形成している場合には、このような発塵が一層起こり易くなる。 However, when the inclination angle of the storage unit 110 is set to 90 ° in this way, when the wafer cassette 100 vibrates, the wafer W moves up and down along with the vibration, and the edge collides with the contact part 113 of the storage unit 110. It is easy to happen. If the vibration of the wafer cassette 100 is large, the edge of the wafer W will strongly collide with the contact portion 113 accordingly. Further, since the size of the storage unit 110 is larger than the size of the wafer W, the wafer W easily moves in the lateral direction (parallel to the main surface or perpendicular to the main surface) when the wafer cassette 100 vibrates. There may be a case where the wafer W collides with the contact portion 113 and a strong impact is locally applied to the wafer W. Thus, when the wafer W collides with the contact part 113, the edge of the wafer W is worn out or damaged, and dust generation occurs. When the inner surface of the storage unit 110 is formed of a material harder than the wafer W, such dust generation is more likely to occur.
　このようなことから、収納部１１０の傾斜角度を９０°とした場合には、図５に示したように、ウェハＷからの発塵数が多くなってしまう。
　一方、収納部１１０の傾斜角度を４５°とした場合、ウェハＷは、その主面が水平方向対して４５°或いは４５°に近い角度で傾斜した状態で、収納部１１０に収納される。 For this reason, when the inclination angle of the storage unit 110 is 90 °, the number of dust generated from the wafer W increases as shown in FIG.
On the other hand, when the inclination angle of the storage unit 110 is 45 °, the wafer W is stored in the storage unit 110 with its main surface inclined at an angle of 45 ° or close to 45 ° with respect to the horizontal direction.
　図６は傾斜角度４５°の収納部に収納されたウェハの収納状態の一例を模式的に示す図である。尚、図６は収納部の当接部位置での断面を模式的に例示するものであって、図２（Ｃ）のＬ４－Ｌ４断面の位置に相当する。 FIG. 6 is a diagram schematically showing an example of a storage state of a wafer stored in a storage unit having an inclination angle of 45 °. FIG. 6 schematically illustrates a cross-section at the contact portion position of the storage portion, and corresponds to the position of the L4-L4 cross section in FIG.
　収納部１１０の傾斜角度を４５°とした場合、ウェハＷは、その自重により、エッジ（下端）が当接部１１３に当接し、そのエッジを当接部１１３で支持される。更に、このウェハＷは、その自重により載置部１１２側にも当接するため、裏面の少なくとも一部を載置部１１２で支持される。 When the inclination angle of the storage unit 110 is 45 °, the edge (lower end) of the wafer W comes into contact with the contact part 113 due to its own weight, and the edge is supported by the contact part 113. Further, since the wafer W also abuts on the mounting portion 112 side by its own weight, at least a part of the back surface is supported by the mounting portion 112.
　ウェハＷは、収納部１１０内でこのように支持されることで、ウェハカセット１００が振動しても、収納部１１０の傾斜角度を９０°としたときに比べ、収納部１１０内で動き難くなる。そのため、収納部１１０の内面とウェハＷとの衝突の機会が減少し、発塵が抑えられるようになる。更に、ウェハＷのエッジ（ナイフエッジ先端）が、収納部１１０における筐体部１２０の内面と載置部１１２の表面とが連続する湾曲面１１４に対して垂直に接し易くなることによっても、発塵が抑えられるようになる。 Since the wafer W is supported in this manner in the storage unit 110, even if the wafer cassette 100 vibrates, the wafer W is less likely to move in the storage unit 110 than when the inclination angle of the storage unit 110 is 90 °. . Therefore, the chance of collision between the inner surface of the storage unit 110 and the wafer W is reduced, and dust generation can be suppressed. Furthermore, the edge of the wafer W (the tip of the knife edge) is also likely to come into contact with the curved surface 114 where the inner surface of the housing unit 120 and the surface of the mounting unit 112 in the storage unit 110 are continuous perpendicularly. Dust is suppressed.
　また、収納部１１０の傾斜角度を４５°にすることで、収納部１１０の傾斜角度を０°としたときのように収納部１１０からウェハＷが飛び出してしまうのを、効果的に抑制することができる。 Further, by setting the inclination angle of the storage unit 110 to 45 °, it is possible to effectively suppress the wafer W from jumping out of the storage unit 110 as when the inclination angle of the storage unit 110 is set to 0 °. Can do.
　図７は収納部傾斜角度と発塵数との関係の別例を示す図である。
　図７には、代表例として、ウェハカセット１００の収納部１１０の傾斜角度を１０°，２０°，３０°，３７°，４５°にして、上記図５について述べたのと同様の調査を各傾斜角度について行った結果を示している。 FIG. 7 is a diagram showing another example of the relationship between the storage portion inclination angle and the number of dust generation.
In FIG. 7, as a representative example, the same investigation as described above with reference to FIG. 5 is performed with the inclination angles of the storage unit 110 of the wafer cassette 100 set to 10 °, 20 °, 30 °, 37 °, and 45 °. The results of the tilt angle are shown.
　図７より、収納部１１０の傾斜角度を４５°にすることで、発塵を再現性良く抑えることができる。収納部１１０の傾斜角度を３７°とした場合も同様に、発塵は再現性良く抑えられている。一方、収納部１１０の傾斜角度を１０°，２０°，３０°とした場合には、発塵数が大幅に増加し、発塵を抑えることができない。 From FIG. 7, dust generation can be suppressed with good reproducibility by setting the inclination angle of the storage unit 110 to 45 °. Similarly, when the inclination angle of the storage unit 110 is 37 °, dust generation is suppressed with good reproducibility. On the other hand, when the inclination angle of the storage unit 110 is set to 10 °, 20 °, and 30 °, the number of dust generation is greatly increased, and dust generation cannot be suppressed.
　３７°～４５°の間の傾斜角度についても、傾斜角度を３７°，４５°としたときと同様に、発塵数を一定レベル以下に再現性良く抑えることができる。発塵数及び再現性の観点から、収納部１１０の傾斜角度は３７°～４５°に設定することが可能であり、好ましくは、発塵を再現性良く効果的に抑えることのできる４５°に設定する。 As for the inclination angle between 37 ° and 45 °, the number of dust generation can be suppressed to a certain level or less with good reproducibility, as in the case where the inclination angle is 37 ° or 45 °. From the viewpoint of the number of dust generation and reproducibility, the inclination angle of the storage unit 110 can be set to 37 ° to 45 °, and preferably 45 ° that can effectively suppress dust generation with good reproducibility. Set.
　このように、ウェハカセット１００の収納部１１０を、３７°～４５°の角度で傾斜させることで、収納部１１０からのウェハＷの飛び出し、及びウェハＷからの発塵を効果的に抑えることが可能になる。 As described above, by tilting the storage section 110 of the wafer cassette 100 at an angle of 37 ° to 45 °, it is possible to effectively suppress the jumping out of the wafer W from the storage section 110 and the generation of dust from the wafer W. It becomes possible.
　図４に例示したように、ここではウェハカセット１００の底面１３１を支持部２１４の第１の面２１４ａと接触させるようにするため、第１の面２１４ａの角度θａは、収納部１１０を傾斜させる角度３７°～４５°に設定される。ウェハカセット１００の背面１３２が接触することとなる第２の面２１４ｂの角度θｂは、ウェハカセット１００の底面１３１と背面１３２の角度θｗ（通常は９０°）に応じ、上記の式（１）に従って、設定される。そして、このような角度θａ，θｂの第１，第２の面２１４ａ，２１４ｂを有する支持部２１４を設けた収納ケース２００が形成される。 As illustrated in FIG. 4, the angle θa of the first surface 214 a inclines the storage unit 110 so that the bottom surface 131 of the wafer cassette 100 is brought into contact with the first surface 214 a of the support unit 214. The angle is set to 37 ° to 45 °. The angle θb of the second surface 214b with which the back surface 132 of the wafer cassette 100 comes into contact depends on the angle θw (usually 90 °) between the bottom surface 131 and the back surface 132 of the wafer cassette 100 according to the above equation (1). Is set. The storage case 200 provided with the support portion 214 having the first and second surfaces 214a and 214b having such angles θa and θb is formed.
　このように、収納ケース２００には、３７°～４５°の角度θａの第１の面２１４ａと、角度θａに基づいて決定される角度θｂの第２の面２１４ｂとを有する支持部２１４を設けておく。それにより、ウェハカセット１００を収納ケース２００の支持部２１４の上に、底面１３１が第１の面２１４ａに接触し、背面１３２が第２の面２１４ｂに接触するようにして載置したときには、収納部１１０が３７°～４５°の角度θａで傾斜した状態が得られる。その結果、上記のように、収納部１１０からのウェハＷの飛び出し、及びウェハＷからの発塵が効果的に抑えられるようになる。 As described above, the storage case 200 is provided with the support portion 214 having the first surface 214a having the angle θa of 37 ° to 45 ° and the second surface 214b having the angle θb determined based on the angle θa. Keep it. Accordingly, when the wafer cassette 100 is placed on the support portion 214 of the storage case 200 so that the bottom surface 131 is in contact with the first surface 214a and the back surface 132 is in contact with the second surface 214b, the storage is performed. A state in which the portion 110 is inclined at an angle θa of 37 ° to 45 ° is obtained. As a result, the protrusion of the wafer W from the storage unit 110 and the generation of dust from the wafer W can be effectively suppressed as described above.
　また、このように３７°～４５°の角度θａで収納部１１０を傾斜させたときには、いずれの収納部１１０においても、ウェハＷがその自重により収納部１１０の奥側へと滑り、ウェハＷのエッジが当接部１１３に当接するようになる。即ち、いずれのウェハＷも、当接部１１３に当接した状態でウェハ収納具１に収納されるようになる。 In addition, when the storage unit 110 is inclined at an angle θa of 37 ° to 45 ° in this way, in any storage unit 110, the wafer W slides to the back side of the storage unit 110 due to its own weight. The edge comes into contact with the contact portion 113. That is, any wafer W is stored in the wafer storage tool 1 in a state of being in contact with the contact portion 113.
　例えば、製造装置による処理を行う際、ウェハカセットの複数の収納部にそれぞれ収納されているウェハを、搬送アームで取り出す場合を想定する。この場合、仮に各ウェハの位置が収納部によって異なっていると、搬送アームがウェハを把持することができなかったり、ウェハとウェハカセットや製造装置との衝突を招いたりする可能性がある。例えば、上記のウェハカセット１００を、その収納部１１０を水平方向に向けて、或いは水平方向に近い角度に傾けて搬送を行ったような場合には、各収納部１１０でウェハＷの位置に違いが生じ易く、上記のような搬送アームによる搬送時の不具合が発生してしまう可能性がある。 For example, it is assumed that the wafers respectively stored in a plurality of storage portions of the wafer cassette are taken out by the transfer arm when processing by the manufacturing apparatus is performed. In this case, if the position of each wafer is different depending on the storage unit, the transfer arm may not be able to hold the wafer or may cause a collision between the wafer and the wafer cassette or the manufacturing apparatus. For example, when the wafer cassette 100 is transported with its storage unit 110 oriented in the horizontal direction or inclined at an angle close to the horizontal direction, the position of the wafer W in each storage unit 110 is different. This is likely to occur, and there is a possibility that problems such as those described above during conveyance by the conveyance arm may occur.
　これに対し、上記のようなウェハ収納具１を用いると、ウェハカセット１００が収納ケース２００に収納されているときに、複数枚のウェハＷを当接部１１３に当接した状態でウェハカセット１００の収納部１１０に収納することができる。そのため、いずれのウェハＷも収納部１１０内の同等の位置に置かれているため、収納ケース２００から取り出したウェハカセット１００から、搬送アームでウェハＷを取り出す際、上記のような搬送時の不具合を効果的に抑えることが可能になる。 On the other hand, when the wafer storage tool 1 as described above is used, when the wafer cassette 100 is stored in the storage case 200, the wafer cassette 100 is in a state where a plurality of wafers W are in contact with the contact portion 113. Can be stored in the storage portion 110 of the storage device. For this reason, since all the wafers W are placed at the same position in the storage unit 110, when the wafer W is taken out from the wafer cassette 100 taken out from the storage case 200 by the transfer arm, the above-described troubles at the time of transfer. Can be effectively suppressed.
　尚、以上の説明では、ウェハカセット１００を、その底面１３１を第１の面２１４ａに接触させ、背面１３２を第２の面２１４ｂに接触させて、収納ケース２００に収納する場合を例にして説明した。このほか、ウェハカセット１００を、その底面１３１を第２の面２１４ｂに接触させ、背面１３２を第１の面２１４ａに接触させて、収納ケース２００に収納することも可能である。その場合には、第２の面２１４ｂの角度θｂを、収納部１１０を傾斜させる角度３７°～４５°に設定し、式（１）を用いて第１の面２１４ａの角度θａを設定するようにすればよい。 In the above description, the wafer cassette 100 is stored in the storage case 200 with the bottom surface 131 in contact with the first surface 214a and the back surface 132 in contact with the second surface 214b. did. In addition, the wafer cassette 100 can be stored in the storage case 200 with the bottom surface 131 in contact with the second surface 214b and the back surface 132 in contact with the first surface 214a. In that case, the angle θb of the second surface 214b is set to an angle of 37 ° to 45 ° for inclining the storage unit 110, and the angle θa of the first surface 214a is set using Equation (1). You can do it.
　また、以上の説明では、ウェハカセット１００を支持する支持部２１４に、角度θａ，θｂの第１，第２の面２１４ａ，２１４ｂを設ける場合を例にしたが、支持部２１４の構成はこの例に限定されるものではない。 In the above description, the case where the first and second surfaces 214a and 214b having the angles θa and θb are provided on the support portion 214 that supports the wafer cassette 100 has been described as an example. It is not limited to.
　図８は収納ケースの変形例の説明図である。ここで、図８（Ａ）は収納ケースの第１変形例を示す図、図８（Ｂ）は収納ケースの第２変形例を示す図である。
　図８（Ａ）に示す収納ケース２００Ａは、各支持部２１４のウェハカセット１００載置面側に、並設された複数の線状の凸部２１５が設けられている。各凸部２１５は、支持部２１４の第１，第２の面２１４ａ，２１４ｂに沿って設けられ、第１，第２の面２１４ａ，２１４ｂから上端までの高さは一定としている。即ち、第１の面２１４ａ上の凸部２１５の上端２１５ａは、底部２１１に対して角度θａで傾斜しており、第２の面２１４ｂ上の凸部２１５の上端２１５ｂは、底部２１１に対して角度θｂで傾斜している。このような凸部２１５を設けた支持部２１４の上に、ウェハカセット１００がその収納部１１０の挿入口１１１が斜め上方を向くようにして載置される。 FIG. 8 is an explanatory view of a modified example of the storage case. Here, FIG. 8A is a diagram illustrating a first modification of the storage case, and FIG. 8B is a diagram illustrating a second modification of the storage case.
A storage case 200 </ b> A shown in FIG. 8A is provided with a plurality of linear convex portions 215 arranged in parallel on the wafer cassette 100 mounting surface side of each support portion 214. Each convex part 215 is provided along the 1st, 2nd surface 214a, 214b of the support part 214, and the height from the 1st, 2nd surface 214a, 214b to an upper end is made constant. That is, the upper end 215 a of the convex portion 215 on the first surface 214 a is inclined at an angle θa with respect to the bottom portion 211, and the upper end 215 b of the convex portion 215 on the second surface 214 b is relative to the bottom portion 211. It is inclined at an angle θb. The wafer cassette 100 is placed on the support part 214 provided with such a convex part 215 so that the insertion port 111 of the storage part 110 faces obliquely upward.
　この図８（Ａ）に示したような収納ケース２００Ａでは、載置されるウェハカセット１００が、複数（ここでは２本）の凸部２１５の上端２１５ａ，２１５ｂで支持されることになる。即ち、ウェハカセット１００は、複数の線状の凸部２１５と接触し、所定の角度で傾斜した状態で、それら線状の凸部２１５によって支持される。 In the storage case 200A as shown in FIG. 8A, the wafer cassette 100 to be placed is supported by the upper ends 215a and 215b of the plurality of (here, two) convex portions 215. That is, the wafer cassette 100 is supported by the linear convex portions 215 in contact with the plurality of linear convex portions 215 and inclined at a predetermined angle.
　また、図８（Ｂ）に示す収納ケース２００Ｂは、各支持部２１４のウェハカセット１００載置面側に、複数の点状の凸部２１６が設けられている。各凸部２１６の、第１，第２の面２１４ａ，２１４ｂから上端までの高さは一定としている。即ち、第１の面２１４ａ上における複数の凸部２１６の上端を結んでできる平面は、底部２１１に対して角度θａで傾斜する平面となり、第２の面２１４ｂ上における複数の凸部２１６の上端を結んでできる平面は、底部２１１に対して角度θｂで傾斜する平面となる。このような凸部２１６を設けた支持部２１４の上に、ウェハカセット１００がその収納部１１０の挿入口１１１が斜め上方を向くようにして載置される。 Further, the storage case 200B shown in FIG. 8B is provided with a plurality of dot-like convex portions 216 on the wafer cassette 100 mounting surface side of each support portion 214. The height from the first and second surfaces 214a and 214b to the upper end of each convex portion 216 is constant. That is, a plane formed by connecting the upper ends of the plurality of convex portions 216 on the first surface 214a is a plane inclined at an angle θa with respect to the bottom portion 211, and the upper ends of the plurality of convex portions 216 on the second surface 214b. A plane formed by connecting the two is a plane inclined at an angle θb with respect to the bottom portion 211. The wafer cassette 100 is placed on the support part 214 provided with such a convex part 216 so that the insertion port 111 of the storage part 110 faces obliquely upward.
　この図８（Ｂ）に示したような収納ケース２００Ｂでは、載置されるウェハカセット１００が、複数（ここでは１面につき４つ）の凸部２１６の上端で支持されることになる。即ち、ウェハカセット１００は、複数の点状の凸部２１６と接触し、所定の角度で傾斜した状態で、それら点状の凸部２１６によって支持される。 In the storage case 200B as shown in FIG. 8B, the wafer cassette 100 to be placed is supported by the upper ends of a plurality (here, four per surface) of the convex portions 216. That is, the wafer cassette 100 is supported by the point-like convex portions 216 in contact with the plurality of point-like convex portions 216 and inclined at a predetermined angle.
　以上説明したように、開示のウェハ収納具では、収納ケースにウェハカセットを収納したときに、そのウェハカセットのウェハ収納部が所定の角度で傾斜するようになる。その結果、ウェハカセットの収納部からのウェハの飛び出し、及び収納されているウェハからの発塵が、効果的に抑制されるようになる。 As described above, in the disclosed wafer storage tool, when the wafer cassette is stored in the storage case, the wafer storage portion of the wafer cassette is inclined at a predetermined angle. As a result, the jumping out of the wafer from the storage portion of the wafer cassette and the generation of dust from the stored wafer are effectively suppressed.
　上記については単に本発明の原理を示すものである。さらに、多数の変形、変更が当業者にとって可能であり、本発明は上記に示し、説明した正確な構成および応用例に限定されるものではなく、対応するすべての変形例および均等物は、添付の請求項およびその均等物による本発明の範囲とみなされる。 The above merely shows the principle of the present invention. In addition, many modifications and changes can be made by those skilled in the art, and the present invention is not limited to the precise configuration and application shown and described above, and all corresponding modifications and equivalents may be And the equivalents thereof are considered to be within the scope of the invention.
　１　ウェハ収納具
　１００　ウェハカセット
　１１０　収納部
　１１１　挿入口
　１１２　載置部
　１１３　当接部
　１１４　湾曲面
　１２０　筐体部
　１３１　底面
　１３２　背面
　２００，２００Ａ，２００Ｂ　収納ケース
　２１０　箱部
　２１１　底部
　２１２　側壁部
　２１３　開口
　２１４　支持部
　２１４ａ　第１の面
　２１４ｂ　第２の面
　２１４ｃ　境界線
　２１５，２１６　凸部
　２１５ａ，２１５ｂ　上端
　２２０　蓋部
　２３０　連結部
　θａ，θｂ，θｗ　角度 DESCRIPTION OF SYMBOLS 1 Wafer storage tool 100 Wafer cassette 110 Storage part 111 Insertion slot 112 Placement part 113 Contact part 114 Contact part 114 Curved surface 120 Case part 131 Bottom surface 132 Back surface 200,200A, 200B Storage case 210 Box part 211 Bottom part 212 Side wall part 213 Opening 214 Support portion 214a First surface 214b Second surface 214c Boundary line 215, 216 Protruding portion 215a, 215b Upper end 220 Lid portion 230 Connecting portion θa, θb, θw Angle

Claims (7)

  1. 　ウェハが収納される収納部を備えたウェハカセットと、
    　前記ウェハカセットが収納される収納ケースと、
    　を含み、
    　前記収納ケースは、前記収納部が前記収納ケースの底に対して３７°乃至４５°の角度で傾斜するように前記ウェハカセットを支持する支持部を備えることを特徴とするウェハ収納具。     A wafer cassette having a storage section for storing wafers;
    A storage case for storing the wafer cassette;
    Including
    The said storage case is provided with the support part which supports the said wafer cassette so that the said storage part may incline at the angle of 37 degrees thru | or 45 degrees with respect to the bottom of the said storage case.
  2. 　前記収納部は、
    　前記ウェハを挿入する挿入口と、
    　挿入される前記ウェハが載置される載置部と、
    　挿入される前記ウェハの挿入方向先端部が当接する当接部と、
    　を有し、
    　前記ウェハカセットは、前記挿入口が前記収納ケースの底に対して前記角度で上方に向くように前記収納ケースに収納され、前記支持部で支持されることを特徴とする請求の範囲第１項に記載のウェハ収納具。     The storage section is
    An insertion slot for inserting the wafer;
    A placement section on which the wafer to be inserted is placed;
    An abutting portion with which the leading end portion of the wafer to be inserted abuts,
    Have
    2. The wafer cassette is housed in the housing case so that the insertion port faces upward at the angle with respect to the bottom of the housing case, and is supported by the support portion. The wafer storage tool described in 1.
  3. 　前記収納ケースは、
    　前記支持部が設けられた箱部と、
    　前記箱部に開閉自在に設けられた蓋部と、
    　を有し、
    　前記支持部で支持された前記ウェハカセットは、前記蓋部が閉じられることで形成される前記箱部と前記蓋部の間の密閉空間に収納されることを特徴とする請求の範囲第１項又は第２項に記載のウェハ収納具。     The storage case is
    A box part provided with the support part;
    A lid part that can be freely opened and closed in the box part;
    Have
    The said wafer cassette supported by the said support part is accommodated in the sealed space between the said box part formed by the said cover part being closed, and the said cover part, The Claim 1 characterized by the above-mentioned. Or the wafer storage tool of a 2nd term | claim.
  4. 　前記支持部は、前記収納ケースに収納される前記ウェハカセットと接触する接触面を有し、前記接触面で前記ウェハカセットを支持することを特徴とする請求の範囲第１項乃至第３項のいずれかに記載のウェハ収納具。 The said support part has a contact surface which contacts the said wafer cassette accommodated in the said storage case, The said contact cassette supports the said wafer cassette, The Claim 1 thru | or 3 characterized by the above-mentioned. The wafer storage tool according to any one of the above.
  5. 　前記支持部は、前記収納ケースに収納される前記ウェハカセットと接触する線状の凸部を有し、前記線状の凸部で前記ウェハカセットを支持することを特徴とする請求の範囲第１項乃至第３項のいずれかに記載のウェハ収納具。 2. The support unit according to claim 1, wherein the support part has a linear protrusion that contacts the wafer cassette stored in the storage case, and the wafer cassette is supported by the linear protrusion. Item 4. A wafer container according to any one of Items 3 to 3.
  6. 　前記支持部は、前記収納ケースに収納される前記ウェハカセットと接触する点状の凸部を有し、前記点状の凸部で前記ウェハカセットを支持することを特徴とする請求の範囲第１項乃至第３項のいずれかに記載のウェハ収納具。 The said support part has a dotted | punctate convex part which contacts the said wafer cassette accommodated in the said storage case, and supports the said wafer cassette by the said dotted | punctate convex part. Item 4. A wafer container according to any one of Items 3 to 3.
  7. 　ウェハを収納し底面と当該底面に垂直な側面とを有するウェハカセットを収納する、ウェハカセットの収納ケースにおいて、
    　前記ウェハカセットを傾斜させて支持する第１の支持部と、前記第１の支持部に直交する第２の支持部とを有し、前記第１の支持部は、収納ケースの底面に対して３７°乃至４５°の角度で傾斜していることを特徴とするウェハカセットの収納ケース。     In a wafer cassette storage case for storing a wafer and storing a wafer cassette having a bottom surface and a side surface perpendicular to the bottom surface,
    A first support part configured to support the wafer cassette in an inclined manner; and a second support part orthogonal to the first support part, wherein the first support part is located with respect to a bottom surface of the storage case. A wafer cassette storage case which is inclined at an angle of 37 ° to 45 °.
PCT/JP2011/070992 2010-09-17 2011-09-14 Wafer storing device, and wafer cassette storage case WO2012036206A1 (en)

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